LHRF5733-PF-TBF-X [LIGITEK]
TAPE AND BOX TYPE LED LAMPS; 磁带和箱型LED灯
| 型号： | LHRF5733-PF-TBF-X |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | TAPE AND BOX TYPE LED LAMPS |
| 文件： | 总8页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LHRF5733-PF/TBF-X
DATA SHEET
DOC. NO : QW0905-LHRF5733-PF/TBF-X
REV.
: C
DATE
: 11 - Apr. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LHRF5733-PF/TBF-X
Package Dimensions
P2
△H
H2
W2
H1
H
L
W0
W3
W1
P1
F
D
P
T
LHRF5733-PF
7.1
2.4
7.8
2.5
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.54TYP
+ -
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X
Page 2/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
HRF
Symbol
Parameter
UNIT
IF
IFP
30
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
90
mW
μA
Power Dissipation
PD
Ir
75
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
10
ESD
Topr
Tstg
2000
-40 ~ +85
-40 ~ +100
V
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V) @20mA(mcd)
Typ.
Min. Max. Min.
Luminous
intensity
Viewing
angle
2θ 1/2
(deg)
Dominant
wave
length
Spectral
halfwidth
△λnm
COLOR
MATERIAL
AlGaInP
PART NO
λDnm
Emitted
Red
Lens
LHRF5733-PF/TBF-X
Water Clear
630
20
1.5
120 220
116
2.4
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO. LHRF5733-PF/TBF-X
‧ Dimension Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
mm
inch
Tape Feed Hole Diameter
Component Lead Pitch
-------
-------
D
F
3.8
0.15
4.2
5.8
2.0
0.17
0.23
4.8
-------
15.5
17.5
0.19
-------
0.61
0.69
-------
-------
△H
H
0.08
0.65
0.77
Front-To-Rear Deflection
Height Of Seating Plane
16.5
19.5
TBF-1
TBF-2
TBF-3
TBF-4
TBF-5
TBF-6
TBF-7
TBF-8
TBF-10
TBF-11
TBF-12
-------
19.0
22.5
25.5
21.5
20.2
17.125
20.0
18.8
24.0
21.0
-------
0.75
0.89
1.0
21.0
24.5
26.5
22.5
21.2
21.125
22.5
19.8
26.0
23.0
36
0.83
0.96
1.04
0.89
0.83
0.83
0.89
0.78
1.02
0.91
1.42
0.43
0.51
0.18
0.3
0.85
0.8
Feed Hole To Bottom Of Component
H1
0.67
0.79
0.74
0.94
0.83
-------
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
W0
11
-------
Feed Hole Pitch
P
12.4
3.15
5.1
0.49
0.12
0.2
13
-------
Lead Location
P1
P2
T
4.55
7.7
Center Of Component Location
Overall Taped Package Thickness
-------
-------
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
-------
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
-------
-------
-------
17.5
0.69
19
REMARK:TBF = Tape And Box Forming Leads
‧ Dimensions Symbol Information
‧ Package Dimensions
Specification
Symbol
minimum
maxmum
Description
W
L
mm
inch
13.0
10.4
1.97
mm
inch
13.4
10.8
2.4
Overall Length
Overall Width
L
W
H
330
265
50
340
275
60
H
Overall Thickness
Quantity/Box
2000PCS
Part No.
LHRF5733-PF/TBF-X
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X
Page 4/7
‧ Dimension Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
mm
inch
Tape Feed Hole Diameter
Component Lead Pitch
-------
-------
D
F
3.8
0.15
4.2
5.8
0.17
0.23
4.8
-------
15.5
0.19
-------
0.61
-------
-------
△H
Front-To-Rear Deflection
Height Of Seating Plane
2.0
16.5
20
0.08
0.65
H
TBF-13
TBF-14
TBF-15
TBF-16
TBF-17
TBF-18
TBF-19
TBF-20
TBF-21
TBF-22
TBF-23
-------
19.0
21.7
22.5
17.5
18.5
20.5
25.5
20.5
25.0
22.0
25.0
-------
0.75
0.85
0.89
0.69
0.73
0.81
1.00
0.81
0.98
0.87
0.98
-------
0.79
0.93
0.93
0.71
0.77
0.85
1.08
0.89
1.06
0.91
1.02
1.42
0.43
0.51
0.18
0.3
23.7
23.5
18
19.5
21.5
27.5
22.5
27.0
23.0
26.0
36
Feed Hole To Bottom Of Component
H1
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
W0
11
-------
Feed Hole Pitch
P
12.4
3.15
5.1
0.49
0.12
0.2
13
-------
Lead Location
P1
P2
T
4.55
7.7
Center Of Component Location
Overall Taped Package Thickness
-------
-------
-------
8.5
-------
0.33
0.57
0
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
-------
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
-------
14.5
0
-------
-------
17.5
0.69
19
REMARK:TBF = Tape And Box Forming Leads
‧ Dimensions Symbol Information
Specification
‧ Package Dimensions
Symbol
minimum
maxmum
Description
W
L
inch
inch
mm
330
265
50
mm
340
275
60
Overall Length
Overall Width
13.0
10.4
1.97
13.4
10.8
2.4
L
W
H
H
Overall Thickness
Quantity/Box
2000PCS
Part No.
LHRF5733-PF/TBF-X
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page5/7
PART NO. LHRF5733-PF/TBF-X
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.5
3.0
2.5
2.0
100
10
1.0
0.1
1.5
1.0
0.5
0
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
1.2
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
0°
1.0
0.5
0
-30°
30°
-60°
60°
550
600
650
700
0
100% 75% 50% 25%
25% 50% 75%100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF5733-PF/TBF-X
Page 6/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350¢XC Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120¢XC Max
Preheat time: 120seconds Max
Ramp-up
2¢XC/sec(max)
Ramp-Down:-5¢XC/sec(max)
Solder Bath:260¢XC Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(¢XC)
260¢XC3sec Max
260°
5¢X/sec
max
120°
2¢X/sec
25°
max
0°
0
100
250
Time(sec)
200
Preheat
120 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/7
PART NO. LHRF5733-PF/TBF-X
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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