LTC3548EDD-2#TR [Linear]

LTC3548-2 - Dual Synchronous, Fixed/Adjustable Output, 2.25MHz Step-Down DC/DC Regulator; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C;
LTC3548EDD-2#TR
型号: LTC3548EDD-2#TR
厂家: Linear    Linear
描述:

LTC3548-2 - Dual Synchronous, Fixed/Adjustable Output, 2.25MHz Step-Down DC/DC Regulator; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C

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LTC3548-2  
Dual Synchronous,  
Fixed/Adjustable Output, 2.25MHz  
Step-Down DC/DC Regulator  
U
DESCRIPTIO  
FEATURES  
The LTC®3548-2 is a dual, constant frequency, synchro-  
High Efficiency: Up to 95%  
nous step down DC/DC converter. Intended for low power  
applications, it operates from 2.5V to 5.5V input voltage  
range and has a constant 2.25MHz switching frequency,  
allowing the use of tiny, low cost capacitors and inductors  
with a profile 1.2mm. For channel 1, the output voltage  
is fixed at 1.8V/800mA; for channel 2, the output voltage  
is adjustable from 0.6V to VIN. Internal synchronous  
0.35, 1.2A/0.7A power switches provide high efficiency  
without the need for external Schottky diodes.  
1.8V/800mA Fixed Output and 400mA Adjustable  
Output Voltage  
Only 40µA Quiescent Current (Both Channels)  
2.25MHz Constant Frequency Operation  
High Switch Current Limits: 1.2A and 0.7A  
No Schottky Diodes Required  
Low RDS(ON) Internal Switches: 0.35Ω  
Current Mode Operation for Excellent Line  
and Load Transient Response  
Short-Circuit Protected  
A user selectable mode input is provided to allow the user  
to trade-off noise ripple for low power efficiency. Burst  
Mode® operation provides high efficiency at light loads,  
while Pulse Skip Mode provides low noise ripple at light  
loads.  
Low Dropout Operation: 100% Duty Cycle  
Ultralow Shutdown Current: IQ < 1µA  
Power-On Reset Output  
Externally Synchronizable Oscillator  
Small Thermally UEnhanced 3mm × 3mm DFN Package  
To further maximize battery run time, the P-channel  
MOSFETs are turned on continuously in dropout (100%  
duty cycle), and both channels draw a total quiescent  
currentofonly40µA.Inshutdown,thedevicedraws<1µA.  
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.  
All other trademarks are the property of their respective owners. Burst Mode is a registered  
trademark of Linear Technology Corporation. Protected by U.S. Patents including 5481178,  
6580258, 6304066, 6127815, 6498466, 6611131.  
APPLICATIO S  
PDAs/Palmtop PCs  
Digital Cameras  
Cellular Phones  
Portable Media Players  
PC Cards  
Wireless and DSL Modems  
U
TYPICAL APPLICATIO  
Efficiency and Power Loss  
vs Load Current  
V
100  
95  
90  
85  
80  
75  
70  
65  
60  
1000  
100  
10  
IN  
2.8V TO 5.5V  
10µF  
100k  
RUN2  
V
RUN1  
POR  
IN  
EFFICIENCY  
MODE/SYNC  
RESET  
LTC3548-2  
POWER LOSS  
4.7µH  
2.2µH  
V
V
OUT2  
2.5V  
OUT1  
SW2  
SW1  
1.8V  
68pF  
887k  
400mA  
800mA  
V
V
= 3.6V  
IN  
OUT  
1
= 1.8V  
V
V
OUT1  
FB2  
Burst Mode OPERATION  
CHANNEL 1  
GND  
280k  
10µF  
4.7µF  
NO LOAD ON CHANNEL 2  
0.1  
1000  
35482 F01  
1
10  
100  
LOAD CURRENT (mA)  
Figure 1. 2.5V/1.8V at 400mA/800mA Step-Down Regulators  
35482 F01b  
35482fa  
1
LTC3548-2  
W W U W  
U
W
U
ABSOLUTE AXI U RATI GS  
PACKAGE/ORDER I FOR ATIO  
(Note 1)  
TOP VIEW  
VIN Voltages.................................................0.3V to 6V  
VOUT1, VFB2 Voltages ...................... 0.3V to VIN + 0.3V  
RUN1, RUN2 Voltages ................................0.3V to VIN  
MODE/SYNC Voltage ...................... 0.3V to VIN + 0.3V  
SW1, SW2 Voltage ......................... 0.3V to VIN + 0.3V  
POR Voltage ................................................0.3V to 6V  
Ambient Operating Temperature Range  
(Note 2) .................................................. 40°C to 85°C  
Junction Temperature (Note 5)............................. 125°C  
Storage Temperature Range ................. – 65°C to 125°C  
V
1
2
3
4
5
10  
9
V
FB2  
OUT1  
RUN1  
RUN2  
POR  
11  
V
IN  
8
SW1  
GND  
7
SW2  
6
MODE/  
SYNC  
DD PACKAGE  
10-LEAD (3mm × 3mm) PLASTIC DFN  
TJMAX = 125°C, θJA = 40°C/W, θJC = 3°C/W (4-LAYER BOARD)  
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND  
ORDER PART NUMBER  
DD PART MARKING  
LCDK  
LTC3548EDD-2  
Order Options Tape and Reel: Add #TR  
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF  
Lead Free Part Marking: http://www.linear.com/leadfree/  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 3.6V, unless otherwise specified. (Note 2)  
A
IN  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
UNITS  
V
V
Operating Voltage Range  
Feedback Pin Input Current  
Feedback Voltage of Channel 2 (Note 3)  
2.5  
IN  
I
30  
nA  
FB2  
V
0°C T 85°C  
0.588  
0.585  
0.6  
0.6  
0.612  
0.612  
V
V
FB2  
A
–40°C T 85°C  
A
V
Output Voltage of Channel 1 (Note 3)  
0°C T 85°C  
1.764  
1.755  
1.8  
1.8  
1.836  
1.836  
V
V
OUT1  
A
–40°C T 85°C  
A
V  
V  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
V
= 2.5V to 5.5V (Note 3)  
IN  
0.3  
0.5  
0.5  
%/V  
%
LINE REG  
(Note 3)  
LOAD REG  
I
Input DC Supply Current (Note 4)  
Active Mode  
S
V
V
= 1.5V, V = 0.5V  
700  
40  
0.1  
950  
60  
1
µA  
µA  
µA  
OUT1  
OUT1  
FB2  
Sleep Mode  
Shutdown  
= 1.9V, V = 0.63V, MODE/SYNC = 3.6V  
FB2  
RUN = 0V, V = 5.5V, MODE/SYNC = 0V  
IN  
f
f
I
Oscillator Frequency  
V
= 1.8V, V = 0.6V  
1.8  
2.25  
2.25  
2.7  
MHz  
MHz  
OSC  
SYNC  
LIM  
OUT1  
FB2  
Synchronization Frequency  
Peak Switch Current Limit Channel 1  
Peak Switch Current Limit Channel 2  
V
V
= 3V, Duty Cycle <35%  
0.95  
0.6  
1.2  
0.7  
1.6  
0.9  
A
A
IN  
IN  
= 3V, V = 0.5V, Duty Cycle <35%  
FB2  
R
Top Switch On-Resistance  
Bottom Switch On-Resistance  
(Note 6)  
(Note 6)  
0.35  
0.30  
0.45  
0.45  
DS(ON)  
I
Switch Leakage Current  
V
= 5V, V  
= 0V, V = 0V, V = 0V  
OUT1  
0.01  
1
µA  
SW(LKG)  
IN  
RUN  
FB2  
35482fa  
2
LTC3548-2  
ELECTRICAL CHARACTERISTICS  
The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 3.6V, unless otherwise specified. (Note 2)  
A
IN  
CONDITIONS  
V , V Ramping Down, MODE/SYNC = 0V  
OUT1 FB2  
SYMBOL  
PARAMETER  
MIN  
TYP  
–8.5  
100  
MAX  
UNITS  
%
POR  
Power-On Reset Threshold  
Power-On Reset On-Resistance  
Power-On Reset Delay  
RUN Threshold  
200  
Cycles  
V
262,144  
1
V
0.3  
1.5  
1
RUN  
I
RUN Leakage Current  
0.01  
µA  
RUN  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: The LTC3548-2 is tested in a proprietary test mode that connects  
the output of the error amplifier with an outside servo loop.  
Note 4: Dynamic supply current is higher due to the internal gate charge  
being delivered at the switching frequency.  
Note 2: The LTC3548-2 is guaranteed to meet specified performance from  
0°C to 85°C. Specifications over the 40°C and 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 5: T is calculated from the ambient T and power dissipation P  
D
J
A
according to the following formula: T = T + (P θ ).  
J
A
D
JA  
Note 6: The DFN switch on-resistance is guaranteed by correlation to  
wafer level measurements.  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS T = 25°C unless otherwise specified.  
A
Burst Mode Operation  
Pulse Skipping Mode  
Load Step  
SW  
5V/DIV  
SW  
5V/DIV  
V
OUT  
200mV/DIV  
I
L
I
L
I
L
200mA/DIV  
500mA/DIV  
200mA/DIV  
V
OUT  
10mV/DIV  
I
LOAD  
V
OUT  
500mA/DIV  
20mV/DIV  
35482 G01  
35482 G02  
35482 G03  
V
V
LOAD  
= 3.6V  
2µs/DIV  
V
V
LOAD  
= 3.6V  
1µs/DIV  
V
= 3.6V  
IN  
20µs/DIV  
IN  
IN  
= 1.8V  
= 1.8V  
V
= 1.8V  
OUT  
OUT  
OUT  
I
= 60mA  
I
= 30mA  
I
LOAD  
= 80mA TO 800mA  
CHANNEL 1; CIRCUIT OF FIGURE 3  
CHANNEL 1; CIRCUIT OF FIGURE 3  
CHANNEL 1; CIRCUIT OF FIGURE 3  
Oscillator Frequency  
vs Temperature  
Oscillator Frequency  
vs Input Voltage  
Efficiency vs Input Voltage  
10  
8
100  
95  
90  
85  
80  
75  
70  
65  
60  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
V
= 3.6V  
IN  
100mA  
6
4
10mA  
1mA  
2
0
800mA  
–2  
–4  
–6  
–8  
–10  
V
= 1.8V, CHANNEL 1  
OUT  
Burst Mode OPERATION  
CIRCUIT OF FIGURE 3  
4
5
6
4
5
6
50  
TEMPERATURE (°C)  
100 125  
2
3
2
3
–50 –25  
0
25  
75  
V
(V)  
INPUT VOLTAGE (V)  
IN  
35482 G06  
35482 G04  
35482 G05  
35482fa  
3
LTC3548-2  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS T = 25°C unless otherwise specified.  
A
Reference Voltage  
vs Temperature  
R
vs Input Voltage  
R
vs Junction Temperature  
DS(ON)  
DS(ON)  
0.615  
0.610  
0.605  
0.600  
0.595  
0.590  
0.585  
500  
450  
400  
350  
300  
250  
200  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
V
= 3.6V  
V
= 2.7V  
IN  
IN  
V
= 3.6V  
IN  
V
= 4.2V  
IN  
MAIN  
SWITCH  
SYNCHRONOUS  
SWITCH  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
3
2
5
7
50  
TEMPERATURE (°C)  
100 125  
1
4
6
50  
100 125 150  
–50 –25  
0
25  
75  
–50 –25  
0
25  
75  
V
(V)  
JUNCTION TEMPERATURE (°C)  
IN  
35482 G08  
35482 G07  
3548 G09  
Line Regulation  
Load Regulation  
Efficiency vs Load Current  
0.5  
2.0  
1.5  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
I
= 1.8V  
OUT  
= 200mA  
0.4  
0.3  
OUT  
Burst Mode OPERATION  
PULSE SKIP MODE  
1.0  
Burst Mode OPERATION  
0.2  
0.5  
0.1  
0
0
PULSE SKIP MODE  
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
–0.5  
–1.0  
–1.5  
–2.0  
V
= 3.6V, V  
= 1.8V  
V
= 3.6V, V  
= 1.8V  
IN  
OUT  
IN  
OUT  
NO LOAD ON OTHER CHANNEL  
NO LOAD ON OTHER CHANNEL  
CHANNEL 1; CIRCUIT OF FIGURE 3  
CHANNEL 1; CIRCUIT OF FIGURE 3  
1
10  
100  
1000  
2
6
1
10  
100  
1000  
3
4
5
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
V
(V)  
IN  
35482 G11  
35482 G12  
35482 G10  
Efficiency vs Load Current  
Efficiency vs Load Current  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
= 2.7V  
IN  
V
= 3.6V  
IN  
V
= 5V  
V
= 3.6V  
IN  
IN  
V
V
= 2.7V  
= 4.2V  
IN  
IN  
V
= 4.2V  
IN  
V
= 1.5V  
V
= 2.5V  
OUT2  
V
OUT2  
= 3.3 V  
OUT2  
Burst Mode OPERATION  
Burst Mode OPERATION  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 3  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 3  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 3  
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
35482 G13  
35482 G14  
35482 G15  
35482fa  
4
LTC3548-2  
U
U
U
PI FU CTIO S  
VOUT1 (Pin 1): Output Voltage Feedback for Channel 1. An  
internal resistive divider divides the output voltage down  
for comparison to the internal reference voltage.  
besynchronizedtoanexternaloscillatorappliedtothispin  
and pulse skipping mode is automatically selected.  
SW2 (Pin 7): Regulator 2 Switch Node Connection to the  
Inductor. This pin swings from VIN to GND.  
RUN1 (Pin 2): Regulator 1 Enable. Forcing this pin to VIN  
enables regulator 1, while forcing it to GND causes regu-  
lator 1 to shut down. This pin must be driven; do not float.  
POR (Pin 8): Power-On Reset . This common-drain logic  
output is pulled to GND when the output voltage falls  
below –8.5% of regulation and goes high after 117ms  
when both channels are within regulation.  
VIN(Pin3):InputPowerSupply.Mustbecloselydecoupled  
to GND.  
SW1 (Pin 4): Regulator 1 Switch Node Connection to the  
RUN2 (Pin 9): Regulator 2 Enable. Forcing this pin to VIN  
enables regulator 2, while forcing it to GND causes regu-  
lator 2 to shut down. This pin must be driven; do not float.  
Inductor. This pin swings from VIN to GND.  
GND (Pin 5): Ground. Connect to the (–) terminal of COUT  
and (–) terminal of CIN.  
,
VFB2 (Pin 10): Output Feedback. Receives the feedback  
voltage from the external resistive divider across the  
output. Nominal voltage for this pin is 0.6V.  
MODE/SYNC (Pin 6): Combination Mode Selection and  
OscillatorSynchronization.Thispincontrolstheoperation  
of the device. When tied to VIN or GND, Burst Mode  
operation or pulse skipping mode is selected, respec-  
tively. Do not float this pin. The oscillation frequency can  
Exposed Pad (GND) (Pin 11): Ground. Connect to the  
(–) terminal of COUT, and (–) terminal of CIN. Must be  
connected to PCB ground for electrical contact and rated  
thermal performance.  
35482fa  
5
LTC3548-2  
W
BLOCK DIAGRA  
REGULATOR 1  
MODE/SYNC  
6
BURST  
CLAMP  
V
IN  
SLOPE  
COMP  
EN  
BURST  
+
+
0.6V  
SLEEP  
+
I
TH1  
5  
EA  
I
COMP  
0.35V  
V
OUT1  
1
R1  
V
FB1  
S
R
Q
Q
RS  
LATCH  
R2  
0.55V  
+
SWITCHING  
LOGIC  
UV  
OV  
UVDET  
OVDET  
AND  
BLANKING  
CIRCUIT  
ANTI  
SHOOT-  
THRU  
4
SW1  
+
0.65V  
+
I
RCMP  
SHUTDOWN  
11 GND  
V
IN  
3
8
V
IN  
PGOOD1  
POR  
2
9
RUN1  
RUN2  
POR  
COUNTER  
0.6V REF  
OSC  
OSC  
5
7
GND  
PGOOD2  
REGULATOR 2 (IDENTICAL TO REGULATOR 1)  
SW2  
+
0.6V  
I
TH2  
EA  
V
FB2  
10  
0.55V  
+
UV  
OV  
UVDET  
OVDET  
+
0.65V  
35482 BD  
35482fa  
6
LTC3548-2  
U
OPERATIO  
The LTC3548-2 uses a constant frequency, current mode  
architecture. The operating frequency is set at 2.25MHz  
and can be synchronized to an external oscillator. Both  
channels share the same clock and run in-phase. To suit  
a variety of applications, the selectable Mode pin allows  
the user to choose between low noise and high efficiency.  
To optimize efficiency, the Burst Mode operation can be  
selected. When the load is relatively light, the LTC3548-2  
automaticallyswitchesintoBurstModeoperationinwhich  
the PMOS switch operates intermittently based on load  
demand with a fixed peak inductor current. By running  
cycles periodically, the switching losses which are domi-  
natedbythegatechargelossesofthepowerMOSFETsare  
minimized. The main control loop is interrupted when the  
output voltage reaches the desired regulated value. A  
voltage comparator trips when ITH is below 0.35V, shut-  
ting off the switch and reducing the power. The output  
capacitor and the inductor supply the power to the load  
untilITH exceeds0.65V,turningontheswitchandthemain  
control loop which starts another cycle.  
The output voltage for channel 1 is set by an internal  
divider returned to the VOUT1 pin. The output voltage for  
channel 2 is set by an external divider returned to the VFB2  
pin. An error amplfier compares the feedback output  
voltage with a reference voltage of 0.6V and adjusts the  
peak inductor current accordingly. An undervoltage com-  
parator will pull the POR output low if the output voltage  
is not above –8.5% of the reference voltage. The POR  
output will go high after 262,144 clock cycles (about  
117ms in pulse skip mode) of achieving regulation.  
For lower ripple noise at low currents, the pulse skipping  
modecanbeused. Inthismode, theLTC3548-2continues  
to switch at a constant frequency down to very low  
currents, where it will begin skipping pulses. The effi-  
ciency in pulse skip mode can be improved slightly by  
connecting the SW node to the MODE/SYNC input which  
reduces the clock frequency by approximately 30%.  
Main Control Loop  
Duringnormaloperation,thetoppowerswitch(P-channel  
MOSFET) is turned on at the beginning of a clock cycle  
when the VFB voltage (see Block Diagram) is below the the  
reference voltage. The current into the inductor and the  
loadincreasesuntilthecurrentlimitisreached.Theswitch  
turns off and energy stored in the inductor flows through  
the bottom switch (N-channel MOSFET) into the load until  
the next clock cycle.  
Dropout Operation  
When the input supply voltage decreases toward the  
output voltage, the duty cycle increases to 100% which is  
the dropout condition. In dropout, the PMOS switch is  
turned on continuously with the output voltage being  
equal to the input voltage minus the voltage drops across  
the internal P-channel MOSFET and the inductor.  
The peak inductor current is controlled by the internally  
compensated ITH voltage, which is the output of the error  
amplifier.This amplifier compares the VFB to the 0.6V  
reference. When the load current increases, the VFB volt-  
age decreases slightly below the reference. This  
decrease causes the error amplifier to increase the ITH  
voltageuntiltheaverageinductorcurrentmatchesthenew  
load current.  
An important design consideration is that the RDS(ON) of  
the P-channel switch increases with decreasing input  
supply voltage (see Typical Performance Characteristics).  
Therefore, the user should calculate the power dissipation  
when the LTC3548-2 is used at 100% duty cycle with low  
input voltage (see Thermal Considerations in the Applica-  
tions Information section).  
The main control loop is shut down by pulling the RUN pin  
to ground.  
Low Supply Operation  
Low Current Operation  
To prevent unstable operation, the LTC3548-2 incorpo-  
rates an Undervoltage Lockout circuit that shuts down the  
part when the input voltage drops below about 1.65V.  
ByselectingMODE/SYNC(pin6), twomodesareavailable  
to control the operation of the LTC3548-2 at low currents.  
Both modes automatically switch from continuous opera-  
tion to the selected mode when the load current is low.  
35482fa  
7
LTC3548-2  
W U U  
U
APPLICATIO S I FOR ATIO  
A general LTC3548-2 application circuit is shown in  
Figure 2. External component selection is driven by the  
load requirement, and begins with the selection of the  
inductor L. Once the inductor is chosen, CIN and COUT can  
be selected.  
The inductor value will also have an effect on Burst Mode  
operation. The transition from low current operation  
begins when the peak inductor current falls below a level  
set by the burst clamp. Lower inductor values result in  
higher ripple current which causes this to occur at lower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values will cause the burst frequency to  
increase.  
Inductor Selection  
Although the inductor does not influence the operating  
frequency, the inductor value has a direct effect on ripple  
current. The inductor ripple current IL decreases with  
Inductor Core Selection  
higher inductance and increases with higher VIN or VOUT  
:
Different core materials and shapes will change the size/  
current and price/current relationship of an inductor.  
Toroid or shielded pot cores in ferrite or permalloy mate-  
rials are small and don’t radiate much energy, but gener-  
ally cost more than powdered iron core inductors with  
similar electrical characterisitics. The choice of which  
style inductor to use often depends more on the price vs  
size requirements and any radiated field/EMI require-  
ments than on what the LTC3548-2 requires to operate.  
Table 1 shows some typical surface mount inductors that  
work well in LTC3548-2 applications.  
VOUT  
fO L  
VOUT  
V
IN  
IL =  
• 1–  
Accepting larger values of IL allows the use of low  
inductances, but results in higher output voltage ripple,  
greater core losses and lower output current capability. A  
reasonable starting point for setting ripple current is  
IL = 0.3 • IOUT(MAX), where IOUT(MAX) is 800mA for  
channel 1 and 400mA for channel 2. The largest ripple  
current IL occurs at the maximum input voltage. To  
guarantee that the ripple current stays below a specified  
maximum, theinductorvalueshouldbechosenaccording  
to the following equation:  
Table 1. Representative Surface Mount Inductors  
PART  
NUMBER  
VALUE  
(µH)  
DCR  
MAX DC  
SIZE  
3
(MAX) CURRENT (A) W × L × H (mm )  
Sumida  
CDRH3D16  
2.2  
3.3  
4.7  
0.075  
0.110  
0.162  
1.20  
1.10  
0.90  
3.8 × 3.8 × 1.8  
VOUT  
fO IL  
VOUT  
V
IN(MAX)  
L =  
• 1–  
Sumida  
CDRH2D11  
1.5  
2.2  
0.068  
0.170  
0.900  
0.780  
3.2 × 3.2 × 1.2  
4.4 × 5.8 × 1.2  
2.5 × 3.2 × 2.0  
2.5 × 3.2 × 2.0  
4.5 × 5.4 × 1.2  
V
IN  
2.5V TO 5.5V  
Sumida  
CMD4D11  
2.2  
3.3  
0.116  
0.174  
0.950  
0.770  
C
R5  
IN  
RUN2  
V
RUN1  
POR  
IN  
BM*  
POWER-ON  
RESET  
MODE/SYNC  
Murata  
LQH32CN  
1.0  
2.2  
0.060  
0.097  
1.00  
0.79  
PS*  
LTC3548-2  
Toko  
D312F  
2.2  
3.3  
0.060  
0.260  
1.08  
0.92  
L1  
L2  
V
OUT2  
SW2  
SW1  
V
OUT1  
C5  
R2  
Panasonic  
ELT5KT  
3.3  
4.7  
0.17  
0.20  
1.00  
0.95  
V
OUT1  
V
FB2  
GND  
C
OUT1  
C
R1  
OUT2  
Input Capacitor (CIN) Selection  
In continuous mode, the input current of the converter is  
35482 F02  
*MODE/SYNC = 0V: PULSE SKIP  
MODE/SYNC = V : Burst Mode  
IN  
a square wave with a duty cycle of approximately VOUT  
/
Figure 2. LTC3548-2 General Schematic  
VIN. To prevent large voltage transients, a low equivalent  
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series resistance (ESR) input capacitor sized for the maxi-  
mum RMS current must be used. The maximum RMS  
capacitor current is given by:  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or RMS  
current handling requirement of the application. Alumi-  
numelectrolytic,specialpolymer,ceramicanddrytantulum  
capacitorsareallavailableinsurfacemountpackages.The  
OS-CONsemiconductordielectriccapacitoravailablefrom  
Sanyo has the lowest ESR(size) product of any aluminum  
electrolytic at a somewhat higher price. Special polymer  
capacitors, such as Sanyo POSCAP, Panasonic Special  
Polymer (SP), and Kemet A700, offer very low ESR, but  
have a lower capacitance density than other types. Tanta-  
lum capacitors have the highest capacitance density, but  
they have a larger ESR and it is critical that the capacitors  
are surge tested for use in switching power supplies. An  
excellent choice is the AVX TPS series of surface mount  
tantalums, available in case heights ranging from 2mm to  
4mm. Aluminum electrolytic capacitors have a signifi-  
cantly larger ESR, and are often used in extremely cost-  
sensitiveapplicationsprovidedthatconsiderationisgiven  
to ripple current ratings and long term reliability. Ceramic  
capacitorshavethelowestESRandcost, butalsohavethe  
lowest capacitance density, a high voltage and tempera-  
ture coefficient, and exhibit audible piezoelectric effects.  
In addition, the high Q of ceramic capacitors along with  
trace inductance can lead to significant ringing.  
VOUT(V – VOUT  
IN  
IRMS IMAX  
V
IN  
where the maximum average output current IMAX equals  
the peak current minus half the peak-to-peak ripple cur-  
rent, IMAX = ILIM IL/2.  
This formula has a maximum at VIN = 2VOUT, where IRMS  
= IOUT/2. This simple worst-case is commonly used to  
design because even significant deviations do not offer  
much relief. Note that capacitor manufacturer’s ripple  
current ratings are often based on only 2000 hours life-  
time. This makes it advisable to further derate the capaci-  
tor, or choose a capacitor rated at a higher temperature  
thanrequired. Severalcapacitorsmayalsobeparalleledto  
meet the size or height requirements of the design. An  
additional 0.1µF to 1µF ceramic capacitor is also recom-  
mended on VIN for high frequency decoupling, when not  
using an all ceramic capacitor solution.  
Output Capacitor (COUT) Selection  
The selection of COUT is driven by the required ESR to  
minimizevoltagerippleandloadsteptransients.Typically,  
once the ESR requirement is satisfied, the capacitance is  
adequate for filtering. The output ripple (VOUT) is deter-  
mined by:  
In most cases, 0.1µF to 1µF of ceramic capacitors should  
also be placed close to the LTC3548-2 in parallel with the  
main capacitors for high frequency decoupling.  
Ceramic Input and Output Capacitors  
1
Higher value, lower cost ceramic capacitors are now  
becomingavailableinsmallercasesizes.Thesearetempt-  
ing for switching regulator use because of their very low  
ESR. Unfortunately, the ESR is so low that it can cause  
loop stability problems. Solid tantalum capacitor ESR  
generatesaloopzeroat5kHzto50kHzthatisinstrumen-  
tal in giving acceptable loop phase margin. Ceramic ca-  
pacitors remain capacitive to beyond 300kHz and usually  
resonate with their ESL before ESR becomes effective.  
Also, ceramic caps are prone to temperature effects which  
requires the designer to check loop stability over the  
operating temperature range. To minimize their large  
temperature and voltage coefficients, only X5R or X7R  
VOUT ≈ ∆IL ESR+  
8• fO COUT  
where f = operating frequency, COUT = output capacitance  
and IL = ripple current in the inductor. The output ripple  
is highest at maximum input voltage since IL increases  
with input voltage. With IL = 0.3 • IOUT(MAX) the output  
ripple will be less than 100mV at maximum VIN and  
fO = 2.25MHz with:  
ESRCOUT < 150mΩ  
Once the ESR requirements for COUT have been met, the  
RMS current rating generally far exceeds the IRIPPLE(P-P)  
requirement, except for an all ceramic solution.  
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ceramic capacitors should be used. A good selection of  
ceramic capacitors is available from Taiyo Yuden, AVX,  
Kemet, TDK, and Murata.  
Keeping the current small (<5µA) in these resistors maxi-  
mizes efficiency, but making them too small may allow  
stray capacitance to cause noise problems and reduce the  
phase margin of the error amp loop.  
Great care must be taken when using only ceramic input  
and output capacitors. When a ceramic capacitor is used  
at the input and the power is being supplied through long  
wires,suchasfromawalladapter,aloadstepattheoutput  
can induce ringing at the VIN pin. At best, this ringing can  
couple to the output and be mistaken as loop instability. At  
worst, the ringing at the input can be large enough to  
damage the part.  
To improve the frequency response, a feed-forward ca-  
pacitor CF may also be used. Great care should be taken to  
route the VOUT1, VFB2 line away from noise sources, such  
as the inductor or the SW line.  
Power-On Reset  
The POR pin is an open-drain output which pulls low when  
either regulator is out of regulation. When both output  
voltages are above –8.5% of regulation, a timer is started  
which releases POR after 218 clock cycles (about 117ms  
in pulse skip mode). This delay can be significantly longer  
in Burst Mode operation with low load currents, since the  
clock cycles only occur during a burst and there could be  
milliseconds of time between bursts. This can be by-  
passed by tying the POR output to the MODE/SYNC input,  
to force pulse skipping mode during a reset. In addition, if  
the output voltage faults during Burst Mode sleep, POR  
could have a slight delay for an undervoltage output  
condition. This can be avoided by using pulse skipping  
mode instead. When either channel is shut down, the POR  
output is pulled low, since one or both of the channels are  
not in regulation.  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must instead fulfill a charge storage  
requirement.Duringaloadstep,theoutputcapacitormust  
instantaneously supply the current to support the load  
untilthefeedbackloopraisestheswitchcurrentenoughto  
support the load. The time required for the feedback loop  
to respond is dependent on the compensation and the  
output capacitor size. Typically, 3-4 cycles are required to  
respond to a load step, but only in the first cycle does the  
output drop linearly. The output droop, VDROOP, is usually  
about 2-3 times the linear drop of the first cycle. Thus, a  
good place to start is with the output capacitor size of  
approximately:  
IOUT  
COUT 2.5  
fO VDROOP  
Mode Selection and Frequency Synchronization  
More capacitance may be required depending on the duty  
cycle and load step requirements.  
In most applications, the input capacitor is merely re-  
quired to supply high frequency bypassing, since the  
impedance to the supply is very low. A 10µF ceramic  
capacitor is usually enough for these conditions.  
TheMODE/SYNCpinisamultipurposepinwhichprovides  
mode selection and frequency synchronization. Connect-  
ing this pin to VIN enables Burst Mode operation, which  
provides the best low current efficiency at the cost of a  
higheroutputvoltageripple.Connectingthispintoground  
selects pulse skipping mode, which provides the lowest  
output ripple, at the cost of low current efficiency.  
Setting the Output Voltage for Channel 2  
The LTC3548-2 can also be synchronized to an external  
2.25MHz clock signal by the MODE/SYNC pin. During  
synchronization, the mode is set to pulse skipping and the  
topswitchturn-onissynchronizedtotherisingedgeofthe  
external clock.  
The LTC3548-2 develops a 0.6V reference voltage be-  
tween the feedback pin, VFB2, and the ground as shown in  
Figure 2. The output voltage, VOUT2, is set by a resistive  
divider according to the following formula:  
R2  
R1  
VOUT2 = 0.6V 1+  
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Checking Transient Response  
It is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Percent efficiency can be  
expressed as:  
The regulator loop response can be checked by looking at  
the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an amount  
equal to ILOAD • ESR, where ESR is the effective series  
resistance of COUT. ILOAD also begins to charge or  
discharge COUT, generating a feedback error signal used  
by the regulator to return VOUT to its steady-state value.  
During this recovery time, VOUT can be monitored for  
overshoot or ringing that would indicate a stability  
problem.  
% Efficiency = 100% – (L1 + L2 + L3 + ...)  
whereL1, L2, etc. aretheindividuallossesasapercentage  
of input power.  
Although all dissipative elements in the circuit produce  
losses, 4 main sources usually account for most of the  
losses in LTC3548-2 circuits: 1)VIN quiescent current,  
2) switching losses, 3) I2R losses, 4) other losses.  
1) The VIN current is the DC supply current given in the  
Electrical Characteristics which excludes MOSFET driver  
andcontrolcurrents.VIN currentresultsinasmall(<0.1%)  
loss that increases with VIN, even at no load.  
The initial output voltage step may not be within the  
bandwidth of the feedback loop, so the standard second-  
order overshoot/DC ratio cannot be used to determine  
phase margin. In addition, a feed-forward capacitor, CF,  
can be added to improve the high frequency response, as  
shown in Figure 2. Capacitor CF provides phase lead by  
creating a high frequency zero with R2, which improves  
the phase margin.  
2) The switching current is the sum of the MOSFET driver  
and control currents. The MOSFET driver current results  
fromswitchingthegatecapacitanceofthepowerMOSFETs.  
Each time a MOSFET gate is switched from low to high to  
low again, a packet of charge dQ moves from VIN to  
ground. The resulting dQ/dt is a current out of VIN that is  
typically much larger than the DC bias current. In continu-  
ousmode, IGATECHG =fO(QT +QB), whereQT andQB arethe  
gate charges of the internal top and bottom MOSFET  
switches. The gate charge losses are proportional to VIN  
and thus their effects will be more pronounced at higher  
supply voltages.  
3) I2R losses are calculated from the DC resistances of the  
internal switches, RSW, and external inductor, RL. In  
continuousmode,theaverageoutputcurrentflowsthrough  
inductor L, but is “chopped” between the internal top and  
bottom switches. Thus, the series resistance looking into  
the SW pin is a function of both top and bottom MOSFET  
RDS(ON) and the duty cycle (D) as follows:  
The output voltage settling behavior is related to the  
stability of the closed-loop system and will demonstrate  
the actual overall supply performance. For a detailed  
explanation of optimizing the compensation components,  
including a review of control loop theory, refer to Applica-  
tion Note 76.  
In some applications, a more severe transient can be  
caused by switching loads with large (>1µF) load input  
capacitors. The discharged load input capacitors are ef-  
fectively put in parallel with COUT, causing a rapid drop in  
VOUT. No regulator can deliver enough current to prevent  
this problem, if the switch connecting the load has low  
resistance and is driven quickly. The solution is to limit the  
turn-on speed of the load switch driver. A Hot SwapTM  
controller is designed specifically for this purpose and  
usuallyincorporatescurrentlimiting, short-circuitprotec-  
tion and soft-starting.  
RSW = (RDS(ON)TOP)(D) + (RDS(ON)BOT)(1 – D)  
The RDS(ON) for both the top and bottom MOSFETs can be  
obtained from the Typical Performance Characteristics  
curves. Thus, to obtain I2R losses:  
I2R losses = IOUT2(RSW + RL)  
Hot Swap is a trademark of Linear Technology Corporation.  
Efficiency Considerations  
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100%.  
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4)Otherhiddenlossessuchascoppertraceandinternal  
battery resistances can account for additional efficiency  
degradations in portable systems. It is very important to  
include these “system” level losses in the design of a  
system. The internal battery and fuse resistance losses  
can be minimized by making sure that CIN has adequate  
charge storage and very low ESR at the switching fre-  
quency. Other losses including diode conduction losses  
during dead-time and inductor core losses generally ac-  
count for less than 2% total additional loss.  
The DFN package junction-to-ambient thermal resistance,  
θJA, is 40°C/W. Therefore, the junction temperature of the  
regulator operating in a 70°C ambient temperature is  
approximately:  
TJ = (0.272 + 0.068) • 40 + 70 = 83.6°C  
which is below the absolute maximum junction tempera-  
ture of 125°C.  
Design Example  
As a design example, consider using the LTC3548-2 in an  
portable application with a Li-Ion battery. The battery  
provides a VIN = 2.8V to 4.2V. The load requires a maxi-  
mum of 800mA in active mode and 2mA in standby mode.  
The output voltage is VOUT1 = 1.8V. Since the load still  
needs power in standby, Burst Mode operation is selected  
for good low load efficiency.  
Thermal Considerations  
In a majority of applications, the LTC3548-2 does not  
dissipate much heat due to its high efficiency. However, in  
applications where the LTC3548-2 is running at high  
ambient temperature with low supply voltage and high  
duty cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part. If  
the junction temperature reaches approximately 150°C,  
both power switches will turn off and the SW node will  
become high impedance.  
First, calculate the inductor value for about 30% ripple  
current at maximum VIN:  
1.8V  
2.25MHz 240mA  
1.8V  
4.2V  
L =  
• 1–  
= 1.9µH  
To prevent the LTC3548-2 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The tempera-  
ture rise is given by:  
Choosing a vendor’s closest inductor value of 2.2µH,  
results in a maximum ripple current of:  
1.8V  
2.25MHz 2.2µ  
1.8V  
4.2V  
IL =  
• 1−  
= 208mA  
T
RISE = PD θJA  
For cost reasons, a ceramic capacitor will be used. COUT  
selection is then based on load step droop instead of ESR  
requirements. For a 5% output droop:  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
800mA  
2.25MHz (5%1.8V)  
COUT 2.5  
= 9.9µF  
The junction temperature, TJ, is given by:  
TJ = TRISE + TAMBIENT  
A good standard value is 10µF. Since the output imped-  
ance of a Li-Ion battery is very low, CIN is typically 10µF.  
Following the same procedure for VOUT2 = 2.5V, the  
inductorvalueisderivedas4.7µHandtheoutputcapacitor  
value is 4.7µF.  
The output voltage, VOUT2, can now be programmed by  
choosing the values of R1 and R2. To maintain high  
efficiency, the current in these resistors should be kept  
small. Choosing 2µA with the 0.6V feedback voltage  
As an example, consider the case when the LTC3548-2 is  
at an input voltage of 2.7V with a load current of 400mA  
and 800mA and an ambient temperature of 70°C. From  
the Typical Performance Characteristics graph of Switch  
Resistance, the RDS(ON) resistance of the main switch is  
0.425. Therefore, power dissipated by each channel is:  
PD = I2 • RDS(ON) = 272mW and 68mW  
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3. The resistor divider, R1 and R2, must be connected  
between the (+) plate of COUT and a ground sense line  
terminatednearGND(exposedpad). Thefeedbacksignals  
makes R1 approximately 280k. A close standard 1%  
resistor is 280k, and R2 is then 887k.  
The PGOOD pin is a common drain output and requires a  
pull-upresistor.A100kresistorisusedforadequate speed.  
V
OUT1, VFB2 should be routed away from noisy compo-  
nents and traces, such as the SW line (Pins 4 and 7), and  
its trace should be minimized.  
Figure 3 shows the complete schematic for this design  
example.  
4.KeepsensitivecomponentsawayfromtheSWpins.The  
input capacitor CIN and the resistors R1 to R2 should be  
routed away from the SW traces and the inductors.  
Board Layout Considerations  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3548-2. These items are also illustrated graphically in  
the layout diagram of Figure 4. Check the following in your  
layout:  
5. Agroundplaneispreferred, butifnotavailable, keepthe  
signal and power grounds segregated with small signal  
components returning to the GND pin at one point and  
should not share the high current path of CIN or COUT  
.
6. Flood all unused areas on all layers with copper.  
Flooding with copper will reduce the temperature rise of  
power components. These copper areas should be con-  
nected to VIN or GND.  
1. Does the capacitor CIN connect to the power VIN (Pin 3)  
andGND(exposedpad)ascloseaspossible?Thiscapaci-  
torprovidestheACcurrenttotheinternalpowerMOSFETs  
and their drivers.  
2. Are the COUT and L1 closely connected? The (–) plate of  
COUT returns current to GND and the (–) plate of CIN.  
V
V
IN  
IN  
2.5V* TO 5.5V  
R5  
C1  
RUN2  
V
RUN1  
POR  
IN  
100k  
10µF  
RUN2  
V
RUN1  
POR  
IN  
MODE/SYNC  
POWER-ON  
RESET  
C
IN  
MODE/SYNC  
LTC3548-2  
L2  
4.7µH  
L1  
2.2µH  
LTC3548-2  
L1  
L2  
V
V
OUT1  
OUT2  
V
SW2  
SW1  
V
OUT1  
OUT2  
2.5V*  
400mA  
1.8V  
SW2  
SW1  
C5  
R2  
800mA  
C5 68pF  
V
V
OUT1  
FB2  
V
OUT1  
V
FB2  
GND  
R2  
887k  
GND  
C
C
R1  
C3  
4.7µF  
C2  
10µF  
OUT1  
R1  
280k  
OUT2  
35482 F03  
35482 F04  
C1, C2, C3: TAIYO YUDEN JMK212BJ106MG  
C3: TAIYO YUDEN JMK212BJ475MG  
L1: MURATA LQH32CN2R2M11  
L2: MURATA LQH32CN4R7M23  
BOLD LINES INDICATE  
HIGH CURRENT PATHS  
*V  
CONNECTED TO V FOR V 2.8V (DROPOUT)  
IN IN  
OUT  
Figure 4. LTC3548-2 Layout Diagram  
(See Board Layout Checklist)  
Figure 3. LTC3548-2 Typical Application  
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LTC3548-2  
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TYPICAL APPLICATIO S  
Low Ripple Buck Regulators Using Ceramic Capacitors  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
IN  
2.5V TO 5.5V  
V
= 2.5V  
OUT2  
R5  
C1  
100k  
10µF  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
V
= 1.8V  
OUT1  
LTC3548-2  
L2  
L1  
4.7µH  
10µH  
V
V
OUT1  
OUT2  
2.5V  
400mA  
1.8V  
SW2  
SW1  
800mA  
C5 68pF  
V
OUT1  
V
FB2  
V
= 3.3V  
IN  
PULSE SKIP MODE  
R2  
887k  
C3  
10µF  
C2  
10µF  
R1  
280k  
MODE/SYNC GND  
10  
100  
LOAD CURRENT (mA)  
1000  
35482 TA01  
C1, C2, C3: TDK C2012X5R0J106M  
L1: SUMIDA CDRH2D18/HP-4R7NC  
L2: SUMIDA CDRH2D18/HP-100NC  
35482 TA01b  
1mm Profile Core and I/O Supplies  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
IN  
3.6V TO 5.5V  
R5  
C1*  
V
V
= 3.3V  
= 1.8V  
OUT2  
OUT1  
100k  
10µF  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
MODE/SYNC  
LTC3548-2  
L2  
4.7µH  
L1  
2.2µH  
V
V
OUT1  
OUT2  
3.3V  
400mA  
1.8V  
SW2  
SW1  
800mA  
C5 68pF  
V
OUT1  
V
FB2  
V
= 5V  
IN  
R2  
887k  
C3  
4.7µF  
C2  
10µF  
R1  
196k  
GND  
Burst Mode OPERATION  
100 1000  
LOAD CURRENT (mA)  
1
10  
35482 TA02a  
C1, C2: MURATA GRM219R60J106KE19  
C3: MURATA GRM219R60J475KE19  
L1: COILTRONICS LPO3310-222MX  
L2: COILTRONICS LPO3310-472MX  
35482 TA02b  
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,  
ADDITIONAL CAPACITANCE MAY BE REQUIRED.  
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PACKAGE DESCRIPTIO  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
0.675 ±0.05  
3.50 ±0.05  
2.15 ±0.05 (2 SIDES)  
1.65 ±0.05  
PACKAGE  
OUTLINE  
0.25 ± 0.05  
0.50  
BSC  
2.38 ±0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
R = 0.115  
0.38 ± 0.10  
TYP  
6
10  
3.00 ±0.10  
(4 SIDES)  
1.65 ± 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
(DD10) DFN 1103  
5
1
0.25 ± 0.05  
0.50 BSC  
0.75 ±0.05  
0.200 REF  
2.38 ±0.10  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
35482fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
15  
LTC3548-2  
U
TYPICAL APPLICATIO  
2mm Height Lithium-Ion Single Inductor Buck-Boost Regulator and a Buck Regulator  
V
IN  
2.8V TO 4.2V  
C1  
10µF  
R5  
100k  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
MODE/SYNC  
L2  
15µH  
L1  
2.2µH  
LTC3548-2  
D1  
V
V
OUT1  
OUT2  
3.3V  
SW2  
SW1  
1.8V  
C5 22pF  
100mA  
800mA  
M1  
+
C6  
22µF  
V
OUT1  
V
FB2  
R4  
887k  
GND  
C3  
4.7µF  
C2  
10µF  
R3  
196k  
35482 TA03a  
C1, C2: TAIYO YUDEN JMK316BJ106ML L1: MURATA LQH32CN2R2M33  
C3: MURATA GRM21BR60J475KA11B  
C6: KEMET C1206C226K9PAC  
D1: PHILIPS PMEG2010  
L2: TOKO A914BYW-150M (D52LC SERIES)  
M1: SILICONIX Si2302DS  
Efficiency vs Load Current  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
90  
80  
70  
60  
50  
40  
30  
2.8V  
4.2V  
3.6V  
2.8V  
4.2V  
3.6V  
V
= 1.8V  
V
= 3.3V  
OUT  
OUT  
Burst Mode OPERATION  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
NO LOAD ON OTHER CHANNEL  
1
10  
100  
1000  
1
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3548 TA03c  
35482 TA03b  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
95% Efficiency, V : 2.7V to 6V, V  
LTC1878  
600mA (I ), 550kHz,  
= 0.8V, I = 10µA,  
Q
OUT  
IN  
OUT(MIN)  
Synchronous Step-Down DC/DC Converter  
I
<1µA, MSOP-8 Package  
SD  
LT1940  
Dual Output 1.4A(I , Constant 1.1MHz,  
V : 3V to 25V, V  
= 1.2V, I = 2.5mA, I = <1µA,  
OUT(MIN) Q SD  
OUT)  
IN  
High Efficiency Step-Down DC/DC Converter  
TSSOP-16E Package  
LTC3405/LTC3405A  
LTC3406/LTC3406B  
LTC3407/LTC3407-2  
LTC3410/LTC3410B  
LTC3411  
300mA (I ), 1.5MHz,  
96% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.8V, I = 20µA,  
Q
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
Synchronous Step-Down DC/DC Converters  
I
<1µA, ThinSOT Package  
600mA (I ), 1.5MHz,  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 20µA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converters  
I
<1µA, ThinSOT Package  
SD  
600mA/1.5MHz, 800mA/2.25MHz  
Dual Synchronous Step-Down DC/DC Converter  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40µA,  
Q
IN  
I
<1µA, MSE, DFN Package  
SD  
300mA (I ), 2.25MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 26µA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
<1µA, SC70 Package  
SD  
1.25A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60µA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
<1µA, MSOP-10 Package  
SD  
LTC3412/LTC3412A  
LTC3414  
2.5A/3A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60µA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
<1µA, TSSOP-16E Package  
SD  
4A (I ), 4MHz,  
95% Efficiency, V : 2.25V to 5.5V, V  
= 0.8V, I = 64µA,  
OUT(MIN) Q  
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
<1µA, TSSOP-28E Package  
SD  
LTC3548/LTC3548-1  
800mA/400mA (I ), Dual 2.25MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40µA,  
OUT(MIN) Q  
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
<1µA, DFN Package  
SD  
35482fa  
LT 0406 REV A • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
16  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
© LINEAR TECHNOLOGY CORPORATION 2006  

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