PGB102ST23MR [LITTELFUSE]
Trans Voltage Suppressor Diode, Bidirectional, 2 Element, Silicon, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3;
| 型号： | PGB102ST23MR |
| 厂家： | 
LITTELFUSE |
| 描述： | Trans Voltage Suppressor Diode, Bidirectional, 2 Element, Silicon, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3 瞬态抑制器 二极管 光电二极管 局域网 |
| 文件： | 总4页 (文件大小：704K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
PGB1 Series Lead-Free
Description
PulseGuard ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important. Data ports
utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI and DVI can benefit from this new technology.
PulseGuard suppressors use polymer composite materials
to suppress fast-rising ESD transients (as specified in IEC
61000-4-2), while adding virtually no capacitance to the
circuit.
Equivalent Circuits
Features
0402 and 0603 Devices
SOT23 Device
• RoHS compliant and
lead-free
• Withstands multiple
ESD strikes
3
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• Compatible with
2
1
pick-and-place processes
• Available in 1000, 3000,
5000 and 10000 piece
reels (EIA-RS481)
1
2
Applications
• HDTV Hardware
• Laptop/Desktop
Computers
• Computer Peripherals
• Digital Cameras
• External Storage
• Set-Top Boxes
Product Characteristics
Part Number
Lines Protected
Component Package
• Network Hardware
PGB1010402
PGB1010603
PGB102ST23
1
1
2
0402
0603
SOT23
Electrical Characteristics
Specification
PGB1010402
PGB1010603
PGB102ST23
Notes
ESD Capability:
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air Discharge
8kV
15kV
8kV
15kV
8kV
15kV
Measured per IEC 61000-4-2
8kV Contact Discharge1
Peak Voltage (typical)
1000V
250V
500V
150V
500V
150V
Measured per IEC 61000-4-2
8kV Contact Discharge1, at 25 nsec.
Clamping Voltage (typical)
Rated Voltage (maximum)
Capacitance (typical)
Response Time
12VDC
0.04 pF
24VDC
0.06 pF
24VDC
0.12 pF
Measured at 250 MHz
<1nS
<1nS
<1nS
Leakage Current (typical)
<1nA (12 VDC)
<1nA (6 VDC)
<1nA (6 VDC)
Some shifting in characteristics may
ESD Pulse Withstand
100 pulses min
1000 pulses min 1000 pulses min occur when tested over multiple
pulses at a very rapid rate
Notes: 1 Testing performed on Littelfuse Test Set up as described in typical test setup section.
1
PGB1 Series
www.littelfuse.com
©2007 Littelfuse
Electronics Designers Guide
Specifications are subject to change without notice.
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Part Numbering System
PGB1 01 0603 MR
Dimensions
0402 Device
Dimensions: mm (inch)
0.15 +/- 0.08
(0.006" +/- 0.003")
QUANTITY &
PACKAGING CODE:
LEAD-FREE
PULSEGUARD®
ESD SUPPRESSORS
MR = 1000 pieces
0.310 +/- 0.08
0.25
WR = 3000 pieces
NR = 5000 pieces
KR = 10,000 pieces
(0.012" +/- 0.003")
(0.010")
LINES PROTECTED:
01 = 1 line
0.99 +/- 0.05
(0.039" +/- 0.002")
0.24 +/- 0.09
(0.009" +/- 0.004")
DEVICE SIZE CODE:
0402 = 0402 (1005)
02 = 2 lines
04 = 4 lines
0.51 +/- 0.05
(0.020" +/- 0.002")
0603 = 0603 (1608)
ST23 = SOT23
Reflow Solder
Recommended for
reflow soldering only
1.55
(0.061")
0.38
(0.015")
Typical Device Capacitance
.58
(0.023")
0.56
(0.022")
1.00
0603 Device
Dimensions: mm (inch)
PGB102ST23
1.66 +/- 0.06
(0.066" +/- 0.003”)
0.10
1.04
0.15 +/- 0.08
(0.006" +/- 0.003”)
(0.041") REF
PGB1010603
PGB1010402
0.36 (0.014")
0.84 +/- 0.05
(0.033" +/- 0.002”)
0.01
100
0.43 +/- 0.18
(0.017" +/- 0.007”)
Reflow Solder
0.51 (0.020")
1,000
10,000
Frequency (MHz)
Wave Solder
0.76 (0.030")
3.30
(0.130")
3.05
(0.120")
Typical ESD Response
1.27 (0.050")
0.76 (0.030")
1.27 (0.050")
0.76 (0.030")
1200
1000
800
SOT23 Device
Dimensions: mm (inch)
2.24 +/- 0.18
(0.088" +/- 0.007")
600
400
PGB1010603
PGB102ST23
3.00 +/- 0.20
(0.118" +/- 0.008")
PGB1010402
1.91
(0.075")
200
0
1.09
(0.043")
0.69 +/- 0.10
(0.027" +/- 0.004)
0.91
(0.036")
TYP
-25
0
25
50
75 100 125 150 175
0.81
(0.032")
TYP
Time (ns)
0.15 +/- 0.08
(0.006 +/- 0.003")
TYP
Reflow Solder
Wave Solder
1.02 (0.040")
1.02 (0.040")
1.27
(0.050")
1.27
(0.050")
2.29
(0.090")
2.54
(0.100")
1.27
(0.050")
1.02 (0.040")
1.02 (0.040")
0.64
(0.025")
0.64
(0.025")
0.51
(0.020")
2.29
(0.090")
2.03
(0.080")
2
PGB1 Series
Specifications are subject to change without notice.
www.littelfuse.com
©2007 Littelfuse
Electronics Designers Guide
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Environmental Specifications
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin
Operating Temperature
Moisture Resistance
-65°C to +125°C
Materials
0402 series:
40°C, 95% RH, 1000 hours
Solderability
MIL-STD-202, Method 208
0603, ST23:
Soldering
Parameters
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
85°C, 85% RH, 1000 hours
MIL-STD-202, Method 107,
-65°C to 125°C, 30 min. cycle,
10 cycles
Thermal Shock
Design Consideration
MIL-STD-202, Method 201,
(10 to 55 to 10 Hz, 1 min.
cycle, 2 hrs each in X-Y-Z)
Because of the fast rise-time of the ESD transient, proper
placement of PulseGuard suppressors are a key design
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
suppressors (connected from signal/data line to ground)
directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Vibration
Chemical Resistance
MIL-STD-202, Method 215
IPC/EIA J-STD-002
Solder Leach Resistance and
Terminal Adhesion
Soldering Parameters
Reflow Condition
- Temperature Min (T
Pb – Free assembly
)
150°C
s(min)
Pre Heat - Temperature Max (T
)
200°C
s(max)
- Time (min to max) (ts)
60 – 180 seconds
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
- Temperature (TL) (Liquidus) 217°C
Reflow
- Temperature (tL)
60 – 150 seconds
260°C
Peak Temperature (TP)
Based on IPC/JEDEC J-STD-020
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate
6°C/second max
8 minutes max
Time 25°C to peak Temperature (TP)
3
PGB1 Series
www.littelfuse.com
©2007 Littelfuse
Electronics Designers Guide
Specifications are subject to change without notice.
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Packaging
Quantity &
Packaging Code
Packaging Specification
Part Number
Quantity
Packaging Option
PGB1010402
PGB1010603
PGB102ST23
PGB1010603
KR
MR
WR
NR
10000
1000
3000
5000
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
Tape and Reel Specifications
Tt
Ds
SOT23 Series
(mm)
0402 Series 0603 Series
Dd
Description
(mm)
0.05
1.50
4.00
0.41
1.12
2.00
0.62
0.61
8.00
(mm)
0.05
1.50
4.00
0.58
1.85
4.00
1.02
0.65
8.00
+
+
+
+
Ct - Cover tape thickness
Dd - Drive hole diameter
Ds - Drive hole spacing
Pd - Pocket depth
0.06
1.50
4.00
1.02
3.23
4.00
2.46
1.77
8.00
Tw
+
Pd
+
+
Ph
Pw
Ps
Ct
Ph - Pocket height
Ps - Pocket spacing
Pw - Pocket width
Tt - Carrier tape thickness
Tw - Carrier tape width
Typical Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20xTIP)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESDTEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
4
PGB1 Series
Specifications are subject to change without notice.
www.littelfuse.com
©2007 Littelfuse
Electronics Designers Guide
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