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SLVU2.8-8BTG [LITTELFUSE]

TVS DIODE 2.8V 17V 8SOIC;
SLVU2.8-8BTG
型号： SLVU2.8-8BTG
厂家： LITTELFUSE    LITTELFUSE
描述：

TVS DIODE 2.8V 17V 8SOIC

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TVS Diode Arrays (SPA® Diodes)  
Lightning Surge Protection- SLVU2.8-8 Series  
RoHS  
GREEN  
Pb  
SLVU2.8-8 Series 2.8V 30A TVS Array  
Description  
The SLVU2.8-8 was designed to protect low voltage,  
CMOS devices from ESD and lightning induced transients.  
There is a compensating diode in series with each low  
voltageTVS to present a low loading capacitance to the line  
being protected. These robust structures can safely absorb  
repetitive ESD strikes at ±±3kV ꢀcontact discharge) per IEC  
61333-4-2 standard and can safely dissipate up to ±3A ꢀIEC  
61333-4-5 2nd Edition, tP=8/23μs) with very low clamping  
voltages.  
Features  
• ESD, IEC 61333-4-2,  
±±3kV contact, ±±3kV air  
• SOIC-8 ꢀJEDEC MO-312)  
pin configuration allows  
for protection of all 4  
Pinout  
• EFT, IEC 61333-4-4, 43A  
ꢀ5/53ns)  
differential pair for 1GbE  
ꢄ
ꢅ
ꢆ
ꢇ
• RoHS Compliant and  
Lead Free  
• Lightning, IEC 61333-4-5  
2nd Edition, ±3A ꢀ8/23μs)  
• Moisture Sensitivity Level  
ꢀMSL-1)  
• Low capacitance of 2.6pF  
per line  
• Low leakage current of  
3.1μA ꢀMAX) at 2.8V  
ꢀ
ꢁ
ꢂ
ꢃ
Applications  
Functional Block Diagram  
• 13/133/1333 Ethernet  
• WAN/LAN Equipment  
• Switching Systems  
• Analog Inputs  
• Base Stations  
Pin 1.3.5.7  
• Desktops, Servers, and  
Notebooks  
Additional Information  
Pin 2.4.6.8  
Daꢀasꢁeeꢀ  
ꢀesoꢁrꢂes  
Saꢀꢁꢂes  
© 2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 08/22/19  
TVS Diode Arrays (SPA® Diodes)  
Lightning Surge Protection- SLVU2.8-8 Series  
Thermal Information  
Absolute Maximum Ratings  
Parameter  
Peak Pulse Power ꢀtP=8/23µs)  
Peak Pulse Current ꢀtP=8/23µs)  
OperatingTemperature  
Rating  
753  
Units  
W
Parameter  
StorageTemperature Range  
Maximum JunctionTemperature  
Rating  
-55 to 153  
153  
Units  
°C  
±3  
A
°C  
-43 to 125  
-55 to 153  
ºC  
Maximum LeadTemperature ꢀSoldering  
23-43s)  
263  
°C  
StorageTemperature  
ºC  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause  
permanent damage to the device. This is a stress only rating and operation of the device  
at these or any other conditions above those indicated in the operational sections of this  
specification is not implied.  
Electrical Characteristics (TOP = 25°C)  
Parameter  
Symbol  
VRWM  
VBR  
Test Conditions  
IR≤1μA ꢀEach Line)  
IT=2μA ꢀEach Line)  
ISB=53mA  
Min  
Typ  
Max  
2.8  
Units  
V
Reverse Standoff Voltage  
Reverse Breakdown Voltage  
Snapback Voltage  
±.3  
2.8  
V
VSB  
V
Reverse Leakage Current  
ILEAK  
VR=2.8V ꢀEach Line)  
3.1  
μA  
IPP=5A, tP=8/23μs ꢀEach Line)  
IPP=24A, tP=8/23μs ꢀEach Line)  
8.5  
17  
Clamping Voltage1  
VC  
V
IEC61333-4-2 ꢀContact)  
IEC61333-4-2 ꢀAir)  
±±3  
±±3  
ESD Withstand Voltage1  
VESD  
kV  
Dynamic Resistance2  
Diode Capacitance1  
RDYN  
CD  
TLP tp=133ns, ꢀEach Line)  
VR=3V, f=1MHz ꢀEach Line)  
3.±  
2.6  
Ω
±.3  
pF  
Note: 1 Parameter is guaranteed by design and/or device characterization.  
2Transmission Line Pulse ꢀTLP) test setting : Std.TDRꢀ53Ω),tp=133ns, tr=3.2ns ITLP and VTLP averaging window: star t1=73ns to end t2=83ns  
ClampingVoltage vs. Peak Pulse Currennt (Each line)  
Capacitance vs. Reverse Bias (Each line)  
ꢆꢁꢀ  
ꢅꢁꢂ  
ꢅꢁꢀ  
ꢄꢁꢂ  
ꢄꢁꢀ  
ꢃꢁꢂ  
ꢃꢁꢀ  
ꢀꢁꢂ  
ꢀ
30  
25  
20  
15  
10  
5
0
ꢀ
ꢀꢁꢆ  
ꢀꢁꢇ  
ꢃꢁꢄ  
ꢃꢁꢈ  
ꢄ
ꢄꢁꢆ  
ꢄꢁꢇ  
0
5
10  
15  
20  
25  
30  
Bias Voltage (V)  
Peak Pulse Current-IPP (A)  
© 2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 08/22/19  
TVS Diode Arrays (SPA® Diodes)  
Lightning Surge Protection- SLVU2.8-8 Series  
PositiveTransmission Line Pulsing (TLP) Plot (Each line)  
NegativeTransmission Line Pulsing (TLP) Plot (Each line)  
35  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
0
0
-20  
-15  
-10  
-5  
0
0
5
10  
15  
20  
TLP Volts (V)  
TLP Volts (V)  
8/20 µs PulseWaveform  
Product Characteristics  
Lead Plating  
ꢂꢂꢀꢁ  
ꢂꢀꢀꢁ  
ꢊꢀꢁ  
ꢉꢀꢁ  
ꢈꢀꢁ  
ꢇꢀꢁ  
ꢆꢀꢁ  
ꢅꢀꢁ  
ꢄꢀꢁ  
ꢃꢀꢁ  
ꢂꢀꢁ  
ꢀꢁ  
MatteTin  
Lead Material  
Copper Alloy  
Lead Coplanarity  
Substrate material  
Body Material  
3.3334 inches ꢀ3.132mm)  
Silicon  
V-3 per UL 94 Molded Epoxy  
Notes :  
1. All dimensions are in millimeters  
2. Dimensions include solder plating.  
±. Dimensions are exclusive of mold flash & metal burr.  
4. All specifications comply to JEDEC SPEC MO-23± Issue A  
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.  
6. Package surface matte finish VDI 11-1±.  
ꢀꢋꢀ  
ꢆꢋꢀ  
ꢂꢀꢋꢀ  
ꢂꢆꢋꢀ  
ꢃꢀꢋꢀ  
ꢃꢆꢋꢀ  
ꢄꢀꢋꢀ  
Time (μs)  
Soldering Parameters  
Reflow Condition  
Pb – Free assembly  
153°C  
tP  
-Temperature Min ꢀTsꢀmin)  
)
TP  
Critical Zone  
T
L to TP  
Pre Heat -Temperature Max ꢀTsꢀmax)  
)
233°C  
Ramp-up  
TL  
TS(max)  
-Time ꢀmin to max) ꢀts)  
63 – 183 secs  
tL  
Average ramp up rate ꢀLiquidus) Temp ꢀTL)  
to peak  
5°C/second max  
Ramp-down  
Preheat  
TSꢀmax) toTL - Ramp-up Rate  
5°C/second max  
217°C  
TS(min)  
tS  
-Temperature ꢀTL) ꢀLiquidus)  
Reflow  
-Temperature ꢀtL)  
63 – 153 seconds  
263+3/-5 °C  
25  
time to peak temperature  
PeakTemperature ꢀTP)  
Time  
Time within 5°C of actual peak  
Temperature ꢀtp)  
23 – 43 seconds  
Ramp-down Rate  
5°C/second max  
8 minutes Max.  
263°C  
Ordering Information  
Time 25°C to peakTemperature ꢀTP)  
Do not exceed  
Part Number  
Package  
SOIC-8  
Min. Order Qty.  
2533  
SLVU2.8-8BTG  
© 2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 08/22/19  
TVS Diode Arrays (SPA® Diodes)  
Lightning Surge Protection- SLVU2.8-8 Series  
Part Numbering System  
Part Marking System  
8
7
6
5
SLVU2.8 -8 B T G  
SLVU2.8-8BTG  
xxxxxxxxx  
F
L
G= Green  
T= Tape & Reel  
Package  
B = SOIC-8  
No. of channels  
Series  
1
2
3
4
DATE CODE  
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline  
Package  
Pins  
SOIC-8  
8
JEDEC  
Millimetres  
MS-312  
Inches  
Min  
1.±5  
3.13  
1.25  
3.±1  
3.17  
4.83  
5.83  
±.83  
Max  
Min  
Max  
3.369  
3.313  
3.365  
3.323  
3.313  
3.197  
3.244  
3.157  
ꢀ
ꢁ
A
A1  
A2  
B
1.75  
3.25  
1.65  
3.51  
3.25  
5.33  
6.23  
4.33  
3.35±  
3.334  
3.353  
3.312  
3.337  
3.189  
3.228  
3.153  
o
Recommended  
Soldering Pad Outline  
(Reference Only)  
c
D
E
E1  
e
1.27 BSC  
3.353 BSC  
3.316  
L
3.43  
1.27  
3.353  
Embossed CarrierTape & Reel Specification — SOIC Package  
Millimetres  
Inches  
User Feeding Direction  
Symbol  
Min  
Max  
1.85  
5.6  
Min  
Max  
3.37±  
3.22  
E
F
1.65  
5.4  
1.9  
3.365  
3.21±  
3.375  
3.359  
P2  
D
2.1  
3.38±  
3.36±  
Pin 1 Location  
1.5  
1.6  
D1  
P0  
10P0  
W
P
1.53 Min  
3.359 Min  
3.154 3.161  
1.574 +/- 3.338  
±.9  
4.1  
43.3 +/- 3.23  
11.9  
12.1  
8.1  
6.5  
5.±  
2.2  
3.468  
3.476  
3.±19  
3.256  
3.239  
3.387  
7. 9  
6.±  
5.1  
2
3.±11  
3.248  
3.2  
A0  
B0  
K0  
t
3.379  
3.±3 +/- 3.35  
3.312 +/- 3.332  
© 2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 08/22/19  

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