SODF153TSH [LRC]

Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A;


型号：	SODF153TSH
厂家：	LESHAN RADIO COMPANY
描述：	Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A
文件：	总7页 (文件大小：172K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SODF151T-SH thru SODF157T-SH

Surface Mount Glass Passivated Junction Fast Recovery Rectifiers

Reverse Voltage 50 to 1000V Forward Current 1.5A

FEATURES

* Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

* High temperature metallurgically

bonded construction

* Cavity-free glass passivated junction

* Capable of meeting environmental standards

of MIL-S-19500

* Typical IR less than 1.0µA

* High temperature soldering guaranteed:

260°C/10 seconds

Mechanical Data

We declare that the material of product is

Haloggen free (green epoxy compound)

Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE

Terminals: Tin Plated, solderable per

MIL-STD-750, Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight: 0.0155 g

Handling precautin:None

Electrical Characteristic

1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.

SOD

F151T- F152T- F153T- F154T- F155T- F156T- F157T-

Parameter Symbol

symbol

Unit

G1T

G2T

100

G3T

200

140

200

G4T

400

280

400

G5T

600

420

600

G6T

800

560

800

Device marking code

G7T

1000

700

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

Maximum DC blocking voltage

100

1000

Maximum average forward rectified current

lead length at T_A= 75°C(Note 2)

1.5

IF(AV)

Peak forward surge current 8.3ms single half sine-

wave superimposed on rated load (JEDEC Method)

IFSM

100

160

Typical reverse recovery time (Note 1)

Typical thermal resistance (Note 1)

trr

150

110

RθJA

RθJC

°C/W

–55 to +150

–65 to +175

Operating junction temperature range

storage temperature range

°C

TSTG

Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.

SOD

F151T- F152T- F153T- F154T- F155T- F156T- F157T-

Parameter Symbol

symbol

V_F

Unit

1.3

Maximum instantaneous forward voltage at 1.5A

Maximum DC reverse current at rated DC blocking

5.0

100

voltage TA = 25℃

Tj = 100℃

µA

15.0

Typical junction capacitance at 4.0V, 1MHz (Note 2)

NOTES:

1. IF = 0.5A, IR = 1.0A, IRR = 0.25A

2. 8.0mm²(.013mm thick) land areas

SODF151T-SH thru SODF157T-SH

2. Characteristic Curves ( TA = 25°C unless otherwise noted )

Fig. 2 – Maximum Non-repetitive Peak

Fig. 1 – Forward Current Derating Curve

Forward Surge Current

60 Hz

TJ = TJ max

Resistive or

Inductive Load

8.3ms Single Half Sine-wave

(JEDEC Method)

1.5

0.75

0.375" (9.5mm) Lead Length

100

25 50 75 100 125 150 175

Number of Cycles at 60Hz

Ambient Temperature, °C

Fig 3. – Typical Instantaneous Forward

Fig 4. – Typical Reverse Characteristics

Characteristics

100

1.0

Tj=125℃

Tj=75℃

Tj=25℃

0.1

0.01

1.0

TJ = 25°C

Pulse width = 300µs

1% Duty Cycle

0.1

0.001

0.01

0.6

0.8

1.0

1.2

1.4

1.6

100

Instantaneous Forward Voltage

Percent of Rated Peak Reverse Voltage (%)

Fig 5. –typical transient thermal

Fig 6. – Typical Junction Capacitance

impedance

100

TJ = 25°C

f = 1.0 MHz

Vsig = 50mVp-p

1.0

0.1

1.0

0.1

0.01

0.1

1.0

100

t,Pulse duration,sec

Reverse Voltage (V)

SODF151T-SH thru SODF157T-SH

3. dimension:

SOD123-FL

MILLIMETERS

INCHES

MIN

0.138

0.029

0.103

0.063

DIM

MIN

3.5

MAX

3.9

MAX

0.159

0.037

0.119

0.079

0.75

2.6

0.95

3.0

1.6

2.0

0.45Typ

0.018Typ

0.9

1.2

0.036

0.005

0.047

0.009

0.12

0.22

0.8Typ

0.032Typ

Suggested solder pad layout

Dimensions in inches and (millimeters)

PACKAGE

SOD123-FL

0.044(1.10

0.040(1.00)

0.079(2.00)

SODF151T-SH thru SODF157T-SH

4.Packing information

Unit：mm

Item

Carrier width

Symbol

tolerance

SOD123-FL

0.1

2.0

min

2.0

min

0.5

0.1

0.3

1.0

2.00

3.85

1.10

1.50

Carrier length

Carrier depth

Sprocket hole

13" Reel outside diameter

13" Reel inner diameter

7" Reel outside diameter

7" Reel inner diameter

Feed hole diameter

Sprocket hole position

Punch hole position

Punch hole pitch

D¹

178.00

62.00

13.00

1.75

3.50

4.00

2.00

0.23

8.00

11.40

D¹

Spocket hole pitch

Embossment center

Overall tape thickness

Tape width

P⁰

Reel width

SODF151T-SH thru SODF157T-SH

Reel packing

APPOX.

GROSS

WEIGHT

COMPONENT

SPACING

(mm)

CARTON

SIZE

REEL

(PCS)

BOX

(pcs)

INNER BOX

(mm)

REEL DIA.

(mm)

CARTON

(PCS)

PACKAGE

REEL SIZE

(mm)

(kg)

8.7

SOD123-FL

3,000

4.0

30,000

183*183*123

178

382*262*387

240,000

5.Suggested thermal profile for soldering process

1. Storage environment：Temperature=5~40℃ Humidity=55±25%

2. Reflow soldering of surface-mount device

3. Reflow soldering

Profile Feature

Soldering Condition

Average ramp-up rate(TL to TP)

<3℃/sec

Preheat

- Temperature Min(Tsmin)

- Temperature Max(Tsmax)

- Time(min to max)(ts)

150℃

200℃

60~120sec

Tsmax to T^L

- Ramp-up Rate

<3sec

Time maintained above:

- Temperature (TL)

- Time(t^L)

217℃

60-260sec

Peak Temperature(T^P)

255 -0/+5℃

Time within 5℃ of actual Peak

10~30sec

Temperature(T^P)

Ramp-down Rate

<6℃/sec

Time 25℃ to Peak Temperature

<6minutes

SODF151T-SH thru SODF157T-SH

6.High reliability test capabilities

Item Test

Condition

Reference

at 260±5℃ for 10±2sec immerse

body into solder 1/16" ± 1/32"

MIL-STD-750D METHOD-2031

Solder Resistance

MIL-STD-202F METHOD-208

MIL-STD-750D METHOD-1038

Solderability

at 245±5℃ for 5 sec

High Temperature Reverse Bias

V^R=80% rate at T^j=150℃ for 168hrs

Rated average rectifier current

MIL-STD-750D METHOD-1027

MIL-STD-750D METHOD-1036

Forward Operation Life

T^A=25℃ for 500hrs

T^A=25℃，I^F=I^O

On state:power on for 5 min.

Off state:power off for 5 min.

on and off for 500 cycles

Intermittent Operation Life

JESD22-A102

Pressure Cooker

15P^SIGat T^A=121℃ for 4hrs

-55℃ to +125℃ dwelled for 30 min.

MIL-STD-750D METHOD-1051

Temperature Cycling

and transferred for 5min. Total 10 cycles

0℃ for 5min. Rise to 100℃ for 5min.

MIL-STD-750D METHOD-1056

MIL-STD-750D METHOD-4066-2

Thermal Shock

Forward Surge

Total 10 cycles

8.3ms single half sine-wave

superimposed on rated load,one surge

MIL-STD-750D METHOD-1021

MIL-STD-750D METHOD-1031

Humidity

at T^A=85℃，R^H=85% for 1000hrs

at 175℃ for 1000hrs

High Temperature Storage Life

SODF151T-SH thru SODF157T-SH

7. Update Record

更新记录

第一版

更新作者

周杰

更新日期

版次

2013.03.20

SODF153TSH [LRC]

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