LT1769CGN#TRPBF [Linear]

LT1769 - Constant-Current/Constant-Voltage 2A Battery Charger with Input Current Limiting; Package: SSOP; Pins: 28; Temperature Range: 0°C to 70°C;
LT1769CGN#TRPBF
型号: LT1769CGN#TRPBF
厂家: Linear    Linear
描述:

LT1769 - Constant-Current/Constant-Voltage 2A Battery Charger with Input Current Limiting; Package: SSOP; Pins: 28; Temperature Range: 0°C to 70°C

电池 光电二极管
文件: 总16页 (文件大小:234K)
中文:  中文翻译
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LT1769  
Constant-Current/  
Constant-Voltage 2ABattery  
Charger with Input Current Limiting  
U
FEATURES  
DESCRIPTIO  
The LT®1769 current mode PWM battery charger is a  
Simple Solution to Charge NiCd, NiMH and Lithium  
Rechargeable Batteries—Charging Current  
Programmed by Resistors or DAC  
Adapter Current Limit Allows Maximum Possible  
Charging Current During System Use*  
Precision 0.5% Accuracy for Voltage Mode Charging  
Available in 20-Lead Exposed Pad TSSOP and  
28-Lead Narrow SSOP Packages  
High Efficiency Current Mode PWM with 3A Internal  
Switch  
5% Charge Current Accuracy  
Adjustable Undervoltage Lockout  
simple, efficient solution to fast charge modern recharge-  
able batteries including lithium-ion (Li-Ion), nickel-metal-  
hydride (NiMH) and nickel-cadmium (NiCd) that require  
constant-current and/or constant-voltage charging. The  
internal switch is capable of delivering 2A** DC current  
(3A peak current). Charge current can be programmed by  
resistorsoraDACtowithin5%. With0.5%referencevoltage  
accuracy, the LT1769 meets the critical constant-voltage  
charging requirement for Li-Ion cells.  
A third control loop is provided to regulate the current  
drawn from the input AC adapter. This allows simulta-  
neous operation of the equipment and battery charging  
withoutoverloadingtheadapter.Chargecurrentisreduced  
to keep the adapter current below specified levels.  
Automatic Shutdown When AC Adapter is Removed  
Low Reverse Battery Drain Current: 3µA  
Current Sensing Can Be at Either Terminal of the Battery  
Charging Current Soft Start  
The LT1769 can charge batteries ranging from 1V to 20V.  
Groundsensingofcurrentisnotrequiredandthebattery’s  
negative terminal can be tied directly to ground. A saturat-  
ing switch running at 200kHz gives high charging effi-  
ciency and small inductor size. A blocking diode is not  
required between the chip and the battery because the  
chip goes into sleep mode and drains only 3µA when the  
wall adapter is unplugged.  
Shutdown Control  
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APPLICATIO S  
Chargers for NiCd, NiMH, Lead-Acid, Lithium  
Rechargeable Batteries  
Switching Regulators with Precision Current Limit  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
*US patent number 5,723,970  
**See LT1510 for 1.5A charger; see LT1511 for 3A charger  
D3††  
U
R7†  
SS24  
500  
TYPICAL APPLICATIO  
V
(ADAPTER INPUT)  
IN  
CLP  
CLN  
GND  
11V TO 28V  
R
S4  
C1  
1µF  
ADAPTER  
CURRENT SENSE  
SW  
TO MAIN  
SYSTEM LOAD  
C2  
D1††  
V
CC  
0.47µF  
C
*
IN  
15µF  
R5†  
SS24  
BOOST  
LT1769  
UNDERVOLTAGE  
LOCKOUT  
L1**  
22µH  
UV  
COMP1  
D2  
1N4148  
R6  
5k  
2nF  
10k  
PROG  
V
C
300Ω  
SPIN  
R
PROG  
4.93k  
1%  
C
PROG  
1µF  
0.33µF  
OVP SENSE  
BAT  
R
R
S2  
S3  
NOTE: COMPLETE LITHIUM-ION CHARGER,  
200Ω  
200Ω  
NO TERMINATION REQUIRED. R , R7  
1%  
S4  
1%  
AND C1 ARE OPTIONAL FOR I LIMITING  
IN  
V
BAT  
R3  
*TOKIN OR UNITED CHEMI-CON/MARCON  
R
S1  
+
C
OUT  
8.4V  
Li-Ion  
390k  
CERAMIC SURFACE MOUNT  
0.05Ω  
22µF  
0.25%  
BATTERY  
VOLTAGE SENSE  
**22µH SUMIDA CDRH125  
BATTERY CURRENT  
SENSE  
TANT  
SEE APPLICATIONS INFORMATION FOR  
1511 • F01  
INPUT CURRENT LIMIT AND UNDERVOLTAGE LOCKOUT  
††  
GENERAL SEMICONDUCTOR. FOR T LESS THEN 100°C  
J
R4  
162k  
0.25%  
MBRS130LT3 CAN BE USED  
Figure 1. 2A Lithium-Ion Battery Charger  
1769fa  
1
LT1769  
W W U W  
(Note 1)  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage  
Operating Ambient Temperature  
(VCC, CLP and CLN Pin Voltage)......................... 30V  
BOOST Pin Voltage with Respect to VCC ................. 25V  
IBAT (Average)........................................................... 2A  
Operating Junction Temperature Range  
Commercial ............................................ 0°C to 70°C  
Industrial ........................................... 40°C to 85°C  
Storage Temperature Range ................. 65°C to 150°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
Commercial ........................................... 0°C to 125°C  
Industrial ......................................... 40°C to 125°C  
U
W U  
PACKAGE/ORDER INFORMATION  
ORDER PART  
ORDER PART  
TOP VIEW  
TOP VIEW  
NUMBER  
NUMBER  
1
2
GND**  
GND**  
GND**  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
GND**  
GND**  
GND**  
SW  
SW  
BOOST  
UV  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND  
LT1769CGN  
LT1769IGN  
LT1769CFE  
LT1769IFE  
V
CC1  
3
V
CC2  
4
V
CC1  
V
CC2  
V
CC3  
*
*
*
GND  
V
CC3  
5
BOOST  
UV  
GND  
PROG  
6
OVP  
V
C
7
GND**  
PROG  
GND**  
GND**  
OVP  
*ALL V PINS SHOULD  
CC  
CLN  
GND  
8
BE CONNECTED  
TOGETHER CLOSE TO  
THE PINS  
CLP  
UV  
OUT  
9
V
C
COMP1  
BAT  
** ALL GND PINS ARE  
FUSED TO INTERNAL DIE  
ATTACH PADDLE FOR  
HEAT SINKING. CONNECT  
THESE PINS TO  
EXPANDED PC LANDS  
FOR PROPER HEAT  
SINKING. 35°C/W  
THERMAL RESISTANCE  
ASSUMES AN INTERNAL  
GROUND PLANE  
DOUBLING AS A HEAT  
SPREADER  
10  
11  
12  
13  
14  
UV  
OUT  
CLP  
SENSE 10  
SPIN  
COMP2  
BAT  
CLN  
COMP1  
SENSE  
GND**  
FE PACKAGE  
20-LEAD PLASTIC TSSOP  
TJMAX = 125°C, θJA = 35°C/ W†  
THE BOTTOM METAL  
PLATE OF THIS PACKAGE  
IS FUSED TO INTERNAL  
GROUND AND IS FOR  
HEAT SINKING. SOLDER  
THE BOTTOM METAL  
PLATE ONTO PCB  
SPIN  
GND**  
EXPOSED PAD IS GROUND  
(MUST BE SOLDERED TO PCB)  
GN PACKAGE  
28-LEAD PLASTIC SSOP  
3.0  
4.1  
×
EXPOSED PAD SIZE:  
(.188) (.162)  
GROUND PLANE FOR  
HEAT SINKING.  
TJMAX = 125°C, θJA = 35°C/ W**  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200(see Block Diagram),  
VCLN = VCC. No load on any outputs unless otherwise noted.  
PARAMETER  
Overall  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Supply Current  
V
V
= 2.7V, V 20V  
4.5  
4.6  
6.8  
7.0  
mA  
mA  
PROG  
PROG  
CC  
= 2.7V, 20V < V 25V  
CC  
Sense Amplifier CA1 Gain and Input Offset Voltage  
8V V 25V , 0V V  
20V  
CC  
BAT  
(With R = 200, R = 200)  
R
R
= 4.93k  
= 49.3k  
93  
8
100  
10  
107  
12  
mV  
mV  
mV  
S2  
S3  
PROG  
PROG  
(Measured across R )(Note 2)  
S1  
T < 0°C  
7
13  
A
V
= 28V, V  
= 20V  
CC  
BAT  
R
= 4.93k  
= 49.3k  
90  
7
6
110  
13  
14  
mV  
mV  
mV  
PROG  
PROG  
R
T < 0°C  
A
1769fa  
2
LT1769  
ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200(see Block Diagram),  
CLN = VCC. No load on any outputs unless otherwise noted.  
V
PARAMETER  
Overall  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Undervoltage Lockout (Switch OFF) Threshold  
Measured at UV Pin  
6
7
8
5
V
µA  
V
CC  
UV Pin Input Current  
0.2V V 8V  
0.1  
0.1  
0.1  
3
UV  
UV Output Voltage at UV  
Pin  
In Undervoltage State, I  
= 70µA  
0.5  
3
OUT  
UVOUT  
UV Output Leakage Current at UV  
Pin  
8V V , V  
= 5V  
µA  
µA  
OUT  
UV UVOUT  
Reverse Current from Battery (When V Is  
V
20V, V 0.4V  
15  
CC  
BAT  
UV  
Not Connected, V Is Floating)  
SW  
Boost Pin Current  
V
V
= 20V, V  
= 28V, V  
BOOST  
BOOST  
= 0V  
= 0V  
0.1  
0.25  
6
10  
20  
9
µA  
µA  
mA  
mA  
CC  
CC  
BOOST  
BOOST  
2V V  
8V V  
– V < 8V (Switch ON)  
– V 25V (Switch ON)  
CC  
8
12  
CC  
Switch  
Switch ON Resistance  
8V V V  
, I = 2A,  
CC  
MAX SW  
V
V
V
– V 2V  
0.15  
25  
0.25  
35  
BOOST  
SW  
I /I During Switch ON  
BOOST SW  
= 24V, I 2A  
mA/A  
BOOST  
SW  
Switch OFF Leakage Current  
= 0V, V 20V  
2
4
100  
200  
µA  
µA  
SW  
CC  
20V < V 28V  
CC  
Minimum I  
Minimum I  
for Switch ON  
for Switch OFF  
for Switch ON  
2
1
4
20  
µA  
mA  
V
PROG  
PROG  
2.4  
Maximum V  
V
– 2  
BAT  
CC  
Current Sense Amplifier CA1 Inputs (Sense, BAT)  
Input Bias Current  
50  
125  
µA  
V
Input Common Mode Low  
Input Common Mode High  
SPIN Input Current  
0.25  
V
– 2  
V
CC  
100  
2.465  
200  
µA  
Reference  
Reference Voltage (Note 3)  
R
= 4.93k, Measured at OVP with  
PROG  
VA Supplying I  
and Switch OFF  
2.448  
2.477  
V
PROG  
Reference Voltage  
All Conditions of V , T 0°C  
2.441  
2.43  
2.489  
2.489  
V
V
CC  
A
T < 0°C (Note 4)  
A
Oscillator  
Switching Frequency  
Switching Frequency  
180  
200  
200  
220  
kHz  
All Conditions of V , T 0°C  
170  
160  
230  
230  
kHz  
kHz  
CC  
A
T < 0°C  
A
Maximum Duty Cycle  
90  
85  
93  
%
%
Current Amplifier CA2  
Transconductance  
V = 1V, I = ±1µA  
150  
250  
550  
0.6  
µmho  
C
VC  
Maximum V for Switch OFF  
V
C
I
Current (Out of Pin)  
V 0.6V  
V < 0.45V  
C
100  
3
µA  
mA  
VC  
C
1769fa  
3
LT1769  
ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V. No load on any outputs unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
0.6  
±3  
MAX  
UNITS  
Voltage Amplifier VA  
Transconductance (Note 3)  
Output Source Current  
OVP Input Bias Current  
Output Current from 50µA to 500µA  
0.25  
1.1  
1.3  
mho  
mA  
V
OVP  
= V + 10mV, V  
= V + 10mV  
REF  
PROG REF  
VA Output Current at 0.5mA  
VA Output Current at 0.5mA, T > 90°C  
VA Output Current at 0.5mA, T < 0°C  
±10  
25  
±15  
nA  
nA  
nA  
–15  
A
A
Current Limit Amplifier CL1, 8V  
Turn-On Threshold  
Input Common Mode  
0.5mA Output Current  
93  
100  
1
110  
2
mV  
mho  
µA  
Transconductance  
Output Current from 50µA to 500µA  
0.5  
CLP Input Current  
0.5mA Output Current, V 0.4V  
0.3  
0.8  
1
UV  
CLN Input Current  
0.5mA Output Current V 0.4V  
2
mA  
UV  
Note 3: Tested with Test Circuit 2.  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 2: Tested with Test Circuit 1.  
Note 4: A linear interpolation can be used for reference voltage  
specification between 0°C and 40°C.  
W
U
TYPICAL PERFORMANCE CHARACTERISTICS  
ICC vs Duty Cycle  
ICC vs VCC  
Efficiency of Figure 1 Circuit  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
100  
98  
96  
94  
92  
90  
88  
86  
84  
82  
80  
8
7
6
5
4
3
2
1
0
MAXIMUM DUTY CYCLE  
V
= 16V  
V
V
= 16.5  
= 8.4V  
CC  
IN  
BAT  
T
= 0°C  
J
T
= 25°C  
J
T
= 0°C  
J
CHARGER EFFICIENCY  
T
= 125°C  
J
T
= 125°C  
J
T
= 25°C  
J
INCLUDES LOSS  
IN DIODE D3  
0
10  
15  
(V)  
20  
25  
30  
40  
5
0
10 20 30  
50 60 70 80  
0.2  
0.6  
1.0  
I
1.4  
(A)  
1.8  
2.2  
V
DUTY CYCLE (%)  
CC  
BAT  
1769 G03  
1769 G02  
1769 G01  
1769fa  
4
LT1769  
W
U
TYPICAL PERFORMANCE CHARACTERISTICS  
VREF Line Regulation  
IVA vs VOVP (Voltage Amplifier)  
0.003  
0.002  
0.001  
0
4
3
2
1
0
ALL TEMPERATURES  
T
= 125°C  
J
–0.001  
–0.002  
–0.003  
T
= 25°C  
J
0
10  
15  
(V)  
20  
25  
30  
5
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
(mA)  
V
CC  
I
VA  
1769 G04  
1769 G05  
Maximum Duty Cycle  
VC Pin Characteristics  
98  
97  
96  
95  
94  
93  
92  
91  
90  
–1.20  
–1.08  
–0.96  
–0.84  
–0.72  
–0.60  
–0.48  
–0.36  
–0.24  
–0.12  
0
0.12  
20  
40  
60  
80 100  
140  
0
120  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
(V)  
JUNCTION TEMPERATURE (°C)  
V
C
1769 G06  
1769 G07  
Reference Voltage  
vs Temperature  
PROG Pin Characteristics  
2.470  
2.468  
2.466  
2.464  
2.462  
2.460  
2.458  
6
T
= 125°C  
J
T
= 25°C  
J
0
–6  
0
50  
75  
100  
125  
150  
25  
0
1
2
3
4
5
JUNCTION TEMPERATURE  
V
(V)  
PROG  
1769 G09  
1769 G08  
1769fa  
5
LT1769  
U
U
U
(GN/FE Pin Numbers)  
PIN FUNCTIONS  
GND (Pins 1 to 3, 7, 8, 14, 15, 22, 26 to 28/Pins 4, 5, 14,  
20): Ground Pins. Must be connected to expanded PC  
lands for proper heat sinking. See Applications Informa-  
tion section for details.  
this function is not used, the resistor and capacitor on  
COMP1 pin, shown on the Figure 1 circuit, are not needed.  
SENSE (Pin 13/Pin 10): Current Amplifier CA1 Input.  
Sensing can be at either terminal of the battery.  
SW (Pin 4/Pin 1): Switch Output. The Schottky catch  
diode must be placed with very short lead length in close  
proximity to SW pin and GND.  
SPIN (Pin 16/Pin 11): This pin is for the current amplifier  
CA1 bias. It must be connected to RS1 as shown in the 2A  
Lithium Battery Charger (Figure 1).  
BOOST (Pin 5/Pin 2): This pin is used to bootstrap and  
drive the switch power NPN transistor to a low on-voltage  
forlowpowerdissipation. InFigure1, VBOOST =VCC +VBAT  
when switch is on. For lowest IC power dissipation,  
connect boost diode D1 to a 3V to 6V at 30mA voltage  
source (see Figure 10).  
BAT (Pin 17/Pin 12): Current Amplifier CA1 Input.  
COMP2 (Pin 18): This is also a compensation node for  
amplifier CL1. Voltage on this pin rises to 2.8V at input  
adapter current limit and/or at constant-voltage charging.  
UVOUT(Pin19/Pin13):Thisisanopen-collectoroutputfor  
undervoltage lockout status. It stays low in undervoltage  
state. Withanexternalpull-upresistor, itgoeshighatvalid  
VCC. Note that the base drive of the open-collector NPN  
comes from CLN pin. UVOUT stays low only when CLN is  
higherthan2V.Pull-upcurrentshouldbekeptunder100µA.  
UV (Pin 6/Pin 3): Undervoltage Lockout Input. The rising  
threshold is at 6.7V with a hysteresis of 0.5V. Switching  
stops in undervoltage lockout. When the input supply  
(normallythewalladapteroutput)totheICisremoved,the  
UV pin must be pulled down to below 0.7V (a 5k resistor  
from adapter output to GND is required) otherwise the  
reverse battery current drained by the IC will be approxi-  
mately 200µA instead of 3µA. Do not leave the UV pin  
floating. When connected to VIN with no resistor divider,  
the built-in 6.7V undervoltage lockout will be effective.  
VC (Pin 20/Pin 15): This is the inner loop control signal for  
the current mode PWM. Switching starts at 0.7V. In  
normal operation, a higher VC corresponds to higher  
charge current. A capacitor of at least 0.33µF to GND  
filters out noise and controls the rate of soft start. To stop  
switching, pull this pin low. Typical output current is 30µA.  
OVP (Pin 9/Pin 6): This is the input to amplifier VA with a  
threshold of 2.465V. Typical bias current is about 3nA out  
ofthispin. Forcharginglithium-ionbatteries, VAmonitors  
the battery voltage and reduces charging when battery  
voltage reaches the preset value. If it is not used, the OVP  
pin should be grounded.  
PROG (Pin 21/Pin 16): This pin is for programming the  
chargecurrentandforsystemloopcompensation. During  
normal operation, VPROG stays close to 2.465V. If it is  
shorted to GND switching will stop. When a microproces-  
sor controlled DAC is used to program charge current, it  
must be capable of sinking current at a compliance up to  
2.465V.  
CLP (Pin 10/Pin 8): This is the positive input to the input  
current limit amplifier CL1. The threshold is set at 100mV.  
Whenusedtolimitsupplycurrent,afilterisneededtofilter  
out the 200kHz switching noise.  
VCC1, VCC2, VCC3 (Pins 23 to 25/Pins 17 to 19): Input  
Supply. For good bypass, a low ESR capacitor of 15µF or  
higher is required, with the lead length kept to a minimum.  
VCC should be between 8V and 28V and at least 3V higher  
than VBAT. Undervoltage lockout starts and switching  
stops when VCC goes below 7V typical. Note that there is  
an internal parasitic diode from SW pin to VCC pin. Do not  
force VCC below SW by more than 0.7V with battery  
present. All three VCC pins should be shorted together  
close to the pins.  
CLN (Pin 11/Pin 7): This is the negative input to the input  
current limit amplifier CL1.  
COMP1 (Pin 12/Pin 9): This is the compensation node for  
the input current limit amplifier CL1. At input adapter  
current limit, this node rises to 1V. By forcing COMP1 low  
with an external transistor, amplifier CL1 will be defeated  
(no adapter current limit). COMP1 can source 200µA. If  
1769fa  
6
LT1769  
W
BLOCK DIAGRAM  
UV  
UV  
OUT  
+
+
7V  
200kHz  
OSCILLATOR  
+
SHUTDOWN  
0.7V  
V
CC  
+
+
S
V
SW  
BOOST  
V
CC  
R
R
R
Q
SW  
SLOPE COMPENSATION  
+
SW  
1.5V  
V
CC  
SPIN  
V
BAT  
+
PWM  
R
R
S3  
SENSE  
BAT  
I
BAT  
B1  
+
C1  
GND  
+
CA1  
R2  
R3  
R
S1  
S2  
I
R1  
1k  
PROG  
BAT  
0VP  
+
+
VA  
V
REF  
V
C
CA2  
2.465V  
g
= 0.64  
V
m
REF  
75k  
100mV  
CLP  
CLN  
+
+
CL1  
COMP1  
COMP2  
1769 BD  
PROG  
(I  
)(R )  
PROG S2  
I
=
=
BAT  
R
S1  
R
R
2.465V  
I
S2  
S1  
PROG  
C
PROG  
(
) (  
)
R
PROG  
(R = R  
)
S3  
S2  
R
PROG  
1769fa  
7
LT1769  
TEST CIRCUITS  
Test Circuit 1  
SPIN  
LT1769  
R
S3  
200  
SENSE  
+
+
V
C
R
S1  
100Ω  
R
S2  
200Ω  
CA1  
CA2  
BAT  
1k  
60k  
0.047µF  
+
V
BAT  
V
REF  
PROG  
1µF  
300Ω  
R
PROG  
+
LT1006  
1k  
1769 TC01  
+
0.65V  
20k  
Test Circuit 2  
LT1769  
OVP  
+
VA  
V
REF  
10k  
PROG  
I
PROG  
10k  
LT1013  
+
+
0.47µF  
R
PROG  
2.465V  
1769 TC02  
U
OPERATION  
The LT1769 is a current mode PWM step-down (buck)  
switcher. The battery DC charge current is programmed  
by a resistor RPROG (or a DAC output current) at the PROG  
pin (see Block Diagram). Amplifier CA1 converts the  
charge current through RS1 to a much lower current IPROG  
fed into the PROG pin. Amplifier CA2 compares the output  
of CA1 with the programmed current and drives the PWM  
control loop to force them to be equal. High DC accuracy  
is achieved with averaging capacitor CPROG. Note that  
IPROG has both AC and DC components. IPROG goes  
through R1 and generates a ramp signal that is fed to the  
PWM control comparator C1 through buffer B1 and level  
shift resistors R2 and R3, forming the current mode inner  
loop. The BOOST pin drives the switch NPN QSW into  
saturation and reduces power loss. For batteries like  
lithium-ion that require both constant-current and con-  
stant-voltage charging, the 0.5%, 2.465V reference and  
the amplifier VA reduce the charge current when battery  
voltage reaches the preset level. For NiMH and NiCd, VA  
can be used for overvoltage protection. When the input  
voltage is removed, the VCC pin drops to 0.7V below the  
batteryvoltage, forcingthechargerintoalowbatterydrain  
(3µA typical) sleep mode. To shut down the charger,  
simply pull the VC pin low with a transistor.  
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Input and Output Capacitors  
ramping up when VC pin voltage reaches 0.7V and full  
current is achieved with VC at 1.1V. With a 0.33µF capaci-  
tor, thetimetoreachfullchargecurrentisabout10msand  
itisassumedthatinputvoltagetothechargerwillreachfull  
value in less than 10ms. The capacitor can be  
increasedupto1µFiflongerinputstart-uptimesareneeded.  
In the 2A Lithium-Ion Battery Charger (Figure 1), the input  
capacitor (CIN) is assumed to absorb all input switching  
ripple current in the converter, so it must have adequate  
ripple current rating. Worst-case RMS ripple current will  
be equal to one half of the output charge current. Actual  
capacitance value is not critical. Solid tantalum capacitors  
such as the AVX TPS and Sprague 593D series have high  
ripple current rating in a relatively small surface mount  
package, but caution must be used when tantalum capaci-  
tors are used for input bypass. High input surge currents  
are possible when the adapter is hot-plugged to the  
charger and solid tantalum capacitors have a known  
failure mechanism when subjected to very high turn-on  
surge currents. Selecting a high voltage rating on the  
capacitor will minimize problems. Consult with the manu-  
facturerbeforeuse.Alternativesincludenewhighcapacity  
ceramic (5µF to 20µF) from Tokin or United Chemi-Con/  
Marcon, et al. Sanyo OS-CON can also be used.  
In any switching regulator, conventional time-based soft-  
starting can be defeated if the input voltage rises much  
slower than the time out period. This happens because the  
switching regulators in the battery charger and the com-  
puter power supply are typically supplying a fixed amount  
of power to the load. If the input voltage comes up slowly  
compared to the soft-start time, the regulators will try to  
deliver full power to the load when the input voltage is still  
well below its final value. If the adapter is current limited,  
it cannot deliver full power at reduced output voltages and  
the possibility exists for a quasi “latch” state where the  
adapter output stays in a current limited state at reduced  
output voltage. For instance, if maximum charger plus  
computer load power is 25W, a 15V adapter might be  
current limited at 2A. If adapter voltage is less than  
(25W/2A = 12.5V) when full power is drawn, the adapter  
voltage will be pulled down by the constant 25W load until  
it reaches a lower stable state where the switching regu-  
lators can no longer supply full load. This situation can be  
preventedbyutilizingundervoltagelockout,sethigherthan  
the minimum adapter voltage where full power can be  
achieved.  
The output capacitor (COUT) is also assumed to absorb  
output switching ripple current. The general formula for  
capacitor ripple current is:  
V
BAT  
0.29 (V ) 1 –  
BAT  
(
)
V
CC  
I
=
RMS  
(L1)(f)  
For example, VCC = 16V, VBAT = 8.4V, L1 = 20µH,  
and f = 200kHz, IRMS = 0.3A.  
Afixedundervoltagelockoutof7VisbuiltintotheLT1769.  
This 7V threshold can be increased by adding a resistive  
divider to the UV pin as shown in Figure 2. Internal lockout  
is performed by clamping the VC pin low. The VC pin is  
released from its clamped state when the UV pin rises  
above 7V and is pulled low when the UV pin drops below  
6.5V (0.5V hysteresis). At the same time UVOUT goes high  
with an external pull-up resistor. This signal can be used  
to alert the system that charging is about to start. The  
charger will start delivering current about 4ms after VC is  
released, as set by the 0.33µF capacitor. A resistor divider  
is used to set the desired VCC lockout voltage as shown in  
Figure 2. A typical value for R6 is 5k and R5 is found from:  
EMI considerations usually make it desirable to minimize  
ripple current in the battery leads. Beads or inductors can  
be added to increase battery impedance at the 200kHz  
switching frequency. Switching ripple current splits be-  
tween the battery and the output capacitor depending on  
the ESR of the output capacitor and the battery imped-  
ance. IftheESRofCOUT is0.2andthebatteryimpedance  
is raised to 4with a bead or inductor, only 5% of the  
ripple current will flow into the battery.  
Soft-Start and Undervoltage Lockout  
The LT1769 is soft-started by the 0.33µF capacitor on the  
VC pin. On start-up, the VC pin voltage will quickly rise to  
0.5V, then ramp at a rate set by the internal 45µA pull-up  
current and the external capacitor. Charge current starts  
R6(V – V )  
IN  
UV  
R5 =  
V
UV  
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APPLICATIONS INFORMATION  
VUV = Rising lockout threshold on the UV pin  
adapter load current remains below the limit. Amplifier  
CL1 in Figure 2 senses the voltage across RS4, connected  
betweentheCLPandCLNpins. Whenthisvoltageexceeds  
100mV,theamplifierwilloverridetheprogrammedcharge  
current to limit adapter current to 100mV/RS4. A lowpass  
filter formed by 500and 1µF is required to eliminate  
switching noise. If the input current limit is not used, both  
CLP and CLN pins should be connected to VCC.  
VIN =Chargerinputvoltagethatwillsustainfullloadpower  
Example: With R6 = 5k, VUV = 6.7V and setting VIN at 12V;  
R5 = 5k (12V – 6.7V)/6.7V = 4k  
The resistor divider should be connected directly to the  
adapter output as shown, not to the VCC pin, to prevent  
battery drain with no adapter voltage. If the UV pin is not  
used, connect it to the adapter output (not VCC) and  
connect a resistor no greater than 5k to ground. Floating  
this pin will cause reverse battery current to increase from  
3µA to 200µA.  
Charge Current Programming  
The basic formula for charge current is (see Block  
Diagram):  
IfconnectingtheunusedUVpintotheadapteroutputisnot  
possible, it can be grounded. Although it would seem that  
grounding the pin creates a permanent lockout state, the  
UV circuitry is arranged for phase reversal with low volt-  
agesontheUVpintoallowthegroundingtechniquetowork.  
R
R
2.465V R  
S2  
S1  
S2  
S1  
I
= I  
=
BAT  
PROG  
(
) (  
) (  
)
R
R
PROG  
whereRPROG isthetotalresistancefromPROGpintoground.  
For the sense amplifier CA1 biasing purpose, RS3 should  
have the same value as RS2 and SPIN should be connected  
directly to the sense resistor (RS1) as shown in the Block  
Diagram.  
100mV  
CLP  
+
+
1µF  
CL1  
500  
CLN  
For example, 2A charge current is needed. For low power  
dissipation on RS1 and enough signal to drive the amplifier  
CA1, let RS1 = 100mV/2A = 0.05. This limits RS1 power  
to 0.2W. Let RPROG = 5k, then:  
AC ADAPTER  
OUTPUT  
R
*
V
S4  
CC  
V
IN  
+
R5  
LT1769  
UV  
*R  
(I )(R  
)(R )  
S1  
BAT  
PROG  
R
S2  
= R  
=
S3  
R6  
100mV  
ADAPTER CURRENT LIMIT  
=
2.465V  
S4  
1769 F02  
(2A)(5k)(0.05)  
2.465V  
=
= 200  
Figure 2. Adapter Input Current Limiting  
Charge current can also be programmed by pulse width  
modulatingIPROG withaswitchQ1toRPROG atafrequency  
higher than a few kHz (Figure 3). Charge current will be  
proportionaltothedutycycleoftheswitchwithfullcurrent  
at 100% duty cycle.  
Adapter Current Limiting  
An important feature of the LT1769 is the ability to  
automaticallyadjustchargecurrenttoalevelwhichavoids  
overloading the wall adapter. This allows the product to  
operate at the same time the batteries are being charged  
without complex load management algorithms. Addition-  
ally, batteries will automatically be charged at the maximum  
possible rate of which the adapter is capable.  
Lithium-Ion Charging  
The 2A Lithium-Ion Battery Charger (Figure 1) charges at  
aconstant2AuntilbatteryvoltagereachesalimitsetbyR3  
and R4. The charger will then automatically go into a  
constant-voltage mode with current decreasing to near  
zeroovertimeasthebatteryreachesfullcharge. Thisisthe  
This is accomplished by sensing total adapter output  
current and adjusting the charge current downward if a  
preset adapter current limit is exceeded. True analog  
control is used, with closed-loop feedback ensuring that  
normal regimen for lithium-ion charging, with the charger  
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APPLICATIONS INFORMATION  
V
BAT  
LT1769  
+
R3  
8.4V  
12k  
PROG  
0.25%  
300Ω  
Q3  
VN2222  
V
IN  
LT1769  
OVP  
R5  
220k  
R
C
PROG  
PROG  
4.7k  
1µF  
R4  
Q1  
VN2222  
5V  
0V  
4.99k  
0.25%  
PWM  
= (DC)(2A)  
1769 F04  
1769 F03  
I
BAT  
Figure 4. Disconnecting Voltage Divider  
Figure 3. PWM Current Programming  
holding the battery at “float” voltage indefinitely. In this  
case no external sensing of full charge is needed.  
is to use a Zener diode with a breakdown voltage two or three  
volts higher than battery voltage to clamp the VBAT voltage.  
Battery manufacturers recommend terminating the con-  
stant-voltage float mode after charge current has dropped  
below a specified level (typically around 10% of the full  
current) and a further time out period of 30 to 90 minutes  
haselapsed.Thismayextendbatterylife,socheckwiththe  
manufacturer for details. The circuit in Figure 5 will detect  
when charge current has dropped below 270mA. This  
logic signal is used to initiate a timeout period, after which  
theLT1769canbeshutdownbypullingtheVC pinlowwith  
an open collector or drain. Some external means must be  
used to detect the need for additional charging or the  
Battery Voltage Sense Resistors Selection  
To minimize battery drain when the charger is off, current  
throughtheR3/R4dividerissetat15µA. Theinputcurrent  
to the OVP pin is 3nA and the error can be neglected.  
With divider current set at 15µA, VBAT = 8.4V, R4 =  
2.465/15µA = 162k and,  
R4 V  
)(  
2.465 162k 8.4 2.465  
(
)
(
)
BAT  
R3 =  
= 390k  
=
2.465  
2.465  
I
BAT  
Li-Ion batteries typically require float voltage accuracy of  
1%. Accuracy of the LT1769 OVP voltage is ±0.5% at  
25°C and ±1% over full temperature. This leads to the  
possibility that very accurate (0.1%) resistors might be  
needed for R3 and R4. Actually, the temperature of the  
LT1769 will rarely exceed 50°C in float mode because  
charging currents have tapered off to a low level, so  
0.25%resistorswillnormallyprovidetherequiredlevelof  
overall accuracy.  
R
S3  
200Ω  
SENSE  
R
S1  
LT1769  
R
200Ω  
0.05Ω  
S2  
BAT  
V
BAT  
ADAPTER  
OUTPUT  
3.3V OR 5V  
D1  
C1  
0.1µF  
R1*  
1.6k  
BAT  
1N4148  
R4  
3
2
8
470k  
7
NEGATIVE EDGE  
TO TIMER  
Whenpowerison, thereisabout200µAofcurrentflowing  
out of the BAT and SENSE pins. If the battery is removed  
during charging, and total load including R3 and R4 is less  
than 200µA, VBAT could float up to VCC even though the  
loop has turned switching off. To keep VBAT regulated to  
the battery voltage in this condition, R3 and R4 can be  
chosen to draw 0.5mA and Q3 can be added to disconnect  
them when power is off (Figure 4). R5 isolates the OVP pin  
from any high frequency noise on VIN. An alternative method  
LT1011  
+
4
1
R2  
560k  
D2  
1N4148  
R1(V  
)
R3  
430k  
BAT  
* TRIP CURRENT =  
(R2 + R3)(R  
)
S1  
(1.6k)(8.4V)  
=
270mA  
(560k + 430k)(0.05)  
1769 F04  
Figure 5. Current Comparator for Initiating Float Time Out  
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charger may be turned on periodically to complete a short  
float-voltage cycle.  
is not nearly as pronounced. This makes it more difficult  
to use dV/dt as an indicator of full charge, and an  
increase in battery temperature is more often used with a  
temperature sensor in the battery pack. Secondly, con-  
stant trickle charge may not be recommended. Instead, a  
moderate level of current is used on a pulse basis (1%  
to 5% duty cycle) with the time-averaged value substitut-  
ing for a constant low trickle. Please contact the Linear  
Technology Applications department about charge termi-  
nation circuits.  
Current trip level is determined by the battery voltage, R1  
through R3 and the sense resistor (RS1). D2 generates  
hysteresis in the trip level to avoid multiple comparator  
transitions.  
Nickel-Cadmium and Nickel-Metal-Hydride Charging  
The 2A Lithium-Ion Battery Charger shown in Figure 1 can  
be modified to charge NiCd or NiMH batteries. For ex-  
ample, if a 2-level charge is needed; 1A when Q1 is on and  
100mA when Q1 is off.  
If overvoltage protection is needed, R3 and R4 can be cal-  
culated according to the procedure described in Lithium-  
Ion Charging section. The OVP pin should be grounded if  
not used.  
LT1769  
PROG  
When a microprocessor DAC output is used to control  
charge current, it must be capable of sinking current at a  
complianceupto2.5VifconnecteddirectlytothePROGpin.  
R1  
49.3k  
R2  
5.49k  
300Ω  
1µF  
Q1  
Thermal Calculations  
1769 F05  
If the LT1769 is used for charging currents above 1A, a  
thermal calculation should be done to ensure that junction  
temperature will not exceed 125°C. Power dissipation in  
the IC is caused by bias and driver current, switch resis-  
tance and switch transition losses. The GN package, with  
a thermal resistance of 35°C/W, can provide a full 2A  
charging current in many situations. A graph is shown in  
the Typical Performance Characteristics section.  
Figure 6. 2-Level Charging  
For 1A full current, the current sense resistor (RS1) should  
be increased to 0.1so that enough signal (10mV) will be  
across RS1 at 0.1A trickle charge to keep charging current  
accurate.  
For a 2-level charger, R1 and R2 are found from:  
2.465 2000  
2.465 2000  
(
)(  
)
(
)(  
)
P
= 3.5mA V + 1.5mA V  
R1=  
R2 =  
(
)(  
)
(
)
BIAS  
IN  
BAT  
ILOW  
IHI ILOW  
2
V
(
)
BAT  
All battery chargers with fast charge rates require some  
meanstodetectfullcharge inthebatteryandterminatethe  
highchargecurrent.NiCdbatteriesaretypicallychargedat  
high current until a temperature rise or battery voltage  
decrease is detected as an indication of near full charge.  
The charging current is then reduced to a much lower  
value and maintained as a constant trickle charge. An  
intermediate “top off” current may also be used for a fixed  
time period to reduce total charge time.  
+
7.5mA + 0.012 I  
)(  
(
)
[
]
BAT  
V
IN  
V
30  
2
BAT  
I
(
V
1+  
)(  
)
BAT BAT  
P
P
=
DRIVER  
55 V  
(
)
)
IN  
2
I
(
R
V
V
SW BAT  
) (  
)(  
BAT  
=
+ t  
(
V
I
f
)( )(  
)( )  
SW  
OL IN BAT  
IN  
RSW = Switch ON resistance 0.16Ω  
tOL = Effective switch overlap time 10ns  
f = 200kHz  
NiMH batteries are similar in chemistry to NiCd but have  
two differences related to charging. First, the inflection  
characteristicinbatteryvoltageasfullchargeisapproached  
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Example: VIN = 19V, VBAT = 12.6V, IBAT = 2A:  
PBIAS = 3.5mA 19 + 1.5mA 12.6  
SW  
LT1769  
C2  
(
)( )  
(
)
L1  
BOOST  
2
12.6  
19  
(
)
D2  
+
7.5mA + 0.012 2000mA = 0.35W  
(
)(  
)
]
[
SPIN  
12.6  
30  
2
V
X
1769 F07  
2 12.6 1+  
( )(  
)
+
I
VX  
10µF  
PDRIVER  
=
= 0.43W  
55 19  
( )  
2
Figure 7. Lower VBOOST  
2
0.16 12.6  
( ) (  
)(  
)
PSW  
=
+ 109 19 2 200kHz  
( )( )(  
)
19  
= 0.42 + 0.08 = 0.5W  
thermal resistance of the package-board combination is  
dominated by the characteristics of the board in the  
immediate area of the package. This means both lateral  
thermal resistance across the board and vertical thermal  
resistance through the board to other copper layers. Each  
layer acts as a thermal heat spreader that increases the  
heat sinking effectiveness of extended areas of the board.  
Total Power in the IC is: 0.35 + 0.43 + 0.5 = 1.3W  
Temperature rise will be (1.3W)(35°C/W) = 46°C. This  
assumes that the LT1769 is properly heat sunk by con-  
necting the eleven fused ground pins to expanded traces  
and that the PC board has a backside or internal plane for  
heat spreading.  
Total board area becomes an important factor when the  
areaoftheboarddropsbelowabout20squareinches. The  
graph in Figure 8 shows thermal resistance vs board area  
for 2-layer and 4-layer boards with continuous copper  
planes. Note that 4-layer boards have significantly lower  
thermal resistance, but both types show a rapid increase  
for reduced board areas. Figure 9 shows actual measured  
lead temperatures for chargers operating at full current.  
Battery voltage and input voltage will affect device power  
dissipation, so the data sheet power calculations must be  
used to extrapolate these readings to other situations.  
The PDRIVER term can be reduced by connecting the boost  
diode D2 (see Figure 7) to a lower system voltage (lower  
than VBAT) instead of VBAT  
.
V
30  
X
I
(
V
V
)( )  
1+  
)(  
BAT BAT  
X
Then P  
=
DRIVER  
55 V  
(
)
IN  
For example, VX = 3.3V then:  
3.3V  
30  
2A 12.6V 3.3V 1+  
(
)(  
)(  
)
P
=
= 0.09W  
Vias should be used to connect board layers together.  
Planes under the charger area can be cut away from the  
rest of the board and connected with vias to form both a  
lowthermalresistancesystemandtoactasagroundplane  
for reduced EMI.  
DRIVER  
55 19V  
(
)
The average IVX required is:  
P
0.09W  
3.3V  
DRIVER  
=
= 28mA  
VX  
Glue-on, chip-mounted heat sinks are effective only in  
moderate power applications where the PC board copper  
cannotbeused,orwheretheboardsizeissmall.Theyoffer  
very little improvement in a properly laid out multilayer  
board of reasonable size.  
The previous example shows the dramatic drop in driver  
power dissipation when the boost diode (D2) is connected  
to an external 3.3V source instead of the 12.6V battery.  
PDRIVER drops from 0.43W to 0.09W resulting in an  
approximately 12°C drop in junction temperature.  
Higher Duty Cycle for the LT1769 Battery Charger  
Fused-lead packages conduct most of their heat out the  
leads. ThismakesitveryimportanttoprovideasmuchPC  
board copper around the leads as is practical. Total  
Maximum duty cycle for the LT1769 is typically 90%, but  
this may be too low for some applications. For example, if  
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45  
40  
35  
30  
STANDARD CONNECTION  
HIGH DUTY CYCLE CONNECTION  
SW  
C3  
0.47µF  
SW  
C3  
0.47µF  
BOOST  
LT1769  
BOOST  
LT1769  
SPIN  
SENSE  
D2  
D2  
SPIN  
2-LAYER BOARD  
25  
4-LAYER BOARD  
20  
V
X
3V TO 6V  
SENSE  
BAT  
BAT  
C
X
10µF  
V
BAT  
V
MEASURED FROM AIR AMBIENT  
BAT  
15  
TO DIE USING COPPER LANDS  
+
+
AS SHOWN ON DATA SHEET  
10  
20  
BOARD AREA (IN2)  
30  
35  
1769 F08  
0
5
10  
15  
25  
1769 F10  
Figure 10. High Duty Cycle  
Figure 8. LT1769 Thermal Resistance  
HIGH DUTY CYCLE CONNECTION  
V
IN  
70  
+
Q1  
NOTE: PEAK DIE TEMPERATURE  
WILL BE ABOUT 15°C HIGHER AT  
2A CHARGE CURRENT  
60  
Q2  
D1  
V
CC  
SW  
V
V
V
= 19V  
IN  
C2  
2
5 IN BOARD  
= 12.3V  
BAT  
0.47µF  
R
50  
40  
30  
20  
X
50k  
= 5V  
BOOST  
LT1769  
SPIN  
BOOST  
2-LAYER BOARD  
D2  
ROOM TEMP = 24°C  
V
X
2
SENSE  
BAT  
Q1 = Si4435DY  
Q2 = TP0610L  
3V TO 6V  
25 IN BOARD  
C
X
10µF  
V
BAT  
+
1
1.5  
0
0.5  
2
CHARGE CURRENT (A)  
1769 F09  
1769 F11  
Figure 11. Replacing the Input Diode  
Figure 9. LT1769 Lead Temperature  
with its gate connected to the battery causing the FET to  
turn off when the input voltage goes low. The problem is  
that the gate must be pumped low so that the FET is fully  
turned on even when the input is only a volt or two above  
the battery voltage. Also there is a turn-off speed issue.  
The FET should turn off instantly when the input is dead  
shorted to avoid large current surges from the battery  
back through the charger into the FET. Gate capacitance  
slows turn-off, so a small P-channel (Q2) is added to  
discharge the gate capacitance quickly in the event of an  
input short. The Q2 body diode creates the necessary  
pumping action to keep the gate of Q1 low during normal  
operation. Note that Q1 and Q2 have a VGS spec limit of  
20V. This restricts VIN to a maximum of 20V. For low  
dropout operation with VIN > 20V consult factory.  
1769fa  
an 18V ±3% adapter is used to charge ten NiMH cells, the  
charger must put out approximaly 15V. A total of 1.6V is  
lost in the input diode, switch resistance, inductor resis-  
tance and parasitics, so the required duty cycle is  
15/16.4 = 91.4%. The duty cycle can be extended to 93%  
by restricting boost voltage to 5V instead of using VBAT as  
is normally done. This lower boost voltage also reduces  
power dissipation in the LT1769, so it is a win-win  
decision. Connect an external source of 3V to 6V at VX  
node in Figure 10 with a 10µF CX bypass capacitor.  
Lower Dropout Voltage  
Forevenlowerdropoutand/orreducingheatontheboard,  
the input diode D3 can be replaced with a FET (see Figure  
11). Connect a P-channel FET in place of the input diode  
14  
LT1769  
U
W U U  
APPLICATIONS INFORMATION  
Optional Diode Connections  
Layout Considerations  
The typical application in Figure 1 shows a single diode  
(D3) to isolate the VCC pin from the adaptor input and to  
block reverse input voltage (both steady state and tran-  
sient). This simple connection may be unacceptable in  
situations where the system load must be powered from  
the battery when the adapter input power is removed. As  
shown in Figure 12, a parasitic diode exists from the SW  
pin to the VCC pin in the LT1769. When the input power is  
removed, this diode will become forward biased and will  
provide a current path from the battery to the system load.  
Becauseofdiodepowerlimitations,itisnotrecommended  
to power the system load through the internal parasitic  
diode. To safely power the system load from the battery,  
anadditionalSchottkydiode(D4)isneeded. Forminimum  
losses, D4 could be replaced by a low RDS(ON) MOSFET  
which is turned on when the adapter power is removed.  
Switch rise and fall times are under 10ns for maximum  
efficiency. To minimize radiation, the catch diode, SW pin  
and input bypass capacitor leads should be kept as short  
as possible. A ground plane should be used under the  
switching circuitry to prevent interplane coupling and to  
act as a thermal spreading path. All ground pins should be  
connected to expanded traces for low thermal resistance.  
Thefast-switchinghighcurrentgroundpath,includingthe  
switch, catch diode and input capacitor, should be kept  
very short. Catch diode and input capacitor should be  
close to the chip and terminated to the same point. This  
path contains nanosecond rise and fall times with several  
amps of current. The other paths contain only DC and/or  
200kHz tri-wave and are less critical. Figure 13 indicates  
the high speed, high current switching path. Figure 14  
shows critical path layout. Contact Linear Technology for  
the LT1769 circuit PCB layout or Gerber file.  
R7  
D3  
500Ω  
ADAPTER  
IN  
CLP  
SWITCH NODE  
L1  
LT1769  
+
+
C1  
V
BAT  
CLN  
R
1µF  
S4  
TO  
SYSTEM  
LOAD  
V
SW  
CC  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
INTERNAL  
PARASITIC  
DIODE  
C
IN  
C
D1  
C
OUT  
V
IN  
BAT  
D4  
IN  
L1  
R
S1  
+
1769 F12a  
1769 F13  
Figure 12. Modified Diode Connection  
Figure 13. High Speed Switching Path  
GND  
D1  
C
IN  
GND  
GND  
GND  
SW  
BOOST  
UV  
GND  
GND  
OVP  
CLP  
CLN  
COMP1  
SENSE  
GND  
GND  
GND  
GND  
V
V
V
CC1  
CC2  
CC3  
GND  
PROG  
TO  
GND  
L1  
V
C
UV  
OUT  
COMP2  
BAT  
TO  
GND  
SPIN  
GND  
R
S1  
C
OUT  
GND  
NOTE: CONNECT ALL GND PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING  
1769 F14  
Figure 14. Critical Electrical and Thermal Path Layout  
1769fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
15  
LT1769  
U
PACKAGE DESCRIPTION  
FE Package  
20-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663)  
Exposed Pad Variation CB  
3.86  
(.152)  
6.60 ±0.10  
2.74  
(.108)  
4.50 ±0.10  
SEE NOTE 4  
0.45 ±0.05  
1.05 ±0.10  
6.40 – 6.60*  
(.252 – .260)  
0.65 BSC  
3.86  
RECOMMENDED SOLDER PAD LAYOUT  
(.152)  
1.20  
(.047)  
MAX  
20 1918 17 16 15 14 1312 11  
4.30 – 4.50*  
(.169 – .177)  
0° – 8°  
0.65  
0.45 – 0.75  
(.018 – .030)  
2.74  
(.108)  
(.0256)  
6.40  
BSC  
0.09 – 0.20  
(.0036 – .0079)  
0.05 – 0.15  
(.002 – .006)  
BSC  
0.195 – 0.30  
(.0077 – .0118)  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
FE20 (CB) TSSOP 0203  
5
7
8
1
2
3
4
6
9 10  
3. DRAWING NOT TO SCALE  
GN Package  
28-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
0.386 – 0.393*  
(9.804 – 9.982)  
0.033  
(0.838)  
REF  
0.015 ± 0.004  
(0.38 ± 0.10)  
28 27 26 25 24 23 22 21 20 19 18 17 1615  
0.053 – 0.069  
(1.351 – 1.748)  
0.004 – 0.009  
(0.102 – 0.249)  
× 45°  
0.0075 – 0.0098  
(0.191 – 0.249)  
0° – 8° TYP  
0.229 – 0.244  
(5.817 – 6.198)  
0.150 – 0.157**  
(3.810 – 3.988)  
0.016 – 0.050  
(0.406 – 1.270)  
0.008 – 0.012  
(0.203 – 0.305)  
0.0250  
(0.635)  
BSC  
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
GN28 (SSOP) 1098  
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
1
2
3
4
5
6
7
8
9 10 11 12 13 14  
RELATED PARTS  
PART NUMBER DESCRIPTION  
COMMENTS  
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High Frequency, Small Inductor, High Efficiency Switchers, 1.5A Switch  
High Frequency, Small Inductor, High Efficiency Switcher, 1.5A Switch  
94% Efficiency, Synchronous Current Mode PWM  
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Up to 1.5A Charge Current for Lithium-Ion, NiCd and NiMH Batteries  
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V Can Be Higher or Lower Than Battery Voltage  
IN  
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Li-Ion Battery Charger Termination Controller  
Preconditioning If Cell < 2.7V, 3hr Time-Out, C/10 Detection, Temp Sensor  
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LTC1759  
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SMBus Smart Battery Charger  
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I
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1769fa  
LT/TP 1101 1.5K REV A • PRINTED IN USA  
16 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
LINEAR TECHNOLOGY CORPORATION 1999  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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