LTC2461CDDPBF [Linear]

Ultra-Tiny, 16-Bit I²C ΔΣ ADCs with 10ppm/°C Max Precision Reference; 超纤巧, 16位I²C我?我英镑的ADC,以及为10ppm / A ° C(最大值)精密基准
LTC2461CDDPBF
型号: LTC2461CDDPBF
厂家: Linear    Linear
描述:

Ultra-Tiny, 16-Bit I²C ΔΣ ADCs with 10ppm/°C Max Precision Reference
超纤巧, 16位I²C我?我英镑的ADC,以及为10ppm / A ° C(最大值)精密基准

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LTC2461/LTC2463  
2
Ultra-Tiny, 16-Bit I C ΔΣ  
ADCs with 10ppm/°C Max  
Precision Reference  
FEATURES  
DESCRIPTION  
The LTC®2461/LTC2463 are ultra tiny, 16-Bit analog-to-  
digital converters with an integrated precision reference.  
They use a single 2.7V to 5.5V supply and communicate  
through an I2C Interface. The LTC2461 is single-ended  
with a 0V to 1.25V input range and the LTC2463 is dif-  
ferential with a 1.25V input range. Both ADCs include a  
1.25V integrated reference with 2ppm/°C drift perfor-  
mance and 0.1% initial accuracy. The converters are  
available in a 12-pin 3mm × 3mm DFN package or an  
MSOP-12 package. They include an integrated oscillator  
and perform conversions with no latency for multiplexed  
applications. TheLTC2461/LTC2463includeaproprietary  
input sampling scheme that reduces the average input  
current several orders of magnitude when compared to  
conventional delta sigma converters.  
n
16-Bit Resolution, No Missing Codes  
n
Internal Reference, High Accuracy 10ppm/°C (Max)  
n
Single-Ended (LTC2461) or Differential (LTC2463)  
n
2LSB Offset Error (Typ)  
n
0.01% Gain Error (Typ)  
n
60 Conversions Per Second  
n
Single Conversion Settling Time for Multiplexed  
Applications  
n
1.5mA Supply Current  
n
200nA Sleep Current  
n
Internal Oscillator—No External Components  
Required  
2
n
2-Wire I C Interface with Two Addresses Plus One  
Global Address for Synchronization  
n
Ultra-Tiny, 12-Lead, 3mm × 3mm DFN and MSOP  
Packages  
Following a single conversion, the LTC2461/LTC2463  
automatically power down the converter and can also be  
configured to power down the reference. When both the  
ADC and reference are powered down, the supply current  
is reduced to 200nA.  
APPLICATIONS  
n
System Monitoring  
n
Environmental Monitoring  
n
Direct Temperature Measurements  
The LTC2461/LTC2463 can sample at 60 conversions per  
second and, due to the very large oversampling ratio,  
have extremely relaxed antialiasing requirements. Both  
includecontinuousinternaloffsetandfullscalecalibration  
algorithmswhicharetransparenttotheuser, ensuringac-  
curacy over time and the operating temperature range.  
n
Instrumentation  
Data Acquisition  
Embedded ADC Upgrades  
n
n
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear  
Technology Corporation. All other trademarks are the property of their respective owners.  
Protected by U.S. Patents, including 6208279, 6411242, 7088280, 7164378.  
TYPICAL APPLICATION  
VREF vs Temperature  
1.2520  
2.7V TO 5.5V  
1.2515  
1.2510  
1.2505  
1.2500  
1.2495  
1.2490  
1.2485  
1.2480  
0.1μF  
0.1μF  
COMP  
0.1μF  
10μF  
0.1μF  
10k  
REFOUT  
V
CC  
SCL  
SDA  
GND  
+
IN  
2
10k  
10k  
I C  
INTERFACE  
LTC2463  
A0  
IN  
0.1μF  
REF  
R
24613 TA01a  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
24613 TA01b  
24613f  
1
LTC2461/LTC2463  
ABSOLUTE MAXIMUM RATINGS  
(Notes 1, 2)  
Supply Voltage (V ) ................................... –0.3V to 6V  
Storage Temperature Range .................. –65°C to 150°C  
Operating Temperature Range  
CC  
Analog Input Voltage  
+
(V , V , V , V ,  
IN REF  
LTC2461C/LTC2463C............................... 0°C to 70°C  
LTC2461I/LTC2463I .............................–40°C to 85°C  
IN  
IN  
V
, V  
)...........................–0.3V to (V + 0.3V)  
COMP REFOUT CC  
Digital Voltage  
(V , V , V )..........................–0.3V to (V + 0.3V)  
SDA SCL A0  
CC  
PIN CONFIGURATION  
LTC2463  
LTC2463  
TOP VIEW  
TOP VIEW  
1
2
3
4
5
6
V
12  
CC  
REFOUT  
COMP  
A0  
1
2
3
4
5
6
REFOUT  
COMP  
A0  
12 V  
CC  
11 GND  
11 GND  
IN  
IN  
10  
9
10 IN  
13  
+
+
GND  
SCL  
GND  
SCL  
SDA  
9
8
7
IN  
REF  
8
REF  
GND  
7
GND  
SDA  
MS PACKAGE  
12-LEAD PLASTIC MSOP  
DD PACKAGE  
12-LEAD (3mm s 3mm) PLASTIC DFN  
T
JMAX  
= 125°C, θ = 135°C/W  
T
= 125°C, θ = 43°C/W  
JA  
JA  
JMAX  
EXPOSED PAD (PIN 13)  
LTC2461  
LTC2461  
TOP VIEW  
TOP VIEW  
1
12  
V
CC  
REFOUT  
COMP  
A0  
1
2
3
4
5
6
REFOUT  
COMP  
A0  
12 V  
CC  
11 GND  
10 GND  
2
3
4
5
6
11 GND  
GND  
IN  
10  
9
13  
GND  
SCL  
GND  
SCL  
SDA  
9
8
7
IN  
REF  
GND  
REF  
8
7
GND  
SDA  
MS PACKAGE  
12-LEAD PLASTIC MSOP  
DD PACKAGE  
12-LEAD (3mm s 3mm) PLASTIC DFN  
T
JMAX  
= 125°C, θ = 135°C/W  
T
= 125°C, θ = 43°C/W  
JA  
JA  
JMAX  
EXPOSED PAD (PIN 13)  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC2461CDD#PBF  
LTC2461IDD#PBF  
LTC2461CMS#PBF  
LTC2461IMS#PBF  
LTC2463CDD#PBF  
LTC2463IDD#PBF  
LTC2463CMS#PBF  
LTC2463IMS#PBF  
TAPE AND REEL  
PART MARKING*  
LFGF  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
0°C to 70°C  
LTC2461CDD#TRPBF  
LTC2461IDD#TRPBF  
LTC2461CMS#TRPBF  
LTC2461IMS#TRPBF  
LTC2463CDD#TRPBF  
LTC2463IDD#TRPBF  
LTC2463CMS#TRPBF  
LTC2463IMS#TRPBF  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic MSOP  
LFGF  
–40°C to 85°C  
0°C to 70°C  
2461  
2461  
12-Lead Plastic MSOP  
–40°C to 85°C  
0°C to 70°C  
LFGG  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic MSOP  
LFGG  
–40°C to 85°C  
0°C to 70°C  
2463  
2463  
12-Lead Plastic MSOP  
–40°C to 85°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
24613f  
2
LTC2461/LTC2463  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. (Note 2)  
PARAMETER  
CONDITIONS  
(Note 3)  
MIN  
TYP  
MAX  
UNITS  
Bits  
l
l
l
Resolution (No Missing Codes)  
Integral Nonlinearity  
Offset Error  
16  
(Note 4)  
1
8
LSB  
LTC2461, 30Hz, LTC2463  
LTC2461, 60Hz  
2
5
15  
LSB  
LSB  
Offset Error Drift  
Gain Error  
0.02  
0.01  
LSB/°C  
l
l
Includes Contributions of ADC and Internal Reference  
0.25 % of FS  
Gain Error Drift  
Includes Contributions of ADC and Internal Reference  
C-Grade  
I-Grade  
2
5
10  
ppm/°C  
ppm/°C  
Transition Noise  
2.2  
80  
μV  
RMS  
Power Supply Rejection DC  
dB  
The l denotes the specifications which apply over the full operating temperature range, otherwise  
ANALOG INPUTS  
specifications are at TA = 25°C.  
SYMBOL  
PARAMETER  
CONDITIONS  
LTC2463  
MIN  
0
TYP  
MAX  
UNITS  
V
+
l
l
l
V
V
V
V
V
C
Positive Input Voltage Range  
Negative Input Voltage Range  
Input Voltage Range  
V
REF  
V
REF  
V
REF  
IN  
IN  
IN  
LTC2463  
0
V
LTC2461  
0
V
+
+
+
, V  
UR  
, V  
UR  
Overrange/Underrange Voltage, IN  
V
IN  
V
IN  
= 0.625V (See Figure 3)  
= 0.625V (See Figure 3)  
8
8
LSB  
LSB  
pF  
OR  
OR  
IN  
+
Overrange/Underrange Voltage, IN–  
+
IN , IN , IN Sampling Capacitance  
0.35  
+
l
l
+
I
IN , IN DC Leakage Current (LTC2463)  
IN DC Leakage Current (LTC2461)  
V
IN  
V
IN  
= GND or V (Note 8)  
–10  
–10  
1
1
10  
10  
nA  
nA  
DC_LEAK(IN , IN , IN)  
CC  
= GND or V (Note 8)  
CC  
I
Input Sampling Current (Note 5)  
REFOUT Output Voltage  
50  
nA  
V
CONV  
l
l
V
1.247  
1.25  
1.253  
10  
REF  
REFOUT Voltage Temperature Coefficient (Note 9)  
C-Grade  
I-Grade  
2
5
ppm/°C  
ppm/°C  
Reference Line Regulation  
2.7V ≤ V ≤ 5.5V  
–90  
dB  
mA  
CC  
l
l
Reference Short Circuit Current  
COMP Pin Short Circuit Current  
Reference Load Regulation  
Reference Output Noise Density  
V
CC  
V
CC  
= 5.5, Forcing REFOUT to GND  
35  
= 5.5, Forcing REFOUT to GND  
200  
μA  
2.7V ≤ V ≤ 5.5V, I  
= 100ꢀA Sourcing  
= 0.1ꢀF, At f = 1kHz  
3.5  
30  
mV/mA  
nV/√Hz  
CC  
OUT  
C = 0.1ꢀF, C  
COMP REFOUT  
The l denotes the specifications which apply over the full operating temperature  
POWER REQUIREMENTS  
range, otherwise specifications are at TA = 25°C.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
l
V
Supply Voltage  
2.7  
5.5  
V
CC  
I
Supply Current  
Conversion  
Nap  
CC  
l
l
l
1.5  
800  
0.2  
2.5  
1500  
2
mA  
μA  
μA  
Sleep  
24613f  
3
LTC2461/LTC2463  
I2C INPUTS AND OUTPUTS  
The l denotes the specifications which apply over the full operating temperature  
range, otherwise specifications are at TA = 25°C. (Notes 2, 7)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
0.7V  
TYP  
MAX  
UNITS  
V
l
l
l
l
l
l
l
l
l
l
V
V
High Level Input Voltage  
IH  
IL  
CC  
Low Level Input Voltage  
0.3V  
10  
V
CC  
I
Digital Input Current  
–10  
μA  
V
I
V
V
Hysteresis of Schmidt Trigger Inputs  
Low Level Output Voltage (SDA)  
Input Leakage  
(Note 3)  
I = 3mA  
0.05V  
HYS  
OL  
CC  
0.4  
1
V
I
0.1V ≤ V ≤ 0.9V  
CC  
μA  
pF  
pF  
V
IN  
CC  
IN  
C
C
V
V
Capacitance for Each I/O Pin  
Capacitance Load for Each Bus Line  
High Level Input Voltage for Address Pin  
Low Level Input Voltage for Address Pin  
10  
I
400  
B
0.95V  
IH(A0)  
IL(A0)  
CC  
0.05V  
V
CC  
I2C TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. (Notes 2, 7)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
13  
TYP  
MAX  
23  
UNITS  
ms  
kHz  
μs  
l
l
l
l
l
l
l
l
l
l
l
l
l
t
f
t
t
t
t
t
t
t
t
t
t
t
Conversion Time  
16.6  
CONV  
SCL  
SCL Clock Frequency  
0
400  
Hold Time (Repeated) START Condition  
LOW Period of the SCL Pin  
HIGH Period of the SCL Pin  
Set-Up Time for a Repeated START Condition  
Data Hold Time  
0.6  
HD(SDA,STA)  
LOW  
1.3  
μs  
0.6  
μs  
HIGH  
0.6  
μs  
SU(STA)  
HD(DAT)  
SU(DAT)  
r
0
0.9  
μs  
Data Set-Up Time  
100  
ns  
Rise Time for SDA, SCL Signals  
Fall Time for SDA, SCL Signals  
Set-Up Time for STOP Condition  
Bus Free Time Between a Stop and Start Condition  
(Note 6)  
(Note 6)  
20 + 0.1C  
20 + 0.1C  
0.6  
300  
300  
ns  
B
ns  
f
B
μs  
SU(STO)  
BUF  
1.3  
μs  
Output Fall Time V  
to V  
Bus Load C = 10pF to  
20 + 0.1C  
250  
50  
ns  
OF  
IHMIN  
ILMAX  
B
B
400pF (Note 6)  
l
t
SP  
Input Spike Suppression  
ns  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 5: Input sampling current is the average input current drawn from  
the input sampling network while the LTC2461/LTC2463 are converting.  
Note 6: C = capacitance of one bus line in pF.  
B
Note 7: All values refer to V  
) and V  
levels.  
IH(MIN  
IL(MAX)  
Note 2: All voltage values are with respect to GND. V = 2.7V to 5.5V  
CC  
Note 8: A positive current is flowing into the DUT pin.  
Note 9: Voltage temperature coefficient is calculated by dividing the  
maximum change in output voltage by the specified temperature range.  
unless otherwise specified.  
Note 3: Guaranteed by design, not subject to test.  
Note 4: Integral nonlinearity is defined as the deviation of a code from a  
straight line passing through the actual endpoints of the transfer curve.  
Guaranteed by design and test correlation.  
24613f  
4
LTC2461/LTC2463  
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, unless otherwise noted)  
Integral Nonlinearity (VCC = 5.5V)  
Integral Nonlinearity (VCC = 2.7V)  
INL vs Temperature  
3
2
3
2
3
2
V
= 5.5V, 4.1V, 2.7V  
T
= –45°C, 25°C, 90°C  
T = –45°C, 25°C, 90°C  
A
CC  
A
1
1
1
0
0
0
–1  
–2  
–3  
–1  
–2  
–3  
–1  
–2  
–3  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–55 –35 –15  
5
25 45 65 85 105 125  
DIFFERENTIAL INPUT VOLTAGE (V)  
DIFFERENTIAL INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
24613 G03  
24613 G01  
24613 G02  
Offset Error vs Temperature  
ADC Gain Error vs Temperature  
Transition Noise vs Temperature  
25  
20  
15  
10  
5
10  
9
8
7
6
5
4
3
2
1
0
5
4
V
= 5.5V  
CC  
V
= 5.5V  
CC  
3
2
V
= 4.1V  
CC  
1
V
= 2.7V  
0
CC  
–1  
–2  
–3  
–4  
–5  
V
= 4.1V  
= 2.7V  
CC  
V
= 2.7V  
= 5.5V  
30  
CC  
V
V
CC  
CC  
0
–50  
–25  
0
25  
50  
75  
100  
–50 –30 –10 10  
50  
70  
90  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
24613 G05  
24613 G06  
24613 G04  
Conversion Mode Power Supply  
Current vs Temperature  
Sleep Mode Power Supply  
Current vs Temperature  
V
V
REF vs Temperature  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
350  
300  
250  
200  
150  
100  
50  
1.2508  
1.2507  
1.2506  
1.2505  
1.2504  
1.2503  
1.2502  
= 5V  
CC  
V
= 5.5V  
CC  
V
= 5.5V  
CC  
V
= 4.1V  
CC  
V
= 2.7V  
V
= 4.1V  
CC  
CC  
V
= 2.7V  
30  
CC  
0
–50 –30 –10 10  
30  
50  
70  
90  
–50 –30 –10 10  
50  
70  
90  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
24613 G07  
24613 G08  
24613 G09  
24613f  
5
LTC2461/LTC2463  
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, unless otherwise noted)  
Power Supply Rejection  
vs Frequency at VCC  
Conversion Time vs Temperature  
VREF vs VCC  
0
–20  
21  
20  
19  
18  
17  
16  
15  
14  
1.24892  
1.24891  
1.24890  
1.24889  
1.24888  
1.24887  
1.24886  
1.24885  
1.24884  
T
= 25°C  
CC  
T
= 25°C  
A
A
V
= 4.1V  
–40  
V
= 5V, 4.1V, 3V  
CC  
–60  
–80  
–100  
–120  
1
10 100 1k 10k 100k 1M 10M  
–50  
–25  
0
25  
50  
75  
100  
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
FREQUENCY AT V (Hz)  
CC  
TEMPERATURE (°C)  
V
CC  
(V)  
24613 G10  
24613 G11  
24613 G12  
24613f  
6
LTC2461/LTC2463  
PIN FUNCTIONS  
2
REFOUT (Pin 1): Reference Output Pin. Nominally 1.25V,  
this voltage sets the fullscale input range of the ADC. For  
noise and reference stability connect to a 0.1μF capacitor  
tied to GND. This capacitor value must be less than or  
equal to the capacitor tied to the reference compensation  
pin (COMP). REFOUT cannot be overdriven by an external  
reference. For applications that require an input range  
greater than 0V to 1.25V, please refer to the LTC2451/  
LTC2453.  
SDA (Pin 6): Bidirectional Serial Data Line of the I C Inter-  
face. The conversion result is output through the SDA pin.  
The pin is high impedance unless the LTC2461/LTC2463  
is in the data output mode. While the LTC2461/LTC2463  
is in the data output mode, SDA is an open drain pull  
down (which requires an external 1.7k pull-up resistor  
to V ).  
CC  
REF (Pin 8): Negative Reference Input to the ADC. The  
voltage on this pin sets the zero input to the ADC. This  
pin should tie directly to ground or the ground sense of  
the input sensor.  
COMP (Pin 2): Internal Reference Compensation Pin. For  
low noise and reference stability, tie a 0.1ꢀF capacitor to  
GND.  
+
IN (LTC2463), IN (LTC2461) (Pin 9): Positive input volt-  
age for the LTC2463 differential device. ADC input for the  
LTC2461 single-ended device.  
A0 (Pin 3): Chip Address Control Pin. The A0 pin can be  
tied to GND or V . If A0 is tied to GND, the LTC2461/  
CC  
2
LTC2463 I C address is 0010100. If A0 is tied to V , the  
CC  
IN (LTC2463), GND (LTC2461) (Pin 10): Negative input  
voltage for the LTC2463 differential device. GND for the  
LTC2461 single-ended device.  
2
LTC2461/LTC2463 I C address is 1010100.  
GND (Pins 4, 7, 11): Ground. Connect directly to the  
ground plane through a low impedance connection.  
V
CC  
(Pin12):PositiveSupplyVoltage. BypasstoGNDwith  
2
SCL (Pin 5): Serial Clock Input of the I C Interface. The  
a 10ꢀF capacitor in parallel with a low-series-inductance  
LTC2461/LTC2463 can only act as a slave and the SCL pin  
only accepts external serial clock. Data is shifted into the  
SDA pin on the rising edges of SCL and output through  
the SDA pin on the falling edges of SCL.  
0.1ꢀF capacitor located as close to pin 12 as possible.  
Exposed Pad (Pin 13 – DFN Package): Ground. Connect  
directly to the ground plane through a low impedance  
connection.  
24613f  
7
LTC2461/LTC2463  
BLOCK DIAGRAM  
1
2
12  
REFOUT  
COMP  
V
CC  
2
3
5
6
INTERNAL  
A0  
SCL  
SDA  
$3 A/D  
CONVERTER  
I C  
REFERENCE  
9
+
INTERFACE  
IN  
(IN)  
DECIMATING  
SINC FILTER  
$3 A/D  
CONVERTER  
10  
IN  
INTERNAL  
OSCILLATOR  
(GND)  
REF  
GND  
4, 7, 11, 13 (DD PACKAGE)  
8
24613 BD  
( ) PARENTHESIS INDICATE LTC2461  
Figure 1. Functional Block Diagram  
APPLICATIONS INFORMATION  
CONVERTER OPERATION  
POWER-ON RESET  
CONVERT  
Converter Operation Cycle  
The LTC2461/LTC2463 are low power, delta sigma, ana-  
2
SLEEP/NAP  
log to digital converters with a simple I C interface (see  
Figure 1). The LTC2463 has a fully differential input while  
the LTC2461 is single-ended. Both are pin and software  
compatible. Their operation is composed of three distinct  
states: CONVERT, SLEEP/NAP, and DATA INPUT/OUTPUT  
(see Figure 2). The operation begins with the CONVERT  
state. Once the conversion is finished, the converter auto-  
matically powers down (NAP) or, under user control, both  
the converter and reference are powered down (SLEEP).  
The conversion result is held in a static register while the  
device is in this state. The cycle concludes with the DATA  
INPUT/OUTPUT state. Once all 16-bits are read the device  
begins a new conversion.  
READ/WRITE  
NO  
ACKNOWLEDGE  
YES  
DATA INPUT/OUTPUT  
STOP  
OR  
READ 16 BITS  
NO  
YES  
24613 F02  
TheCONVERTstatedurationisdeterminedbytheLTC2461/  
LTC2463 conversion time (nominally 16.6 milliseconds).  
Oncestarted, thisoperationcannotbeabortedexceptbya  
Figure 2. LTC2461/LTC2463 State Transition Diagram  
low power supply condition (V < 2.1V) which generates  
CC  
read/write is acknowledged. Following this condition, the  
ADC transitions into the DATA INPUT/OUTPUT state.  
an internal power-on reset signal.  
Afterthecompletionofaconversion,theLTC2461/LTC2463  
enterstheSLEEP/NAPstateandremainsthereuntilavalid  
While in the SLEEP/NAP state, the LTC2461/LTC2463’s  
converters are powered down. This reduces the supply  
24613f  
8
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
current by approximately 50%. While in the Nap state,  
the reference remains powered up. To power down the  
reference in addition to the converter, the user can select  
the SLEEP mode during the DATA INPUT/OUTPUT state.  
Once the next conversion is complete, SLEEP state is  
entered and power is reduced to 200nA. The reference  
is powered up once a valid read/write is acknowledged.  
The reference startup time is 12ms (if the reference and  
compensation capacitor values are both 0.1ꢀF).  
The LTC2461/LTC2463 perform offset calibrations every  
conversion cycle. This calibration is transparent to the  
user and has no effect upon the cyclic operation described  
previously. The advantage of continuous calibration is  
stability of the ADC performance with respect to time and  
temperature.  
TheLTC2461/LTC2463includeaproprietaryinputsampling  
scheme that reduces the average input current by several  
orders of magnitude when compared to traditional delta-  
sigma architectures. This allows external filter networks  
to interface directly to the LTC2461/LTC2463. Since the  
average input sampling current is 50nA, an external RC  
lowpass filter using 1kΩ and 0.1μF results in <1LSB  
additional error. Additionally, there is negligible leakage  
Power-Up Sequence  
When the power supply voltage (V ) applied to the con-  
CC  
verter is below approximately 2.1V, the ADC performs a  
power-on reset. This feature guarantees the integrity of  
the conversion result.  
+
current between IN and IN .  
WhenV risesabovethiscriticalthreshold, theconverter  
CC  
Input Voltage Range (LTC2461)  
generates an internal power-on reset (POR) signal for  
approximately 0.5ms. The POR signal clears all internal  
registers.FollowingthePORsignal,theLTC2461/LTC2463  
startaconversioncycleandfollowthesuccessionofstates  
shown in Figure 2. The reference startup time following a  
Ignoring offset and full-scale errors, the LTC2461 will  
theoretically output an “all zero” digital result when the  
input is at ground (a zero scale input) and an “all one”  
digital result when the input is at V (V  
= 1.25V).  
REF REFOUT  
In an underrange condition, for all input voltages below  
zeroscale,theconverterwillgeneratetheoutputcode0.In  
an overrange condition, for all input voltages greater than  
POR is 12ms (C  
= C  
= 0.1ꢀF). The first conver-  
COMP  
REFOUT  
sion following power-up will be invalid since the reference  
voltage has not completely settled. The first conversion  
following power up can be discarded using the data abort  
command or simply read and ignored. The following con-  
versions are accurate to the device specifications.  
V
, the converter will generate the output code 65535.  
REF  
For applications that require an input range greater than  
0V to 1.25V, please refer to the LTC2451.  
Input Voltage Range (LTC2463)  
Ease of Use  
AsmentionedintheOutputDataFormatsection,theoutput  
The LTC2461/LTC2463 data output has no latency, filter  
settling delay or redundant results associated with the  
conversion cycle. There is a one-to-one correspondence  
between the conversion and the output data. Therefore,  
multiplexing multiple analog input voltages requires no  
special actions.  
+
code is given as 32768 • (V – V )/V + 32768. For  
IN  
IN  
REF  
+
(V – V ) ≥ V , the output code is clamped at 65535  
(all ones). For (V – V ) ≤ –V , the output code is  
IN  
IN  
REF  
IN  
+
IN  
REF  
clamped at 0 (all zeroes).  
The LTC2463 includes a proprietary architecture that  
can, typically, digitize each input up to 8 LSBs above  
24613f  
9
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
2
V
and below GND, if the differential input is within  
REF  
the data line is free, it is HIGH. Data on the I C bus can be  
REF  
V
. As an example (Figure 3), if the user desires to  
transferredatratesupto100kbits/sintheStandard-Mode  
and up to 400kbits/s in the Fast-Mode.  
measure a signal slightly below ground, the user could  
+
set V = GND. If V = GND, the output code would be  
IN  
IN  
UponenteringtheDATAINPUT/OUTPUTstate,SDAoutputs  
the sign (D15) of the conversion result. During this state,  
the ADC shifts the conversion result serially through the  
SDA output pin under the control of the SCL input pin.  
There is no latency in generating this data and the result  
corresponds to the last completed conversion. A new bit  
of data appears at the SDA pin following each falling edge  
detectedattheSCLinputpinandappearsfromMSBtoLSB.  
The user can reliably latch this data on every rising edge  
of the external serial clock signal driving the SCL pin.  
+
approximately32768.IfV = GND 8LSB =0.305mV,  
IN  
the output code would be approximately 32760. For ap-  
plications that require an input range greater than 1.25V,  
please refer to the LTC2453.  
20  
16  
12  
8
4
0
2
Each device on the I C bus is recognized by a unique  
–4  
address stored in that device and can operate either as  
a transmitter or receiver, depending on the function of  
the device. In addition to transmitters and receivers,  
devices can also be considered as masters or slaves when  
performing data transfers. A master is the device which  
initiates a data transfer on the bus and generates the  
clock signals to permit that transfer. Devices addressed  
by the master are considered a slave. The address of the  
LTC2461/LTC2463 is 0010100 (if A0 is tied to GND) or  
SIGNALS  
–8  
BELOW  
GND  
–12  
–16  
–20  
–0.001 –0.005  
0
V
0.005 0.001 0.0015  
+
+
/V  
IN REF  
24613 F03  
Figure 3. Output Code vs VIN+ with VIN= 0 (LTC2463)  
2
I C INTERFACE  
1010100 (if A0 is tied to V ).  
2
CC  
The LTC2461/LTC2463 communicate through an I C in-  
terface. The I C interface is a 2-wire open-drain interface  
supporting multiple devices and masters on a single bus.  
The connected devices can only pull the data line (SDA)  
LOW and can never drive it HIGH. SDA must be externally  
connected to the supply through a pull-up resistor. When  
2
The LTC2461/LTC2463 can only be addressed as a slave.  
It can only transmit the last conversion result. The serial  
clockline,SCL,isalwaysaninputtotheLTC2461/LTC2463  
andtheserialdatalineSDAisbidirectional.Figure4shows  
2
the definition of the I C timing.  
SDA  
t
SU(DAT)  
t
t
r
r
t
t
f
t
t
t
BUF  
t
f
HD(SDA)  
SP  
LOW  
SCL  
t
t
t
SU(STO)  
HD(STA)  
SU(STA)  
t
t
HIGH  
S
Sr  
P
S
HD(DAT)  
24613 F04  
Figure 4. Definition of Timing for Fast/Standard Mode Devices on the I2C Bus  
24613f  
10  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
The START and STOP Conditions  
Output Data Format  
After a START condition, the master sends a 7-bit address  
followed by a read request (R) bit. The bit R is 1 for a  
Read Request. If the 7-bit address matches the LTC2461/  
LTC2463’saddress(0010100or1010100,dependingonthe  
state of the pin A0) the ADC is selected. When the device is  
addressed during the conversion state, it does not accept  
therequestandissuesaNAKbyleavingtheSDAlineHIGH.  
If the conversion is complete, the LTC2461/LTC2463 issue  
an ACK by pulling the SDA line LOW.  
A START (S) condition is generated by transitioning SDA  
from HIGH to LOW while SCL is HIGH. The bus is consid-  
ered to be busy after the START condition. When the data  
transfer is finished, a STOP (P) condition is generated by  
transitioning SDA from LOW to HIGH while SCL is HIGH.  
ThebusisfreeafteraSTOPisgenerated.STARTandSTOP  
conditions are always generated by the master.  
When the bus is in use, it stays busy if a repeated START  
(Sr)isgeneratedinsteadofaSTOPcondition.Therepeated  
START timing is functionally identical to the START and  
is used for reading from the device before the initiation  
of a new conversion.  
FollowingtheACK, theLTC2461/LTC2463canoutputdata.  
The data output stream is 16 bits long and is shifted out  
on the falling edges of SCL (see Figure 5a).  
The DATA INPUT/OUTPUT state is concluded once all 16  
data bits have been read or after a STOP condition.  
Data Transferring  
2
After the START condition, the I C bus is busy and data  
The LTC2463 (differential input) output code is given by  
transfer can begin between the master and the addressed  
slave. Data is transferred over the bus in groups of nine  
bits, one byte followed by one acknowledge (ACK) bit. The  
master releases the SDA line during the ninth SCL clock  
cycle. The slave device can issue an ACK by pulling SDA  
LOW or issue a Not Acknowledge (NAK) by leaving the  
SDA line HIGH impedance (the external pull-up resistor  
will hold the line HIGH). Change of data only occurs while  
the clock line (SCL) is LOW.  
+
32768 • (V – V )/V  
+ 32768. The first bit output  
IN  
IN  
REF  
+
by the LTC2463, D15, is the MSB, which is 1 for V  
IN  
+
V
and 0 for V < V . This bit is followed by succes-  
IN  
IN IN  
sively less significant bits (D14, D13, …) until the LSB is  
output by the LTC2463, see Table 1.  
1
7
8
9
1
2
3
8
9
1
2
3
8
9
SCL  
SDA  
7-BIT  
ADDRESS  
R
D15  
D14  
D13  
D8  
D7  
D6  
D5  
D0  
MSB  
LSB  
START BY  
MASTER  
ACK BY  
LTC2461/LTC2463  
ACK BY  
MASTER  
NACK BY  
MASTER  
SLEEP  
DATA OUTPUT  
CONVERSION  
24613 F05a  
Figure 5a. Read Sequence Timing Diagram  
24613f  
11  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
The LTC2461 (single-ended input) output code is a direct  
binary encoded result, see Table 1.  
The speed bit (SPD) is only used by the LTC2461. In the  
default mode, SPD = 0, the output rate is 60Hz and con-  
tinuousbackgroundoffsetcalibrationisnotperformed.By  
changing the SPD bit to 1, background offset calibration  
is performed and the output rate is reduced to 30Hz. The  
LTC2463 data output rate is always 60Hz and background  
offset calibration is performed (SPD = don’t care).  
Data Input Format  
After a START condition, the master sends a 7-bit ad-  
dress followed by a read/write request (R/W) bit. The  
R/W bit is 0 for a write. The data input word is 4 bits long  
and consists of two enable bits (EN1 and EN2) and two  
programming bits (SPD and SLP), see Figure 5b. EN1 is  
applied to the first rising edge of SCL after a valid write  
address is acknowledged. Programming is enabled by  
setting EN1 = 1 and EN2 = 0.  
The sleep bit (SLP) is used to power down the on chip  
reference. In the default mode, the reference remains  
powered up even when the ADC is powered down. If the  
SLP bit is set HIGH, the reference will power down after  
Table 1. LTC2461/LTC2463 Output Data Format  
SINGLE ENDED INPUT V  
(LTC2461)  
DIFFERENTIAL INPUT VOLTAGE  
D15  
(MSB)  
D14  
D13  
D12...D2  
D1  
D0  
(LSB)  
CORRESPONDING  
DECIMAL VALUE  
IN  
+
V
– V (LTC2463)  
IN  
IN  
≥V  
≥V  
1
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
65535  
65534  
49152  
49151  
32768  
32767  
16384  
16383  
0
REF  
REF  
V
– 1LSB  
V
– 1LSB  
REF  
REF  
0.75 • V  
0.5 • V  
REF  
REF  
0.75 • V – 1LSB  
0.5 • V – 1LSB  
REF  
REF  
0.5 • V  
0
REF  
0.5 • V – 1LSB  
–1LSB  
REF  
0.25 • V  
–0.5 • V  
REF  
REF  
0.25 • V – 1LSB  
–0.5 • V – 1LSB  
REF  
REF  
0
≤ –V  
REF  
1
2
7
8
9
1
2
3
4
5
6
7
8
9
SCL  
SDA  
7-BIT ADDRESS  
EN1  
EN2  
SPD  
SLP  
W
ACK BY  
LTC2461/LTC2463  
ACK BY  
LTC2461/LTC2463  
START BY  
MASTER  
SLEEP  
DATA INPUT  
24613 F03  
Figure 5b. Timing Diagram for Writing to the LTC2461/LTC2463  
24613f  
12  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
the next conversion is complete. It will remain powered  
downuntilavalidaddressisacknowledged. Thereference  
startup time is approximately 12ms. In order to ensure a  
stable reference for the following conversions, either the  
data input/output time should be delayed 12ms after an  
address acknowledge or the first conversion following a  
reference start up should be discarded.  
end of a read operation, a new conversion automatically  
begins. At the conclusion of the conversion cycle, the next  
result may be read using the method described above. If  
the conversion cycle is not complete and a valid address  
selects the device, the LTC2461/LTC2463 generate a NAK  
signal indicating the conversion cycle is in progress. See  
Figure 7a for an example state diagram.  
Discarding a Conversion Result and Initiating a New  
Conversion  
OPERATION SEQUENCE  
Continuous Read  
It is possible to start a new conversion without reading  
the old result, as shown in Figure 7b. Following a valid  
7-bit address, a read request (R/W) bit, and a valid ACK,  
a STOP command will start a new conversion.  
Conversions from the LTC2461/LTC2463 can be continu-  
ously read, see Figure 6. The R/W is 1 for a read. At the  
7-BIT ADDRESS  
(0010100 OR 1010100)  
7-BIT ADDRESS  
(0010100 OR 1010100)  
S
R
ACK  
READ  
P
S
R
ACK  
READ  
P
SLEEP  
DATA OUTPUT  
CONVERSION  
SLEEP  
DATA OUTPUT  
CONVERSION  
CONVERSION  
24613 F06  
Figure 6. Consecutive Reading  
WRITE INPUT  
CONFIGURATION  
(FIGURE 5b)  
ACK  
7-BIT ADDRESS:  
0010100 OR 1010100  
R/W  
BIT LOW  
2
2
I C START  
I C STOP  
CONVERT  
CONVERSION  
FINISHED  
WRITE INPUT  
CONFIGURATION  
(FIGURE 5b)  
R/W  
BIT LOW  
7-BIT ADDRESS:  
0010100 OR 1010100  
2
2
I C (REPEAT) START  
I C START  
FOR CYCLE N  
CONVERSION  
FINISHED  
ACK  
NAK  
7-BIT ADDRESS:  
0010100 OR 1010100  
R/W  
BIT HIGH  
READ DATA FROM  
CYCLE N-1  
2
I C STOP  
CONVERT  
24613 F07b  
ACK  
Figure 7a. I2C State Diagram  
7-BIT ADDRESS  
S
R
ACK READ (OPTIONAL)  
DATA OUTPUT  
P
(0010100 OR 1010100)  
CONVERSION  
SLEEP  
CONVERSION  
24613 F07a  
Figure 7b. Start a New Conversion without Reading Old Conversion Result  
24613f  
13  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
PRESERVING THE CONVERTER ACCURACY  
Very low impedance ground and power planes, and star  
connections at both V and GND pins, are preferable.  
CC  
TheLTC2461/LTC2463aredesignedtominimizetheconver-  
sion result’s sensitivity to device decoupling, PCB layout,  
antialiasingcircuits,lineandfrequencyperturbations.Nev-  
ertheless, inordertopreservethehighaccuracycapability  
of this part, some simple precautions are desirable.  
The V pin should have two distinct connections: the  
CC  
first to the decoupling capacitors described above, and  
the second to the ground return for the power supply  
voltage source.  
REFOUT and COMP  
Digital Signal Levels  
The on-chip 1.25V precision reference is internally tied  
to the LTC2461/LTC2463 converter’s reference input and  
its output to the REFOUT pin. A 0.1ꢀF capacitor should  
be placed on the REFOUT pin. It is possible to reduce  
this capacitor, but the transition noise increases. A 0.1ꢀF  
capacitor should also be placed on the COMP pin. This  
pin is tied to an internal point in the reference and is used  
for stability. In order for the reference to remain stable the  
capacitor placed on the COMP pin must be greater than or  
Due to the nature of CMOS logic, it is advisable to keep  
inputdigitalsignalsnearGNDorV .Voltagesintherange  
CC  
of 0.5V to V – 0.5V may result in additional current  
CC  
leakage from the part. Undershoot and overshoot should  
also be minimized, particularly while the chip is convert-  
ing. Excessive noise on the digital lines could degrade the  
ADC performance.  
Driving V and GND  
CC  
InrelationtotheV andGNDpins, the LTC2461/LTC2463  
CC  
INTERNAL  
V
V
V
V
CC  
CC  
CC  
CC  
REFERENCE  
R
SW  
15k  
combinesinternalhighfrequencydecouplingwithdamping  
elements, which reduce the ADC performance sensitivity  
to PCB layout and external components. Nevertheless,  
the very high accuracy of this converter is best pre-  
served by careful low and high frequency power supply  
decoupling.  
I
I
LEAK  
LEAK  
(TYP)  
REFOUT  
R
SW  
15k  
I
I
LEAK  
(TYP)  
+
A 0.1μF, high quality, ceramic capacitor in parallel with  
a 10μF low ESR ceramic capacitor should be connected  
IN  
LEAK  
between the V and GND pins, as close as possible to  
CC  
C
EQ  
the package. The 0.1μF capacitor should be placed closest  
R
SW  
0.35pF  
(TYP)  
15k  
to the ADC package. It is also desirable to avoid any via  
I
I
LEAK  
(TYP)  
in the circuit path, starting from the converter V pin,  
IN  
CC  
passing through these two decoupling capacitors, and  
returningtotheconverterGNDpin.Theareaencompassed  
by this circuit path, as well as the path length, should be  
minimized.  
LEAK  
R
SW  
15k  
I
I
LEAK  
(TYP)  
24613 F08  
REF  
As shown in Figure 8, REF is used as the negative refer-  
LEAK  
ence voltage input to the ADC. This pin can be tied directly  
to ground or Kelvined to sensor ground. In the case where  
Figure 8. LTC2461/LTC2463 Analog Input/Reference  
Equivalent Circuit  
REF is used as a sense input, it should be bypassed to  
ground with a 0.1ꢀF ceramic capacitor in parallel with a  
10ꢀF low ESR ceramic capacitor.  
24613f  
14  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
V
CC  
equaltothecapacitortiedtotheREFOUTpin. TheREFOUT  
pin should not be overridden by an external voltage. If  
a reference voltage greater than 1.25V is required, the  
LTC2451/LTC2453 should be used.  
IN  
R
SW  
(LTC2461)  
15k  
I
LEAK  
R
R
(TYP)  
S
+
IN  
(LTC2463)  
I
LEAK  
+
C
C
C
+
IN  
EQ  
V
V
I
I
SIG  
CONV  
0.35pF  
(TYP)  
C
PAR  
The internal reference has a corresponding start up  
time depending on the size of the capacitors tied to the  
REFOUT and COMP pins. This start up time is typically  
12ms when 0.1ꢀF capacitors are used. At initial power up,  
the first conversion result can be aborted or ignored. At  
the completion of this first conversion, the reference has  
settled and all subsequent conversions are valid.  
V
CC  
R
SW  
15k  
I
LEAK  
(TYP)  
S
IN  
(LTC2463)  
I
LEAK  
C
+
IN  
EQ  
SIG  
CONV  
0.35pF  
(TYP)  
C
PAR  
24613 F09  
Figure 9. LTC2461/LTC2463 Input Drive Equivalent Circuit  
If the reference is put to sleep (program SLP = 1) the refer-  
ence is powered down after the next conversion. This last  
conversionresultisvalid.Onavalidaddressacknowledge,  
the reference is powered back up. In order to ensure the  
reference output has settled before the next conversion,  
the power up time can be extended by delaying the data  
read 12ms. Once all 16 bits are read from the device, the  
nextconversionautomaticallybegins.Inthedefaultopera-  
tion, the reference remains powered up at the conclusion  
of the conversion cycle.  
Therearesomeimmediatetrade-offsinR andC without  
S
IN  
needing a full circuit analysis. Increasing R and C can  
S
IN  
give the following benefits:  
1) Due to the LTC2461/LTC2463’s input sampling algo-  
+
rithm, the input current drawn by IN , IN or IN over  
a conversion cycle is typically 50nA. A high R • C  
S
IN  
attenuates the high frequency components of the input  
current, and R values up to 1k result in <1LSB error.  
S
2) The bandwidth from V is reduced at the input pins  
+
SIG  
Driving V and V  
IN  
IN  
+
(IN , IN or IN). This bandwidth reduction isolates the  
ADCfromhighfrequencysignals, andassuchprovides  
simple antialiasing and input noise reduction.  
The input drive requirements can best be analyzed using  
the equivalent circuit of Figure 9. The input signal V is  
SIG  
+
connected to the ADC input pins (IN and IN ) through an  
3) Switching transients generated by the ADC are attenu-  
ated before they go back to the signal source.  
equivalentsourceresistanceR .Thisresistorincludesboth  
S
the actual generator source resistance and any additional  
optional resistors connected to the input pins. Optional  
4) A large C gives a better AC ground at the input pins,  
IN  
input capacitors C are also connected to the ADC input  
helping reduce reflections back to the signal source.  
IN  
pins. This capacitor is placed in parallel with the input  
5) Increasing R protects the ADC by limiting the current  
S
parasitic capacitance C . This parasitic capacitance  
PAR  
during an outside-the-rails fault condition.  
includes elements from the printed circuit board (PCB)  
There is a limit to how large R • C should be for a given  
and the associated input pin of the ADC. Depending on the  
S
IN  
application. Increasing R beyond a given point increases  
PCBlayout, C hastypicalvaluesbetween2pFand15pF.  
S
PAR  
the voltage drop across R due to the input current,  
In addition, the equivalent circuit of Figure 9 includes the  
S
converter equivalent internal resistor R and sampling  
SW  
capacitor C .  
EQ  
24613f  
15  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
to the point that significant measurement errors exist.  
on. The resultant INL vs V is shown in Figure 11. The  
IN  
Additionally, forsomeapplications, increasingtheR •C  
measurements of Figure 11 include a capacitor C  
cor-  
S
IN  
PAR  
product too much may unacceptably attenuate the signal  
respondingtoaminimumsizedlayoutpadandaminimum  
width input trace of about 1 inch length.  
at frequencies of interest.  
For most applications, it is desirable to implement C as  
IN  
Signal Bandwidth, Transition Noise and Noise  
Equivalent Input Bandwidth  
a high-quality 0.1μF ceramic capacitor and to set R ≤ 1k.  
S
This capacitor should be located as close as possible to  
1
+
The LTC2461/LTC2463 include a sinc type digital filter  
the actual IN , IN or IN package pin. Furthermore, the  
area encompassed by this circuit path, as well as the path  
length, should be minimized.  
with the first notch located at f = 60Hz. As such, the  
0
3dB input signal bandwidth is 26.54Hz. The calculated  
LTC2461/LTC2463 input signal attenuation vs frequency  
over a wide frequency range is shown in Figure 12. The  
calculated LTC2461/LTC2463 input signal attenuation vs  
frequency at low frequencies is shown in Figure 13. The  
In the case of a 2-wire sensor that is not remotely  
grounded, it is desirable to split R and place series  
S
resistors in the ADC input line as well as in the sensor  
ground return line, which should be tied to the ADC GND  
pin using a star connection topology.  
converter noise level is about 2.2μV  
and can be mod-  
RMS  
eled by a white noise source connected at the input of a  
noise-free converter.  
Figure 10 shows the measured LTC2463 INL vs Input  
Voltage as a function of R value with an input capacitor  
S
On a related note, the LTC2463 uses two separate A/D  
converters to digitize the positive and negative inputs.  
C = 0.1μF.  
IN  
Insomecases,R canbeincreasedabovetheseguidelines.  
Each of these A/D converters has 2.2μV  
transition  
S
RMS  
The input current is zero when the ADC is either in sleep  
noise. If one of the input voltages is within this small  
transition noise band, then the output will fluctuate one  
bit, regardless of the value of the other input voltage. If  
both of the input voltages are within their transition noise  
bands, the output can fluctuate 2 bits.  
or I/O modes. Thus, if the time constant of the input RC  
circuit τ = R • C , is of the same order of magnitude or  
S
IN  
longer than the time periods between actual conversions,  
then one can consider the input current to be reduced  
correspondingly.  
Forasimplesystemnoiseanalysis,theV drivecircuitcan  
IN  
These considerations need to be balanced out by the input  
be modeled as a single-pole equivalent circuit character-  
signal bandwidth. The 3dB bandwidth ≈ 1/(2πR C ).  
ized by a pole location f and a noise spectral density n .  
S IN  
i
i
If the converter has an unlimited bandwidth, or at least a  
Finally, if the recommended choice for C is unacceptable  
IN  
bandwidth substantially larger than f , then the total noise  
i
fortheuser’sspecificapplication,analternatestrategyisto  
contribution of the external drive circuit would be:  
eliminateC andminimizeC andR .Inpracticalterms,  
IN  
PAR  
S
thisconfigurationcorrespondstoalowimpedancesensor  
directly connected to the ADC through minimum length  
traces. Actual applications include current measurements  
through low value sense resistors, temperature measure-  
ments, low impedance voltage source monitoring, and so  
Vn = ni π /2• fi  
Then, the total system noise level can be estimated as  
2
the square root of the sum of (V ) and the square of the  
n
2
LTC2461/LTC2463 noise floor (~2.2μV ).  
24613f  
16  
LTC2461/LTC2463  
APPLICATIONS INFORMATION  
3
3
2
C
V
T
= 0.1μF  
= 5V  
C
V
T
= 0  
IN  
CC  
= 25°C  
IN  
CC  
A
= 5V  
= 25°C  
2
1
A
R
= 10k  
R = 10k  
S
S
1
R
= 1k  
S
R
S
= 0k  
0
0
R
= 0k  
R
= 1k  
S
S
–1  
–2  
–3  
–1  
–2  
–3  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
DIFFERENTIAL INPUT VOLTAGE (V)  
DIFFERENTIAL INPUT VOLTAGE (V)  
24613 F10  
24613 F11  
Figure 10. Measured INL vs Input Voltage (CIN = 0.1μF)  
Figure 11. Measured INL vs Input Voltage (CIN = 0)  
0
0
V
T
= 5V  
V
T
= 5V  
CC  
A
CC  
A
= 25°C  
= 25°C  
–5  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
–50  
–20  
–40  
–60  
–80  
–100  
0
5.0  
7.5  
1.00 1.25 1.50  
2.5  
0
60 120 180 240 300 360 420 480 540 600  
INPUT SIGNAL FREQUENCY (Hz)  
INPUT SIGNAL FREQUENCY (MHz)  
24613 F12  
24613 F13  
Figure 12. LTC2463 Input Signal Attentuation vs Frequency  
Figure 13. LTC2463 Input Signal Attenuation  
vs Frequency (Low Frequencies)  
24613f  
17  
LTC2461/LTC2463  
PACKAGE DESCRIPTION  
DD Package  
12-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1725 Rev A)  
0.70 0.05  
2.38 0.05  
1.65 0.05  
3.50 0.05  
2.10 0.05  
PACKAGE  
OUTLINE  
0.25 0.05  
0.45 BSC  
2.25 REF  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
R = 0.115  
0.40 0.10  
TYP  
7
12  
2.38 0.10  
3.00 0.10  
(4 SIDES)  
1.65 0.10  
PIN 1 NOTCH  
PIN 1  
TOP MARK  
R = 0.20 OR  
0.25 × 45°  
CHAMFER  
(SEE NOTE 6)  
6
1
0.23 0.05  
0.45 BSC  
0.75 0.05  
0.200 REF  
2.25 REF  
(DD12) DFN 0106 REV A  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
24613f  
18  
LTC2461/LTC2463  
PACKAGE DESCRIPTION  
MS Package  
12-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1668 Rev Ø)  
0.889 p 0.127  
(.035 p .005)  
5.23  
(.206)  
MIN  
3.20 – 3.45  
(.126 – .136)  
4.039 p 0.102  
(.159 p .004)  
(NOTE 3)  
0.65  
(.0256)  
BSC  
0.42 p 0.038  
(.0165 p .0015)  
TYP  
0.406 p 0.076  
(.016 p .003)  
REF  
12 11 10 9 8 7  
RECOMMENDED SOLDER PAD LAYOUT  
DETAIL “A”  
0o – 6o TYP  
3.00 p 0.102  
(.118 p .004)  
(NOTE 4)  
4.90 p 0.152  
(.193 p .006)  
0.254  
(.010)  
GAUGE PLANE  
0.53 p 0.152  
(.021 p .006)  
1
2 3 4 5 6  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.22 – 0.38  
(.009 – .015)  
TYP  
0.1016 p 0.0508  
(.004 p .002)  
MSOP (MS12) 1107 REV Ø  
0.650  
(.0256)  
BSC  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
24613f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
19  
LTC2461/LTC2463  
TYPICAL APPLICATION  
10μF  
V
V
CC  
V
1μF  
CC  
0.1μF  
0.1μF  
CC  
V
V
CC  
CC  
μC  
1
12  
5k  
5k  
REFOUT  
V
1k  
CC  
5
4
7
5
9
+
+
SCK/SCL  
MOSI/SDA  
MISO/SDO  
SCL  
IN  
IN  
LTC2463  
0.1μF  
1k  
6
3
SDA  
A0  
IN  
IN  
10  
GND  
8
COMP REF GND  
0.1μF  
0.1μF  
2
8
7, 11, 4  
0.1μF  
24613 TA02  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC1860/LTC1861  
12-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP  
850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP Packages  
450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP Packages  
850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP Packages  
450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP Packages  
3V Supply, 1.5mW at 100ksps, TSOT 6-pin/8-pin Packages  
LTC1860L/LTC1861L 12-Bit, 3V, 1-/2-Channel 150ksps SAR ADC  
LTC1864/LTC1865 16-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP  
LTC1864L/LTC1865L 16-bit, 3V, 1-/2-Channel 150ksps SAR ADC  
LTC2360  
LTC2440  
LTC2480  
12-Bit, 100ksps SAR ADC  
200nV  
Noise, 4kHz Output Rate, 15ppm INL  
24-Bit No Latency ΔΣADC  
RMS  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
Noise,  
Noise,  
Noise,  
Noise,  
Noise,  
Noise,  
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,  
Temp. Sensor, SPI  
RMS  
RMS  
RMS  
RMS  
RMS  
RMS  
LTC2481  
LTC2482  
LTC2483  
LTC2484  
LTC2485  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,  
2
Temp. Sensor, I C  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, SPI  
2
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, I C  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
24-Bit, Differential Input, No Latency ΔΣ ADC, SPI with  
Temp. Sensor  
2
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
24-Bit, Differential Input, No Latency ΔΣ ADC, I C with  
Temp. Sensor  
LTC6241  
LTC2450  
Dual, 18MHz, Low Noise, Rail-to-Rail Op Amp  
550nV Noise, 125μV Offset Max  
P-P  
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V  
Input Range  
2 LSB INL, 50nA Sleep current, Tiny 2mm × 2mm DFN-6 Package,  
30Hz Output Rate  
LTC2450-1  
LTC2451  
LTC2452  
LTC2453  
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V  
Input Range  
2 LSB INL, 50nA Sleep Current, Tiny 2mm × 2mm DFN-6 Package,  
60Hz Output Rate  
2
Easy-to-Use, Ultra-Tiny 16-Bit ADC, I C, 0V to 5.5V  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package, Programmable 30Hz/60Hz Output Rates  
Input Range  
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, SPI,  
5.5V Input Range  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package  
2
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, I C,  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package  
5.5V Input Range  
LTC2460  
LTC2462  
16-Bit, ΔΣ SPI ADC with 10ppm Max Reference  
16-Bit, ΔΣ SPI ADC with 10ppm Max Reference  
Single-Ended, Tiny 12-Lead 3mm × 3mm DFN and MSOP Packages  
Differential Input, Tiny 12-Lead 3mm × 3mm DFN and MSOP Packages  
No Latency ΔΣ is a trademark of Linear Technology Corporation.  
24613f  
LT 0609 • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
© LINEAR TECHNOLOGY CORPORATION 2009  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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