LTC3417AEFE [Linear]

Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator; 双通道同步1.5A / 1A 4MHz降压型DC / DC稳压器
LTC3417AEFE
型号: LTC3417AEFE
厂家: Linear    Linear
描述:

Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator
双通道同步1.5A / 1A 4MHz降压型DC / DC稳压器

稳压器 开关式稳压器或控制器 电源电路 开关式控制器
文件: 总20页 (文件大小:1109K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3417A  
Dual Synchronous  
1.5A/1A 4MHz  
Step-Down DC/DC Regulator  
U
FEATURES  
DESCRIPTIO  
The LTC®3417A is a dual constant frequency, synchro-  
nous step-down DC/DC converter. Intended for medium  
power applications, it operates from a 2.25V to 5.5V input  
voltage range and has a constant programmable switch-  
ingfrequency, allowingtheuseoftiny, lowcostcapacitors  
and inductors 2mm or less in height. Each output voltage  
is adjustable from 0.8V to 5V. Internal, synchronous, low  
RDS(ON) power switches provide high efficiency without  
the need for external Schottky diodes.  
High Efficiency: Up to 95%  
1.5A/1A Guaranteed Minimum Output Current  
Synchronizable to External Clock  
No Schottky Diodes Required  
Programmable Frequency Operation: 1.5MHz or  
Adjustable From 0.6MHz to 4MHz  
Low RDS(ON) Internal Switches  
Short-Circuit Protected  
VIN: 2.25V to 5.5V  
Current Mode Operation for Excellent Line and Load  
A user selectable mode input allows the user to trade off  
ripple voltage for light load efficiency. Burst Mode® opera-  
tion provides high efficiency at light loads, while Pulse  
Skipmodeprovideslowripplenoiseatlightloads.Aphase  
mode pin allows the second channel to operate in-phase  
or 180° out-of-phase with respect to channel 1. Out-of-  
phase operation produces lower RMS current on VIN and  
thus a lower RMS derating on the input capacitor.  
Transient Response  
125µA Quiescent Current in Sleep Mode  
Ultralow Shutdown Current: IQ < 1µA  
Low Dropout Operation: 100% Duty Cycle  
Power Good Output  
Phase Pin Selects 2nd Channel Phase Relationship  
with Respect to 1st Channel  
Internal Soft-Start with Individual Run Pin Control  
Available in Small Thermally Enhanced  
To further maximize battery life, the P-channel MOSFETs  
are turned on continuously in dropout (100% duty cycle)  
and both channels draw a total quiescent current of only  
100µA. In shutdown, the device draws <1µA.  
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.  
Burst Mode is a registered trademark of Linear Technology Corporation.  
All other trademarks are the property of their respective owners.  
Protected by U.S. Patents, including 5481178, 6580258, 6304066, 6127815, 6498466,  
6611131, 6144194  
(5mm × 3mm) DUFN and 20-Lead TSSOP Packages  
APPLICATIO S  
GPS/Navigation  
Digital Cameras  
PC Cards  
Wireless and DSL Modems  
General Purpose Point of Load DC/DC  
U
OUT2 Efficiency  
TYPICAL APPLICATIO  
(Burst Mode Operation)  
100  
95  
90  
85  
80  
75  
70  
10  
V
IN  
2.5V TO 5.5V  
REFER TO FIGURE 4  
10µF  
V
IN  
EFFICIENCY  
1
FREQ  
SW1  
1.5µH  
2.2µH  
V
V
2.5V  
1A  
OUT1  
1.8V  
1.5A  
OUT2  
SW2  
0.1  
22pF  
511k  
22pF  
866k  
RUN2  
V
IN  
RUN1  
V
IN  
LTC3417A  
0.01  
0.001  
0.0001  
V
FB2  
V
FB1  
POWER LOSS  
47µF  
412k  
22µF  
412k  
V
V
= 3.6V  
OUT  
FREQ = 1MHz  
I
IN  
I
TH2  
TH1  
= 2.5V  
5.9k  
2200pF  
2.87k  
GND  
0.001  
0.01  
0.1  
1
6800pF  
LOAD CURRENT (A)  
3417 TA01  
3417 TA01a  
3417afa  
1
LTC3417A  
ABSOLUTE AXI U RATI GS  
W W  
U W  
(Note 1)  
VIN1, VIN2 Voltages ..................................... 0.3V to 6V  
PGOOD Voltage .......................................... 0.3V to 6V  
Operating Ambient Temperature Range  
(Note 2) .................................................. 40°C to 85°C  
Junction Temperature (Notes 7, 8) ...................... 125°C  
Storage Temperature Range ................. 65°C to 125°C  
SYNC/MODE, SW1, SW2, RUN1,  
RUN2, VFB1, VFB2, PHASE, FREQ,  
ITH1, ITH2 Voltages ............. 0.3V to (VIN1/VIN2 + 0.3V)  
V
IN1 – VIN2, VIN2 – VIN1 ......................................... 0.3V  
U W  
U
PACKAGE/ORDER I FOR ATIO  
TOP VIEW  
ORDER PART  
NUMBER  
ORDER PART  
TOP VIEW  
NUMBER  
GNDD  
RUN1  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GNDD  
RUN1  
1
2
3
4
5
6
7
8
16 PGND1  
15 SW1  
PGND1  
SW1  
LTC3417AEDHC  
LTC3417AEFE  
LTC3417AIFE  
V
IN1  
V
IN1  
I
14 PHASE  
13 GNDA  
12 FREQ  
11 PGOOD  
10 SW2  
I
PHASE  
GNDA  
TH1  
TH1  
V
FB1  
V
FB1  
17  
21  
V
V
FB2  
FREQ  
FB2  
I
I
PGOOD  
SW2  
TH2  
TH2  
RUN2  
RUN2  
DHC PART MARKING  
3417A  
V
9
SYNC/MODE  
V
IN2  
SYNC/MODE  
PGND2  
IN2  
PGND2 10  
DHC PACKAGE  
16-LEAD (3mm × 5mm) PLASTIC DFN  
FE PACKAGE  
20-LEAD PLASTIC TSSOP  
TJMAX = 125°C, θJA = 43°C/ W  
EXPOSED PAD (PIN 17) IS PGND2/GNDD  
MUST BE SOLDERED TO PCB  
TJMAX = 125°C, θJA = 38°C/ W  
EXPOSED PAD (PIN 21) IS PGND2/GNDD  
MUST BE SOLDERED TO PCB  
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF  
Lead Free Part Marking: http://www.linear.com/leadfree/  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The  
denotes specifications which apply over the full operating temperature range, otherwise specifications are at T = 25°C.  
A
V
= 3.6V unless otherwise specified. (Note 2)  
IN  
SYMBOL  
, V  
PARAMETER  
CONDITIONS  
= V  
MIN  
TYP  
MAX  
5.5  
UNITS  
V
V
Operating Voltage Range  
Feedback Pin Input Current  
Feedback Voltage  
V
IN1  
2.25  
IN1 IN2  
IN2  
I
, I  
(Note 3)  
(Note 3)  
±0.1  
0.816  
0.2  
µA  
FB1 FB2  
V
, V  
0.784  
0.8  
V
FB1 FB2  
V  
Reference Voltage Line Regulation. %/V is the  
V
IN  
= 2.25V to 5V (Note 3)  
0.04  
%/V  
LINEREG  
LOADREG  
m(EA)  
Percentage Change in V  
with a Change in V  
OUT  
IN  
V
Output Voltage Load Regulation  
I
I
, I  
= 0.36V (Note 3)  
= 0.84V (Note 3)  
0.02  
–0.02  
0.2  
–0.2  
%
%
TH1 TH2  
, I  
TH1 TH2  
g
Error Amplifier Transconductance  
I
, I  
= ±5µA (Note 3)  
1400  
µS  
TH1 TH2(PINLOAD)  
I
Input DC Supply Current (Note 4)  
Active Mode  
S
V
V
= V = 0.75V, V  
= V ,  
400  
600  
µA  
FB1  
FB2  
SYNC/MODE  
IN  
= V  
= V  
RUN1  
RUN2  
IN  
3417afa  
2
LTC3417A  
ELECTRICAL CHARACTERISTICS  
The  
IN  
denotes specifications which apply over the full operating temperature range, otherwise specifications are at T = 25°C.  
A
V
= 3.6V unless otherwise specified. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
260  
260  
125  
MAX  
400  
400  
250  
UNITS  
µA  
I
Half Active Mode (V  
Half Active Mode (V  
= 0V, 1.5A Only)  
= 0V, 1A Only)  
V
= 0.75V, V  
= 0.75V, V  
= V , V  
= V  
= V  
S
RUN2  
FB1  
SYNC/MODE  
IN RUN1  
IN  
V
FB2  
= V , V  
µA  
RUN1  
SYNC/MODE  
IN RUN2  
IN  
Both Channels in Sleep Mode  
V
V
= V = 1V, V  
= V ,  
µA  
FB1  
FB2  
SYNC/MODE  
IN  
= V  
= V  
RUN1  
RUN2  
RUN2  
IN  
IN  
Shutdown  
V
= V  
= 0V  
0.1  
1
µA  
RUN1  
FREQ  
f
Oscillator Frequency  
V
V
V
= V  
1.2  
0.85  
1.5  
1
1.8  
1.25  
4
MHz  
MHz  
MHz  
OSC  
: R = 143k  
: Resistor (Note 6)  
FREQ  
FREQ  
T
I
I
Peak Switch Current Limit on SW1 (1.5A)  
Peak Switch Current Limit on SW2 (1A)  
2.1  
1.4  
2.5  
1.7  
A
A
LIM1  
LIM2  
R
SW1 Top Switch On-Resistance (1.5A)  
SW1 Bottom Switch On-Resistance  
V
V
= 3.6V (Note 5)  
= 3.6V (Note 5)  
0.088  
0.084  
DS(ON)1  
IN1  
IN1  
R
SW2 Top Switch On-Resistance (1A)  
SW2 Bottom Switch On-Resistance  
V
V
= 3.6V (Note 5)  
= 3.6V (Note 5)  
0.16  
0.15  
DS(ON)2  
IN2  
IN2  
I
I
Switch Leakage Current SW1 (1.5A)  
Switch Leakage Current SW2 (1A)  
Undervoltage Lockout Threshold  
V
V
= 6V, V  
= 6V, V  
= 0V, V  
= 0V, V  
= 0V  
= 0V  
0.01  
0.01  
1
1
µA  
µA  
SW1(LKG)  
SW2(LKG)  
IN1  
IN2  
ITH1  
ITH2  
RUN1  
RUN2  
V
V
V
, V Ramping Down  
IN1 IN2  
, V Ramping Up  
IN1 IN2  
1.9  
1.95  
2.07  
2.12  
2.2  
2.25  
V
V
UVLO  
T
Threshold for Power Good. Percentage  
V
V
V
or V Ramping Up, V  
= 0V  
–6  
–6  
%
%
PGOOD  
FB1  
FB2  
SYNC/MODE  
Deviation from V Steady State  
or V Ramping Down,  
FB  
FB1  
FB2  
(Typically 0.8V)  
= 0V  
SYNC/MODE  
R
Power Good Pull-Down On-Resistance  
RUN1, RUN2 Threshold  
160  
300  
1.5  
V
PGOOD  
V
V
, V  
0.3  
0.85  
RUN1 RUN2  
PHASE  
PHASE Threshold High-CMOS Levels  
PHASE Threshold Low-CMOS Levels  
V
–0.5  
V
IN  
0.5  
1
V
I
I
I
, I  
,
,
RUN1, RUN2, PHASE and SYNC/MODE  
Leakage Current  
V
= 6V, PV = 3V  
0.01  
µA  
RUN1 RUN2  
IN  
IN  
PHASE  
SYNC/MODE  
VTL  
SYNC/MODE Threshold Voltage Low  
SYNC/MODE Threshold Voltage High  
FREQ Threshold Voltage High  
0.5  
V
V
V
SYNC/MODE  
VTH  
VTH  
V
V
–0.5  
–0.5  
SYNC/MODE  
IN  
FREQ  
IN  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 5: Switch on-resistance is guaranteed by design and test correlation  
on the DHC package and by final test correlation on the FE package.  
Note 6: Variable frequency operation with resistor is guaranteed by design  
but not production tested and is subject to duty cycle limitations.  
Note 2: The LTC3417AE is guaranteed to meet specified performance from  
0°C to 85°C. Specifications over the –40°C to 85°C operating ambient  
temperature range are assured by design, characterization and correlation  
with statistical process controls. The LTC3417AI is guaranteed to meet  
performance specifications over the –40°C to 85°C operating temperature  
range.  
Note 7: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 8: T is calculated from the ambient temperature, T , and power  
J
A
Note 3: The LTC3417A is tested in feedback loop which servos V to the  
FB1  
dissipation, P , according to the following formula:  
D
midpoint for the error amplifier (V  
= 0.6V) and V to the midpoint for  
ITH1  
FB2  
LTC3417AEDHC: T = T + (P • 43°C/W)  
J
A
D
the error amplifier (V  
= 0.6V).  
ITH2  
LTC3417AEFE: T = T + (P • 38°C/W)  
J
A
D
Note 4: Total supply current is higher due to the internal gate charge being  
delivered at the switching frequency.  
3417afa  
3
LTC3417A  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
OUT1 Pulse Skipping  
OUT1 Forced Continuous  
Mode Operation  
OUT1 Burst Mode Operation  
Mode Operation  
V
V
V
OUT  
20mV/DIV  
OUT  
OUT  
20mV/DIV  
20mV/DIV  
I
I
I
L
L
L
250mA/DIV  
250mA/DIV  
250mA/DIV  
3417 G01  
3417 G02  
3417 G03  
V
V
LOAD  
= 3.6V  
2µs/DIV  
V
V
LOAD  
= 3.6V  
2µs/DIV  
V
= 3.6V  
IN  
2µs/DIV  
IN  
IN  
= 1.8V  
= 1.8V  
V
= 1.8V  
OUT  
OUT  
OUT  
LOAD  
I
= 100mA  
I
= 100mA  
I
= 100mA  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
OUT2 Pulse Skipping  
Mode Operation  
OUT2 Forced Continuous  
Mode Operation  
OUT2 Burst Mode Operation  
V
V
V
OUT  
20mV/DIV  
OUT  
OUT  
20mV/DIV  
20mV/DIV  
I
I
I
L
L
L
250mA/DIV  
250mA/DIV  
250mA/DIV  
3417 G04  
3417 G05  
3417 G06  
V
V
LOAD  
= 3.6V  
2µs/DIV  
V
V
LOAD  
= 3.6V  
2µs/DIV  
V
= 3.6V  
IN  
2µs/DIV  
IN  
IN  
= 2.5V  
= 2.5V  
V
= 2.5V  
OUT  
OUT  
OUT  
LOAD  
I
= 60mA  
I
= 60mA  
I
= 60mA  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
OUT1 Efficiency vs VIN  
(Burst Mode Operation)  
OUT1 Efficiency vs Load Current  
OUT2 Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
V
V
= 2.5V  
V
V
= 3.6V  
V
OUT  
= 1.8V  
IN  
OUT  
IN  
OUT  
= 1.8V  
= 2.5V  
95  
90  
85  
I
= 460mA  
LOAD  
I
= 1.4A  
LOAD  
Burst Mode  
OPERATION  
PULSE SKIP  
FORCED  
Burst Mode  
OPERATION  
PULSE SKIP  
FORCED  
80  
75  
70  
CONTINUOUS  
REFER TO FIGURE 4  
CONTINUOUS  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
4.5 5.5  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
2
2.5  
3
3.5  
4
5
LOAD CURRENT (A)  
LOAD CURRENT (A)  
V
IN  
(V)  
3417 G07  
3417 G08  
3417 G09  
3417afa  
4
LTC3417A  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
OUT2 Efficiency vs V  
IN  
Load Step OUT1  
Load Step OUT2  
(Pulse Skipping Mode)  
100  
95  
I
= 250mA  
LOAD  
V
V
OUT2  
100mV/DIV  
OUT1  
100mV/DIV  
I
= 800mA  
LOAD  
90  
85  
I
I
OUT2  
500mA/DIV  
OUT1  
500mA/DIV  
80  
75  
70  
3417 G11  
3417 G12  
V
V
I
= 3.6V  
100µs/DIV  
V
V
I
= 3.6V  
100µs/DIV  
IN  
OUT  
IN  
OUT  
V
= 2.5V  
OUT  
= 1.8V  
= 2.5V  
= 0.25A to 0.8A  
REFER TO FIGURE 4  
= 0.25A to 1.4A  
LOAD  
LOAD  
4
4.5 5.5  
5
2
2.5  
3
3.5  
REFER TO FIGURE 4  
REFER TO FIGURE 4  
V
IN  
(V)  
3417 G10  
Efficiency vs Frequency OUT1  
Efficiency vs Frequency OUT2  
R
vs V OUT1  
DS(ON) IN  
94  
92  
90  
0.105  
0.100  
0.095  
0.090  
0.085  
0.080  
T
= 27°C  
A
T
A =  
27°C  
V
V
= 3.6V  
IN  
= 1.8V  
= 300mA  
85  
OUT  
OUT  
I
P-CHANNEL SWITCH  
90  
88  
80  
75  
86  
84  
82  
70  
65  
60  
T
= 27°C  
A
V
V
= 3.6V  
IN  
= 2.5V  
= 100mA  
OUT  
OUT  
N-CHANNEL SWITCH  
2.5 3.5  
I
0
1
2
3
4
5
0
1
2
3
4
2
3
4
4.5  
5
5.5  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
V
IN  
(V)  
3417 G13  
3417 G14  
3417 G15  
R
vs V OUT2  
Frequency vs V  
IN  
Frequency vs Temperature  
DS(ON)  
IN  
15  
10  
5
0.20  
0.19  
0.18  
0.17  
6
4
T
A
= 27°C  
FREQ = V  
IN  
2
FREQ = 143k TO GROUND  
P-CHANNEL SWITCH  
0
0
–2  
–4  
–6  
–8  
–10  
FREQ = 143k TO GROUND  
–5  
–10  
–15  
0.16  
0.15  
0.14  
FREQ = V  
IN  
N-CHANNEL SWITCH  
50  
TEMPERATURE (˚C)  
100 125  
–50 –25  
0
25  
75  
4
5
5.5  
2
3.5  
V
5
5.5  
2
2.5  
3
3.5  
V
4.5  
2.5  
3
4
4.5  
(V)  
(V)  
IN  
IN  
3417 G17  
3417 G18  
3417 G16  
3417afa  
5
LTC3417A  
U
U
U
PI FU CTIO S (DFN/TSSOP)  
RUN1 (Pin 1/Pin 2): Enable for 1.5A Regulator. When at  
Logic 1, 1.5A regulator is running. When at 0V, 1.5A  
regulator is off. When both RUN1 and RUN2 are at 0V, the  
part is in shutdown.  
an external oscillator applied to this pin. When synchro-  
nized to an external clock, pulse skip mode is selected.  
SW2 (Pin 10/Pin 13): Switch Node Connection to the  
Inductor for the 1A Regulator. This pin swings from VIN2  
to PGND2.  
VIN1 (Pin 2/Pin 3): Supply Pin for P-Channel Switch of  
1.5A Regulator.  
PGOOD (Pin 11/Pin 14): Power Good Pin. This common  
drain-logic output is pulled to GND when the output  
voltage of either regulator is 6% of regulation. If either  
RUN1 or RUN2 is low (the respective regulator is in sleep  
mode and therefore the output voltage is low), then  
PGOOD reflects the regulation of the running regulator.  
I
TH1 (Pin 3/Pin 4): Error Amplifier Compensation Point for  
1.5A Regulator. The current comparator threshold in-  
creases with this control voltage. Nominal voltage range  
for this pin is 0V to 1.5V.  
VFB1 (Pin 4/Pin 5): Receives the feedback voltage from  
external resistive divider across the 1.5A regulator output.  
Nominal voltage for this pin is 0.8V.  
FREQ (Pin 12/Pin 15): Frequency Set Pin. When FREQ is  
at VIN, internal oscillator runs at 1.5MHz. When a resistor  
isconnectedfromthispintoground,theinternaloscillator  
frequency can be varied from 0.6MHz to 4MHz.  
VFB2 (Pin 5/Pin 6): Receives the feedback voltage from  
external resistive divider across the 1A regulator output.  
Nominal voltage for this pin is 0.8V.  
GNDA (Pin 13/Pin 16): Analog Ground Pin for Internal  
Analog Circuitry.  
I
TH2 (Pin 6/Pin 7): Error Amplifier Compensation Point for  
1A regulator. The current comparator threshold increases  
with this control voltage. Nominal voltage range for this  
pin is 0V to 1.5V.  
PHASE (Pin 14/Pin 17): Selects 1A regulator switching  
phase with respect to 1.5A regulator switching. Set to VIN,  
the1.5Aregulatorandthe1Aregulatorareinphase. When  
PHASEisat0V, the1.5Aregulatorandthe1Aregulatorare  
switching 180 degrees out-of-phase.  
RUN2 (Pin 7/Pin 8): Enable for 1A Regulator. When at  
Logic 1, 1A regulator is running. When at 0V, 1A regulator  
is off. When both RUN1 and RUN2 are at 0V, the part is in  
shutdown.  
SW1 (Pin 15/Pin 18): Switch Node Connection to the  
Inductorforthe1.5ARegulator. ThispinswingsfromVIN1  
to PGND1.  
V
IN2 (Pin 8/Pin 9): Supply Pin for P-Channel Switch of 1A  
Regulator and Supply for Analog Circuitry.  
PGND1 (Pin 16/Pin 19): Ground for SW1 N-Channel  
Driver.  
SYNC/MODE(Pin9/Pin12):CombinationModeSelection  
and Oscillator Synchronization Pin. This pin controls the  
operation of the device. When the voltage on the SYNC/  
MODE pin is >(VIN – 0.5V), Burst Mode operation is  
selected. When the voltage on the SYNC/MODE pin is  
<0.5V, pulse skipping mode is selected. When the SYNC/  
MODE pin is held at VIN/2, forced continuous mode is  
selected. Theoscillationfrequencycanbesynchronizedto  
PGND2, GNDD (Pins 1,10,11,20): TSSOP Package Only.  
Ground for SW2 N-channel driver and digital ground for  
circuit.  
Exposed Pad (Pin 17/Pin 21): PGND2, GNDD. Ground for  
SW2 N-channel driver and digital ground for circuit. The  
Exposed Pad must be soldered to PCB ground.  
3417afa  
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LTC3417A  
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FU CTIO AL DIAGRA  
1.5A REGULATOR  
I
V
IN1  
TH1  
I
TH  
LIMIT  
+
+
+
V
FB1  
V
B
SLOPE  
COMPENSATION  
+
0.752V  
ANTI-SHOOT-  
THROUGH  
SW1  
+
+
LOGIC  
0.848V  
+
PGND1  
PGOOD  
RUN1  
VOLTAGE  
REFERENCE  
V
IN2  
RUN2  
PHASE  
FREQ  
SYNC/MODE  
OSCILLATOR  
PGND2  
+
+
0.848V  
+
LOGIC  
+
SW2  
ANTI-SHOOT-  
THROUGH  
0.752V  
SLOPE  
COMPENSATION  
+
V
FB2  
V
B
+
+
I
TH  
LIMIT  
I
V
IN2  
TH2  
1A REGULATOR  
3417 BD  
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LTC3417A  
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OPERATIO  
The LTC3417A uses a constant frequency, current mode  
architecture. Both channels share the same clock fre-  
quency. The PHASE pin sets whether the channels are  
runningin-phaseoroutofphase. Theoperatingfrequency  
is determined by connecting the FREQ pin to VIN for  
1.5MHz operation or by connecting a resistor from FREQ  
to ground for a frequency from 0.6MHz to 4MHz. To suit  
a variety of applications, the SYNC/MODE pin allows the  
user to trade off noise for efficiency.  
Low Current Operation  
Three modes are available to control the operation of the  
LTC3417A at low currents. Each of the three modes  
automatically switch from continuous operation to the  
selected mode when the load current is low.  
To optimize efficiency, Burst Mode operation can be  
selected. When the load is relatively light, the LTC3417A  
automaticallyswitchesintoBurstModeoperationinwhich  
the PMOS switches operate intermittently based on load  
demand. By running cycles periodically, the switching  
losses, which are dominated by the gate charge losses of  
the power MOSFETs, are minimized. The main control  
loop is interrupted when the output voltage reaches the  
desired regulated value. The hysteresis voltage compara-  
tor trips when ITH is below 0.24V, shutting off the switch  
and reducing the power. The output capacitor and the  
inductor supply the power to the load until ITH exceeds  
0.31V, turning on the switch and the main control loop  
which starts another cycle.  
The output voltages are set by external dividers returned  
to the VFB1 and VFB2 pins. An error amplifier compares the  
dividedoutputvoltagewithareferencevoltageof0.8Vand  
adjusts the peak inductor current accordingly. Undervolt-  
age comparators will pull the PGOOD output low when  
either output voltage is 6% below its targeted value.  
Main Control Loop  
For each regulator, during normal operation, the P-chan-  
nel MOSFET power switch is turned on at the beginning of  
a clock cycle when the VFB voltage is below the reference  
voltage. The current into the inductor and the load in-  
creases until the current limit is reached. The switch turns  
off and energy stored in the inductor flows through the  
bottom N-channel MOSFET switch into the load until the  
next clock cycle.  
For lower output voltage ripple at low currents, pulse  
skipping mode can be used. In this mode, the LTC3417A  
continues to switch at constant frequency down to very  
low currents, where it will begin skipping pulses used to  
control the power MOSFETs.  
Finally, in forced continuous mode, the inductor current is  
constantly cycled creating a fixed output voltage ripple at  
all output current levels. This feature is desirable in tele-  
communications since the noise is a constant frequency  
and is thus easy to filter out. Another advantage of this  
mode is that the regulator is capable of both sourcing  
current into a load and sinking some current from the  
output.  
The peak inductor current is controlled by the voltage on  
the ITH pin, which is the output of the error amplifier. This  
amplifier compares the VFB pin to the 0.8V reference.  
WhentheloadcurrentincreasestheVFB voltagedecreases  
slightly below the reference. This decrease causes the  
error amplifier to increase the ITH voltage until the average  
inductor current matches the new load current.  
The main control loop is shut down by pulling the RUN pin  
to ground. A digital soft-start is enabled after shutdown,  
which will slowly ramp the peak inductor current up over  
1024 clock cycles.  
The mode selection for the LTC3417A is set using the  
SYNC/MODE pin. The SYNC/MODE pin sets the mode for  
both the1A and the 1.5A step-down DC/DC converters.  
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LTC3417A  
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OPERATIO  
Dropout Operation  
Low Supply Operation  
When the input supply voltage decreases toward the  
output voltage, the duty cycle increases to 100%. In this  
dropout condition, the PMOS switch is turned on continu-  
ously with the output voltage being equal to the input  
voltage minus the voltage drops across the internal P-  
channel MOSFET and inductor.  
The LTC3417A incorporates an undervoltage lockout cir-  
cuit which shuts down the part when the input voltage  
drops below about 2.07V to prevent unstable operation.  
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APPLICATIO S I FOR ATIO  
160  
140  
120  
100  
A general LTC3417A application circuit is shown in  
Figure 4. External component selection is driven by the  
load requirement, and begins with the selection of the  
inductors L1 and L2. Once L1 and L2 are chosen, CIN,  
C
OUT1 and COUT2 can be selected.  
80  
60  
Operating Frequency  
40  
20  
0
Selection of the operating frequency is a tradeoff between  
efficiency and component size. High frequency operation  
allows the use of smaller inductor and capacitor values.  
Operation at lower frequencies improves efficiency by  
reducing internal gate charge losses but requires larger  
inductance values and/or capacitance to maintain low  
output ripple voltage.  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
FREQUENCY (MHz)  
3417 F01  
Figure 1. Frequency vs R  
T
The operating frequency, fO, of the LTC3417A is deter-  
mined by pulling the FREQ pin to VIN for 1.5MHz operation  
orbyconnectinganexternalresistorfromFREQtoground.  
The value of the resistor sets the ramp current that is used  
tochargeanddischargeaninternaltimingcapacitorwithin  
the oscillator and can be calculated by using the following  
equation:  
VOUT  
fO(MAX) 6.67  
MHz  
(
)
V
IN(MAX)  
The minimum frequency is limited by leakage and noise  
coupling due to the large resistance of RT.  
Inductor Selection  
1.611011  
Although the inductor does not influence the operating  
frequency, the inductor value has a direct effect on ripple  
current. The inductor ripple current, IL, decreases with  
RT ≈  
– 16.586kΩ  
( )  
fO  
higher inductance and increases with higher VIN or VOUT  
.
for 0.6MHz fO 4MHz. Alternatively, use Figure 1 to  
select the value for RT.  
VOUT  
VOUT  
V
IN  
IL =  
1–  
The maximum operating frequency is also constrained by  
the minimum on-time and duty cycle. This can be calcu-  
lated as:  
fO L ⎝  
Accepting larger values of IL allows the use of low  
inductances, but results in higher output voltage ripple,  
greater core losses and lower output current capability.  
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9
LTC3417A  
APPLICATIO S I FOR ATIO  
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A reasonable starting point for setting ripple current is  
IL = 0.35ILOAD(MAX), where ILOAD(MAX) is the maximum  
current output. The largest ripple, IL, occurs at the  
maximum input voltage. To guarantee that the ripple  
current stays below a specified maximum, the inductor  
value should be chosen according to the following equa-  
tion:  
LTC3417A requires to operate. Table 1 shows some  
typical surface mount inductors that work well in  
LTC3417A applications.  
Input Capacitor (CIN) Selection  
Incontinuousmode, theinputcurrentoftheconvertercan  
be approximated by the sum of two square waves with  
duty cycles of approximately VOUT1/VIN and VOUT2/VIN. To  
prevent large voltage transients, a low equivalent series  
resistance (ESR) input capacitor sized for the maximum  
RMS current must be used. Some capacitors have a de-  
rating spec for maximum RMS current. If the capacitor  
being used has this requirement, it is necessary to calcu-  
late the maximum RMS current. The RMS current calcu-  
lation is different if the part is used in “in phase” or “out of  
phase”.  
VOUT  
fO IL  
VOUT  
V
IN(MAX)  
L =  
1–  
The inductor value will also have an effect on Burst Mode  
operation. The transition from low current operation be-  
gins when the peak inductor current falls below a level set  
by the burst clamp. Lower inductor values result in higher  
ripple current which causes this to occur at lower load  
currents. This causes a dip in efficiency in the upper range  
of low current operation. In Burst Mode operation, lower  
inductor values will cause the burst frequency to increase.  
For “in phase”, there are two different equations:  
V
OUT1 > VOUT2  
RMS = 2 I1 I2 D2(1D1)+I2 (D2 D22)+I1 (D1D1 )  
VOUT2 > VOUT1  
:
2
2
2
Inductor Core Selection  
I
Different core materials and shapes will change the size/  
current relationship of an inductor. Toroid or shielded pot  
cores in ferrite or permalloy materials are small and don’t  
radiate much energy, but generally cost more than pow-  
dered iron core inductors with similar electrical character-  
istics. The choice of which style inductor to use often  
depends more on the price vs size requirements of any  
radiated field/EMI requirements than on what the  
:
2
2
2
I
RMS = 2 I1 I2 D1(1D2)+I2 (D2 D22)+I1 (D1D1 )  
where:  
VOUT1  
V
IN  
VOUT2  
V
IN  
D1=  
and D2 =  
Table 1  
MANUFACTURER  
L1 on OUT1  
Toko  
PART NUMBER  
VALUE (µH)  
MAX DC CURRENT (A)  
DCR  
DIMENSIONS L × W × H (mm)  
A920CY-1R5M-D62CB  
A918CY-1R5M-D62LCB  
1.5  
1.5  
2.8  
2.9  
0.014 6 × 6 × 2.5  
0.018 6 × 6 × 2  
Coilcraft  
Sumida  
Midcom  
L2 on OUT2  
Toko  
DO1608C-152ML  
CDRH4D22/HP 1R5  
DUP-1813-1R4R  
1.5  
1.5  
1.4  
2.6  
3.9  
5.5  
0.06  
6.6 × 4.5 × 2.9  
0.031 5 × 5 × 2.4  
0.033 4.3 × 4.8 × 3.5  
A915AY-2R0M-D53LC  
DO1608C-222ML  
2.0  
2.2  
3.9  
2.3  
0.027 5 × 5 × 3  
Coilcraft  
Sumida  
0.07  
6.6 × 4.5 × 2.9  
CDRH3D16/HP 2R2  
CDRH2D18/HP 2R2  
2.2  
2.2  
1.75  
1.6  
0.047 4 × 4 × 1.8  
0.035 3.2 × 3.2 × 2  
Midcom  
DUP-1813-2R2R  
2.2  
3.9  
0.047 4.3 × 4.8 × 3.5  
3417afa  
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LTC3417A  
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When D1 = D2 then the equation simplifies to:  
Output Capacitor (COUT1 and COUT2) Selection  
The selection of COUT1 and COUT2 is driven by the required  
ESR to minimize voltage ripple and load step transients.  
Typically, once the ESR requirement is satisfied, the  
capacitance is adequate for filtering. The output ripple  
(VOUT) is determined by:  
IRMS = I +I D 1D  
(
)
(
)
1
2
or  
VOUT V – V  
(
)
IN  
OUT  
IRMS = I +I  
(
)
1
2
V
IN  
1
VOUT ≈ ∆I ESR  
+
L
COUT  
8 • fO COUT  
where the maximum average output currents I1 and I2  
equal the respective peak currents minus half the peak-to-  
peak ripple currents:  
wherefO=operatingfrequency,COUT=outputcapacitance  
and IL = ripple current in the inductor. The output ripple  
is highest at maximum input voltage, since IL increases  
with input voltage. With IL = 0.35ILOAD(MAX), the output  
ripple will be less than 100mV at maximum VIN and fO =  
1MHz with:  
IL1  
2
IL2  
2
I1 = ILIM1  
I2 = ILIM2  
ESRCOUT < 150mΩ  
These formula have a maximum at VIN = 2VOUT, where  
RMS = (I1 + I2)/2. This simple worst case is commonly  
used to determine the highest IRMS  
Once the ESR requirements for COUT have been met, the  
RMS current rating generally far exceeds the IRIPPLE(P-P)  
requirement, except for an all ceramic solution.  
I
.
For “out of phase” operation, the ripple current can be  
lower than the “in phase” current.  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or RMS  
current handling requirement of the application. Alumi-  
num electrolytic, special polymer, ceramic and dry tanta-  
lum capacitors are all available in surface mount pack-  
ages. The OS-CON semiconductor dielectric capacitor  
available from Sanyo has the lowest ESR(size) product of  
any aluminum electrolytic at a somewhat higher price.  
Special polymer capacitors, such as Sanyo POSCAP, offer  
very low ESR, but have a lower capacitance density than  
other types. Tantalum capacitors have the highest capaci-  
tance density, but it has a larger ESR and it is critical that  
the capacitors are surge tested for use in switching power  
supplies. An excellent choice is the AVX TPS series of  
surface tantalums, available in case heights ranging from  
2mm to 4mm. Aluminum electrolytic capacitors have a  
significantly larger ESR, and are often used in extremely  
cost-sensitive applications provided that consideration is  
In the “out of phase” case, the maximum IRMS does not  
occurwhenVOUT1=VOUT2. Themaximumtypicallyoccurs  
when VOUT1 – VIN/2 = VOUT2 or when VOUT2 – VIN/2 =  
V
OUT1. As a good rule of thumb, the amount of worst case  
ripple is about 75% of the worst case ripple in the “in  
phase” mode. Also note that when VOUT1 = VOUT2 = VIN/2  
and I1 = I2, the ripple is zero.  
Note that capacitor manufacturer’s ripple current ratings  
are often based on only 2000 hours lifetime. This makes it  
advisable to further derate the capacitor, or choose a  
capacitor rated at a higher temperature than required.  
Several capacitors may also be paralleled to meet the size  
or height requirements of the design. An additional 0.1µF  
to 1µF ceramic capacitor is also recommended on VIN for  
high frequency decoupling, when not using an all ceramic  
capacitor solution.  
3417afa  
11  
LTC3417A  
APPLICATIO S I FOR ATIO  
given to ripple current ratings and long term reliability.  
Ceramic capacitors have the lowest ESR and cost but also  
have the lowest capacitance density, high voltage and  
temperature coefficient and exhibit audible piezoelectric  
effects. In addition, the high Q of ceramic capacitors along  
with trace inductance can lead to significant ringing. Other  
capacitor types include the Panasonic specialty polymer  
(SP) capacitors.  
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instantaneously supply the current to support the load  
untilthefeedbackloopraisestheswitchcurrentenoughto  
support the load. The time required for the feedback loop  
to respond is dependent on the compensation compo-  
nentsandtheoutputcapacitorsize. Typically, 3to4cycles  
are required to respond to a load step, but only in the first  
cycle does the output drop linearly. The output droop,  
V
DROOP,isusuallyabout2to3timesthelineardroopofthe  
first cycle. Thus, a good place to start is with the output  
capacitor size of approximately:  
In most cases, 0.1µF to 1µF of ceramic capacitors should  
also be placed close to the LTC3417A in parallel with the  
main capacitors for high frequency decoupling.  
IOUT  
COUT 2.5  
fO VDROOP  
Ceramic Input and Output Capacitors  
More capacitance may be required depending on the duty  
cycle and load step requirements.  
Higher value, lower cost ceramic capacitors are now  
becomingavailableinsmallercasesizes.Thesearetempt-  
ing for switching regulator use because of their very low  
ESR. Unfortunately, the ESR is so low that it can cause  
loop stability problems. Solid tantalum capacitor ESR  
generatesaloopzeroat5kHzto50kHzthatisinstrumen-  
tal in giving acceptable loop phase margin. Ceramic ca-  
pacitors remain capacitive to beyond 300kHz and usually  
resonate with their ESL before ESR becomes effective.  
Also, ceramic capacitors are prone to temperature effects  
which require the designer to check loop stability over the  
operating temperature range. To minimize their large  
temperature and voltage coefficients, only X5R or X7R  
ceramic capacitors should be used. A good selection of  
ceramiccapacitorsisavailablefromTaiyoYuden,TDKand  
Murata.  
In most applications, the input capacitor is merely re-  
quired to supply high frequency bypassing, since the  
impedance to the supply is very low. A 10µF ceramic  
capacitor is usually enough for these conditions.  
Setting the Output Voltage  
The LTC3417A develops a 0.8V reference voltage between  
the feedback pins, VFB1 and VFB2, and the signal ground as  
shown in Figure 4. The output voltages are set by two  
resistive dividers according to the following formulas:  
R1  
R2  
VOUT1 0.8V 1+  
R3  
R4  
Great care must be taken when using only ceramic input  
and output capacitors. When a ceramic capacitor is used  
at the input and the power is being supplied through long  
wires,suchasfromawalladapter,aloadstepattheoutput  
can induce ringing at the VIN pin. At best, this ringing can  
couple to the output and be mistaken as loop instability. At  
worst, the ringing at the input can be large enough to  
damage the part.  
VOUT2 0.8V 1+  
Keeping the current small (<5µA) in these resistors maxi-  
mizes efficiency, but making the current too small may  
allow stray capacitance to cause noise problems and  
reduce the phase margin of the error amp loop.  
To improve the frequency response, a feed-forward ca-  
pacitor, CF, may also be used. Great care should be taken  
toroutetheVFB nodeawayfromnoisesources,suchasthe  
inductor or the SW line.  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must fulfill a charge storage require-  
ment. During a load step, the output capacitor must  
3417afa  
12  
LTC3417A  
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clock frequency to ensure adequate slope compensation,  
since slope compensation is derived from the internal  
oscillator. During synchronization, the mode is set to  
pulse skipping and the top switch turn-on is synchronized  
to the rising edge of the external clock.  
V
RUN  
2V/DIV  
V
OUT  
1V/DIV  
When using an external clock, with the PHASE pin low, the  
switching of the two channels occur at the edges of the  
external clock. A 50% duty cycle will therefore produce  
180° out-of-phase operation.  
I
L
1A/DIV  
V
V
= 3.6V  
200µs/DIV  
IN  
OUT  
= 0.9  
= 1.8V  
R
L
Checking Transient Response  
Figure 2. Digital Soft-Start OUT1  
TheITH pincompensationallowsthetransientresponseto  
be optimized for a wide range of loads and output capaci-  
tors. The availability of the ITH pin not only allows optimi-  
zation of the control loop behavior, but also provides a DC  
coupled and AC filtered closed-loop response test point.  
The DC step, rise time, and settling at this test point truly  
reflects the closed-loop response. Assuming a predomi-  
nantly second order system, phase margin and/or damp-  
ing factor can be estimated using the percentage of  
overshoot seen at this pin. The bandwidth can also be  
estimated using the percentage of overshoot seen at this  
pin or by examining the rise time at this pin.  
Soft-Start  
Soft-start reduces surge currents from VIN by gradually  
increasing the peak inductor current. Power supply se-  
quencing can also be accomplished by controlling the ITH  
pin. The LTC3417A has an internal digital soft-start for  
each regulator output, which steps up a clamp on ITH over  
1024clockcycles,ascanbeseeninFigures2and3.Asthe  
voltage on ITH ramps through its operating range, the  
internal peak current limit is also ramped at a proportional  
linear rate.  
Mode Selection  
The ITH external components shown in the Figure 4 circuit  
will provide an adequate starting point for most applica-  
tions. TheseriesRCfiltersetsthedominantpole-zeroloop  
compensation. The values can be modified slightly (from  
0.5to2timestheirsuggestedvalues)tooptimizetransient  
response once the final PC layout is done and the particu-  
lar output capacitor type and value have been determined.  
TheSYNC/MODEpinisamultipurposepinwhichprovides  
mode selection and frequency synchronization. Connect-  
ing this pin to VIN enables Burst Mode operation for both  
regulators, which provides the best low current efficiency  
at the cost of a higher output voltage ripple. When SYNC/  
MODEisconnectedtoground, pulseskippingoperationis  
selected for both regulators, which provides the lowest  
output voltage and current ripple at the cost of low current  
efficiency. Applying a voltage that is more than 1V from  
either supply results in forced continuous mode for both  
regulators, which creates a fixed output ripple and allows  
the sinking of some current (about 1/2IL). Since the  
switching noise is constant in this mode, it is also the  
easiest to filter out. In many cases, the output voltage can  
be simply connected to the SYNC/MODE pin, selecting the  
forced continuous mode except at start-up. The  
LTC3417A can also be synchronized to an external clock  
signal by the SYNC/MODE pin. The internal oscillator  
frequency should be set to 20% lower than the external  
V
RUN  
2V/DIV  
V
OUT  
1V/DIV  
I
L
0.5A/DIV  
V
V
R
= 3.6V  
= 2.5V  
= 2  
200µs/DIV  
IN  
OUT  
L
Figure 3. Digital Soft-Start OUT2  
3417afa  
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LTC3417A  
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The output capacitors need to be selected because of  
various types and values determine the loop feedback  
factor gain and phase. An output current pulse of 20% to  
100% of full load current having a rise time of 1µs to 10µs  
willproduceoutputvoltageandITH pinwaveformsthatwill  
give a sense of overall loop stability without breaking the  
feedback loop.  
Although a buck regulator is capable of providing the full  
output current in dropout, it should be noted that as the  
input voltage VIN drops toward VOUT, the load step capa-  
bility does decrease due to the decreasing voltage across  
the inductor. Applications that require large load step  
capability near dropout should use a different topology  
such as SEPIC, Zeta, or single inductor, positive buck  
boost.  
Switching regulators take several cycles to respond to a  
step in load current. When a load step occurs, VOUT  
In some applications, a more severe transient can be  
caused by switching in loads with large (>1µF) input  
capacitors.Thedischargedinputcapacitorsareeffectively  
put in parallel with COUT, causing a rapid drop in VOUT. No  
regulator can deliver enough current to prevent this prob-  
lem, if the switch connecting the load has low resistance  
and is driven quickly. The solution is to limit the turn-on  
speed of the load switch driver. A Hot SwapTM controller is  
designedspecificallyforthispurposeandusuallyincorpo-  
rates current limiting, short-circuit protection, and soft-  
starting.  
immediatelyshiftsbyanamountequaltoILOADESRCOUT  
,
where ESRCOUT is the effective series resistance of COUT  
.
ILOAD also begins to charge or discharge COUT generat-  
ing a feedback error signal used by the regulator to return  
V
V
OUT to its steady-state value. During this recovery time,  
OUT canbemonitoredforovershootorringingthatwould  
indicate a stability problem.  
The initial output voltage step may not be within the  
bandwidth of the feedback loop, so the standard second  
order overshoot/DC ratio cannot be used to determine  
phasemargin.ThegainoftheloopincreaseswithRITH and  
Efficiency Considerations  
the bandwidth of the loop increases with decreasing CITH  
.
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100. It  
is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Percent efficiency can be  
expressed as:  
If RITH is increased by the same factor that CITH is de-  
creased, the zero frequency will be kept the same, thereby  
keeping the phase the same in the most critical frequency  
range of the feedback loop. In addition, feedforward ca-  
pacitors, C1 and C2, can be added to improve the high  
frequency response, as shown in Figure 4. Capacitor C1  
providesphaseleadbycreatingahighfrequencyzerowith  
R1 which improves the phase margin for the 1.5A SW1  
channel. Capacitor C2 provides phase lead by creating a  
high frequency zero with R3 which improves the phase  
margin for the 1A SW2 channel.  
% Efficiency = 100% – (P1+ P2 + P3 +…)  
whereP1,P2,etc.aretheindividuallossesasapercentage  
of input power.  
Although all dissipative elements in the circuit produce  
losses, four main sources account for most of the losses  
in LTC3417A circuits: 1) LTC3417A IS current, 2) switch-  
ing losses, 3) I2R losses, 4) other losses.  
The output voltage settling behavior is related to the  
stability of the closed-loop system and will demonstrate  
the actual overall supply performance. For a detailed  
explanation of optimizing the compensation components,  
including a review of control loop theory, refer to Linear  
Technology Application Note 76.  
1) The IS current is the DC supply current given in the  
electrical characteristics which excludes MOSFET driver  
and control currents. IS current results in a small (<0.1%)  
loss that increases with VIN, even at no load.  
Hot Swap is a trademark of Linear Technology Corporation.  
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LTC3417A  
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APPLICATIO S I FOR ATIO  
2) The switching current is the sum of the MOSFET driver  
and control currents. The MOSFET driver current results  
fromswitchingthegatecapacitanceofthepowerMOSFETs.  
Each time a MOSFET gate is switched from low to high to  
low again, a packet of charge moves from VIN to ground.  
The resulting charge over the switching period is a current  
out of VIN that is typically much larger than the DC bias  
current.ThegatechargelossesareproportionaltoVIN and  
thus their effects will be more pronounced at higher  
supply voltages.  
3) I2R losses are calculated from the DC resistances of the  
internal switches, RSW, and the external inductor, RL. In  
continuous mode, the average output current flowing  
through inductor L is “chopped” between the internal top  
and bottom switches. Thus, the series resistance looking  
into the SW pin is a function of both top and bottom  
MOSFET RDS(ON) and the duty cycle (DC) as follows:  
Thermal Considerations  
TheLTC3417ArequiresthepackageExposedPad(PGND2/  
GNDD pin) to be well soldered to the PC board. This gives  
the DFN and TSSOP packages exceptional thermal prop-  
erties, compared to similar packages of this size, making  
it difficult in normal operation to exceed the maximum  
junction temperature of the part. In a majority of applica-  
tions, the LTC3417A does not dissipate much heat due to  
its high efficiency. However, in applications where the  
LTC3417A is running at high ambient temperature with  
low supply voltage and high duty cycles, such as in  
dropout, the heat dissipated may exceed the maximum  
junction temperature of the part. If the junction tempera-  
ture reaches approximately 150°C, both switches in both  
regulatorswillbeturnedoffandtheSWnodeswillbecome  
high impedance.  
To prevent the LTC3417A from exceeding its maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The tempera-  
ture rise is given by:  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
The RDS(ON) for both the top and bottom MOSFETs can be  
obtained from the Typical Performance Characteristics  
curves. Thus, to obtain I2R losses:  
I2R losses = IOUT2(RSW + RL)  
T
RISE = PD θJA  
where RL is the resistance of the inductor.  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
4)Otherhiddenlossessuchascoppertraceandinternal  
battery resistances can account for additional efficiency  
degradations in portable systems. It is very important to  
include these “system” level losses in the design of a  
system. The internal battery and fuse resistance losses  
can be minimized by making sure that CIN has adequate  
charge storage and very low ESRCOUT at the switching  
frequency.Otherlossesincludingdiodeconductionlosses  
during dead-time and inductor core losses generally ac-  
count for less than 2% total additional loss.  
The junction temperature, TJ, is given by:  
TJ = TRISE + TAMBIENT  
As an example, consider the case when the LTC3417A is  
in dropout in both regulators at an input voltage of 3.3V  
with load currents of 1.5A and 1A. From the Typical  
Performance Characteristics graph of Switch Resistance,  
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LTC3417A  
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APPLICATIO S I FOR ATIO  
the RDS(ON) resistance of the 1.5A P-channel switch is  
0.09and the RDS(ON) of the 1A P-channel switch is  
0.163. The power dissipated by the part is:  
Using the 1.5MHz frequency setting (FREQ = VIN), we get  
the following equations for L1 and L2:  
PD = I12 • RDS(ON)1 + I22 • RDS(ON)2  
PD = 1.52 • 0.09 + 12 • 0.163  
PD = 366mW  
1.8V  
1.5MHz • 525mA  
1.8V  
4.2V  
L1=  
1–  
= 1.3µH  
= 1.9µH  
Use 1.5µH.  
L2 =  
The DFN package junction-to-ambient thermal resistance,  
θJA, is about 43°C/W. Therefore, the junction temperature  
of the regulator operating in a 70°C ambient temperature  
is approximately:  
2.5V  
1.5MHz • 350mA  
2.5V  
4.2V  
1–  
Use 2.2µH.  
TJ = 0.366 • 43 + 70  
COUT selection is based on load step droop instead of ESR  
requirements. For a 2.5% output droop:  
TJ = 85.7°C  
Remembering that the above junction temperature is  
obtained from an RDS(ON) at 25°C, we might recalculate  
the junction temperature based on a higher RDS(ON) since  
it increases with temperature. However, we can safely  
assume that the actual junction temperature will not  
exceed the absolute maximum junction temperature of  
125°C.  
1.5A  
COUT1 = 2.5 •  
= 28µF  
= 13µF  
1.5MHz 5% • 1.8V  
(
)
1A  
COUT2 = 2.5 •  
1.5MHz 5% • 2.5V  
(
)
Design Example  
The closest standard values are 47µF and 22µF.  
As a design example, consider using the LTC3417A in a  
portable application with a Li-Ion battery. The battery  
provides a VIN from 2.8V to 4.2V. One load requires 1.8V  
at 1.5A in active mode, and 1mA in standby mode. The  
other load requires 2.5V at 1A in active mode, and 500µA  
in standby mode. Since both loads still need power in  
standby, Burst Mode operation is selected for good low  
load efficiency (SYNC/MODE = VIN).  
Theoutputvoltagescannowbeprogrammedbychoosing  
the values of R1, R2, R3, and R4. To maintain high  
efficiency, the current in these resistors should be kept  
small. Choosing 2µA with the 0.8V feedback voltages  
makes R2 and R4 equal to 400k. A close standard 1%  
resistor is 412k. This then makes R1 = 515k. A close  
standard 1% is 511k. Similarily, with R4 at 412k, R3 is  
equal to 875k. A close 1% resistor is 866k.  
First, determine what frequency should be used. Higher  
frequency results in a lower inductor value for a given IL  
(IL is estimated as 0.35ILOAD(MAX)). Reasonable values  
for wire wound surface mount inductors are usually in the  
range of 1µH to 10µH.  
The compensation should be optimized for these compo-  
nents by examining the load step response, but a good  
placetostartfortheLTC3417Aiswitha5.9kand2200pF  
filter on ITH1 and 2.87k and 6800pF on ITH2. The output  
capacitor may need to be increased depending on the  
actual undershoot during a load step.  
CONVERTER OUTPUT  
I
I  
L
LOAD(MAX)  
The PGOOD pin is a common drain output and requires a  
pull-up resistor. A 100k resistor is used for adequate  
speed. Figure 4 shows a complete schematic for this  
design.  
SW1  
SW2  
1.5A  
525mA  
350mA  
1A  
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LTC3417A  
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APPLICATIO S I FOR ATIO  
V
IN  
2.25V TO 5.5V  
C
C
C
R7  
100k  
IN  
IN1  
0.1µF  
IN2  
0.1µF  
10µF  
V
V
IN1 IN2  
L1  
1.5µH  
L2  
2.2µH  
SYNC/MODE PGOOD  
V
V
2.5V  
1A  
OUT1  
1.8V  
OUT2  
SW1  
SW2  
C1 22pF  
C2 22pF  
R3 866k  
1.5A  
V
V
RUN1  
RUN2  
IN  
IN  
IN  
LTC3417A  
R1 511k  
V
V
FB2  
FB1  
C
C
R2  
412k  
R4  
412k  
OUT1  
47µF  
OUT2  
22µF  
V
PHASE  
FREQ  
I
I
TH1  
TH2  
EXPOSED  
R5  
5.9k  
R6  
2.87k  
GNDA PAD GNDD  
C3  
2200pF  
C4  
6800pF  
3417 F04  
L1: MIDCOM DUS-5121-1R5R  
: KEMET C1210C226K8PAC  
L2: MIDCOM DUS-5121-2R2R  
C , C : KEMET C1206C106K4PAC  
OUT2 IN  
C
OUT1  
OUT1 Efficiency vs Load Current  
100  
10  
V
V
= 3.6V  
IN  
OUT  
= 1.8V  
FREQ = 1MHz  
95  
90  
REFER TO FIGURE 4  
1
EFFICIENCY  
0.1  
0.01  
0.001  
85  
80  
POWER LOSS  
75  
70  
0.001  
0.01  
0.1  
1
10  
LOAD CURRENT (A)  
3417 F04a  
Figure 4. 1.8V at 1.5A/2.5V at 1A Step-Down Regulators  
3417afa  
17  
LTC3417A  
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APPLICATIO S I FOR ATIO  
Board Layout Considerations  
must be connected between the (+) plate of COUT2 and  
a ground line terminated near GNDA. The feedback  
signalsVFB1 andVFB2 shouldberoutedawayfromnoise  
components and traces, such as the SW lines, and its  
trace should be minimized.  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3417A. These items are also illustrated graphically in  
the layout diagram of Figure 5. Check the following in your  
layout.  
4. Keep sensitive components away from the SW pins.  
The input capacitor CIN, the compensation capacitors  
CC1, CC2, CITH1 and CITH2 and all resistors R1, R2, R3,  
R4,RITH1andRITH2 shouldberoutedawayfromtheSW  
traces and the inductors L1 and L2.  
1
. Does the capacitor CIN connect to the power VIN1  
(Pin 2), VIN2 (Pin 8), and PGND2/GNDD (Pin 17) as  
close as possible (DFN package)? It may be necessary  
tosplitCIN intotwocapacitors.Thiscapacitorprovides  
the AC current to the internal power MOSFETs and  
their drivers.  
5. Agroundplaneispreferred,butifnotavailable,keepthe  
signal and power grounds segregated with small signal  
components returning to the GNDA pin at one point  
which is then connected to the PGND2/GNDD pin.  
2. AretheCOUT1,L1 andCOUT2,L2 closelyconnected?The  
(–) plate of COUT1 returns current to PGND1, and the  
(–) plate of COUT2 returns current to the PGND2/GNDD  
and the (–) plate of CIN.  
6. Flood all unused areas on all layers with copper. Flood-  
ing with copper will reduce the temperature rise of  
power components. These copper areas should be  
connected to one of the input supplies.  
3. The resistor divider, R1 and R2, must be connected  
between the (+) plate of COUT1 and a ground line  
terminated near GNDA. The resistor divider, R3 and R4,  
V
IN  
V
V
IN1  
IN2  
C
C
C
IN1  
0.1µF  
IN  
IN2  
10µF  
0.1µF  
PGND2/  
EXPOSED PAD  
PGND1  
GNDA  
SW2  
C
V
C
V
OUT2  
OUT2  
OUT1  
OUT1  
L2  
L1  
SW1  
C
C2  
C
C1  
R3  
R4  
R1  
R2  
LTC3417A  
V
V
FB1  
FB2  
STAR TO  
GNDA  
STAR TO  
GNDA  
R
R
ITH2  
ITH1  
R7  
I
I
TH2  
TH1  
C
C
ITH1  
ITH2  
R8  
V
IN  
PGOOD  
FREQ  
V
RUN2  
RUN1  
IN  
PHASE  
SYNC/MODE  
GNDD  
Figure 5. Layout Guideline  
3417afa  
18  
LTC3417A  
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PACKAGE DESCRIPTIO  
DHC Package  
16-Lead Plastic DFN (5mm × 3mm)  
(Reference LTC DWG # 05-08-1706)  
R = 0.115  
0.40 ± 0.10  
5.00 ±0.10  
(2 SIDES)  
TYP  
16  
9
R = 0.20  
TYP  
0.65 ±0.05  
3.50 ±0.05  
1.65 ±0.05  
3.00 ±0.10 1.65 ± 0.10  
PACKAGE  
OUTLINE  
2.20 ±0.05 (2 SIDES)  
(2 SIDES)  
(2 SIDES)  
PIN 1  
PIN 1  
NOTCH  
TOP MARK  
(DHC16) DFN 1103  
(SEE NOTE 6)  
8
1
0.25 ± 0.05  
0.50 BSC  
0.75 ±0.05  
0.200 REF  
0.25 ± 0.05  
0.50 BSC  
4.40 ±0.10  
4.40 ±0.05  
(2 SIDES)  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
NOTE:  
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC  
PACKAGE OUTLINE MO-229  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
FE Package  
20-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663)  
Exposed Pad Variation CA  
6.40 – 6.60*  
(.252 – .260)  
4.95  
(.195)  
4.95  
(.195)  
20 1918 17 16 15 14 1312 11  
6.60 ±0.10  
2.74  
(.108)  
4.50 ±0.10  
6.40  
2.74  
(.108)  
SEE NOTE 4  
(.252)  
BSC  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
9 10  
RECOMMENDED SOLDER PAD LAYOUT  
1.20  
(.047)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0.25  
REF  
0° – 8°  
0.65  
(.0256)  
BSC  
0.09 – 0.20  
(.0035 – .0079)  
0.50 – 0.75  
(.020 – .030)  
0.05 – 0.15  
(.002 – .006)  
FE20 (CA) TSSOP 0204  
0.195 – 0.30  
(.0077 – .0118)  
TYP  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
3417afa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
19  
LTC3417A  
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ThinSOT is a trademark of Linear Technology Corporation.  
3417afa  
LT/LWI 0906 REV A • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
©LINEAR TECHNOLOGY CORPORATION 2006  

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Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator
Linear

LTC3417AEFE-2-TRPBF

Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator
Linear

LTC3417AIDHC-1-PBF

Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator with POR
Linear

LTC3417AIDHC-1-TRPBF

Dual Synchronous 1.5A/1A 4MHz Step-Down DC/DC Regulator with POR
Linear