LTC3616IUDD#PBF [Linear]

LTC3616 - 6A, 4MHz Monolithic Synchronous Step-Down DC/DC Converter; Package: QFN; Pins: 24; Temperature Range: -40°C to 85°C;
LTC3616IUDD#PBF
型号: LTC3616IUDD#PBF
厂家: Linear    Linear
描述:

LTC3616 - 6A, 4MHz Monolithic Synchronous Step-Down DC/DC Converter; Package: QFN; Pins: 24; Temperature Range: -40°C to 85°C

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LTC3616  
6A, 4MHz Monolithic  
Synchronous Step-Down  
DC/DC Converter  
DescripTion  
FeaTures  
The LTC®3616 is a low quiescent current monolithic syn-  
chronous buck regulator using a current mode, constant  
n
6A Output Current  
n
2.25V to 5.5V Input Voltage Range  
Low Output Ripple Burst Mode® Operation: I = 75µA frequency architecture. The no-load DC supply current  
n
Q
n
n
n
n
n
±±1 Output Voltage Accuracy  
in sleep mode is only 70µA while maintaining the output  
voltage (Burst Mode operation) at no load, dropping to  
zero current in shutdown. The 2.25V to 5.5V input supply  
voltage range makes the LTC3616 ideally suited for single  
Li-Ionaswellasfixedlowvoltageinputapplications.100%  
duty cycle capability provides low dropout operation,  
extending the operating timein battery-powered systems.  
Output Voltage Down to 0.6V  
High Efficiency: Up to 951  
Low Dropout Operation: 100% Duty Cycle  
Programmable Slew Rate on SW Node Reduces  
Noise and EMI  
n
n
Adjustable Switching Frequency: Up to 4MHz  
Optional Active Voltage Positioning (AVP) with  
Internal Compensation  
The operating frequency is externally programmable up to  
4MHz, allowing the use of small surface mount inductors.  
For switching noise-sensitive applications, the LTC3616  
can be synchronized to an external clock at up to 4MHz.  
n
Selectable Pulse-Skipping/Forced Continuous/Burst  
Mode Operation with Adjustable Burst Clamp  
Programmable Soft-Start  
n
n
n
n
ForcedcontinuousmodeoperationintheLTC3616reduces  
noiseandRFinterference.Adjustablecompensationallows  
the transient response to be optimized over a wide range  
of loads and output capacitors.  
Inputs for Start-Up Tracking or External Reference  
DDR Memory Mode, I  
= 3A  
OUT  
Available in a 24-Pin 3mm × 5mm QFN  
Thermally Enhanced Package  
The internal synchronous switch increases efficiency and  
eliminates the need for an external catch diode, saving  
external components and board space. The LTC3616  
is offered in a leadless 24-pin 3mm × 5mm thermally  
enhanced QFN package.  
applicaTions  
n
Point-of-Load Supplies  
n
Distributed Power Supplies  
n
Portable Computer Systems  
n
DDR Memory Termination  
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks  
of Linear Technology Corporation. All other trademarks are the property of their respective owners.  
Protected by U.S. Patents, including 6580258, 5481178, 5994885, 6304066, 6498466, 6611131.  
n
Handheld Devices  
Efficiency and Power Loss  
Typical applicaTion  
vs Load Current  
100  
V
IN  
2.7V TO 5.5V  
90  
22µF  
×4  
SV  
PV  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
IN  
IN  
RUN  
SRLIM/DDR  
TRACK/SS  
RT/SYNC  
0.1  
0.01  
0
220nH  
V
2.5V  
6A  
OUT  
LTC3616  
SW  
SGND  
PGND  
PGOOD  
ITH  
47µF  
×2  
MODE  
V
FB  
665k  
3616 TA01a  
V
V
V
= 2.8V  
= 3.3V  
= 5V  
IN  
IN  
IN  
210k  
V
= 2.5V  
10  
OUT  
1
100  
1000  
10000  
OUTPUT CURRENT (mA)  
3616 TA01b  
3616fc  
1
For more information www.linear.com/LTC3616  
LTC3616  
absoluTe MaxiMuM raTings  
pin conFiguraTion  
(Note ±)  
TOP VIEW  
PV , SV Voltages ..................................... –0.3V to 6V  
IN  
IN  
SW Voltage ................................. –0.3V to (PV + 0.3V)  
IN  
ITH, RT/SYNC Voltages............... –0.3V to (SV + 0.3V)  
IN  
24 23 22 21  
SRLIM, TRACK/SS Voltages ....... –0.3V to (SV + 0.3V)  
IN  
MODE, RUN, V Voltages .......... –0.3V to (SV + 0.3V)  
FB  
IN  
SRLIM/DDR  
RT/SYNC  
SGND  
PGOOD  
RUN  
1
2
3
4
5
6
7
8
20  
19  
18  
17  
16  
15  
14  
13  
PGOOD Voltage............................................ –0.3V to 6V  
Operating Junction Temperature Range  
SV  
IN  
(Notes 2, 11) .......................................... –55°C to 150°C  
Storage Temperature.............................. –65°C to 150°C  
Reflow Peak Body Temperature (QFN)..................260°C  
PV  
IN  
PV  
IN  
25  
SW  
SW  
SW  
SW  
SW  
SW  
SW  
SW  
9
10 11 12  
UDD PACKAGE  
24-LEAD (3mm × 5mm) PLASTIC QFN  
= 150°C, θ = 38°C/W  
T
JMAX  
JA  
EXPOSED PAD (PIN 25) IS PGND, MUST BE SOLDERED TO PCB  
orDer inForMaTion  
LEAD FREE FINISH  
LTC3616EUDD#PBF  
LTC3616IUDD#PBF  
LTC3616HUDD#PBF  
LTC3616MPUDD#PBF  
TAPE AND REEL  
PART MARKING*  
LDYG  
PACKAGE DESCRIPTION  
24-Lead (3mm × 5mm) Plastic QFN  
TEMPERATURE RANGE  
–40°C to 125°C  
LTC3616EUDD#TRPBF  
LTC3616IUDD#TRPBF  
LTC3616HUDD#TRPBF  
LDYG  
24-Lead (3mm × 5mm) Plastic QFN  
24-Lead (3mm × 5mm) Plastic QFN  
24-Lead (3mm × 5mm) Plastic QFN  
–40°C to 125°C  
–40°C to 150°C  
–55°C to 150°C  
LDYG  
LTC3616MPUDD#TRPBF LDYG  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
3616fc  
2
For more information www.linear.com/LTC3616  
LTC3616  
elecTrical characTerisTics The l denotes the specifications which apply over the specified operating  
junction temperature range, otherwise specifications are at TJ = 25°C (Note 2). VIN = 3.3V, RT/SYNC = SVIN unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
2.25  
1.7  
TYP  
MAX  
UNITS  
l
V
V
Operating Voltage Range  
Undervoltage Lockout Threshold  
5.5  
V
IN  
l
l
SV Ramping Down  
V
V
UVLO  
IN  
SV Ramping Up  
2.25  
IN  
V
FB  
Feedback Voltage Internal Reference  
(Note 3) V  
= SV , V = 0V  
IN DDR  
TRACK  
0°C < T < 85°C  
0.594  
0.591  
0.589  
0.6  
0.606  
0.609  
0.609  
V
V
V
J
l
l
–40°C < T < 125°C  
J
–55°C < T < 150°C  
J
Feedback Voltage External Reference  
(Note 7)  
(Note 3) V  
(Note 3) V  
= 0.3V, V  
= SV  
= SV  
0.275  
0.475  
0.300  
0.500  
0.325  
0.525  
30  
V
V
TRACK  
TRACK  
DDR  
IN  
IN  
= 0.5V, V  
DDR  
l
I
Feedback Input Current  
Line Regulation  
V
= 0.6V  
FB  
nA  
FB  
V  
LINEREG  
SV = PV = 2.25V to 5.5V  
IN IN  
(Notes 3, 4) TRACK/SS = SV  
IN  
l
l
–40°C < T < 125°C  
0.2  
0.3  
%/V  
%/V  
J
–55°C < T < 150°C  
J
V  
Load Regulation  
ITH from 0.5V to 0.9V (Notes 3, 4)  
0.25  
2.6  
%
%
LOADREG  
V
V
V
= SV (Note 5)  
IN  
ITH  
I
Active Mode  
Sleep Mode  
= 0.5V, V  
= 0.7V, V  
= SV (Note 6)  
1100  
75  
µA  
µA  
S
FB  
MODE  
IN  
= 0V, ITH = SV  
100  
FB  
MODE  
IN  
(Note 5)  
V
= 0.7V, V  
= 0V (Note 4)  
130  
0.1  
35  
175  
1
µA  
µA  
FB  
MODE  
Shutdown  
SV = PV = 5.5V, V  
= 0V  
IN  
IN  
RUN  
R
Top Switch On-Resistance  
Bottom Switch On-Resistance  
Top Switch Current Limit  
PV = 3.3V (Note 10)  
mΩ  
mΩ  
DS(ON)  
IN  
PV = 3.3V (Note 10)  
25  
IN  
I
Sourcing (Note 8), V = 0.5V  
LIM  
FB  
Duty Cycle <35%  
10.5  
7.6  
12  
–8  
13.5  
–11  
A
A
Duty Cycle = 100%  
Bottom Switch Current Limit  
Sinking (Note 8), V = 0.7V,  
–6  
A
FB  
Forced Continuous Mode  
g
Error Amplifier Transconductance  
–5µA < I < 5µA (Note 4)  
200  
30  
µS  
µA  
m(EA)  
ITH  
I
Error Amplifier Maximum Output  
Current  
(Note 4)  
EAO  
t
SS  
Internal Soft-Start Time  
V
from 0.06V to 0.54V,  
FB  
0.65  
1.2  
1.9  
ms  
TRACK/SS = SV  
IN  
V
Enable Internal Soft-Start  
(Note 7 )  
0.62  
60  
V
µs  
Ω
TRACK/SS  
t
Soft-Start Discharge Time at Start-Up  
TRACK/SS_DIS  
R
TRACK/SS Pull-Down Resistor at  
Start-Up  
200  
ON(TRACK/SS_DIS)  
l
l
f
Oscillator Frequency  
RT/SYNC = 370k  
= SV  
0.8  
1.8  
0.3  
1.2  
.
1
1.2  
2.7  
4
MHz  
MHz  
MHz  
V
OSC  
Internal Oscillator Frequency  
Synchronization Frequency Range  
SYNC Level High  
V
2.25  
RT/SYNC  
IN  
f
SYNC  
V
RT/SYNC  
SYNC Level Low  
0.3  
1
V
I
Switch Leakage Current  
DDR Option Enable Voltage  
SV = PV = 5.5V, V = 0V  
RUN  
0.1  
µA  
V
SW(LKG)  
IN  
IN  
V
SV – 0.3  
IN  
DDR  
3616fc  
3
For more information www.linear.com/LTC3616  
LTC3616  
elecTrical characTerisTics The l denotes the specifications which apply over the specified operating  
junction temperature range, otherwise specifications are at TJ = 25°C (Note 2). VIN = 3.3V, RT/SYNC = SVIN unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Internal Burst Mode Operation  
Pulse-Skipping Mode  
0.3  
V
V
V
V
MODE  
(Note 9)  
SV – 0.3  
IN  
Forced Continuous Mode  
External Burst Mode Operation  
Power Good Voltage Windows  
1.1  
SV • 0.58  
IN  
0.45  
0.8  
PGOOD  
TRACK/SS = SV , Entering Window  
IN  
V
V
Ramping Up  
–3  
3
–6  
6
%
%
FB  
FB  
Ramping Down  
TRACK/SS = SV , Leaving Window  
IN  
V
V
Ramping Up  
9
–9  
11  
–11  
%
%
FB  
FB  
Ramping Down  
t
Power Good Blanking Time  
Power Good Pull-Down On-Resistance  
RUN Voltage  
Entering and Leaving Window  
70  
8
105  
17  
140  
33  
µs  
Ω
PGOOD  
R
PGOOD  
RUN  
l
l
V
Input High  
Input Low  
1
V
V
0.4  
Note ±: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 2: The LTC3616 is tested under pulsed load conditions such that T ≈  
T . The LTC3616E is guaranteed to meet specifications from 0°C to 85°C  
A
Note 3: This parameter is tested in a feedback loop which servos V to  
FB  
the midpoint for the error amplifier (V = 0.75V).  
ITH  
Note 4: External compensation on ITH pin.  
Note 5: Tying the ITH pin to SV enables the internal compensation and  
IN  
J
AVP mode.  
Note 6: Dynamic supply current is higher due to the internal gate charge  
junction temperature. Specifications over the –40°C to 125°C operating  
junction temperature range are assured by design, characterization  
and correlation with statistical process controls. The LTC3616I is  
guaranteed to meet specifications over the –40°C to 125°C operating  
junction temperature, the LTC3616H is guaranteed to meet specifications  
over the –40°C to 150°C operating junction temperature range and the  
LTC36146MP is guaranteed and tested to meet specifications over the  
full –55°C to 150°C operating junction temperature range. High junction  
temperatures degrade operating lifetimes; operating lifetime is derated  
for temperature greater than 125°C. Note that the maximum ambient  
temperature consistent with these specifications is determined by specific  
operating conditions in conjunction with board layout, the rated package  
thermal impedance and other environmental factors.  
being delivered at the switching frequency.  
Note 7: See description of the TRACK/SS pin in the Pin Functions section.  
Note 8: In sourcing mode the average output current is flowing out of SW  
pin. In sinking mode the average output current is flowing into the SW Pin.  
Note 9: See description of the MODE pin in the Pin Functions section.  
Note ±0: Guaranteed by correlation and design to wafer level  
measurements for QFN packages.  
Note ±±: This IC includes overtemperature protection that is intended  
to protect the device during momentary overload conditions. Junction  
temperature will exceed 150°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
The junction temperature (T ) is calculated from the ambient temperature  
J
(T ) and power dissipation (P ) according to the formula: T = T + (P  
A
D
J
A
D
θ °C/W), where θ is the package thermal impedance. The maximum  
JA  
JA  
ambient temperature is determined by specific operating conditions in  
conjunction with board layout, the rated package thermal resistance and  
other environmental factors.  
3616fc  
4
For more information www.linear.com/LTC3616  
LTC3616  
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN unless otherwise noted.  
Efficiency vs Load Current  
Burst Mode Operation (VMODE = 0V)  
Efficiency vs Load Current  
Burst Mode Operation (VMODE = 0V)  
Efficiency vs Load Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 1.8V  
V
= 1.8V, V = 3.3V  
IN  
V
= 1.2V  
OUT  
OUT  
OUT  
V
V
V
= 2.5V  
= 3.3V  
= 5V  
V
V
V
= 2.5V  
= 3.3V  
= 5V  
Burst Mode OPERATION  
IN  
IN  
IN  
IN  
IN  
IN  
PULSE-SKIPPING  
FORCED CONTINUOUS  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
OUTPUT CURRENT (mA)  
OUTPUT CURRENT (mA)  
OUTPUT CURRENT (mA)  
3616 G01  
3616 G02  
3616 G03  
Efficiency vs Frequency  
Burst Mode Operation  
(VMODE = 0V), IOUT = 2A  
Efficiency vs Input Voltage  
Burst Mode Operation  
(VMODE = 0V)  
Load Regulation  
(VIN = 3.3V, VOUT = ±.8V)  
95  
94  
93  
92  
91  
90  
89  
88  
87  
86  
85  
84  
83  
82  
1.5  
1.3  
100  
90  
80  
70  
60  
50  
40  
30  
FORCED CONTINUOUS MODE  
PULSE-SKIPPING MODE  
INTERNAL Burst Mode OPERATION  
V
V
= 3.3V  
OUT  
V
= 1.8V  
IN  
OUT  
= 1.8V  
1.1  
0.9  
0.7  
0.5  
0.3  
I
I
I
I
= 6mA  
0.1  
OUT  
OUT  
OUT  
OUT  
150nH  
330nH  
470nH  
= 600mA  
= 2A  
–0.1  
–0.3  
= 6A  
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
0
2000 3000 4000 5000 6000  
OUTPUT CURRENT (mA)  
1000  
2.5  
3
3.5  
4
4.5  
5
5.5  
FREQUENCY (MHz)  
INPUT VOLTAGE (V)  
3616 G05  
3616 G06  
3616 G04  
Line Regulation  
Burst Mode Operation  
Pulse-Skipping Mode Operation  
0.3  
0.2  
V
V
OUT  
OUT  
0.1  
20mV/DIV  
20mV/DIV  
0
–0.1  
–0.2  
–0.3  
I
L
I
L
1A/DIV  
1A/DIV  
3616 G08  
3616 G09  
V
I
= 1.8V  
= 150mA  
= 0V  
20µs/DIV  
V
I
= 1.8V  
= 150mA  
= 3.3V  
20µs/DIV  
2.20  
3.30 3.85 4.40  
INPUT VOLTAGE (V)  
4.95 5.50  
2.75  
OUT  
OUT  
MODE  
OUT  
OUT  
MODE  
V
V
3616 G07  
3616fc  
5
For more information www.linear.com/LTC3616  
LTC3616  
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN unless otherwise noted.  
Load Step Transient in  
Pulse-Skipping Mode  
Load Step Transient in  
Burst Mode Operation  
Forced Continuous Mode Operation  
V
OUT  
20mV/DIV  
V
V
OUT  
OUT  
200mV/DIV  
200mV/DIV  
I
L
500mA/DIV  
I
LOAD  
I
LOAD  
5A/DIV  
5A/DIV  
3616 G11  
3616 G12  
3616 G10  
100µs/DIV  
100µs/DIV  
V
= 1.8V  
1µs/DIV  
OUT  
OUT  
V
LOAD  
= 1.8V  
V
LOAD  
= 1.8V  
OUT  
OUT  
I
= 100mA  
I
= 100mA TO 6A, V  
= 3.3V  
I
= 100mA TO 6A, V  
= 0V  
MODE  
MODE  
V
= 1.5V  
MODE  
COMPENSATION FIGURE 1  
COMPENSATION FIGURE 1  
Load Step Transient in Forced  
Continuous Mode Sourcing and  
Sinking Current  
Load Step Transient in Forced  
Continuous Mode without AVP Mode  
Load Step Transient in Forced  
Continuous Mode with AVP Mode  
V
V
V
OUT  
200mV/DIV  
OUT  
OUT  
200mV/DIV  
200mV/DIV  
I
I
I
LOAD  
5A/DIV  
LOAD  
LOAD  
5A/DIV  
5A/DIV  
3616 G13  
3616 G14  
3616 G15  
100µs/DIV  
100µs/DIV  
100µs/DIV  
= –3A TO 6A, V = 1.5V  
V
LOAD  
= 1.8V  
V
LOAD  
= 1.8V  
V
= 1.8V  
OUT  
OUT  
OUT  
I
= 100mA TO 6A, V  
= 1.5V  
I
= 100mA TO 6A, V  
= 1.5V  
I
LOAD  
MODE  
MODE  
MODE  
COMPENSATION FIGURE 1  
COMPENSATION FIGURE 1  
Tracking Up/Down in  
Forced Continuous Mode,  
Non DDR Mode  
Internal Start-Up in Forced  
Continuous Mode  
Sinking Current  
RUN  
10V/DIV  
V
OUT  
100mV/DIV  
V
OUT  
PGOOD  
10V/DIV  
1V/DIV  
V
SW  
2V/DIV  
OUT  
V
TRACK/SS  
500mV/DIV  
500mV/DIV  
I
L
I
L
PGOOD  
2V/DIV  
2A/DIV  
2A/DIV  
3616 G18  
3616 G16  
3616 G17  
2ms/DIV  
1µs/DIV  
500µs/DIV  
V
= 1.8V  
= –3A, V  
V
= 1.8V  
= 0A, V  
OUT  
OUT  
OUT  
OUT  
V
= 0V TO 1.8V  
OUT  
OUT  
I
= 1.5V  
I
= 1.5V  
MODE  
MODE  
I
= 3A, V  
= 0V TO 0.7V  
TRACK/SS  
V
= 1.5V, V  
= 0V  
DDR  
MODE  
3616fc  
6
For more information www.linear.com/LTC3616  
LTC3616  
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN unless otherwise noted.  
Tracking Up/Down in Forced  
Continuous Mode, DDR Pin Tied  
to SVIN  
Reference Voltage  
vs Temperature  
Switch On-Resistance  
vs Input Voltage  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.606  
0.604  
V
OUT  
MAIN SWITCH  
500mV/DIV  
0.602  
0.600  
0.598  
SYNCHRONOUS SWITCH  
V
TRACK/SS  
200mV/DIV  
PGOOD  
2V/DIV  
0.596  
0.594  
3616 G19  
2ms/DIV  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
–60 –40 –20  
0
20 40 60 80 100 120 140 160  
V
= 0V TO 1.2V  
OUT  
OUT  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
I
= 3A, V  
= 0V TO 0.4V  
TRACK/SS  
3616 G21  
V
= 1.5V, V  
= 3.3V  
SRLIM/DDR  
3616 G20  
MODE  
Switch On-Resistance  
vs Temperature  
Frequency vs Resistor on  
RT/SYNC Pin  
Frequency vs Temperature  
1.0  
0.5  
0.050  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
MAIN SWITCH  
0
–0.5  
–1.0  
–1.5  
SYNCHRONOUS SWITCH  
0
–60 –40 –20  
0
20 40 60 80 100 120 140 160  
–60 –40 –20  
0
20 40 60  
140 160  
80 100 120  
0
200 400 600  
1400  
800 1000 1200  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
RESISTOR ON RT/SYNC PIN (kΩ)  
3616 G24  
3616 G22  
3616 G23  
Switch Leakage vs Temperature,  
Main Switch  
Switch Leakage vs Temperature,  
Synchronous Switch  
Frequency vs Input Voltage  
1.0  
0.5  
14000  
12000  
10000  
8000  
6000  
4000  
2000  
0
16000  
14000  
12000  
10000  
8000  
6000  
4000  
2000  
0
V
IN  
V
IN  
V
IN  
= 2.25V  
= 3.3V  
= 5.5V  
V
V
V
= 2.25V  
= 3.3V  
= 5.5V  
IN  
IN  
IN  
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
2.25  
40  
TEMPERATURE (°C)  
20 40  
0
2.75 3.25  
3.75 4.25 4.75 5.25  
INPUT VOLTAGE (V)  
–60  
–10  
90  
140  
–60 –40 –20  
60 80 100 120 140 160  
TEMPERATURE (°C)  
3616 G25  
3616 G27  
3616 G27  
3616fc  
7
For more information www.linear.com/LTC3616  
LTC3616  
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN unless otherwise noted.  
Dynamic Supply Current vs Input  
Voltage without AVP Mode  
Dynamic Supply Current vs  
VOUT Short to GND,  
Forced Continuous Mode  
Temperature without AVP Mode  
100  
10  
1
100  
10  
1
FORCED CONTINUOUS MODE  
FORCED CONTINUOUS MODE  
V
OUT  
500mV/DIV  
PULSE-SKIPPING MODE  
Burst Mode OPERATION  
PULSE-SKIPPING MODE  
Burst Mode OPERATION  
I
L
5A/DIV  
0.1  
0.1  
0.01  
0.01  
3616 G30  
100µs/DIV  
–60 –40 –20  
0
20 40 60 80 100 120 140 160  
2.25 2.75 3.25 3.75 4.25 4.75 5.25  
V
= 1.8V  
= 0A  
MODE  
OUT  
OUT  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
I
3616 G29  
3616 G28  
V
= 1.5V  
Start-Up from Shutdown with  
Prebiased Output  
(Forced Continuous Mode)  
Output Voltage During Sinking  
vs Input Voltage (VOUT = ±.8V,  
0.47µH Inductor)  
1.88  
PGOOD  
5V/DIV  
1.86  
1.84  
1.82  
1.80  
1.78  
1.76  
1.74  
V
OUT  
500mV/DIV  
–3A, 2MHz, 120°C  
–3A, 2MHz, 25°C  
I
L
5A/DIV  
3616 G31  
50µs/DIV  
= 2.2V  
= 0A  
2.25  
2.75  
3.25  
4
4.5  
5.25  
PREBIASED V  
OUT  
OUT  
INPUT VOLTAGE (V)  
V
V
= 1.2V, I  
OUT  
MODE  
3616 G32  
= 1.5V  
3616fc  
8
For more information www.linear.com/LTC3616  
LTC3616  
pin FuncTions  
SRLIM/DDR (Pin ±): Slew Rate Limit. Tying this pin to  
ground selects maximum slew rate. Minimum slew rate  
is selected when the pin is open. Connecting a resistor  
from SRLIM/DDR to ground allows the slew rate to be  
FB voltage leaves the power good window for more than  
100µs the PGOOD pin is pulled down.  
InDDRmode(DDR=V ), thepowergoodwindowmoves  
IN  
in relation to the actual TRACK/SS pin voltage. During  
continuously adjusted. If SRLIM/DDR is tied to S , DDR  
VIN  
up/down tracking the PGOOD pin is always pulled down.  
mode is selected. In DDR mode the slew rate limit is set  
In shutdown the PGOOD output will actively pull down  
and may be used to discharge the output capacitors via  
an external resistor.  
to maximum.  
RT/SYNC (Pin 2): Oscillator Frequency. This pin provides  
three ways of setting the constant switching frequency:  
MODE (Pin 2±): Mode Selection. Tying the MODE pin  
1. Connecting a resistor from RT/SYNC to ground will set  
the switching frequency based on the resistor value.  
to SV or SGND enables pulse-skipping mode or Burst  
IN  
Mode operation (with an internal Burst Mode clamp),  
2. Driving the RT/SYNC pin with an external clock signal  
will synchronize the LTC3616 to the applied frequency.  
Theslopecompensationisautomaticallyadaptedtothe  
external clock frequency.  
respectively. If this pin is held at slightly higher than half  
of SV , forced continuous mode is selected. Connecting  
IN  
this pin to an external voltage selects Burst Mode opera-  
tion with the burst clamp set to the pin voltage. See the  
Operation section for more details.  
3. Tying the RT/SYNC pin to SV enables the internal  
IN  
2.25MHz oscillator frequency.  
V
(Pin 22): Voltage Feedback Input Pin. Senses the  
FB  
feedbackvoltagefromtheexternalresistivedivideracross  
the output.  
SGND (Pin 3): Signal Ground. All small-signal and com-  
pensation components should connect to this ground,  
which in turn should connect to PGND at a single point.  
ITH (Pin 23): Error Amplifier Compensation. The current  
comparator’s threshold increases with this control volt-  
age. Tying this pin to SVIN enables internal compensation  
and AVP mode.  
PV (Pins 4, ±0, ±±, ±7): Power Input Supply. PV  
IN  
IN  
connects to the source of the internal P-channel power  
MOSFET. This pin is independent of SV and may be con-  
IN  
nected to the same voltage or to a lower voltage supply.  
TRACK/SS (Pin 24): Track/External Soft-Start/External  
Reference. Start-up behavior is programmable with the  
TRACK/SS pin:  
SW (Pins 5, 6, 7, 8, ±3, ±4, ±5, ±6): Switch Node. Con-  
nection to the inductor. These pins connect to the drains  
of the internal synchronous power MOSFET switches.  
1. Tying this pin to SV selects the internal soft-start  
IN  
circuit.  
NC (Pins 9, ±2): Can be connected to ground or left open.  
2. External soft-start timing can be programmed with a  
SV (Pin ±8): Signal Input Supply. This pin powers the  
IN  
capacitor to ground and a resistor to SV .  
IN  
internal control circuitry and is monitored by the under-  
voltage lockout comparator.  
3. TRACK/SS can be used to force the LTC3616 to track  
the start-up behavior of another supply.  
RUN(Pin±9):EnablePin. Forcingthispintogroundshuts  
downtheLTC3616.Inshutdown,allfunctionsaredisabled  
and the chip draws <1µA of supply current.  
The pin can also be used as external reference input. See  
theApplicationsInformationsectionformoreinformation.  
PGOOD (Pin 20): Power Good. This open-drain output is  
pulled down to SGND on start-up and while the FB voltage  
is outside the power good voltage window. If the FB volt-  
age increases and stays inside the power good window  
for more than 100µs the PGOOD pin is released. If the  
PGND (Exposed Pad Pin 25): Power Ground. This pin  
connects to the source of the internal N-channel power  
MOSFET. This pin should be connected close to the (–)  
terminal of C and C  
.
IN  
OUT  
3616fc  
9
For more information www.linear.com/LTC3616  
LTC3616  
FuncTional block DiagraM  
SV  
SGND  
RT/SYNC  
ITH  
PV PV PV PV  
IN  
IN  
IN  
IN  
IN  
ITH SENSE  
COMPARATOR  
+
BANDGAP  
AND  
BIAS  
RUN  
INTERNAL  
COMPENSATION  
CURRENT  
SENSE  
OSCILLATOR  
SV – 0.3V  
IN  
R
PMOS CURRENT  
COMPARATOR  
+
ITH  
LIMIT  
+
FOLDBACK  
AMPLIFIER  
+
0.3V  
SLOPE  
COMPENSATION  
ERROR  
AMPLIFIER  
0.6V  
BURST  
COMPARATOR  
+
+
V
SW  
SW  
SW  
SW  
SW  
SW  
SW  
SW  
SLEEP  
FB  
DRIVER  
+
MODE  
TRACK/SS  
SOFT-START  
0.555V  
+
LOGIC  
REVERSE  
+
COMPARATOR  
+
I
REV  
0.645V  
PGND  
PGOOD  
EXPOSED PAD  
SRLIM/DDR  
MODE  
3616 BD  
3616fc  
10  
For more information www.linear.com/LTC3616  
LTC3616  
operaTion  
Main Control Loop  
Mode Selection  
The LTC3616 is a monolithic, constant frequency, current  
mode step-down DC/DC converter. During normal opera-  
tion, the internal top power switch (P-channel MOSFET) is  
turned on at the beginning of each clock cycle. Current in  
the inductor increases until the current comparator trips  
and turns off the top power switch. The peak inductor cur-  
rent at which the current comparator trips is controlled by  
the voltage on the ITH pin. The error amplifier adjusts the  
voltage on the ITH pin by comparing the feedback signal  
The MODE pin is used to select one of four different  
operating modes:  
Mode Selection Voltage  
SV  
IN  
PS  
FC  
PULSE-SKIPPING MODE ENABLE  
SV – 0.3V  
IN  
SV • 0.58  
IN  
FORCED CONTINUOUS MODE ENABLE  
1.1V  
from a resistor divider on the V pin with an internal 0.6V  
FB  
0.8V  
Burst Mode ENABLE—EXTERNAL CLAMP,  
CONTROLLED BY VOLTAGE APPLIED AT  
MODE PIN  
BM  
EXT  
reference. When the load current increases, it causes a  
reduction in the feedback voltage relative to the reference.  
The error amplifier raises the ITH voltage until the average  
inductor current matches the new load current. Typical  
voltage range for the ITH pin is from 0.1V to 1.05V with  
0.45V corresponding to zero current.  
0.45V  
0.3V  
BM  
Burst Mode ENABLE—INTERNAL CLAMP  
SGND  
3616 OP01  
Burst Mode Operation—Internal Clamp  
Connecting the MODE pin to SGND enables Burst Mode  
operation with an internal clamp. In Burst Mode operation  
the internal power switches operate intermittently at light  
loads. This increases efficiency by minimizing switching  
losses. During the intervals when the switches are idle,  
the LTC3616 enters sleep state where many of the internal  
circuits are disabled to save power. During Burst Mode  
operation,theminimumpeakinductorcurrentisinternally  
clamped and the voltage on the ITH pin is monitored by  
the burst comparator to determine when sleep mode is  
enabled and disabled. When the average inductor current  
is greater than the load current, the voltage on the ITH pin  
drops. As the ITH voltage falls below the internal clamp,  
the burst comparator trips and enables sleep mode. Dur-  
ing sleep mode, the power MOSFETs are held off and the  
load current is solely supplied by the output capacitor.  
When the output voltage drops, the top power switch is  
turned back on and the internal circuits are re-enabled.  
This process repeats at a rate that is dependent on the  
load current.  
When the top power switch shuts off, the synchronous  
power switch (N-channel MOSFET) turns on until either  
the bottom current limit is reached or the next clock cycle  
begins. The bottom current limit is typically set at –8A for  
forced continuous mode and 0A for Burst Mode operation  
and pulse-skipping mode.  
The operating frequency defaults to 2.25MHz when  
RT/SYNC is connected to SV , or can be set by an ex-  
IN  
ternal resistor connected between the RT/SYNC pin and  
ground, or by a clock signal applied to the RT/SYNC pin.  
The switching frequency can be set from 300kHz to 4MHz.  
Overvoltage and undervoltage comparators pull the  
PGOOD output low if the output voltage varies more than  
7.5% (typical) from the set point.  
3616fc  
11  
For more information www.linear.com/LTC3616  
LTC3616  
operaTion  
Burst Mode Operation—External Clamp  
Dropout Operation  
ConnectingtheMODEpintoavoltageintherangeof0.45V  
to0.8VenablesBurstModeoperationwithexternalclamp.  
Duringthismodeofoperationtheminimumvoltageonthe  
ITH pin is externally set by the voltage on the MODE pin.  
Astheinputsupplyvoltageapproachestheoutputvoltage,  
the duty cycle increases toward the maximum on-time.  
Further reduction of the supply voltage forces the main  
switch to remain on for more than one cycle, eventually  
reaching 100% duty cycle. The output voltage will then be  
determined by the input voltage minus the voltage drop  
across the internal P-channel MOSFET and the inductor.  
Pulse-Skipping Mode Operation  
Pulse-skipping mode is similar to Burst Mode operation,  
but the LTC3616 does not disable power to the internal  
circuitry during sleep mode. This improves output voltage  
ripple but uses more quiescent current, compromising  
light load efficiency.  
Low Supply Operation  
The LTC3616 is designed to operate down to an input  
supplyvoltageof2.25V.Animportantconsiderationatlow  
input supply voltages is that the R  
of the P-channel  
DS(ON)  
Tying the MODE pin to SV enables pulse-skippingmode.  
IN  
andN-channelpowerswitchesincreases. Theusershould  
calculate the power dissipation when the LTC3616 is used  
at 100% duty cycle with low input voltages to ensure that  
thermal limits are not exceeded. See the Typical Perfor-  
mance Characteristics graphs.  
As the load current decreases, the peak inductor current  
will be determined by the voltage on the ITH pin until the  
ITHvoltagedropsbelowthevoltagelevelcorrespondingto  
0A. At this point, the peak inductor current is determined  
by the minimum on-time of the current comparator. If  
the load demand is less than the average of the minimum  
on-time inductor current, switching cycles will be skipped  
to keep the output voltage in regulation.  
Short-Circuit Protection  
Thepeakinductorcurrentatwhichthecurrentcomparator  
shuts off the top power switch is controlled by the voltage  
on the ITH pin.  
Forced Continuous Mode  
In forced continuous mode the inductor current is con-  
stantly cycled which creates a minimum output voltage  
ripple at all output current levels.  
If the output current increases, the error amplifier raises  
the ITH pin voltage until the average inductor current  
matches the new load current. In normal operation the  
LTC3616 clamps the maximum ITH pin voltage at ap-  
proximately 1.05V which corresponds typically to 12A  
peak inductor current.  
Connecting the MODE pin to a voltage in the range of  
1.1V to SV • 0.58 will enable forced continuous mode  
IN  
operation.  
Whentheoutputisshortedtoground,theinductorcurrent  
decays very slowly during a single switching cycle. The  
LTC3616 uses two techniques to prevent current runaway  
from occurring.  
At light loads, forced continuous mode operation is less  
efficient than Burst Mode or pulse-skipping operation, but  
may be desirable in some applications where it is neces-  
sary to keep switching harmonics out of the signal band.  
Forced continuous mode must be used if the output is  
required to sink current.  
3616fc  
12  
For more information www.linear.com/LTC3616  
LTC3616  
operaTion  
Iftheoutputvoltagedropsbelow50%ofitsnominalvalue,  
the clamp voltage at ITH pin is lowered causing the maxi-  
mum peak inductor current to decrease gradually with the  
output voltage. When the output voltage reaches 0V the  
clamp voltage at the ITH pin drops to 40% of the clamp  
voltage during normal operation. The short-circuit peak  
inductor current is determined by the minimum on-time  
of the LTC3616, the input voltage and the inductor value.  
This foldback behavior helps in limiting the peak inductor  
currentwhentheoutputisshortedtoground.Itisdisabled  
duringinternalorexternalsoft-startandtrackingup/down  
operation (see the Applications Information section).  
A secondary limit is also imposed on the valley inductor  
current. If the inductor current measured through the  
bottom MOSFET increases beyond 12A typical, the top  
power MOSFET will be held off and switching cycles will  
be skipped until the inductor current is reduced.  
applicaTions inForMaTion  
The basic LTC3616 application circuit is shown in Figure 1.  
ramp current that is used to charge and discharge an  
internal timing capacitor within the oscillator and can be  
calculated by using the following equation:  
Operating Frequency  
3.82 1011Hz  
Selectionoftheoperatingfrequencyisatrade-offbetween  
efficiency and component size. High frequency operation  
allows the use of smaller inductor and capacitor values.  
RT =  
Ω – 16kΩ  
fOSC Hz  
( )  
Operation at lower frequencies improves efficiency by  
reducing internal gate charge losses but requires larger  
inductance values and/or capacitance to maintain low  
output ripple voltage.  
Although frequencies as high as 4MHz are possible, the  
minimum on-time of the LTC3616 imposes a minimum  
limit on the operating duty cycle. The minimum on-time  
is typically 60ns; therefore, the minimum duty cycle is  
equal to 60nsf (Hz)100%.  
OSC  
The operating frequency of the LTC3616 is determined  
by an external resistor that is connected between the RT/  
SYNC pin and ground. The value of the resistor sets the  
Tying the RT/SYNC pin to SV sets the default internal  
IN  
operating frequency to 2.25MHz 20%.  
V
IN  
2.25V TO 5.5V  
C
IN1  
R
22µF  
SS  
SV  
RUN  
PV  
IN  
IN  
2M  
×4  
TRACK/SS SRLIM/DDR  
RT/SYNC  
L1  
220nH  
C
SS  
V
1.8V  
6A  
OUT  
R
T
22nF  
LTC3616  
SW  
SGND  
PGND  
R
130k  
C
C
C
OUT2  
100µF  
OUT1  
PGOOD  
ITH  
15k  
47µF  
C
R1  
392k  
MODE  
V
C1  
FB  
C
C
10pF  
470pF  
3616 F01  
(OPT)  
R2  
196k  
Figure ±. ±.8V, 6A Step-Down Regulator  
3616fc  
13  
For more information www.linear.com/LTC3616  
LTC3616  
applicaTions inForMaTion  
Frequency Synchronization  
Inductor Selection  
The LTC3616’s internal oscillator can be synchronized to  
an external frequency by applying a square wave clock  
signaltotheRT/SYNCpin.Duringsynchronization,thetop  
switch turn-on is locked to the falling edge of the external  
frequency source. The synchronization frequency range  
is 300kHz to 4MHz. During synchronization all operation  
modes can be selected.  
For a given input and output voltage, the inductor value  
and operating frequency determine the ripple current. The  
ripple current I increases with higher V and decreases  
L
IN  
with higher inductance:  
VOUT  
VOUT  
I =  
1–  
L
f
L  
V
IN  
SW  
It is recommended that the regulator is powered down  
(RUN pin to ground) before removing the clock signal on  
theRT/SYNCpininordertoreduceinductorcurrentripple.  
Having a lower ripple current reduces the core losses  
in the inductor, the ESR losses in the output capacitors  
and the output voltage ripple. A reasonable starting point  
for selecting the ripple current is I = 0.3 • I  
.
AC coupling should be used if the external clock generator  
cannotprovideacontinuousclocksignalthroughoutstart-  
up, operation and shutdown of the LTC3616. The size of  
L
OUT(MAX)  
The largest ripple current occurs at the highest V . To  
IN  
guarantee that the ripple current stays below a specified  
maximum, theinductorvalueshouldbechosenaccording  
to the following equation:  
capacitor C  
depends on parasitic capacitance on the  
SYNC  
RT/SYNC pin and is typically in the range of 10pF to 22pF.  
VOUT  
fSW IL(MAX)  
VOUT  
L =  
1–  
V
IN  
LTC3616  
V
IN  
SV  
f
IN  
OSC  
2.25MHz  
RT/SYNC  
The inductor value will also have an effect on Burst Mode  
operation. The transition to low current operation begins  
whenthepeakinductorcurrentfallsbelowalevelsetbythe  
burst clamp. Lower inductor values result in higher ripple  
current which causes this to occur at lower load currents.  
This causes a dip in efficiency in the upper range of low  
current operation. In Burst Mode operation, lower induc-  
tance values will cause the burst frequency to increase.  
V
IN  
LTC3616  
SV  
IN  
f
1/R  
T
0.4V  
OSC  
RT/SYNC  
SGND  
R
T
V
IN  
LTC3616  
SV  
IN  
f
OSC  
1/T  
RT/SYNC  
SGND  
P
Inductor Core Selection  
1.2V  
0.3V  
Once the value forL is known, the type ofinductormust be  
selected. Actual core loss is independent of core size for  
fixed inductor value, but it is very dependent on the induc-  
tanceselected.Astheinductanceincreases,corelossesde-  
crease.Unfortunately,increasedinductancerequiresmore  
turns ofwire and therefore, copperlosses willincrease.  
T
P
V
IN  
LTC3616  
SV  
C
SYNC  
IN  
f
OSC  
1/T  
RT/SYNC  
SGND  
P
R
T
3616 F02  
Figure 2. Setting the Switching Frequency  
3616fc  
14  
For more information www.linear.com/LTC3616  
LTC3616  
applicaTions inForMaTion  
Table ±. Representative Surface Mount Inductors  
Ferrite designs have very low core losses and are pre-  
ferred at high switching frequencies, so design goals  
can concentrate on copper loss and preventing satura-  
tion. Ferrite core material saturates “hard,” meaning  
that inductance collapses abruptly when the peak design  
current is exceeded. This results in an abrupt increase in  
inductor ripple current and consequently output voltage  
ripple. Do not allow a ferrite core to saturate and select  
external inductors respecting the temperature range of  
the application!  
INDUCTANCE  
(μH)  
DCR  
(mΩ)  
MAX  
CURRENT (A)  
DIMENSIONS  
(mm)  
HEIGHT  
(mm)  
Vishay IHLP-2525CZ-0±  
0.10  
0.15  
0.20  
0.22  
0.33  
0.47  
1.5  
1.9  
2.4  
2.5  
3.5  
4
60  
52  
41  
40  
30  
26  
6.5 × 6.9  
6.5 × 6.9  
6.5 × 6.9  
6.5 × 6.9  
6.5 × 6.9  
6.5 × 6.9  
3
3
3
3
3
3
Sumida CDMC6D28 Series  
Different core materials and shapes will change the size/  
currentandprice/currentrelationshipofaninductor.Toroid  
or shielded pot cores in ferrite or permalloy materials are  
small and don’t radiate much energy, but generally cost  
more than powdered iron core inductors with similar  
characteristics. The choice of which style inductor to use  
mainly depends on the price versus size requirements  
and any radiated field/EMI requirements. Table 1 shows  
some typical surface mount inductors that work well in  
LTC3616 applications.  
0.2  
0.3  
2.5  
3.2  
4.2  
21.7  
15.4  
13.6  
7.25 × 4.4  
7.25 × 4.4  
7.25 × 4.4  
3
3
3
0.47  
Cooper HCP0703 Series  
0.22  
0.47  
0.68  
2.8  
4.2  
5.5  
23  
17  
15  
7 × 7.3  
7 × 7.3  
7 × 7.3  
3.0  
3.0  
3.0  
Würth Electronik WE-HC7443±2 Series  
0.25  
0.47  
2.5  
3.4  
18  
16  
7 × 7.7  
7 × 7.7  
3.8  
3.8  
Input Capacitor (C ) Selection  
Coilcraft SLC7530 Series  
IN  
0.100  
0.188  
0.272  
0.350  
0.400  
0.123  
0.100  
0.100  
0.100  
0.100  
20  
21  
14  
11  
8
7.5 × 6.7  
7.5 × 6.7  
7.5 × 6.7  
7.5 × 6.7  
7.5 × 6.7  
3
3
3
3
3
In continuous mode, the source current of the top P-  
channel MOSFET is a square wave of duty cycle V /V .  
OUT IN  
To prevent large voltage transients, a low ESR capacitor  
sized for the maximum RMS current must be used at V .  
IN  
The maximum RMS capacitor current is given by:  
VOUT  
V
IN  
V
OUT  
IRMS =IOUT(MAX)  
– 1  
V
IN  
This formula has a maximum at V = 2V , where I =  
RMS  
IN  
OUT  
I
/2.Thissimpleworst-caseconditioniscommonlyused  
OUT  
fordesignbecauseevensignificantdeviationsdonotoffer  
muchrelief.Notethatripplecurrentratingsfromcapacitor  
manufacturers are often based on only 2000 hours of life  
which makes it advisable to further derate the capacitor,  
or choose a capacitor rated at a higher temperature than  
required. Generally select the capacitors respecting the  
temperature range of the application! Several capacitors  
may also be paralleled to meet size or height requirements  
in the design.  
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LTC3616  
applicaTions inForMaTion  
Output Capacitor (C ) Selection  
Ceramic capacitors are prone to temperature effects  
which require the designer to check loop stability over  
the operating temperature range. To minimize their large  
temperature and voltage coefficients, only X5R or X7R  
ceramic capacitors should be used.  
OUT  
The selection of C  
is typically driven by the required  
OUT  
ESR to minimize voltage ripple and load step transients  
(low ESR ceramic capacitors are discussed in the next  
section). Typically, once the ESR requirement is satisfied,  
the capacitance is adequate for filtering. The output ripple  
Whenaceramiccapacitorisusedattheinputandthepower  
is being supplied through long wires, such as from a wall  
adapter, a load step at the output can induce ringing at  
V  
is determined by:  
OUT  
1
the V pin. At best, this ringing can couple to the output  
VOUT ≤ ∆I ESR+  
IN  
L
8 fSW COUT  
and be mistaken as loop instability. At worst, the ringing  
at the input can be large enough to damage the part.  
where f  
= operating frequency, C  
L
= output capaci-  
OUT  
OSC  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must instead fulfill a charge storage  
requirement.Duringaloadstep,theoutputcapacitormust  
instantaneouslysupplythecurrenttosupporttheloaduntil  
thefeedbackloopraisestheswitchcurrentenoughtosup-  
port the load. The time required for the feedback loop to  
respond is dependent on the compensation components  
and the output capacitor size. Typically, 3 to 4 cycles are  
requiredtorespondtoaloadstep,butonlyinthefirstcycle  
tance and I = ripple current in the inductor. The output  
ripple is highest at maximum input voltage since I  
increases with input voltage.  
L
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or RMS  
currenthandlingrequirementoftheapplication.Aluminum  
electrolytic, special polymer, ceramic and dry tantalum  
capacitors are all available in surface mount packages.  
does the output drop linearly. The output droop, V  
,
DROOP  
Tantalumcapacitorshavethehighestcapacitancedensity,  
but can have higher ESR and must be surge tested for  
use in switching power supplies. Aluminum electrolytic  
capacitors have significantly higher ESR, but can often  
be used in extremely cost-sensitive applications provided  
that consideration is given to ripple current ratings and  
long-term reliability.  
is usually about 2 to 4 times the linear drop of the first  
cycle; however, this behavior can vary depending on the  
compensation component values. Thus, a good place to  
start is with the output capacitor size of approximately:  
3.5 IOUT  
fSW VDROOP  
COUT  
Ceramic Input and Output Capacitors  
This is only an approximation; more capacitance may  
be needed depending on the duty cycle and load step  
requirements.  
Ceramic capacitors have the lowest ESR and can be cost  
effective, but also have the lowest capacitance density,  
high voltage and temperature coefficients, and exhibit  
audible piezoelectric effects. In addition, the high Q of  
ceramic capacitors along with trace inductance can lead  
to significant ringing.  
Inmostapplications,theinputcapacitorismerelyrequired  
to supply high frequency bypassing, since the impedance  
to the supply is very low.  
They are attractive for switching regulator use because  
of their very low ESR, but great care must be taken when  
using only ceramic input and output capacitors.  
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LTC3616  
applicaTions inForMaTion  
Output Voltage Programming  
Pulse-skippingmode,whichisacompromisebetweenlow  
output voltage ripple and efficiency, can be implemented  
The output voltage is set by an external resistive divider  
according to the following equation:  
by connecting MODE to SV . This sets I  
to 0A. In  
IN  
BURST  
this condition, the peak inductor current is limited by the  
minimum on-time of the current comparator. The low-  
est output voltage ripple is achieved while still operating  
discontinuously. During very light output loads, pulse-  
skipping allows only a few switching cycles to skip while  
maintaining the output voltage in regulation.  
R1  
R2  
VOUT = 0.6 1+  
V
The resistive divider allows pin V to sense a fraction of  
FB  
the output voltage as shown in Figure 1.  
Burst Clamp Programming  
Internal and External Compensation  
If the voltage on the MODE pin is less than 0.8V, Burst  
Mode operation is enabled.  
The regulator loop response can be checked by looking at  
the load current transient response. Switching regulators  
take several cycles to respond to a step in DC load current.  
If the voltage on the MODE pin is less than 0.3V, the in-  
ternal default burst clamp level is selected. The minimum  
voltage on the ITH pin is typically 525mV (internal clamp).  
When a load step occurs, V  
shifts by an amount equal  
OUT  
toI  
,whereESRistheeffectiveseriesresistance  
also begins to charge or discharge C  
LOAD(ESR)  
of C . I  
,
OUT  
LOAD  
OUT  
If the voltage is between 0.45V and 0.8V, the voltage on  
generatingthefeedbackerrorsignalthatforcestheregula-  
tor to adapt to the current change and return V to its  
the MODE pin (V  
) is equal to the minimum voltage  
BURST  
OUT  
on the ITH pin (external clamp) and determines the burst  
clamp level I (typically from 0A to 7A).  
steady-state value. During this recovery time V  
can  
OUT  
BURST  
be monitored for excessive overshoot or ringing, which  
would indicate a stability problem. The availability of the  
ITH pin allows the transient response to be optimized over  
a wide range of output capacitance.  
When the ITH voltage falls below the internal (or external)  
clamp voltage, the sleep state is enabled.  
Astheoutputloadcurrentdrops,thepeakinductorcurrent  
decreases to keep the output voltage in regulation. When  
the output load current demands a peak inductor current  
The ITH external components (R and C ) shown in Fig-  
C
C
ure 1 provide adequate compensation as a starting point  
for most applications. The values can be modified slightly  
to optimize transient response once the final PCB layout  
is done and the particular output capacitor type and value  
have been determined. The output capacitors need to be  
selected because the various types and values determine  
the loop gain and phase. The gain of the loop will be in-  
that is less than I  
, the burst clamp will force the peak  
BURST  
inductor current to remain equal to I  
regardless of  
BURST  
further reductions in the load current.  
Since the average inductor current is greater than the out-  
put load current, the voltage on the ITH pin will decrease.  
When the ITH voltage drops, sleep mode is enabled in  
which both power switches are shut off along with most  
of the circuitry to minimize power consumption. All cir-  
cuitry is turned back on and the power switches resume  
operationwhentheoutputvoltagedropsoutofregulation.  
creased by increasing R and the bandwidth of the loop  
C
will be increased by decreasing C . If R is increased by  
C
C
the same factor that C is decreased, the zero frequency  
C
will be kept the same, thereby keeping the phase shift the  
same in the most critical frequency range of the feedback  
loop. The output voltage settling behavior is related to the  
stability of the closed-loop system. The external capaci-  
The value for I  
is determined by the desired amount  
BURST  
of output voltage ripple. As the value of I  
increases,  
BURST  
the sleep period between pulses and the output voltage  
ripple increase. Note that for very high V voltage  
tor, C , (Figure 1) is not needed for loop stability, but it  
C1  
BURST  
helps filter out any high frequency noise that may couple  
settings, the power good comparator may trip, since the  
outputripplemaygetbiggerthanthepowergoodwindow.  
onto that node.  
3616fc  
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A second, more severe transient is caused by switching  
in loads with large (>1μF) supply bypass capacitors. The  
dischargedbypasscapacitorsareeffectivelyputinparallel  
If the ITH pin is tied to SV , the active voltage position-  
IN  
ing (AVP) mode and internal compensation are selected.  
AVP mode intentionally compromises load regulation by  
reducing the gain of the feedback circuit, resulting in an  
outputvoltagethatvarieswithloadcurrent. Whentheload  
currentsuddenlyincreases, theoutputvoltagestartsfrom  
a level slightly higher than nominal so the output voltage  
can droop more and stay within the specified voltage  
range. When the load current suddenly decreases the  
output voltage starts at a level lower than nominal so the  
output voltage can have more overshoot and stay within  
the specified voltage range (see Figures 3 and 4).  
with C , causing a rapid drop in V . No regulator can  
OUT  
OUT  
alter its delivery of current quickly enough to prevent this  
sudden step change in output voltage if the load switch  
resistance is low and it is driven quickly. More output  
capacitance may be required depending on the duty cycle  
and load step requirements.  
AVP Mode  
Fast load transient response, limited board space and low  
cost are typical requirements of microprocessor power  
supplies. A microprocessor has typical full load step with  
veryfastslewrate.Thevoltageatthemicroprocessormust  
be held to about 0.1V of nominal in spite of these load  
current steps. Since the control loop cannot respond this  
fast, the output capacitors must supply the load current  
until the control loop can respond.  
Thebenefitisalowerpeak-to-peakoutputvoltagedeviation  
for a given load step without having to increase the output  
filter capacitance. Alternatively, the output voltage filter  
capacitance can be reduced while maintaining the same  
peak to peak transient response. Due to the reduced loop  
gain in AVP mode, no external compensation is required.  
Normally, several capacitors in parallel are required to  
meet microprocessor transient requirements. Capacitor  
ESR and ESL primarily determine the amount of droop or  
overshoot in the output voltage.  
DDR Mode  
TheLTC3616canbothsourceandsinkcurrentiftheMODE  
pin is configured to forced continuous mode.  
Currentsinkingistypicallylimitedto3Afor1MHzfrequency  
and a0.47µH inductor, but can belowerathigher frequen-  
cies and low output voltages. If higher ripple current can  
be tolerated, smaller inductor values can increase the sink  
current limit. See the Typical Performance Characteristics  
curves for more information.  
ConsidertheLTC3616withoutAVP withabankoftantalum  
output capacitors. If a load step with very fast slew rate  
occurs, the voltage excursion will be seen in both direc-  
tions, for full load to minimum load transient and for the  
minimum load to full load transient.  
V
OUT  
100mV/DIV  
V
OUT  
200mV/DIV  
I
L
I
L
1A/DIV  
1A/DIV  
3616 F03  
3616 F04  
V
V
I
= 3.3V  
50µs/DIV  
V
V
I
= 3.3V  
50µs/DIV  
IN  
OUT  
IN  
OUT  
= 1.8V  
= 1.8V  
= 100mA TO 3A  
= 1.5V  
= 100mA TO 3A  
= 1.5V  
LOAD  
LOAD  
MODE  
V
V
MODE  
COMPENSATION FIGURE 1  
V
= 3.3V  
ITH  
OUTPUT CAPACITOR VALUE FIGURE 1  
Figure 3. Load Step Transient Forced  
Continuous Mode (AVP Inactive)  
Figure 4. Load Step Transient Forced  
Continuous Mode with AVP Mode  
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In addition, tying the SRLIM/DDR pin to SV , lower  
for ten microseconds in order to discharge the external  
capacitor. This discharging time is typically adequate  
for capacitors up to about 33nF. If a larger capacitor is  
required, connect the external soft-start resistor to the  
RUN pin.  
IN  
external reference voltage and tracking output voltage  
between channels are possible. See the Output Voltage  
Tracking and External Reference Input sections.  
Soft-Start  
Regardless of either internal or external soft-start state,  
the MODE pin is ignored and soft-start will always be in  
pulse-skipping mode. In addition, the PGOOD pin is kept  
low and foldback of the switching frequency is disabled.  
TheRUNpinprovidesameanstoshutdowntheLTC3616.  
Tying the RUN pin to SGND places the LTC3616 in a low  
quiescent current shutdown state (I < 1µA).  
Q
When the LTC3616 is enabled by pulling the RUN pin  
high, the chip enters a soft start-up state. The type of soft  
start-up behavior is set by the TRACK/SS pin:  
Programmable Switch Pin Slew Rate  
Asswitchingfrequenciesrise,itisdesirabletominimizethe  
transitiontimerequiredwhenswitchingtominimizepower  
losses and blanking time for the switch to settle. However,  
fast slewing of the switch node results in relatively high  
external radiated EMI and high on chip supply transients,  
which can cause problems for some applications.  
1. Tying TRACK/SS to SV selects the internal soft-start  
IN  
circuit. This circuit ramps the output voltage to the final  
value within 1ms.  
2. If a longer soft-start period is desired, it can be set  
externally with a resistor and capacitor on the TRACK/  
SSpinasshowninFigure1.TheTRACK/SSpinreduces  
The LTC3616 allows the user to control the slew rate of  
the switching node SW by using the SRLIM/DDR pin.  
Tying this pin to ground selects the fastest slew rate. The  
slowest slew rate is selected when the pin is open. Con-  
necting a resistor (between 10k and 100k) from SRLIM  
pin to ground adjusts the slew rate between the maximum  
and minimum values. The reduced dV/dt of the switch  
node results in a significant reduction of the supply and  
ground ringing, as well as lower radiated EMI.  
the value of the internal reference at V until TRACK/  
FB  
SSispulledabove0.6V.Theexternalsoft-startduration  
can be calculated by using the following formula:  
SV  
IN  
tSS =R C ln  
SS  
SS  
SV – 0.6V  
IN  
3. The TRACK/SS pin can be used to track the output  
voltage of another supply.  
Particularattentionshouldbeusedwithveryhighswitching  
frequencies. Using the slowest slew rate (SRLIM open)  
can reduce the minimum duty cycle capability.  
Each time the RUN pin is tied high and the LTC3616 is  
turned on, the TRACK/SS pin is internally pulled down  
10k  
100k  
OPEN  
OPEN  
100k  
10k  
3616 F05  
2ns/DIV  
2ns/DIV  
V
V
SW  
= 3.3V  
= 1.8V  
= 2.25MHz  
V
V
= 3.3V  
= 1.8V  
= 2.25MHz  
IN  
OUT  
IN  
OUT  
f
f
SW  
Figure 5. Slew Rate at SW Pin vs SRLIM/DDR Resistor: Open, ±00k, ±0k  
3616fc  
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Output Voltage Tracking Input  
V
V
OUT1  
OUT2  
If the DDR pin is not tied to SV , once V  
exceeds  
IN  
TRACK/SS  
0.6V, the run state is entered and the MODE selection,  
power good and current foldback circuits are enabled.  
In the run state, the TRACK/SS pin can be used for track-  
ing down/up the output voltage of another supply. If the  
V
drops below 0.6V, the LTC3616 enters the  
TRACK/SS  
down tracking state and V  
is referenced to the TRACK/  
OUT  
TIME  
SS voltage. If the TRACK/SS pin drops below 0.2V, the  
switching frequency is reduced to ensure that the mini-  
mum duty cycle limit does not prevent the output from  
following the TRACK/SS pin. The run state will resume if  
(6a) Coincident Tracking  
V
V
OUT1  
OUT2  
V
again exceeds 0.6V and V  
is referenced to  
TRACK/SS  
OUT  
the internal precision reference (see Figure 8).  
Through the TRACK/SS pin, the output voltage can be set  
up for either coincident or ratiometric tracking, as shown  
in Figure 6.  
3616 F06  
TIME  
To implement the coincident tracking behavior in Fig-  
ure 6a, connect an extra resistive divider to the output  
of the master channel and connect its midpoint to the  
TRACK/SS pin for the slave channel. The ratio of this  
divider should be selected to be the same as that of the  
slavechannel’sfeedbackdivider(Figure 7a).Inthistrack-  
ing mode, the master channel’s output must be set higher  
than slave channel’s output. To implement the ratiometric  
tracking behavior in Figure 6b, different resistor divider  
values must be used as specified in Figure 7b.  
(6b) Ratiometric Tracking  
Figure 6. Two Different Modes of Output Voltage Tracking  
V
OUT1  
V
OUT2  
R4  
R4  
R3  
V
IN  
V
V
FB1  
FB2  
R2  
R2  
R2  
LTC3616  
TRACK/SS2  
LTC3616  
TRACK/SS1  
Forcoincidentstart-up, thevoltagevalueattheTRACK/SS  
pin for the slave channel needs to reach the final reference  
value after the internal soft-start time (around 1ms). The  
master start-up time needs to be adjusted with an external  
capacitor and resistor to ensure this.  
R4 ≤ R3  
3616 F07a  
LTC3616 CHANNEL 2  
SLAVE  
LTC3616 CHANNEL 1  
MASTER  
Figure 7a. Setup for Coincident Tracking  
V
OUT1  
V
OUT2  
External Reference Input (DDR Mode)  
R1  
R2  
R5  
R3 R1/R2 < R5/R6  
If the DDR pin is tied to SV (DDR mode), the run state is  
IN  
V
V
FB1  
FB2  
entered when V  
exceeds 0.3V and tracking down  
TRACK/SS  
R6  
R4  
LTC3616  
TRACK/SS2  
LTC3616  
TRACK/SS1  
behaviorispossibleiftheV  
voltageisbelow0.6V.  
TRACK/SS  
V
IN  
This allows TRACK/SS to be used as an external reference  
between 0.3V and 0.6V if desired. During the run state in  
DDR mode, the power good window moves in relation  
LTC3616 CHANNEL 2  
SLAVE  
LTC3616 CHANNEL 1  
MASTER  
3616 F07b  
Figure 7b. Setup for Ratiometric Tracking  
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Efficiency Considerations  
to the actual TRACK/SS pin voltage if the voltage value  
is between 0.3V and 0.6V. Note: if TRACK/SS voltage is  
0.6V, either the tracking circuit or the internal reference  
can be used.  
Theefficiencyofaswitchingregulatorisequaltotheoutput  
power divided by the input power times 100%. It is often  
useful to analyze individual losses to determine what is  
limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
During up/down tracking the output current foldback is  
disabled and the PGOOD pin is always pulled down (see  
Figure 9).  
Efficiency = 100% – (L1 + L2 + L3 + ...)  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
0.6V  
PIN  
V
FB  
VOLTAGE  
0V  
0.6V  
TRACK/SS  
PIN VOLTAGE  
0.2V  
0V  
V
IN  
RUN PIN  
VOLTAGE  
0V  
V
IN  
SV PIN  
IN  
VOLTAGE  
0V  
TIME  
SHUTDOWN SOFT-START  
RUN STATE  
REDUCED  
SWITCHING  
FREQUENCY  
RUN STATE  
STATE  
STATE  
> 1ms  
3616 F08  
t
SS  
DOWN  
TRACKING TRACKING  
STATE STATE  
UP  
Figure 8. DDR Pin Not Tied to SVIN  
0.45V  
0.3V  
V
PIN  
FB  
VOLTAGE  
0V  
EXTERNAL  
VOLTAGE  
REFERENCE 0.45V  
0.45V  
0.3V  
TRACK/SS  
PIN VOLTAGE  
0.2V  
0V  
V
IN  
RUN PIN  
VOLTAGE  
0V  
V
IN  
SV PIN  
IN  
VOLTAGE  
0V  
TIME  
SHUTDOWN SOFT-START  
STATE STATE  
> 1ms  
RUN STATE  
REDUCED  
SWITCHING  
FREQUENCY  
RUN STATE  
3616 F09  
t
SS  
DOWN  
TRACKING  
STATE  
UP  
TRACKING  
STATE  
Figure 9. DDR Pin Tied to SVIN. Example DDR Application  
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Although all dissipative elements in the circuit produce  
losses, two main sources usually account for most of  
However, in applications where the LTC3616 is running  
at high ambient temperature with low supply voltage and  
high duty cycles, such as in dropout, the heat dissipated  
mayexceedthemaximumjunctiontemperatureofthepart.  
If the junction temperature reaches approximately 170°C,  
both power switches will be turned off and the SW node  
will become high impedance.  
2
the losses: V quiescent current and I R losses. The V  
IN  
IN  
quiescent current loss dominates the efficiency loss at  
2
very low load currents whereas the I R loss dominates  
the efficiency loss at medium to high load currents. In a  
typical efficiency plot, the efficiency curve at very low load  
currents can be misleading since the actual power lost is  
usually of no consequence.  
To prevent the LTC3616 from exceeding the maximum  
junction temperature, some thermal analysis is required.  
The temperature rise is given by:  
1. TheV quiescentcurrentisduetotwocomponents:the  
IN  
DCbiascurrentasgivenintheElectricalCharacteristics  
and the internal main switch and synchronous switch  
gate charge currents. The gate charge current results  
fromswitchingthegatecapacitanceoftheinternalpower  
MOSFET switches. Each time the gate is switched from  
low to high to low again, a packet of charge dQ moves  
T
= (P )(θ )  
D JA  
RISE  
where P is the power dissipated by the regulator and  
D
θ
is the thermal resistance from the junction of the die  
JA  
to the ambient temperature. The junction temperature,  
T , is given by:  
J
from V to ground. The resulting dQ/dt is the current  
IN  
T = T + T  
RISE  
J
A
out of V due to gate charge, and it is typically larger  
IN  
where T is the ambient temperature.  
A
than the DC bias current. Both the DC bias and gate  
chargelossesareproportionaltoV ;thus, theireffects  
IN  
As an example, consider the case when the LTC3616 is in  
dropout at an input voltage of 3.3V with a load current of  
6A at an ambient temperature of 70°C. From the Typical  
Performance Characteristics graph of Switch Resistance,  
will be more pronounced at higher supply voltages.  
2
2. I R losses are calculated from the resistances of the  
internal switches, R , and external inductor, R . In  
SW  
L
the R  
resistance of the P-channel switch is 0.035Ω.  
DS(ON)  
continuous mode the average output current flowing  
through inductor L is “chopped” between the main  
switch and the synchronous switch. Thus, the series  
resistance looking into the SW pin is a function of both  
Therefore, power dissipated by the part is:  
2
P = (I ) R  
= 1.26W  
D
OUT  
DS(ON)  
For the QFN package, the θ is 38°C/W.  
JA  
top and bottom MOSFET R  
(DC) as follows:  
and the duty cycle  
DS(ON)  
Therefore, the junction temperature of the regulator op-  
erating at 70°C ambient temperature is approximately:  
R
= (R )(DC) + (R )(1 – DC)  
DS(ON)TOP DS(ON)BOT  
SW  
T = 1.26W • 38°C/W + 70°C = 118°C  
J
The R  
for both the top and bottom MOSFETs can  
DS(ON)  
be obtained from the Typical Performance Character-  
We cansafelyassumethattheactualjunctiontemperature  
will not exceed the absolute maximum junction tempera-  
ture of 125°C.  
2
istics curves. To obtain I R losses, simply add R to  
SW  
R and multiply the result by the square of the average  
L
output current.  
Note that for very low input voltage, the junction tempera-  
ture will be higher due to increased switch resistance,  
Other losses including C and C  
ESR dissipative  
OUT  
IN  
losses and inductor core losses generally account for  
R
. It is not recommended to use full load current  
DS(ON)  
less than 2% of the total loss.  
for high ambient temperature and low input voltage.  
To maximize the thermal performance of the LTC3616 the  
exposed pad should be soldered to a ground plane. See  
the PCB Layout Board Checklist.  
Thermal Considerations  
In most applications, the LTC3616 does not dissipate  
much heat due to its high efficiency.  
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Design Example  
Finally, define the soft start-up time choosing the proper  
value for the capacitor and the resistor connected to  
As a design example, consider using the LTC3616 in an  
application with the following specifications:  
TRACK/SS. If we set minimum t = 5ms and a resistor  
SS  
of 2MΩ, the following equation can be solved with the  
V = 2.25V to 5.5V, V  
= 1.8V, I  
= 6A, I  
OUT(MAX) OUT(MIN)  
maximum SV = 5.5V :  
IN  
OUT  
IN  
= 200mA, f = 2.6MHz.  
5ms  
CSS =  
= 21.6nF  
Efficiency is important at both high and low load current,  
so Burst Mode operation will be utilized.  
5.5V  
5.5V – 0.6V  
2MΩ In  
First, calculate the timing resistor:  
3.8211Hz  
The standard value of 22nF guarantees the minimum soft-  
start up time of 5ms.  
RT =  
k – 16k = 130kΩ  
2.6MHz  
Figure 1 shows the schematic for this design example.  
Next, calculate the inductor value for about 30% ripple  
PC Board Layout Checklist  
current at maximum V :  
IN  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of  
the LTC3616:  
⎞ ⎛  
1.8V  
2.6MHz 2A  
1.8V  
5.5V  
L =  
1–  
= 0.233µH  
⎟ ⎜  
⎠ ⎝  
Using a standard value of 0.22µH inductor results in a  
maximum ripple current of:  
1. Agroundplaneisrecommended.Ifagroundplanelayer  
is not used, the signal and power grounds should be  
segregated with all small-signal components returning  
to the SGND pin at one point which is then connected  
to the PGND pin close to the LTC3616.  
1.8V  
1.8V  
5.5V  
I =  
1–  
= 2.12A  
L
2.6MHz0.22µH  
2. Connect the (+) terminal of the input capacitor(s), C ,  
C
will be selected based on the ESR that is required  
IN  
OUT  
ascloseaspossibletothePV pin, andthe()terminal  
to satisfy the output voltage ripple requirement and the  
bulk capacitance needed for loop stability. For this design,  
a 150µF (or 47µF plus 100µF) ceramic capacitor is used  
with a X5R or X7R dielectric.  
IN  
as close as possible to the exposed pad, PGND. This  
capacitorprovidestheACcurrentintotheinternalpower  
MOSFETs.  
3. Keep the switching node, SW, away from all sensitive  
small-signal nodes.  
Assumingworst-caseconditionsofV =2V ,C should  
IN  
OUT IN  
be selected for a maximum current rating of:  
4. Flood all unused areas on all layers with copper. Flood-  
ing with copper will reduce the temperature rise of  
powercomponents. ConnectthecopperareastoPGND  
(exposed pad) for best performance.  
1.8V  
3.6V  
3.6V  
1.8V  
I
RMS = 6A •  
– 1 = 3A  
RMS  
Decoupling PV with four 22µF capacitors is adequate  
IN  
for most applications.  
5. Connect the V pin directly to the feedback resistors.  
FB  
The resistor divider must be connected between V  
and SGND.  
OUT  
IfwesetR2=196k, thevalueofR1cannowbedetermined  
by solving the following equation.  
1.8V  
0.6V  
R1 = 196k •  
1  
A value of 392k will be selected for R1.  
3616fc  
23  
For more information www.linear.com/LTC3616  
LTC3616  
Typical applicaTions  
General Purpose Buck Regulator Using Ceramic Capacitors, 2.25MHz  
V
IN  
2.25V TO 5.5V  
22µF  
×4  
R
F
24Ω  
C
F
1µF  
SV  
RUN  
PV  
IN  
R
IN  
SS  
4.7M  
SRLIM/DDR  
TRACK/SS  
RT/SYNC  
C
SS  
L1  
10nF  
0.22µH  
LTC3616  
V
1.8V  
6A  
R4  
100k  
OUT  
SW  
SGND  
PGND  
R
15k  
C
C
C
O2  
100µF  
O1  
PGOOD  
PGOOD  
ITH  
MODE  
47µF  
C
C
C1  
10pF  
C
R5A  
1M  
R1  
392k  
V
FB  
470pF  
C3  
22pF  
R2  
196k  
R5B  
1M  
3616 TA02a  
L1: VISHAY IHLP-2525CZ-01 220nH  
Efficiency vs Output Current  
Load Step Forced Continuous Mode  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 1.8V, V = 3.3V  
IN  
OUT  
V
OUT  
200mV/DIV  
I
OUT  
5A/DIV  
V
V
V
V
= 2.5V  
= 3.3V  
= 4V  
IN  
IN  
IN  
IN  
3616 TA02c  
V
V
= 3.3V  
50µs/DIV  
IN  
= 1.8V  
OUT  
OUT  
= 5.5V  
I
= 100mA TO 3A  
= 1.5V  
V
MODE  
1
10  
100  
1000  
10000  
OUTPUT CURRENT (mA)  
3616 TA02b  
3616fc  
24  
For more information www.linear.com/LTC3616  
LTC3616  
Typical applicaTions  
Master and Slave for Coincident Tracking Outputs Using a ±MHz External Clock  
V
IN  
2.25V TO 5.5V  
22µF  
×4  
R
F1  
4.7M  
10nF  
24Ω  
C
F1  
1µF  
SV  
PV  
IN  
IN  
RUN  
CHANNEL 1  
MASTER  
TRACK/SS SRLIM/DDR  
RT/SYNC  
1MHz  
CLOCK  
L1  
0.47µH  
LTC3616  
SW  
V
1.8V  
6A  
OUT1  
R5  
100k  
R
C1  
C
C
O12  
100µF  
O11  
PGOOD  
PGOOD  
ITH  
SGND  
PGND  
15k  
47µF  
C
C
C2  
10pF  
C1  
R1  
MODE  
V
FB  
4.7M  
4.7M  
R3  
470pF  
715k  
464k  
C3  
22pF  
R2  
357k  
R4  
464k  
R
22µF  
×4  
F2  
24Ω  
C
F2  
1µF  
SV  
PV  
IN  
IN  
RUN  
TRACK/SS  
RT/SYNC  
CHANNEL 2  
SLAVE  
SRLIM/DDR  
L2  
0.47µH  
LTC3616  
V
1.2V  
6A  
OUT2  
R7  
100k  
SW  
SGND  
PGND  
R
C2  
C
C
O22  
100µF  
O21  
PGOOD  
PGOOD  
ITH  
15k  
47µF  
C
C
C4  
10pF  
C3  
R5  
301k  
MODE  
V
FB  
470pF  
C7  
22pF  
R6  
301k  
L1, L2: VISHAY IHLP-2525CZ-01 470nH  
3616 TA03a  
Coincident Start-Up  
Coincident Tracking Up/Down  
V
V
OUT1  
OUT2  
V
OUT1  
500mV/DIV  
500mV/DIV  
V
OUT2  
3616 TA03b  
3616 TA03c  
2ms/DIV  
200ms/DIV  
3616fc  
25  
For more information www.linear.com/LTC3616  
LTC3616  
package DescripTion  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
UDD Package  
24-Lead Plastic QFN (3mm × 5mm)  
(Reference LTC DWG # 05-08-1833)  
0.70 0.05  
3.50 0.05  
2.ꢀ0 0.05  
ꢀ.50 REF  
3.65 0.05  
ꢀ.65 0.05  
PACKAGE OUTLINE  
0.25 0.05  
0.50 BSC  
3.50 REF  
4.ꢀ0 0.05  
5.50 0.05  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
PIN ꢀ NOTCH  
R = 0.20 OR 0.25  
× 45° CHAMFER  
0.75 0.05  
ꢀ.50 REF  
23  
R = 0.05 TYP  
3.00 0.ꢀ0  
24  
0.40 0.ꢀ0  
PIN ꢀ  
TOP MARK  
(NOTE 6)  
2
3.65 0.ꢀ0  
ꢀ.65 0.ꢀ0  
5.00 0.ꢀ0  
3.50 REF  
(UDD24) QFN 0808 REV Ø  
0.200 REF  
0.00 – 0.05  
0.25 0.05  
0.50 BSC  
R = 0.ꢀꢀ5  
TYP  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
ꢀ. DRAWING IS NOT A JEDEC PACKAGE OUTLINE  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
3616fc  
26  
For more information www.linear.com/LTC3616  
LTC3616  
revision hisTory  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
A
4/11  
Added V specification in the Electrical Characteristics section.  
4
RUN  
B
11/13 Add H and MP grades and applicable temperature range references.  
Modified Note 2.  
Throughout  
4
7, 8  
15  
15  
3
Modified Typical Performance Characteristics graphs.  
Modified Inductor Core Selection section.  
Modified Input Capacitor Selection section.  
C
4/14  
Modified the top switch current limit specification.  
3616fc  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
27  
LTC3616  
Typical applicaTion  
DDR Termination With Ratiometric Tracking of VDD, ±MHz  
Ratiometric Start-Up  
V
IN  
3.3V  
V
DD  
C1  
22µF  
×4  
SV  
RUN  
TRACK/SS  
RT/SYNC  
PV  
IN  
IN  
V
V
TT  
DD  
500mV/DIV  
SRLIM/DDR  
1.8V  
R6  
562k  
R3  
R8  
100k  
L1  
LTC3616  
365k  
0.33µH  
V
TT  
R7  
187k  
PGOOD  
PGOOD  
ITH  
SW  
0.9V  
3A  
C4  
C5  
47µF  
R
C
6k  
3616 TA04b  
100µF  
500µs/DIV  
SGND  
PGND  
V
FB  
C
C
C1  
10pF  
C
R1  
200k  
MODE  
2.2nF  
R4  
1M  
C3  
22pF  
R2  
200k  
R5  
1M  
L1: COILCRAFT DO3316T  
3616 TA04a  
relaTeD parTs  
PART NUMBER DESCRIPTION  
COMMENTS  
95% Efficiency, V  
LTC3418  
5.5V, 8A (I ), 4MHz, Synchronous Step-Down DC/DC  
= 2.25V, V  
= 5.5V, V  
= 0.8V,  
= 0.6V,  
OUT  
IN(MIN)  
IN(MAX)  
OUT(MIN)  
Converter  
I = 380µA, I <1µA, 5mm × 7mm QFN-38 Package  
Q SD  
LTC3415  
5.5V, 7A (I ), 1.5MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V  
= 2.5V, V  
= 5.5V, V  
IN(MAX) OUT(MIN)  
OUT  
IN(MIN)  
Converter  
I = 450µA, I <1µA, 5mm × 7mm QFN-38 Package  
Q SD  
LTC3414/  
LTC3416  
5.5V, 4A (I ), 4MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V  
= 2.25V, V  
= 5.5V, V  
= 0.8V,  
=
OUT  
IN(MIN)  
IN(MAX)  
OUT(MIN)  
OUT(MIN)  
Converter  
I = I = 64µA, I <1µA, TSSOP20E Package  
Q Q SD  
LTC3413  
LTC3412A  
LTC3612  
5.5V, 3A (I  
Sink/Source), 2MHz, Monolithic Synchronous  
90% Efficiency, V  
= 2.25V, V  
= 5.5V, V  
IN(MAX)  
OUT  
IN(MIN)  
Regulator for DDR/QDR Memory Termination  
V
REF  
/2, I = 280µA, I <1µA, TSSOP16E Package  
Q
SD  
5.5V, 2.5A (I ), 4MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V  
I = 60µA, I <1µA, 4mm × 4mm QFN-16 TSSOP16E Package  
Q SD  
= 2.5V, V  
= 5.5V, V  
= 0.8V,  
OUT(MIN)  
OUT  
IN(MIN)  
IN(MAX)  
Converter  
5.5V, 3A (I ), 4MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V  
I = 70µA, I <1µA, 3mm × 4mm QFN-20 TSSOP20E Package  
Q SD  
= 2.25V, V  
= 5.5V, V  
= 0.6V,  
OUT  
IN(MIN)  
IN(MAX)  
OUT(MIN)  
Converter  
3616fc  
LT 0414 REV C • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
LINEAR TECHNOLOGY CORPORATION 2010  
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTC3616  

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