RH1013MJ8#PBF [Linear]
IC DUAL OP-AMP, 750 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Operational Amplifier;
| 型号： | RH1013MJ8#PBF |
| 厂家： | 
Linear |
| 描述： | IC DUAL OP-AMP, 750 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Operational Amplifier 放大器 CD |
| 文件： | 总19页 (文件大小：472K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPEC NO. 05-08-5013 REV. L
REV
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
DATE
0
A
INITIAL RELEASE
06/12/96
09/05/96
PARAGRAPH 3.8 NOW REFLECTS THE CORRECT FIGURES FOR BURN-IN CIRCUITS FOR EACH
PERTINENT PACKAGE. DELETION OF PARAGRAPHS 3.12.1 AND 3.12.2, AND INCORPORATION
OF PARAGRAPH 3.12.1 INTO PARAGRAPH 3.12, PAGE 4. CHANGED BURN-IN CIRCUIT FOR
FLATPACK. BURN-IN CIRCUIT NOW REFLECTS A CIRCUIT THAT IS USED FOR BOTH STATIC
AND DYNAMIC. REMAINING FIGURES WILL BE RENUMBERED. WILL NOT CHANGE.
PARAGRAPH 4.5.2 MOVED FROM PAGE 5 TO PAGE 4. ENTIRE SPECIFICATION IS RENUMBERED.
ENTIRE SPECIFICATION REV’D.
B
11/25/97
·
·
·
·
·
PAGE 2, ADDED PARAGRAPHS 3.2.1, 3.2.2, AND 3.2.3.
PAGE 2, PARAGRAPH 3.3.b: ADDED “(SEE PARAGRAPH 3.2)”.
PAGE 3, ADDED PARAGRAPHS 3.8.1, 3.8.2, AND 3.8.3.
PAGE 4, PARAGRAPH 4.4.2, GROUP B INSPECTION WAS REDEFINED.
PAGE 5, PARAGRAPH 4.4.3, GROUP D INSPECTION WAS REDEFINED.
PARAGRAPH 4.5.1, SOURCE INSPECTION WAS REDEFINED.
·
·
·
PAGES 6, 7, 8, FIGURES 1, 2, 3 CASE OUTLINES: ADDED θja AND θjc .
PAGE 9, REDREW FIGURES 5 AND 6 TERMINAL CONNECTIONS.
UPDATED ENTIRE SPEC TO REVISION B.
C
D
12/18/97
03/20/98
·
·
·
·
PAGE 17, CHANGED VOS MIN DELTA LIMIT FROM –60 μV to –200 μV, AND CHANGED VOS
MAX DELTA LIMIT FROM 60 μV TO 200 μV.
ADDED A SECOND PAGE FOR REVISION RECORD. UPDATED ENTIRE SPEC TO NEXT
REVISION DUE TO THE ADDITIONAL PAGE.
PAGE 3, PARAGRAPH 3.2.3, CHANGED PACKAGE TYPE TO 10 LEAD FLATPACK GLASS
SEAL.
PAGE 4, PARAGRAPH 3.8.3, CHANGED OPTION 3 TO FLATPACK GLASS SEAL, AND
PARAGRAPH 3.10.3, CHANGED LEAD MATERIAL AND FINISH TO KOVAR WITH HOT
SOLDER DIP ON ALL PACKAGE OPTIONS.
·
PAGE 5, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
·
·
·
·
PAGE 9, FIGURE 3, CHANGED PACKAGE TYPE TO FLATPACK GLASS SEAL.
PAGE 10, FIGURE 6, CHANGED PACKAGE TYPE TO FLATPACK GLASS SEAL.
PAGE 14, FIGURE 10, CHANGED PACKAGE TYPE TO FLATPACK GLASS SEAL.
PAGE 7,8,9, FIGURE 1,2,3, CHANGED θJA AND θJC.
E
09/28/99
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
1
L
18
L
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
17
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
ORIG
DSGN
ENGR
MFG
CM
MICROCIRCUIT, LINEAR,
RH1013M, DUAL PRECISION
OPERATIONAL AMPLIFIER
QA
SIZE CAGE CODE DRAWING NUMBER REV
64155 05-08-5013
DATE CONTRACT:
PROG
FUNCT
L
APPLICATION
SIGNOFFS
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
PAGE 1 OF 18
SPEC NO. 05-08-5013 REV. L
REV
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
DATE
F
11/18/99
·
·
PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3 HAD FIGURES 1, 2, AND 3 REMOVED.
PAGE 4, PARAGRAPH 3.7, CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2.
PARAGRAPH 3.9, ADDED “HEREIN” AFTER “TABLE II”, LINE 2.
·
·
PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PARAGRAPH 4.4.1, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PAGE 6, PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF
TABLE 11A OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IIA IN MIL-STD-
883”. PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF
TABLE IV OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD-
883’.
G
H
08/30/00
04/08/03
·
PAGE 9, CHANGED THETA JA TO θJA=170°C/W AND THETA JC TO θJC=40°C/W FROM
θJA=225°C/W AND θJC=18°C/W PER PACKAGE ENGINEER.
PAGE 3:
·
PARAGRAPH 3.2.1 ADDED “OPTION 1”, PARAGRAPH 3.2.2, ADDED “OPTION 2”, PARAGRAPH
3.2.3, ADDED “OPTION 3”.
·
PAGE 4:
PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.9, TABLE II CHANGED TO TABLE III.
PARAGRAPH 3.10.3, ADDED “DEVICE OPTIONS 1, 2, AND 3” TO LINE 1.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per second” TO
“…dosage rate of less than or equal to 10 Rads per second”.
·
PAGE 5:
PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
·
PAGE 6:
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
·
PAGES 7 THROUGH 15, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
·
PAGE 8:
LEAD SHOULDER DIAMETER MAX NOW 0.065 INCHES (WAS 0.068).
·
·
·
·
·
PAGE 9: CASE OUTLINE UPDATED TO MIL-STD-1835.
PAGE 10: MOVED FIGURES TO BETTER FIT THE PAGE.
PAGE 17: TABLE IA HAS BECOME TABLE II.
PAGE 18: TABLE II HAS BECOME TABLE III. TABLE III HAS BECOME TABLE IV.
PAGE 9:
J
5/19/03
CASE OUTLINE DRAWING CHANGED PIN 1 NOTCH MOVED TO INSIDE LEAD LOCATION.
K
L
03/15/05
04/23/08
·
·
PAGE 4: CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED
TO 3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
PAGE 4, PARAGRAPH 3.10.3 CHANGED OPTION 2 & ADDED OPTION 3 AS ALLOY 42.
PARAGRAPH 3.11.1 CHANGED VERBIAGE.
·
LINEAR TECHNOLOGY CORPORATION
PAGE 2 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
1.0
2.0
SCOPE:
1.1
This specification defines the performance and test requirements for a microcircuit processed to a space level
manufacturing flow.
APPLICABLE DOCUMENTS:
2.1 Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
MIL-PRF-38535
MIL-STD-883
MIL-STD-1835
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
Test Method and Procedures for Microcircuits
Microcircuits Case Outlines
2.2
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of
this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced
specifications.
3.0
REQUIREMENTS:
3.1
3.2
General Description: This specification details the requirements for the RH1013M DUAL PRECISION
OPERATIONAL AMPLIFIER, processed to space level manufacturing flow.
Part Number:
3.2.1 Option 1 – RH1013MH (TO5 Metal Can, 8 Leads)
3.2.2 Option 2 – RH1013MJ8 (Ceramic Dip, 8 Leads)
3.2.3 Option 3 – RH1013MW (Glass Sealed Flatpack, 10 Leads)
Part Marking Includes:
3.3
a.
b.
c.
d.
e.
LTC Logo
LTC Part Number (See Paragraph 3.2)
Date Code
Serial Number
ESD Identifier per MIL-PRF-38535, Appendix A
LINEAR TECHNOLOGY CORPORATION
PAGE 3 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
3.4
The Absolute Maximum Ratings:
Supply Voltage (Pin 8 to Pin 4)
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+22V
+30V
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Differential Input Voltage
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Input Voltage
Equal to Positive Supply Voltage
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5V Below Negative Supply Voltage
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Output Short Circuit Duration 1/
Operating Temperature Range
Storage Temperature Range
INDEFINITE
-55°C to +125°C
-65°C to +150°C
.
.
.
.
.
.
Lead Temperature (Soldering, 10 sec)
. . .
+300°C
1/ Parameter is guaranteed by design, characterization, or correlation to other tested parameters.
Electrostatic discharge sensitivity, ESDS, shall be Class 1.
3.5
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
3.7
3.8
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
Burn-In Requirement:
3.8.1 Option 1 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8
3.8.2 Option 2 (Ceramic Dip): Static/Dynamic Burn-In, Figure 9
3.8.3 Option 3 (Glass Sealed Flatpack) : Static/Dynamic Burn-In, Figure 10
3.9
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after each
burn-in, and the delta rejects are included in the PDA calculation.
3.10
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.10.1 Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1, Figure 2, and Figure 3.
3.10.2 Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5, and
Figure 6.
3.10.3 Lead Material and Finish: The lead material and finish for Device Options 1, shall be Kovar and
options 2, 3 are Alloy 42.The lead finishes shall be hot solder dip (Finish letter A) in accordance
with MIL-PRF-38535.
3.11
Radiation Hardness Assurance (RHA):
3.11.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a
guideline.
LINEAR TECHNOLOGY CORPORATION
PAGE 4 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
3.11.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the
manufacturer will provide certified RAD testing and report through an independent test laboratory
when required as a customer purchase order line item.
3.11.3 Total dose bias circuit is specified in Figure 11.
3.12
3.13
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
4.0
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
4.2
4.3
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method 5005
with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and 3.4 of the
test method.
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test method.
Electrical testing shall be as specified in Table IV herein.
4.3.1 Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
4.4
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1 Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2 Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroup B2 (Resistance to Solvents / Mark Permanency) and Subgroup B3
(Solderability) are performed prior to the first shipment from any inspection lot and Attributes
provided when a Full Space Data Pack is ordered. Subgroup B5 (Operating Life) is performed on
each wafer lot. This subgroup may or may not be from devices built in the same package style as the
current inspection lot. Attributes and variables data for this subgroup will be provided upon request
at no charge.
4.4.2.1 Group B, Subgroup 2c = 10%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
Group B, Subgroup 3 = 10%
Group B, Subgroup 4 = 5%
whichever is the larger quantity)
Group B, Subgroup 6 = 15%
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
LINEAR TECHNOLOGY CORPORATION
PAGE 5 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
4.4.3 Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each assembly
location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is
ordered.
4.4.3.1 Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2 All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The quantity
(accept number) or sample number and accept number of all other subgroups are per MIL-
STD-883, Method 5005, Table IV.
4.5
Source Inspection:
4.5.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal
visual.
4.5.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to
shipment for each lot of deliverables when specified as a customer purchase order line item. This
may include wafer lot acceptance and final data review.
4.6
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1 Lot Serial Number Sheets identifying all devices accepted through final inspection by serial number.
4.6.2 100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3 Burn-In Variables Data and Deltas (if applicable)
4.6.4 Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5 Generic Group D data (4.4.3 herein)
4.6.6 SEM photographs (3.13 herein)
4.6.7 Wafer Lot Acceptance Report (3.13 herein)
4.6.8 X-Ray Negatives and Radiographic Report
4.6.9 A copy of outside test laboratory radiation report if ordered
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this specification
and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is
noted on the Purchase Order Review Form as “No Charge Data”.
5.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices shall
be packaged in conductive material or packaged in anti-static material with an external conductive field shielding
barrier.
LINEAR TECHNOLOGY CORPORATION
PAGE 6 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 1
(H) TO5 / 8 LEADS CASE OUTLINE
θja = +150°C/W
θjc = +40°C/W
FIGURE 1
LINEAR TECHNOLOGY CORPORATION
PAGE 7 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 2
(J8) CERAMIC DIP / 8 LEADS CASE OUTLINE
0.045 – 0.065
(1.14 – 1.65)
FULL LEAD
OPTION
NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. 8 LEAD D MAX = .405 (10.287)
θja = +110°C/W
θjc = +30°C/W
FIGURE 2
LINEAR TECHNOLOGY CORPORATION
PAGE 8 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 3
(W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR OFF-CENTER
LID, MENISCUS AND GLASS OVER RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH WHEN
LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +170°C/W
θjc = +40°C/W
FIGURE 3
LINEAR TECHNOLOGY CORPORATION
PAGE 9 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
TERMINAL CONNECTIONS
DEVICE OPTION #1, TO5 8 LEAD METAL CAN
DEVICE OPTION #2, 8 LEAD CERAMIC DIP
FIGURE 4
FIGURE 5
DEVICE OPTION #3, GLASS SEALED
10 LEAD FLATPACK
FIGURE 6
LINEAR TECHNOLOGY CORPORATION
PAGE 10 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 7
LINEAR TECHNOLOGY CORPORATION
PAGE 11 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 8
LINEAR TECHNOLOGY CORPORATION
PAGE 12 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
STATIC/DYNAMIC BURN-IN CIRCUIT
OPTION 2, CERDIP / 8 LEADS
FIGURE 9
LINEAR TECHNOLOGY CORPORATION
PAGE 13 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
STATIC/DYNAMIC BURN-IN CIRCUIT
OPTION 3, FLATPACK GLASS SEAL
FIGURE 10
LINEAR TECHNOLOGY CORPORATION
PAGE 14 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
TOTAL DOSE BIAS CIRCUIT
FIGURE 11
LINEAR TECHNOLOGY CORPORATION
PAGE 15 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION)
Note: Table I electrical characteristics notes are on the next page following Table II .
LINEAR TECHNOLOGY CORPORATION
PAGE 16 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE
LINEAR TECHNOLOGY CORPORATION
PAGE 17 OF 18
SPEC NO. 05-08-5013 REV. L
RH1013M, DUAL PRECISION OPERATIONAL AMPLIFIER
TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
T = 25°C, V = +15V, V = 0V unless otherwise noted
CM
A
S
ENDPOINT LIMIT
DELTA
PARAMETER
MIN
-300
-30
MAX
300
0
MIN
-200
-3
MAX
200
3
UNITS
μV
nA
VOS
+IB
-IB
-30
0
-3
3
nA
TABLE IV: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
FINAL ELECTRICAL TEST REQUIREMENTS (METHOD
5004)
SUBGROUP
1*, 2, 3, 4, 5, 6
GROUP A TEST REQUIREMENTS (METHOD 5005)
GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL
PARAMETERS (METHOD 5005)
1, 2, 3, 4, 5, 6
1, 2, 3
*PDA APPLIES TO SUBGROUP 1.
PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the
final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1 and
delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to determine
the percent for the lot
LINEAR TECHNOLOGY CORPORATION
PAGE 18 OF 18
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