LMX321AXK [MAXIM]

PLASTIC ENCAPSULATED DEVICES; 塑封器件
LMX321AXK
型号: LMX321AXK
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

PLASTIC ENCAPSULATED DEVICES
塑封器件

运算放大器 放大器电路 光电二极管
文件: 总9页 (文件大小:91K)
中文:  中文翻译
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LMX321AxK  
Rev. A  
RELIABILITY REPORT  
FOR  
LMX321AxK  
PLASTIC ENCAPSULATED DEVICES  
May 26, 2002  
MAXIM INTEGRATED PRODUCTS  
120 SAN GABRIEL DR.  
SUNNYVALE, CA 94086  
Written by  
Reviewed by  
Jim Pedicord  
Quality Assurance  
Reliability Lab Manager  
Bryan J. Preeshl  
Quality Assurance  
Executive Director  
Conclusion  
The LMX321 successfully meets the quality and reliability standards required of all Maxim products. In addition,  
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality  
and reliability standards.  
Table of Contents  
I. ........Device Description  
II. ........Manufacturing Information  
III. .......Packaging Information  
IV. .......Die Information  
V. ........Quality Assurance Information  
VI. .......Reliability Evaluation  
......Attachments  
I. Device Description  
A. General  
The LMX321 is a single, low-cost, low-voltage, pin-to-pin compatible upgrade to the LMV321 general-purpose op  
amp. This device offers Rail-to-Rail® outputs and an input common-mode range that extends below ground. This op  
amp draws only 105µA of quiescent current per amplifier, operates from a single +2.3V to +7V supply, and drives  
2k resistive loads to within 40mV of either rail. The LMX321 is unity-gain stable with a 1.3MHz gain-bandwidth  
product capable of driving capacitive loads up to 400pF. The combination of low voltage, low cost, and small package  
size makes this amplifier ideal for portable/battery-powered equipment.  
The LMX321 single op amp is available in ultra-small 5-pin SC70 and space-saving 5-pin SOT23 packages.  
B. Absolute Maximum Ratings  
Item  
Rating  
Supply Voltage (VCC to VEE)  
Differential Input Voltage (VIN+ - VIN-)  
OUT_ to VEE  
Short-Circuit Duration (OUT_ shorted to VCC or VEE)  
Continuous Power Dissapation (TA = +700C)  
Storage Temp.  
Junction Temperature  
Lead Temp. (10 sec.)  
Power Dissipation  
-0.3V to +8V  
VEE to VCC  
-0.3V to (VCC + 0.3V)  
Continuous  
-65°C to +150°C  
+150°C  
+300°C  
5 Lead SOT23  
5 Lead SC70  
571mW  
247mW  
Derates above +70°C  
5 Lead SOT-23  
5 Lead SC70  
7.1mW/°C  
3.1mW/°C  
II. Manufacturing Information  
A. Description/Function:  
B. Process:  
Single, General Purpose, Low-Voltage, Rail-to-Rail Op Amp  
CB20 (High Speed Complementary Bipolar Process)  
C. Number of Device Transistors:  
88  
D. Fabrication Location:  
E. Assembly Location:  
F. Date of Initial Production:  
Oregon, USA  
Philippines, Malaysia or Thailand  
July, 2001  
III. Packaging Information  
A. Package Type:  
B. Lead Frame:  
5 Lead SOT-23  
5-Lead SC70  
Copper  
Alloy 42  
C. Lead Finish:  
Solder Plate  
Solder Plate  
D. Die Attach:  
Silver-filled Epoxy  
Gold (1 mil dia.)  
Epoxy with silica filler  
Buildsheet # 05-2501-0167  
Class UL94-V0  
Silver-filled Epoxy  
Gold (1 mil dia.)  
Epoxy with silica filler  
Buildsheet # 05-2501-0168  
Class UL94-V0  
E. Bondwire:  
F. Mold Material:  
G. Assembly Diagram:  
H. Flammability Rating:  
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1  
IV. Die Information  
A. Dimensions:  
31 x 30 mils  
B. Passivation:  
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)  
C. Interconnect:  
Gold  
D. Backside Metallization:  
E. Minimum Metal Width:  
F. Minimum Metal Spacing:  
G. Bondpad Dimensions:  
H. Isolation Dielectric:  
I. Die Separation Method:  
None  
2 microns (as drawn)  
2 microns (as drawn)  
5 mil. Sq.  
SiO2  
Wafer Saw  
V. Quality Assurance Information  
A. Quality Assurance Contacts:  
Jim Pedicord  
Bryan Preeshl  
Kenneth Huening  
(Reliability Lab Manager)  
(Executive Director)  
(Vice President)  
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.  
0.1% For all Visual Defects.  
C. Observed Outgoing Defect Rate: < 50 ppm  
D. Sampling Plan: Mil-Std-105D  
VI. Reliability Evaluation  
A. Accelerated Life Test  
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure  
Rate (l ) is calculated as follows:  
l =  
1
=
1.83  
(Chi square value for MTTF upper limit)  
MTTF  
192 x 4389 x 79 x 2  
Temperature Acceleration factor assuming an activation energy of 0.8eV  
l = 13.76 x 10-9  
l = 13.76 F.I.T. (60% confidence level @ 25°C)  
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to  
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects  
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be  
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece  
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In  
Schematic (Spec. # 06-5662) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test  
monitors. This data is published in the Product Reliability Report (RR-1L).  
B. Moisture Resistance Tests  
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample  
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard  
85°C/85%RH testing is done per generic device/package family once a quarter.  
C. E.S.D. and Latch-Up Testing  
The OX63 die type has been found to have all pins able to withstand a transient pulse of ±25000V, per Mil-  
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device  
withstands a current of ±250mA.  
Table 1  
Reliability Evaluation Test Results  
LMX321AxK  
TEST ITEM  
TEST CONDITION  
FAILURE  
IDENTIFICATION  
SAMPLE  
SIZE  
NUMBER OF  
FAILURES  
PACKAGE  
Static Life Test (Note 1)  
Ta = 135°C  
Biased  
DC Parameters  
& functionality  
79  
0
Time = 192 hrs.  
Moisture Testing (Note 2)  
Pressure Pot  
Ta = 121°C  
P = 15 psi.  
DC Parameters  
& functionality  
SC70  
SOT23  
77  
99  
0
0
RH= 100%  
Time = 168hrs.  
85/85  
Ta = 85°C  
RH = 85%  
Biased  
DC Parameters  
& functionality  
77  
77  
0
Time = 1000hrs.  
Mechanical Stress (Note 2)  
Temperature  
Cycle  
-65°C/150°C  
1000 Cycles  
Method 1010  
DC Parameters  
0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the package.  
Note 2: Generic package/process data  
Attachment #1  
TABLE II. Pin combination to be tested. 1/ 2/  
Terminal A  
Terminal B  
(The common combination  
of all like-named pins  
(Each pin individually  
connected to terminal A  
with the other floating)  
connected to terminal B)  
All pins except VPS1 3/  
All input and output pins  
All VPS1 pins  
1.  
2.  
All other input-output pins  
1/ Table II is restated in narrative form in 3.4 below.  
2/ No connects are not to be tested.  
3/ Repeat pin combination I for each named Power supply and for ground  
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).  
Pin combinations to be tested.  
3.4  
a.  
Each pin individually connected to terminal A with respect to the device ground pin(s) connected  
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.  
b.  
Each pin individually connected to terminal A with respect to each different set of a combination  
of all named power supply pins (e.g., VSS1, or V  
or V  
or VCC1, or VCC2) connected to  
SS2  
SS3  
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be  
open.  
c.  
Each input and each output individually connected to terminal A with respect to a combination of all the  
other input and output pins connected to terminal B. All pins except the input or output pin being tested and the  
combination of all the other input and output pins shall be open.  
TERMINAL C  
R2  
R1  
S1  
TERMINAL A  
REGULATED  
HIGH VOLTAGE  
SUPPLY  
DUT  
S2  
SHORT  
SOCKET  
C1  
CURRENT  
PROBE  
(NOTE 6)  
TERMINAL B  
R = 1.5kW  
C = 100pf  
TERMINAL D  
Mil Std 883D  
Method 3015.7  
Notice 8  
ONCE PER BOARD  
ONCE PER SOCKET  
10 K  
+5V  
10 OHMS  
1.0 uA  
0.1uF  
1
2
3
6
5
2 K  
4
6 - SOT  
18 K  
10 K  
DEVICES: MAX 4464/4470/4400/4401/4480/4481/  
DRAWN BY: TODD BEJSOVEC  
4490/4291/4465/4466/4335/4336/4245/LMX321/4231  
MAX CURRENT: MAX4481/MAX4291/LMX321= 800uA / MAX4464/4470/  
4480/4465/4466= 400uA / MAX4400/4401/4245=1.2mA / MAX4490=2.5mA  
MAX4435/4436/4231/4230=3.4mA  
DOCUMENT I.D. 06-5662  
REVISION E  
MAXIM TITLE: BI Circuit  
PAGE 2 OF 3  
(MAX4464/4470/4465/4466/4400/4401/4480/4481/4490/4291/4335/4336/4245/LMX321/  
4231/4230)  

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