MAX8752 [MAXIM]

TFT LCD Step-Up DC-DC Converter; TFT LCD升压型DC -DC转换器
MAX8752
型号: MAX8752
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

TFT LCD Step-Up DC-DC Converter
TFT LCD升压型DC -DC转换器

转换器 CD
文件: 总12页 (文件大小:240K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
19-3793; Rev 0; 8/05  
TFT LCD Step-Up DC-DC Converter  
General Description  
Features  
The MAX8752 is a high-performance, step-up DC-DC  
converter that provides a regulated supply voltage for  
active-matrix thin-film transistor (TFT) liquid-crystal dis-  
plays (LCDs). The MAX8752 incorporates current-mode,  
fixed-frequency, pulse-width modulation (PWM) circuitry  
with a built-in n-channel power MOSFET to achieve high  
efficiency and fast transient response. The input supply  
voltage of the MAX8752 is from 1.8V to 5.5V.  
1.8V to 5.5V Input Supply Range  
Built-In 14V, 2.2A, 0.2Ω n-Channel MOSFET  
High Efficiency (> 85%)  
Fast Transient Response to Pulsed Load  
High-Accuracy Output Voltage (1.5%)  
Internal Digital Soft-Start  
The MAX8752 operates with a switching frequency of  
1.2MHz, allowing the use of ultrasmall inductors and low-  
ESR ceramic capacitors. The current-mode architecture  
provides fast transient response to the pulsed loads typi-  
cal of LCD source-driver applications. A compensation  
pin (COMP) gives users flexibility in adjusting loop  
dynamics. The 14V internal MOSFET can generate output  
voltages up to 13V. The internal digital soft-start and cur-  
rent limit effectively control inrush and fault currents.  
Input Supply Undervoltage Lockout  
1.2MHz Switching Frequency  
0.1µA Shutdown Current  
Small 8-Pin TDFN Package  
The MAX8752 is available in a 3mm x 3mm 8-pin TDFN  
package with a maximum height of 8mm.  
Ordering Information  
Applications  
Notebook Computer Displays  
TEMP  
PIN-  
PKG  
PART  
RANGE  
PACKAGE  
CODE  
LCD Monitor Panels  
8 TDFN  
3mm x 3mm  
MAX8752ETA -40°C to +85°C  
T833-2  
Automotive Displays  
Typical Operating Circuit  
Pin Configuration  
V
IN  
V
+1.8V TO +5.5V  
MAIN  
TOP VIEW  
LX  
IN  
FB  
MAX8752  
MAX8752  
GND  
SUP  
COMP  
LDO  
SHDN  
IN  
TDFN  
3mm x 3mm  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
TFT LCD Step-Up DC-DC Converter  
ABSOLUTE MAXIMUM RATINGS  
LX, SUP to GND .....................................................-0.3V to +14V  
Continuous Power Dissipation (T = +70°C)  
A
IN, SHDN, LDO to GND............................................-0.3V to +6V  
10-Pin TDFN (derate 18.2mW/°C above +70°C) .......1454mW  
FB to GND ...................................................-0.3V to (V + 0.3V)  
Operating Temperature Range ...........................-40°C to +85°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range.............................-65°C to +160°C  
Lead Temperature (soldering, 10s) .................................+300°C  
IN  
LDO  
COMP to GND..........................................-0.3V to (V  
+ 0.3V)  
LX Switch Maximum Continuous RMS Current.....................1.6A  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V = V  
IN  
= 2.5V, T = 0°C to +85°C. Typical values are at T = +25°C, unless otherwise noted.)  
SHDN  
A
A
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
UNITS  
Input Supply Range  
1.8  
V
V
Output Voltage Range  
13  
IN Undervoltage Lockout  
Threshold  
V
rising, typical hysteresis is 200mV  
0.90  
1.30  
1.75  
V
IN  
V
V
= 1.3V, not switching  
= 1.0V, switching  
0.18  
2
0.35  
5
FB  
FB  
IN Quiescent Current  
mA  
IN Shutdown Current  
SHDN = GND  
6V V 13V, I  
0.1  
5.0  
2.7  
10.0  
5.4  
3.0  
µA  
V
LDO Output Voltage  
= 12.5mA  
LDO  
4.6  
2.4  
15  
SUP  
LDO Undervoltage Lockout  
LDO Output Current  
V
rising, typical hysteresis is 200mV  
V
LDO  
mA  
V
SUP Supply Voltage Range  
4.5  
13.0  
14.0  
SUP Overvoltage-Lockout  
Threshold  
V
V
rising, typical hysteresis is 200mV (Note 1)  
rising, typical hysteresis is 200mV (Note 2)  
13.2  
13.6  
V
V
SUP  
SUP  
SUP Undervoltage-Lockout  
Threshold  
1.4  
LX not switching  
LX switching  
1.5  
4
2.0  
8
SUP Supply Current  
ERROR AMPLIFIER  
FB Regulation Voltage  
mA  
I
I
= 200mA, T = 0°C to +25°C  
= 200mA, T = +25°C to +85°C  
1.218  
1.223  
1.240  
1.240  
0
1.262  
1.257  
40  
LX  
V
LX  
FB Input Bias Current  
FB Line Regulation  
Transconductance  
Voltage Gain  
V
V
= 1.24V  
nA  
%/V  
µS  
FB  
IN  
= 1.8V to 5.5V  
0.05  
180  
700  
0.15  
280  
70  
V/V  
OSCILLATOR  
Frequency  
1000  
88  
1220  
92  
1500  
96  
kHz  
%
Maximum Duty Cycle  
2
_______________________________________________________________________________________  
TFT LCD Step-Up DC-DC Converter  
ELECTRICAL CHARACTERISTICS (continued)  
(V = V  
IN  
= 2.5V, T = 0°C to +85°C. Typical values are at T = +25°C, unless otherwise noted.)  
SHDN  
A
A
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
n-CHANNEL MOSFET  
Current Limit  
V
V
= 1V, 65% duty cycle  
1.8  
2.2  
0.2  
0.1  
0.3  
2.6  
0.4  
10  
A
Ω
FB  
LX  
On-Resistance  
Leakage Current  
= 12V  
µA  
V/A  
Current-Sense Transresistance  
SOFT-START  
0.2  
0.4  
Soft-Start Period  
13  
ms  
A
Soft-Start Step Size  
CONTROL INPUTS  
SHDN Input Low Voltage  
SHDN Input High Voltage  
SHDN Input Current  
0.275  
V
V
= 1.8V to 5.5V  
= 1.8V to 5.5V  
0.6  
V
V
IN  
IN  
0.7 × V  
IN  
0.001  
1.000  
µA  
ELECTRICAL CHARACTERISTICS  
(V = V  
IN  
= 2.5V, T = -40°C to +85°C. unless otherwise noted.)  
A
SHDN  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
13  
UNITS  
Input Supply Range  
1.8  
V
V
V
Output Voltage Range  
IN Undervoltage-Lockout Threshold  
V
V
V
rising, typical hysteresis is 200mV  
= 1.3V, not switching  
0.90  
1.75  
0.35  
5
IN  
FB  
FB  
IN Quiescent Current  
mA  
= 1.0V, switching  
LDO Output Voltage  
6V V  
13V, I  
= 12.5mA  
4.6  
2.4  
15  
5.4  
3.0  
V
V
SUP  
LDO  
LDO Undervoltage Lockout  
LDO Output Current  
V
rising, typical hysteresis is 200mV  
LDO  
mA  
V
SUP Supply Voltage Range  
SUP Overvoltage-Lockout Threshold  
SUP Undervoltage-Lockout Threshold  
4.5  
13.2  
13.0  
14.0  
1.4  
2.0  
8
V
V
rising, typical hysteresis is 200mV (Note 1)  
rising, typical hysteresis is 200mV (Note 2)  
V
SUP  
SUP  
V
LX not switching  
LX switching  
SUP Supply Current  
mA  
ERROR AMPLIFIER  
FB Regulation Voltage  
OSCILLATOR  
I
= 200mA  
1.210  
940  
1.7  
1.270  
1560  
V
LX  
Frequency  
kHz  
n-CHANNEL MOSFET  
Current Limit  
V
= 1V, 65% duty cycle  
2.7  
0.4  
0.4  
A
Ω
FB  
On-Resistance  
Current-Sense Transresistance  
0.2  
V/A  
_______________________________________________________________________________________  
3
TFT LCD Step-Up DC-DC Converter  
ELECTRICAL CHARACTERISTICS (continued)  
(V = V  
IN  
= 2.5V, T = -40°C to +85°C. unless otherwise noted.)  
A
SHDN  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
CONTROL INPUTS  
SHDN Input Low Voltage  
V
V
= 1.8V to 5.5V  
= 1.8V to 5.5V  
0.6  
V
V
IN  
IN  
0.7 ×  
SHDN Input High Voltage  
V
IN  
Note 1: Step-up regulator inhibited when VSUP exceeds this threshold.  
Note 2: Step-up regulator inhibited until VSUP exceeds this threshold.  
Note 3: Specifications to -40°C are guaranteed by design, not production tested.  
Typical Operating Characteristics  
(Circuit of Figure 1, V = 2.5V, V  
= 10V, T = +25°C, unless otherwise noted.)  
A
IN  
MAIN  
OUTPUT VOLTAGE ERROR  
vs. LOAD CURRENT  
EFFICIENCY vs. LOAD CURRENT  
EFFICIENCY vs. LOAD CURRENT  
0.5  
0
90  
85  
80  
75  
70  
65  
60  
55  
50  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
V
= 5V  
IN  
L1 = 3.3μH  
L1 = 2.6μH  
V
= 5V  
IN  
V
= 5V  
IN  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
V
= 3.3V  
IN  
V
= 1.8V  
IN  
V
= 1.8V  
IN  
V
= 3.3V  
IN  
V
= 3.3V  
IN  
V
= 1.8V  
IN  
1
10  
100  
1000  
10,000  
10  
100  
LOAD CURRENT (mA)  
1000  
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
IN SUPPLY CURRENT  
vs. SUPPLY VOLTAGE  
SWITCHING FREQUENCY ERROR  
vs. INPUT VOLTAGE  
IN SUPPLY CURRENT  
vs. TEMPERATURE  
50  
40  
30  
20  
10  
0
0.2  
0.1  
50  
40  
30  
20  
10  
0
NO LOAD  
NORMAL FB  
V
= 1.8V  
IN  
0
-0.1  
-0.2  
-0.3  
-0.4  
-0.5  
-0.6  
V
= 3.3V  
IN  
V
= 1.3V  
FB  
V
= 5V  
IN  
1.5  
2.5  
3.5  
4.5  
5.5  
1.8  
2.8  
3.8  
4.8  
5.8  
-40  
-20  
0
20  
40  
60  
80  
SUPPLY VOLTAGE (V)  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
4
_______________________________________________________________________________________  
TFT LCD Step-Up DC-DC Converter  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, V = 2.5V, V  
IN  
= 10V, T = +25°C, unless otherwise noted.)  
MAIN  
A
SOFT-START (HEAVY LOAD)  
LOAD TRANSIENT RESPONSE  
PULSED-LOAD TRANSIENT RESPONSE  
MAX8752 toc08  
MAX8752 toc07  
MAX8752 toc09  
I
I
MAIN  
MAIN  
1A/div  
200mA/div  
100mA  
0A  
0A  
INDUCTOR  
CURRENT  
1A/div  
INDUCTOR  
CURRENT  
1A/div  
INDUCTOR  
CURRENT  
1A/div  
0A  
0A  
0V  
V
MAIN  
5V/div  
10V  
10V  
V
V
MAIN  
MAIN  
500mA/div  
200mV/div  
10V OFFSET  
10V OFFSET  
2ms/div  
100μs/div  
10μs/div  
SUP SUPPLY CURRENT  
vs. SUP VOLTAGE  
SUP SUPPLY CURRENT  
vs. TEMPERATURE  
SWITCHING WAVEFORMS  
MAX8752 toc10  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
I
= 140mA  
LOAD  
NO LOAD  
LX  
5V/div  
4.2  
3.8  
3.4  
3.0  
V
= 3.3V  
IN  
0V  
V
= 1.8V  
IN  
V
= 1.8V  
IN  
V
= 5V  
IN  
INDUCTOR  
CURRENT  
500mA/div  
V
= 5V  
IN  
V
= 3.3V  
12  
IN  
I
= 300mA  
LOAD  
0A  
4
6
8
10  
14  
-40  
-20  
0
20  
40  
60  
80  
1μs/div  
SUP VOLTAGE (V)  
TEMPERATURE (°C)  
LDO OUTPUT VOLTAGE  
vs. LDO CURRENT  
LDO OUTPUT VOLTAGE  
vs. TEMPERATURE  
5.08  
5.06  
5.04  
5.02  
5.00  
4.98  
4.96  
4.94  
5.08  
5.06  
5.04  
5.02  
5.00  
4.98  
0
10  
20  
30  
40  
50  
-40  
-20  
0
20  
40  
60  
80  
LDO CURRENT (mA)  
TEMPERATURE (°C)  
_______________________________________________________________________________________  
5
TFT LCD Step-Up DC-DC Converter  
Pin Description  
PIN  
NAME  
FUNCTION  
Compensation Pin for Error Amplifier. Connect a series resistance and capacitor from COMP to GND.  
See the Loop Compensation section for component selection guidelines.  
1
COMP  
Feedback Pin. The FB regulation voltage is 1.24V nominal. Connect an external resistive voltage-  
divider between the step-up regulator’s output (V  
FB. Place the divider close to the IC and minimize the trace area to reduce noise coupling. Set V  
) and GND, with the center tap connected to  
MAIN  
2
FB  
MAIN  
according to the Output Voltage Selection section.  
3
4
SHDN  
Shutdown Control Input. Drive SHDN low to turn off the MAX8752.  
GND  
Ground  
Switching Node. LX is the drain of the internal MOSFET. Connect the inductor/rectifier diode junction  
to LX and minimize the trace area for lower EMI.  
5
6
7
LX  
IN  
Supply Pin. Connect IN to the input supply through a series 100Ω resistor and bypass it to GND with  
0.1µF or greater ceramic capacitor.  
Internal 5V Linear-Regulator Output. This regulator powers all internal circuitry. Bypass LDO to GND  
with a 0.22µF or greater ceramic capacitor.  
LDO  
Linear-Regulator Supply Input. SUP is the supply input of the internal 5V linear regulator. Connect  
SUP to the step-up regulator output and bypass SUP to GND with a 0.1µF capacitor.  
8
SUP  
BP  
Backside Paddle. Connect the backside paddle to analog ground.  
C11  
V
GON  
28V/10mA  
D4  
0.1μ  
F
C13  
C10  
0.1μF  
V
C9  
GOFF  
0.1μF  
D2  
D3  
0.1μ  
F
-9V/20mA  
C12  
0.1  
C8  
μ
F
0.1μF  
V
V
IN  
MAIN  
L1  
2.6μH  
+1.8V TO +5.5V  
+10V/240mA  
D1  
C2  
C1  
10μF  
R1  
90.9k  
1%  
10  
μ
F
R4  
16V  
Ω
6.3V  
LX  
100Ω  
IN  
FB  
C3  
0.1μF  
R2  
13k  
Ω
1%  
R3  
40.2k  
MAX8752  
Ω
COMP  
LDO  
GND  
SUP  
C6  
20pF  
C4  
1.2nF  
C14  
C7  
0.22μF  
0.1μF  
SHDN  
Figure 1. Typical Applications Circuit  
_______________________________________________________________________________________  
6
TFT LCD Step-Up DC-DC Converter  
current trip point each time the internal MOSFET turns  
on. As the load changes, the error amplifier sources or  
sinks current to the COMP output to set the inductor  
peak current necessary to service the load. To maintain  
stability at high duty cycles, a slope-compensation sig-  
nal is summed with the current-sense signal.  
CLOCK  
LX  
LOGIC  
AND DRIVER  
GND  
CURRENT LIMIT  
STARTUP  
OSC  
On the rising edge of the internal clock, the controller  
sets a flip-flop, turning on the n-channel MOSFET and  
applying the input voltage across the inductor. The cur-  
rent through the inductor ramps up linearly, storing  
energy in its magnetic field. Once the sum of the cur-  
rent-feedback signal and the slope compensation  
exceed the COMP voltage, the controller resets the flip-  
flop and turns off the MOSFET. Since the inductor cur-  
rent is continuous, a transverse potential develops  
across the inductor that turns on the diode (D1). The  
voltage across the inductor then becomes the differ-  
ence between the output voltage and the input voltage.  
This discharge condition forces the current through the  
inductor to ramp back down, transferring the energy  
stored in the magnetic field to the output capacitor and  
the load. The MOSFET remains off for the rest of the  
clock cycle.  
IN  
SOFT-  
START  
I
LIMIT  
SLOPE COMP  
CURRENT  
SENSE  
OSCILLATOR  
PWM  
COMPARATOR  
SHDN  
SUP  
ERROR AMP  
LINEAR  
REGULATOR  
AND  
FB  
1.24V  
MAX8752  
LDO  
BOOTSTRAP  
COMP  
Figure 2. MAX8752 Functional Diagram  
Detailed Description  
At light loads, this architecture allows the MAX8752 to  
“skip” cycles to prevent overcharging the output  
capacitor voltage.  
The MAX8752 is a highly efficient, step-up power sup-  
ply designed for TFT-LCD panels. The typical circuit  
shown in Figure 1 operates from an input voltage as  
low as 1.8V, and produces a MAIN output of 10V at  
220mA from 2.5V input while supporting discrete  
diode-capacitor charge pumps that produce  
-9V at 20mA and +28V at 10mA. If the charge-pump  
outputs are not required, the diodes and capacitors  
associated with them may be eliminated and the main  
output increased to 270mA.  
In this region of operation, the inductor ramps up to a  
peak value of approximately 250mA, discharges to the  
output, and waits until another pulse is needed.  
Output-Current Capability  
The output-current capability of the MAX8752 is a func-  
tion of current limit, input voltage, operating frequency,  
and inductor value. Because of the slope compensa-  
tion used to stabilize the feedback loop, the inductor  
current limit depends on the duty cycle. The current  
limit is determined by the following equation:  
The MAX8752 employs a current-mode, fixed-frequen-  
cy, pulse-width modulation (PWM) architecture for fast  
transient response and low-noise operation. The high  
switching frequency (1.2MHz) allows the use of low-  
profile inductors and ceramic capacitors to minimize  
the thickness of LCD panel designs. The integrated  
high-efficiency MOSFET and the IC’s built-in digital  
soft-start function reduce the number of external com-  
ponents required. The output voltage can be set from  
I
= (1.162 - 0.361 x D) x I  
LIM_EC  
LIM  
where I  
_
is the current limit specified at 65% duty  
LIM EC  
cycle (see the Electrical Characteristics) and D is the  
duty cycle.  
The output current capability depends on the current-  
limit value and is governed by the following equation:  
V
IN  
to 13V with an external resistive voltage-divider.  
The MAX8752 regulates the output voltage through a  
combination of an error amplifier, two comparators, and  
several signal generators (Figure 2). The error amplifier  
compares the signal at FB to 1.24V and varies the  
COMP output. The voltage at COMP determines the  
0.5 x D V  
V
V
OUT  
IN  
IN  
I
= I  
x
x η  
OUT(MAX)  
LIM  
f
x L  
OSC  
_______________________________________________________________________________________  
7
TFT LCD Step-Up DC-DC Converter  
where I  
is the current limit calculated above, η is the  
LIM  
Table 1. Component List  
regulator efficiency (85% nominal), and D is the duty  
cycle. The duty cycle when operating at the current  
limit is:  
DESIGNATION  
DESCRIPTION  
10µF 10%, 4V X5R ceramic capacitor  
(0603)  
TDK C1608X5R0G106K  
Murata GRM188R60G106M  
C1  
V
V + V  
IN DIODE  
OUT  
D =  
V
I  
× R  
+ V  
OUT  
LIM  
ON DIODE  
10µF 10%, 16V X5R ceramic capacitor  
(1206)  
TDK C3216X5R1C106K  
Murata GRM319R61A106K  
C2  
where V  
ON  
is the rectifier diode forward voltage and  
DIODE  
R
is the on-resistance of the internal MOSFET.  
3A, 30V Schottky diode (M-flat)  
Toshiba CRS02  
D1  
L1  
Bootstrapping and Soft-Start  
The MAX8752 features bootstrapping operation. In nor-  
mal operation, the internal linear regulator supplies  
power to the internal circuitry. The input of the linear  
regulator (SUP) should be directly connected to the  
output of the step-up regulator. After the input voltage  
at SUP is above 1.75V, the regulator starts open-loop  
switching to generate the supply voltage for the linear  
regulator. The internal reference block turns on when  
the LDO voltage exceeds 2.7V (typ).  
2.6µH, 2.1A power inductor  
3.3µH, 1.7A power inductor  
Sumida CDRH6D12-3R3  
Applications Information  
Step-up regulators using the MAX8752 can be  
designed by performing simple calculations for a first  
iteration. All designs should be prototyped and tested  
prior to production. Table 1 provides a list of power  
components for the typical applications circuit. Table 2  
lists component suppliers.  
When the reference voltage reaches regulation, the  
PWM controller and the current-limit circuit are enabled  
and the step-up regulator enters soft-start. During the  
soft-start, the main step-up regulator directly limits the  
peak inductor current, allowing from zero up to the full  
current limit in eight equal current steps. The maximum  
load current is available after the output voltage reach-  
es regulation (which terminates soft-start), or after the  
soft-start timer expires (13ms typ). The soft-start routine  
minimizes the inrush current and voltage overshoot and  
ensures a well-defined startup behavior.  
External component value choice is primarily dictated  
by the output voltage and the maximum load current,  
as well as maximum and minimum input voltages.  
Begin by selecting an inductor value. Once the induc-  
tor value and peak current are known, choose the  
diode and capacitors.  
Inductor Selection  
The minimum inductance value, peak current rating,  
and series resistance are factors to consider when  
selecting the inductor. These factors influence the con-  
verter’s efficiency, maximum output load capability,  
transient response time, and output voltage ripple.  
Physical size and cost are also important factors to  
consider.  
Shutdown  
The MAX8752 shuts down to reduce the supply current  
to 0.1µA when SHDN is low. In this mode, the internal ref-  
erence, error amplifier, comparators, and biasing circuit-  
ry turn off and the n-channel MOSFET is turned off. In  
shutdown, the step-up regulator’s output is connected to  
IN through the external inductor and rectifier diode.  
Table 2. Component Suppliers  
SUPPLIER  
PHONE  
FAX  
WEBSITE  
www.murata.com  
Murata  
Sumida  
TDK  
770-436-1300  
847-545-6700  
847-803-6100  
949-455-2000  
770-436-3030  
847-545-6720  
847-803-6296  
949-859-3963  
www.sumida.com  
www.component.tdk.com  
www.toshiba.com/taec  
Toshiba  
8
_______________________________________________________________________________________  
TFT LCD Step-Up DC-DC Converter  
The maximum output current, input voltage, output volt-  
age, and switching frequency determine the inductor  
value. Very high inductance values minimize the cur-  
rent ripple and therefore reduce the peak current,  
which decreases core losses in the inductor and I2R  
losses in the entire power path. However, large induc-  
tor values also require more energy storage and more  
turns of wire, which increase physical size and can  
increase I2R losses in the inductor. Low inductance val-  
ues decrease the physical size but increase the current  
ripple and peak current. Finding the best inductor  
involves choosing the best compromise between circuit  
efficiency, inductor size, and cost.  
I
is the positive charge-pump output current,  
POS  
assuming the pump source for I  
is V  
MAIN.  
POS  
Calculate the approximate inductor value using the typ-  
ical input voltage (V ), the maximum output current  
IN  
(I  
), the expected efficiency (η  
) taken from  
MAIN(MAX)  
TYP  
an appropriate curve in the Typical Operating  
Characteristics, and an estimate of LIR based on the  
above discussion:  
2
V
V
V  
× f  
η
TYP  
LIR  
IN  
MAIN  
IN  
L =  
V
I
MAIN  
MAIN(MAX)  
OSC ⎠  
The equations used here include a constant, LIR, which  
is the ratio of the inductor peak-to-peak ripple current  
to the average DC inductor current at the full-load cur-  
rent. The best trade-off between inductor size and cir-  
cuit efficiency for step-up regulators generally has an  
LIR between 0.3 and 0.5. However, depending on the  
AC characteristics of the inductor core material and  
ratio of inductor resistance to other power path resis-  
tances, the best LIR can shift up or down. If the induc-  
tor resistance is relatively high, more ripple can be  
accepted to reduce the number of turns required and  
increase the wire diameter. If the inductor resistance is  
relatively low, increasing inductance to lower the peak  
current can decrease losses throughout the power  
path. If extremely thin high-resistance inductors are  
used, as is common for LCD panel applications, the  
best LIR can increase to between 0.5 and 1.0.  
Choose an available inductor value from an appropriate  
inductor family. Calculate the maximum DC input cur-  
rent at the minimum input voltage V  
using con-  
IN(MIN)  
servation of energy and the expected efficiency at that  
operating point (η ) taken from an appropriate curve  
MIN  
in the Typical Operating Characteristics:  
I
× V  
MAIN  
MAIN(MAX)  
I
=
IN(DC,MAX)  
V
× η  
MIN  
IN(MIN)  
Calculate the ripple current at that operating point and  
the peak current required for the inductor:  
Once a physical inductor is chosen, higher and lower  
values of the inductor should be evaluated for efficien-  
cy improvements in typical operating regions.  
V
× (V  
V  
)
IN(MIN)  
MAIN  
IN(MIN)  
× f  
OSC  
I
I
=
RIPPLE  
L × V  
MAIN  
In Figure 1, the LCD’s gate-on and gate-off voltages  
are generated from two unregulated charge pumps dri-  
ven by the step-up regulator’s LX node. The additional  
load on LX must therefore be considered in the induc-  
tance calculation. The effective maximum output cur-  
RIPPLE  
I
= I  
+
PEAK  
IN(DC,MAX)  
2
The inductor’s saturation current rating and the  
MAX8752’s LX current limit (I ) should exceed I  
rent I  
becomes the sum of the maximum load  
MAIN(EFF)  
LIM  
PEAK  
current on the step-up regulator’s output plus the con-  
tributions from the positive and negative charge  
pumps:  
and the inductor’s DC current rating should exceed  
I
. For good efficiency, choose an inductor  
IN(DC,MAX)  
with less than 0.1Ω series resistance.  
Considering the Typical Applications Circuit (Figure 1),  
I
= I  
I
+ η  
x I  
+ (η  
+ 1) x  
MAIN(EFF)  
MAIN(MAX)  
NEG NEG  
POS  
the maximum load current (I  
) is 180mA with a  
MAIN(MAX)  
10V output and a typical input voltage of 2.5V:  
POS  
I
= 180mA + 1 x 20mA + 3 x 10mA = 230mA  
MAIN(EFF)  
where I  
is the maximum main output current,  
MAIN(MAX)  
n
n
is the number of negative charge-pump stages,  
is the number of positive charge-pump stages,  
is the negative charge-pump output current, and  
NEG  
POS  
NEG  
I
_______________________________________________________________________________________  
9
TFT LCD Step-Up DC-DC Converter  
Choosing an LIR of 0.5 and estimating efficiency of  
80% at this operating point:  
Input Capacitor Selection  
The input capacitor (C ) reduces the current peaks  
IN  
drawn from the input supply and reduces noise injec-  
tion into the IC. A 10µF ceramic capacitor is used in the  
Typical Applications Circuit (Figure 1) because of the  
high source impedance seen in typical lab setups.  
Actual applications usually have much lower source  
impedance since the step-up regulator often runs  
directly from the output of another regulated supply.  
2
⎞ ⎛  
2.5V  
10V  
10V 2.5V  
0.80  
0.50  
L =  
2.6μH  
⎟ ⎜  
0.23A × 1.2MHz  
⎠ ⎝  
Using the circuit’s minimum input voltage (2.2V) and  
estimating efficiency of 75% at that operating point:  
Typically, C can be reduced below the values used in  
IN  
0.23A × 10V  
the Typical Applications Circuit. Ensure a low noise  
I
=
1.4A  
IN(DC,MAX)  
2.2V × 0.75  
supply at IN by using adequate C . Alternatively,  
IN  
greater voltage variation can be tolerated on C if IN is  
IN  
The ripple current and the peak current are:  
decoupled from C using an RC lowpass filter (see R3  
IN  
and C3 in Figure 1).  
2.2V × (10V 2.2V)  
I
=
0.55A  
RIPPLE  
Rectifier Diode Selection  
The MAX8752’s high switching frequency demands a  
high-speed rectifier. Schottky diodes are recommend-  
ed for most applications because of their fast recovery  
time and low forward voltage. The diode should be  
rated to handle the output voltage and the peak switch  
current. Make sure that the diode’s peak current rating  
2.6μH × 10V × 1.2MHz  
0.55A  
I
= 1.4A +  
1.7A  
PEAK  
2
Output Capacitor Selection  
The total output voltage ripple has two components: the  
capacitive ripple caused by the charging and discharg-  
ing of the output capacitance, and the ohmic ripple due  
to the capacitor’s equivalent series resistance (ESR):  
is at least I  
calculated in the Inductor Selection  
PEAK  
section and that its breakdown voltage exceeds the  
output voltage.  
Output Voltage Selection  
The MAX8752 operates with an adjustable output from  
V
= V  
+ V  
RIPPLE  
RIPPLE(C) RIPPLE(ESR)  
V
to 13V. Connect a resistive voltage-divider from the  
IN  
output (V  
) to GND with the center tap connected to  
MAIN  
FB (see Figure 1). Select R2 in the 10kΩ to 50kΩ range.  
Calculate R1 with the following equation:  
I
C
V
V
V  
MAIN  
MAIN IN  
V
, and  
RIPPLE(C)  
f
OUT  
MAIN OSC  
V
V
MAIN  
R1 = R2 ×  
1  
FB  
V
I  
R
RIPPLE(ESR)  
PEAK ESR(COUT)  
where V , the step-up regulator’s feedback set point,  
FB  
is 1.24V (typ). Place R1 and R2 close to the IC.  
where I  
is the peak inductor current (see the  
PEAK  
Inductor Selection section). For ceramic capacitors, the  
output voltage ripple is typically dominated by  
V
. The voltage rating and temperature charac-  
RIPPLE(C)  
teristics of the output capacitor must also be considered.  
10 ______________________________________________________________________________________  
TFT LCD Step-Up DC-DC Converter  
capacitor and input-capacitor ground terminals.  
Connect these loop components with short, wide  
connections. Avoid using vias in the high-current  
paths, especially the ground paths. If vias are  
unavoidable, use many vias in parallel to reduce  
resistance and inductance.  
Loop Compensation  
The voltage-feedback loop needs proper compensa-  
tion to prevent excessive output ripple and poor effi-  
ciency caused by instability. This is done by  
connecting a resistor (R  
) and capacitor (C  
)
COMP  
COMP  
in series from COMP to GND, and another capacitor  
(C ) from COMP to GND. R is chosen to set  
COMP2  
COMP  
2) Create a power ground island (PGND) consisting of  
the input and output capacitor grounds and GND.  
Connect all of these together with short, wide traces  
or a small ground plane. Maximizing the width of  
the power ground traces improves efficiency and  
reduces output voltage ripple and noise spikes.  
Create an analog ground plane (AGND) consisting  
of the feedback divider’s ground, the COMP capac-  
itor’s ground, and the IC’s exposed backside pad  
near pin 1. Connect the AGND and PGND islands  
by connecting the GND pin directly to the exposed  
backside pad. Make no other connections between  
these separate ground planes.  
the high-frequency integrator gain for fast transient  
response, while C is chosen to set the integrator  
COMP  
zero to maintain loop stability. The second capacitor,  
, is chosen to cancel the zero introduced by  
C
COMP2  
output-capacitance ESR. For optimal performance,  
choose the components using the following equations:  
264 × V × V  
× C  
OUT  
IN  
OUT  
R
COMP  
L × I  
MAIN(EFF)  
V
× C  
OUT  
OUT  
C
COMP  
10 × I  
× R  
MAIN(MAX)  
COMP  
3) Place the feedback voltage-divider resistors as  
close to FB as possible. The divider’s center trace  
should be kept short. Placing the resistors far away  
causes the FB trace to become an antenna that can  
pick up switching noise. Avoid running the feed-  
back trace near LX.  
0.02 × R  
× L × I  
MAIN(EFF)  
ESR  
C
COMP2  
V
× V  
OUT  
IN  
For the ceramic output capacitor, where ESR is small,  
is optional. The best gauge of correct loop  
4) Place the SUP and LDO bypass capacitors and the  
IN bypass capacitors (C3 in Figure 1) if within 5mm  
of their respective pins. Connect their ground termi-  
nals to GND through the IC’s exposed back paddle  
near GND (pin4).  
C
COMP2  
compensation is by inspecting the transient response  
of the MAX8752. Adjust R and C as neces-  
COMP  
COMP  
sary to obtain optimal transient performance.  
PC Board Layout and Grounding  
Careful PC board layout is important for proper opera-  
tion. Use the following guidelines for good PC board  
layout:  
5) Minimize the length and maximize the width of the  
traces between the output capacitors and the load  
for best transient responses.  
6) Minimize the size of the LX node while keeping it  
wide and short. Keep the LX node away from the  
feedback node and other sensitive nodes. Use DC  
traces as shield if necessary.  
1) Minimize the area of high-current loops by placing  
the inductor, rectifier diode, and output capacitors  
near the input capacitors and near the LX and GND  
pins. The high-current input loop goes from the  
positive terminal of the input capacitor to the induc-  
tor, to the IC’s LX pin, out the IC’s GND pin, and to  
the input capacitor’s negative terminal. The high-  
current output loop is from the positive terminal of  
the input capacitor to the inductor, to the rectifier  
diode (D1), to the positive terminal of the output  
capacitors, reconnecting between the output-  
Refer to the MAX8752 evaluation kit for an example of  
proper board layout.  
Chip Information  
TRANSISTOR COUNT: 3091  
PROCESS: BiCMOS  
______________________________________________________________________________________ 11  
TFT LCD Step-Up DC-DC Converter  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information  
go to www.maxim-ic.com/packages.)  
D2  
D
A2  
PIN 1 ID  
N
0.35x0.35  
b
[(N/2)-1] x e  
REF.  
PIN 1  
INDEX  
AREA  
E
E2  
DETAIL A  
e
A1  
k
C
C
L
L
A
L
L
e
e
PACKAGE OUTLINE, 6,8,10 & 14L,  
TDFN, EXPOSED PAD, 3x3x0.80 mm  
1
-DRAWING NOT TO SCALE-  
21-0137  
G
2
COMMON DIMENSIONS  
SYMBOL  
MIN.  
0.70  
2.90  
2.90  
0.00  
0.20  
MAX.  
0.80  
3.10  
3.10  
0.05  
0.40  
A
D
E
A1  
L
k
0.25 MIN.  
0.20 REF.  
A2  
PACKAGE VARIATIONS  
DOWNBONDS  
ALLOWED  
PKG. CODE  
T633-1  
N
6
D2  
E2  
e
JEDEC SPEC  
b
[(N/2)-1] x e  
1.90 REF  
1.90 REF  
1.95 REF  
1.95 REF  
1.95 REF  
2.00 REF  
2.40 REF  
2.40 REF  
1.50±0.10 2.30±0.10 0.95 BSC  
1.50±0.10 2.30±0.10 0.95 BSC  
1.50±0.10 2.30±0.10 0.65 BSC  
1.50±0.10 2.30±0.10 0.65 BSC  
1.50±0.10 2.30±0.10 0.65 BSC  
MO229 / WEEA  
MO229 / WEEA  
MO229 / WEEC  
MO229 / WEEC  
MO229 / WEEC  
0.40±0.05  
0.40±0.05  
0.30±0.05  
0.30±0.05  
0.30±0.05  
NO  
NO  
T633-2  
6
T833-1  
8
NO  
T833-2  
8
NO  
T833-3  
8
YES  
NO  
T1033-1  
T1433-1  
T1433-2  
10  
14  
14  
1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05  
1.70±0.10 2.30±0.10 0.40 BSC  
1.70±0.10 2.30±0.10 0.40 BSC  
- - - -  
- - - -  
0.20±0.05  
0.20±0.05  
YES  
NO  
PACKAGE OUTLINE, 6,8,10 & 14L,  
TDFN, EXPOSED PAD, 3x3x0.80 mm  
2
-DRAWING NOT TO SCALE-  
21-0137  
G
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2005 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products, Inc.  

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