PHY1090DS-WR [MAXIM]
0B10GbE Linear Transimpedance Amplifier;
| 型号： | PHY1090DS-WR |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 0B10GbE Linear Transimpedance Amplifier |
| 文件： | 总10页 (文件大小：730K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-5686; Rev 1/11
PHY1090
A Maxim Integrated Brand
10GbE Linear Transimpedance Amplifier
Features
• 1100nArms maximum input referred noise
• Linear up to 2mApp input level
• 2kΩ typical transimpedance
• Incorporates automatic gain control
• 3.3V power supply
• Integrated PIN filter capacitor & resistor
• OMA-based RSSI output current
• -40°C to +95°C operating range
• 1.169mm X 0.929mm die size
Description
The PHY1090 is a high linearity transimpedance
amplifier designed to be used in fiber optic
modules for EDC enabled 10Gbps applications.
The PHY1090 is optimised for applications
requiring low distortion and low input referred
noise, such as 10GBASE-LRM. When combined
with the PHY2060 EDC IC, the PHY1090
enables a complete EDC-enabled receive path,
ideally suited to the 10GBASE-LRM IEEE
standard.
The PHY1090 integrates
a
low noise
transimpedance amplifier and an automatic gain
control output stage to give a linear output over
a wide dynamic range. It also integrates an RC
filter in series with the photodiode cathode pads
to reduce ROSA cost.
Applications
• EDC enabled receivers
• OC192 Telecom systems
• IEEE 10GBASE-LRM receiver systems
VCC
RSSI
FILT1 VCC1 VCC2 ATE1 DP VSS1
1
4
2
3
5
6
ATE1
FILT
PDC
Voltage
Regulator
ATE2
ATE3
VSS6 22
PDC1 21
RSSI
200R
20pF
7
8
9
ATE2
VSS2
ATE3
Ω
Ω
50
50
RF
PHY1090
DP
DN
AGC
Amp
PDA 20
Amplifier
PDA
10 ATE4
11 VSS3
12 ATE5
PDC2 19
VSS5 18
ATE4
ATE5
Signal Detect &
DC Restore
ATE6
17
16
15
14
13
VSS
RSSI FILT2 ATE6
DN VSS4
Figure 2: Pad Layout
Figure 1: Block diagram
PHY1090-RD-1.3
Released Datasheet
Page 1
1.
2.
Ordering Information
Part Number
Description
PHY1090 bare die in waffle pack
PHY1090 bare die on film
PHY1090DS-WR
PHY1090DS-FR
Pad Descriptions
Number
Name
FILT1
VCC1
VCC2
ATE1
DP
Type
Analog
Description
1
2
Series resistor to PDC, connected internally to FILT2
Power supply connection
PWR/GND
PWR/GND
Test pads
Analog
3
Power supply connection
4
Probe test pad - Do not bond to these
Serial data output+
5
6
VSS1
ATE2
VSS2
ATE3
ATE4
VSS3
ATE5
VSS4
DN
PWR/GND
Test pads
PWR/GND
Test pads
Test pads
PWR/GND
Test pads
PWR/GND
Analog
Ground connection
7
Probe test pad - Do not bond to these
Ground connection
8
9
Probe test pad - Do not bond to these
Probe test pad - Do not bond to these
Ground connection
10
11
12
13
14
15
16
17
18
19
20
21
22
Probe test pad - Do not bond to these
Ground connection
Serial data output
ATE6
FILT2
RSSI
VSS5
PDC1
PDA
Test pads
Analog
Probe test pad - Do not bond to these
Series resistor to PDC, connected internally to FILT1
Current proportional to OMA in dBm
Ground connection
Analog
PWR/GND
Analog
Photodiode cathode connected internally to PDC2
Photodiode anode
Analog
PDC2
VSS6
Analog
Photodiode cathode connected internally to PDC1
Ground connection
PWR/GND
PHY1090-RD-1.3
Released Datasheet
Page 2
3. Device Specifications
3.1
Absolute Maximum Ratings
Parameter
Conditions
Min
-0.5
-55
Typ
Max
6
Unit
V
Supply voltage
Storage temperature
PDA Input Current A.C.
PDA Input Current D.C.
Operating temperature
Die attach temperature
+150
4.0
°C
ER = ∞
mApp
mA
°C
2.0
Measured on die
115
400
°C
Please note that functional device operation at these ratings is not guaranteed, nor implied. Sustained stress at these
ratings may affect device reliability.
3.2
ESD and Latch Up Ratings
Parameter
Conditions
Min
2
Typ
Max
Unit
kV
ESD – All pins except PDA
ESD – PDA pin
JEDEC JESD-A114 (HBM) Class 1c
JEDEC JESD-A114 (HBM) Class 1c
1
kV
The device is not guaranteed to meet parametric specifications. Permanent damage may be incurred by operating
beyond these limits.
3.3
Operating Conditions
Parameter
Conditions
Min
2.95
-40
Typ
Max
3.65
+95
Unit
V
Supply voltage
3.3
Operating temperature
Measured on back side of die
°C
3.4
Parametric Performance
Parametric performance is guaranteed over the specified Operating Conditions.
DC Specifications
Parameter
Supply current
Conditions
Min
Typ
Max
Unit
Vcc = 3.3V
45
68
mA
(VDP - VDN) / ΔVcc at 2MHz; no Vcc
decoupling
6
dB
Power supply
rejection ratio
(VDP - VDN) / ΔVcc at 5MHz; no Vcc
decoupling
14
dB
V
Input bias voltage
Transimpedance
PDA voltage; wrt Vss
1
At 10MHz;
Input current =40uApp
1600
2000
2700
Ω
Photodiode filter resistor
Output resistance
160
80
200
100
300
120
Ω
Ω
Differential
PHY1090-RD-1.3
Released Datasheet
Page 3
AC Specifications
Parameter
Condition
Min
Typ
Max
Unit
GHz
Over input current range:
150uApp - 1mApp, 100Ω differential
output load
-3dB Bandwidth1
5
6
Input current1
2
mApp
nArms
Measured using 7.5GHz 4th order
Bessel filter;
Input referred noise1
1100
Input current ≤ 150µApp
Input current ≥ 150µApp, 10.3Gbps data
filtered by 2.25GHz, 4th order Bessel-
Thomson filter
Differential output swing1
Differential output swing1
240
300
200
360
15
mVpp
mVpp
Input current ≥ 150µApp
- 10.3Gbps back-to-back
Low frequency cut-off
23uApp
< 5GHz
< 5GHz
kHz
dB
Output return loss, differential
Output return loss, single ended
8
8
20
20
dB
0.1GHz sinusoidal input; ER = 6.5dB;
current 100µA pp - 600µA pp
Total Harmonic Distortion (THD)
Total Harmonic Distortion (THD)
Gain flatness1
2
%
%
0.1GHz sinusoidal input; ER = 6.5dB;
current = 0.75 - 2mApp
6.5
100MHz - 5GHz; flatness referred to
100MHz; Input current ≤ 150µApp
±1.5
100
dB
27-1 PRBS; input current 2mApp, 5dB
extinction ratio
Deterministic jitter1
50
mUIpp
AGC settling time
RSSI Accuracy
Within 10% of final value
40
30
40
μs
%
AC input current 150μA to 500μA
RSSI response time
ms
Notes:
1
Using the circuit below for PD and bonding parameters (Figure 3) :
CPD = 0.3pF
LPD IN = 0.5nH
LOUT DP/DN = 0.5nH
LFILTER = 0.5nH
LVCC = 0.3nH
LVSS = 0.1nH
RPD = 15Ω;
RPD IN = 500mΩ;
ROUT DP/DN = 250mΩ
RFILTER = 250mΩ;
RVCC = 300mΩ;
RVSS = 100mΩ
- PD parasitics
_
_
_
_
- PDA bond wire parasitics
- DP/DN bond wire parasitics
- FILT bond wire parasitics
- Combined Vcc bond wire parasitics
- Combined Vss bond wire parasitics
RFILTER
LFILTER
3.3V
ROUT_DP
LOUT_DP
DOUT+
LFILTER
RFILTER
1
4
2
3
5
6
FILT1 VCC1 VCC2 ATE1 DP VSS1
22
VSS6
ATE2
VSS2
ATE3
7
8
9
RPD_IN
LPD_IN
21 PDC1
20 PDA
RVSS
LVSS
GND
PHY1090
(all 6 VSS pads
bonded)
RPD
LPD_IN
RPD_IN
ATE4 10
VSS3 11
CPD
19 PDC2
18 VSS5
ATE5
DN VSS4
14 13
12
RSSI FILT2 ATE6
17
16
15
ROUT_DN
LOUT_DN
DOUT-
Figure 3: Photodiode and bonding parameters
PHY1090-RD-1.3
Released Datasheet
Page 4
4. Device Description
VCC
RSSI
ATE1
FILT
Voltage
Regulator
ATE2
ATE3
RSSI
200R
20pF
PDC
Ω
Ω
50
50
RF
DP
DN
AGC
Amp
Amplifier
PDA
ATE4
ATE5
Signal Detect &
DC Restore
ATE6
VSS
Figure 4: PHY1090 TIA block diagram
The PHY1090 is a Transimpedance Amplifier (TIA) designed for 10GBASE-LRM applications. It provides
typical measured average power sensitivity for a ROSA featuring the PHY1090 of better than -18.5dBm at
10.3125Gbps. This is based upon a back-to-back link and under the conditions specified in Notes 1 and 2
of the Parametric Performance section. Since sensitivity is strongly dependant upon both the photo
detector’s capacitance and responsivity and individual ROSA design and bonding, this typical measured
sensitivity is for illustrative purposes only.
4.1
Photodiode Cathode Supply
The photodiode (PD) cathode power supply is connected externally. A 20pF capacitor and 200Ω resistor
are integrated into the PHY1090 to reduce cost of the ROSA, though additional decoupling within the
ROSA may still be used.
The pad layout of the PHY1090 has been optimized for direct connection of the PD cathode (via the FILT
pin) to Vcc. Alternatively, the pad layout also enables a PD cathode connection to a supply voltage
external to the ROSA.
4.2
Transimpedance & AGC Stages
The transimpedance (current to voltage) amplifier (TIA) stage is a very low noise amplifier with a
feedback resistor to set the gain. An internal voltage regulator with integrated stability components is
used to power the front-end TIA in order to improve the rejection of power supply noise.
The AGC stage features automatic gain control, whereby the gain is adjusted to maintain a fixed output
swing. This allows the output gain to remain linear over a wide range of input signal levels.
The PHY1090 AGC gain control is a function of the peak input signal amplitude, not average input signal and has
been optimized for dispersed input data.
For the purposes of test evaluation, the effect of dispersion has been emulated in the electrical domain by filtering the
input data to the PHY1090 using a 4th order Bessel-Thompson filter having a 2.25GHz bandwidth. This ensures
sufficient eye closure to emulate the effects of dispersion, and hence ensure correct operation of the PHY1090 AGC.
In this case, 300mVpp differential typical output swing will result. If a back-to-back test is performed without any
filtering or dispersion, the measured output swing is typically 200mVppd.
The TIA output features a differential supply referenced voltage amplifier, and has 50Ω single ended
output impedance. For optimum supply-noise rejection, the PHY1090 should be terminated differentially.
PHY1090-RD-1.3
Released Datasheet
Page 5
1000
200
100
<150µApp
2kΩ
10
10
100
1000
TIA OMA Input Current (µApp)
Figure 5: PHY1090 output voltage characteristic (filtered data)
4.3
DC Restore
The direct-current cancellation uses low frequency feedback to remove the DC component of the input
signal. This has the effect of minimizing pulse-width distortions for signals with a 50% mark density. The
DC cancellation circuit is internally compensated, and does not require any additional external capacitors.
4.4
RSSI
The PHY1090 RSSI output is designed to produce an OMA-based power indication proportional to input
OMA. This can be used to generate a Loss of Signal indicator when used with a threshold detector as
provided in the PHY2060 EDC enabled 10Gbps receiver.
The RSSI detector has been designed to be most accurate from 150µApp to 500µA, to allow the
detection of a valid 10GBASE-LRM signal. In this range the output RSSI current is equal to 3X the input
current.
The RSSI output is referenced to Vcc. When used in conjunction with Phyworks’ PHY2060EDC IC, it is
recommended that the RSSI current is connected to a ground (Vss) referenced 1kΩ resistor to generate a
voltage indication that increases with increasing input OMA.
PHY1090-RD-1.3
Released Datasheet
Page 6
5. Typical Application Information
5.1
Bonding and Layout
In order to achieve optimal ROSA performance, it is necessary to minimise noise pickup and the effects
of parasitic components related to the TIA bond-out. To this end, it is recommended that:
All bond wire lengths should be kept to a minimum, especially supply and ground wires, to
minimize inductive effects.
Bond wires carrying high speed signals be kept orthogonal to supply and ground bond wires to
minimize performance degradation through pick-up.
The positive supply inside the ROSA should be decoupled with a good quality capacitor.
If external PD bias is implemented, the PD bias pin should be decoupled inside the ROSA with a
good quality capacitor.
The PD capacitance should not exceed 0.3pF to minimize degradation of bandwidth and noise.
Bond ball should be centred and within the bond pad opening and should not occupy more than
75% of the bond pad area
Bond pressure of 20-25g is recommended, with a maximum ultrasonic power of 70mW for 20ms
Figures 6 and 7 depict suggested bond-outs.
Note: Whilst the PHY1090 AC performance has been characterized for the bonding and PD parasitics
stated in Note 2 of the Parametric Performance section, improvements in ROSA electrical bandwidth may
be obtained by ‘tuning’ the bond wire length between the PD anode pad and TIA PDA pad. However, this
may also adversely affect jitter and gain flatness performance.
5.2
MSA Compatibility
Figure 8 shows the PHY1090’s compatibility with the XMD ROSA specification. Note that pin 6 of the
ROSA flex can be the RSSI output from the PHY1090, or the photodiode bias voltage in the case of
external bias configuration.
Figure 6: Example 5-pin TO-46 bond-out – internal PD bias
(Top-view: looking into the header)
PHY1090-RD-1.3
Released Datasheet
Page 7
Figure 7: Example 5-pin TO-46 bond-out – external PD bias
(Top-view: looking into the header)
Suggested Vcc decoupling capacitor value:
Suggested Vpd decoupling capacitor value:
≥470pF
≥200pF
Figure 8: Example Flex-based ROSA
PHY1090-RD-1.3
Released Datasheet
Page 8
6. Die image, Pad Positions and Sizes
Die size: 1.169mm x 0.929mm
Thickness: 290µm +/-10µm
VCC
VCC
ATE1
VSS
FILT
DP
ATE2
VSS
PDC
VSS
ATE3
PDA
ATE4
VSS
PDC
VSS
ATE5
RSSI
ATE6
VSS
FILT
DN
Pin
Pin Name
X (µm)
Y (µm)
Number
1
2
FILT1
VCC1
VCC2
ATE1
DP
80µm x 80µm, octagonal
80µm x 80µm, rectangular
80µm x 80µm, rectangular
80µm x 80µm, rectangular
80µm x 80µm, octagonal
80µm x 80µm, rectangular
80µm x 80µm, rectangular
80µm x 80µm, octagonal
80µm x 80µm, octagonal
80µm x 80µm, octagonal
80µm x 80µm, rectangular
80µm x 80µm, rectangular
80µm x 80µm, rectangular
80µm x 80µm, octagonal
80µm x 80µm, rectangular
80µm x 80µm, octagonal
80µm x 80µm, octagonal
-258.9
-159.5
-61.5
122.5
222
339.5
339.5
339.5
339.5
339.5
339.5
250
3
4
5
6
VSS1
ATE2
VSS2
ATE3
ATE4
VSS3
ATE5
VSS4
DN
321.5
439.5
439.5
439.5
439.5
439.5
439.5
321.5
222
7
8
150
9
47.5
10
11
12
13
14
15
16
17
-52.45
-150
-250
-339.5
-339.5
-339.5
-339.5
-339.5
ATE6
FILT2
RSSI
121.6
-215
-315
PHY1090-RD-1.3
Released Datasheet
Page 9
18
19
20
21
22
VSS5
PDC1
PDA
80µm x 80µm, rectangular
80µm x 80µm, octagonal
80µm x 80µm, octagonal
80µm x 80µm, octagonal
80µm x 80µm, rectangular
-439.5
-439.5
-439.5
-439.5
-439.5
-221.5
-110.5
0
PDC2
VSS6
110.75
221.5
Contact Information
For technical support, contact Maxim at www.maximintegrated.com/support.
Disclaimer
This datasheet contains preliminary information and is subject to change.
This document does not transfer or license any intellectual property rights to the user. It does not imply
any commitment to produce the device described and is intended as a proposal for a new device.
Phyworks Ltd assumes no liability or warranty for infringement of patent, copyright or other intellectual
property rights through the use of this product.
Phyworks Ltd assumes no liability for fitness for particular use or claims arising from sale or use of its
products.
Phyworks Ltd products are not intended for use in life critical or sustaining applications.
PHY1090-RD-1.3
Released Datasheet
Page 10
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