MLX81215LLQAA000TU [MELEXIS]
BLDC Motor Controller;
| 型号： | MLX81215LLQAA000TU |
| 厂家： | 
Melexis Microelectronic Systems |
| 描述： | BLDC Motor Controller |
| 文件： | 总18页 (文件大小：463K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MLX81205/07/10/15
Features
Microcontroller: MLX16-FX RISC CPU
o
o
o
o
16 bit RISC CPU with 20DMIPS and Power-Saving-Modes
Co-processor for fast multiplication and division
Flash and EEPROM memory with EEC
In-circuit debug and emulation
Supported bus interfaces:
o
LIN-Interface with integrated LIN transceiver supporting LIN 2.x, certified LIN protocol
software provided by Melexis
o
o
o
In-Module-Programming (Flash and EE) via pin LIN using a special Melexis fast protocol
PWM-Interface
Full duplex SPI, Master/Slave, double-buffered, speed programmable. DMA access. Flash
and EEPROM programming also possible via SPI.
TruSense Motor Control Technology
o
o
o
Patented algorithms for sensor-less 3-phase sine and trapezoidal motor control
Phase voltage integration filter for BEMF voltage sensing at lowest speeds
Position dependent phase inductance sensing via shunt current measurements at stand still
and low to medium speeds
o
o
Support of Star and Delta based motor configurations without the need for center star point
Support of 3-phase switched reluctance motor control
Voltage Regulator
o
o
o
o
Direct powered from 12V board net with low voltage detection
Operating voltage VS = 5V to 18V
Internal voltage regulator with possibility to use external regulator transistor
Very low standby current, < 30µA in sleep mode, wake-up possible via LIN or local sources
Pre-Driver
o
Pre-driver (~25Ω Rdson) for all 3 N-FET half bridges with programmable Inter-Lock-Delay
and slope control for optimal EMC and thermal performance during power N-FET switching
Monitoring of Drain-Source voltages of the N-FETs
o
Periphery
o
4 independent 16 bit timer modules with capture and compare, and additional software
timer
o
o
o
o
o
o
o
o
3 programmable 12 bit PWM units with programmable frequencies
10 bit ADC converter (2µs conversion time) and DMA access
On-chip temperature sensor with ±10K accuracy
System-clock-independent fully integrated watchdog
32 MHz ±5% internal RC oscillator with PLL
Optional crystal oscillator
Load dump and brown out interrupt function
Integrated shunt current amplifier with programmable gain
Product Abstract
TFR / CPA
Page 1 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
Applications
The MLX81205/07/10/15 controls BLDC motors via external FET transistors for:
o
o
o
Oil-, water-, fuel-pumps
Blowers, compressors
Positioning actuators
Family Concept
MLX81205
MLX81207
MLX81210
MLX81215
Flash Memory [kByte]
RAM [kByte]
32
4
32
4
32
8
64
8
EEPROM [Byte]
Package
384
384
384
384
QFN32
QFN48
TQFP EP 48
QFN48
TQFP EP 48
QFN48
TQFP EP 48
Support of active high side reverse
polarity protection
No
Yes
Yes
Yes
Current shunt measurement
possibility
High side
High side
Low side,
High side
Low side,
High side
UART
SPI
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Support of sensor based BLDC
motor control
No
Support of Switched Reluctance
(SR) motor control
No
No
32
No
No
37
No
Yes
48
Yes
Yes
48
5V Regulator support for 5V
external supplies (CAN support)
Bonded pins in package
Pin compatibility
MLX81210 and MLX81215 are pin compatible
Table 1 – Family Options
Product Abstract
TFR / CPA
Page 2 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
Ordering Information
Order Code [1]
Temp.
Range
Package
Delivery
Remark
MLX81205 LLQ-xAA-000-TU
MLX81205 LLQ-xAA-000-RE
MLX81207 LLQ-xAA-000-TU
MLX81207 LLQ-xAA-000-RE
MLX81207 LPF-xAA-000-TR
MLX81207 LPF-xAA-000-RE
MLX81210 LLQ-xAA-000-TU
MLX81210 LLQ-xAA-000-RE
MLX81210 LPF-xAA-000-TR
MLX81210 LPF-xAA-000-RE
MLX81215 LLQ-xAA-000-TU
MLX81215 LLQ-xAA-000-RE
MLX81215 LPF-xAA-000-TR
MLX81215 LPF-xAA-000-RE
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
-40 - 150 °C
QFN32 5x5
QFN32 5x5
QFN48 7x7
QFN48 7x7
TQFP EP 48 7x7
TQFP EP 48 7x7
QFN48 7x7
Tube
Reel
Tube
Reel
Tray
Reel
Tube
Reel
Tray
Reel
Tube
Reel
Tray
Reel
QFN48 7x7
TQFP EP 48 7x7
TQFP EP 48 7x7
QFN48 7x7
QFN48 7x7
TQFP EP 48 7x7
TQFP EP 48 7x7
Table 2 – Ordering Information
[1].See Marking/Order Code.
Product Abstract
TFR / CPA
Page 3 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
Contents
1.
2.
3.
FUNCTIONAL DIAGRAM ........................................................................................................................ 5
PIN DESCRIPTION .................................................................................................................................. 6
ELECTRICAL CHARACTERISTICS........................................................................................................ 7
3.1
3.2
O
PERATING ONDITIONS .................................................................................................................... 7
C
ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 7
4.
APPLICATION EXAMPLES..................................................................................................................... 8
4.1
SENSOR-LESS BLDC MOTOR CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE
POLARITY PROTECTION AND CURRENT SENSING................................................................................................. 8
4.2 LESS BLDC MOTOR
POLARITY PROTECTION IN THE HIGH SIDE PATH................................................................................................ 10
S
ENSOR
-
CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE
4.3
4.4
4.5
S
S
S
ENSOR BASED BLDC MOTOR CONTROL .......................................................................................... 11
ENSOR
-
-
LESS BLDC MOTOR
LESS BLDC MOTOR
C
C
ONTROL WITH ABSOLUTE POSITION SENSING ....................................... 12
ONTROL VIA A CAN-BUS-INTERFACE.................................................. 13
ENSOR
5.
6.
MECHANICAL SPECIFICATION........................................................................................................... 14
5.1
QFN................................................................................................................................................ 14
5.1.1. QFN32 5x5 (32 leads)...............................................................................................................................14
5.1.2. QFN48 7x7 (48 leads)...............................................................................................................................14
5.2
TQFP EP 48 7X7 (48 LEADS)........................................................................................................... 15
MARKING/ORDER CODE ..................................................................................................................... 16
6.1
6.2
M
ARKING MLX81205/07/10/15........................................................................................................ 16
O
RDER CODE MLX81205/07/10/15 ................................................................................................. 16
7.
8.
ASSEMBLY INFORMATION.................................................................................................................. 17
DISCLAIMER.......................................................................................................................................... 18
Product Abstract
TFR / CPA
Page 4 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
1. Functional Diagram
RTG
VDDA
CLKO
OSC1
OSC2
VREF
VBAT_S1
VBAT_S2
VS
VDDD
fmain
V5IN
V5R
VS
VREF
ISENSH
ISENSL
TEMP
VBAT_S1
VBAT_S2
GND_S1
GND_S2
U
GND_S1
GND_S2
V
W
T
IOHV
PHASEINT
IOHV
IO1
...
IO9
......
fmain
......
IO1
IO2
IO3
CP0
HS0
LS0
U
SHU
IO4
IO5
CP1
HS1
IO6
IO7
IO8
IO9
ADC
SPI
LS1
V
SHV
CP2
HS2
LS2
LIN
W
GNDA
SHW
GNDD
GNDCAP
GNDDRV
T
TO
TI0 TI1
Figure 1 - Block Diagram
Black: common for all versions,
Blue: additional pins / functionality for MLX81207,
Blue + red: additional pins / functionality for MLX81210 / MLX81215
Product Abstract
TFR / CPA
Page 5 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
2. Pin Description
Name
Type
Function
MLX81205
MLX81207
MLX81210
MLX81215
Battery Supply
VS
P
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
3.3V External MOS Gate Control
3.3V Supply
RTG
O
VDDA
V5R
P
5V Regulator Output for external NFET
5V Regulator Input
P
V5IN
VDDD
GNDD
I
1.8V Regulator output
P
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Digital ground
GND
Digital ground
GNDCAP GND
GNDDRV GND
Driver ground
X
X
X
X
X
X
X
X
X
X
X
Analog ground
GNDA
LIN
GND
HVIO
HVIO
I
Connection to LIN bus or PWM interface
General purpose IO pin
IOHV
TI0
Test input, debug interface
Test input, debug interface
TI1
I
Test output, debug interface
TO
O
Quarz interface input
OSC1
OSC2
IO1
I
Quarz interface ouput
O
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
General purpose IO pin (Low voltage 3.3V)
Switchable 250kHz clock output to VREF level
Phase U input to BEMF sensing blocks
Phase V input to BEMF sensing blocks
Phase W input to BEMF sensing blocks
Reference input to BEMF sensing blocks
Clamped 8V or 12V ref. voltage for bootstrap
High side bootstrap capacitor driver 2
N-FET high side gate driver 2
LVIO
LVIO
LVIO
LVIO
LVIO
LVIO
LVIO
LVIO
LVIO
HVO
HVI
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
CLKO
SHU
SHV
SHW
T
X
HVI
HVI
HVI
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
VREF
CP2
HS2
W
P
HVIO
HVIO
HVI
Phase W input to HS2 buffer and BEMF sensing blocks
N-FET low side gate driver 2
LS2
CP1
HS1
V
HVO
HVIO
HVIO
HVI
High side bootstrap capacitor driver 1
N-FET high side gate driver 1
Phase V input to HS1 buffer and BEMF sensing blocks
N-FET low side gate driver 1
LS1
CP0
HS0
U
HVO
HVIO
HVIO
HVI
High side bootstrap capacitor driver 0
N-FET high side gate driver 0
Phase U input to HS0 buffer and BEMF sensing blocks
N-FET low side gate driver 0
LS0
HVO
VS high side input for current sensing
VS low side input for current sensing
VBAT_S1 HVI
VBAT_S2 HVI
Product Abstract
TFR / CPA
Page 6 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
GND high side input for current sensing
GND low side input for current sensing
GND_S1
GND_S2
Pin count
LVI
LVI
X
X
X
X
32
37
48
48
Table 3 - Pin Description MLX81205 / MLX81207 / MLX81210 / MLX81215
3. Electrical Characteristics
All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum
ratings given in the table below are limiting values that do not lead to a permanent damage of the device but
exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of
the device. Reliable operation of the MLX81205/07/10/15 is only specified within the limits shown in
Operating conditions.
3.1 Operating Conditions
Parameter
Symbol
Min
5
Max
18
Unit
V
IC supply voltage
VS
Operating ambient temperature
Tamb
-40
+150 [1]
°C
Table 4 - Operating Conditions
[1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power
dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time,
customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.
3.2 Absolute Maximum Ratings
Parameter
Symbol Condition
Min Max
Unit
T = 2 min
-0.3
28
45
IC supply voltage
VS
V
T < 500 ms
Maximum reverse current into any pin
-10
+10
+10
mA
mA
V
Maximum sum of reverse currents into all pins
DC voltage on LVIO pins, OSC<2:1>, GND_S<2:1>
DC voltage on HV I/O pin, V5R pin
-0.3
-0.3
-0.3
-0.3
-0.3
VDDA+0.3
VS+0.3
18
V
DC voltage on drivers supply pin VREF
V
DC voltage on drivers control pins (CLKO, LS<2:0>)
DC voltage on drivers CP<2:0>, HS<2:0> pins
VREF+0.3
VS + VREF
V
V
DC voltage on phases related pins (U, V, W, SHU,
SHV, SHW, T, VBAT_S<2:1>)
-0.3
-6
VS+1.5
+6
V
Human body model, equivalent to
discharge 100pF with 1.5kΩ,
ESD capability of pin LIN
ESDBUSHB
ESDHB
kV
kV
Human body model, equivalent to
discharge 100pF with 1.5kΩ,
ESD capability of any other pins
-2
+2
Maximum latch–up free current at any Pin
Junction temperature [1]
Storage temperature
Rthjc QFN32
ILATCH
Tvj
-250
+250
+155
+150
10
mA
°C
Tstg
-55
°C
K / W
K / W
K / W
Rthjc
Rthjc QFN48
5
Rthjc TQFP48
5.5
Table 5 - Absolute Maximum Ratings
Product Abstract
TFR / CPA
Page 7 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
[1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power
dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time,
customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.
4. Application Examples
The following sections show typical application examples[1].
4.1 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with
reverse polarity protection and current sensing
In the sample application of Figure 2, the MLX81205 can realize the sensor-less driving of a BLDC motor via
three external power N-FET half bridges with only a few external components. The high side N-FET driving is
done with a bootstrap output stage. Reverse polarity protection of the bridge is realized with an external
power FET in the ground path. An external temperature sensor is connected to the 10 bit ADC via pin IO1.
The integrated watchdog with a dedicated separate RC-oscillator is monitoring application integrity. The
communication interface could be LIN or a PWM interface. The pin LIN can also be used as wake-up source
and to program the Flash memory.
The motor currents are measured by a shunt resistor in the high side path. In case the current exceeds the
programmed threshold, the bridge can be switched off automatically and / or a software interrupt can be
generated. The motor current can also be measured by the 10-bit ADC converter.
The patented Melexis TruSense technology combines two methods to determine the rotor position:
- The measurement of the induced BEMF voltage at medium and high speeds.
- The measurement of position dependent coil inductance variations at stand-still and low speeds.
As a result TruSense allows operation of the motor in the widest dynamic speed range. The motor can be
driven with block, trapezoidal or sine-wave currents. The motor start-up can be made independent of the
load conditions according to the application requirements.
In this example application the motor star point is not available. It is modeled with external resistors from the
motor phases and connected to T input. Alternatively an artificial IC internal reference point can be chosen
as shown in the block diagram of the MLX81205/07/10/15.
[1] The application examples are principal application schematics only. The details need to be worked out for each application schematic
separately, depending on the application requirements.
Product Abstract
TFR / CPA
Page 8 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
Figure 2 - Typical Sensor-less BLDC Motor Control Application Example with MLX81205
Product Abstract
TFR / CPA
Page 9 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
4.2 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with
reverse polarity protection in the high side path
In the sample application of Figure 3, the MLX81207 has been selected in order to benefit from the external
high side reverse polarity protection possibility compared to the application shown in section 4.1.
All other remarks from the previous application example remain valid.
Figure 3 – Typical Sensor-less BLDC Motor Control Application Example with MLX81207
Product Abstract
TFR / CPA
Page 10 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
4.3 Sensor based BLDC Motor Control
In the sample application of, Figure 4, the MLX81207 can realize the driving of a BLDC motor with three Hall
sensors. An external P-FET is used to derive the 3.3V supply with a higher current capability in order to bring
power consumption outside the MLX81207.
VBAT
CLKO
VS
VHIGH
VBAT_S1
RTG
VCC3
SHUNT
VBAT_S2
VREF
VDDA
VPROT
CP2
CP1
CP0
VDDD
VCC3
HS0
U
IO1
U
LIN / PWM
LIN
IO2
LS0
VPROT
MLX81207
HS1
V
IO3
V
IOHV
LS1
OSC1
VPROT
OSC2
HS2
W
W
IO4
IO5
LS2
T
VCC3
TI0
TI1
TO
VCCHALL
HALL1
HALL2
HALL3
GND
GNDA
GNDD
GNDCAP
GNDDRV
GND
Figure 4 – Typical Sensor based BLDC Motor Control Application Example with MLX81207
Product Abstract
TFR / CPA
Page 11 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
4.4 Sensor-less BLDC Motor Control with absolute position sensing
In the sample application of Figure 5, the MLX81210 is working with an absolute position sensor in order to
measure the position of the gear shaft in throttle valve application systems or any other similar applications,
where absolute precise position sensing is requested.
Figure 5 – Typical Sensor-less BLDC Motor Control Application Example with MLX81210 and Triaxis®
absolute position sensing
Product Abstract
TFR / CPA
Page 12 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
4.5 Sensor-less BLDC Motor Control via a CAN-Bus-Interface
In this sample application the MLX81215 can realize the sensor-less driving of a BLDC motor via a CAN-Bus
Interface. System wake-up on CAN-bus traffic is possible. The 5V and a 3.3V voltage supply needed for the
CAN-Bus, is generated via external N-FET control in order to limit the power dissipation in the package.
The motor current can be monitored via shunt resistors in the ground and battery path in case the application
requests a double side monitoring for security reasons.
Application programming on module level via the CAN-Bus is supported by the SPI-Interface.
Figure 6 – Typical BLDC Motor Control Application Example on the CAN-Bus with MLX81215
Product Abstract
TFR / CPA
Page 13 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
5. Mechanical Specification
5.1 QFN
Figure 7 – QFN Drawing
5.1.1. QFN32 5x5 (32 leads)
Symbol [1][2]
A
A1 A3
b
D
D2
E
E2
e
L
N [3] ND [4] NE [4]
0.80 0.00
0.85 0.02
0,90 0.05
0.18
0.25
0.30
3.50
3.60
3.70
3.50
3.60
3.70
0.35
0.40
0.45
Min
QFN32 Nom
Max
0.20
5.00
5.00
0.50
32
8
8
Table 6 – QFN32 5x5 Package Dimensions
5.1.2. QFN48 7x7 (48 leads)
Symbol [1][2]
A
A1 A3
b
D
D2
E
E2
e
L
N [3] ND [4] NE [4]
0.80
0
0.18
0.25
0.30
5.00
5.10
5.20
5.00
5.10
5.20
0.45
0.50
0.55
Min
QFN48 Nom
Max
0.20
7.00
7.00
0.50
48
12
12
0.85 0.02
0.90 0.05
Table 7 - QFN48 7x7 Package Dimensions
[1] Dimensions and tolerances conform to ASME Y14.5M-1994
[2] All dimensions are in Millimeters. All angels are in degrees
[3] N is the total number of terminals
[4] ND and NE refer to the number of terminals on each D and E side respectively
Product Abstract
TFR / CPA
Page 14 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
5.2 TQFP EP 48 7x7 (48 leads)
Exposed pad need best
possible contact to ground for
exlectrical and thermal reasons
Figure 8 – TQFP EP 7x7 Drawing
A
-
-
A1
0.05 0.95 0.17 0.17
1.00 0.22 0.20
A2
b
b1
D
D1
D2
E
E1
E2
e
L
N
Ccc ddd
Min
Nom
0.45
0.60
0.75
-
-
-
-
9.00 7.00 4.00 9.00 7.00 4.00 0.50
48
-
Max 1.20 0.15 1.05 0.27 0.23
0.08 0.08
Table 8 – TQFP EP 7x7 Package Dimensions
Notes:
1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,
∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line.
∆3. Datum [A-B] and [-D-] to be determined at centerline between leads where leads exist, plastic body at datum plane [-|-|-]
∆4. To be determined at seating plane [-C-]
∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould
protrusion is 0.254 mm on D1 and E1 dimensions.
6. 'N' is the total number of terminals
∆7. These dimensions to be determined at datum plane [-|-|-]
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.
∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b"
dimension at maximum material condition, dam bar can not be located on the lower radius of the foot.
10. Controlling dimension millimeter.
11. Maximum allowable die thickness to be assembled in this package family is 0.38mm
12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.
∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and
are independent from die size.
15. Exposed pad shall be coplanar with bottom of package within 0.05.
Product Abstract
TFR / CPA
Page 15 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
6. Marking/Order Code
6.1 Marking MLX81205/07/10/15
IC Version: 07/10 or 15
Silicon Revision: Character [A...Z]
Lot Number
Assembly Date Code: Week number
Firmware Revision: Characters [AA...ZZ]
Assembly Date Code: Year
Silicon Revision: Character [A...Z]
Lot Number
Assembly Date Code: Week number
Firmware Revision: Characters [AA...ZZ]
Assembly Date Code: Year
6.2 Order Code MLX81205/07/10/15
Product Abstract
TFR / CPA
Page 16 of 18
Rev 3.9
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7. Assembly Information
This Melexis device is classified and qualified regarding soldering technology, solder ability and moisture
sensitivity level, as defined in this specification, according to following test methods:
•
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For No hermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of No hermetic Surface Mount Devices Prior to Reliability Testing (Reflow profiles
according to table 2)
CECC00802
Standard Method For The specification of Surface Mounting Components (SMD’s) of Assessed
Quality
•
•
•
EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solder ability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after
consulting Melexis regarding assurance of adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation (Directive on the
restriction of the use of certain hazardous substances, RoHS) and customer requests, Melexis has installed
a roadmap to qualify their package families for lead free processes also. Various lead free generic
qualifications are running, current results on request.
For more information on Melexis lead free statement see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
Product Abstract
TFR / CPA
Page 17 of 18
Rev 3.9
11-May-2012
MLX81205/07/10/15
8. Disclaimer
The product abstract just provides an overview of the described devices. Please consult the complete
product specification/datasheet in its latest revision for any detailed information.
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© Melexis NV. All rights reserved
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
America:
Phone: +32 1367 0495
Phone: +1 248 306 5400
E-mail: sales_usa@melexis.com
E-mail: sales_europe@melexis.com
ISO/TS16949 and ISO14001 Certified
Product Abstract
TFR / CPA
Page 18 of 18
Rev 3.9
11-May-2012
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