SY89827LHYTR [MICREL]

3.3V 500MHz DUAL 1:10 HSTL FANOUT BUFFER/TRANSLATOR WITH 2:1 MUX INPUT; 3.3V 500MHz的双1:10 HSTL扇出缓冲器/翻译以2: 1多路复用器输入
SY89827LHYTR
型号: SY89827LHYTR
厂家: MICREL SEMICONDUCTOR    MICREL SEMICONDUCTOR
描述:

3.3V 500MHz DUAL 1:10 HSTL FANOUT BUFFER/TRANSLATOR WITH 2:1 MUX INPUT
3.3V 500MHz的双1:10 HSTL扇出缓冲器/翻译以2: 1多路复用器输入

复用器 输入元件
文件: 总11页 (文件大小:165K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®  
®
3.3V 500MHz DUAL 1:10 HSTL FANOUT  
Precision Edge  
SY89827L  
BUFFER/TRANSLATOR WITH 2:1 MUX INPUT  
FEATURES  
Dual LVPECL or HSTL input, 10 differential 1.5V  
®
HSTL compatible outputs  
Precision Edge  
Configurable as dual-channel 10 output or a single-  
channel 20 output clock driver  
DESCRIPTION  
Guaranteed AC parameters over temperature and  
voltage:  
• > 500MHz f  
• < 50ps within device skew  
• < 1.5ns propagation delay  
• < 700ps t / t time  
The SY89827L is a High Performance Bus Clock Driver  
with dual 1:10 or single 1:20 HSTL (High Speed  
Transceiver Logic) output pairs. The part is designed for  
use in low voltage (3.3V/1.8V) applications which require  
a large number of outputs to drive precisely aligned, ultra  
low skew signals to their destination. The input is  
multiplexed from either HSTL or LVPECL (Low Voltage  
Positive Emitter Coupled Logic) by the CLK_SEL pin.  
The Output Enables (OE1 & OE2) are synchronous so  
that the outputs will only be enabled/disabled when they  
are already in the LOW state. This avoids any chance of  
generating a runt clock pulse when the device is enabled/  
disabled as can happen with an asynchronous control.  
The SY89827L features extremely low skew  
performance of <50ps over temperature and voltage –  
performance previously unachievable in a standard  
product having such a high number of outputs. The  
SY89827L is available in a single space saving package,  
enabling a lower overall cost solution. For applications  
that require greater HSTL fanout capability, consider the  
SY89824L.  
MAX  
r
f
Low jitter design  
• < 1ps cycle-to-cycle jitter  
RMS  
• < 10ps total jitter  
PP  
3.3V core supply, 1.8V output supply  
Output enable function  
Available in a 64-Pin EPAD-TQFP  
APPLICATIONS  
High-performance PCs  
Workstations  
Parallel processor-based systems  
Other high-performance computing  
Communications  
TYPICAL APPLICATION CIRCUIT  
10  
Primary Clock Source  
LVPECL_CLKA  
Primary  
Card  
10  
/LVPECL_CLKA  
Redundant Backup  
Clock Source  
10  
10  
LVPECL_CLKB  
Redundant  
Card  
/LVPECL_CLKB  
SEL1  
Primary/Backup Clock Select  
(Switchover within 2.0ns)  
System using SY89827L as a switchover circuit from a Primary Clock to a Redundant Backup Clock in a failsafe application.  
LVPECL inputs only, shown in this application.  
Precision Edge is a registered trademark of Micrel, Inc.  
Rev.: E  
Amendment: /0  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
1
Issue Date: January 2007  
Precision Edge®  
SY89827L  
Micrel, Inc.  
PACKAGE/ORDERING INFORMATION  
Ordering Information(1)  
Package Operating  
Package  
Marking  
Lead  
Finish  
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49  
Part Number  
Type  
H64-1  
H64-1  
H64-1  
Range  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
VCCO  
Q7  
/Q7  
Q8  
/Q8  
SEL2  
HSTL_CLKB  
/HSTL_CLKB  
1
2
3
SY89827LHI  
Industrial  
Industrial  
Industrial  
SY89827LHI  
SY89827LHI  
Sn-Pb  
Sn-Pb  
VCCI  
HSTL_CLKA  
/HSTL_CLKA  
CLK_SEL1  
4
5
6
7
SY89827LHITR(2)  
SY89827LHY(3)  
Q9  
/Q9  
SY89827LHY with  
Pb-Free bar-line indicator Matte-Sn  
Pb-Free  
VCCO  
VCCO  
Q10  
/Q10  
Q11  
/Q11  
Q12  
/Q12  
VCCO  
LVPECL_CLKA  
/LVPECL_CLKA  
GND  
8
9
10  
11  
12  
13  
14  
15  
16  
OE1  
LVPECL_CLKB  
/LVPECL_CLKB  
CLK_SEL2  
SY89827LHYTR(2, 3) H64-1  
Industrial  
SY89827LHY with Pb-Free  
Pb-Free bar-line indicator Matte-Sn  
OE2  
SEL1  
Notes:  
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32  
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.  
2. Tape and Reel.  
3. Pb-Free package recommended for new designs.  
64-Pin TQFP (H64-1)  
FUNCTIONAL BLOCK DIAGRAM  
CLK_SEL1  
SEL1  
OE1  
HSTL_CLKA  
0
/HSTL_CLKA  
10  
10  
0
1
Q0 Q9  
LVPECL_CLKA  
1
/Q0 /Q9  
/LVPECL_CLKA  
LEN  
D
HSTL_CLKB  
Q
0
/HSTL_CLKB  
LVPECL_CLKB  
1
/LVPECL_CLKB  
0
1
10  
10  
Q10 Q19  
/Q10 /Q19  
CLK_SEL2  
LEN  
D
SEL2  
Q
OE2  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
2
Precision Edge®  
SY89827L  
Micrel, Inc.  
TRUTH TABLE  
OE1(1) OE2(1) SEL1(1) SEL2(1) CLK_SEL1(1) CLK_SEL2(1)  
Q0 Q9  
/Q0 /Q9  
Q10 Q19  
/Q10 /Q19  
1
1
1
1
0
0
0
0
0
1
X
X
HSTL_CLKA  
/HSTL_CLKA  
HSTL_CLKA  
/HSTL_CLKA  
LVPECL_CLKA /LVPECL_CLKA LVPECL_CLKA /LVPECL_CLKA  
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
HSTL_CLKA  
/HSTL_CLKA  
HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB  
HSTL_CLKB /HSTL_CLKB  
LVPECL_CLKA /LVPECL_CLKA LVPECL_CLKB /LVPECL_CLKB  
/HSTL_CLKB  
HSTL_CLKA  
/HSTL_CLKA  
LVPECL_CLKA /LVPECL_CLKA  
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB  
HSTL_CLKB /HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB LVPECL_CLKA /LVPECL_CLKA  
HSTL_CLKB /HSTL_CLKB HSTL_CLKB /HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB LVPECL_CLKB /LVPECL_CLKB  
/HSTL_CLKB  
HSTL_CLKA  
/HSTL_CLKA  
HSTL_CLKA  
/HSTL_CLKA  
LVPECL_CLKA /LVPECL_CLKA  
1
1
1
1
1
1
1
1
X
X
0
1
0
0
0
0
1
1
1
1
X
X
X
X
0
0
1
1
0
1
X
X
0
1
LOW  
LOW  
LOW  
LOW  
HIGH  
HIGH  
HIGH  
HIGH  
HSTL_CLKA  
LVPECL_CLKA /LVPECL_CLKA  
HSTL_CLKB /HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB  
/HSTL_CLKA  
X
X
1
1
1
1
0
0
0
0
0
0
1
1
X
X
X
X
0
1
X
X
0
1
HSTL_CLKA  
/HSTL_CLKA  
LOW  
LOW  
LOW  
LOW  
HIGH  
HIGH  
HIGH  
HIGH  
LVPECL_CLKA /LVPECL_CLKA  
HSTL_CLKB /HSTL_CLKB  
LVPECL_CLKB /LVPECL_CLKB  
LOW HIGH  
X
X
0
0
X
X
X
X
LOW  
HIGH  
Note 1. Input has internal pull-up Floating input = 1.  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
3
Precision Edge®  
SY89827L  
Micrel, Inc.  
PIN DESCRIPTIONS  
Internal  
P/U  
Pin Number  
Pin Name  
I/O  
Type  
Pin Function  
5, 6  
HSTL_CLKA  
/HSTL_CLKA  
Input  
HSTL  
Differential clock input selected by CLK_SEL1, SEL1 and SEL2.  
Can be left floating if not selected. Floating input, if selected  
produces an indeterminate output. HSTL input signal requires  
external termination 50-to-GND.  
2, 3  
8, 9  
HSTL_CLKB  
/HSTL_CLKB  
Input  
HSTL  
Differential clock input selected by CLK_SEL1, SEL1 and SEL2.  
Can be left floating if not selected. Floating input, if selected  
produces an indeterminate output. HSTL input signal requires  
external termination 50-to-GND.  
LVPECL_CLKA Input LVPECL  
/LVPECL_CLKA  
75kΩ  
Differential clock input selected by CLK_SEL1, SEL1 and SEL2.  
pull-down Can be left floating. Floating input, if selected produces a LOW  
at output. Requires external termination. See Figure 1.  
12, 13  
7
LVPECL_CLKB Input LVPECL  
/LVPECL_CLKB  
75kΩ  
Differential clock input selected by CLK_SEL2, SEL1 and SEL2.  
pull-down Requires external termination. See Figure 1.  
CLK_SEL1  
CLK_SEL2  
SEL1  
Input  
Input  
Input  
Input  
Input  
Input  
Power  
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Selects HSTL_CLKA input when LOW and LVPECL_CLKA  
input when HIGH.  
14  
16  
1
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Selects HSTL_CLKB input when LOW and LVPECL_CLKB  
input when HIGH.  
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Selects input source CLKA when LOW and CLKB  
when HIGH for outputs Q0 Q9 and /Q0 /Q9.  
SEL2  
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Selects input source CLKA when LOW and CLKB  
when HIGH for outputs Q10 Q19 and /Q10 /Q19.  
11  
15  
4
OE1  
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Enable input synchronized internally to prevent glitching of the  
Q0 Q9 and /Q0 /Q9 outputs.  
OE2  
LVTTL/  
CMOS  
11kΩ  
Pull-up  
Enable input synchronized internally to prevent glitching of the  
Q10 Q19 and /Q10 /Q19 outputs.  
VCCI  
Core VCC connected to 3.3V supply. Bypass with 0.1µF in  
parallel with 0.01µF low ESR capacitors as close to VCC pins as  
possible.  
17, 32, 33,  
40, 41, 48, 49, 64  
VCCO  
Power  
Output buffer VCC connected to 1.8V nominal supply. All VCCO  
pins should be connected together on the PCB. Bypass with  
0.1µF in parallel with 0.01µF low ESR capacitors as close to  
VCCO pins as possible.  
10  
GND  
Power  
Output  
Ground.  
63, 61, 59, 57, 55  
53, 51, 47, 45, 43  
Q0 Q9  
HSTL  
HSTL  
Differential clock outputs from CLKA when SEL1 = LOW and  
from CLKB when SEL1 = HIGH. HSTL outputs (Q and /Q) must  
be terminated with 50-to-GND. Q outputs are static when  
OE1 = LOW. Unused output pairs may be left floating.  
62, 60, 58, 56, 54  
52, 50, 46, 44, 42  
/Q0 /Q9  
Output  
Differential clock outputs (complement) from CLKA when SEL1 =  
LOW and from CLKB when SEL1 = HIGH. HSTL outputs (Q and  
/Q) must be terminated with 50-to-GND. /Q outputs are static  
HIGH when OE1 = LOW. Unused output pairs may be left  
floating.  
39, 37, 35, 31, 29  
38, 36, 34, 30, 28  
Q10 Q19  
27, 25, 23, 21, 19  
Output  
Output  
HSTL  
HSTL  
Differential outputs from CLKA when SEL2 = LOW and from  
CLKB when SEL2 = HIGH. HSTL outputs (Q and /Q) must be  
terminated with 50-to-GND. Q outputs are static LOW when  
OE2 = LOW. Unused output pairs may be left floating.  
/Q10 /Q19  
26, 24, 22, 20, 18  
Differential outputs (complement) from CLKA when SEL2 = LOW  
and from CLKB when SEL2 = HIGH. HSTL outputs (Q and /Q)  
must be terminated with 50-to-GND. /Q outputs are static HIGH  
when OE2 = LOW. Unused output pairs may be left floating.  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
4
Precision Edge®  
SY89827L  
Micrel, Inc.  
Absolute Maximum Ratings(Note 1)  
Operating Ratings(Note 2)  
Power Supply Voltage (V , V  
) ..............0.5 to +4.0V  
Supply Voltage  
CCI CCO  
(V ) .................................................... +3.3V to +3.47V  
Input Voltage (V ) ...........................................0.5 to V  
CCI  
IN  
CCI  
(V  
) ..................................................... +1.6V to +2.0V  
CCO  
Output Current (I  
) ...............................................50mA  
OUT  
Ambient Temperature (T ) ......................... 40°C to +85°C  
A
Lead Temperature (T  
, Soldering, 20sec.).......... 260°C  
LEAD  
Package Thermal Resistance  
Storage Temperature (T ) ........................... 65 to +150°C  
S
TQFP (θ  
)
JA  
ESD Rating, Note 3 .................................................... >1kV  
Exposed pad soldered to GND, Note 4  
Still-Air (multi-layer PCB).................................23°C/W  
200lfpm (multi-layer PCB) .............................18°C/W  
500lfpm (multi-layer PCB) .............................15°C/W  
Exposed pad NOT soldered to GND (not recommended)  
Still-Air (multi-layer PCB).................................44°C/W  
200lfpm (multi-layer PCB) .............................36°C/W  
500lfpm (multi-layer PCB) .............................30°C/W  
TQFP ) .........................................................4.4°C/W  
JC  
DC ELECTRICAL CHARACTERISTICS  
Power Supply: TA = 40°C to +85°C  
Symbol  
VCCI  
Parameter  
VCC Core  
VCC Output  
ICC Core  
Condition  
Min  
3.13  
1.6  
Typ  
3.3  
Max  
3.47  
2.0  
Units  
V
VCCO  
ICCI  
1.8  
V
No Load  
140  
170  
mA  
HSTL Input/Output: VCCI = 3.3V ±5%, VCCO = 1.8V ±10%, TA = 40°C to +85°C  
Symbol  
VOH  
VOL  
VIH  
Parameter  
Condition  
Note 5  
Min  
1.0  
Typ  
Max  
1.2  
Units  
V
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
Input Crossover Voltage  
Input HIGH Current  
Input LOW Current  
Note 5  
0.2  
0.4  
V
VX +0.1  
0.3  
0.68  
+20  
1.6  
V
VIL  
VX 0.1  
0.9  
V
VX  
V
IIH  
350  
500  
µA  
µA  
IIL  
Note 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not  
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions  
for extended periods may affect device reliability.  
Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.  
Note 3. Devices are ESD sensitive. Handling precautions recommended.  
Note 4. It is highly recommended to solder the exposed pad of the EPAD-TQFP package to a ground plane on the PCB for maximum thermal  
efficiency.  
Note 5. Outputs loaded with 50-to-ground.  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
5
Precision Edge®  
SY89827L  
Micrel, Inc.  
DC ELECTRICAL CHARACTERISTICS  
LVPECL Input: VCCI = 3.3V ±5%, TA = 40°C to +85°C  
Symbol  
VIH  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
V
Input HIGH Voltage (Single-Ended)  
Input LOW Voltage  
VCCI 1.165  
VCCI 1.945  
300  
VCCI 0.880  
VCCI 1.625  
VIL  
V
VPP  
VCMR  
IIH  
Minimum Input Swing (LVPECL_CLK)  
Note 6  
mV  
V
Common Mode Range (LVPECL_CLK) Note 7  
Input HIGH Current  
GNDI +1.8  
VCCI 0.4  
150  
µA  
µA  
IIL  
Input LOW Current  
0.5  
Note 6. The V (min.) is defined as the minimum input differential voltage which will cause no increase in the propagation delay.  
PP  
Note 7.  
V
is defined as the range within which the V level may vary, with the device still meeting the propagation delay specification. The  
CMR IH  
numbers in the table are referenced to V . The V level must be such that the peak-to-peak voltage is less than 1.0V and greater than or  
CCI  
IL  
equal to V (min.). V  
range varies 1:1 with V . V  
(min) is fixed at GNDI +1.8V  
CMR  
PP  
CMR  
CCI  
CMOS/LVTTL Inputs: VCCI = 3.3V ±5%, VCCO = 1.8V ±10%, TA = 40°C to +85°C  
Symbol  
VIH  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
V
Input HIGH Voltage  
Input LOW Voltage  
Input HIGH Current  
Input LOW Current  
2.0  
VIL  
0.8  
V
IIH  
+20  
250  
600  
µA  
µA  
IIL  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
6
Precision Edge®  
SY89827L  
Micrel, Inc.  
(NOTE 1)  
AC ELECTRICAL CHARACTERISTICS  
VCCI = 3.3V ±5%, VCCO = 1.8V ±10%, TA = 40°C to +85°C, all outputs loaded, unless noted.  
Symbol  
fMAX  
tPD  
Parameter  
Condition  
Note 2  
Min  
500  
1.0  
Typ  
Max  
Units  
MHz  
ns  
Maximum Toggle Frequency  
Differential Propagation Delay  
Minimum Input Swing, Note 4  
Note 3  
1.3  
1.5  
VPP  
HSTL  
PECL  
200  
150  
mV  
mV  
tSW  
Switchover Time  
CLK_SEL-to-Q  
SEL-to-Q  
1.6  
1.4  
2.0  
1.75  
ns  
ns  
tJITTER  
Cycle-to-Cycle  
Note 8  
Note 9  
Note 5  
Note 5  
Note 6  
<1  
psRMS  
psPP  
ns  
Total Jitter  
<10  
tS(OE)  
tH(OE)  
tskew  
Output Enable Set-Up Time  
Output Enable Hold Time  
Within Device Skew  
1.0  
0.5  
ns  
0°C to +85°C  
40°C  
25  
35  
50  
75  
ps  
ps  
Part-to-Part Skew  
Note 7  
400  
700  
ps  
ps  
tr, tf  
Output Rise/Fall Times  
(20% to 80%)  
450  
Note 1. Outputs loaded with 50-t- ground.  
Note 2. is defined as the maximum toggle frequency, measured with a 750mV LVPECL/HSTL input. HSTL output swing is > 400mV.  
f
MAX  
Note 3. Differential propagation delay is defined as the delay from the crossing point of the differential input signals to the crossing point of the differential  
output signals.  
Note 4. The V (min.) is defined as the minimum input differential voltage which will cause no increase in the propagation delay.  
PP  
Note 5. OE set-up time is defined with respect to the rising edge of the clock. OE HIGH-to-LOW transition ensures outputs remain disabled during the next  
clock cycle. OE LOW-to-HIGH transition enables normal operation of the next input clock.  
Note 6. The within-device skew is defined as the worst case difference between any two similar delay paths within a single device operating at the same  
voltage and temperature. This parameters includes within bank skew and bank-to-bank skew.  
Note 7. Thepart-to-partskewisdefinedastheabsoluteworstcasedifferencebetweenanytwodelaypathsonanytwodevicesoperatingatthesamevoltage  
and temperature.  
Note 8. Cycle-to-cycle jitter definition: The variation in period between adjacent cycles over a random sample of adjacent cycle pairs. T  
=T T  
n n+1  
JITTER_CC  
where T is the time between rising edges of the output signal.  
12  
Note 9. Total jitter definition: with an ideal clock input, no more than one output edge in 10 output edges will deviate by more than the specified peak-  
to-peak jitter value.  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
7
Precision Edge®  
SY89827L  
Micrel, Inc.  
TYPICAL OPERATING CHARACTERISTICS  
V
= 3.3V, V  
= 1.8V, T = 25°C, unless otherwise stated.  
CCI  
CCO  
A
Output Amplitude  
vs. Frequency  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
200 400 600 800 1000  
FREQUENCY (MHz)  
Propagation Delay  
vs. Input Amplitude  
CLK_SEL Switchover Time  
vs. Temperature  
1400  
1200  
1000  
800  
600  
400  
200  
0
1800  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
HSTL INPUT  
PECL INPUT  
0
200 400 600 800 1000  
INPUT AMPLITUDE (mV)  
-50 -25  
0
25 50 75 100  
TEMPERATURE (°C)  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
8
Precision Edge®  
SY89827L  
Micrel, Inc.  
FUNCTIONAL CHARACTERISTICS  
V
= 3.3V, V  
= 1.8V, T = 25°C, unless otherwise stated.  
CCI  
CCO  
A
100MHz Output  
250MHz Output  
/Q  
/Q  
Q
Q
TIME (500ps/div.)  
TIME (2ns/div.)  
500MHz Output  
/Q  
Q
TIME (500ps/div.)  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
9
Precision Edge®  
SY89827L  
Micrel, Inc.  
LVPECL/HSTL INPUTS  
Figure 2. Simplified HSTL Input Stage  
Figure 1. Simplified LVPECL Input Stage  
HSTL OUTPUTS  
QOUT  
QOUT  
1.6V  
QOUT /QOUT  
800mV  
/QOUT  
/QOUT  
Figure 3. Output Driver Signal Levels  
(Single-Ended)  
Figure 4. Output Driver Signal Levels  
(Differential)  
RELATED PRODUCT AND SUPPORT DOCUMENTATION  
Part Number Function  
Data Sheet Link  
SY89809L  
SY89824L  
3.3V 1:9 High-Performance, Low-Voltage Bus Clock Driver  
www.micrel.com/product-info/products/sy89809l.shtml  
www.micrel.com/product-info/products/sy89824l.html  
www.amkor.com/products/notes_papers/epad.pdf  
www.micrel.com/product-info/products/solutions.shtml  
www.micrel.com/product-info/products/mic3775.shtml  
3.3V 1:22 High-Performance, Low-Voltage Bus Clock Driver  
Exposed Pad Application Note  
M-0317  
HBW Solutions  
MIC3775  
750mA µCap Low-Voltage Low-Dropout Regulator  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
10  
Precision Edge®  
SY89827L  
Micrel, Inc.  
64-PIN EPAD-TQFP (DIE UP) (H64-1)  
+0.05  
0.05  
+0.002  
0.002  
+0.05  
0.05  
+0.012  
0.012  
+0.03  
+0.15  
0.03  
0.15  
+0.012  
0.012  
+0.006  
0.006  
+0.05  
0.05  
Rev. 02  
+0.002  
0.002  
Package  
EP- Exposed Pad  
Die  
CompSide Island  
Heat Dissipation  
Heat Dissipation  
VEE  
Heavy Copper Plane  
Heavy Copper Plane  
VEE  
PCB Thermal Consideration for 64-Pin EPAD-TQFP Package  
(Always solder, or equivalent, the exposed pad to the PCB)  
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA  
TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com  
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.  
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.  
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can  
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into  
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchasers  
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchasers own risk and Purchaser agrees to fully indemnify  
Micrel for any damages resulting from such use or sale.  
© 2006 Micrel, Incorporated.  
M9999-011907  
hbwhelp@micrel.com or (408) 955-1690  
11  

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