ATWINC1510-MR210UB_技术文档

ATWINC15x0

ATWINC15x0-MR210xB IEEE® 802.11 b/g/n SmartConnect

IoT Module

Introduction

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things)

module,specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA),

Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL)

connector for an external antenna resulting in a small form factor (21.7 x 14.7 x 2.1 mm) design. It is

interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to

interface with a host controller.

The references to the ATWINC15x0-MR210xB module include the module devices listed in the following:

•

ATWINC1500-MR210PB

ATWINC1500-MR210UB

ATWINC1510-MR210PB

ATWINC1510-MR210UB

Features

®

•

IEEE 802.11 b/g/n 20 MHz (1x1) solution

Single spatial stream in 2.4 GHz ISM band

Integrated Transmit/Receive switch

Integrated PCB antenna or u.FL micro co-ax connector for external antenna

Superior sensitivity and range via advanced PHY signal processing

Advanced equalization and channel estimation

Advanced carrier and timing synchronization

®

Wi-Fi Direct (supported till firmware release 19.5.2)

Soft-AP support

Supports IEEE 802.11 WEP, WPA, WPA2 security

Support Enterprise security with WPA/WPA2 (802.1X)⁽¹⁾

–

EAP-TLS

EAP-PEAPv0/1 with TLS

EAP-TTLSv0 with MSCHAPv2

EAP-PEAPv0/1 with MSCHAPv2

•

Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation

and block acknowledgment

•

On-chip memory management engine to reduce host load

SPI host interface

DS70005304C-page 1

Datasheet

ATWINC15x0

•

Operating temperature range from -40°C to +85°C. RF performance at room temperature of 25^oC with

a 2-3 db change at boundary conditions

•

I/O operating voltage of 2.7V to 3.6V

Built-in 26 MHz crystal

Integrated Flash memory for system software

Power Save modes

–

4 µA Power-Down mode typical at 3.3V I/O

380 µA Doze mode with chip settings preserved (used for beacon monitoring)⁽²⁾

On-chip low power sleep oscillator

Fast host wake-up from Doze mode by a pin or SPI transaction

•

Fast Boot options

–

On-chip boot ROM (Firmware instant boot)

SPI flash boot

Low-leakage on-chip memory for state variables

Fast AP re-association (150 ms)

On-chip Network stack to offload MCU

–

Integrated Network IP stack to minimize host CPU requirements

Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS

Hardware accelerators for Wi-Fi and TLS security to improve connection time

•

Hardware accelerator for IP checksum

Hardware accelerators for OTA security

Small footprint host driver

®

Wi-Fi Alliance certifications for Connectivity and Optimizations

–

ID: WFA61069

Note:ꢀ

1. For more information on software feature, refer to Wi-Fi Network Controller Software Design Guide

(DS00002389).

2. For information on module power modes, refer to Power Consumption.

DS70005304C-page 2

Datasheet

Table of Contents

1. Ordering Information and Module Marking................................................................5

2. Block Diagram........................................................................................................... 7

3. Pin Description.......................................................................................................... 8

4. Electrical Specifications...........................................................................................10

4.1. Absolute Maximum Ratings........................................................................................................10

4.2. Recommended Operating Conditions........................................................................................ 10

5. CPU and Memory Subsystems................................................................................11

5.1. Processor................................................................................................................................... 11

5.2. Memory Subsystem....................................................................................................................11

5.3. Non-volatile Memory (eFuse)..................................................................................................... 11

6. WLAN Subsystem................................................................................................... 13

6.1. MAC........................................................................................................................................... 13

6.2. PHY............................................................................................................................................14

6.3. Radio..........................................................................................................................................14

7. External Interfaces...................................................................................................18

7.1. Interfacing with the Host Microcontroller.................................................................................... 18

7.2. SPI Interface...............................................................................................................................19

7.3. UART Interface...........................................................................................................................21

8. Power Consumption................................................................................................ 23

8.1. Description of Device States...................................................................................................... 23

8.2. Current Consumption in Various Device States......................................................................... 23

8.3. Restrictions for Power States.....................................................................................................24

8.4. Power-up/down Sequence......................................................................................................... 24

8.5. Digital I/O Pin Behavior During Power-up Sequences............................................................... 25

8.6. Module Reset............................................................................................................................. 26

9. Notes On Interfacing to the ATWINC15x0-MR210xB..............................................27

9.1. Programmable Pull Up Resistors............................................................................................... 27

10. Schematic Design Information.................................................................................28

10.1. Application Schematic................................................................................................................28

11. Module Drawing.......................................................................................................29

11.1. Module Footprint........................................................................................................................ 30

12. Design Considerations............................................................................................ 32

12.1. ATWINC15x0-MR210PB Placement and Routing Guidelines....................................................32

12.2. Printed PCB Antenna Performance of ATWINC15x0-MR210PB............................................... 32

DS70005304C-page 3

Datasheet

ATWINC15x0

12.3. ATWINC15x0-MR210UB Placement and Routing Guidelines................................................... 35

12.4. Module Assembly Considerations..............................................................................................36

13. Reflow Profile Information....................................................................................... 37

13.1. Storage Condition.......................................................................................................................37

13.2. Printing Process......................................................................................................................... 37

13.3. Baking Conditions...................................................................................................................... 37

13.4. Soldering and Reflow Condition.................................................................................................37

14. Regulatory Approval................................................................................................40

14.1. United States..............................................................................................................................41

14.2. Canada.......................................................................................................................................43

14.3. Europe........................................................................................................................................45

14.4. Japan..........................................................................................................................................47

14.5. Korea..........................................................................................................................................48

14.6. Taiwan........................................................................................................................................ 48

14.7. China..........................................................................................................................................49

14.8. Other Regulatory Information.....................................................................................................50

15. Reference Documentation and Support.................................................................. 51

15.1. Reference Documents................................................................................................................51

16. Document Revision History..................................................................................... 52

The Microchip Web Site................................................................................................ 56

Customer Change Notification Service..........................................................................56

Customer Support......................................................................................................... 56

Microchip Devices Code Protection Feature................................................................. 56

Legal Notice...................................................................................................................57

Trademarks................................................................................................................... 57

Quality Management System Certified by DNV.............................................................58

Worldwide Sales and Service........................................................................................59

DS70005304C-page 4

Datasheet

ATWINC15x0

Ordering Information and Module Marking

1.

Ordering Information and Module Marking

Following table describes the ordering details for the ATWINC15x0-MR210xB modules.

Table 1-1.ꢀOrdering Details

Model Number

Ordering

Code

Package

Dimension

No. Description

of

Regulatory

Certification

1

Pins

ATWINC1500-

MR210PB

ATWINC1500-

MR210PBXXXX

21.7 x 14.7 x 2.1

mm

28

Certified Module with

FCC, ISED,

CE, MIC,

KCC, NCC,

SRRC

ATWINC1500B chip

(4Mb Flash) and PCB

printed antenna

ATWINC1500-

MR210UB

ATWINC1500-

MR210UBXXXX

21.7 x 14.7 x 2.1

mm

Certified Module with

ATWINC1500B chip

(4Mb Flash) and u.FL

connector

FCC, ISED,

CE

ATWINC1510-

MR210PB

ATWINC1510-

MR210PBXXXX

21.7 x 14.7 x 2.1

mm

Certified Module with

ATWINC1510B chip

(8Mb Flash) and PCB

printed antenna

FCC, ISED,

CE, MIC,

KCC, NCC,

SRRC

ATWINC1510-

MR210UB

ATWINC1510-

MR210UBXXXX

21.7 x 14.7 x 2.1

mm

Certified Module with

ATWINC1510B chip

(8Mb Flash) and u.FL

connector

FCC, ISED,

CE

Note:ꢀ

1. XXXX in the Ordering code represents the Firmware version of the product. For more details, refer

to the Software Release Notes available on the Microchip web page.

Following figure illustrates the ATWINC15x0-MR210xB modules’ marking information.

DS70005304C-page 5

Datasheet

ATWINC15x0

Ordering Information and Module Marking

Figure 1-1.ꢀMarking Information

ATWINC15x0 -

MR

2

1

0

P

ATWINC1500: 4Mb Flash

ATWINC1510: 8Mb Flash

Software Version

Reserved

1 0

Module Revision Letter

MR Industrial

P: PCB Antenna

U: uFL Connector

1: No OTA / with shield

2: OTA with shield

DS70005304C-page 6

Datasheet

ATWINC15x0

Block Diagram

2.

Block Diagram

Figure 2-1.ꢀATWINC15x0-MR210xB Module Block Diagram

Printed 2.4 GHz Antenna

or

u.FL 2.4 GHz External

Antenna Connector

VBAT

VDDIO

SPI_CFG

SPI

RX/TX

GPIO 3

GPIO 4

GPIO 5

GPIO 6

BALUN

®

Wi-Fi

ATWINC15x0

SoC

IRQN

Chip_EN

WAKE

RESET

26 MHz crystal

GND

DS70005304C-page 7

Datasheet

ATWINC15x0

Pin Description

3.

Pin Description

Figure 3-1.ꢀPin Diagram

ATWINC15x0-MR210

GND_1

9

8

7

NC

SPI_CFG

10

11

12

13

14

15

16

17

18

19

29

PADDLE

GND

NC

WAKE

GND_2

6

(Bottom)

IRQN

5

NC

UART_TXD

SPI_MOSI

SPI_SSN

SPI_MISO

SPI_SCK

UART_RXD

4

3

2

1

RESET_N

I2C_SDA

I2C_SCL

GPIO_6

Table 3-1.ꢀATWINC15x0-MR210xB Pin Description

Pin Name

#

Type Description

Programmable

Pull Up Resistor

1

2

GPIO_6

I/O

General purpose I/O.

Yes

I2C_SCL

I2C Slave Clock. Currently used only for development

debug. Leave unconnected.

Yes

No

3

4

I2C_SDA

I/O

I

I2C Slave Data. Currently used only for development

debug. Leave unconnected.

RESET_N

Active-Low Hard Reset. When this pin is asserted

low, the module will be placed in the reset state.

When this pin is asserted high, the module will be out

of reset and will function normally. Connect to a host

output that defaults low at power up. If the host output

is tri-stated, add a 1 MΩ pull down resistor to ensure

a low level at power-up.

5

NC

-

No connect.

-

DS70005304C-page 8

Datasheet

ATWINC15x0

Pin Description

Pin Name

#

Type Description

Programmable

Pull Up Resistor

6

NC

-

I

No connect.

GND.

-

7

NC

8

NC

-

9

GND_1

SPI_CFG

-

10

Tie to VDDIO through a 1 MΩ resistor to enable the

SPI interface.

No

11

WAKE

I

Host Wake control. Can be used to wake-up the

module from Doze mode. Connect to a host GPIO.

Yes

12

13

GND_2

IRQN

-

GND.

-

O

ATWINC15x0-MR210xB Device Interrupt output.

Connect to host interrupt input pin.

Yes

14

UART_TXD

O

UART Transmit Output from ATWINC15x0-MR210xB

Added debug.

Yes

15

16

17

18

19

SPI_RXD

SPI_SSN

SPI_TXD

SPI_SCK

UART_RXD

I

SPI MOSI (Master Out, Slave In) pin.

SPI Slave Select. Active-low.

SPI MISO (Master In, Slave Out) pin.

SPI Clock.

Yes

I

O

I

UART Receive input to ATWINC15x0-MR210xB.

Added debug.

20

21

22

VBATT

-

I

Battery power supply.

-

GPIO_1/RTC

CHIP_EN

General Purpose I/O / RTC.

Yes

No

Module enable. High level enables the module; low

level places module in Power-Down mode. Connect

to a host output that defaults low at power-up. If the

host output is tri-stated, add a 1 MΩ pull down

resistor to ensure a low level at power-up.

23

24

VDDIO

-

I/O Power Supply. Must match host I/O voltage.

-

1P3V_TP

1.3V VDD Core Test Point. Decouple with 10 µF, and

0.01 µF to GND.

25

26

27

28

29

GPIO_3

GPIO_4

GPIO_5

GND_3

I/O

-

General purpose I/O.

GND.

Yes

-

PADDLE GND -

GND.

-

DS70005304C-page 9

Datasheet

ATWINC15x0

Electrical Specifications

4.

Electrical Specifications

4.1

Absolute Maximum Ratings

Absolute maximum ratings for the ATWINC15x0-MR210xB modules are listed below.

Table 4-1.ꢀConditions

Symbol

Description

Min.

-0.3

-40

Max.

5.0

Unit

V

VBATT

Input supply voltage

I/O voltage

VDDIO

4.2

V

Operating Temperature

+85

^oC

Stresses listed under "Absolute Maximum Ratings" may cause permanent damage to the

device. This is a stress rating only. The functional operation of the device at those or any other

conditions above those indicated in the operation listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods may affect the device reliability.

CAUTION

4.2

Recommended Operating Conditions

Table 4-2.ꢀRecommended Operating Conditions

Symbol

VBATT

VDDIO

Min.

3.0

Typ.

3.3

Max.

4.2

Unit

V

2.7

3.3

3.6

V

Note:ꢀ 1. Test Conditions: -40^oC - +85^oC

DS70005304C-page 10

Datasheet

ATWINC15x0

CPU and Memory Subsystems

5.

CPU and Memory Subsystems

5.1

Processor

The ATWINC15x0-MR210xB modules have a Cortus APS3 32-bit processor. This processor performs

many of the MAC functions, including but not limited to the association, authentication, power

management, security key management, and MSDU aggregation/de-aggregation. In addition, the

processor provides flexibility for various modes of operation, such as STA and AP modes.

5.2

Memory Subsystem

The APS3 core uses a 128KB instruction/boot ROM along with a 160KB instruction RAM and a 64KB

data RAM. The ATWINC15x0-MR210xB modules come populated with either 4Mb or 8Mb of Flash

memory depending on the module model that is ordered. This memory can be used for system software.

See Table 1-1 for more information. In addition, the device uses a 128KB shared RAM, accessible by the

processor and MAC, which allows the APS3 core to perform various data management tasks on the TX

and RX data packets.

5.3

Non-volatile Memory (eFuse)

The ATWINC15x0-MR210xB modules have 768 bits of non-volatile eFuse memory that can be read by

the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store

customer-specific parameters, such as MAC address; various calibration information, such as TX power,

crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is

partitioned into six 128-bit banks. Each bank has the same bitmap (see following figure). The purpose of

the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent

bits, or reserved for future use. Since each bank can be programmed independently, this allows for

several updates of the device parameters following the initial programming; for example, if the MAC

address has to be changed, Bank 1 has to be programmed with the new MAC address along with the

values of TX gain correction and frequency offset if they are used and programmed in Bank 0. The

contents of Bank 0 have to be invalidated in this case by programming the invalid bit in the Bank 0. This

will allow the firmware to use the MAC address. By default, all the ATWINC15x0-MR210xB modules are

programmed with the MAC address and the frequency offset bits of Bank 0.

DS70005304C-page 11

Datasheet

ATWINC15x0

CPU and Memory Subsystems

Figure 5-1.ꢀeFuse Bitmap

1

3

4

1

7

1

15

Flags

8

48

8

16

FO

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

F

MAC ADDR

G

128 Bits

DS70005304C-page 12

Datasheet

ATWINC15x0

WLAN Subsystem

6.

WLAN Subsystem

The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY).

The following two subsections describe the MAC and PHY in detail.

6.1

MAC

6.1.1

Description

The ATWINC15x0-MR210xB MAC is designed to operate at low power while providing high data

throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath

engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of

dedicated logic with a programmable processor provides optimal power efficiency and real-time response

while providing the flexibility to accommodate evolving standards and future feature enhancements.

Dedicated datapath engines are used to implement datapath functions with heavy computational

requirements. For example, an FCS engine checks the CRC of the transmitting and receiving packets,

and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-

TKIP, and WPA2 CCMP-AES.

Control functions which have real-time requirements are implemented using hardwired control logic

modules. These logic modules offer real-time response while maintaining configurability via the

processor. Examples of hardwired control logic modules are the channel access control module

(implements EDCA/HCCA, Beacon TX control, interframe spacing, etc.), protocol timer module

(responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot

management), MPDU handling module, aggregation/de-aggregation module, block ACK controller

(implements the protocol requirements for burst block communication), and TX/RX control FSMs

(coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the

TX/RX FIFOs).

The MAC functions implemented solely in software on the microprocessor have the following

characteristics:

•

Functions with high memory requirements or complex data structures. Examples are association

table management and power save queuing.

Functions with low computational load or without critical real-time requirements. Examples are

authentication and association.

Functions which need flexibility and upgradeability. Examples are beacon frame processing and

QoS scheduling.

6.1.2

Features

The ATWINC15x0-MR210xB IEEE802.11 MAC supports the following functions:

•

IEEE 802.11b/g/n

IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling

Advanced IEEE 802.11n features:

–

Transmission and reception of aggregated MPDUs (A-MPDU)

Transmission and reception of aggregated MSDUs (A-MSDU)

Immediate Block Acknowledgment

Reduced Interframe Spacing (RIFS)

DS70005304C-page 13

Datasheet

ATWINC15x0

WLAN Subsystem

•

Support for IEEE802.11i and WFA security with key management:

–

WEP 64/128

WPA-TKIP

128-bit WPA2 CCMP (AES)

Advanced power management:

Standard 802.11 Power Save Mode

–

•

RTS-CTS and CTS-self support

Supports either STA or AP mode in the infrastructure basic service set mode

6.2

PHY

6.2.1

Description

The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer

communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced

algorithms have been employed to achieve maximum throughput in a real world communication

environment with impairments and interference. The PHY implements all the required functions that

include FFT, filtering, FEC (Viterbi decoder), frequency, timing acquisition and tracking, channel

estimation and equalization, carrier sensing, clear channel assessment, and automatic gain control.

6.2.2

Features

The ATWINC1500B IEEE802.11 PHY supports the following functions:

•

Single antenna 1x1 stream in 20MHz channels

Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps

Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps

Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2,

13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps

•

IEEE 802.11n mixed mode operation

Per packet TX power control

Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery,

and frame detection

6.3

Radio

This section presents information describing the properties and characteristics of the ATWINC15x0-

MR210xB and Wi-Fi radio transmit and receive performance capabilities of the device.

The performance measurements are taken at the RF pin assuming 50Ω impedance; the RF performance

is guaranteed for room temperature of 25^oC with a derating of 2-3dB at boundary conditions.

Measurements were taken under typical conditions: VBATT=3.3V; VDDIO=3.3V; temperature: +25ºC

Table 6-1.ꢀFeatures and Properties

Feature

Description

Part Number

WLAN Standard

ATWINC15x0-MR210xB

IEEE 802.11 b/g/n, Wi-Fi compliant

DS70005304C-page 14

Datasheet

ATWINC15x0

WLAN Subsystem

Feature

Description

SPI

Host Interface

Dimension

21.7 x 14.7 x 2.1 mm

Frequency Range

Number of Channels

Modulation

2.412GHz ~ 2.472GHz (2.4GHz ISM Band)

11 for North America, and 13 for Europe

802.11b: DQPSK, DBPSK, CCK

802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK

Data Rate

802.11b: 1, 2, 5.5, 11Mbps

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps

Data Rate

(20MHz, normal GI, 800ns)

Data Rate

(20MHz, short GI, 400ns)

802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8,

65,72.2Mbps

Operating temperature

Storage temperature

Humidity

-40 to +85^oC

-40 to +125 ^oC

Operating Humidity 10% to 95% Non-Condensing

Storage Humidity 5% to 95% Non-Condensing

6.3.1

Receiver Performance

Table 6-2.ꢀReceiver Performance

Parameter

Description

Minimum Typical

Maximum Unit

2,472 MHz

Frequency

2,412

DS70005304C-page 15

Datasheet

ATWINC15x0

WLAN Subsystem

Parameter

Description

Minimum Typical

Maximum Unit

1Mbps DSS

-95

-90

-92

-86

-90

-89

-88

-85

-83

-80

-76

-74

-89

-87

-85

-82

-77

-74

-72

-70.5

0

2Mbps DSS

Sensitivity

802.11b

5.5Mbps DSS

11Mbps DSS

6Mbps OFDM

9Mbps OFDM

12Mbps OFDM

18Mbps OFDM

24Mbps OFDM

36Mbps OFDM

48Mbps OFDM

54Mbps OFDM

MCS 0

Sensitivity

802.11g

dBm

MCS 1

MCS 2

Sensitivity

802.11n

(BW=20MHz)

MCS 3

MCS 4

MCS 5

MCS 6

MCS 7

1-11Mbps DSS

6-54Mbps OFDM

MCS 0 – 7

Maximum Receive

Signal Level

0

1Mbps DSS (30MHz offset)

11Mbps DSS (25MHz offset)

6Mbps OFDM (25MHz offset)

54Mbps OFDM (25MHz offset)

MCS 0 – 20MHz BW (25MHz offset)

MCS 7 – 20MHz BW (25MHz offset)

50

43

40

Adjacent Channel

Rejection

dB

25

40

20

DS70005304C-page 16

Datasheet

ATWINC15x0

WLAN Subsystem

Parameter

Description

Minimum Typical

Maximum Unit

776-794MHz CDMA

824-849MHz GSM

880-915MHz GSM

1710-1785MHz GSM

1850-1910MHz GSM

1850-1910MHz WCDMA

1920-1980MHz WCDMA

-14

-10

-15

-24

Cellular Blocker

Immunity

dBm

6.3.2

Transmitter Performance

Table 6-3.ꢀTransmitter Performance

Parameter

Description

—

Minimum Typical

Maximum Unit

Frequency

2,412

—

2,472

—

MHz

802.11b 1Mbps

802.11b 11Mbps

802.11g 6Mbps

802.11g 54Mbps

802.11n MCS 0

802.11n MCS 7

—

17.5

18.5

17.5

16

—

Output Power^1-2

ON_Transmit

—

dBm

—

17.0

14.5

±1.5 ²

30.0

—

TX Power Accuracy

Carrier Suppression

—

dB

—

dBc

2nd

—

-41

Harmonic Output Power

dBm/MHz

3rd

—

Note:ꢀ

1. Measured at 802.11 spec compliant EVM/Spectral Mask.

2. Measured after RF matching network.

3. Operating temperature range is -40°C to +85°C. RF performance guaranteed at room temperature

of 25°C with a 2-3dB change at boundary conditions.

4. With respect to TX power, different (higher/lower) RF output power settings may be used for

specific antennas and/or enclosures, in which case recertification may be required.

5. The availability of some specific channels and/or operational frequency bands are country

dependent and should be programmed at the Host product factory to match the intended

destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement

needs to be taken care of via Host implementation.

DS70005304C-page 17

Datasheet

ATWINC15x0

External Interfaces

7.

External Interfaces

7.1

Interfacing with the Host Microcontroller

This section describes interfacing the ATWINC15x0-MR210xB module with the host microcontroller. The

interface is comprised of a slave SPI and additional control signals, as shown in the following figure. For

more information on SPI interface specification and timing, refer to the SPI Interface. Additional control

signals are connected to the GPIO/IRQ interface of the microcontroller.

Figure 7-1.ꢀInterfacing with Host Microcontroller

CHIP_EN

RESET

WAKE

Host

Microcontroller

Wi-Fi Controller

Module

SPI

IRQN

Table 7-1.ꢀHost Microcontroller Interface Pins

Pin Number

Function

RESET_N

WAKE

4

11

13

22

16

15

17

18

IRQ_N

CHIP_EN

SPI_SSN

SPI_MOSI

SPI_MISO

SPI_SCK

Related Links

9.1 Programmable Pull Up Resistors

7.2.2

SPI Timing

The SPI Slave interface supports four standard modes as determined by the Clock Polarity (CPOL) and

Clock Phase (CPHA) settings. These modes are illustrated in the following table and figure.

Table 7-3.ꢀSPI Slave Modes

Mode

CPOL

CPHA

0

1

2

3

0

1

0

1

0

1

Note:ꢀ The ATWINC15x0 firmware uses “SPI MODE 0” to communicate with the host.

DS70005304C-page 19

Datasheet

ATWINC15x0

External Interfaces

The red lines in the following figure correspond to Clock Phase = 0 and the blue lines correspond to Clock

Phase = 1.

Figure 7-2.ꢀSPI Slave Clock Polarity and Clock Phase Timing

CPOL = 0

SCK

CPOL = 1

SSN

CPHA = 0

CPHA = 1

z

1

2

3

4

5

6

7

8

z

RXD/TXD

(MOSI/MISO)

z

1

2

3

4

5

6

7

8

z

The SPI timing is provided in the following figure and table.

Figure 7-3.ꢀSPI Timing Diagram (SPI Mode CPOL=0, CPHA=0)

f

SCK

t

WL

LH

WH

HL

SCK

TXD

t

t _ODLY

RXD

SSN

t

ISU

IHD

t _SUSSN

t

HDSSN

Table 7-4.ꢀSPI Slave Timing Parameters¹

Parameter

Symbol

Min.

Max.

Units

Clock Input Frequency²

f_SCK

—

48

MHz

DS70005304C-page 20

Datasheet

ATWINC15x0

External Interfaces

Parameter

Symbol

t_WL

Min.

Max.

Units

Clock Low Pulse Width

Clock High Pulse Width

Clock Rise Time

4

5

0

4

—

7

t_WH

t_LH

Clock Fall Time

t_HL

7

TXD Output Delay³

t_ODLY

9 from SCK fall

12.5 from SCK

rise

ns

RXD Input Setup Time

RXD Input Hold Time

SSN Input Setup Time

SSN Input Hold Time

t_ISU

1

5

—

t_IHD

t_SUSSN

t_HDSSN

3

5.5

Note:ꢀ

1. Timing is applicable to all SPI modes

2. Maximum clock frequency specified is limited by the SPI Slave interface internal design, actual

maximum clock frequency can be lower and depends on the specific PCB layout

3. Timing based on 15pF output loading

7.3

UART Interface

The ATWINC15x0-MR210xB supports the Universal Asynchronous Receiver/Transmitter (UART)

interface. This interface should be used for debug purposes only. The UART is available on pins 14 and

19. The UART is compatible with the RS-232 standard, and the ATWINC15x0-MR210xB operates as

Data Terminal Equipment (DTE). It has a two-pin RXD/TXD interface.

The default configuration for accessing the UART interface of ATWINC15x0-MR210xB is mentioned

below:

•

Baud rate: 115200

Data: 8 bit

Parity: None

Stop bit: 1 bit

Flow control: None

It also has RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead

transmission. FIFO size is 4 x 8 for both RX and TX direction. The UART also has status registers

showing the number of received characters available in the FIFO and various error conditions, as well the

ability to generate interrupts based on these status bits.

An example of the UART receiving or transmitting a single packet is shown in the following figure. This

example shows 7-bit data (0x45), odd parity, and two stop bits.

DS70005304C-page 21

Datasheet

ATWINC15x0

External Interfaces

Important:ꢀ UART2 supports RTS and CTS flow control. The UART RTS and UART CTS

MUST be connected to the host MCU UART and enabled for the UART interface to be

functional.

Figure 7-4.ꢀExample of UART RX of TX Packet

Current Packet

Data

Leading

Parity

Bit

Start

Bit

Stop Bits

Idle Bits

DS70005304C-page 22

Datasheet

ATWINC15x0

Power Consumption

8.

Power Consumption

8.1

Description of Device States

The ATWINC15x0-MR210xB has several device states:

•

ON_Transmit – Device is actively transmitting an 802.11 signal. Highest output power and nominal

current consumption.

•

ON_Receive – Device is actively receiving an 802.11 signal. Lowest sensitivity and nominal current

consumption.

•

ON_Doze – Device is ON but is neither transmitting nor receiving

Power_Down – Device core supply off (Leakage)

IDLE connect – Device is connected with 1 DTIM beacon interval

The following pins are used to switch between the ON and Power_Down states:

•

CHIP_EN – Device pin (pin #22) used to enable DC/DC Converter

VDDIO – I/O supply voltage from external supply

In the ON states, VDDIO is on and CHIP_EN is high (at VDDIO voltage level). To switch between

the ON states and Power_Down state CHIP_EN has to change between high and low (GND)

voltage. When VDDIO is off and CHIP_EN is low, the chip is powered off with no leakage (also see

Restrictions for Power States).

8.2

Current Consumption in Various Device States

Table 8-1.ꢀCurrent Consumption

Current Consumption ¹

IVBATT IVDDIO

268mA

Output

power, dBm

Device State

Code Rate

802.11b 1Mbps

802.11b 11Mbps

802.11g 6Mbps

802.11g 54Mbps

802.11n MCS 0

802.11n MCS 7

802.11b 1Mbps

802.11b 11Mbps

802.11g 6Mbps

802.11g 54Mbps

802.11n MCS 0

802.11n MCS 7

17.5

18.5

17.5

16.0

17.0

14.5

N/A

22mA

264mA

269mA

266mA

268mA

265mA

61mA

ON_Transmit

ON_Receive

DS70005304C-page 23

Datasheet

ATWINC15x0

Power Consumption

Current Consumption ¹

Output

power, dBm

Device State

Code Rate

IVBATT

380µA

<0.5µA

IVDDIO

<10µA

<3.5µA

ON_Doze

N/A

Power_Down

Note:ꢀ

1. Measured conditions: VBATT @ 3.3V, VDDIO@ 3.3V, temp. 25°C.

8.3

Restrictions for Power States

When no power is supplied to the device, for example, the DC/DC Converter output and VDDIO are both

off (at ground potential), a voltage cannot be applied to the device pins because each pin contains an

ESD diode from the pin to supply. This diode will turn on when a voltage higher than one diode drop is

supplied to the pin.

If a voltage must be applied to the signal pads while the chip is in a low-power state, the VDDIO supply

must be on, so the SLEEP or Power_Down state must be used.

Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one

diode drop below ground to any pin.

8.4

Power-up/down Sequence

The power-up/down sequence for ATWINC15x0-MR210xB is shown in the Following Figure. The timing

parameters are provided in following the table.

Figure 8-1.ꢀPower Up/Down Sequence

VBATT

t_A

t_A'

VDDIO

t_B

t_B'

CHIP_EN

RESETN

XO Clock

t _C

t_C'

DS70005304C-page 24

Datasheet

ATWINC15x0

Power Consumption

Table 8-2.ꢀPower-up/down Sequence Timing

Parameter Min.

Max.

Units

Description

Notes

0

ms

VBATT rise to VDDIO

rise

VBATT and VDDIO can rise

simultaneously or can be tied

together. VDDIO must not rise

before VBATT.

t_A

0

ms

VDDIO rise to CHIP_EN CHIP_EN must not rise before

t_B

rise

VDDIO. CHIP_EN must be driven

high or low, not left floating.

5

CHIP_EN rise to

RESETN rise

This delay is needed because the

XO clock must stabilize before

RESETN removal. RESETN must

be driven high or low, not left

floating.

t_C

0

ms

VDDIO fall to VBATT fall VBATT and VDDIO can fall

simultaneously or can be tied

together. VBATT must not fall

before VDDIO.

t_A’

0

ms

CHIP_EN fall to VDDIO

fall

VDDIO must not fall before

CHIP_EN. CHIP_EN and RESETN

can fall simultaneously.

t_B’

0

RESETN fall to VDDIO

fall

VDDIO must not fall before

RESETN. RESETN and CHIP_EN

can fall simultaneously.

t_C’

8.5

Digital I/O Pin Behavior During Power-up Sequences

The following table represents digital I/O Pin states corresponding to device power modes.

Table 8-3.ꢀDigital I/O Pin Behavior in Different Device States

Device state

VDDIO

CHIP_EN RESETN Output

driver

Input

driver

Pull up/down

resistor (96kΩ)

Power-Down:

core supply off

High

Low

Disabled (Hi-Z) Disabled Disabled

Power-on Reset:

core supply on, hard reset

on

High

Low

Disabled (Hi-Z) Disabled Enabled

Power-On Default:

High

Disabled (Hi-Z) Enabled Enabled

core supply on, the device

is out of reset but not

programmed yet

DS70005304C-page 25

Datasheet

ATWINC15x0

Power Consumption

Device state

VDDIO

CHIP_EN RESETN Output

driver

Input

driver

Pull up/down

resistor (96kΩ)

On Sleep/

High

Programmed by Opposite Programmed by

On Transmit/

On Receive:

core supply on, device

programmed by firmware

firmware for

each pin:

Enabled or

Disabled

of Output firmware for

Driver

state

each pin:

Enabled or

Disabled

8.6

Module Reset

If a module reset is performed, the RESETN pin must be pulsed low for a minimum of 1µ second.

DS70005304C-page 26

Datasheet

ATWINC15x0

Notes On Interfacing to the ATWINC15x0-MR210xB

9.

Notes On Interfacing to the ATWINC15x0-MR210xB

9.1

Programmable Pull Up Resistors

The ATWINC15x0-MR210xB provides programmable pull up resistors on various pins. The purpose of

these resistors is to keep any unused input pins from floating, which can cause excess current to flow

through the input buffer from the VDDIO supply. Any unused module pin on the ATWINC15x0-MR210xB

should leave these pull up resistors enabled so the pin will not float. The default state at power-up is for

the pull up resistor to be enabled. However, any pin that is used should have the pull up resistor disabled.

The reason for this is that if any pins are driven to a low level while the ATWINC15x0-MR210xB is in the

low power sleep state, current will flow from the VDDIO supply through the pull up resistors, increasing

the current consumption of the module. Since the value of the pull up resistor is approximately 100KΩ,

the current through any pull up resistor that is being driven low will be VDDIO/100K. For VDDIO = 3.3V,

the current through each pull up resistor that is driven low would be approximately 3.3V/100K = 33µA.

Pins which are used and have had the programmable pull up resistor disabled should always be actively

driven to either a high or low level and not be allowed to float.

DS70005304C-page 27

Datasheet

ATWINC15x0

Schematic Design Information

10.

Schematic Design Information

This section provides schematic information for reference. Application schematics for SPI are provided in

the following figure. Module design information such as module schematics can be obtained under an

NDA from Microchip. These schematics are applicable to the ATWINC1500-MR210PB, ATWINC1510-

MR210PB, ATWINC1500-MR210UB, and ATWINC1510-MR210UB modules.

10.1

Application Schematic

Figure 10-1.ꢀSPI Application Schematic

Resistors R2-R1 are recommended

As placeholders in case filtering

of noisy signals is required. They

also allow disconnecting of module

For debug purposes.

Note:ꢀ Add 10uF and 0.01uF decoupling capacitors between the pin 24 (1P3V_TP) and GND.

DS70005304C-page 28

Datasheet

ATWINC15x0

Module Drawing

11.

Module Drawing

This section provides information about the module package outline drawings.

Figure 11-1.ꢀModule Drawing - ATWINC15x0-MR210PB (unit = mm)

Metal

Shield

NOTE: THIS PAD MUST

BE SOLDERED TO GND.

PCB

Metal

Shield

MODULE BOTTOM VIEW

MODULE SIDE VIEW

MODULE TOP VIEW

NOT TO SCALE

DS70005304C-page 29

Datasheet

ATWINC15x0

Module Drawing

Figure 11-2.ꢀModule Drawings – ATWINC15x0-MR210UB (unit = mm)

Metal

Shield

NOTE: THIS PAD MUST

BE SOLDERED TO GND.

PCB

Metal

Shield

MODULE BOTTOM VIEW

MODULE SIDE VIEW

MODULE TOP VIEW

NOT TO SCALE

Rev. 2

11.1

Module Footprint

This section provides the outline drawing for the recommended footprint for the ATWINC15x0-MR210xB

module. It is imperative that the center Ground Pad is provided, with an array of vias to provide for a good

ground and thermal transfer for the ATWINC15x0-MR210xB module.

This footprint is applicable to the ATWINC15x0-MR210xB module devices.

DS70005304C-page 30

Datasheet

ATWINC15x0

Module Drawing

Figure 11-3.ꢀModule Solder Pad Footprint (unit = mm).

14.73

1.9

NOTE: THIS PAD MUST BE

TIED TO GND.

0.8

1.016 Pitch

2.032

21.72

1.016 Pitch

4.064

3.70

1.016 Pitch

3.70

6.00

4.42

3.68

2.67

1.9

3.048

Drawing not to scale.

Untoleranced dimensions.

Units=mm.

1.016 Pitch

SOLDER PAD FOOTPRINT

DS70005304C-page 31

Datasheet

ATWINC15x0

Design Considerations

12.

Design Considerations

This section provides the guidelines on placement and routing to achieve the best performance.

12.1

ATWINC15x0-MR210PB Placement and Routing Guidelines

•

The module must be placed on the main board – the printed antenna area must overlap with the

carrier board. The portion of the module containing the antenna should not go outside the edge of

the main board. The antenna is designed to work properly when it is sitting directly on top of a

1.5mm thick printed circuit board.

•

If the module is placed at the edge of the main board, a minimum 22mm by 5mm area directly

under the antenna must be clear of all metal on all layers of the board. “In-land” placement is

acceptable; however deepness of keep-out area must grove to: module edge to main board edge

plus 5mm. DO NOT PLACE THE MODULE IN THE MIDDLE OF THE MAIN BOARD OR FAR

AWAY FROM THE MAIN BOARD EDGE.

•

Keep away from the antenna, as far as possible, large metal objects to avoid electromagnetic field

blocking

•

Do not enclose the antenna within a metal shield

Keep any components which may radiate noise or signals within the 2.4GHz-2.5GHz frequency

band as far away from the antenna as possible, or better yet, shield those components. Any noise

radiated from the main board in this frequency band will degrade the sensitivity of the module.

Figure 12-1.ꢀATWINC15x0-MR210PB Placement Reference

Keep out area.

Microchip

Best Case

(a)

Microchip

Worst Case

(b)

System Ground Plane

12.2

Printed PCB Antenna Performance of ATWINC15x0-MR210PB

The printed PCB antenna on the ATWINC15x0-MR210PB is a meandered Inverted F Antenna (IFA). The

antenna is fed via matching network, which is matched for the module installed on a 1.5mm thick main

DS70005304C-page 32

Datasheet

ATWINC15x0

Design Considerations

board. Main board thickness deviation by ±1mm changes RX/TX performance by ±1dB maximum,

referring to RX/TX performance with a default antenna matching network and installed on 1.5mm thick

main board.

Measured peak antenna gain is -0.3dBi.

Antenna Radiation Pattern

Following figures illustrate the Antenna Radiation Patterns.

Figure 12-2.ꢀAntenna Radiation Pattern when Phi = 0 degree

DS70005304C-page 33

Datasheet

ATWINC15x0

Design Considerations

Figure 12-3.ꢀAntenna Radiation Pattern when Phi = 90 degree

DS70005304C-page 34

Datasheet

ATWINC15x0

Design Considerations

Figure 12-4.ꢀAntenna Radiation Pattern when Theta = 90 degree

12.3

ATWINC15x0-MR210UB Placement and Routing Guidelines

The ATWINC15x0-MR210UB module has an Ultra Small Miniature RF Connector (u.FL) for the external

antenna.

The choice of antenna is limited to the antenna types for which the module was tested and approved. For

a list of tested and approved antennas that may be used with the module, refer to the respective country

in 14. Regulatory Approval.

An approved and tested antenna type is shown in the following table.

Table 12-1.ꢀTested External Antenna Type

Antenna Type

Gain

Whip Antenna

2.2dBi

DS70005304C-page 35

Datasheet

ATWINC15x0

Design Considerations

12.3.1 Recommended External Antenna for ATWINC15x0-MR210UB

Whip Antenna (Part number: RN-SMA-4) along with a 10cm length RF cable assembly (u.FL to SMA) has

been used for the certification of ATWINC15x0-MR210UB. It is recommended to use the same or similar

external antenna in design.

12.4

Module Assembly Considerations

The ATWINC15x0-MR210xB modules are assembled with an EMI Shield to ensure compliance with EMI

emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically

sealed. Solutions like IPA and similar solvents can be used to clean the ATWINC15x0-MR210xB module.

However, cleaning solutions that contain acid should never be used on the module.

The ATWINC15x0-MR210xB modules are not intended for use with a conformal coating and the customer

assumes all risks if a conformal coating is applied to the modules.

DS70005304C-page 36

Datasheet

ATWINC15x0

Reflow Profile Information

13.

Reflow Profile Information

This chapter provides guidelines for reflow processes in getting the Microchip module soldered to the

customer’s design. For more information on reflow process guidelines, refer to Solder Reflow

Recommendation Application Note (DS00233D).

13.1

Storage Condition

13.1.1 Moisture Barrier Bag Before Opening

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.

The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.

13.1.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, <30%.

13.2

13.3

Printing Process

The printing process requires no significant changes compared to Sn/Pb solder. Any guidelines

recommended by the paste manufacturers to accommodate paste specific characteristics should be

followed. Post-print inspection and paste volume measurement is very critical to ensure good print quality

and uniform paste.

Baking Conditions

This module is rated at MSL level 3. After a sealed bag is opened, no baking is required within 168 hours

so long as the devices are held at ≤30°C/60% RH or stored at <10% RH.

The module will require baking before mounting if:

•

The sealed bag has been open for >168 hours

Humidity Indicator Card reads >10%

SIPs need to be baked for 8 hours at 125°C

13.4

Soldering and Reflow Condition

The optimization of the reflow process is the most critical factor to be considered for lead-free soldering.

The development of an optimal profile should take into account the paste characteristics, the size of the

board, the density of the components, the mix of the larger and smaller components, and the peak

temperature requirements of the components. An optimized reflow process is the key to ensuring a

successful lead-free assembly and achieves high yield and long term solder joint reliability.

Temperature Profiling

Temperature profiling should be performed for all new board designs by attaching thermocouples at the

solder joints, on the top surface of the larger components, and at multiple locations of the boards. This is

to ensure that all components are heated to a temperature above the minimum reflow temperatures and

the smaller components do not exceed maximum temperature limit. The SnAgCu solder alloy melts at

~217°C, so the reflow temperature peak at joint level should be 15 to 20°C higher than melting

DS70005304C-page 37

Datasheet

ATWINC15x0

Reflow Profile Information

temperature. The targeted solder joint temperature for the Sn-Ag-Cu solder should be ~235°C. For larger

or sophisticated boards with a large mix of components, it is also important to ensure that the

temperature difference across the board is less than 10 degrees to minimize board warpage. The

maximum temperature at the component body should not exceed the MSL3 qualification specification.

13.4.1 Reflow Oven

The following items should also be observed in the reflow process:

1. Allowable reflow soldering iterations:

–

Three times based on the following reflow soldering profile (refer following Figure).

2. Temperature profile:

–

Reflow soldering shall be done according to the following temperature profile (refer to the

following figure).

Peak temperature: 250°C.

Figure 13-1.ꢀSolder Reflow Profile

Slope: 1~2^oC/sec max.

(217^oC to peak)

(Peak: 250^oC)

Ramp down rate:

Max. 2.5^oC/sec.

217^oC

Preheat:150 ~ 200^oC

60 ~ 120 sec.

40 ~ 70 sec.

25^oC

Ramp up rate:

Max. 2.5^oC/sec.

Time (sec)

Cleaning

The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no

clean solder pastes is recommended. Full drying of no-clean paste fluxes as a result of the reflow process

must be ensured. This may require longer reflow profiles and/or peak temperatures toward the high end

of the process window as recommended by the solder paste vendor. It is believed that uncured flux

residues could lead to corrosion and/or shorting in accelerated testing and possibly the field.

Rework

Rework is to remove the mounted SIP package and replace with a new unit. It is recommended that once

an ATWINC15x0-MR210xB Module has been removed it should never be reused. During the rework

process, the mounted module and PCB are heated partially, and the module is removed. It is

DS70005304C-page 38

Datasheet

ATWINC15x0

Reflow Profile Information

recommended to pay attention to heat-proof the proximity of the mounted parts and junctions and use the

best nozzle for rework that is suited to the module size.

DS70005304C-page 39

Datasheet

ATWINC15x0

Regulatory Approval

14.

Regulatory Approval

Regulatory Approvals received.

ATWINC1500-MR210PB

•

United States/FCC ID: 2ADHKATWINC1500

Canada

–

IC: 20266-WINC1500PB

HVIN: ATWINC1500-MR210PB

PMN: ATWINC1500-MR210PB

•

Europe - CE

Japan/MIC: 005-101762

Korea/KCC: R-CRM-mcp-WINC1510MR210P

Taiwan/NCC: CCAN18LP0321T2

China/SRRC: CMIIT ID: 2018DJ1305

ATWINC1510-MR210PB

•

United States/FCC ID: 2ADHKATWINC1510

Canada

–

IC: 20266-ATWINC1510

HVIN: ATWINC1510-MR210PB

PMN: ATWINC1510-MR210PB

•

Europe - CE

Japan/MIC: 005-101762

Korea/KCC: R-CRM-mcp-WINC1510MR210P

Taiwan/NCC: CCAN18LP0320T0

China/SRRC: CMIIT ID: 2018DJ1310

ATWINC1500-MR210UB

•

United States/FCC ID: 2ADHKATWINC1500U

Canada

–

IC: 20266-WINC1500UB

HVIN: ATWINC1500-MR210UB

PMN: ATWINC1500-MR210UB

•

Europe - CE

ATWINC1510-MR210UB

•

United States/FCC ID: 2ADHKATWINC1500U

Canada

–

IC: 20266-WINC1500UB

HVIN: ATWINC1510-MR210UB

PMN: ATWINC1510-MR210UB

•

Europe - CE

DS70005304C-page 40

Datasheet

ATWINC15x0

Regulatory Approval

14.1

United States

The ATWINC1500-MR210PB, ATWINC1510-MR210PB, ATWINC1500-MR210UB, and ATWINC1510-

MR210UB modules have received Federal Communications Commission (FCC) CFR47

Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance

with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a

complete RF transmission sub-assembly, designed to be incorporated into another device, that must

demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a

modular grant can be installed in different end-use products (referred to as a host, host product, or host

device) by the grantee or other equipment manufacturer, then the host product may not require additional

testing or equipment authorization for the transmitter function provided by that specific module or limited

module device.

The user must comply with all of the instructions provided by the Grantee, which indicate installation

and/or operating conditions necessary for compliance.

A host product itself is required to comply with all other applicable FCC equipment authorization

regulations, requirements, and equipment functions that are not associated with the transmitter module

portion. For example, compliance must be demonstrated: to regulations for other transmitter components

within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital

devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the

non-transmitter functions on the transmitter module (i.e., Suppliers Declaration of Conformity (SDoC) or

certification) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic

functions).

14.1.1 Labeling And User Information Requirements

The ATWINC1500-MR210PB, ATWINC1510-MR210PB, ATWINC1500-MR210UB, and ATWINC1510-

MR210UB modules have been labeled with its own FCC ID number, and if the FCC ID is not visible when

the module is installed inside another device, then the outside of the finished product into which the

module is installed must display a label referring to the enclosed module. This exterior label should use

the following wording:

For the ATWINC1500-MR210PB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1500

or

Contains FCC ID: 2ADHKATWINC1500

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

For the ATWINC1510-MR210PB:

DS70005304C-page 41

Datasheet

ATWINC15x0

Regulatory Approval

Contains Transmitter Module FCC ID: 2ADHKATWINC1510

or

Contains FCC ID: 2ADHKATWINC1510

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

For the ATWINC1500-MR210UB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1500U

or

Contains FCC ID: 2ADHKATWINC1500U

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

For the ATWINC1510-MR210UB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1500U

or

Contains FCC ID: 2ADHKATWINC1500U

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

The user's manual for the finished product should include the following statement:

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can radiate

radio frequency energy, and if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to radio or television

reception, which can be determined by turning the equipment off and on, the user is encouraged to try

to correct the interference by one or more of the following measures:

•

Reorient or relocate the receiving antenna

Increase the separation between the equipment and receiver

Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected

•

Consult the dealer or an experienced radio/TV technician for help

Additional information on labeling and user information requirements for Part 15 devices can be found in

KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET)

Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm.

DS70005304C-page 42

Datasheet

ATWINC15x0

Regulatory Approval

14.1.2 RF Exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF

Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities,

operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by

the Federal Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This transmitter is restricted for use with the

specific antenna(s) tested in this application for Certification.

In the end product, the antenna(s) used with this transmitter must be installed to provide a separation

distance of at least 6.5 cm from all persons and must not be co-located or operation in conjunction with

any other antenna or transmitter. User and installers must be provided with antenna installation

instructions and transmitter operating conditions for satisfying the RF exposure compliance.

14.1.3 Approved Antenna Types

To maintain modular approval in the United States, only the antenna types that have been tested shall be

used. It is permissible to use different antenna provided the same antenna type and antenna gain (equal

to or less than) is used. An antenna type comprises antennas having similar in-band and out-of-band

radiation patterns.

Testing the ATWINC1500-MR210UB module was performed with the antenna types listed in Table 12-1.

14.1.4 Helpful Web Sites

Federal Communications Commission (FCC): http://www.fcc.gov

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB)

https://apps.fcc.gov/oetcf/kdb/index.cfm

14.2

Canada

The ATWINC1500-MR210PB, ATWINC1510-MR210PB, ATWINC1500-MR210UB, and ATWINC1510-

MR210UB modules have been certified for use in Canada under Innovation, Science, and Economic

Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100,

Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation

of a module in a host device without the need to recertify the device.

14.2.1 Labeling and User Information Requirements

Labeling Requirements (from RSP-100 - Issue 11, Section 3): The host product shall be properly labeled

to identify the module within the host device.

The Innovation, Science and Economic Development Canada certification label of a module shall be

clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to

display the Innovation, Science and Economic Development Canada certification number of the module,

preceded by the word “Contains” or similar wording expressing the same meaning, as follows:

For the ATWINC1500-MR210PB:

Contains IC: 20266-WINC1500PB

For the ATWINC1510-MR210PB:

Contains IC: 20266-ATWINC1510

DS70005304C-page 43

Datasheet

ATWINC15x0

Regulatory Approval

For the ATWINC1500-MR210UB module:

Contains IC: 20266-WINC1500UB

For the ATWINC1510-MR210UB module:

Contains IC: 20266-WINC1500UB

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4,

November 2014): User manuals for license-exempt radio apparatus shall contain the following or

equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:

This device complies with Industry Canada's license exempt RSS standard(s). Operation is

subject to the following two conditions:

(1) This device may not cause interference, and

(2) This device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Guidelines on Transmitter Antenna for License Exempt Radio Apparatus:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of

a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce

potential radio interference to other users, the antenna type and its gain should be so chosen

that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for

successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique

à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la

puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à

l'établisse-ment d'une communication satisfaisante.

Immediately following the above notice, the manufacturer shall provide a list of all antenna types

approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and

required impedance for each.

14.2.2 Transmitter Antenna (From Section 8.3 RSS-GEN, Issue 4, November 2014)

User manuals for transmitters equipped with detachable antennas shall also contain the following notice

in a conspicuous location:

DS70005304C-page 44

Datasheet

ATWINC15x0

Regulatory Approval

This radio transmitter (identify the device by certification number, or model number if Category

II) has been approved by Industry Canada to operate with the antenna types listed below with the

maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated

for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (identifier le dispositif par son numéro de certification) a été approuvé

par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci‑dessous et ayant

un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est

supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

14.2.3 RF Exposure

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must

comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance

of Radiocommunication Apparatus (All Frequency Bands).

This transmitter is restricted for use with a specific antenna tested in this application for certification, and

must not be co-located or operating in conjunction with any other antenna or transmitters within a host

device, except in accordance with Canada multi-transmitter product procedures.

The installation of the transmitter must ensure that the antenna has a separation distance of at least 6.5

cm from all persons or compliance must be demonstrated according to the ISED SAR procedures.

14.2.4 Helpful Web Sites

Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/

14.3

Europe

The ATWINC15x0-MR210xB module is a Radio Equipment Directive (RED) assessed radio module that

is CE marked and has been manufactured and tested with the intention of being integrated into a final

product.

The ATWINC15x0-MR210xB module has been tested to RED 2014/53/EU Essential Requirements for

Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio

(Article 3.2), which is summarized in the following European Compliance Testing table.

The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards

covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-

radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20

3367/01.01.01_60/eg_203367v010101p.pdf.

Note:ꢀ To maintain conformance to the testing listed in the following European Compliance Testing table

the module shall be installed in accordance with the installation instructions in this data sheet and shall

not be modified. When integrating a radio module into a completed product, the integrator becomes the

manufacturer of the final product and is therefore responsible for demonstrating compliance of the final

product with the essential requirements against the RED.

14.3.1 Labeling and User Information Requirements

The label on the final product that contains the ATWINC15x0-MR210xB module must follow CE marking

requirements.

DS70005304C-page 45

Datasheet

ATWINC15x0

Regulatory Approval

Table 14-1.ꢀEuropean Compliance Testing (ATWINC15x0-MR210PB)

Certification Standards Article Laboratory Report

Date

Number

EN60950-1:2006/A11:2009/

A1:2010/ A12:2011/A2:2013

10059657

001

Safety

Health

2017-02-20

[3.1(a)]

EN300328 V1.9.1/

EN62311:2008

50068130

002

EN301489-1 V1.9.2

EN301489-17 V2.2.1

10058459

002

2017-02-20

2017-05-25

TUV

Rheinland,

Taiwan

EN301489-1 V2.1.1

EN301489-1 V2.2.0

EMC

[3.1(b)]

10058459

003

EN301489-17 V3.1.1

EN301489-17 V3.2.0

Radio

EN300328 V1.9.1

50068130

002

2017-02-20

2017-05-26

(3.2)

50068130

003

EN300328 V2.1.1

Table 14-2.ꢀEuropean Compliance Testing (ATWINC15x0-MR210UB)

Certification Standards

Article

Laboratory Report

Number

Date

EN60950-1:2006/A11:2009/

A1:2010/ A12:2011/A2:2013

Safety

50118432 001 2018-01-08

50124655 001 2018-03-16

Health

EMC

EN62311:2008

TUV

Rheinland,

Taiwan

[3.1(a)]

(3.2)

EN301489-1 V2.1.1

EN301489-1 V2.2.0

50113712 001 2018-03-22

50124665 001 2018-03-16

EN301489-17 V3.1.1

EN301489-17 V3.2.0

Radio

EN300328 V2.1.1

14.3.2 Conformity Assessment

From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio

product:

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in

equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio

product) and according to the installation instructions for the radio product, then no additional assessment

of the combined equipment against article 3.2 of the RED is required.

The European Compliance Testing listed in the preceeding table was performed using the integral chip

antenna.

DS70005304C-page 46

Datasheet

ATWINC15x0

Regulatory Approval

14.3.2.1 Simplified EU Declaration of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC15x0-MR210xB is in

compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity for this product is available at http://www.microchip.com/

design-centers/wireless-connectivity/.

14.3.3 Helpful Websites

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD)

in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which

can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/.

Additional helpful web sites are:

•

Radio Equipment Directive (2014/53/EU):

https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en

European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

The Radio Equipment Directive Compliance Association (REDCA):

http://www.redca.eu/

14.4

Japan

The ATWINC15x0-MR210PB module has received type certification and is labeled with its own technical

conformity mark and certification number as required to conform to the technical standards regulated by

the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.

Integration of this module into a final product does not require additional radio certification provided

installation instructions are followed and no modifications of the module are allowed. Additional testing

may be required:

•

If the host product is subject to electrical appliance safety (for example, powered from an AC

mains), the host product may require Product Safety Electrical Appliance and Material (PSE)

testing. The integrator should contact their conformance laboratory to determine if this testing is

required

•

There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by

VCCI: http://www.vcci.jp/vcci_e/index.html

14.4.1 Labeling and User Information Requirements

The label on the final product which contains the ATWINC15x0-MR210PB module must follow Japan

marking requirements. The integrator of the module should refer to the labeling requirements for Japan

available at the Ministry of Internal Affairs and Communications (MIC) website.

For the ATWINC15x0-MR210PB module, due to a limited module size, the technical conformity logo and

ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final

product in which this module is being used must have a label referring to the type certified module inside:

DS70005304C-page 47

Datasheet

ATWINC15x0

Regulatory Approval

005-101762

14.4.2 Helpful Web Sites

Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm

Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/

14.5

Korea

The ATWINC15x0-MR210PB module has received certification of conformity in accordance with the

Radio Waves Act. Integration of this module into a final product does not require additional radio

certification provided installation instructions are followed and no modifications of the module are allowed.

14.5.1 Labeling and User Information Requirements

The label on the final product which contains the ATWINC15x0-MR210PB module must follow KC

marking requirements. The integrator of the module should refer to the labeling requirements for Korea

available on the Korea Communications Commission (KCC) website.

The ATWINC15x0-MR210PB module is labeled with its own KC mark. The final product requires the KC

mark and certificate number of the module:

R-CRM-mcp-WINC1510MR210P

14.5.2 Helpful Websites

Korea Communications Commission (KCC): http://www.kcc.go.kr

National Radio Research Agency (RRA): http://rra.go.kr

14.6

Taiwan

The ATWINC1500-MR210PB and ATWINC1510-MR210PB modules have received compliance approval

in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in

their product should contact Microchip Technology sales or distribution partners to obtain a Letter of

Authority.

Integration of these modules into a final product does not require additional radio certification provided

installation instructions are followed and no modifications of the modules are allowed.

14.6.1 Labeling and User Information Requirements

For the ATWINC1500-MR210PB module, due to the limited module size, the NCC mark and ID are

displayed in the data sheet only and cannot be displayed on the module label:

DS70005304C-page 48

Datasheet

ATWINC15x0

Regulatory Approval

CCAN18LP0321T2

For the ATWINC1510-MR210PB module, due to the limited module size, the NCC mark and ID are

displayed in the data sheet only and cannot be displayed on the module label:

CCAN18LP0320T0

The user's manual should contain following warning (for RF device) in traditional Chinese:

注意 !

依據低功率電波輻射性電機管理辦法

第十二條經型式認證合格之低功率射頻電機，非經許可，

公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計

之特性及功能。

第十四條低功率射頻電機之使用不得影響飛航安全及干擾合法通信；

經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。

前項合法通信，指依電信規定作業之無線電信。

低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性

電機設備之干擾。

14.6.2 Helpful Web Sites

National Communications Commission (NCC): http://www.ncc.gov.tw

14.7

China

The ATWINC1500-MR210PB and ATWINC1510-MR210PB modules have received certification of

conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee

(SRRC) certification scheme. Integration of these modules into a final product does not require additional

radio certification, provided installation instructions are followed and no modifications of the modules are

allowed.

14.7.1 Labeling and User Information Requirements

The ATWINC1500-MR210PB module is labeled with its own CMIIT ID as follows:

CMIIT ID: 2018DJ1305

DS70005304C-page 49

Datasheet

ATWINC15x0

Regulatory Approval

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label

containing the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ1305”.

The ATWINC1510-MR210PB module is labeled with its own CMIIT ID as follows:

CMIIT ID: 2018DJ1310

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label

containing the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ1310”.

14.8

Other Regulatory Information

•

For information about other countries' jurisdictions not covered here, refer to http://

www.microchip.com/design-centers/wireless-connectivity/certifications

•

Should other regulatory jurisdiction certification be required by the customer, or the customer needs

to recertify the module for other reasons, contact Microchip for the required utilities and

documentation

DS70005304C-page 50

Datasheet

ATWINC15x0

Reference Documentation and Support

15.

Reference Documentation and Support

15.1

Reference Documents

The following table provides the set of collateral documents to ease integration and device ramp.

Table 15-1.ꢀReference Documents

Title

Content

ATWINC1500 MU Device

Datasheet

Datasheet for the ATWINC1500 SmartConnect Wi-Fi component.

For more details, contact a Microchip sales representative.

Platform Getting Started Guide

Details on how to evaluate the WINC15X0 Network Controller

Module.

Flash Memory Download

Procedure

Details the download procedures of firmware, root certificate, gain

table values, etc.

ATWINC1500 Wi-Fi Network

Controller Software Design Guide

Integration guide with a clear description of High-level Arch, an

overview on how to write a networking application, list all APIs,

parameters, and structures.

Features of the device, SPI/handshake protocol between device

and host MCU, with flow/sequence/state diagram, and timing.

Software Programming Guide

(ATWINC15x0)

Details the flow chart and how to use each API to implement all

generic use cases (for example, start AP, start STA, provisioning,

UDP, TCP, HTTP, TLS, p2p, errors management, connection/

transfer recovery mechanism/state diagram) - usage and sample

application note.

Note:ꢀ A Design Files Package is available under NDA. For more details, contact a Microchip sales

representative.

For a complete listing of development-support tools and documentation, visit www.microchip.com, or refer

to the customer support section on options to locate the nearest Microchip field representative.

DS70005304C-page 51

Datasheet

ATWINC15x0

Document Revision History

16.

Document Revision History

Note:ꢀ The datasheet revision is independent of the die revision (Revision bit in the Device Identification

register of the Device Service Unit, DSU.DID.REVISION) and the device variant (last letter of the ordering

number).

Rev C - 09/2018

Section

Changes

Features

Added Enterprise security feature and related note.

Updated Table 1-1.

Ordering Information and Module Marking

Pin Description

Updated Table 3-1.

SPI Timing

Added note for Table 7-3.

Editorial updates.

Schematic Design Information

Module Assembly Considerations

Reflow Profile Information

Editorial updates.

•

Removed Solder Paste.

Removed Stencil Design.

Editorial updates.

Regulatory Approvals

Updated the content of certifications to include the

details of ATWINC1510-MR210UB module.

Rev B - 12/2017

Section

Changes

Introduction

Editorial updates.

Features

Editorial updates.

Regulatory Approvals

Reference Documents

Revised the content of certifications.

Updated Table 15-1.

Rev A - 02/2017

Section

Changes

Document

•

Change of document style.

Change the name to incorporate all the

ATWINC15x0-MR210xB module family.

•

New Microchip document number. Previous

version was Atmel document 42502 rev. B.

DS70005304C-page 52

Datasheet

ATWINC15x0

Document Revision History

Section

Changes

Product Description

•

Added description information indicating that

the document content is relevant to all

WINC1500 Module models unless noted.

•

Changed SSL references to TLS.

Removed WAPI security.

Removed UART as host interface.

Editorial updates.

Product Features

•

Removed WAPI security.

Removed UART and I²C as host interfaces.

Removed Bluetooth coexistance interface.

Replaced SSL with TLS.

Added 26 MHz crystal.

Removed: (4KB flash – less than 1KB RAM).

Order Information and Module Marking

•

Revised Ordering table.

Revised Marking information. Figure.

Block Diagram

Pin Description

•

Revised Block Diagram figure.

•

Revised Pin Description drawing.

Editorial updates.

Electrical Specifications

•

Revised VDDIO maximum voltage in table

4.1 and added max temperatures.

Revised table 4-2 to include Recommended

operating temperature.

CPU and Memory Subsystems

WLAN Subsystem RADIO

•

Editorial update.

Added text regarding performance derating

at cold temperature.

•

Features table revisions and changes:

–

Corrected the package height

Revised Storage temperature

•

Added performance test conditions to the

performance tables.

Revised the Receive performance in table

6-2.

Revised the 802.11b mode Transmit

performance numbers in table 6-3.

•

Revised Transmit performance Footnotes.

Changed max frequency to 2.472GHz.

Editorial updates.

DS70005304C-page 53

Datasheet

ATWINC15x0

Document Revision History

Section

Changes

External Interfaces

•

Revised SPI timing information in table 7-3.

Removed Bluetooth Coexistance section.

Removed SDIO.

Editorial updates.

Power Consumption

•

Added Module Reset section for reset

duration.

•

Editorial updates.

12.1 ATWINC15x0-MR210PB Placement and

Routing Guidelines

Added text for antenna types used in test

and an associated table.

•

Revised Co-Ax connector type.

Schematic Design Information

Module Drawings

•

Removed SDIO schematic.

Editorial updates.

•

Updated module drawing figures and figure

titles.

•

Added section with footprint drawing.

Design Considerations

Added sections for Module design and

assembly considerations, and module PCB

placement.

Reflow Profile Information

Certification Notices

•

Revised reflow profile picture to be clearer.

Editorial updates.

•

Added section for Agency Certification

notices (now under Regulatory Approvals

with Rev. B).

Agency Regulatory Approvals

Reference Documents

•

Added back Agency Approval section.

Revised content of certifications.

•

Moved Design File Package to a separate

paragraph below the table to remove web

availability aspect and to contact sales.

Rev B - 02/2016

Document

•

Updated footers.

Module Outline Drawing

•

Revised Module outline drawings to show

Ground pad to be soldered.

Pulled out Footprint drawing as this is

covered in the Module drawing.

DS70005304C-page 54

Datasheet

ATWINC15x0

Document Revision History

WLAN Subsystem Radio

Power Consumption

•

Revised Transmit Performance Table 6-3.

Revised current table references in Table

8-1.

Schematic Design Information

Reflow Profile Information

Reference Documents

•

Updated Schematics Section 11 text and

figures Figure 11-1 and Figure 11-2.

Revised section 12 Reflow Profile

Information.

Updated Document Reference table to

include the ATWINC1500-MU datasheet.

Rev A - 07/2015

Document

Updated due to changes in the ATWINC1500 from

Rev A to Rev B.

Description

•

Updated model revisions to rev B.

Corrected Package dimensions.

Features

•

Added Hardware Accelerator content to

features list.

Pinout Information

•

Updated reference schematic.

New pin list adds GPIO's 3,4,5 and 6.

CPU and Memory Subsystems

External Interfaces

•

Increased Memory from 182KB to 160KB.

Improved and corrected description of

Coexistence interface.

•

Editorial updates.

Power Consumption

Updated power numbers and description,

added high-power and low-power modes.

WLAN Subsystem Radio

•

Updated Performance numbers.

DS70005304C-page 55

Datasheet

ATWINC15x0

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as

a means to make files and information easily available to customers. Accessible by using your favorite

Internet browser, the web site contains the following information:

•

Product Support – Data sheets and errata, application notes and sample programs, design

resources, user’s guides and hardware support documents, latest software releases and archived

software

•

General Technical Support – Frequently Asked Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant program member listing

Business of Microchip – Product selector and ordering guides, latest Microchip press releases,

listing of seminars and events, listings of Microchip sales offices, distributors and factory

representatives

Customer Change Notification Service

Microchip’s customer notification service helps keep customers current on Microchip products.

Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata

related to a specified product family or development tool of interest.

To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on

“Customer Change Notification” and follow the registration instructions.

Customer Support

Users of Microchip products can receive assistance through several channels:

•

Distributor or Representative

Local Sales Office

Field Application Engineer (FAE)

Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.

Local sales offices are also available to help customers. A listing of sales offices and locations is included

in the back of this document.

Technical support is available through the web site at: http://www.microchip.com/support

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the

market today, when used in the intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of

these methods, to our knowledge, require using the Microchip products in a manner outside the

operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is

engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

DS70005304C-page 56

Datasheet

ATWINC15x0

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the

code protection features of our products. Attempts to break Microchip’s code protection feature may be a

violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software

or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice

Information contained in this publication regarding device applications and the like is provided only for

your convenience and may be superseded by updates. It is your responsibility to ensure that your

application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY

OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS

CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life

support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,

indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting

from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual

property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud,

chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,

Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST,

SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight

Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,

CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM,

dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming,

ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,

motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient

Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,

Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are

trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

DS70005304C-page 57

Datasheet

ATWINC15x0

©

ISBN: 978-1-5224-3491-7

Quality Management System Certified by DNV

ISO/TS 16949

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer

fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures are for its PIC^®MCUs and dsPIC^®

DSCs, KEELOQ^®code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design and manufacture of development

systems is ISO 9001:2000 certified.

DS70005304C-page 58

Datasheet

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

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Technical Support:

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support

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Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Padova

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Tel: 86-27-5980-5300

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Tel: 248-848-4000

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Fax: 31-416-690340

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Tel: 86-29-8833-7252

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China - Zhuhai

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Fax: 317-773-5453

Tel: 317-536-2380

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Tel: 86-756-3210040

Poland - Warsaw

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Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

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Tel: 951-273-7800

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Sweden - Gothenberg

Tel: 46-31-704-60-40

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 919-844-7510

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Tel: 408-436-4270

Canada - Toronto

Tel: 905-695-1980

Fax: 905-695-2078

Tel: 44-118-921-5800

Fax: 44-118-921-5820

DS70005304C-page 59

Datasheet


型号：	ATWINC1510-MR210UB
厂家：	MICROCHIP
描述：	RF TXRX MODULE WIFI U.FL ANT 外围集成电路
文件：	总59页 (文件大小：1030K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ATWINC1510-MR210UB [MICROCHIP]

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