DSPIC30F3011-20I/ML_技术文档

dsPIC30F3010/3011

Data Sheet

High-Performance, 16-Bit

Digital Signal Controllers

DS70141E

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

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Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

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Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, rfPIC and SmartShunt are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

FilterLab, Linear Active Thermistor, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, In-Circuit Serial

Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,

32

PICDEM.net, PICtail, PIC logo, PowerCal, PowerInfo,

PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS70141E-page ii

dsPIC30F3010/3011

High Performance, 16-Bit Digital Signal Controllers

Peripheral Features:

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

• High-Current Sink/Source I/O Pins: 25 mA/25 mA

• Timer module with Programmable Prescaler:

- Five 16-bit timers/counters; optionally pair

16-bit timers into 32-bit timer modules

• 16-Bit Capture Input Functions

• 16-Bit Compare/PWM Output Functions

• 3-Wire SPI modules (supports 4 Frame modes)

• I²C^TMmodule Supports Multi-Master/Slave mode

and 7-Bit/10-Bit Addressing

• 2 UART modules with FIFO Buffers

High-Performance Modified RISC CPU:

Motor Control PWM Module Features:

• Modified Harvard Architecture

• C Compiler Optimized Instruction Set Architecture

with Flexible Addressing modes

• 6 PWM Output Channels

- Complementary or Independent Output

modes

• 83 Base Instructions

• 24-Bit Wide Instructions, 16-Bit Wide Data Path

- Edge and Center-Aligned modes

• 3 Duty Cycle Generators

• 24 Kbytes On-Chip Flash Program Space

(8K instruction words)

• Dedicated Time Base

• 1 Kbyte of On-Chip Data RAM

• 1 Kbyte of Nonvolatile Data EEPROM

• 16 x 16-Bit Working Register Array

• Up to 30 MIPs Operation:

• Programmable Output Polarity

• Dead-Time Control for Complementary mode

• Manual Output Control

• Trigger for A/D Conversions

- DC to 40 MHz external clock input

- 4 MHz-10 MHz oscillator input with

PLL active (4x, 8x, 16x)

Quadrature Encoder Interface Module

Features:

• 29 Interrupt Sources

• Phase A, Phase B and Index Pulse Input

• 16-Bit Up/Down Position Counter

- 3 external interrupt sources

- 8 user-selectable priority levels for each

interrupt source

• Count Direction Status

- 4 processor trap sources

• Position Measurement (x2 and x4) mode

• Programmable Digital Noise Filters on Inputs

• Alternate 16-Bit Timer/Counter mode

• Interrupt on Position Counter Rollover/Underflow

DSP Engine Features:

• Dual Data Fetch

• Accumulator Write Back for DSP Operations

• Modulo and Bit-Reversed Addressing modes

Analog Features:

• Two, 40-Bit Wide Accumulators with Optional

saturation Logic

• 10-Bit Analog-to-Digital Converter (ADC) with

4 S/H Inputs:

• 17-Bit x 17-Bit Single-Cycle Hardware Fractional/

Integer Multiplier

- 1 Msps conversion rate

- 9 input channels

• All DSP Instructions Single Cycle

• ±16-Bit Single-Cycle Shift

- Conversion available during Sleep and Idle

• Programmable Brown-out Reset

DS70141E-page 1

dsPIC30F3010/3011

Special Microcontroller Features:

CMOS Technology:

• Enhanced Flash Program Memory:

• Low-Power, High-Speed Flash Technology

• Wide Operating Voltage Range (2.5V to 5.5V)

• Industrial and Extended Temperature Ranges

• Low Power Consumption

- 10,000 erase/write cycle (min.) for

industrial temperature range, 100K (typical)

• Data EEPROM Memory:

- 100,000 erase/write cycle (min.) for

industrial temperature range, 1M (typical)

• Self-Reprogrammable under Software Control

• Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST)

• Flexible Watchdog Timer (WDT) with On-Chip

Low-Power RC Oscillator for Reliable Operation

• Fail-Safe Clock Monitor Operation Detects Clock

Failure and Switches to On-Chip Low-Power RC

Oscillator

• Programmable Code Protection

• In-Circuit Serial Programming™ (ICSP™)

• Selectable Power Management modes:

- Sleep, Idle and Alternate Clock modes

dsPIC30F Motor Control and Power Conversion Family

Program

Pins Mem. Bytes/

Instructions

Output

Comp/Std Control

PWM

Motor

SRAM EEPROM Timer Input

A/D 10-Bit Quad

Device

Bytes

16-Bit Cap

1 Msps

Enc

PWM

dsPIC30F3010

28

24K/8K

1024

5

4

2

4

6 ch

9 ch

Yes

1

2

1

dsPIC30F3011 40/44

DS70141E-page 2

dsPIC30F3010/3011

Pin Diagrams

40-Pin PDIP

MCLR

AVDD

AVSS

PWM1L/RE0

PWM1H/RE1

1

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

AN7/RB7

2

3

4

5

PWM2L/RE2

6

PWM2H/RE3

7

PWM3L/RE4

8

PWM3H/RE5

9

VDD

10

11

12

13

14

15

16

17

18

19

20

AN8/RB8

VSS

VDD

VSS

RF0

RF1

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

FLTA/INT0/RE8

U2RX/CN17/RF4

U2TX/CN18/RF5

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

SCK1/RF6

EMUD2/OC2/IC2/INT2/RD1

EMUC2/OC1/IC1/INT1/RD0

OC3/RD2

VDD

OC4/RD3

VSS

44-Pin TQFP

NC

PGC/EMUC/U1RX/SDI1/SDA/RF2

33

32

31

30

29

28

27

26

25

24

23

1

2

3

4

5

6

7

8

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

U2TX/CN18/RF5

U2RX/CN17/RF4

RF1

OSC2/CLKO/RC15

OSC1/CLKI

VSS

VDD

AN8/RB8

RF0

VSS

VDD

dsPIC30F3011

AN7/RB7

PWM3H/RE5

PWM3L/RE4

PWM2H/RE3

PWM2L/RE2

AN6/OCFA/RB6

AN5/QEB/IC8/CN7/RB5

AN4/QEA/IC7/CN6/RB4

9

10

11

DS70141E-page 3

dsPIC30F3010/3011

Pin Diagrams (Continued)

44-Pin QFN

1

2

3

4

5

6

7

8

9

33

32

31

30

29

28

27

26

25

24

23

OSC2/CLKO/RC15

OSC1/CLKI

VSS

PGC/EMUC/U1RX/SDI1/SDA/RF2

U2TX/CN18/RF5

U2RX/CN17/RF4

RF1

VSS

VDD

AN8/RB8

AN7/RB7

AN6/OCFA/RB6

AN5/QEB/IC8/CN7/RB5

AN4/QEA/IC7/CN6/RB4

RF0

VSS

VDD

dsPIC30F3011

PWM3H/RE5

PWM3L/RE4

PWM2H/RE3

10

11

DS70141E-page 4

dsPIC30F3010/3011

Pin Diagrams (Continued)

28-Pin SPDIP

28-Pin SOIC

MCLR

1

2

3

4

5

28

27

26

25

24

AVDD

AVSS

PWM1L/RE0

PWM1H/RE1

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

PWM2L/RE2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

VSS

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

6

7

8

23

22

21

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

VDD

VSS

9

20

19

18

17

16

15

10

11

12

13

14

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

FLTA/INT0/SCK1/OCFA/RE8

EMUC2/OC1/IC1/INT1/RD0

EMUD2/OC2/IC2/INT2/RD1

44-Pin QFN

1

2

3

4

5

6

7

8

9

33

32

31

30

29

28

27

26

25

24

23

OSC2/CLKO/RC15

OSC1/CLKI

VSS

PGC/EMUC/U1RX/SDI1/SDA/RF2

NC

VSS

VDD

NC

dsPIC30F3010

VDD

NC

PWM3H/RE5

PWM3L/RE4

PWM2H/RE3

10

11

AN5/QEB/IC8/CN7/RB5

AN4/QEA/IC7/CN6/RB4

DS70141E-page 5

dsPIC30F3010/3011

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 7

2.0 CPU Architecture Overview........................................................................................................................................................ 15

3.0 Memory Organization................................................................................................................................................................. 23

4.0 Address Generator Units............................................................................................................................................................ 35

5.0 Interrupts .................................................................................................................................................................................... 41

6.0 Flash Program Memory.............................................................................................................................................................. 47

7.0 Data EEPROM Memory ............................................................................................................................................................. 53

8.0 I/O Ports ..................................................................................................................................................................................... 59

9.0 Timer1 Module ........................................................................................................................................................................... 65

10.0 Timer2/3 Module ........................................................................................................................................................................ 69

11.0 Timer4/5 Module ....................................................................................................................................................................... 75

12.0 Input Capture Module................................................................................................................................................................. 79

13.0 Output Compare Module ............................................................................................................................................................ 83

14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 87

15.0 Motor Control PWM Module....................................................................................................................................................... 93

16.0 SPI Module............................................................................................................................................................................... 105

17.0 I2C™ Module ........................................................................................................................................................................... 109

18.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 117

19.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 125

20.0 System Integration ................................................................................................................................................................... 137

21.0 Instruction Set Summary.......................................................................................................................................................... 151

22.0 Development Support............................................................................................................................................................... 159

23.0 Electrical Characteristics .......................................................................................................................................................... 163

24.0 Packaging Information.............................................................................................................................................................. 201

Index ................................................................................................................................................................................................. 215

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DS70141E-page 6

dsPIC30F3010/3011

1.0

DEVICE OVERVIEW

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

This document contains device-specific information for

the dsPIC30F3010/3011 device. The dsPIC30F

devices contain extensive Digital Signal Processor

(DSP) functionality within a high-performance 16-bit

microcontroller (MCU) architecture. Figure 1-1 and

Figure 1-2 show device block diagrams for the

dsPIC30F3011 and dsPIC30F3010 devices.

DS70141E-page 7

dsPIC30F3010/3011

FIGURE 1-1:

dsPIC30F3011 BLOCK DIAGRAM

Y Data Bus

X Data Bus

16

Data Latch

Interrupt

Controller

PSV & Table

Data Access

Control Block

Y Data

RAM

(4 Kbytes)

Address

Latch

X Data

RAM

(4 Kbytes)

Address

Latch

8

16

24

16 16

X RAGU

X WAGU

16

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

Y AGU

PCH PCL

PCU

Program Counter

Stack

Control

Logic

Loop

Control

Logic

Address Latch

Program Memory

(24 Kbytes)

AN7/RB7

AN8/RB8

Data EEPROM

(1 Kbyte)

Effective Address

16

Data Latch

PORTB

ROM Latch

24

IR

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

OSC2/CLKO/RC15

16

16 x 16

PORTC

W Reg Array

Decode

Instruction

Decode and

Control

16 16

Control Signals

to Various Blocks

DSP

Engine

Divide

Unit

Power-up

Timer

EMUC2/OC1/IC1/INT1/RD0

EMUD2/OC2/IC2/INT2/RD1

OC3/RD2

Timing

OSC1/CLKI

Generation

Oscillator

Start-up Timer

OC4/RD3

ALU<16>

16

PORTD

POR/BOR

Reset

16

MCLR

Watchdog

Timer

VDD, VSS

AVDD, AVSS

Input

Capture

Module

Output

Compare

Module

2

I C™

10-Bit ADC

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

FLTA/INT0/RE8

UART1,

UART2

Motor Control

PWM

SPI

Timers

QEI

PORTE

RF0

RF1

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

U2RX/CN17/RF4

U2TX/CN18/RF5

SCK1/RF6

PORTF

DS70141E-page 8

dsPIC30F3010/3011

FIGURE 1-2:

dsPIC30F3010 BLOCK DIAGRAM

Y Data Bus

X Data Bus

16

Data Latch

Interrupt

Controller

PSV & Table

Data Access

Control Block

Y Data

RAM

(4 Kbytes)

Address

Latch

X Data

RAM

(4 Kbytes)

Address

Latch

8

16

24

16 16

X RAGU

X WAGU

16

Y AGU

PCH PCL

PCU

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

Program Counter

Loop

Control

Logic

Stack

Control

Logic

Address Latch

Program Memory

(24 Kbytes)

Data EEPROM

(1 Kbyte)

PORTB

Effective Address

16

Data Latch

ROM Latch

24

IR

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

OSC2/CLKO/RC15

16

16 x 16

W Reg Array

PORTC

Decode

Instruction

Decode and

Control

16 16

Control Signals

to Various Blocks

DSP

Engine

Divide

Unit

Power-up

Timer

EMUC2/OC1/IC1/INT1/RD0

EMUD2/OC2/IC2/INT2/RD1

Timing

Generation

OSC1/CLKI

Oscillator

Start-up Timer

PORTD

ALU<16>

16

POR/BOR

Reset

16

MCLR

Watchdog

Timer

VDD, VSS

AVDD, AVSS

Input

Capture

Module

Output

Compare

Module

2

I C™

10-Bit ADC

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

Motor Control

PWM

FLTA/INT0/SCK1/OCFA/RE8

SPI

Timers

QEI

UART

PORTE

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

PORTF

DS70141E-page 9

dsPIC30F3010/3011

Table 1-1 provides a brief description of the device I/O

pinout and the functions that are multiplexed to a port

pin. Multiple functions may exist on one port pin. When

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-1:

Pin Name

AN0-AN8

dsPIC30F3011 I/O PIN DESCRIPTIONS

Type

Buffer

Type

Description

I

Analog Analog input channels.

AN0 and AN1 are also used for device programming data and clock inputs,

respectively.

AVDD

AVSS

P

Positive supply for analog module.

Ground reference for analog module.

CLKI

I

ST/CMOS External clock source input. Always associated with OSC1 pin function.

CLKO

O

—

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7

I

ST

Input change notification inputs.

CN17-CN18

Can be software programmed for internal weak pull-ups on all inputs.

EMUD

EMUC

I/O

ST

ICD Primary Communication Channel data input/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel clock input/output pin.

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

IC1, IC2, IC7,

IC8

I

ST

Capture inputs 1, 2, 7 and 8.

INDX

QEA

I

ST

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

QEB

I

ST

INT0

INT1

INT2

I

ST

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

I

ST

—

PWM Fault A input.

PWM 1 Low output.

PWM 1 High output.

PWM 2 Low output.

PWM 2 High output.

PWM 3 Low output.

PWM 3 High output.

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

O

MCLR

I/P

ST

Master Clear (Reset) input or programming voltage input. This pin is an active

low Reset to the device.

OCFA

OC1-OC4

I

O

ST

—

Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 through 4.

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

ST

I

=

Schmitt Trigger input with CMOS levels

Input

O

P

=

Output

Power

DS70141E-page 10

dsPIC30F3010/3011

TABLE 1-1:

Pin Name

dsPIC30F3011 I/O PIN DESCRIPTIONS (CONTINUED)

Buffer

Type

Description

Type

OSC1

OSC2

I

ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS

I/O

—

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC

I/O

I

ST

In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB8

I/O

ST

PORTB is a bidirectional I/O port.

PORTC is a bidirectional I/O port.

PORTD is a bidirectional I/O port.

PORTE is a bidirectional I/O port.

RC13-RC15

RD0-RD3

RE0-RE5,

RE8

RF0-RF6

I/O

ST

PORTF is a bidirectional I/O port.

SCK1

SDI1

SDO1

SS1

I/O

ST

—

Synchronous serial clock input/output for SPI #1.

SPI #1 Data In.

SPI #1 Data Out.

I

O

I

ST

SPI #1 Slave Synchronization.

SCL

SDA

I/O

ST

Synchronous serial clock input/output for I²C™.

Synchronous serial data input/output for I²C.

SOSCO

SOSCI

O

I

—

32 kHz low-power oscillator crystal output.

ST/CMOS 32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherwise.

T1CK

T2CK

I

ST

Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

U2RX

U2TX

I

O

I

O

I

ST

—

ST

—

ST

—

UART1 Receive.

UART1 Transmit.

UART1 Alternate Receive.

UART1 Alternate Transmit.

UART2 Receive.

O

UART2 Transmit.

VDD

P

I

—

Positive supply for logic and I/O pins.

Ground reference for logic and I/O pins.

VSS

VREF+

VREF-

Analog Analog Voltage Reference (High) input.

Analog Analog Voltage Reference (Low) input.

I

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

ST

I

=

Schmitt Trigger input with CMOS levels

Input

O

P

=

Output

Power

DS70141E-page 11

dsPIC30F3010/3011

Table 1-2 provides a brief description of the device I/O

pinout and the functions that are multiplexed to a port

pin. Multiple functions may exist on one port pin. When

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-2:

Pin Name

AN0-AN5

dsPIC30F3010 I/O PIN DESCRIPTIONS

Type

Buffer

Type

Description

I

Analog Analog input channels.

AN0 and AN1 are also used for device programming data and clock inputs,

respectively.

AVDD

AVSS

P

Positive supply for analog module.

Ground reference for analog module.

CLKI

I

ST/CMOS External clock source input. Always associated with OSC1 pin function.

CLKO

O

—

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7

I

ST

Input change notification inputs.

Can be software programmed for internal weak pull-ups on all inputs.

EMUD

EMUC

I/O

ST

ICD Primary Communication Channel data input/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel clock input/output pin.

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

IC1, IC2, IC7,

IC8

I

ST

Capture inputs 1, 2, 7 and 8.

INDX

QEA

I

ST

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

QEB

I

ST

INT0

INT1

INT2

I

ST

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

I

ST

—

PWM Fault A input.

PWM 1 Low output.

PWM 1 High output.

PWM 2 Low output.

PWM 2 High output.

PWM 3 Low output.

PWM 3 High output.

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

O

MCLR

I/P

ST

Master Clear (Reset) input or programming voltage input. This pin is an active

low Reset to the device.

OCFA

OC1, OC2

I

O

ST

—

Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 and 2.

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

ST

I

=

Schmitt Trigger input with CMOS levels

Input

O

P

=

Output

Power

DS70141E-page 12

dsPIC30F3010/3011

TABLE 1-2:

Pin Name

dsPIC30F3010 I/O PIN DESCRIPTIONS (CONTINUED)

Buffer

Type

Description

Type

OSC1

OSC2

I

ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS

I/O

—

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC

I/O

I

ST

In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB5

I/O

8I/O

I/O

ST

8ST

ST

PORTB is a bidirectional I/O port.

PORTC is a bidirectional I/O port.

PORTD is a bidirectional I/O port.

PORTE is a bidirectional I/O port.

RC13-RC15

RD0-RD1

RE0-RE5,

RE8

I/O

ST

RF2-RF3

I/O

ST

PORTF is a bidirectional I/O port.

SCK1

SDI1

SDO1

I/O

I

O

ST

—

Synchronous serial clock input/output for SPI #1.

SPI #1 Data In.

SPI #1 Data Out.

SCL

SDA

I/O

ST

Synchronous serial clock input/output for I²C™.

Synchronous serial data input/output for I²C.

SOSCO

SOSCI

O

I

—

32 kHz low-power oscillator crystal output.

ST/CMOS 32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherwise.

T1CK

T2CK

I

ST

Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

I

O

I

ST

—

ST

—

UART1 Receive.

UART1 Transmit.

UART1 Alternate Receive.

UART1 Alternate Transmit.

O

VDD

P

I

—

Positive supply for logic and I/O pins.

Ground reference for logic and I/O pins.

VSS

VREF+

VREF-

Analog Analog Voltage Reference (High) input.

Analog Analog Voltage Reference (Low) input.

I

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

ST

I

=

Schmitt Trigger input with CMOS levels

Input

O

P

=

Output

Power

DS70141E-page 13

dsPIC30F3010/3011

NOTES:

DS70141E-page 14

dsPIC30F3010/3011

• Linear indirect access of 32K word pages within

program space is also possible using any working

register, via table read and write instructions.

Table read and write instructions can be used to

access all 24 bits of an instruction word.

2.0

CPU ARCHITECTURE

OVERVIEW

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

Overhead-free circular buffers (Modulo Addressing)

are supported in both X and Y address spaces. This is

primarily intended to remove the loop overhead for

DSP algorithms.

The X AGU also supports Bit-Reversed Addressing on

destination effective addresses, to greatly simplify input

or output data reordering for radix-2 FFT algorithms.

Refer to Section 4.0 “Address Generator Units” for

details on Modulo and Bit-Reversed addressing.

The core supports Inherent (no operand), Relative, Lit-

eral, Memory Direct, Register Direct, Register Indirect,

Register Offset and Literal Offset Addressing modes.

Instructions are associated with predefined addressing

modes, depending upon their functional requirements.

2.1

Core Overview

The core has a 24-bit instruction word. The Program

Counter (PC) is 23 bits wide with the Least Significant

bit (LSb) always clear (see Section 3.1 “Program

Address Space”), and the Most Significant bit (MSb)

is ignored during normal program execution, except for

certain specialized instructions. Thus, the PC can

address up to 4M instruction words of user program

space. An instruction prefetch mechanism is used to

help maintain throughput. Program loop constructs,

free from loop count management overhead, are sup-

ported using the DOand REPEAT instructions, both of

which are interruptible at any point.

For most instructions, the core is capable of executing

a data (or program data) memory read, a working reg-

ister (data) read, a data memory write and a program

(instruction) memory read per instruction cycle. As a

result, 3 operand instructions are supported, allowing

C = A + B operations to be executed in a single cycle.

A DSP engine has been included to significantly

enhance the core arithmetic capability and throughput.

It features a high-speed 17-bit by 17-bit multiplier, a

40-bit ALU, two 40-bit saturating accumulators and a

40-bit bidirectional barrel shifter. Data in the accumula-

tor or any working register can be shifted up to 16 bits

right or 16 bits left in a single cycle. The DSP instruc-

tions operate seamlessly with all other instructions and

have been designed for optimal real-time performance.

The MAC class of instructions can concurrently fetch

two data operands from memory, while multiplying two

W registers. To enable this concurrent fetching of data

operands, the data space has been split for these

instructions and linear for all others. This has been

achieved in a transparent and flexible manner, by

dedicating certain working registers to each address

space for the MAC class of instructions.

The working register array consists of 16x16-bit regis-

ters, each of which can act as data, address or offset

registers. One working register (W15) operates as a

Software Stack Pointer (SP) for interrupts and calls.

The data space is 64 Kbytes (32K words) and is split into

two blocks, referred to as X and Y data memory. Each

block has its own independent Address Generation Unit

(AGU). Most instructions operate solely through the X

memory AGU, which provides the appearance of a

single unified data space. The Multiply-Accumulate

(MAC) class of dual source DSP instructions operate

through both the X and Y AGUs, splitting the data

address space into two parts (see Section 3.2 “Data

Address Space”). The X and Y data space boundary is

device specific and cannot be altered by the user. Each

data word consists of 2 bytes, and most instructions can

address data either as words or bytes.

The core does not support a multi-stage instruction

pipeline. However, a single stage instruction prefetch

mechanism is used, which accesses and partially

decodes instructions a cycle ahead of execution, in

order to maximize available execution time. Most

instructions execute in a single cycle, with certain

exceptions.

There are two methods of accessing data stored in

program memory:

• The upper 32 Kbytes of data space memory can

be mapped into the lower half (user space) of pro-

gram space at any 16K program word boundary,

defined by the 8-bit Program Space Visibility Page

(PSVPAG) register. This lets any instruction

access program space as if it were data space,

with a limitation that the access requires an addi-

tional cycle. Moreover, only the lower 16 bits of

each instruction word can be accessed using this

method.

The core features a vectored exception processing

structure for traps and interrupts, with 62 independent

vectors. The exceptions consist of up to 8 traps (of

which 4 are reserved) and 54 interrupts. Each interrupt

is prioritized based on a user assigned priority between

1 and 7 (1 being the lowest priority and 7 being the

highest) in conjunction with a predetermined ‘natural

order’. Traps have fixed priorities, ranging from 8 to 15.

DS70141E-page 15

dsPIC30F3010/3011

2.2.1

SOFTWARE STACK POINTER/

FRAME POINTER

2.2

Programmer’s Model

The programmer’s model is shown in Figure 2-1 and

consists of 16x16-bit working registers (W0 through

W15), 2x40-bit accumulators (ACCA and ACCB),

STATUS Register (SR), Data Table Page register

(TBLPAG), Program Space Visibility Page register

(PSVPAG), DO and REPEAT registers (DOSTART,

DOEND, DCOUNT and RCOUNT) and Program Coun-

ter (PC). The working registers can act as Data,

Address or Offset registers. All registers are memory

mapped. W0 acts as the W register for file register

addressing.

The dsPIC^®DSC devices contain a software stack.

W15 is the dedicated Software Stack Pointer, and will

be automatically modified by exception processing and

subroutine calls and returns. However, W15 can be ref-

erenced by any instruction in the same manner as all

other W registers. This simplifies the reading, writing

and manipulation of the Stack Pointer (e.g., creating

stack frames).

Note:

In order to protect against misaligned

stack accesses, W15<0> is always clear.

Some of these registers have a Shadow register asso-

ciated with each of them, as shown in Figure 2-1. The

Shadow register is used as a temporary holding regis-

ter and can transfer its contents to or from its host reg-

ister upon the occurrence of an event. None of the

Shadow registers are accessible directly. The following

rules apply for transfer of registers into and out of

shadows.

W15 is initialized to 0x0800 during a Reset. The user

may reprogram the SP during initialization to any

location within data space.

W14 has been dedicated as a Stack Frame Pointer as

defined by the LNK and ULNK instructions. However,

W14 can be referenced by any instruction in the same

manner as all other W registers.

• PUSH.Sand POP.S

W0, W1, W2, W3, SR (DC, N, OV, Z and C bits

only) are transferred.

2.2.2

STATUS REGISTER

The dsPIC DSC core has a 16-bit STATUS Register

(SR), the LSB of which is referred to as the SR Low

Byte (SRL) and the MSB as the SR High Byte (SRH).

See Figure 2-1 for SR layout.

• DOinstruction

DOSTART, DOEND, DCOUNT shadows are

pushed on loop start, and popped on loop end.

SRL contains all the MCU ALU operation status flags

(including the Z bit), as well as the CPU Interrupt Prior-

ity Level status bits, IPL<2:0>, and the Repeat Active

status bit, RA. During exception processing, SRL is

concatenated with the MSB of the PC to form a

complete word value which is then stacked.

When a byte operation is performed on a working reg-

ister, only the Least Significant Byte (LSB) of the target

register is affected. However, a benefit of memory

mapped working registers is that both the Least and

Most Significant Bytes can be manipulated through

byte-wide data memory space accesses.

The upper byte of the SR register contains the DSP

adder/subtracter status bits, the DO Loop Active bit

(DA) and the Digit Carry (DC) status bit.

2.2.3

PROGRAM COUNTER

The Program Counter is 23 bits wide. Bit 0 is always

clear. Therefore, the PC can address up to 4M

instruction words.

DS70141E-page 16

dsPIC30F3010/3011

FIGURE 2-1:

PROGRAMMER’S MODEL

D15

D0

W0/WREG

W1

PUSH.SShadow

DOShadow

W2

W3

Legend

W4

DSP Operand

Registers

W5

W6

W7

Working Registers

W8

W9

DSP Address

Registers

W10

W11

W12/DSP Offset

W13/DSP Write Back

W14/Frame Pointer

W15/Stack Pointer

SPLIM

Stack Pointer Limit Register

AD0

AD15

AD39

AD31

DSP

Accumulators

ACCA

ACCB

PC22

PC0

0

Program Counter

0

7

T

A

B

P

A

G

TBLPAG

Data Table Page Address

0

7

PS

V

PA

G

PSVPAG

Program Space Visibility Page Address

15

0

RCOUNT

DCOUNT

REPEATLoop Counter

DOLoop Counter

22

0

DOSTART

DOEND

DOLoop Start Address

DOLoop End Address

22

15

0

Core Configuration Register

CORCON

IPL0 RA

OA OB

SA SB OAB SAB DA DC

SRH

N

OV

Z

C

IPL2 IPL1

STATUS Register

SRL

DS70141E-page 17

dsPIC30F3010/3011

The divide instructions must be executed within a

REPEATloop. Any other form of execution (e.g. a series

of discrete divide instructions) will not function correctly

because the instruction flow depends on RCOUNT. The

divide instruction does not automatically set up the

RCOUNT value, and it must, therefore, be explicitly and

correctly specified in the REPEATinstruction, as shown

in Table 2-1 (REPEATwill execute the target instruction

{operand value + 1} times). The REPEAT loop count

must be set up for 18 iterations of the DIV/DIVFinstruc-

tion. Thus, a complete divide operation requires

19 cycles.

2.3

Divide Support

The dsPIC DSC devices feature a 16/16-bit signed

fractional divide operation, as well as 32/16-bit and 16/

16-bit signed and unsigned integer divide operations, in

the form of single instruction iterative divides. The

following instructions and data sizes are supported:

1. DIVF– 16/16 signed fractional divide

2. DIV.sd– 32/16 signed divide

3. DIV.ud– 32/16 unsigned divide

4. DIV.sw– 16/16 signed divide

5. DIV.uw– 16/16 unsigned divide

Note:

The divide flow is interruptible. However,

the user needs to save the context as

appropriate.

TABLE 2-1:

DIVIDE INSTRUCTIONS

Instruction

Function

DIVF

Signed fractional divide: Wm/Wn → W0; Rem → W1

Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

Signed divide: Wm/Wn → W0; Rem → W1

DIV.sd

DIV.sw

DIV.ud

DIV.uw

Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

Unsigned divide: Wm/Wn → W0; Rem → W1

A block diagram of the DSP engine is shown in

Figure 2-2.

2.4

DSP Engine

The DSP engine consists of a high-speed 17-bit x

17-bit multiplier, a barrel shifter, and a 40-bit adder/

subtracter (with two target accumulators, round and

saturation logic).

TABLE 2-2:

DSP INSTRUCTION

SUMMARY

Instruction

Algebraic Operation

The dsPIC30F devices have a single instruction flow

which can execute either DSP or MCU instructions.

Many of the hardware resources are shared between

the DSP and MCU instructions. For example, the

instruction set has both DSP and MCU multiply

instructions which use the same hardware multiplier.

CLR

ED

A = 0

A = (x – y)²

A = A + (x – y)²

A = A + (x * y)

No change in A

A = x * y

EDAC

MAC

MOVSAC

MPY

The DSP engine also has the capability to perform

inherent accumulator-to-accumulator operations, which

require no additional data. These instructions are ADD,

SUBand NEG.

MPY.N

MSC

A = – x * y

A = A – x * y

The DSP engine has various options selected through

various bits in the CPU Core Configuration register

(CORCON), as listed below:

1. Fractional or integer DSP multiply (IF).

2. Signed or unsigned DSP multiply (US).

3. Conventional or convergent rounding (RND).

4. Automatic saturation on/off for ACCA (SATA).

5. Automatic saturation on/off for ACCB (SATB).

6. Automatic saturation on/off for writes to data

memory (SATDW).

7. Accumulator Saturation mode selection

(ACCSAT).

DS70141E-page 18

dsPIC30F3010/3011

FIGURE 2-2:

DSP ENGINE BLOCK DIAGRAM

S

a

40

16

40-Bit Accumulator A

40-Bit Accumulator B

40

t

Round

Logic

u

r

a

t

Carry/Borrow Out

Saturate

e

Adder

Carry/Borrow In

Negate

40

Barrel

Shifter

16

40

Sign-Extend

32

16

Zero Backfill

32

33

17-Bit

Multiplier/Scaler

16

To/From W Array

DS70141E-page 19

dsPIC30F3010/3011

2.4.1

MULTIPLIER

2.4.2.1

Adder/Subtracter, Overflow and

Saturation

The 17x17-bit multiplier is capable of signed or

unsigned operation and can multiplex its output using a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. Unsigned operands are zero-extended

into the 17th bit of the multiplier input value. Signed

operands are sign-extended into the 17th bit of the

multiplier input value. The output of the 17x17-bit

multiplier/scaler is a 33-bit value, which is sign-

extended to 40 bits. Integer data is inherently

represented as a signed two’s complement value,

where the MSB is defined as a sign bit. Generally

speaking, the range of an N-bit two’s complement

integer is -2^N-1to 2^N-1– 1. For a 16-bit integer, the data

range is -32768 (0x8000) to 32767 (0x7FFF), including

0. For a 32-bit integer, the data range is -2,147,483,648

(0x8000 0000) to 2,147,483,645 (0x7FFF FFFF).

The adder/subtracter is a 40-bit adder with an optional

zero input into one side and either true or complement

data into the other input. In the case of addition, the

carry/borrow input is active-high and the other input is

true data (not complemented), whereas in the case of

subtraction, the carry/borrow input is active-low and the

other input is complemented. The adder/subtracter

generates overflow status bits, SA/SB and OA/OB,

which are latched and reflected in the STATUS register.

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits are not identical to each other.

When the multiplier is configured for fractional multipli-

cation, the data is represented as a two’s complement

fraction, where the MSB is defined as a sign bit and the

radix point is implied to lie just after the sign bit

(QX format). The range of an N-bit two’s complement

fraction with this implied radix point is -1.0 to (1-2^1-N).

For a 16-bit fraction, the Q15 data range is -1.0

(0x8000) to 0.999969482 (0x7FFF), including 0 and

has a precision of 3.01518x10^-5. In Fractional mode, a

16x16 multiply operation generates a 1.31 product,

The adder has an additional saturation block which

controls accumulator data saturation, if selected. It

uses the result of the adder, the overflow status bits

described above, and the SATA/B (CORCON<7:6>)

and ACCSAT (CORCON<4>) mode control bits to

determine when and to what value to saturate.

Six STATUS register bits have been provided to

support saturation and overflow; they are:

1. OA:

which has a precision of 4.65661x10^-10

.

ACCA overflowed into guard bits

The same multiplier is used to support the MCU

multiply instructions, which includes integer 16-bit

signed, unsigned and mixed sign multiplies.

2. OB:

ACCB overflowed into guard bits

3. SA:

The MUL instruction may be directed to use byte or

word-sized operands. Byte operands will direct a 16-bit

result, and word operands will direct a 32-bit result to

the specified register(s) in the W array.

ACCA saturated (bit 31 overflow and saturation)

or

ACCA overflowed into guard bits and saturated

(bit 39 overflow and saturation)

4. SB:

2.4.2

DATA ACCUMULATORS AND

ADDER/SUBTRACTER

ACCB saturated (bit 31 overflow and saturation)

or

ACCB overflowed into guard bits and saturated

(bit 39 overflow and saturation)

The data accumulator consists of a 40-bit adder/sub-

tracter with automatic sign extension logic. It can select

one of two accumulators (A or B) as its pre-

accumulation source and post-accumulation destina-

tion. For the ADDand LACinstructions, the data to be

accumulated or loaded can be optionally scaled via the

barrel shifter, prior to accumulation.

5. OAB:

Logical OR of OA and OB

6. SAB:

Logical OR of SA and SB

The OA and OB bits are modified each time data passes

through the adder/subtracter. When set, they indicate

that the most recent operation has overflowed into the

accumulator guard bits (bits 32 through 39). The OA and

OB bits can also optionally generate an arithmetic warn-

ing trap when set and the corresponding overflow trap

flag enable bit (OVATE, OVBTE) in the INTCON1 regis-

ter (refer to Section 5.0 “Interrupts”) is set. This allows

the user to take immediate action, for example, to correct

system gain.

DS70141E-page 20

dsPIC30F3010/3011

The SA and SB bits are modified each time data passes

through the adder/subtracter, but can only be cleared by

the user. When set, they indicate that the accumulator

has overflowed its maximum range (bit 31 for 32-bit

saturation, or bit 39 for 40-bit saturation) and will be

saturated (if saturation is enabled). When saturation is

not enabled, SA and SB default to bit 39 overflow and

thus indicate that a catastrophic overflow has occurred.

If the COVTE bit in the INTCON1 register is set, SA and

SB bits will generate an arithmetic warning trap when

saturation is disabled.

2.4.2.2

Accumulator ‘Write Back’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the accumulator that is not targeted by the instruction

into data space memory. The write is performed across

the X bus into combined X and Y address space. The

following addressing modes are supported:

1. W13, Register Direct:

The rounded contents of the non-target

accumulator are written into W13 as

1.15 fraction.

a

The overflow and saturation status bits can optionally

be viewed in the STATUS Register (SR) as the logical

OR of OA and OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). This allows programmers to check

one bit in the STATUS register to determine if either

accumulator has overflowed, or one bit to determine if

either accumulator has saturated. This would be useful

for complex number arithmetic which typically uses

both the accumulators.

2. [W13]+=2, Register Indirect with Post-Increment:

The rounded contents of the non-target accumu-

lator are written into the address pointed to by

W13 as

incremented by 2 (for a word write).

a

1.15 fraction. W13 is then

2.4.2.3

Round Logic

The round logic is a combinational block, which per-

forms a conventional (biased) or convergent (unbiased)

round function during an accumulator write (store). The

Round mode is determined by the state of the RND bit

in the CORCON register. It generates a 16-bit, 1.15 data

value which is passed to the data space write saturation

logic. If rounding is not indicated by the instruction, a

truncated 1.15 data value is stored and the least

significant word (lsw) is simply discarded.

The device supports three Saturation and Overflow

modes.

1. Bit 39 Overflow and Saturation:

When bit 39 overflow and saturation occurs, the

saturation logic loads the maximally positive 9.31

(0x7FFFFFFFFF) or maximally negative 9.31

value (0x8000000000) into the target

accumulator. The SA or SB bit is set and

remains set until cleared by the user. This is

referred to as ‘super saturation’ and provides

protection against erroneous data or unexpected

algorithm problems (e.g., gain calculations).

Conventional rounding takes bit 15 of the accumulator,

zero-extends it and adds it to the ACCxH word (bits 16

through 31 of the accumulator). If the ACCxL word

(bits 0 through 15 of the accumulator) is between

0x8000 and 0xFFFF (0x8000 included), ACCxH is

incremented. If ACCxL is between 0x0000 and 0x7FFF,

ACCxH is left unchanged. A consequence of this

algorithm is that over a succession of random rounding

operations, the value will tend to be biased slightly

positive.

2. Bit 31 Overflow and Saturation:

When bit 31 overflow and saturation occurs, the

saturation logic then loads the maximally

positive 1.31 value (0x007FFFFFFF) or

maximally negative 1.31 value (0x0080000000)

into the target accumulator. The SA or SB bit is

set and remains set until cleared by the user.

When this Saturation mode is in effect, the guard

bits are not used (so the OA, OB or OAB bits are

never set).

Convergent (or unbiased) rounding operates in the

same manner as conventional rounding, except when

ACCxL equals 0x8000. If this is the case, the LSb

(bit 16 of the accumulator) of ACCxH is examined. If it

is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not

modified. Assuming that bit 16 is effectively random in

nature, this scheme will remove any rounding bias that

may accumulate.

3. Bit 39 Catastrophic Overflow

The bit 39 overflow status bit from the adder is

used to set the SA or SB bit, which remain set

until cleared by the user. No saturation operation

is performed and the accumulator is allowed to

overflow (destroying its sign). If the COVTE bit in

the INTCON1 register is set, a catastrophic

overflow can initiate a trap exception.

The SAC and SAC.R instructions store either a trun-

cated (SAC) or rounded (SAC.R) version of the contents

of the target accumulator to data memory, via the X bus

(subject to data saturation, see Section 2.4.2.4 “Data

Space Write Saturation”). Note that for the MACclass

of instructions, the accumulator write-back operation

will function in the same manner, addressing combined

MCU (X and Y) data space though the X bus. For this

class of instructions, the data is always subject to

rounding.

DS70141E-page 21

dsPIC30F3010/3011

2.4.2.4

Data Space Write Saturation

2.4.3

BARREL SHIFTER

In addition to adder/subtracter saturation, writes to data

space may also be saturated, but without affecting the

contents of the source accumulator. The data space

The barrel shifter is capable of performing up to 16-bit

arithmetic or logic right shifts, or up to 16-bit left shifts

in a single cycle. The source can be either of the two

DSP accumulators or the X bus (to support multi-bit

shifts of register or memory data).

write saturation logic block accepts

a

16-bit,

1.15 fractional value from the round logic block as its

input, together with overflow status from the original

source (accumulator) and the 16-bit round adder.

These are combined and used to select the appropriate

1.15 fractional value as output to write to data space

memory.

The shifter requires a signed binary value to determine

both the magnitude (number of bits) and direction of the

shift operation. A positive value will shift the operand

right. A negative value will shift the operand left. A

value of ‘0’ will not modify the operand.

If the SATDW bit in the CORCON register is set, data

(after rounding or truncation) is tested for overflow and

adjusted accordingly. For input data greater than

0x007FFF, data written to memory is forced to the

maximum positive 1.15 value, 0x7FFF. For input data

less than 0xFF8000, data written to memory is forced

to the maximum negative 1.15 value, 0x8000. The MSb

of the source (bit 39) is used to determine the sign of

the operand being tested.

The barrel shifter is 40 bits wide, thereby obtaining a

40-bit result for DSP shift operations and a 16-bit result

for MCU shift operations. Data from the X bus is

presented to the barrel shifter between bit positions 16

to 31 for right shifts, and bit positions 0 to 15 for left

shifts.

If the SATDW bit in the CORCON register is not set, the

input data is always passed through unmodified under

all conditions.

DS70141E-page 22

dsPIC30F3010/3011

FIGURE 3-1:

PROGRAM SPACE

MEMORY MAP FOR

dsPIC30F3010/3011

3.0

MEMORY ORGANIZATION

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

Reset - GOTOInstruction

Reset - Target Address

000000

000002

000004

Vector Tables

Interrupt Vector Table

3.1

Program Address Space

00007E

000080

000084

0000FE

000100

Reserved

The program address space is 4M instruction words. It

is addressable by the 23-bit PC, table instruction

Effective Address (EA) or data space EA, when

program space is mapped into data space, as defined

by Table 3-1. Note that the program space address is

incremented by two between successive program

words in order to provide compatibility with data space

addressing.

Alternate Vector Table

User Flash

Program Memory

(8K instructions)

003FFE

004000

Reserved

(Read 0’s)

7FFBFE

7FFC00

User program space access is restricted to the lower

4M instruction word address range (0x000000 to

0x7FFFFE) for all accesses other than TBLRD/TBLWT,

which use TBLPAG<7> to determine user or configura-

tion space access. In Table 3-1, read/write instructions,

bit 23 allows access to the Device ID, the User ID and

the Configuration bits; otherwise, bit 23 is always clear.

Data EEPROM

(1 Kbyte)

7FFFFE

800000

Reserved

8005BE

8005C0

UNITID (32 instr.)

Reserved

8005FE

800600

F7FFFE

Device Configuration

Registers

F80000

F8000E

F80010

Reserved

DEVID (2)

FEFFFE

FF0000

FFFFFE

DS70141E-page 23

dsPIC30F3010/3011

TABLE 3-1:

PROGRAM SPACE ADDRESS CONSTRUCTION

Program Space Address

Access

Space

Access Type

<23>

<22:16>

<15>

<14:1>

<0>

Instruction Access

User

(TBLPAG<7> = 0)

0

PC<22:1>

0

TBLRD/TBLWT

TBLPAG<7:0>

PSVPAG<7:0>

Data EA <15:0>

TBLRD/TBLWT

Configuration

(TBLPAG<7> = 1)

Program Space Visibility User

0

Data EA <14:0>

FIGURE 3-2:

DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

23 bits

Using

Program

Counter

Program Counter

0

Select

1

EA

Using

Program

Space

PSVPAG Reg

Visibility

8 bits

15 bits

EA

Using

Table

Instruction

1/0

TBLPAG Reg

8 bits

16 bits

User/

Configuration

Space

Byte

24-bit EA

Select

Note: Program Space Visibility cannot be used to access bits<23:16> of a word in program memory.

DS70141E-page 24

dsPIC30F3010/3011

A set of table instructions are provided to move byte or

word-sized data to and from program space.

3.1.1

DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

1. TBLRDL:Table Read Low

Word: Read the lsw of the program

address;

This architecture fetches 24-bit wide program memory.

Consequently, instructions are always aligned. How-

ever, as the architecture is modified Harvard, data can

also be present in program space.

P<15:0> maps to D<15:0>.

Byte: Read one of the LSBs of the program

address;

There are two methods by which program space can

be accessed: via special table instructions, or through

the remapping of a 16K word program space page into

the upper half of data space (see Section 3.1.2 “Data

Access From Program Memory Using Program

Space Visibility”). The TBLRDLand TBLWTLinstruc-

tions offer a direct method of reading or writing the lsw

of any address within program space, without going

through data space. The TBLRDHand TBLWTHinstruc-

tions are the only method whereby the upper 8 bits of a

program space word can be accessed as data.

P<7:0> maps to the destination byte when byte

select = 0;

P<15:8> maps to the destination byte when byte

select = 1.

2. TBLWTL:Table Write Low (refer to Section 6.0

“Flash Program Memory” for details on Flash

programming).

3. TBLRDH:Table Read High

Word: Read the msw of the program

address;

P<23:16> maps to D<7:0>; D<15:8> will always

be = 0.

Byte: Read one of the MSBs of the program

address;

P<23:16> maps to the destination byte when

byte select = 0;

The destination byte will always be = 0 when

byte select = 1.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two 16-bit

word-wide address spaces, residing side by side, each

with the same address range. TBLRDL and TBLWTL

access the space which contains the lsw, and TBLRDH

and TBLWTH access the space which contains the

MSB.

4. TBLWTH:Table Write High (refer to Section 6.0

“Flash Program Memory” for details on Flash

programming).

Figure 3-2 shows how the EA is created for table oper-

ations and data space accesses (PSV = 1). Here,

P<23:0> refers to a program space word, whereas

D<15:0> refers to a data space word.

FIGURE 3-3:

PROGRAM DATA TABLE ACCESS (lsw)

PC Address

23

8

16

0

0x000000

0x000002

0x000004

0x000006

00000000

TBLRDL.B (Wn<0> = 0)

TBLRDL.W

Program Memory

‘Phantom’ Byte

(Read as ‘0’).

TBLRDL.B (Wn<0> = 1)

DS70141E-page 25

dsPIC30F3010/3011

FIGURE 3-4:

PROGRAM DATA TABLE ACCESS (MSB)

TBLRDH.W

PC Address

23

8

0

16

0x000000

0x000002

0x000004

0x000006

00000000

TBLRDH.B (Wn<0> = 0)

Program Memory

‘Phantom’ Byte

(Read as ‘0’)

TBLRDH.B (Wn<0> = 1)

Note that by incrementing the PC by 2 for each

program memory word, the 15 LSbs of data space

addresses directly map to the 15 LSbs in the

corresponding program space addresses. The

remaining bits are provided by the Program Space

Visibility Page register, PSVPAG<7:0>, as shown in

Figure 3-5.

3.1.2

DATA ACCESS FROM PROGRAM

MEMORY USING PROGRAM SPACE

VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word program space page. This

provides transparent access of stored constant data

from X data space, without the need to use special

instructions (i.e., TBLRDL/H, TBLWTL/Hinstructions).

Note:

PSV access is temporarily disabled during

table reads/writes.

Program space access through the data space occurs

if the MSb of the data space, EA, is set and program

space visibility is enabled, by setting the PSV bit in the

Core Control register (CORCON). The functions of

CORCON are discussed in Section 2.4 “DSP

Engine”.

For instructions that use PSV which are executed

outside a REPEATloop:

• The following instructions will require one instruc-

tion cycle in addition to the specified execution

time:

Data accesses to this area add an additional cycle to

the instruction being executed, since two program

memory fetches are required.

- MACclass of instructions with data operand

prefetch

- MOVinstructions

Note that the upper half of addressable data space is

always part of the X data space. Therefore, when a

DSP operation uses program space mapping to access

this memory region, Y data space should typically

contain state (variable) data for DSP operations,

- MOV.Dinstructions

• All other instructions will require two instruction

cycles in addition to the specified execution time

of the instruction.

For instructions that use PSV which are executed

inside a REPEATloop:

whereas

X data space should typically contain

coefficient (constant) data.

• The following instances will require two instruction

cycles in addition to the specified execution time

of the instruction:

Although each data space address, 0x8000 and higher,

maps directly into a corresponding program memory

address (see Figure 3-5), only the lower 16 bits of the

24-bit program word are used to contain the data. The

upper 8 bits should be programmed to force an illegal

instruction to maintain machine robustness. Refer

to the “dsPIC30F/33F Programmer’s Reference

Manual” (DS70157) for details on instruction encoding.

- Execution in the first iteration

- Execution in the last iteration

- Execution prior to exiting the loop due to an

interrupt

- Execution upon re-entering the loop after an

interrupt is serviced

• Any other iteration of the REPEATloop will allow

the instruction, accessing data using PSV, to

execute in a single cycle.

DS70141E-page 26

dsPIC30F3010/3011

FIGURE 3-5:

DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION

Program Space

Data Space

0x0000

0x000100

PSVPAG⁽¹⁾

0x00

8

15

EA<15> =

0

Data

Space

16

0x8000

23

15

0

EA

Address

Concatenation

EA<15> = 1

0x001200

0x003FFE

15

23

Upper half of Data

Space is mapped

into Program Space

0xFFFF

Data Read

BSET CORCON,#2

; PSV bit set

MOV

#0x00, W0

W0, PSVPAG

0x9200, W0

; Set PSVPAG register

; Access program memory location

; using a data space access

Note: PSVPAG is an 8-bit register, containing bits<22:15> of the program space address

(i.e., it defines the page in program space to which the upper half of data space is being mapped).

When executing any instruction other than one of the

MAC class of instructions, the X block consists of the

3.2

Data Address Space

The core has two data spaces. The data spaces can be

considered either separate (for some DSP instruc-

tions), or as one unified linear address range (for MCU

instructions). The data spaces are accessed using two

Address Generation Units (AGUs) and separate data

paths.

64 Kbyte data address space (including all

Y

addresses). When executing one of the MAC class of

instructions, the X block consists of the 64 Kbyte data

address space excluding the Y address block (for data

reads only). In other words, all other instructions regard

the entire data memory as one composite address

space. The MAC class instructions extract the Y

address space from data space and address it using

EAs sourced from W10 and W11. The remaining X data

space is addressed using W8 and W9. Both address

spaces are concurrently accessed only with the MAC

class instructions.

3.2.1

DATA SPACE MEMORY MAP

The data space memory is split into two blocks, X and

Y data space. A key element of this architecture is that

Y space is a subset of X space, and is fully contained

within X space. In order to provide an apparent linear

addressing space, X and Y spaces have contiguous

addresses.

A data space memory map is shown in Figure 3-6.

Figure 3-7 shows a graphical summary of how X and Y

data spaces are accessed for MCU and DSP

instructions.

DS70141E-page 27

dsPIC30F3010/3011

FIGURE 3-6:

dsPIC30F3010/3011 DATA SPACE MEMORY MAP

LSB

Address

MSB

Address

16 bits

MSB

LSB

0x0000

0x0001

2 Kbyte

SFR Space

0x07FE

0x0800

0x07FF

0x0801

X Data RAM (X)

Y Data RAM (Y)

3072 Bytes

Near

Data

1 Kbyte

0x09FF

0x0A01

0x09FE

0x0A00

Space

SRAM Space

0x0BFF

0x0C01

0xBFE

0x0C00

0x8001

0x8000

X Data

Unimplemented (X)

Optionally

Mapped

into Program

Memory

0xFFFF

0xFFFE

DS70141E-page 28

dsPIC30F3010/3011

DATA SPACE FOR MCU AND DSP (MACCLASS) INSTRUCTIONS EXAMPLE

SFR SPACE

FIGURE 3-7:

SFR SPACE

UNUSED

Y SPACE

UNUSED

(Y SPACE)

UNUSED

Non-MACClass Ops (Read/Write)

MACClass Ops (Write)

MACClass Ops Read-Only

Indirect EA Using any W

Indirect EA Using W10, W11Indirect EA Using W8, W9

DS70141E-page 29

dsPIC30F3010/3011

3.2.2

DATA SPACES

3.2.3

DATA SPACE WIDTH

The X data space is used by all instructions and sup-

ports all addressing modes. There are separate read

and write data buses. The X read data bus is the return

data path for all instructions that view data space as

combined X and Y address space. It is also the X

address space data path for the dual operand read

instructions (MAC class). The X write data bus is the

only write path to data space for all instructions.

The core data width is 16 bits. All internal registers are

organized as 16-bit wide words. Data space memory is

organized in byte addressable, 16-bit wide blocks.

3.2.4

DATA ALIGNMENT

To help maintain backward compatibility with PIC^®

MCU devices and improve data space memory usage

efficiency, the dsPIC30F instruction set supports both

word and byte operations. Data is aligned in data mem-

ory and registers as words, but all data space EAs

resolve to bytes. Data byte reads will read the complete

word, which contains the byte, using the LSb of any EA

to determine which byte to select. The selected byte is

placed onto the LSB of the X data path (no byte

accesses are possible from the Y data path as the MAC

class of instruction can only fetch words). That is, data

memory and registers are organized as two parallel

byte-wide entities with shared (word) address decode,

but separate write lines. Data byte writes only write to

the corresponding side of the array or register which

matches the byte address.

The X data space also supports Modulo Addressing for

all instructions, subject to addressing mode restric-

tions. Bit-Reversed Addressing is only supported for

writes to X data space.

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED,

EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to

provide two concurrent data read paths. No writes

occur across the Y bus. This class of instructions

dedicates two W register pointers, W10 and W11, to

always address Y data space, independent of X data

space, whereas W8 and W9 always address X data

space. Note that during accumulator write back, the

data address space is considered a combination of X

and Y data spaces, so the write occurs across the X

bus. Consequently, the write can be to any address in

the entire data space.

As a consequence of this byte accessibility, all effective

address calculations (including those generated by the

DSP operations, which are restricted to word-sized

data) are internally scaled to step through word-aligned

memory. For example, the core would recognize that

Post-Modified Register Indirect Addressing mode,

[Ws++], will result in a value of Ws + 1 for byte

operations and Ws + 2 for word operations.

The Y data space can only be used for the data

prefetch operation associated with the MAC class of

instructions. It also supports Modulo Addressing for

automated circular buffers. Of course, all other instruc-

tions can access the Y data address space through the

X data path, as part of the composite linear space.

All word accesses must be aligned to an even address.

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word opera-

tions, or translating from 8-bit MCU code. Should a mis-

aligned read or write be attempted, an address error

trap will be generated. If the error occurred on a read,

the instruction underway is completed, whereas if it

occurred on a write, the instruction will be executed but

the write will not occur. In either case, a trap will then

be executed, allowing the system and/or user to exam-

ine the machine state prior to execution of the address

Fault.

The boundary between the X and Y data spaces is

defined as shown in Figure 3-6 and is not user-

programmable. Should an EA point to data outside its

own assigned address space, or to a location outside

physical memory, an all zero word/byte will be returned.

For example, although Y address space is visible by all

non-MAC instructions using any addressing mode, an

attempt by a MAC instruction to fetch data from that

space, using W8 or W9 (X Space Pointers), will return

0x0000.

FIGURE 3-8:

DATA ALIGNMENT

LSB

TABLE 3-2:

EFFECT OF INVALID

MEMORY ACCESSES

MSB

15

8 7

0

Attempted Operation

Data Returned

0000

0002

0004

0001

Byte 1

Byte 3

Byte 5

Byte 0

Byte 2

Byte 4

EA = an unimplemented address

0x0000

0003

0005

W8 or W9 used to access Y data

space in a MACinstruction

W10 or W11 used to access X

0x0000

data space in a MACinstruction

All effective addresses are 16 bits wide and point to

bytes within the data space. Therefore, the data space

address range is 64 Kbytes or 32K words.

DS70141E-page 30

dsPIC30F3010/3011

All byte loads into any W register are loaded into the

LSB. The MSB is not modified.

There is a Stack Pointer Limit register (SPLIM) associ-

ated with the Stack Pointer. SPLIM is uninitialized at

Reset. As is the case for the Stack Pointer, SPLIM<0>

is forced to ‘0’, because all stack operations must be

word-aligned. Whenever an Effective Address (EA) is

generated using W15 as a source or destination

pointer, the address thus generated is compared with

the value in SPLIM. If the contents of the Stack Pointer

(W15) and the SPLIM register are equal and a push

operation is performed, a stack error trap will not occur.

The stack error trap will occur on a subsequent push

operation. Thus, for example, if it is desirable to cause

a stack error trap when the stack grows beyond

address 0x2000 in RAM, initialize the SPLIM with the

value, 0x1FFE.

A sign-extend (SE) instruction is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the MSB of any W register by executing a

zero-extend (ZE) instruction on the appropriate

address.

Although most instructions are capable of operating on

word or byte data sizes, it should be noted that some

instructions, including the DSP instructions, operate

only on words.

3.2.5

NEAR DATA SPACE

An 8 Kbyte ‘near’ data space is reserved in X address

memory space between 0x0000 and 0x1FFF, which is

directly addressable via a 13-bit absolute address field

within all memory direct instructions. The remaining X

address space and all of the Y address space is

addressable indirectly. Additionally, the whole of X data

space is addressable using MOV instructions, which

support memory direct addressing with a 16-bit

address field.

Similarly, a Stack Pointer underflow (stack error) trap is

generated when the Stack Pointer address is found to

be less than 0x0800, thus preventing the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM register should not be immediately

followed by an indirect read operation using W15.

FIGURE 3-9:

CALLSTACK FRAME

3.2.6

SOFTWARE STACK

0x0000

15

0

The dsPIC DSC device contains a software stack. W15

is used as the Stack Pointer.

The Stack Pointer always points to the first available

free word and grows from lower addresses towards

higher addresses. It pre-decrements for stack pops and

post-increments for stack pushes, as shown in

Figure 3-9. Note that for a PC push during any CALL

instruction, the MSB of the PC is zero-extended before

the push, ensuring that the MSB is always clear.

PC<15:0>

000000000

W15 (before CALL)

PC<22:16>

W15 (after CALL)

POP: [--W15]

PUSH: [W15++]

Note:

A PC push during exception processing

will concatenate the SRL register to the

MSB of the PC prior to the push.

DS70141E-page 31

dsPIC30F3010/3011

DS70141E-page 32

dsPIC30F3010/3011

DS70141E-page 33

dsPIC30F3010/3011

NOTES:

DS70141E-page 34

dsPIC30F3010/3011

4.1.1

FILE REGISTER INSTRUCTIONS

4.0

ADDRESS GENERATOR UNITS

Most file register instructions use a 13-bit address field

(f) to directly address data present in the first

8192 bytes of data memory (near data space). Most file

register instructions employ a working register, W0,

which is denoted as WREG in these instructions. The

destination is typically either the same file register, or

WREG (with the exception of the MUL instruction),

which writes the result to a register or register pair. The

MOV instruction allows additional flexibility and can

access the entire data space during file register

operation.

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

4.1.2

MCU INSTRUCTIONS

The dsPIC DSC core contains two independent

address generator units: the X AGU and Y AGU. The Y

AGU supports word-sized data reads for the DSP MAC

class of instructions only. The dsPIC DSC AGUs

support three types of data addressing:

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where Operand 1 is always a working register (i.e., the

addressing mode can only be Register Direct), which is

referred to as Wb. Operand 2 can be a W register,

fetched from data memory, or a 5-bit literal. The result

location can be either a W register or an address

location. The following addressing modes are

supported by MCU instructions:

• Linear Addressing

• Modulo (Circular) Addressing

• Bit-Reversed Addressing

Linear and Modulo Data Addressing modes can be

applied to data space or program space. Bit-Reversed

Addressing is only applicable to data space addresses.

• Register Direct

• Register Indirect

4.1

Instruction Addressing Modes

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

The addressing modes in Table 4-1 form the basis of

the addressing modes optimized to support the specific

features of individual instructions. The addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

Note:

Not all instructions support all the address-

ing modes given above. Individual

instructions may support different subsets

of these addressing modes.

TABLE 4-1:

FUNDAMENTAL ADDRESSING MODES SUPPORTED

Description

The address of the file register is specified explicitly.

Addressing Mode

File Register Direct

Register Direct

The contents of a register are accessed directly.

The contents of Wn forms the EA.

Register Indirect

Register Indirect Post-Modified

The contents of Wn forms the EA. Wn is post-modified (incremented or

decremented) by a constant value.

Register Indirect Pre-Modified

Wn is pre-modified (incremented or decremented) by a signed constant value

to form the EA.

Register Indirect with Register Offset The sum of Wn and Wb forms the EA.

Register Indirect with Literal Offset

The sum of Wn and a literal forms the EA.

DS70141E-page 35

dsPIC30F3010/3011

In summary, the following addressing modes are

supported by the MACclass of instructions:

4.1.3

MOVE AND ACCUMULATOR

INSTRUCTIONS

• Register Indirect

Move instructions and the DSP Accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

addressing modes supported by most MCU instruc-

tions, move and accumulator instructions also support

Register Indirect with Register Offset Addressing

mode, also referred to as Register Indexed mode.

• Register Indirect Post-Modified by 2

• Register Indirect Post-Modified by 4

• Register Indirect Post-Modified by 6

• Register Indirect with Register Offset (Indexed)

4.1.5

OTHER INSTRUCTIONS

Note:

For the MOV instructions, the addressing

mode specified in the instruction can differ

for the source and destination EA. How-

ever, the 4-bit Wb (Register Offset) field is

shared between both source and

destination (but typically only used by

one).

Besides the various addressing modes outlined above,

some instructions use literal constants of various sizes.

For example, BRA (branch) instructions use 16-bit

signed literals to specify the branch destination directly,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, such as ADDAcc, the

source of an operand or result is implied by the opcode

itself. Certain operations, such as NOP, do not have any

operands.

In summary, the following addressing modes are

supported by move and accumulator instructions:

• Register Direct

4.2

Modulo Addressing

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

Modulo Addressing is a method of providing an auto-

mated means to support circular data buffers using

hardware. The objective is to remove the need for soft-

ware to perform data address boundary checks when

executing tightly looped code, as is typical in many

DSP algorithms.

• 16-bit Literal

Modulo Addressing can operate in either data or

program space (since the Data Pointer mechanism is

essentially the same for both). One circular buffer can be

supported in each of the X (which also provides the

pointers into program space) and Y data spaces. Modulo

Addressing can operate on any W register pointer.

However, it is not advisable to use W14 or W15 for

Modulo Addressing, since these two registers are used

as the Stack Frame Pointer and Stack Pointer,

respectively.

Note:

Not all instructions support all the address-

ing modes given above. Individual

instructions may support different subsets

of these addressing modes.

4.1.4

MACINSTRUCTIONS

The dual source operand DSP instructions (CLR,ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also

referred to as MACinstructions, utilize a simplified set of

addressing modes to allow the user to effectively

manipulate the Data Pointers through register indirect

tables.

In general, any particular circular buffer can only be

configured to operate in one direction, as there are

certain restrictions on the buffer start address (for

incrementing buffers) or end address (for decrementing

buffers) based upon the direction of the buffer.

The two source operand prefetch registers must be a

member of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 will always be directed to the X

RAGU and W10 and W11 will always be directed to the

Y AGU. The effective addresses generated (before and

after modification) must, therefore, be valid addresses

within X data space for W8 and W9 and Y data space

for W10 and W11.

The only exception to the usage restrictions is for

buffers which have a power-of-2 length. As these

buffers satisfy the start and end address criteria, they

may operate in a Bidirectional mode, (i.e., address

boundary checks will be performed on both the lower

and upper address boundaries).

Note:

Register Indirect with Register Offset

Addressing is only available for W9 (in X

space) and W11 (in Y space).

DS70141E-page 36

dsPIC30F3010/3011

4.2.1

START AND END ADDRESS

4.2.2

W ADDRESS REGISTER

SELECTION

The Modulo Addressing scheme requires that a

starting and an end address be specified and loaded

into the 16-bit Modulo Buffer Address registers:

XMODSRT, XMODEND, YMODSRT and YMODEND

(see Table 3-3).

The Modulo and Bit-Reversed Addressing Control

register MODCON<15:0> contains enable flags, as

well as a W register field to specify the W address

registers. The XWM and YWM fields select which

registers will operate with Modulo Addressing. If

XWM = 15, X RAGU and X WAGU Modulo Addressing

are disabled. Similarly, if YWM = 15, Y AGU Modulo

Addressing is disabled.

Note:

Y-space Modulo Addressing EA calcula-

tions assume word-sized data (LSb of

every EA is always clear).

The length of a circular buffer is not directly specified. It

is determined by the difference between the

corresponding start and end addresses. The maximum

possible length of the circular buffer is 32K words

(64 Kbytes).

The X Address Space Pointer W register (XWM), to

which Modulo Addressing is to be applied, is stored in

MODCON<3:0> (see Table 3-3). Modulo Addressing is

enabled for X data space when XWM is set to any value

other than 15 and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM), to

which Modulo Addressing is to be applied, is stored in

MODCON<7:4>. Modulo Addressing is enabled for Y

data space when YWM is set to any value other than 15

and the YMODEN bit is set at MODCON<14>.

FIGURE 4-1:

MODULO ADDRESSING OPERATION EXAMPLE

Byte

Address

MOV

DO

#0x1100,W0

W0, XMODSRT

#0x1163,W0

W0,MODEND

#0x8001,W0

W0,MODCON

#0x0000,W0

#0x1110,W1

AGAIN,#0x31

W0, [W1++]

;set modulo start address

;set modulo end address

0x1100

;enable W1, X AGU for modulo

;W0 holds buffer fill value

;point W1 to buffer

;fill the 50 buffer locations

;fill the next location

;increment the fill value

MOV

AGAIN: INC

W0,W0

0x1163

Start Addr = 0x1100

End Addr = 0x1163

Length = 0x0032 words

DS70141E-page 37

dsPIC30F3010/3011

If the length of a bit-reversed buffer is M = 2^Nbytes,

then the last ‘N’ bits of the data buffer start address

must be zeros.

4.2.3

MODULO ADDRESSING

APPLICABILITY

Modulo Addressing can be applied to the Effective

Address (EA) calculation associated with any W regis-

ter. It is important to realize that the address boundar-

ies check for addresses less than or greater than the

upper (for incrementing buffers) and lower (for decre-

menting buffers) boundary addresses (not just equal

to). Address changes may, therefore, jump beyond

boundaries and still be adjusted correctly.

XB<14:0> is the bit-reversed address modifier or ‘pivot

point’ which is typically a constant. In the case of an

FFT computation, its value is equal to half of the FFT

data buffer size.

Note:

All bit-reversed EA calculations assume

word-sized data (LSb of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note:

The modulo corrected effective address is

written back to the register only when Pre-

Modify or Post-Modify Addressing mode is

used to compute the effective address.

When an address offset (e.g., [W7 + W2])

is used, Modulo Addressing correction is

performed, but the contents of the register

remains unchanged.

When enabled, Bit-Reversed Addressing will only be

executed for Register Indirect with Pre-Increment or

Post-Increment Addressing and word-sized data

writes. It will not function for any other addressing

mode or for byte-sized data, and normal addresses will

be generated instead. When Bit-Reversed Addressing

is active, the W Address Pointer will always be added

to the address modifier (XB) and the offset associated

with the Register Indirect Addressing mode will be

4.3

Bit-Reversed Addressing

Bit-Reversed Addressing is intended to simplify data

re-ordering for radix-2 FFT algorithms. It is supported

by the X AGU for data writes only.

ignored. In addition, as word-sized data is

a

requirement, the LSb of the EA is ignored (and always

clear).

The modifier, which may be a constant value or register

contents, is regarded as having its bit order reversed.

The address source and destination are kept in normal

order. Thus, the only operand requiring reversal is the

modifier.

Note:

Modulo Addressing and Bit-Reversed

Addressing should not be enabled

together. In the event that the user

attempts to do this, Bit-Reversed Address-

ing will assume priority when active for the

X WAGU, and X WAGU Modulo Address-

ing will be disabled. However, Modulo

Addressing will continue to function in the

X RAGU.

4.3.1

BIT-REVERSED ADDRESSING

IMPLEMENTATION

Bit-Reversed Addressing is enabled when:

1. BWM (W register selection) in the MODCON

register is any value other than 15 (the stack can

not be accessed using Bit-Reversed

Addressing) and

If Bit-Reversed Addressing has already been enabled

by setting the BREN (XBREV<15>) bit, then a write to

the XBREV register should not be immediately followed

by an indirect read operation using the W register that

has been designated as the Bit-Reversed Pointer.

2. the BREN bit is set in the XBREV register and

3. the addressing mode used is Register Indirect

with Pre-Increment or Post-Increment.

FIGURE 4-2:

BIT-REVERSED ADDRESS EXAMPLE

Sequential Address

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1

0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

b2 b3 b4

0

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1

Bit-Reversed Address

Pivot Point

XB = 0x0008 for a 16-word Bit-Reversed Buffer

DS70141E-page 38

dsPIC30F3010/3011

TABLE 4-2:

BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

Normal

Address

Bit-Reversed

Address

A3

A2

A1

A0

Decimal

A3

A2

A1

A0

Decimal

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

8

2

4

3

12

2

4

5

10

6

7

14

1

8

9

10

11

12

13

14

15

5

13

3

11

7

15

TABLE 4-3:

BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER

Buffer Size (Words)

XB<14:0> Bit-Reversed Address Modifier Value

512

256

128

64

32

16

8

0x0100

0x0080

0x0040

0x0020

0x0010

0x0008

0x0004

0x0002

0x0001

4

2

DS70141E-page 39

dsPIC30F3010/3011

NOTES:

DS70141E-page 40

dsPIC30F3010/3011

• INTCON1<15:0>, INTCON2<15:0>

5.0

INTERRUPTS

Global interrupt control functions are derived from

these two registers. INTCON1 contains the

control and status flags for the processor

exceptions. The INTCON2 register controls the

external interrupt request signal behavior and the

use of the alternate vector table.

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

Note:

Interrupt flag bits get set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit. User

software should ensure the appropriate

Interrupt flag bits are clear prior to

enabling an interrupt.

The dsPIC30F3010/3011 has 29 interrupt sources and

processor exceptions (traps), which must be

arbitrated based on a priority scheme.

All interrupt sources can be user-assigned to one of

7 priority levels, 1 through 7, via the IPCx registers.

Each interrupt source is associated with an interrupt

vector, as shown in Table 5-1. Levels 7 and 1 repre-

sent the highest and lowest maskable priorities,

respectively.

4

The CPU is responsible for reading the Interrupt

Vector Table (IVT) and transferring the address con-

tained in the interrupt vector to the program counter.

The interrupt vector is transferred from the program

data bus into the program counter via a 24-bit wide

multiplexer on the input of the program counter.

Note:

Assigning a priority level of 0 to an

interrupt source is equivalent to disabling

that interrupt.

The Interrupt Vector Table (IVT) and Alternate

Interrupt Vector Table (AIVT) are placed near the

beginning of program memory (0x000004). The IVT

and AIVT are shown in Figure 5-1.

If the NSTDIS bit (INTCON1<15>) is set, nesting of

interrupts is prevented. Thus, if an interrupt is currently

being serviced, processing of a new interrupt is

prevented, even if the new interrupt is of higher priority

than the one currently being serviced.

The interrupt controller is responsible for pre-

processing the interrupts and processor exceptions,

prior to their being presented to the processor core.

The peripheral interrupts and traps are enabled,

prioritized and controlled using centralized Special

Function Registers (SFR):

Note:

The IPL bits become read-only whenever

the NSTDIS bit has been set to ‘1’.

Certain interrupts have specialized control bits for

features like edge or level triggered interrupts, inter-

rupt-on-change, etc. Control of these features remains

within the peripheral module which generates the

interrupt.

• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>

All interrupt request flags are maintained in these

three registers. The flags are set by their respec-

tive peripherals or external signals, and they are

cleared via software.

The DISI instruction can be used to disable the

processing of interrupts of priorities 6 and lower for a

certain number of instructions, during which the DISI bit

(INTCON2<14>) remains set.

• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>

All interrupt enable control bits are maintained in

these three registers. These control bits are used

to individually enable interrupts from the

peripherals or external signals.

When an interrupt is serviced, the PC is loaded with the

address stored in the vector location in program

memory that corresponds to the interrupt. There are 63

different vectors within the IVT (refer to Figure 5-2).

These vectors are contained in locations 0x000004

through 0x0000FE of program memory (refer to

Figure 5-2). These locations contain 24-bit addresses,

and in order to preserve robustness, an address error

trap will take place should the PC attempt to fetch any

of these words during normal execution. This prevents

execution of random data as a result of accidentally

decrementing a PC into vector space, accidentally

mapping a data space address into vector space or the

PC rolling over to 0x000000 after reaching the end of

implemented program memory space. Execution of a

GOTOinstruction to this vector space will also generate

an address error trap.

• IPC0<15:0>... IPC11<7:0>

The user-assignable priority level associated with

each of these interrupts is held centrally in these

twelve registers.

• IPL<3:0> The current CPU priority level is

explicitly stored in the IPL bits. IPL<3> is present

in the CORCON register, whereas IPL<2:0> are

present in the STATUS Register (SR) in the

processor core.

DS70141E-page 41

dsPIC30F3010/3011

TABLE 5-1:

INTERRUPT VECTOR TABLE

5.1

Interrupt Priority

INT

Vector

The user-assignable Interrupt Priority (IP<2:0>) bits for

each individual interrupt source are located in the

3 LSbs of each nibble, within the IPCx register(s). Bit

3 of each nibble is not used and is read as a ‘0’. These

bits define the priority level assigned to a particular

interrupt by the user.

Interrupt Source

Number Number

Highest Natural Order Priority

0

1

8

INT0 – External Interrupt 0

IC1 – Input Capture 1

OC1 – Output Compare 1

T1 – Timer 1

9

2

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

3

Note:

The user-assignable priority levels start at

0, as the lowest priority, and Level 7, as

the highest priority.

4

IC2 – Input Capture 2

OC2 – Output Compare 2

T2 – Timer 2

5

6

Since more than one interrupt request source may be

assigned to a specific user-assigned priority level, a

means is provided to assign priority within a given level.

This method is called “Natural Order Priority”.

7

T3 – Timer 3

8

SPI #1

9

U1RX – UART1 Receiver

U1TX – UART1 Transmitter

ADC – ADC Convert Done

NVM – NVM Write Complete

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45-53

Natural Order Priority is determined by the position of

an interrupt in the vector table, and only affects

interrupt operation when multiple interrupts with the

same user-assigned priority become pending at the

same time.

2

SI2C – I C™ Slave Interrupt

2

MI2C – I C Master Interrupt

Input Change Interrupt

INT1 – External Interrupt 1

IC7 – Input Capture 7

IC8 – Input Capture 8

OC3 – Output Compare 3*

OC4 – Output Compare 4*

T4 – Timer 4

Table 5-1 lists the interrupt numbers and interrupt

sources for the dsPIC DSC devices and their

associated vector numbers.

Note 1: The natural order priority scheme has 0

as the highest priority and 53 as the

lowest priority.

2:The natural order priority number is the

T5 – Timer 5

same as the INT number.

INT2 – External Interrupt 2

U2RX – UART2 Receiver*

U2TX – UART2 Transmitter*

Reserved

The ability for the user to assign every interrupt to one

of seven priority levels implies that the user can assign

a very high overall priority level to an interrupt with a

low natural order priority. For example, the PWM Fault

A Interrupt can be given a priority of 7. The INT0

(external interrupt 0) may be assigned to priority

Level 1, thus giving it a very low effective priority.

Reserved

PWM – PWM Period Match

QEI – QEI Interrupt

Reserved

FLTA – PWM Fault A

Reserved

53-61 Reserved

Lowest Natural Order Priority

Available on dsPIC30F3011 only

*

DS70141E-page 42

dsPIC30F3010/3011

5.2

Reset Sequence

5.3

Traps

A Reset is not a true exception, because the interrupt

controller is not involved in the Reset process. The

processor initializes its registers in response to a

Reset, which forces the PC to zero. The processor then

begins program execution at location 0x000000. A

GOTOinstruction is stored in the first program memory

location, immediately followed by the address target for

the GOTOinstruction. The processor executes the GOTO

to the specified address and then begins operation at

the specified target (start) address.

Traps can be considered as non-maskable interrupts,

indicating a software or hardware error, which adhere

to a predefined priority as shown in Figure 5-1. They

are intended to provide the user a means to correct

erroneous operation during debug and when operating

within the application.

Note:

If the user does not intend to take correc-

tive action in the event of a trap error

condition, these vectors must be loaded

with the address of a default handler that

simply contains the RESET instruction. If,

on the other hand, one of the vectors

containing an invalid address is called, an

address error trap is generated.

5.2.1

RESET SOURCES

There are 6 sources of error which will cause a device

reset.

• Watchdog Time-out:

Note that many of these trap conditions can only be

detected when they occur. Consequently, the question-

able instruction is allowed to complete prior to trap

exception processing. If the user chooses to recover

from the error, the result of the erroneous action that

caused the trap may have to be corrected.

The watchdog has timed out, indicating that the

processor is no longer executing the correct flow

of code.

• Uninitialized W Register Trap:

An attempt to use an uninitialized W register as

an Address Pointer will cause a Reset.

There are 8 fixed priority levels for traps: Level 8

through Level 15, which implies that the IPL3 is always

set during processing of a trap.

• Illegal Instruction Trap:

Attempted execution of any unused opcodes will

result in an illegal instruction trap. Note that a

fetch of an illegal instruction does not result in an

illegal instruction trap if that instruction is flushed

prior to execution due to a flow change.

If the user is not currently executing a trap, and he sets

the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all

interrupts are disabled, but traps can still be processed.

• Brown-out Reset (BOR):

5.3.1

TRAP SOURCES

A momentary dip in the power supply to the

device has been detected, which may result in

malfunction.

The following traps are provided with increasing

priority. However, since all traps can be nested, priority

has little effect.

• Trap Lockout:

Occurrence of multiple trap conditions

simultaneously will cause a Reset.

Math Error Trap:

The math error trap executes under the following three

circumstances:

1. Should an attempt be made to divide by zero,

the divide operation will be aborted on a cycle

boundary and the trap taken.

2. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes an overflow from bit 31 and the

accumulator guard bits are not utilized.

3. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes a catastrophic overflow from bit 39

and all saturation is disabled.

4. If the shift amount specified in a shift instruction

is greater than the maximum allowed shift

amount, a trap will occur.

DS70141E-page 43

dsPIC30F3010/3011

Address Error Trap:

5.3.2

HARD AND SOFT TRAPS

This trap is initiated when any of the following

circumstances occurs:

It is possible that multiple traps can become active

within the same cycle (e.g., a misaligned word stack

write to an overflowed address). In such a case, the

fixed priority shown in Figure 5-2 is implemented,

which may require the user to check if other traps are

pending, in order to completely correct the Fault.

1. A misaligned data word access is attempted.

2. A data fetch from our unimplemented data

memory location is attempted.

3. A data access of an unimplemented program

memory location is attempted.

‘Soft’ traps include exceptions of priority Level 8

through Level 11, inclusive. The arithmetic error trap

(Level 11) falls into this category of traps.

4. An instruction fetch from vector space is

attempted.

‘Hard’ traps include exceptions of priority Level 12

through Level 15, inclusive. The address error

(Level 12), stack error (Level 13) and oscillator error

(Level 14) traps fall into this category.

Note:

In the MAC class of instructions, wherein

the data space is split into X and Y data

space, unimplemented X space includes

all of Y space, and unimplemented Y

space includes all of X space.

Each hard trap that occurs must be Acknowledged

before code execution of any type may continue. If a

lower priority hard trap occurs while a higher priority

trap is pending, Acknowledged, or is being processed,

a hard trap conflict will occur.

5. Execution of a “BRA #literal” instruction or a

“GOTO #literal” instruction, where literal

is an unimplemented program memory address.

6. Executing instructions after modifying the PC to

point to unimplemented program memory

addresses. The PC may be modified by loading

a value into the stack and executing a RETURN

instruction.

The device is automatically reset in a hard trap conflict

condition. The TRAPR status bit (RCON<15>) is set

when the Reset occurs, so that the condition may be

detected in software.

Stack Error Trap:

FIGURE 5-1:

TRAP VECTORS

This trap is initiated under the following conditions:

Reset – GOTOInstruction

Reset – GOTOAddress

0x000000

0x000002

0x000004

1. The Stack Pointer is loaded with a value which

is greater than the (user-programmable) limit

value written into the SPLIM register (stack

overflow).

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

Reserved Vector

2. The Stack Pointer is loaded with a value which

is less than 0x0800 (simple stack underflow).

IVT

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

—

0x000014

Oscillator Fail Trap:

—

This trap is initiated if the external oscillator fails and

operation becomes reliant on an internal RC backup.

Interrupt 52 Vector

Interrupt 53 Vector

Reserved

0x00007E

0x000080

0x000082

Reserved

0x000084

Oscillator Fail Trap Vector

Stack Error Trap Vector

Address Error Trap Vector

Math Error Trap Vector

Reserved Vector

Interrupt 0 Vector

AIVT

0x000094

0x0000FE

Interrupt 1 Vector

—

Interrupt 52 Vector

Interrupt 53 Vector

DS70141E-page 44

dsPIC30F3010/3011

5.4

Interrupt Sequence

5.5

Alternate Vector Table

In program memory, the Interrupt Vector Table (IVT) is

followed by the Alternate Interrupt Vector Table (AIVT),

as shown in Figure 5-1. Access to the Alternate Vector

Table is provided by the ALTIVT bit in the INTCON2

register. If the ALTIVT bit is set, all interrupt and

exception processes use the alternate vectors instead

of the default vectors. The alternate vectors are

organized the same as the default vectors. The AIVT

supports emulation and debugging efforts by providing

a means to switch between an application and a

support environment without requiring the interrupt

vectors to be reprogrammed. This feature also enables

switching between applications for evaluation of

different software algorithms at run time.

All interrupt event flags are sampled in the beginning of

each instruction cycle by the IFSx registers. A pending

Interrupt Request (IRQ) is indicated by the flag bit

being equal to a ‘1’ in an IFSx register. The IRQ will

cause an interrupt to occur if the corresponding bit in

the Interrupt Enable (IECx) register is set. For the

remainder of the instruction cycle, the priorities of all

pending interrupt requests are evaluated.

If there is a pending IRQ with a priority level greater

than the current processor priority level in the IPL bits,

the processor will be interrupted.

The processor then stacks the current program counter

and the low byte of the processor STATUS register

(SRL), as shown in Figure 5-2. The low byte of the

STATUS register contains the processor priority level at

the time, prior to the beginning of the interrupt cycle.

The processor then loads the priority level for this inter-

rupt into the STATUS register. This action will disable

all lower priority interrupts until the completion of the

Interrupt Service Routine (ISR).

If the AIVT is not required, the program memory

allocated to the AIVT may be used for other purposes.

AIVT is not a protected section and may be freely

programmed by the user.

5.6

Fast Context Saving

A context saving option is available using Shadow

registers. Shadow registers are provided for the DC, N,

OV, Z and C bits in SR, and the registers, W0 through

W3. The shadows are only one level deep. The

Shadow registers are accessible using the PUSH.S

and POP.S instructions only. When the processor

vectors to an interrupt, the PUSH.Sinstruction can be

used to store the current value of the aforementioned

registers into their respective Shadow registers.

FIGURE 5-2:

INTERRUPT STACK

FRAME

0x0000 15

0

If an ISR of a certain priority uses the PUSH.S and

POP.S instructions for fast context saving, then a

higher priority ISR should not include the same

instructions. Users must save the key registers in

software during a lower priority interrupt if the higher

priority ISR uses fast context saving.

PC<15:0>

SRL IPL3 PC<22:16>

W15 (before CALL)

W15 (after CALL)

POP : [--W15]

PUSH : [W15++]

5.7

External Interrupt Requests

Note 1: The user can always lower the priority

level by writing a new value into SR. The

Interrupt Service Routine must clear the

interrupt flag bits in the IFSx register

before lowering the processor interrupt

priority, in order to avoid recursive

interrupts.

The dsPIC30F3010/3011 interrupt controller supports

three external interrupt request signals, INT0-INT2.

These inputs are edge sensitive; they require a low-to-

high or a high-to-low transition to generate an interrupt

request. The INTCON2 register has five bits, INT0EP-

INT4EP, that select the polarity of the edge detection

circuitry.

2: The IPL3 bit (CORCON<3>) is always

clear when interrupts are being

processed. It is set only during execution

of traps.

5.8

Wake-up from Sleep and Idle

The interrupt controller may be used to wake-up the

processor from either Sleep or Idle modes if Sleep or

Idle mode is active when the interrupt is generated.

The RETFIE (Return from Interrupt) instruction will

unstack the program counter and STATUS registers to

return the processor to its state prior to the interrupt

sequence.

If an enabled interrupt request of sufficient priority is

received by the interrupt controller, then the standard

interrupt request is presented to the processor. At the

same time, the processor will wake-up from Sleep or

Idle and begin execution of the Interrupt Service

Routine needed to process the interrupt request.

DS70141E-page 45

dsPIC30F3010/3011

DS70141E-page 46

dsPIC30F3010/3011

6.2

Run-Time Self-Programming

(RTSP)

6.0

FLASH PROGRAM MEMORY

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

RTSP is accomplished using TBLRD (table read) and

TBLWT(table write) instructions.

With RTSP, the user may erase program memory,

32 instructions (96 bytes) at a time and can write

program memory data, 32 instructions (96 bytes) at a

time.

6.3

Table Instruction Operation Summary

The TBLRDLand the TBLWTLinstructions are used to

read or write to bits<15:0> of program memory.

TBLRDLand TBLWTLcan access program memory in

Word or Byte mode.

The dsPIC30F family of devices contains internal

program Flash memory for executing user code. There

are two methods by which the user can program this

memory:

The TBLRDHand TBLWTHinstructions are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTHcan access program memory in Word or

Byte mode.

1. In-Circuit Serial Programming™ (ICSP™)

capabilities

2. Run-Time Self-Programming (RTSP)

A 24-bit program memory address is formed using

bits<7:0> of the TBLPAG register and the Effective

Address (EA) from a W register specified in the table

instruction, as shown in Figure 6-1.

6.1

In-Circuit Serial Programming

(ICSP)

dsPIC30F devices can be serially programmed while in

the end application circuit. This is simply done with two

lines for Programming Clock and Programming Data

(which are named PGC and PGD, respectively), and

three other lines for Power (VDD), Ground (VSS) and

Master Clear (MCLR). This allows customers to manu-

facture boards with unprogrammed devices, and then

program the microcontroller just before shipping the

product. This also allows the most recent firmware or a

custom firmware to be programmed.

FIGURE 6-1:

ADDRESSING FOR TABLE AND NVM REGISTERS

24 bits

Using

Program

Counter

Program Counter

0

NVMADR Reg EA

Using

NVMADR

1/0 NVMADRU Reg

Addressing

8 bits

16 bits

Working Reg EA

Using

Table

Instruction

1/0

TBLPAG Reg

8 bits

16 bits

Byte

Select

User/Configuration

Space Select

24-bit EA

DS70141E-page 47

dsPIC30F3010/3011

6.4

RTSP Operation

6.5

RTSP Control Registers

The dsPIC30F Flash program memory is organized

into rows and panels. Each row consists of 32 instruc-

tions or 96 bytes. Each panel consists of 128 rows or

4K x 24 instructions. RTSP allows the user to erase one

row (32 instructions) at a time and to program

32 instructions at one time.

The four SFRs used to read and write the program

Flash memory are:

• NVMCON

• NVMADR

• NVMADRU

• NVMKEY

Each panel of program memory contains write latches

that hold 32 instructions of programming data. Prior to

the actual programming operation, the write data must

be loaded into the panel write latches. The data to be

programmed into the panel is loaded in sequential

order into the write latches; instruction 0, instruction 1,

etc. The addresses loaded must always be from an

even group of 32 boundary.

6.5.1

NVMCON REGISTER

The NVMCON register controls which blocks are to be

erased, which memory type is to be programmed and

the start of the programming cycle.

6.5.2

NVMADR REGISTER

The NVMADR register is used to hold the lower two

bytes of the effective address. The NVMADR register

captures the EA<15:0> of the last table instruction that

has been executed and selects the row to write.

The basic sequence for RTSP programming is to set up

a Table Pointer, then do a series of TBLWTinstructions

to load the write latches. Programming is performed by

setting the special bits in the NVMCON register.

32 TBLWTL and four TBLWTH instructions are

required to load the 32 instructions.

6.5.3

NVMADRU REGISTER

The NVMADRU register is used to hold the upper byte

of the effective address. The NVMADRU register

captures the EA<23:16> of the last table instruction

that has been executed.

All of the table write operations are single-word writes

(2 instruction cycles), because only the table latches

are written.

After the latches are written, a programming operation

needs to be initiated to program the data.

6.5.4

NVMKEY REGISTER

The Flash program memory is readable, writable and

erasable during normal operation over the entire VDD

range.

NVMKEY is a write-only register that is used for write

protection. To start a programming or erase sequence,

the user must consecutively write 0x55 and 0xAA to the

NVMKEY register. Refer to Section 6.6 “Programming

Operations” for further details.

Note:

The user can also directly write to the

NVMADR and NVMADRU registers to

specify a program memory address for

erasing or programming.

DS70141E-page 48

dsPIC30F3010/3011

4. Write 32 instruction words of data from data

RAM “image” into the program Flash write

latches.

6.6

Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. A programming operation is nominally 2 msec in

duration and the processor stalls (waits) until the oper-

ation is finished. Setting the WR bit (NVMCON<15>)

starts the operation, and the WR bit is automatically

cleared when the operation is finished.

5. Program 32 instruction words into program

Flash.

a) Set up NVMCON register for multi-word,

program Flash, program and set WREN bit.

b) Write ‘0x55’ to NVMKEY.

c) Write ‘0xAA’ to NVMKEY.

6.6.1

PROGRAMMING ALGORITHM FOR

PROGRAM FLASH

d) Set the WR bit. This will begin program

cycle.

The user can erase or program one row of program

Flash memory at a time. The general process is:

e) CPU will stall for duration of the program

cycle.

f) The WR bit is cleared by the hardware

when program cycle ends.

1. Read one row of program Flash (32 instruction

words) and store into data RAM as a data

“image”.

6. Repeat steps 1 through 5 as needed to program

desired amount of program Flash memory.

2. Update the data image with the desired new

data.

6.6.2

ERASING A ROW OF PROGRAM

MEMORY

3. Erase program Flash row.

a) Set up NVMCON register for multi-word,

program Flash, erase and set WREN bit.

Example 6-1 shows a code sequence that can be used

to erase a row (32 instructions) of program memory.

b) Write address of row to be erased into

NVMADRU/NVMDR.

c) Write ‘0x55’ to NVMKEY.

d) Write ‘0xAA’ to NVMKEY.

e) Set the WR bit. This will begin erase cycle.

f) CPU will stall for the duration of the erase

cycle.

g) The WR bit is cleared when erase cycle

ends.

EXAMPLE 6-1:

ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write

; program memory selected, and writes enabled

MOV

#0x4041,W0

W0 NVMCON

;

; Initialize NVMCON SFR

,

; Init pointer to row to be ERASED

MOV

DISI

#tblpage(PROG_ADDR),W0

;

W0 NVMADRU

; Initialize PM Page Boundary SFR

; Initialize in-page EA[15:0] pointer

; Initialize NVMADR SFR

; Block all interrupts with priority <7

; for next 5 instructions

,

#tbloffset(PROG_ADDR),W0

W0, NVMADR

#5

MOV

BSET

NOP

#0x55,W0

W0 NVMKEY

; Write the 0x55 key

;

; Write the 0xAA key

; Start the erase sequence

; Insert two NOPs after the erase

; command is asserted

,

#0xAA,W1

W1 NVMKEY

,

NVMCON,#WR

DS70141E-page 49

dsPIC30F3010/3011

6.6.3

LOADING WRITE LATCHES

Example 6-2 shows a sequence of instructions that

can be used to load the 96 bytes of write latches.

32 TBLWTLand 32 TBLWTHinstructions are needed to

load the write latches selected by the Table Pointer.

EXAMPLE 6-2:

LOADING WRITE LATCHES

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV

#0x0000,W0

;

W0 TBLPAG

; Initialize PM Page Boundary SFR

; An example program memory address

,

#0x6000,W0

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV

#LOW_WORD_0,W2

#HIGH_BYTE_0,W3

;

TBLWTL W2 [W0]

; Write PM low word into program latch

; Write PM high byte into program latch

,

TBLWTH W3 [W0++]

,

; 1st_program_word

MOV

#LOW_WORD_1,W2

#HIGH_BYTE_1,W3

;

TBLWTL W2 [W0]

; Write PM low word into program latch

; Write PM high byte into program latch

,

TBLWTH W3 [W0++]

,

;

2nd_program_word

MOV

#LOW_WORD_2,W2

#HIGH_BYTE_2,W3

;

TBLWTL W2 [W0]

; Write PM low word into program latch

; Write PM high byte into program latch

,

TBLWTH W3 [W0++]

,

•

; 31st_program_word

MOV

#LOW_WORD_31,W2

#HIGH_BYTE_31,W3

;

TBLWTL W2 [W0]

; Write PM low word into program latch

; Write PM high byte into program latch

,

TBLWTH W3 [W0++]

,

Note: In Example 6-2, the contents of the upper byte of W3 have no effect.

6.6.4

INITIATING THE PROGRAMMING

SEQUENCE

For protection, the write initiate sequence for NVMKEY

must be used to allow any erase or program operation

to proceed. After the programming command has been

executed, the user must wait for the programming time

until programming is complete. The two instructions

following the start of the programming sequence

should be NOPs.

EXAMPLE 6-3:

INITIATING A PROGRAMMING SEQUENCE

DISI

#5

; Block all interrupts with priority <7

; for next 5 instructions

MOV

BSET

NOP

#0x55,W0

W0 NVMKEY

; Write the 0x55 key

;

; Write the 0xAA key

; Start the erase sequence

; Insert two NOPs after the erase

; command is asserted

,

#0xAA,W1

W1 NVMKEY

,

NVMCON,#WR

DS70141E-page 50

dsPIC30F3010/3011

DS70141E-page 51

dsPIC30F3010/3011

NOTES:

DS70141E-page 52

dsPIC30F3010/3011

A program or erase operation on the data EEPROM

does not stop the instruction flow. The user is respon-

sible for waiting for the appropriate duration of time

before initiating another data EEPROM write/erase

operation. Attempting to read the data EEPROM while

a programming or erase operation is in progress results

in unspecified data.

7.0

DATA EEPROM MEMORY

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

Control bit, WR, initiates write operations, similar to

program Flash writes. This bit cannot be cleared, only

set, in software. This bit is cleared in hardware at the

completion of the write operation. The inability to clear

the WR bit in software prevents the accidental or

premature termination of a write operation.

The data EEPROM memory is readable and writable

during normal operation over the entire VDD range. The

data EEPROM memory is directly mapped in the

program memory address space.

The WREN bit, when set, will allow a write operation.

On power-up, the WREN bit is clear. The WRERR bit is

set when a write operation is interrupted by a MCLR

Reset, or a WDT Time-out Reset, during normal oper-

ation. In these situations, following Reset, the user can

check the WRERR bit and rewrite the location. The

address register, NVMADR, remains unchanged.

The four SFRs used to read and write the program

Flash memory are used to access data EEPROM

memory as well. As described in Section 4.0

“Address Generator Units”, these registers are:

Note:

Interrupt flag bit, NVMIF in the IFS0

register, is set when the write is complete.

It must be cleared in software.

• NVMCON

• NVMADR

• NVMADRU

• NVMKEY

7.1

Reading the Data EEPROM

A TBLRD instruction reads a word at the current

program word address. This example uses W0 as a

pointer to data EEPROM. The result is placed in

register W4, as shown in Example 7-1.

The EEPROM data memory allows read and write of

single words and 16-word blocks. When interfacing to

data memory, NVMADR, in conjunction with the

NVMADRU register, is used to address the EEPROM

location being accessed. TBLRDLand TBLWTLinstruc-

tions are used to read and write data EEPROM. The

dsPIC30F3010/3011 devices have 1 Kbyte (512 words)

of data EEPROM, with an address range from

0x7FFC00 to 0x7FFFFE.

EXAMPLE 7-1:

DATA EEPROM READ

MOV

#LOW_ADDR_WORD,W0 ; Init Pointer

#HIGH_ADDR_WORD,W1

W1 TBLPAG

,

TBLRDL [ W0 ], W4

; read data EEPROM

A word write operation should be preceded by an erase

of the corresponding memory location(s). The write

typically requires 2 ms to complete, but the write time

will vary with voltage and temperature.

DS70141E-page 53

dsPIC30F3010/3011

7.2

Erasing Data EEPROM

7.2.1

ERASING A BLOCK OF DATA

EEPROM

In order to erase a block of data EEPROM, the

NVMADRU and NVMADR registers must initially

point to the block of memory to be erased. Configure

NVMCON for erasing a block of data EEPROM, and

set the ERASE and WREN bits in the NVMCON reg-

ister. Setting the WR bit initiates the erase, as shown

in Example 7-2.

EXAMPLE 7-2:

DATA EEPROM BLOCK ERASE

; Select data EEPROM block, ERASE, WREN bits

MOV

#0x4045,W0

W0 NVMCON

; Initialize NVMCON SFR

,

; Start erase cycle by setting WR after writing key sequence

DISI

#5

; Block all interrupts with priority <7

; for next 5 instructions

MOV

BSET

NOP

#0x55,W0

;

W0 NVMKEY

; Write the 0x55 key

;

; Write the 0xAA key

; Initiate erase sequence

,

#0xAA,W1

W1 NVMKEY

,

NVMCON,#WR

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

7.2.2

ERASING A WORD OF DATA

EEPROM

The TBLPAG and NVMADR registers must point to

the block. Select erase a block of data Flash, and set

the ERASE and WREN bits in the NVMCON register.

Setting the WR bit initiates the erase, as shown in

Example 7-3.

EXAMPLE 7-3:

DATA EEPROM WORD ERASE

; Select data EEPROM word, ERASE, WREN bits

MOV

#0x4044,W0

W0 NVMCON

,

; Start erase cycle by setting WR after writing key sequence

DISI

#5

; Block all interrupts with priority <7

; for next 5 instructions

MOV

BSET

NOP

#0x55,W0

;

W0 NVMKEY

; Write the 0x55 key

;

; Write the 0xAA key

; Initiate erase sequence

,

#0xAA,W1

W1 NVMKEY

,

NVMCON,#WR

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

DS70141E-page 54

dsPIC30F3010/3011

The write will not initiate if the above sequence is not

exactly followed (write 0x55 to NVMKEY, write 0xAA to

NVMCON, then set WR bit) for each word. It is strongly

recommended that interrupts be disabled during this

code segment.

7.3

Writing to the Data EEPROM

To write an EEPROM data location, the following

sequence must be followed:

1. Erase data EEPROM word.

a) Select the word, data EEPROM, erase and

set WREN bit in the NVMCON register.

Additionally, the WREN bit in NVMCON must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code

execution. The WREN bit should be kept clear at all

times, except when updating the EEPROM. The

WREN bit is not cleared by hardware.

b) Write the address of word to be erased into

the NVMADRU/NVMADR.

c) Enable the NVM interrupt (optional).

d) Write 0x55 to NVMKEY.

After a write sequence has been initiated, clearing the

WREN bit will not affect the current write cycle. The WR

bit will be inhibited from being set unless the WREN bit

is set. The WREN bit must be set on a previous instruc-

tion. Both WR and WREN cannot be set with the same

instruction.

e) Write 0xAA to NVMKEY.

f) Set the WR bit. This will begin the erase cycle.

g) Either poll the NVMIF bit or wait for the

NVMIF interrupt.

h) The WR bit is cleared when the erase cycle

ends.

At the completion of the write cycle, the WR bit is

cleared in hardware and the Nonvolatile Memory Write

Complete Interrupt Flag bit (NVMIF) is set. The user

may either enable this interrupt, or poll this bit. NVMIF

must be cleared by software.

2. Write the data word into the data EEPROM write

latches.

3. Program 1 data word into the data EEPROM.

a) Select the word, data EEPROM, program and

set the WREN bit in the NVMCON register.

7.3.1

WRITING A WORD OF DATA

EEPROM

b) Enable the NVM write done interrupt

(optional).

c) Write 0x55 to NVMKEY.

d) Write 0xAA to NVMKEY.

Once the user has erased the word to be programmed,

then a table write instruction is used to write one write

latch, as shown in Example 7-4.

e) Set the WR bit. This will begin the program

cycle.

f) Either poll the NVMIF bit or wait for the

NVM interrupt.

g) The WR bit is cleared when the write cycle

ends.

EXAMPLE 7-4:

DATA EEPROM WORD WRITE

; Point to data memory

MOV

#LOW_ADDR_WORD,W0

#HIGH_ADDR_WORD,W1

; Init pointer

MOV

W1 TBLPAG

,

MOV

#LOW(WORD),W2

; Get data

TBLWTL

W2 [ W0]

; Write data

,

; The NVMADR captures last table access address

; Select data EEPROM for 1 word op

MOV

#0x4004,W0

W0 NVMCON

,

; Operate key to allow write operation

DISI

#5

; Block all interrupts with priority <7

; for next 5 instructions

MOV

BSET

NOP

#0x55,W0

W0 NVMKEY

; Write the 0x55 key

,

#0xAA,W1

W1 NVMKEY

; Write the 0xAA key

; Initiate program sequence

,

NVMCON,#WR

; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

DS70141E-page 55

dsPIC30F3010/3011

7.3.2

WRITING A BLOCK OF DATA

EEPROM

To write a block of data EEPROM, write to all sixteen

latches first, then set the NVMCON register and

program the block.

EXAMPLE 7-5:

DATA EEPROM BLOCK WRITE

MOV

#LOW_ADDR_WORD,W0 ; Init pointer

#HIGH_ADDR_WORD,W1

MOV

W1 TBLPAG

,

MOV

#data1,W2

; Get 1st data

TBLWTL

MOV

W2 [ W0]++

#data2,W2

; write data

; Get 2nd data

,

TBLWTL

MOV

W2 [ W0]++

#data3,W2

; write data

; Get 3rd data

,

TBLWTL

MOV

W2 [ W0]++

#data4,W2

; write data

; Get 4th data

,

TBLWTL

MOV

W2 [ W0]++

#data5,W2

; write data

; Get 5th data

,

TBLWTL

MOV

W2 [ W0]++

#data6,W2

; write data

; Get 6th data

,

TBLWTL

MOV

W2 [ W0]++

#data7,W2

; write data

; Get 7th data

,

TBLWTL

MOV

W2 [ W0]++

#data8,W2

; write data

; Get 8th data

,

TBLWTL

MOV

W2 [ W0]++

#data9,W2

; write data

; Get 9th data

,

TBLWTL

MOV

W2 [ W0]++

#data10,W2

; write data

; Get 10th data

,

TBLWTL

MOV

W2 [ W0]++

#data11,W2

; write data

; Get 11th data

,

TBLWTL

MOV

W2 [ W0]++

#data12,W2

; write data

; Get 12th data

,

TBLWTL

MOV

W2 [ W0]++

#data13,W2

; write data

; Get 13th data

,

TBLWTL

MOV

W2 [ W0]++

#data14,W2

; write data

; Get 14th data

,

TBLWTL

MOV

W2 [ W0]++

#data15,W2

; write data

; Get 15th data

,

TBLWTL

MOV

W2 [ W0]++

#data16,W2

; write data

; Get 16th data

,

TBLWTL

MOV

W2 [ W0]++

#0x400A,W0

; write data. The NVMADR captures last table access address.

; Select data EEPROM for multi word op

; Operate Key to allow program operation

; Block all interrupts with priority <7

; for next 5 instructions

,

W0 NVMCON

,

DISI

#5

MOV

BSET

NOP

#0x55,W0

W0 NVMKEY

; Write the 0x55 key

,

#0xAA,W1

W1 NVMKEY

; Write the 0xAA key

; Start write cycle

,

NVMCON,#WR

DS70141E-page 56

dsPIC30F3010/3011

7.4

Write Verify

7.5

Protection Against Spurious Write

Depending on the application, good programming

practice may dictate that the value written to the

memory should be verified against the original value.

This should be used in applications where excessive

writes can stress bits near the specification limit.

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared;

also, the Power-up Timer prevents EEPROM write.

The write initiate sequence, and the WREN bit

together, help prevent an accidental write during

brown-out, power glitch or software malfunction.

DS70141E-page 57

dsPIC30F3010/3011

NOTES:

DS70141E-page 58

dsPIC30F3010/3011

Writes to the latch, write the latch (LATx). Reads from

the port (PORTx), read the port pins, and writes to the

port pins, write the latch (LATx).

8.0

I/O PORTS

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabled. That means the corresponding LATx and

TRISx registers and the port pin will read as zeros.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nevertheless

regarded as a dedicated port because there is no

other competing source of outputs. An example is the

INT4 pin.

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared between the peripherals and

the parallel I/O ports.

The format of the registers for PORTx is shown in

Table 8-1.

All I/O input ports feature Schmitt Trigger inputs for

improved noise immunity.

The TRISx register controls the direction of the pins.

The LATx register supplies data to the outputs and is

readable/writable. Reading the PORTx register yields

the state of the input pins, while writing the PORTx

register modifies the contents of the LATx register.

8.1

Parallel I/O (PIO) Ports

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

may be read, but the output driver for the parallel port

bit will be disabled. If a peripheral is enabled, but the

peripheral is not actively driving a pin, that pin may be

driven by a port.

A Parallel I/O (PIO) port that shares a pin with a periph-

eral is, in general, subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has ownership of the output data and control signals of

the I/O pad cell. Figure 8-2 shows how ports are shared

with other peripherals, and the associated I/O cell (pad)

to which they are connected. Table 8-1 shows the

formats of the registers for the shared ports, PORTB

through PORTF.

All port pins have three registers directly associated

with the operation of the port pin. The Data Direction

register (TRISx) determines whether the pin is an input

or an output. If the data direction bit is a ‘1’, then the pin

is an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx), read the latch.

FIGURE 8-1:

BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

Dedicated Port Module

Read TRIS

I/O Cell

TRIS Latch

D

Q

Data Bus

WR TRIS

CK

Data Latch

I/O Pad

D

Q

WR LAT +

WR PORT

CK

Read LAT

Read PORT

DS70141E-page 59

dsPIC30F3010/3011

FIGURE 8-2:

BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

Output Multiplexers

Peripheral Module

Peripheral Input Data

Peripheral Module Enable

I/O Cell

Peripheral Output Enable

Peripheral Output Data

1

0

Output Enable

1

0

PIO Module

Output Data

Read TRIS

I/O Pad

Data Bus

WR TRIS

D

Q

CK

TRIS Latch

D

Q

WR LAT +

WR PORT

CK

Data Latch

Read LAT

Input Data

Read PORT

8.2.1

I/O PORT WRITE/READ TIMING

8.2

Configuring Analog Port Pins

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically this instruction

would be a NOP.

The use of the ADPCFG and TRIS registers control the

operation of the A/D port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared

(output), the digital output level (VOH or VOL) will be

converted.

EXAMPLE 8-1:

PORT WRITE/READ

EXAMPLE

When reading the PORT register, all pins configured as

analog input channel will read as cleared (a low level).

MOV

0xFF00, W0 ; Configure PORTB<15:8>

; as inputs

Pins configured as digital inputs will not convert an

analog input. Analog levels on any pin that is defined as

a digital input (including the ANx pins), may cause the

input buffer to consume current that exceeds the

device specifications.

MOV

NOP

W0, TRISBB ; and PORTB<7:0> as outputs

; Delay 1 cycle

BTSS PORTB, #13 ; Next Instruction

DS70141E-page 60

dsPIC30F3010/3011

DS70141E-page 61

dsPIC30F3010/3011

DS70141E-page 62

dsPIC30F3010/3011

8.3

Input Change Notification Module

The input change notification module provides the

dsPIC30F devices the ability to generate interrupt

requests to the processor in response to a Change-Of-

State (COS) on selected input pins. This module is

capable of detecting input Change-Of-States, even in

Sleep mode, when the clocks are disabled. There are

10 external signals (CN0 through CN7, CN17 and

CN18) that may be selected (enabled) for generating

an interrupt request on a Change-Of-State.

Please refer to the Pin Diagrams for CN pin locations.

TABLE 8-3:

INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)⁽¹⁾

SFR Name Addr.

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

Reset State

CNEN1

CNPU1

Note 1:

00C0

CN7IE

CN6IE

CN5IE

CN4IE

CN3IE

CN2IE

CN1IE

CN0IE

0000 0000 0000 0000

00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE

CN2PUE

CN1PUE

CN0PUE 0000 0000 0000 0000

Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

DS70141E-page 63

dsPIC30F3010/3011

NOTES:

DS70141E-page 64

dsPIC30F3010/3011

These operating modes are determined by setting the

appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1

presents a block diagram of the 16-bit timer module.

9.0

TIMER1 MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

16-Bit Timer Mode: In the 16-Bit Timer mode, the

timer increments on every instruction cycle up to a

match value, preloaded into the Period register, PR1,

then resets to ‘0’ and continues to count.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the TSIDL (T1CON<13>)

bit = 0. If TSIDL = 1, the timer module logic will resume

the incrementing sequence upon termination of the

CPU Idle mode.

This section describes the 16-bit general purpose

Timer1 module and associated operational modes.

Figure 9-1 depicts the simplified block diagram of the

16-bit Timer1 module.

16-bit Synchronous Counter Mode: In the 16-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in PR1,

then resets to ‘0’ and continues.

Note:

Timer1 is a ‘Type A’ timer. Please refer to

the specifications for a Type A timer in Sec-

tion 23.0 “Electrical Characteristics” of

this document.

The following sections provide a detailed description,

including setup and control registers along with associ-

ated block diagrams for the operational modes of the

timers.

When the CPU goes into the Idle mode, the timer will

stop incrementing, unless the respective TSIDL bit = 0.

If TSIDL = 1, the timer module logic will resume the

incrementing sequence upon termination of the CPU

Idle mode.

The Timer1 module is a 16-bit timer which can serve as

the time counter for the Real-time Clock (RTC), or oper-

ate as a free-running interval timer/counter. The 16-bit

timer has the following modes:

16-Bit Asynchronous Counter Mode: In the 16-Bit

Asynchronous Counter mode, the timer increments on

every rising edge of the applied external clock signal.

The timer counts up to a match value preloaded in PR1,

then resets to ‘0’ and continues.

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

When the timer is configured for the Asynchronous mode

of operation and the CPU goes into the Idle mode, the

timer will stop incrementing if TSIDL = 1.

Further, the following operational characteristics are

supported:

• Timer gate operation

• Selectable prescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

DS70141E-page 65

dsPIC30F3010/3011

FIGURE 9-1:

16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)

PR1

Comparator x 16

TMR1

Equal

Reset

TSYNC

1

Sync

0

1

T1IF

Event Flag

Q

D

TGATE

Q

CK

TGATE

TCKPS<1:0>

2

TON

SOSCO/

T1CK

1X

Gate

Sync

Prescaler

1, 8, 64, 256

LPOSCEN

0 1

00

SOSCI

TCY

9.1

Timer Gate Operation

9.3

Timer Operation During Sleep

Mode

The 16-bit timer can be placed in the Gated Time

Accumulation mode. This mode allows the internal TCY

to increment the respective timer when the gate input

signal (T1CK pin) is asserted high. Control bit, TGATE

(T1CON<6>), must be set to enable this mode. The

timer must be enabled (TON = 1) and the timer clock

source set to internal (TCS = 0).

During CPU Sleep mode, the timer will operate if:

• The timer module is enabled (TON = 1) and

• The timer clock source is selected as external

(TCS = 1) and

• The TSYNC bit (T1CON<2>) is asserted to a logic

‘0’, which defines the external clock source as

asynchronous

When the CPU goes into the Idle mode, the timer will

stop incrementing unless TSIDL = 0. If TSIDL = 1, the

timer will resume the incrementing sequence upon

termination of the CPU Idle mode.

When all three conditions are true, the timer will

continue to count up to the Period register and be reset

to 0x0000.

9.2

Timer Prescaler

When a match between the timer and the Period

register occurs, an interrupt can be generated, if the

respective timer interrupt enable bit is asserted.

The input clock (FOSC/4 or external clock) to the 16-bit

Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256,

selected by control bits, TCKPS<1:0> (T1CON<5:4>).

The prescaler counter is cleared when any of the

following occurs:

• a write to the TMR1 register

• clearing of the TON bit (T1CON<15>)

• device Reset such as POR and BOR

However, if the timer is disabled (TON = 0), then the

timer prescaler cannot be reset since the prescaler

clock is halted.

TMR1 is not cleared when T1CON is written. It is

cleared by writing to the TMR1 register.

DS70141E-page 66

dsPIC30F3010/3011

9.5.1

RTC OSCILLATOR OPERATION

9.4

Timer Interrupt

When the TON = 1, TCS = 1and TGATE = 0, the timer

increments on the rising edge of the 32 kHz LP oscilla-

tor output signal, up to the value specified in the Period

register, and is then reset to ‘0’.

The 16-bit timer has the ability to generate an interrupt

on period match. When the timer count matches the

Period register, the T1IF bit is asserted and an interrupt

will be generated, if enabled. The T1IF bit must be

cleared in software. The Timer Interrupt Flag, T1IF, is

located in the IFS0 Control register in the interrupt

controller.

The TSYNC bit must be asserted to a logic ‘0’

(Asynchronous mode) for correct operation.

Enabling LPOSCEN (OSCCON<1>) will disable the

normal Timer and Counter modes and enable a timer

carry-out wake-up event.

When the Gated Time Accumulation mode is enabled,

an interrupt will also be generated on the falling edge of

the gate signal (at the end of the accumulation cycle).

When the CPU enters Sleep mode, the RTC will

continue to operate, provided the 32 kHz external

crystal oscillator is active and the control bits have not

been changed. The TSIDL bit should be cleared to ‘0’

in order for RTC to continue operation in Idle mode.

Enabling an interrupt is accomplished via the

respective Timer Interrupt Enable bit, T1IE. The timer

interrupt enable bit is located in the IEC0 Control

register in the interrupt controller.

9.5.2

RTC INTERRUPTS

9.5

Real-Time Clock

When an interrupt event occurs, the respective

interrupt flag, T1IF, is asserted and an interrupt will be

generated, if enabled. The T1IF bit must be cleared in

software. The respective Timer Interrupt Flag, T1IF, is

located in the IFS0 register in the interrupt controller.

Timer1, when operating in Real-Time Clock (RTC)

mode, provides time-of-day and event time-stamping

capabilities. Key operational features of the RTC are:

• Operation from 32 kHz LP oscillator

• 8-bit prescaler

Enabling an interrupt is accomplished via the

respective Timer Interrupt Enable bit, T1IE. The timer

interrupt enable bit is located in the IEC0 Control

register in the interrupt controller.

• Low power

• Real-Time Clock interrupts

These operating modes are determined by setting the

appropriate bit(s) in the T1CON control register

FIGURE 9-2:

RECOMMENDED

COMPONENTS FOR

TIMER1 LP OSCILLATOR

RTC

C1

SOSCI

32.768 kHz

XTAL

dsPIC30FXXXX

SOSCO

C2

R

C1 = C2 = 18 pF; R = 100K

DS70141E-page 67

dsPIC30F3010/3011

DS70141E-page 68

dsPIC30F3010/3011

For 32-bit timer/counter operation, Timer2 is the lsw

and Timer3 is the msw of the 32-bit timer.

10.0 TIMER2/3 MODULE

Note:

This data sheet summarizes features of

Note:

For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits

are used for setup and control. Timer2

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer3 Interrupt Flag

(T3IF) and the interrupt is enabled with the

Timer3 Interrupt Enable bit (T3IE).

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

This section describes the 32-bit general purpose timer

module (Timer2/3) and associated operational modes.

Figure 10-1 depicts the simplified block diagram of the

32-bit Timer2/3 module. Figure 10-2 and Figure 10-3

show Timer2/3 configured as two independent 16-bit

timers; Timer2 and Timer3, respectively.

16-Bit Mode: In the 16-bit mode, Timer2 and Timer3

can be configured as two independent 16-bit timers.

Each timer can be set up in either 16-bit Timer mode or

16-bit Synchronous Counter mode. See Section 9.0

“Timer1 Module” for details on these two operating

modes.

Note:

Timer2 is a ‘Type B’ timer and Timer3 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 23.0

“Electrical Characteristics” of this

document.

The only functional difference between Timer2 and

Timer3 is that Timer2 provides synchronization of the

clock prescaler output. This is useful for high-frequency

external clock inputs.

32-Bit Timer Mode: In the 32-Bit Timer mode, the

timer increments on every instruction cycle up to a

match value, preloads into the combined 32-bit Period

register, PR3/PR2, then resets to ‘0’ and continues to

count.

The Timer2/3 module is a 32-bit timer, which can be

configured as two 16-bit timers, with selectable operat-

ing modes. These timers are utilized by other

peripheral modules such as:

• Input Capture

For synchronous 32-bit reads of the Timer2/Timer3

pair, reading the lsw (TMR2 register) will cause the

msw to be read and latched into a 16-bit holding

register, termed TMR3HLD.

• Output Compare/Simple PWM

The following sections provide a detailed description,

including setup and control registers, along with

associated block diagrams for the operational modes of

the timers.

For synchronous 32-bit writes, the holding register

(TMR3HLD) must first be written to. When followed by

a write to the TMR2 register, the contents of TMR3HLD

will be transferred and latched into the MSB of the

32-bit timer (TMR3).

The 32-bit timer has the following modes:

• Two independent 16-bit timers (Timer2 and

Timer3) with all 16-bit operating modes (except

Asynchronous Counter mode)

32-Bit Synchronous Counter Mode: In the 32-Bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in the

combined 32-bit Period register, PR3/PR2, then resets

to ‘0’ and continues.

• Single 32-bit timer operation

• Single 32-bit synchronous counter

Further, the following operational characteristics are

supported:

• ADC Event Trigger

When the timer is configured for the Synchronous

Counter mode of operation and the CPU goes into the

Idle mode, the timer will stop incrementing unless the

TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer

module logic will resume the incrementing sequence

upon termination of the CPU Idle mode.

• Timer Gate Operation

• Selectable Prescaler Settings

• Timer Operation during Idle and Sleep modes

• Interrupt on a 32-Bit Period Register Match

These operating modes are determined by setting the

appropriate bit(s) in the 16-bit T2CON and T3CON

SFRs.

DS70141E-page 69

dsPIC30F3010/3011

FIGURE 10-1:

32-BIT TIMER2/3 BLOCK DIAGRAM

Data Bus<15:0>

TMR3HLD

16

Write TMR2

Read TMR2

16

Reset

TMR3

TMR2

LSB

Sync

MSB

ADC Event Trigger

Comparator x 32

Equal

PR3

PR2

0

1

T3IF

Event Flag

Q

D

TGATE(T2CON<6>)

CK

TGATE

(T2CON<6>)

TCKPS<1:0>

2

TON

T2CK

1X

Prescaler

1, 8, 64, 256

Gate

Sync

01

00

TCY

Note:

Timer Configuration bit, T32 T2CON(<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T2CON register.

DS70141E-page 70

dsPIC30F3010/3011

FIGURE 10-2:

16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER)

PR2

Comparator x 16

TMR2

Equal

Reset

Sync

0

1

T2IF

Event Flag

Q

D

TGATE

CK

TGATE

TCKPS<1:0>

2

TON

T2CK

1X

01

00

Prescaler

1, 8, 64, 256

Gate

Sync

TCY

FIGURE 10-3:

16-BIT TIMER3 BLOCK DIAGRAM (TYPE C TIMER)

PR3

ADC Event Trigger

Equal

Reset

Comparator x 16

TMR3

0

1

T3IF

Event Flag

Q

D

TGATE

CK

TGATE

TCKPS<1:0>

2

TON

Sync

TCY

1X

01

00

Prescaler

1, 8, 64, 256

Note:

The dsPIC30F3010/3011 devices do not have external pin inputs to Timer3. In these devices, the following

modes should not be used:

1. TCS = 1

2. TCS = 0and TGATE = 1(Gated Time Accumulation)

DS70141E-page 71

dsPIC30F3010/3011

10.1 Timer Gate Operation

10.4 Timer Operation During Sleep

Mode

The 32-bit timer can be placed in the Gated Time

Accumulation mode. This mode allows the internal TCY

to increment the respective timer when the gate input

signal (T2CK pin) is asserted high. Control bit, TGATE

(T2CON<6>), must be set to enable this mode. When

in this mode, Timer2 is the originating clock source.

The TGATE setting is ignored for Timer3. The timer

must be enabled (TON = 1) and the timer clock source

set to internal (TCS = 0).

During CPU Sleep mode, the timer will not operate,

because the internal clocks are disabled.

10.5 Timer Interrupt

The 32-bit timer module can generate an interrupt-on-

period match, or on the falling edge of the external gate

signal. When the 32-bit timer count matches the

respective 32-bit Period register, or the falling edge of

the external “gate” signal is detected, the T3IF bit

(IFS0<7>) is asserted and an interrupt will be gener-

ated if enabled. In this mode, the T3IF interrupt flag is

used as the source of the interrupt. The T3IF bit must

be cleared in software.

The falling edge of the external signal terminates the

count operation, but does not reset the timer. The user

must reset the timer in order to start counting from zero.

10.2 ADC Event Trigger

When a match occurs between the 32-bit timer (TMR3/

TMR2) and the 32-bit combined Period register (PR3/

PR2), a special ADC trigger event signal is generated

by Timer3.

Enabling an interrupt is accomplished via the

respective Timer Interrupt Enable bit, T3IE (IEC0<7>).

10.3 Timer Prescaler

The input clock (FOSC/4 or external clock) to the timer

has a prescale option of 1:1, 1:8, 1:64 and 1:256,

selected by control bits, TCKPS<1:0> (T2CON<5:4>

and T3CON<5:4>). For the 32-bit timer operation, the

originating clock source is Timer2. The prescaler

operation for Timer3 is not applicable in this mode. The

prescaler counter is cleared when any of the following

occurs:

• a write to the TMR2/TMR3 register

• clearing either of the TON (T2CON<15> or

T3CON<15>) bits to ‘0’

• device Reset such as POR and BOR

However, if the timer is disabled (TON = 0), then the

Timer2 prescaler cannot be reset, since the prescaler

clock is halted.

TMR2/TMR3 is not cleared when T2CON/T3CON is

written.

DS70141E-page 72

dsPIC30F3010/3011

DS70141E-page 73

dsPIC30F3010/3011

NOTES:

DS70141E-page 74

dsPIC30F3010/3011

The Timer4/5 module is similar in operation to the

Timer 2/3 module. However, there are some

differences, which are as follows:

11.0 TIMER4/5 MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• The Timer4/5 module does not support the ADC

event trigger feature

• Timer4/5 can not be utilized by other peripheral

modules such as input capture and output compare

The operating modes of the Timer4/5 module are

determined by setting the appropriate bit(s) in the 16-bit

T4CON and T5CON SFRs.

This section describes the second 32-bit general

purpose timer module (Timer4/5) and associated

operational modes. Figure 11-1 depicts the simplified

block diagram of the 32-bit Timer4/5 module.

Figure 11-2 and Figure 11-3 show Timer4/5 configured

as two independent 16-bit timers, Timer4 and Timer5,

respectively.

For 32-bit timer/counter operation, Timer4 is the lsw

and Timer5 is the msw of the 32-bit timer.

Note:

For 32-bit timer operation, T5CON control

bits are ignored. Only T4CON control bits

are used for setup and control. Timer4

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer5 Interrupt Flag

(T5IF) and the interrupt is enabled with the

Timer5 Interrupt Enable bit (T5IE).

Note:

Timer4 is a ‘Type B’ timer and Timer5 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 23.0

“Electrical Characteristics” of this

document.

FIGURE 11-1:

32-BIT TIMER4/5 BLOCK DIAGRAM

Data Bus<15:0>

TMR5HLD

16

Write TMR4

Read TMR4

16

Reset

TMR5

MSB

TMR4

LSB

Sync

Comparator x 32

Equal

PR5

PR4

0

1

T5IF

Event Flag

Q

D

TGATE(T4CON<6>)

CK

TGATE

(T4CON<6>)

TCKPS<1:0>

TON

2

1x

Prescaler

1, 8, 64, 256

Gate

01

00

Sync

TCY

Note:

Timer configuration bit, T32 T4CON(<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All

control bits are respective to the T4CON register.

The dsPIC30F3010/3011 devices do not have external pin inputs to Timer4 or Timer5. In these devices,

the following modes should not be used:

1. TCS = 1

2. TCS = 0and TGATE = 1(Gated Time Accumulation)

DS70141E-page 75

dsPIC30F3010/3011

FIGURE 11-2:

16-BIT TIMER4 BLOCK DIAGRAM (TYPE B TIMER)

PR4

Comparator x 16

TMR4

Equal

Reset

Sync

0

1

T4IF

Event Flag

Q

D

TGATE

CK

TGATE

TCKPS<1:0>

2

TON

1x

Prescaler

1, 8, 64, 256

Gate

Sync

01

00

TCY

Note:

The dsPIC30F3010/3011 devices do not have external pin inputs to Timer4 or Timer5. In these devices,

the following modes should not be used:

1. TCS = 1

2. TCS = 0and TGATE = 1(Gated Time Accumulation)

DS70141E-page 76

dsPIC30F3010/3011

FIGURE 11-3:

16-BIT TIMER5 BLOCK DIAGRAM (TYPE C TIMER)

PR5

Comparator x 16

TMR5

Equal

Reset

ADC Event Trigger

0

1

T5IF

Event Flag

Q

D

TGATE

Q

CK

TGATE

TCKPS<1:0>

2

TON

Sync

TCY

1x

Prescaler

1, 8, 64, 256

01

00

Note:

The dsPIC30F3010/3011 devices do not have external pin inputs to Timer4 or Timer5. In these devices,

the following modes should not be used:

1. TCS = 1

2. TCS = 0and TGATE = 1(Gated Time Accumulation)

DS70141E-page 77

dsPIC30F3010/3011

DS70141E-page 78

dsPIC30F3010/3011

The key operational features of the input capture

module are:

12.0 INPUT CAPTURE MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• Simple Capture Event mode

• Timer2 and Timer3 mode selection

• Interrupt on input capture event

These operating modes are determined by setting

the appropriate bits in the ICxCON register

(where x = 1,2,...,N).

Note:

The dsPIC30F3010/3011 devices have

four capture channels. The channels are

designated IC1, IC2, IC7 and IC8 to

maintain software compatibility with other

dsPIC30F devices.

This section describes the input capture module and

associated operational modes. The features provided by

this module are useful in applications requiring

frequency (period) and pulse measurement. Figure 12-1

depicts a block diagram of the input capture module.

Input capture is useful for such modes as:

• Frequency/Period/Pulse Measurements

• Additional Sources of External Interrupts

FIGURE 12-1:

INPUT CAPTURE MODE BLOCK DIAGRAM

T3_CNT

16

T2_CNT

From General Purpose Timer Module

16

ICx

ICTMR

1

0

Edge

Detection

Logic

FIFO

R/W

Logic

Prescaler

1, 4, 16

Clock

Synchronizer

3

ICM<2:0>

Mode Select

ICxBUF

ICBNE, ICOV

ICI<1:0>

Interrupt

Logic

ICxCON

Data Bus

Set Flag

ICxIF

Note:

Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture

channels, 1 through N.

DS70141E-page 79

dsPIC30F3010/3011

12.1.3

TIMER2 AND TIMER3 SELECTION

MODE

12.1 Simple Capture Event Mode

The simple capture events in the dsPIC30F product

family are:

Each capture channel can select between one of two

timers for the time base, Timer2 or Timer3.

• Capture every falling edge

Selection of the timer resource is accomplished

through SFR bit, ICTMR (ICxCON<7>). Timer3 is the

default timer resource available for the input capture

module.

• Capture every rising edge

• Capture every 4th rising edge

• Capture every 16th rising edge

• Capture every rising and falling edge

12.1.4

HALL SENSOR MODE

These simple Input Capture modes are configured by

setting the appropriate bits, ICM<2:0> (ICxCON<2:0>).

When the input capture module is set for capture on

every edge, rising and falling, ICM<2:0> = 001, the

following operations are performed by the input

capture logic:

12.1.1

CAPTURE PRESCALER

There are four input capture prescaler settings, speci-

fied by bits, ICM<2:0> (ICxCON<2:0>). Whenever the

capture channel is turned off, the prescaler counter will

be cleared. In addition, any Reset will clear the

prescaler counter.

• The input capture interrupt flag is set on every

edge, rising and falling.

• The interrupt on Capture Mode Setting bits,

ICI<1:0>, is ignored, since every capture

generates an interrupt.

12.1.2

CAPTURE BUFFER OPERATION

• A capture overflow condition is not generated in

this mode.

Each capture channel has an associated FIFO buffer,

which is four 16-bit words deep. There are two status

flags, which provide status on the FIFO buffer:

12.2 Input Capture Operation During

Sleep and Idle Modes

• ICBNE — Input Capture Buffer Not Empty

• ICOV — Input Capture Overflow

An input capture event will generate a device wake-up

or interrupt, if enabled, if the device is in CPU Idle or

Sleep mode.

The ICBNE will be set on the first input capture event

and remain set until all capture events have been read

from the FIFO. As each word is read from the FIFO, the

remaining words are advanced by one position within

the buffer.

Independent of the timer being enabled, the input

capture module will wake-up from the CPU Sleep or Idle

mode when a capture event occurs if ICM<2:0> = 111

and the interrupt enable bit is asserted. The same wake-

up can generate an interrupt if the conditions for

processing the interrupt have been satisfied. The wake-

up feature is useful as a method of adding extra external

pin interrupts.

In the event that the FIFO is full with four capture

events and a fifth capture event occurs prior to a read

of the FIFO, an overflow condition will occur and the

ICOV bit will be set to a logic ‘1’. The fifth capture event

is lost and is not stored in the FIFO. No additional

events will be captured till all four events have been

read from the buffer.

12.2.1

INPUT CAPTURE IN CPU SLEEP

MODE

If a FIFO read is performed after the last read and no

new capture event has been received, the read will

yield indeterminate results.

CPU Sleep mode allows input capture module opera-

tion with reduced functionality. In the CPU Sleep

mode, the ICI<1:0> bits are not applicable, and the

input capture module can only function as an external

interrupt source.

The capture module must be configured for interrupt

only on the rising edge (ICM<2:0> = 111) in order for

the input capture module to be used while the device

is in Sleep mode. The prescale settings of 4:1 or 16:1

are not applicable in this mode.

DS70141E-page 80

dsPIC30F3010/3011

12.2.2

INPUT CAPTURE IN CPU IDLE

MODE

12.3 Input Capture Interrupts

The input capture channels have the ability to generate

an interrupt based upon the selected number of

capture events. The selection number is set by control

bits, ICI<1:0> (ICxCON<6:5>).

CPU Idle mode allows input capture module operation

with full functionality. In the CPU Idle mode, the Inter-

rupt mode selected by the ICI<1:0> bits is applicable, as

well as the 4:1 and 16:1 capture prescale settings,

which are defined by control bits, ICM<2:0>. This mode

requires the selected timer to be enabled. Moreover, the

ICSIDL bit must be asserted to a logic ‘0’.

Each channel provides an interrupt flag (ICxIF) bit. The

respective capture channel interrupt flag is located in

the corresponding IFSx register.

Enabling an interrupt is accomplished via the respec-

tive Input Capture Channel Interrupt Enable (ICxIE) bit.

The capture interrupt enable bit is located in the

corresponding IEC Control register.

If the input capture module is defined as ICM<2:0> = 111

in CPU Idle mode, the input capture pin will serve only as

an external interrupt pin.

DS70141E-page 81

dsPIC30F3010/3011

DS70141E-page 82

dsPIC30F3010/3011

The key operational features of the output compare

module include:

13.0 OUTPUT COMPARE MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• Timer2 and Timer3 Selection mode

• Simple Output Compare Match mode

• Dual Output Compare Match mode

• Simple PWM mode

• Output Compare during Sleep and Idle modes

• Interrupt on Output Compare/PWM Event

These operating modes are determined by setting the

appropriate bits in the 16-bit OCxCON SFR (where

x = 1,2,3,...,N). The dsPIC30F3010/3011 devices have

4/2 compare channels, respectively.

This section describes the output compare module and

associated operational modes. The features provided

by this module are useful in applications requiring

operational modes such as:

OCxRS and OCxR in the figure represent the Dual

Compare registers. In the Dual Compare mode, the

OCxR register is used for the first compare and OCxRS

is used for the second compare.

• Generation of Variable Width Output Pulses

• Power Factor Correction

Figure 13-1 depicts a block diagram of the output

compare module.

FIGURE 13-1:

OUTPUT COMPARE MODE BLOCK DIAGRAM

Set Flag bit

OCxIF

OCxRS

OCxR

Output

Logic

S

R

Q

OCx

Output Enable

3

OCM<2:0>

Mode Select

OCFA

Comparator

(for x = 1, 2, 3 or 4)

OCTSEL

1

0

From GP Timer Module

T3P3_MATCH

TMR3<15:0>

T2P2_MATCH

TMR2<15:0

Note:

Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels,

1 through N.

DS70141E-page 83

dsPIC30F3010/3011

13.3.2

CONTINUOUS PULSE MODE

13.1 Timer2 and Timer3 Selection Mode

For the user to configure the module for the generation

of a continuous stream of output pulses, the following

steps are required:

Each output compare channel can select between one

of two 16-bit timers: Timer2 or Timer3.

The selection of the timers is controlled by the OCTSEL

bit (OCxCON<3>). Timer2 is the default timer resource

for the output compare module.

• Determine instruction cycle time, TCY.

• Calculate desired pulse value based on TCY.

• Calculate timer to start pulse-width from timer

start value of 0x0000.

13.2 Simple Output Compare Match

Mode

• Write pulse-width start and stop times into OCxR

and OCxRS (x denotes channel 1, 2, ...,N)

Compare registers, respectively.

When control bits, OCM<2:0> (OCxCON<2:0>) = 001,

010 or 011, the selected output compare channel is

configured for one of three simple output compare

match modes:

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register.

• Set OCM<2:0> = 101.

• Compare forces I/O pin low

• Compare forces I/O pin high

• Compare toggles I/O pin

• Enable timer, TON (TxCON<15>) = 1.

13.4 Simple PWM Mode

The OCxR register is used in these modes. The OCxR

register is loaded with a value and is compared to the

selected incrementing timer count. When a compare

occurs, one of these Compare Match modes occurs. If

the counter resets to zero before reaching the value in

OCxR, the state of the OCx pin remains unchanged.

When control bits, OCM<2:0> (OCxCON<2:0>) = 110

or 111, the selected output compare channel is config-

ured for the PWM mode of operation. When configured

for the PWM mode of operation, OCxR is the main latch

(read-only) and OCxRS is the secondary latch. This

enables glitchless PWM transitions.

The user must perform the following steps in order to

configure the output compare module for PWM

operation:

13.3 Dual Output Compare Match Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 100

or 101, the selected output compare channel is config-

ured for one of two Dual Output Compare modes,

which are:

1. Set the PWM period by writing to the appropriate

Period register.

2. Set the PWM duty cycle by writing to the OCxRS

register.

• Single Output Pulse mode

• Continuous Output Pulse mode

3. Configure the output compare module for PWM

operation.

13.3.1

SINGLE PULSE MODE

4. Set the TMRx prescale value and enable the

For the user to configure the module for the generation

of a single output pulse, the following steps are

required (assuming timer is off):

timer, TON (TxCON<15>) = 1.

13.4.1

INPUT PIN FAULT PROTECTION

FOR PWM

• Determine instruction cycle time, TCY.

• Calculate desired pulse width value based on TCY.

When control bits, OCM<2:0> (OCxCON<2:0>) = 111,

the selected output compare channel is again config-

ured for the PWM mode of operation, with the addi-

tional feature of input Fault protection. While in this

mode, if a logic ‘0’ is detected on the OCFA/B pin, the

respective PWM output pin is placed in the high-

impedance input state. The OCFLT bit (OCxCON<4>)

indicates whether a Fault condition has occurred. This

state will be maintained until both of the following

events have occurred:

• Calculate time to start pulse from timer start value

of 0x0000.

• Write pulse-width start and stop times into OCxR

and OCxRS Compare registers (x denotes

channel 1, 2, ...,N).

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register.

• Set OCM<2:0> = 100.

• Enable timer, TON (TxCON<15>) = 1.

• The external Fault condition has been removed.

To initiate another single pulse, issue another write to

set OCM<2:0> = 100.

• The PWM mode has been re-enabled by writing

to the appropriate control bits.

DS70141E-page 84

dsPIC30F3010/3011

When the selected TMRx is equal to its respective

Period register, PRx, the following four events occur on

the next increment cycle:

13.4.2

PWM PERIOD

The PWM period is specified by writing to the PRx

register. The PWM period can be calculated using

Equation 13-1.

• TMRx is cleared.

• The OCx pin is set.

EQUATION 13-1: PWM PERIOD

- Exception 1: If PWM duty cycle is 0x0000,

the OCx pin will remain low.

PWM period = [(PRx) + 1] • 4 • TOSC •

(TMRx prescale value)

- Exception 2: If duty cycle is greater than PRx,

the pin will remain high.

• The PWM duty cycle is latched from OCxRS into

OCxR.

PWM frequency is defined as 1/[PWM period].

• The corresponding timer interrupt flag is set.

See Figure 13-1 for key PWM period comparisons.

Timer3 is referred to in the figure for clarity.

FIGURE 13-1:

PWM OUTPUT TIMING

Period

Duty Cycle

TMR3 = PR3

T3IF = 1

(Interrupt Flag)

OCxR = OCxRS

TMR3 = PR3

T3IF = 1

(Interrupt Flag)

OCxR = OCxRS

TMR3 = Duty Cycle (OCxR)

13.5 Output Compare Operation During

CPU Sleep Mode

13.7 Output Compare Interrupts

The output compare channels have the ability to

generate an interrupt on a compare match for

whichever Match mode has been selected.

When the CPU enters the Sleep mode, all internal

clocks are stopped. Therefore, when the CPU enters

the Sleep state, the output compare channel will drive

the pin to the active state that was observed prior to

entering the CPU Sleep state.

For all modes except the PWM mode, when a compare

event occurs, the respective interrupt flag (OCxIF) is

asserted and an interrupt will be generated, if enabled.

The OCxIF bit is located in the corresponding IFS

register, and must be cleared in software. The interrupt

is enabled via the respective Compare Interrupt Enable

(OCxIE) bit, located in the corresponding IEC register.

For example, if the pin was high when the CPU

entered the Sleep state, the pin will remain high. Like-

wise, if the pin was low when the CPU entered the

Sleep state, the pin will remain low. In either case, the

output compare module will resume operation when

the device wakes up.

For the PWM mode, when an event occurs, the respec-

tive Timer Interrupt Flag (T2IF or T3IF) is asserted and

an interrupt will be generated, if enabled. The TxIF bit

is located in the IFS0 register, and must be cleared in

software. The interrupt is enabled via the respective

Timer Interrupt Enable bit (T2IE or T3IE), located in the

IEC0 register. The output compare interrupt flag is

never set during the PWM mode of operation.

13.6 Output Compare Operation During

CPU Idle Mode

When the CPU enters the Idle mode, the output

compare module can operate with full functionality.

The output compare channel will operate during the

CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at

logic ‘0’ and the selected time base (Timer2 or Timer3)

is enabled and the TSIDL bit of the selected timer is

set to logic ‘0’.

DS70141E-page 85

dsPIC30F3010/3011

DS70141E-page 86

dsPIC30F3010/3011

The operational features of the QEI include:

14.0 QUADRATURE ENCODER

INTERFACE (QEI) MODULE

• Three input channels for two phase signals and

index pulse

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-Bit Timer/Counter mode

• Quadrature Encoder Interface interrupts

These operating modes are determined by setting the

appropriate bits QEIM<2:0> (QEICON<10:8>).

Figure 14-1 depicts the Quadrature Encoder Interface

block diagram.

This section describes the Quadrature Encoder

Interface (QEI) module and associated operational

modes. The QEI module provides the interface to

incremental encoders for obtaining mechanical position

data.

FIGURE 14-1:

QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM

TQCKPS<1:0>

2

Sleep Input

TQCS

TCY

0

1

Synchronize

Det

Prescaler

1, 8, 64, 256

1

0

QEIM<2:0>

QEIIF

Event

Flag

D

Q

TQGATE

CK

16-Bit Up/Down Counter

(POSCNT)

2

Programmable

Digital Filter

QEA

Reset

Quadrature

Encoder

Interface Logic

UPDN_SRC

Comparator/

Zero Detect

Equal

QEICON<11>

3

0

QEIM<2:0>

Mode Select

1

Max Count Register

(MAXCNT)

Programmable

Digital Filter

QEB

Up/Down⁽¹⁾

Programmable

Digital Filter

INDX

3

Note 1: In dsPIC30F3010/3011, the UPDN pin is not available. Up/Down logic bit can still be polled by software.

DS70141E-page 87

dsPIC30F3010/3011

14.2.2

POSITION COUNTER RESET

14.1 Quadrature Encoder Interface

Logic

The Position Counter Reset Enable bit, POSRES

(QEI<2>), controls whether the position counter is reset

when the index pulse is detected. This bit is only

applicable when QEIM<2:0> = 100or 110.

A typical incremental (a.k.a. optical) encoder has three

outputs: Phase A, Phase B and an index pulse. These

signals are useful and often required in position and

speed control of ACIM and SR motors.

If the POSRES bit is set to ‘1’, then the position counter

is reset when the index pulse is detected. If the

POSRES bit is set to ‘0’, then the position counter is not

reset when the index pulse is detected. The position

counter will continue counting up or down, and will be

reset on the rollover or underflow condition.

The two channels, Phase A (QEA) and Phase B (QEB),

have a unique relationship. If Phase A leads Phase B,

then the direction (of the motor) is deemed positive or

forward. If Phase A lags Phase B, then the direction (of

the motor) is deemed negative or reverse.

When selecting the INDX signal to reset the Position

Counter (POSCNT), the user has to specify the states

on QEA and QEB input pins. These states have to be

matched in order for a Reset to occur. These states are

selected by the IMV<1:0> bits in the DFLTCON

register.

A third channel, termed index pulse, occurs once per

revolution and is used as a reference to establish an

absolute position. The index pulse coincides with

Phase A and Phase B, both low.

14.2 16-Bit Up/Down Position Counter

Mode

The IMV<1:0> (Index Match Value) bits allow the user

to specify the state of the QEA and QEB input pins

during an index pulse when the POSCNT register is to

be reset.

The 16-bit up/down counter counts up or down on

every count pulse, which is generated by the difference

of the Phase A and Phase B input signals. The counter

acts as an integrator, whose count value is proportional

to position. The direction of the count is determined by

the UPDN signal, which is generated by the

Quadrature Encoder Interface logic.

In x4 Quadrature Count mode:

IMV1 = Required state of Phase B input signal for

match on index pulse

IMV0 = Required state of Phase A input signal for

match on index pulse

In x2 Quadrature Count mode:

IMV1 = Selects phase input signal for index state

match (0= Phase A, 1= Phase B)

14.2.1

POSITION COUNTER ERROR

CHECKING

Position count error checking in the QEI is provided for

and indicated by the CNTERR bit (QEICON<15>). The

error checking only applies when the position counter

is configured for Reset on the Index Pulse modes

(QEIM<2:0> = 110 or 100). In these modes, the

contents of the POSCNT register are compared with

the values (0xFFFF or MAXCNT + 1, depending on

direction). If these values are detected, an error condi-

tion is generated by setting the CNTERR bit and a QEI

count error interrupt is generated. The QEI count error

interrupt can be disabled by setting the CEID bit

(DFLTCON<8>). The position counter continues to

count encoder edges after an error has been detected.

The POSCNT register continues to count up/down until

a natural rollover/underflow. No interrupt is generated

for the natural rollover/underflow event. The CNTERR

bit is a read/write bit and reset in software by the user.

IMV0 = Required state of the selected phase input

signal for match on index pulse

The interrupt is still generated on the detection of the

index pulse and not on the position counter overflow/

underflow.

14.2.3

COUNT DIRECTION STATUS

As mentioned in the previous section, the QEI logic

generates an UPDN signal based upon the relationship

between Phase A and Phase B. In addition to the out-

put pin, the state of this internal UPDN signal is

supplied to a SFR bit, UPDN (QEICON<11>), as a

read-only bit.

Note:

QEI pins are multiplexed with analog inputs.

The user must insure that all QEI associ-

ated pins are set as digital inputs in the

ADPCFG register.

DS70141E-page 88

dsPIC30F3010/3011

14.3 Position Measurement Mode

14.5 Alternate 16-Bit Timer/Counter

There are two measurement modes which are sup-

ported and are termed x2 and x4. These modes are

selected by the QEIM<2:0> mode select bits located in

SFR, QEICON<10:8>.

When the QEI module is not configured for the QEI

mode, QEIM<2:0> = 001, the module can be config-

ured as a simple 16-bit timer/counter. The setup and

control of the auxiliary timer is accomplished through

the QEICON SFR register. This timer functions identi-

cally to Timer1. The QEA pin is used as the timer clock

input.

When control bits, QEIM<2:0> = 100 or 101, the x2

Measurement mode is selected and the QEI logic only

looks at the Phase A input for the position counter

increment rate. Every rising and falling edge of the

Phase A signal causes the position counter to be incre-

mented or decremented. The Phase B signal is still

utilized for the determination of the counter direction,

just as in the x4 Measurement mode.

When configured as a timer, the POSCNT register

serves as the Timer Count register and the MAXCNT

register serves as the Period register. When a Timer/

Period register match occurs, the QEI interrupt flag will

be asserted.

Within the x2 Measurement mode, there are two

variations of how the position counter is reset:

The only exception between the general purpose

timers and this timer is the added feature of external

up/down input select. When the UPDN pin is asserted

high, the timer will increment up. When the UPDN pin

is asserted low, the timer will be decremented.

1. Position counter reset by detection of index

pulse, QEIM<2:0> = 100.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 101.

Note:

Changing the operational mode (i.e., from

QEI to timer or vice versa), will not affect

the Timer/Position Count register contents.

When control bits, QEIM<2:0> = 110 or 111, the x4

Measurement mode is selected and the QEI logic looks

at both edges of the Phase A and Phase B input

signals. Every edge of both signals causes the position

counter to increment or decrement.

The UPDN control/status bit (QEICON<11>) can be

used to select the count direction state of the Timer

register. When UPDN = 1, the timer will count up. When

UPDN = 0, the timer will count down.

Within the x4 Measurement mode, there are two

variations of how the position counter is reset:

In addition, control bit, UPDN_SRC (QEICON<0>),

determines whether the timer count direction state is

based on the logic state written into the UPDN control/

status bit (QEICON<11>), or the QEB pin state. When

UPDN_SRC = 1, the timer count direction is controlled

from the QEB pin. Likewise, when UPDN_SRC = 0, the

timer count direction is controlled by the UPDN bit.

1. Position counter reset by detection of index

pulse, QEIM<2:0> = 110.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 111.

The x4 Measurement mode provides for finer resolu-

tion data (more position counts) for determining motor

position.

Note:

This timer does not support the External

Asynchronous Counter mode of operation.

If using an external clock source, the clock

will automatically be synchronized to the

internal instruction cycle.

14.4 Programmable Digital Noise

Filters

The digital noise filter section is responsible for reject-

ing noise on the incoming capture or quadrature

signals. Schmitt Trigger inputs and a three-clock cycle

delay filter combine to reject low level noise and large,

short duration noise spikes that typically occur in noise

prone applications, such as a motor system.

14.6 QEI Module Operation During CPU

Sleep Mode

14.6.1

QEI OPERATION DURING CPU

SLEEP MODE

The filter ensures that the filtered output signal is not

permitted to change until a stable value has been

registered for three consecutive clock cycles.

The QEI module will be halted during the CPU Sleep

mode.

14.6.2

TIMER OPERATION DURING CPU

SLEEP MODE

For the QEA, QEB and INDX pins, the clock divide

frequency for the digital filter is programmed by bits,

QECK<2:0> (DFLTCON<6:4>), and are derived from

the base instruction cycle, TCY.

During CPU Sleep mode, the timer will not operate,

because the internal clocks are disabled.

To enable the filter output for channels, QEA, QEB and

INDX, the QEOUT bit must be ‘1’. The filter network for

all channels is disabled on POR and BOR.

DS70141E-page 89

dsPIC30F3010/3011

14.7 QEI Module Operation During CPU

Idle Mode

14.8 Quadrature Encoder Interface

Interrupts

Since the QEI module can function as a Quadrature

Encoder Interface, or as a 16-bit timer, the following

section describes operation of the module in both

modes.

The Quadrature Encoder Interface has the ability to

generate an interrupt on occurrence of the following

events:

• Interrupt on 16-bit up/down position counter

rollover/underflow

14.7.1

QEI OPERATION DURING CPU IDLE

MODE

• Detection of qualified index pulse, or if CNTERR

bit is set

When the CPU is placed in the Idle mode, the QEI

module will operate if the QEISIDL bit

(QEICON<13>) = 0. This bit defaults to a logic ‘0’

upon executing POR and BOR. For halting the QEI

module during the CPU Idle mode, QEISIDL should

be set to ‘1’.

• Timer period match event (overflow/underflow)

• Gate accumulation event

The QEI Interrupt Flag bit, QEIIF, is asserted upon

occurrence of any of the above events. The QEIIF bit

must be cleared in software. QEIIF is located in the

IFS2 register.

14.7.2

TIMER OPERATION DURING CPU

IDLE MODE

Enabling an interrupt is accomplished via the respec-

tive enable bit, QEIIE. The QEIIE bit is located in the

IEC2 register.

When the CPU is placed in the Idle mode and the QEI

module is configured in the 16-Bit Timer mode, the

16-bit timer will operate if the QEISIDL bit (QEI-

CON<13>) = 0. This bit defaults to a logic ‘0’ upon

executing POR and BOR. For halting the timer module

during the CPU Idle mode, QEISIDL should be set

to ‘1’.

If the QEISIDL bit is cleared, the timer will function

normally as if the CPU Idle mode had not been

entered.

DS70141E-page 90

dsPIC30F3010/3011

DS70141E-page 91

dsPIC30F3010/3011

NOTES:

DS70141E-page 92

dsPIC30F3010/3011

• ‘On-the-Fly’ PWM frequency changes

• Edge and Center-Aligned Output modes

• Single Pulse Generation mode

15.0 MOTOR CONTROL PWM

MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• Interrupt support for asymmetrical updates in

Center-Aligned mode

• Output override control for Electrically

Commutative Motor (ECM) operation

• ‘Special Event’ comparator for scheduling other

peripheral events

• Fault pins to optionally drive each of the PWM

output pins to a defined state

This module simplifies the task of generating multiple,

synchronized Pulse-Width Modulated (PWM) outputs.

In particular, the following power and motion control

applications are supported by the PWM module:

This module contains

3 duty cycle generators,

numbered 1 through 3. The module has 6 PWM output

pins, numbered PWM1H/PWM1L through PWM3H/

PWM3L. The six I/O pins are grouped into high/low

numbered pairs, denoted by the suffix H or L,

respectively. For complementary loads, the low PWM

pins are always the complement of the corresponding

high I/O pins.

• Three-Phase AC Induction Motor

• Switched Reluctance (SR) Motor

• Brushless DC (BLDC) Motor

• Uninterruptible Power Supply (UPS)

The PWM module allows several modes of operation

which are beneficial for specific power control

applications.

The PWM module has the following features:

• 6 PWM I/O pins with 3 duty cycle generators

• Up to 16-bit resolution

DS70141E-page 93

dsPIC30F3010/3011

FIGURE 15-1:

PWM MODULE BLOCK DIAGRAM

PWMCON1

PWMCON2

DTCON1

PWM Enable and Mode SFRs

Dead-Time Control SFRs

FLTACON

OVDCON

Fault Pin Control SFRs

PWM Manual

Control SFR

PWM Generator #3

PDC3 Buffer

PDC3

PWM3H

PWM3L

Comparator

Channel 3 Dead-Time

Generator and

Override Logic

PWM Generator

#2

PWM2H

PWM2L

PTMR

Comparator

PTPER

Channel 2 Dead-Time

Generator and

Output

Driver

Block

Override Logic

PWM Generator

#1

PWM1H

PWM1L

Channel 1 Dead-Time

Generator and

Override Logic

FLTA

PTPER Buffer

PTCON

Special Event

Postscaler

Comparator

SEVTCMP

Special Event Trigger

SEVTDIR

PTDIR

PWM Time Base

Note:

Details of PWM Generator #1 and #2 not shown for clarity.

DS70141E-page 94

dsPIC30F3010/3011

15.1.1

FREE-RUNNING MODE

15.1 PWM Time Base

In the Free-Running mode, the PWM time base counts

upwards until the value in the Time Base Period

register (PTPER) is matched. The PTMR register is

reset on the following input clock edge and the time

base will continue to count upwards as long as the

PTEN bit remains set.

The PWM time base is provided by a 15-bit timer with

a prescaler and postscaler. The time base is accessible

via the PTMR SFR. PTDIR (PTMR<15>) is a read-only

status bit that indicates the present count direction of

the PWM time base. If PTDIR is cleared, PTMR is

counting upwards. If PTDIR is set, PTMR is counting

downwards. The PWM time base is configured via the

PTCON SFR. The time base is enabled/disabled by

setting/clearing the PTEN bit in the PTCON SFR.

PTMR is not cleared when the PTEN bit is cleared in

software.

When the PWM time base is in the Free-Running mode

(PTMOD<1:0> = 00), an interrupt event is generated

each time a match with the PTPER register occurs and

the PTMR register is reset to zero. The postscaler

selection bits may be used in this mode of the timer to

reduce the frequency of the interrupt events.

The PTPER SFR sets the counting period for PTMR.

The user must write a 15-bit value to PTPER<14:0>.

When the value in PTMR<14:0> matches the value in

PTPER<14:0>, the time base will either reset to 0, or

reverse the count direction on the next occurring clock

cycle. The action taken depends on the operating

mode of the time base.

15.1.2

SINGLE-SHOT MODE

In the Single-Shot mode, the PWM time base begins

counting upwards when the PTEN bit is set. When the

value in the PTMR register matches the PTPER regis-

ter, the PTMR register will be reset on the following

input clock edge and the PTEN bit will be cleared by the

hardware to halt the time base.

Note:

If the Period register is set to 0x0000, the

timer will stop counting, and the interrupt

and the Special Event Trigger will not be

generated, even if the special event value

is also 0x0000. The module will not update

the Period register if it is already at

0x0000; therefore, the user must disable

the module in order to update the Period

register.

When the PWM time base is in the Single-Shot mode

(PTMOD<1:0> = 01), an interrupt event is generated

when a match with the PTPER register occurs, the

PTMR register is reset to zero on the following input

clock edge, and the PTEN bit is cleared. The postscaler

selection bits have no effect in this mode of the timer.

15.1.3

CONTINUOUS UP/DOWN COUNT

MODES

The PWM time base can be configured for four different

modes of operation:

In the Continuous Up/Down Count modes, the PWM

time base counts upwards until the value in the PTPER

register is matched. The timer will begin counting

downwards on the following input clock edge. The

PTDIR bit in the PTCON SFR is read-only and

indicates the counting direction. The PTDIR bit is set

when the timer counts downwards.

• Free-Running mode

• Single-Shot mode

• Continuous Up/Down Count mode

• Continuous Up/Down Count mode with interrupts

for double updates

These four modes are selected by the PTMOD<1:0>

bits in the PTCON SFR. The Continuous Up/Down

Count modes support center-aligned PWM generation.

The Single-Shot mode allows the PWM module to sup-

port pulse control of certain Electronically Commutative

Motors (ECMs).

In the Continuous Up/Down Count mode

(PTMOD<1:0> = 10), an interrupt event is generated

each time the value of the PTMR register becomes

zero and the PWM time base begins to count upwards.

The postscaler selection bits may be used in this mode

of the timer to reduce the frequency of the interrupt

events.

The interrupt signals generated by the PWM time base

depend on the mode selection bits (PTMOD<1:0>) and

the postscaler bits (PTOPS<3:0>) in the PTCON SFR.

DS70141E-page 95

dsPIC30F3010/3011

15.1.4

DOUBLE-UPDATE MODE

15.2 PWM Period

In the Double-Update mode (PTMOD<1:0> = 11), an

interrupt event is generated each time the PTMR regis-

ter is equal to zero, as well as each time a period match

occurs. The postscaler selection bits have no effect in

this mode of the timer.

PTPER is a 15-bit register and is used to set the

counting period for the PWM time base. PTPER is a

double- buffered register. The PTPER buffer contents

are loaded into the PTPER register at the following

instances:

The Double-Update mode provides two additional

functions to the user. First, the control loop bandwidth

is doubled because the PWM duty cycles can be

updated, twice per period. Second, asymmetrical

center-aligned PWM waveforms can be generated,

which are useful for minimizing output waveform

distortion in certain motor control applications.

• Free-Running and Single-Shot modes: When the

PTMR register is reset to zero after a match with

the PTPER register.

• Continuous Up/Down Count modes: When the

PTMR register is zero.

The value held in the PTPER buffer is automatically

loaded into the PTPER register when the PWM time

base is disabled (PTEN = 0).

Note:

Programming a value of 0x0001 in the

Period register could generate a continu-

ous interrupt pulse, and hence, must be

avoided.

The PWM period can be determined using

Equation 15-1:

EQUATION 15-1: PWM PERIOD

(FREE-RUNNING MODE)

15.1.5

PWM TIME BASE PRESCALER

The input clock to PTMR (FOSC/4), has prescaler

options of 1:1, 1:4, 1:16, or 1:64, selected by control

bits, PTCKPS<1:0> in the PTCON SFR. The prescaler

counter is cleared when any of the following occurs:

TCY • (PTPER + 1)

TPWM =

(PTMR Prescale Value)

• a write to the PTMR register

• a write to the PTCON register

• any device Reset

If the PWM time base is configured for one of the

Continuous Up/Down Count modes, the PWM period is

given by Equation 15-2.

The PTMR register is not cleared when PTCON is

written.

EQUATION 15-2: PWM PERIOD (UP/DOWN

COUNTING MODE)

15.1.6

PWM TIME BASE POSTSCALER

The match output of PTMR can optionally be post-

scaled through a 4-bit postscaler (which gives a 1:1 to

1:16 scaling).

2 • TCY • (PTPER + 0.75)

TPWM =

(PTMR Prescale Value)

The postscaler counter is cleared when any of the

following occurs:

The maximum resolution (in bits) for a given device

oscillator and PWM frequency can be determined using

Equation 15-3:

• a write to the PTMR register

• a write to the PTCON register

• any device Reset

EQUATION 15-3: PWM RESOLUTION

The PTMR register is not cleared when PTCON is written.

log (2 • TPWM / TCY)

Resolution =

log (2)

DS70141E-page 96

dsPIC30F3010/3011

FIGURE 15-3:

CENTER-ALIGNED PWM

15.3 Edge-Aligned PWM

Period/2

Edge-aligned PWM signals are produced by the module

when the PWM time base is in the Free-Running or

Single-Shot mode. For edge-aligned PWM outputs, the

output has a period specified by the value in PTPER

and a duty cycle specified by the appropriate Duty Cycle

register (see Figure 15-2). The PWM output is driven

active at the beginning of the period (PTMR = 0) and is

driven inactive when the value in the Duty Cycle register

matches PTMR.

PTPER

PTMR

Value

Duty

Cycle

0

If the value in a particular Duty Cycle register is zero,

then the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the Duty Cycle register is greater

than the value held in the PTPER register.

Period

15.5 PWM Duty Cycle Comparison

Units

FIGURE 15-2:

EDGE-ALIGNED PWM

New Duty Cycle Latched

There are three 16-bit Special Function Registers

(PDC1, PDC2 and PDC3) used to specify duty cycle

values for the PWM module.

PTPER

The value in each Duty Cycle register determines the

amount of time that the PWM output is in the active

state. The Duty Cycle registers are 16 bits wide. The

LSb of a Duty Cycle register determines whether the

PWM edge occurs in the beginning. Thus, the PWM

resolution is effectively doubled.

PTMR

Value

0

Duty Cycle

15.5.1

DUTY CYCLE REGISTER BUFFERS

The three PWM Duty Cycle registers are double-

buffered to allow glitchless updates of the PWM

outputs. For each duty cycle, there is a Duty Cycle reg-

ister that is accessible by the user and a second Duty

Cycle register that holds the actual compare value

used in the present PWM period.

Period

15.4 Center-Aligned PWM

Center-aligned PWM signals are produced by the

module when the PWM time base is configured in a

Continuous Up/Down Count mode (see Figure 15-3).

For edge-aligned PWM output, a new duty cycle value

will be updated whenever a match with the PTPER

register occurs and PTMR is reset. The contents of the

duty cycle buffers are automatically loaded into the

Duty Cycle registers when the PWM time base is

disabled (PTEN = 0) and the UDIS bit is cleared in

PWMCON2.

The PWM compare output is driven to the active state

when the value of the Duty Cycle register matches the

value of PTMR and the PWM time base is counting

downwards (PTDIR = 1). The PWM compare output is

driven to the inactive state when the PWM time base is

counting upwards (PTDIR = 0) and the value in the

PTMR register matches the duty cycle value.

When the PWM time base is in the Continuous Up/

Down Count mode, new duty cycle values are updated

when the value of the PTMR register is zero and the

PWM time base begins to count upwards. The contents

of the duty cycle buffers are automatically loaded into

the Duty Cycle registers when the PWM time base is

disabled (PTEN = 0).

If the value in a particular Duty Cycle register is zero,

then the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the Duty Cycle register is equal to

the value held in the PTPER register.

DS70141E-page 97

dsPIC30F3010/3011

When the PWM time base is in the Continuous Up/

Down Count mode with double updates, new duty cycle

values are updated when the value of the PTMR regis-

ter is zero, and when the value of the PTMR register

matches the value in the PTPER register. The contents

of the duty cycle buffers are automatically loaded into

the Duty Cycle registers when the PWM time base is

disabled (PTEN = 0).

15.7.1

DEAD-TIME GENERATORS

Each complementary output pair for the PWM module

has a 6-bit down counter that is used to produce the

dead-time insertion. As shown in Figure 15-4, each

dead-time unit has a rising and falling edge detector

connected to the duty cycle comparison output.

15.7.2

DEAD-TIME RANGES

The amount of dead time provided by the dead-time

unit is selected by specifying the input clock prescaler

value and a 6-bit unsigned value.

15.6 Complementary PWM Operation

In the Complementary mode of operation, each pair of

PWM outputs is obtained by a complementary PWM

signal. A dead time may be optionally inserted during

device switching, when both outputs are inactive for a

short period (Refer to Section 15.7 “Dead-Time

Generators”).

Four input clock prescaler selections have been pro-

vided to allow a suitable range of dead time, based on

the device operating frequency. The dead-time clock

prescaler values are selected using the DTAPS<1:0>

control bits in the DTCON1 SFR. One of four clock

prescaler options (TCY, 2 TCY, 4 TCY or 8 TCY) may be

selected.

In Complementary mode, the duty cycle comparison

units are assigned to the PWM outputs as follows:

After the prescaler value is selected, the dead time is

adjusted by loading 6-bit unsigned values into the

DTCON1 SFR.

• PDC1 register controls PWM1H/PWM1L outputs

• PDC2 register controls PWM2H/PWM2L outputs

• PDC3 register controls PWM3H/PWM3L outputs

The dead-time unit prescaler is cleared on the following

events:

The Complementary mode is selected for each PWM

I/O pin pair by clearing the appropriate PMODx bit in the

PWMCON1 SFR. The PWM I/O pins are set to

Complementary mode by default upon a device Reset.

• On a load of the down timer due to a duty cycle

comparison edge event.

• On a write to the DTCON1 register.

• On any device Reset.

15.7 Dead-Time Generators

Note:

The user should not modify the DTCON1

value while the PWM module is operating

(PTEN = 1). Unexpected results may

occur.

Dead-time generation may be provided when any of the

PWM I/O pin pairs are operating in the Complementary

Output mode. The PWM outputs use push-pull drive cir-

cuits. Due to the inability of the power output devices to

switch instantaneously, some amount of time must be

provided between the turn-off event of one PWM output

in a complementary pair and the turn-on event of the

other transistor.

The PWM module allows two different dead times to be

programmed. These two dead times may be used in

one of two methods described below to increase user

flexibility:

• The PWM output signals can be optimized for

different turn-off times in the high side and low

side transistors in a complementary pair of

transistors. The first dead time is inserted

between the turn-off event of the lower transistor

of the complementary pair and the turn-on event

of the upper transistor. The second dead time is

inserted between the turn-off event of the upper

transistor and the turn-on event of the lower

transistor.

• The two dead times can be assigned to individual

PWM I/O pin pairs. This operating mode allows

the PWM module to drive different transistor/load

combinations with each complementary PWM I/O

pin pair.

DS70141E-page 98

dsPIC30F3010/3011

FIGURE 15-4:

DEAD-TIME TIMING DIAGRAM

Duty Cycle Generator

PWMxH

PWMxL

Dead Time

DS70141E-page 99

dsPIC30F3010/3011

15.8 Independent PWM Output

15.10 PWM Output Override

An Independent PWM Output mode is required for

driving certain types of loads. A particular PWM output

pair is in the Independent Output mode when the

corresponding PMOD bit in the PWMCON1 register is

set. No dead-time control is implemented between

adjacent PWM I/O pins when the module is operating

in the Independent mode and both I/O pins are allowed

to be active simultaneously.

The PWM output override bits allow the user to

manually drive the PWM I/O pins to specified logic

states, independent of the duty cycle comparison units.

All control bits associated with the PWM output over-

ride function are contained in the OVDCON register.

The upper half of the OVDCON register contains six

bits, POVDxH<3:1> and POVDxL<3:1>, that determine

which PWM I/O pins will be overridden. The lower half

of the OVDCON register contains six bits,

POUTxH<3:1> and POUTxL<3:1>, that determine the

state of the PWM I/O pins when a particular output is

overridden via the POVD bits.

In the Independent mode, each duty cycle generator is

connected to both of the PWM I/O pins in an output

pair. By using the associated Duty Cycle register and

the appropriate bits in the OVDCON register, the user

may select the following signal output options for each

PWM I/O pin operating in the Independent mode:

15.10.1 COMPLEMENTARY OUTPUT MODE

When a PWMxL pin is driven active via the OVDCON

register, the output signal is forced to be the comple-

ment of the corresponding PWMxH pin in the pair.

Dead-time insertion is still performed when PWM

channels are overridden manually.

• I/O pin outputs PWM signal

• I/O pin inactive

• I/O pin active

15.9 Single Pulse PWM Operation

15.10.2 OVERRIDE SYNCHRONIZATION

The PWM module produces single pulse outputs when

the PTCON control bits, PTMOD<1:0> = 10. Only

edge-aligned outputs may be produced in the Single

Pulse mode. In Single Pulse mode, the PWM I/O pin(s)

are driven to the active state when the PTEN bit is set.

When a match with a Duty Cycle register occurs, the

PWM I/O pin is driven to the inactive state. When a

match with the PTPER register occurs, the PTMR

register is cleared, all active PWM I/O pins are driven

to the inactive state, the PTEN bit is cleared and an

interrupt is generated.

If the OSYNC bit in the PWMCON2 register is set, all

output overrides performed via the OVDCON register

are synchronized to the PWM time base. Synchronous

output overrides occur at the following times:

• Edge-Aligned mode, when PTMR is zero.

• Center-Aligned modes, when PTMR is zero and

when the value of PTMR matches PTPER.

DS70141E-page 100

dsPIC30F3010/3011

15.12.2 FAULT STATES

15.11 PWM Output and Polarity Control

The FLTACON Special Function Register has 6 bits

that determine the state of each PWM I/O pin when it is

overridden by a Fault input. When these bits are

cleared, the PWM I/O pin is driven to the inactive state.

If the bit is set, the PWM I/O pin will be driven to the

active state. The active and inactive states are refer-

enced to the polarity defined for each PWM I/O pin

(HPOL and LPOL polarity control bits).

There are three device Configuration bits associated

with the PWM module that provide PWM output pin

control:

• HPOL Configuration bit

• LPOL Configuration bit

• PWMPIN Configuration bit

These three bits in the FBORPOR Configuration

register (see Section 20.6 “Device Configuration

Registers”) work in conjunction with the PWM Enable

bits (PENxH and PENxL) located in the PWMCON1

SFR. The Configuration bits and PWM enable bits

ensure that the PWM pins are in the correct states after

a device Reset occurs. The PWMPIN Configuration bit

allows the PWM module outputs to be optionally

enabled on a device Reset. If PWMPIN = 0, the PWM

outputs will be driven to their inactive states at Reset. If

PWMPIN = 1 (default), the PWM outputs will be tri-

stated. The HPOL bit specifies the polarity for the

PWMxH outputs, whereas the LPOL bit specifies the

polarity for the PWMxL outputs.

A special case exists when a PWM module I/O pair is

in the Complementary mode and both pins are pro-

grammed to be active on a Fault condition. The

PWMxH pin always has priority in the Complementary

mode, so that both I/O pins cannot be driven active

simultaneously.

15.12.3 FAULT INPUT MODES

The Fault input pin has two modes of operation:

• Latched Mode: When the Fault pin is driven low,

the PWM outputs will go to the states defined in

the FLTACON register. The PWM outputs will

remain in this state until the Fault pin is driven

high and the corresponding interrupt flag has

been cleared in software. When both of these

actions have occurred, the PWM outputs will

return to normal operation at the beginning of the

next PWM cycle or half-cycle boundary. If the

interrupt flag is cleared before the Fault condition

ends, the PWM module will wait until the Fault pin

is no longer asserted to restore the outputs.

15.11.1 OUTPUT PIN CONTROL

The PENxH<3:1> and PENxL<3:1> control bits in the

PWMCON1 SFR enable each high PWM output pin

and each low PWM output pin, respectively. If a

particular PWM output pin is not enabled, it is treated

as a general purpose I/O pin.

15.12 PWM Fault Pin

• Cycle-by-Cycle Mode: When the Fault input pin

is driven low, the PWM outputs remain in the

defined Fault states for as long as the Fault pin is

held low. After the Fault pin is driven high, the

PWM outputs return to normal operation at the

beginning of the following PWM cycle or

half-cycle boundary.

There is one Fault pin (FLTA) associated with the PWM

module. When asserted, this pin can optionally drive

each of the PWM I/O pins to a defined state.

15.12.1 FAULT PIN ENABLE BITS

The FLTACON SFR has three control bits that deter-

mine whether a particular pair of PWM I/O pins is to be

controlled by the Fault input pin. To enable a

specific PWM I/O pin pair for Fault overrides, the

corresponding bit should be set in the FLTACON

register.

The operating mode for the Fault input pin is selected

using the FLTAM control bit in the FLTACON Special

Function Register.

The Fault pin can be controlled manually in software.

If all enable bits are cleared in the FLTACON register,

then the corresponding Fault input pin has no effect on

the PWM module and the pin may be used as a general

purpose interrupt or I/O pin.

Note:

The Fault pin logic can operate indepen-

dent of the PWM logic. If all the enable bits

in the FLTACON register are cleared, then

the Fault pin could be used as a general

purpose interrupt pin. The Fault pin has an

interrupt vector, interrupt flag bit and

interrupt priority bits associated with it.

DS70141E-page 101

dsPIC30F3010/3011

15.14.1 SPECIAL EVENT TRIGGER

POSTSCALER

15.13 PWM Update Lockout

For a complex PWM application, the user may need to

write up to three Duty Cycle registers and the Time

Base Period register, PTPER, at a given time. In some

applications, it is important that all buffer registers be

written before the new duty cycle and period values are

loaded for use by the module.

The PWM Special Event Trigger has a postscaler that

allows a 1:1 to 1:16 postscale ratio. The postscaler is

configured by writing the SEVOPS<3:0> control bits in

the PWMCON2 SFR.

The special event output postscaler is cleared on the

following events:

The PWM update lockout feature is enabled by setting

the UDIS control bit in the PWMCON2 SFR. The UDIS

bit affects all Duty Cycle Buffer registers and the PWM

Time Base Period buffer, PTPER. No duty cycle

changes or period value changes will have effect while

UDIS = 1.

• Any write to the SEVTCMP register

• Any device Reset

15.15 PWM Operation During CPU Sleep

Mode

15.14 PWM Special Event Trigger

The Fault A input pin has the ability to wake the CPU

from Sleep mode. The PWM module generates an

interrupt if the Fault pin is driven low while in Sleep.

The PWM module has a Special Event Trigger that

allows A/D conversions to be synchronized to the PWM

time base. The A/D sampling and conversion time may

be programmed to occur at any point within the PWM

period. The Special Event Trigger allows the user to

minimize the delay between the time when A/D conver-

sion results are acquired and the time when the duty

cycle value is updated.

15.16 PWM Operation During CPU Idle

Mode

The PTCON SFR contains a PTSIDL control bit. This

bit determines if the PWM module will continue to

operate or stop when the device enters Idle mode. If

PTSIDL = 0, the module will continue to operate. If

PTSIDL = 1, the module will stop operation as long as

the CPU remains in Idle mode.

The PWM Special Event Trigger has an SFR named

SEVTCMP, and five control bits to control its operation.

The PTMR value for which a Special Event Trigger

should occur is loaded into the SEVTCMP register.

When the PWM time base is in a Continuous Up/Down

Count mode, an additional control bit is required to

specify the counting phase for the Special Event Trig-

ger. The count phase is selected using the SEVTDIR

control bit in the SEVTCMP SFR. If the SEVTDIR bit is

cleared, the Special Event Trigger will occur on the

upward counting cycle of the PWM time base. If the

SEVTDIR bit is set, the Special Event Trigger will occur

on the downward count cycle of the PWM time base.

The SEVTDIR control bit has no effect unless the PWM

time base is configured for a Continuous Up/Down

Count mode.

DS70141E-page 102

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DS70141E-page 103

dsPIC30F3010/3011

NOTES:

DS70141E-page 104

dsPIC30F3010/3011

contents of the transmit buffer are moved to SPI1SR.

The received data is thus placed in SPI1BUF and the

transmit data in SPI1SR is ready for the next transfer.

16.0 SPI MODULE

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

Note:

Both the transmit buffer (SPI1TXB) and

the receive buffer (SPI1RXB) are mapped

to the same register address, SPI1BUF.

In Master mode, the clock is generated by prescaling

the system clock. Data is transmitted as soon as a

value is written to SPI1BUF. The interrupt is generated

at the middle of the transfer of the last bit.

The Serial Peripheral Interface (SPI) module is a

synchronous serial interface. It is useful for

communicating with other peripheral devices, such as

EEPROMs, shift registers, display drivers and A/D

converters or other microcontrollers. It is compatible

with SPI and SIOP interfaces available on some other

microcontrollers.

In Slave mode, data is transmitted and received as

external clock pulses appear on SCKx. Again, the

interrupt is generated when the last bit is latched. If

SSx control is enabled, then transmission and

reception are enabled only when SSx = low. The

SDOx output will be disabled in SSx mode with SSx

high.

The clock provided to the module is (FOSC/4). This

clock is then prescaled by the primary (PPRE<1:0>)

and the secondary (SPRE<2:0>) prescale factors. The

CKE bit determines whether transmit occurs on transi-

tion from active clock state to Idle clock state, or vice

versa. The CKP bit selects the Idle state (high or low)

for the clock.

16.1 Operating Function Description

The SPI module consists of a 16-bit shift register,

SPI1SR, used for shifting data in and out, and a buffer

register, SPI1BUF. A Control register, SPI1CON,

configures the module. Additionally, a status register,

SPI1STAT, indicates various status conditions.

The serial interface consists of 4 pins: SDI1 (Serial

Data Input), SDO1 (Serial Data Output), SCK1 (Shift

Clock Input or Output) and SS1 (Active-Low Slave

Select).

16.1.1

WORD AND BYTE

COMMUNICATION

A control bit, MODE16 (SPI1CON<10>), allows the

module to communicate in either 16-bit or 8-bit mode.

16-bit operation is identical to 8-bit operation, except

that the number of bits transmitted is 16 instead of 8.

In Master mode operation, SCK1 is a clock output, but

in Slave mode, it is a clock input.

A series of eight (8) or sixteen (16) clock pulses shifts

out bits from the SPI1SR to the SDO1 pin and

simultaneously shifts in data from the SDI1 pin. An

interrupt is generated when the transfer is complete

and the corresponding interrupt flag bit (SPI1IF) is set.

This interrupt can be disabled through an interrupt

enable bit (SPI1IE).

The user software must disable the module prior to

changing the MODE16 bit. The SPI module is reset

when the MODE16 bit is changed by the user.

A basic difference between 8-bit and 16-bit operation is

that the data is transmitted out of bit 7 of the SPIxSR for

8-bit operation, and data is transmitted out of bit 15 of

the SPIxSR for 16-bit operation. In both modes, data is

shifted into bit 0 of the SPIxSR.

The receive operation is double-buffered. When a

complete byte is received, it is transferred from

SPI1SR to SPI1BUF.

16.1.2

SDO1 DISABLE

If the receive buffer is full when new data is being

transferred from SPI1SR to SPI1BUF, the module will

set the SPIROV bit, indicating an overflow condition.

The transfer of the data from SPI1SR to SPI1BUF will

not be completed and the new data will be lost. The

module will not respond to SCL transitions while

SPIROV is ‘1’, effectively disabling the module until

SPI1BUF is read by user software.

A control bit, DISSDO, is provided to the SPI1CON

register to allow the SDO1 output to be disabled. This

will allow the SPI module to be connected in an input

only configuration. SDOx can also be used for general

purpose I/O.

Transmit writes are also double-buffered. The user

writes to SPI1BUF. When the master or slave transfer

is completed, the contents of the shift register

(SPI1SR) are moved to the receive buffer. If any trans-

mit data has been written to the buffer register, the

DS70141E-page 105

dsPIC30F3010/3011

the SS1 pin is an input or an output (i.e., whether the

module receives or generates the frame synchroniza-

tion pulse). The frame pulse is an active-high pulse for

a single SPI clock cycle. When frame synchronization

is enabled, the data transmission starts only on the

subsequent transmit edge of the SPI clock.

16.2 Framed SPI Support

The module supports a basic framed SPI protocol in

Master or Slave mode. The control bit, FRMEN,

enables framed SPI support and causes the SS1 pin to

perform the Frame Synchronization (FSYNC) pulse

function. The control bit, SPIFSD, determines whether

FIGURE 16-1:

SPI BLOCK DIAGRAM

Internal

Data Bus

Read

Write

SPI1BUF

Transmit

SPI1BUF

Receive

SPI1SR

bit 0

SDI1

SDO1

Shift

clock

SSx & FSYNC

Control

Clock

Control

Edge

Select

SS1

Secondary

Prescaler

1:1 – 1:8

Primary

Prescaler

1, 4, 16, 64

FCY

SCK1

Enable Master Clock

FIGURE 16-2:

SPI MASTER/SLAVE CONNECTION

SPI Master

SPI Slave

SDOx

SDIy

Serial Input Buffer

(SPIxBUF)

Serial Input Buffer

(SPIyBUF)

SDIx

SDOy

SCKy

Shift Register

(SPIxSR)

Shift Register

(SPIySR)

LSb

MSb

LSb

Serial Clock

SCKx

PROCESSOR 1

PROCESSOR 2

Note: x = 1 or 2, y = 1 or 2.

DS70141E-page 106

dsPIC30F3010/3011

16.3 Slave Select Synchronization

16.4 SPI Operation During CPU Sleep

Mode

The SS1 pin allows a Synchronous Slave mode. The

SPI must be configured in SPI Slave mode with SS1

pin control enabled (SSEN = 1). When the SS1 pin is

low, transmission and reception are enabled and the

SDO1 pin is driven. When the SS1 pin goes high, the

SDO1 pin is no longer driven. Also, the SPI module is

resynchronized and all counters/control circuitry are

reset. Therefore, when the SS1 pin is asserted low

again, transmission/reception will begin at the MSb,

even if SS1 has been deasserted in the middle of a

transmit/receive.

During Sleep mode, the SPI module is shut down. If

the CPU enters Sleep mode while an SPI transaction

is in progress, then the transmission and reception is

aborted.

The transmitter and receiver will stop in Sleep mode.

However, register contents are not affected by

entering or exiting Sleep mode.

16.5 SPI Operation During CPU Idle

Mode

When the device enters Idle mode, all clock sources

remain functional. The SPISIDL bit (SPI1STAT<13>)

selects if the SPI module will stop or continue on Idle.

If SPISIDL = 0, the module will continue to operate

when the CPU enters Idle mode. If SPISIDL = 1, the

module will stop when the CPU enters Idle mode.

DS70141E-page 107

dsPIC30F3010/3011

DS70141E-page 108

dsPIC30F3010/3011

2

17.1.1

VARIOUS I²C MODES

17.0 I C™ MODULE

The following types of I²C operation are supported:

Note:

This data sheet summarizes features of

• I²C Slave operation with 7-bit addressing

• I²C Slave operation with 10-bit addressing

• I²C Master operation with 7 or 10-bit addressing

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

See the I²C programmer’s model in Figure 17-1.

17.1.2

PIN CONFIGURATION IN I²C MODE

I²C has a 2-pin interface; pin SCL is clock and pin SDA

is data.

The Inter-Integrated Circuit (I²C™) module provides

complete hardware support for both Slave and Multi-

Master modes of the I²C serial communication

standard with a 16-bit interface.

17.1.3

I²C REGISTERS

I2CCON and I2CSTAT are control and status registers,

respectively. The I2CCON register is readable and

writable. The lower 6 bits of I2CSTAT are read-only.

The remaining bits of the I2CSTAT are read/write.

This module offers the following key features:

• I²C interface supporting both master and slave

operation.

• I²C Slave mode supports 7 and 10-bit addressing.

• I²C Master mode supports 7 and 10-bit addressing.

• I²C port allows bidirectional transfers between

master and slaves.

• Serial clock synchronization for I²C port can be

used as a handshake mechanism to suspend and

resume serial transfer (SCLREL control).

I2CRSR is the shift register used for shifting data,

whereas I2CRCV is the buffer register to which data

bytes are written, or from which data bytes are read.

I2CRCV is the receive buffer, as shown in Figure 17-1.

I2CTRN is the transmit register to which bytes are

written during a transmit operation, as shown in

Figure 17-2.

The I2CADD register holds the slave address. A status

bit, ADD10, indicates 10-Bit Addressing mode. The

I2CBRG acts as the Baud Rate Generator (BRG)

reload value.

• I²C supports multi-master operation; detects bus

collision and will arbitrate accordingly.

17.1 Operating Function Description

In receive operations, I2CRSR and I2CRCV together

The hardware fully implements all the master and

slave functions of the I²C Standard and Fast mode

specifications, as well as 7 and 10-bit addressing.

Thus, the I²C module can operate either as a slave or

a master on an I²C bus.

form

a double-buffered receiver. When I2CRSR

receives a complete byte, it is transferred to I2CRCV

and an interrupt pulse is generated. During

transmission, the I2CTRN is not double-buffered.

Note:

Following a Restart condition in 10-bit

mode, the user only needs to match the

first 7-bit address.

FIGURE 17-1:

PROGRAMMER’S MODEL

I2CRCV (8 bits)

bit 0

bit 7

I2CTRN (8 bits)

bit 0

bit 7

bit 8

I2CBRG (9 bits)

bit 0

I2CCON (16 bits)

bit 0

bit 15

I2CSTAT (16 bits)

bit 0

I2CADD (10 bits)

bit 0

bit 9

DS70141E-page 109

dsPIC30F3010/3011

FIGURE 17-2:

I²C™ BLOCK DIAGRAM

Internal

Data Bus

I2CRCV

Read

Shift

Clock

SCL

SDA

I2CRSR

LSB

Addr_Match

Match Detect

I2CADD

Write

Read

Start and

Stop bit Detect

Write

Read

Start, Restart,

Stop bit Generate

Collision

Detect

Write

Read

Acknowledge

Generation

Clock

Stretching

Write

Read

I2CTRN

LSB

Shift

Clock

Reload

Control

Write

Read

I2CBRG

BRG Down

Counter

FCY

DS70141E-page 110

dsPIC30F3010/3011

2

17.3.2

SLAVE RECEPTION

17.2 I C Module Addresses

If the R_W bit received is a ‘0’ during an address

match, then Receive mode is initiated. Incoming bits

are sampled on the rising edge of SCL. After 8 bits are

received, if I2CRCV is not full or I2COV is not set,

I2CRSR is transferred to I2CRCV. ACK is sent on the

ninth clock.

The I2CADD register contains the Slave mode

addresses. The register is a 10-bit register.

If the A10M bit (I2CCON<10>) is ‘0’, the address is

interpreted by the module as a 7-bit address. When an

address is received, it is compared to the 7 LSbs of the

I2CADD register.

If the RBF flag is set, indicating that I2CRCV is still

holding data from a previous operation (RBF = 1), then

ACK is not sent; however, the interrupt pulse is gener-

ated. In the case of an overflow, the contents of the

I2CRSR are not loaded into the I2CRCV.

If the A10M bit is ‘1’, the address is assumed to be a

10-bit address. When an address is received, it will be

compared with the binary value, ‘11110 A9 A8’

(where A9 and A8 are two Most Significant bits of

I2CADD). If that value matches, the next address will

be compared with the Least Significant 8 bits of

I2CADD, as specified in the 10-bit addressing protocol.

Note:

The I2CRCV will be loaded if the I2COV

bit = 1and the RBF flag = 0. In this case,

a read of the I2CRCV was performed, but

the user did not clear the state of the

I2COV bit before the next receive

occurred. The Acknowledgement is not

sent (ACK = 1) and the I2CRCV is

updated.

The 7-bit I²C slave addresses supported by the

dsPIC30F are shown in Table 17-1.

TABLE 17-1: 7-BIT I²C™ SLAVE

ADDRESSES

0x00

General Call Address or Start Byte

Reserved

2

17.4 I C 10-Bit Slave Mode Operation

0x01-0x03

0x04-0x07

0x08-0x77

0x78-0x7b

0x7c-0x7f

HS mode Master Codes

Valid 7-Bit Addresses

Valid 10-Bit Addresses (lower 7 bits)

Reserved

In 10-bit mode, the basic receive and transmit opera-

tions are the same as in the 7-bit mode. However, the

criteria for address match is more complex.

The I²C specification dictates that a slave must be

addressed for a write operation, with two address bytes

following a Start bit.

2

17.3 I C 7-Bit Slave Mode Operation

The A10M bit is a control bit that signifies that the

address in I2CADD is a 10-bit address rather than a

7-bit address. The address detection protocol for the

first byte of a message address is identical for 7-bit

and 10-bit messages, but the bits being compared are

different.

Once enabled (I2CEN = 1), the slave module will wait

for a Start bit to occur (i.e., the I²C module is ‘Idle’).

Following the detection of a Start bit, 8 bits are shifted

into I2CRSR and the address is compared against

I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>

are compared against I2CRSR<7:1> and I2CRSR<0>

is the R_W bit. All incoming bits are sampled on the

rising edge of SCL.

I2CADD holds the entire 10-bit address. Upon receiv-

ing an address following a Start bit, I2CRSR <7:3> is

compared against a literal ‘11110’ (the default 10-bit

address) and I2CRSR<2:1> are compared against

I2CADD<9:8>. If a match occurs and if R_W = 0, the

interrupt pulse is sent. The ADD10 bit will be cleared to

indicate a partial address match. If a match fails or

R_W = 1, the ADD10 bit is cleared and the module

returns to the Idle state.

If an address match occurs, an Acknowledgement will

be sent, and the Slave Event Interrupt Flag (SI2CIF) is

set on the falling edge of the ninth (ACK) bit. The

address match does not affect the contents of the

I2CRCV buffer or the RBF bit.

17.3.1

SLAVE TRANSMISSION

The low byte of the address is then received and com-

pared with I2CADD<7:0>. If an address match occurs,

the interrupt pulse is generated and the ADD10 bit is

set, indicating a complete 10-bit address match. If an

address match did not occur, the ADD10 bit is cleared

and the module returns to the Idle state.

If the R_W bit received is a ‘1’, then the serial port will

go into Transmit mode. It will send an ACK on the ninth

bit and then hold SCL to ‘0’ until the CPU responds by

writing to I2CTRN. SCL is released by setting the

SCLREL bit, and 8 bits of data are shifted out. Data bits

are shifted out on the falling edge of SCL, such that

SDA is valid during SCL high. The interrupt pulse is

sent on the falling edge of the ninth clock pulse,

regardless of the status of the ACK received from the

master.

DS70141E-page 111

dsPIC30F3010/3011

Clock stretching takes place following the ninth clock of

the receive sequence. On the falling edge of the ninth

clock at the end of the ACK sequence, if the RBF bit is

set, the SCLREL bit is automatically cleared, forcing the

SCL output to be held low. The user’s ISR must set the

SCLREL bit before reception is allowed to continue. By

holding the SCL line low, the user has time to service

the ISR and read the contents of the I2CRCV before the

master device can initiate another receive sequence.

This will prevent buffer overruns from occurring.

17.4.1

10-BIT MODE SLAVE

TRANSMISSION

Once a slave is addressed in this fashion, with the full

10-bit address (we will refer to this state as

“PRIOR_ADDR_MATCH”), the master can begin sending

data bytes for a slave reception operation.

17.4.2

10-BIT MODE SLAVE RECEPTION

Once addressed, the master can generate a Repeated

Start, reset the high byte of the address and set the

R_W bit without generating a Stop bit, thus initiating a

slave transmit operation.

Note 1: If the user reads the contents of the

I2CRCV, clearing the RBF bit before the

falling edge of the ninth clock, the

SCLREL bit will not be cleared and clock

stretching will not occur.

17.5 Automatic Clock Stretch

In the Slave modes, the module can synchronize buffer

reads and writes to the master device by clock

stretching.

2: The SCLREL bit can be set in software,

regardless of the state of the RBF bit. The

user should be careful to clear the RBF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

17.5.1

TRANSMIT CLOCK STRETCHING

Both 10-Bit and 7-Bit Transmit modes implement clock

stretching by asserting the SCLREL bit after the falling

edge of the ninth clock if the TBF bit is cleared,

indicating the buffer is empty.

17.5.4

CLOCK STRETCHING DURING

10-BIT ADDRESSING (STREN = 1)

In Slave Transmit modes, clock stretching is always

performed, irrespective of the STREN bit.

Clock stretching takes place automatically during the

addressing sequence. Because this module has a

register for the entire address, it is not necessary for

the protocol to wait for the address to be updated.

Clock synchronization takes place following the ninth

clock of the transmit sequence. If the device samples

an ACK on the falling edge of the ninth clock, and if the

TBF bit is still clear, then the SCLREL bit is automati-

cally cleared. The SCLREL being cleared to ‘0’ will

assert the SCL line low. The user’s ISR must set the

SCLREL bit before transmission is allowed to

continue. By holding the SCL line low, the user has

time to service the ISR and load the contents of the

I2CTRN before the master device can initiate another

transmit sequence.

After the address phase is complete, clock stretching

will occur on each data receive or transmit sequence

as was described earlier.

17.6 Software Controlled Clock

Stretching (STREN = 1)

When the STREN bit is ‘1’, the SCLREL bit may be

cleared by software to allow software to control the

clock stretching. The logic will synchronize writes to

the SCLREL bit with the SCL clock. Clearing the

SCLREL bit will not assert the SCL output until the

module detects a falling edge on the SCL output and

SCL is sampled low. If the SCLREL bit is cleared by

the user while the SCL line has been sampled low, the

SCL output will be asserted (held low). The SCL out-

put will remain low until the SCLREL bit is set, and all

other devices on the I²C bus have deasserted SCL.

This ensures that a write to the SCLREL bit will not

violate the minimum high time requirement for SCL.

Note 1: If the user loads the contents of I2CTRN,

setting the TBF bit before the falling edge

of the ninth clock, the SCLREL bit will not

be cleared and clock stretching will not

occur.

2: The SCLREL bit can be set in software,

regardless of the state of the TBF bit.

17.5.2

RECEIVE CLOCK STRETCHING

The STREN bit in the I2CCON register can be used to

enable clock stretching in Slave Receive mode. When

the STREN bit is set, the SCL pin will be held low at

the end of each data receive sequence.

If the STREN bit is ‘0’, a software write to the SCLREL

bit will be disregarded and have no effect on the

SCLREL bit.

17.5.3

CLOCK STRETCHING DURING

7-BIT ADDRESSING (STREN = 1)

When the STREN bit is set in Slave Receive mode,

the SCL line is held low when the buffer register is full.

The method for stretching the SCL output is the same

for both 7 and 10-Bit Addressing modes.

DS70141E-page 112

dsPIC30F3010/3011

2

17.7 Interrupts

17.11 I C Master Support

The I²C module generates two interrupt flags, MI2CIF

(I²C Master Interrupt Flag) and SI2CIF (I²C Slave

Interrupt Flag). The MI2CIF interrupt flag is activated

on completion of a master message event. The SI2CIF

interrupt flag is activated on detection of a message

directed to the slave.

As a master device, six operations are supported:

• Assert a Start condition on SDA and SCL

• Assert a Restart condition on SDA and SCL

• Write to the I2CTRN register initiating

transmission of data/address

• Generate a Stop condition on SDA and SCL

• Configure the I²C port to receive data

17.8 Slope Control

• Generate an ACK condition at the end of a

received byte of data

The I²C standard requires slope control on the SDA

and SCL signals for Fast mode (400 kHz). The control

bit, DISSLW, enables the user to disable slew rate

control, if desired. It is necessary to disable the slew

rate control for 1 MHz mode.

2

17.12 I C Master Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the beginning of the next serial transfer, the I²C bus will

not be released.

17.9 IPMI Support

The control bit, IPMIEN, enables the module to support

Intelligent Peripheral Management Interface (IPMI).

When this bit is set, the module accepts and acts upon

all addresses.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the data direction bit. In

this case, the data direction bit (R_W) is logic ‘0’. Serial

data is transmitted 8 bits at a time. After each byte is

transmitted, an ACK bit is received. Start and Stop

conditions are output to indicate the beginning and the

end of a serial transfer.

17.10 General Call Address Support

The general call address can address all devices.

When this address is used, all devices should, in

theory, respond with an Acknowledgement.

The general call address is one of eight addresses

reserved for specific purposes by the I²C protocol. It

consists of all ‘0’s with R_W = 0.

In Master Receive mode, the first byte transmitted

contains the slave address of the transmitting device

(7 bits) and the data direction bit. In this case, the data

direction bit (R_W) is logic ‘1’. Thus, the first byte

transmitted is a 7-bit slave address, followed by a ‘1’ to

indicate the receive bit. Serial data is received via

SDA, while SCL outputs the serial clock. Serial data is

received 8 bits at a time. After each byte is received,

an ACK bit is transmitted. Start and Stop conditions

indicate the beginning and end of transmission.

The general call address is recognized when the Gen-

eral Call Enable (GCEN) bit is set (I2CCON<7> = 1).

Following a Start bit detection, 8 bits are shifted into

I2CRSR and the address is compared with I2CADD,

and is also compared with the general call address

which is fixed in hardware.

If a general call address match occurs, the I2CRSR is

transferred to the I2CRCV after the eighth clock, the

RBF flag is set, and on the falling edge of the ninth bit

(ACK bit), the Master Event Interrupt Flag (MI2CIF) is

set.

17.12.1 I²C MASTER TRANSMISSION

Transmission of a data byte, a 7-bit address or the

second half of a 10-bit address is accomplished by

simply writing a value to I2CTRN register. The user

should only write to I2CTRN when the module is in a

Wait state. This action will set the Buffer Full Flag (TBF)

and allow the Baud Rate Generator to begin counting

and start the next transmission. Each bit of address/

data will be shifted out onto the SDA pin after the falling

edge of SCL is asserted. The Transmit Status Flag,

TRSTAT (I2CSTAT<14>), indicates that a master

transmit is in progress.

When the interrupt is serviced, the source for the

interrupt can be checked by reading the contents of the

I2CRCV to determine if the address was device-specific,

or a general call address.

DS70141E-page 113

dsPIC30F3010/3011

17.12.2 I²C MASTER RECEPTION

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the TBF flag is

cleared, the SDA and SCL lines are deasserted and a

value can now be written to I2CTRN. When the user

services the I²C master event Interrupt Service

Routine, if the I²C bus is free (i.e., the P bit is set), the

user can resume communication by asserting a Start

condition.

Master mode reception is enabled by programming the

Receive Enable (RCEN) bit (I2CCON<3>). The I²C

module must be Idle before the RCEN bit is set; other-

wise, the RCEN bit will be disregarded. The Baud Rate

Generator begins counting, and on each rollover, the

state of the SCL pin toggles, and data is shifted into the

I2CRSR on the rising edge of each clock.

If a Start, Restart, Stop or Acknowledge condition was

in progress when the bus collision occurred, the condi-

tion is aborted, the SDA and SCL lines are deasserted

and the respective control bits in the I2CCON register

are cleared to ‘0’. When the user services the bus

collision Interrupt Service Routine, and if the I²C bus is

free, the user can resume communication by asserting

a Start condition.

17.12.3 BAUD RATE GENERATOR (BRG)

In I²C Master mode, the reload value for the BRG is

located in the I2CBRG register. When the BRG is

loaded with this value, the BRG counts down to ‘0’ and

stops until another reload has taken place. If clock

arbitration is taking place, for instance, the BRG is

reloaded when the SCL pin is sampled high.

The Master will continue to monitor the SDA and SCL

pins, and if a Stop condition occurs, the MI2CIF bit will

be set.

As per the I²C standard, FSCL may be 100 kHz or

400 kHz. However, the user can specify any baud rate

up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.

A write to the I2CTRN will start the transmission of data

at the first data bit, regardless of where the transmitter

left off when bus collision occurred.

EQUATION 17-1: I2CBRG VALUE

In a Multi-Master environment, the interrupt generation

on the detection of Start and Stop conditions allows the

determination of when the bus is free. Control of the I²C

bus can be taken when the P bit is set in the I2CSTAT

register, or the bus is Idle and the S and P bits are

cleared.

FCY

FSCL

FCY

1,111,111

I2CBRG =

– 1

–

(

)

17.12.4 CLOCK ARBITRATION

Clock arbitration occurs when the master deasserts the

SCL pin (SCL allowed to float high) during any receive,

transmit or Restart/Stop condition. When the SCL pin is

allowed to float high, the Baud Rate Generator is

suspended from counting until the SCL pin is actually

sampled high. When the SCL pin is sampled high, the

Baud Rate Generator is reloaded with the contents of

I2CBRG and begins counting. This ensures that the

SCL high time will always be at least one BRG rollover

count in the event that the clock is held low by an

external device.

2

17.13 I C Module Operation During CPU

Sleep and Idle Modes

17.13.1 I²C OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’. If

Sleep occurs in the middle of a transmission, and the

state machine is partially into a transmission as the

clocks stop, then the transmission is aborted. Similarly,

if Sleep occurs in the middle of a reception, then the

reception is aborted.

17.12.5 MULTI-MASTER COMMUNICATION,

BUS COLLISION AND BUS

ARBITRATION

Multi-master operation support is achieved by bus

arbitration. When the master outputs address/data bits

onto the SDA pin, arbitration takes place when the

master outputs a ‘1’ on SDA, by letting SDA float high

while another master asserts a ‘0’. When the SCL pin

floats high, data should be stable. If the expected data

on SDA is a ‘1’ and the data sampled on the SDA

pin = 0, then a bus collision has taken place. The

master will set the MI2CIF pulse and reset the master

portion of the I²C port to its Idle state.

17.13.2 I²C OPERATION DURING CPU IDLE

MODE

For the I²C, the I2CSIDL bit selects if the module will

stop on Idle or continue on Idle. If I2CSIDL = 0, the

module will continue operation on assertion of the Idle

mode. If I2CSIDL = 1, the module will stop on Idle.

DS70141E-page 114

dsPIC30F3010/3011

DS70141E-page 115

dsPIC30F3010/3011

NOTES:

DS70141E-page 116

dsPIC30F3010/3011

18.1 UART Module Overview

18.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART) MODULE

The key features of the UART module are:

• Full-duplex, 8 or 9-bit data communication

• Even, odd or no parity options (for 8-bit data)

• One or two Stop bits

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

• Fully integrated Baud Rate Generator with 16-bit

prescaler

• Baud rates range from 38 bps to 1.875 Mbps at a

30 MHz instruction rate

• 4-word deep transmit data buffer

• 4-word deep receive data buffer

This section describes the Universal Asynchronous

Receiver/Transmitter Communications module.

• Parity, framing and buffer overrun error detection

• Support for interrupt only on address detect

(9th bit = 1)

• Separate transmit and receive interrupts

• Loopback mode for diagnostic support

FIGURE 18-1:

UART TRANSMITTER BLOCK DIAGRAM

Internal Data Bus

Control and Status bits

Write

UTX8

UxTXREG Low Byte

Transmit Control

– Control TSR

– Control Buffer

– Generate Flags

– Generate Interrupt

Load TSR

UxTXIF

UTXBRK

Data

Transmit Shift Register (UxTSR)

‘0’ (Start)

‘1’ (Stop)

UxTX

16x Baud Clock

from Baud Rate

Generator

Parity

Generator

16 Divider

Parity

Control

Signals

Note:

x = 1 or 2

dsPIC30F3010 only has UART1.

DS70141E-page 117

dsPIC30F3010/3011

FIGURE 18-2:

UART RECEIVER BLOCK DIAGRAM

Internal Data Bus

16

Write

Read

Read Read

Write

UxMODE

UxSTA

UxRXREG Low Byte

URX8

Receive Buffer Control

– Generate Flags

– Generate Interrupt

– Shift Data Characters

8-9

LPBACK

From UxTX

UxRX

Load RSR

to Buffer

Receive Shift Register

(UxRSR)

1

0

Control

Signals

· Start bit Detect

· Parity Check

· Stop bit Detect

· Shift Clock Generation

· Wake Logic

16 Divider

16x Baud Clock from

Baud Rate Generator

UxRXIF

DS70141E-page 118

dsPIC30F3010/3011

18.2 Enabling and Setting Up UART

18.2.1 ENABLING THE UART

18.3 Transmitting Data

18.3.1

TRANSMITTING IN 8-BIT DATA

MODE

The UART module is enabled by setting the UARTEN

bit in the UxMODE register (where x = 1 or 2). Once

enabled, the UxTX and UxRX pins are configured as an

output and an input respectively, overriding the TRIS

and LATCH register bit settings for the corresponding

I/O port pins. The UxTX pin is at logic ‘1’ when no

transmission is taking place.

The following steps must be performed in order to

transmit 8-bit data:

1. Set up the UART:

First, the data length, parity and number of Stop

bits must be selected. Then, the transmit and

receive interrupt enable and priority bits are set

up in the UxMODE and UxSTA registers. Also,

the appropriate baud rate value must be written

to the UxBRG register.

18.2.2

DISABLING THE UART

The UART module is disabled by clearing the

UARTEN bit in the UxMODE register. This is the

default state after any Reset. If the UART is disabled,

all I/O pins operate as port pins under the control of

the LATCH and TRIS bits of the corresponding port

pins.

2. Enable the UART by setting the UARTEN bit

(UxMODE<15>).

3. Set the UTXEN bit (UxSTA<10>), thereby

enabling a transmission.

4. Write the byte to be transmitted to the lower byte

of UxTXREG. The value will be transferred to the

Transmit Shift register (UxTSR) immediately

and the serial bit stream will start shifting out

during the next rising edge of the baud clock.

Alternatively, the data byte may be written while

UTXEN = 0, following which, the user may set

UTXEN. This will cause the serial bit stream to

begin immediately because the baud clock will

start from a cleared state.

Disabling the UART module resets the buffers to

empty states. Any data characters in the buffers are

lost and the baud rate counter is reset.

All error and status flags associated with the UART

module are reset when the module is disabled. The

URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and

UTXBF bits are cleared, whereas RIDLE and TRMT

are set. Other control bits, including ADDEN,

URXISEL<1:0>, UTXISEL, as well as the UxMODE

and UxBRG registers, are not affected.

5. A transmit interrupt will be generated depending

on the value of the interrupt control bit, UTXISEL

(UxSTA<15>).

Clearing the UARTEN bit while the UART is active will

abort all pending transmissions and receptions and

reset the module as defined above. Re-enabling the

UART will restart the UART in the same configuration.

18.3.2

TRANSMITTING IN 9-BIT DATA

MODE

18.2.3

ALTERNATE I/O

The sequence of steps involved in the transmission of

9-bit data is similar to 8-bit transmission, except that a

16-bit data word (of which the upper 7 bits are always

clear) must be written to the UxTXREG register.

The alternate I/O function is enabled by setting the

ALTIO bit (U1MODE<10>). If ALTIO = 1, the UxATX and

UxARX pins (alternate transmit and alternate receive

pins, respectively) are used by the UART module

instead of the UxTX and UxRX pins. If ALTIO = 0, the

UxTX and UxRX pins are used by the UART module.

18.3.3

TRANSMIT BUFFER (UXTXB)

The transmit buffer is 9 bits wide and 4 characters

deep. Including the Transmit Shift register (UxTSR),

the user effectively has a 5-deep FIFO (First In First

Out) buffer. The UTXBF Status bit (UxSTA<9>)

indicates whether the transmit buffer is full.

18.2.4

SETTING UP DATA, PARITY AND

STOP BIT SELECTIONS

Control bits, PDSEL<1:0> in the UxMODE register, are

used to select the data length and parity used in the

transmission. The data length may either be 8 bits with

even, odd or no parity, or 9 bits with no parity.

If a user attempts to write to a full buffer, the new data

will not be accepted into the FIFO, and no data shift

will occur within the buffer. This enables recovery from

a buffer overrun condition.

The STSEL bit determines whether one or two Stop bits

will be used during data transmission.

The FIFO is reset during any device Reset, but is not

affected when the device enters or wakes up from a

power-saving mode.

The default (power-on) setting of the UART is 8 bits, no

parity, 1 Stop bit (typically represented as 8, N, 1).

DS70141E-page 119

dsPIC30F3010/3011

18.3.4

TRANSMIT INTERRUPT

18.4.2

RECEIVE BUFFER (UXRXB)

The transmit interrupt flag (U1TXIF or U2TXIF) is

located in the corresponding Interrupt Flag register.

The receive buffer is 4 words deep. Including the

Receive Shift register (UxRSR), the user effectively

has a 5-word deep FIFO buffer.

The transmitter generates an edge to set the UxTXIF

bit. The condition for generating the interrupt depends

on the UTXISEL control bit:

URXDA (UxSTA<0>) = 1 indicates that the receive

buffer has data available. URXDA = 0implies that the

buffer is empty. If a user attempts to read an empty

buffer, the old values in the buffer will be read and no

data shift will occur within the FIFO.

a) If UTXISEL = 0, an interrupt is generated when a

word is transferred from the transmit buffer to the

Transmit Shift register (UxTSR). This implies that

the transmit buffer has at least one empty word.

The FIFO is reset during any device Reset. It is not

affected when the device enters or wakes up from a

power-saving mode.

b) If UTXISEL = 1, an interrupt is generated when

a word is transferred from the transmit buffer to

the Transmit Shift register (UxTSR) and the

transmit buffer is empty.

18.4.3

RECEIVE INTERRUPT

The receive interrupt flag (U1RXIF or U2RXIF) can be

read from the corresponding Interrupt Flag register.

The interrupt flag is set by an edge generated by the

receiver. The condition for setting the receive interrupt

flag depends on the settings specified by the

URXISEL<1:0> (UxSTA<7:6>) control bits.

Switching between the two interrupt modes during

operation is possible and sometimes offers more

flexibility.

18.3.5

TRANSMIT BREAK

Setting the UTXBRK bit (UxSTA<11>) will cause the

UxTX line to be driven to logic ‘0’. The UTXBRK bit

overrides all transmission activity. Therefore, the user

should generally wait for the transmitter to be Idle

before setting UTXBRK.

a) If URXISEL<1:0> = 00 or 01, an interrupt is

generated every time a data word is transferred

from the Receive Shift register (UxRSR) to the

receive buffer. There may be one or more

characters in the receive buffer.

To send a Break character, the UTXBRK bit must be

set by software and must remain set for a minimum of

13 baud clock cycles. The UTXBRK bit is then cleared

by software to generate Stop bits. The user must wait

for a duration of at least one or two baud clock cycles

in order to ensure a valid Stop bit(s) before reloading

the UxTXB or starting other transmitter activity. Trans-

mission of a Break character does not generate a

transmit interrupt.

b) If URXISEL<1:0> = 10, an interrupt is generated

when a word is transferred from the Receive

Shift register (UxRSR) to the receive buffer,

which, as a result of the transfer, contains

3 characters.

c) If URXISEL<1:0> = 11, an interrupt is set when

a word is transferred from the Receive Shift

register (UxRSR) to the receive buffer, which, as

a result of the transfer, contains 4 characters

(i.e., becomes full).

18.4 Receiving Data

Switching between the Interrupt modes during opera-

tion is possible, though generally not advisable during

normal operation.

18.4.1

RECEIVING IN 8-BIT OR 9-BIT DATA

MODE

The following steps must be performed while receiving

8-bit or 9-bit data:

18.5 Reception Error Handling

1. Set up the UART (see Section 18.3.1 “Trans-

mitting in 8-Bit Data Mode” and Sec-

tion 18.3.2 “Transmitting in 9-Bit Data Mode”).

18.5.1

RECEIVE BUFFER OVERRUN

ERROR (OERR BIT)

2. Enable the UART (see Section 18.3.1 “Trans-

mitting in 8-Bit Data Mode” and Section 18.3.2

“Transmitting in 9-Bit Data Mode”).

The OERR bit (UxSTA<1>) is set if all of the following

conditions occur:

a) The receive buffer is full.

3. A receive interrupt will be generated when one

or more data words have been received,

depending on the receive interrupt settings

specified by the URXISEL bits (UxSTA<7:6>).

b) The Receive Shift register is full, but unable to

transfer the character to the receive buffer.

c) The Stop bit of the character in the UxRSR is

detected, indicating that the UxRSR needs to

transfer the character to the buffer.

4. Read the OERR bit to determine if an overrun

error has occurred. The OERR bit must be reset

in software.

Once OERR is set, no further data is shifted in UxRSR

(until the OERR bit is cleared in software or a Reset

occurs). The data held in UxRSR and UxRXREG

remains valid.

5. Read the received data from UxRXREG. The act

of reading UxRXREG will move the next word to

the top of the receive FIFO, and the PERR and

FERR values will be updated.

DS70141E-page 120

dsPIC30F3010/3011

18.5.2

FRAMING ERROR (FERR)

18.6 Address Detect Mode

The FERR bit (UxSTA<2>) is set if a ‘0’ is detected

instead of a Stop bit. If two Stop bits are selected, both

Stop bits must be ‘1’; otherwise, FERR will be set. The

read-only FERR bit is buffered along with the received

data; it is cleared on any Reset.

Setting the ADDEN bit (UxSTA<5>) enables the

Address Detect mode, in which a 9th bit (URX8) value

of ‘1’ identifies the received word as an address rather

than data. This mode is only applicable for 9-bit data

communication. The URXISEL control bit does not

have any impact on interrupt generation in this mode,

since an interrupt (if enabled) will be generated every

time the received word has the 9th bit set.

18.5.3

PARITY ERROR (PERR)

The PERR bit (UxSTA<3>) is set if the parity of the

received word is incorrect. This error bit is applicable

only if a Parity mode (odd or even) is selected. The

read-only PERR bit is buffered along with the received

data bytes; it is cleared on any Reset.

18.7 Loopback Mode

Setting the LPBACK bit enables this special mode in

which the UxTX pin is internally connected to the UxRX

pin. When configured for the Loopback mode, the

UxRX pin is disconnected from the internal UART

receive logic. However, the UxTX pin still functions as

in a normal operation.

18.5.4

IDLE STATUS

When the receiver is active (i.e., between the initial

detection of the Start bit and the completion of the Stop

bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the

completion of the Stop bit and detection of the next

Start bit, the RIDLE bit is ‘1’, indicating that the UART

is Idle.

To select this mode:

a) Configure UART for desired mode of operation.

b) Set LPBACK = 1to enable Loopback mode.

c) Enable transmission as defined in Section 18.3

“Transmitting Data”.

18.5.5

RECEIVE BREAK

The receiver will count and expect a certain number of

bit times based on the values programmed in the

PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)

bits.

18.8 Baud Rate Generator

The UART has a 16-bit Baud Rate Generator to allow

maximum flexibility in baud rate generation. The Baud

Rate Generator register (UxBRG) is readable and

writable. The baud rate is computed as follows:

If the break is longer than 13 bit times, the reception is

considered complete after the number of bit times

specified by PDSEL and STSEL. The URXDA bit is

set, FERR is set, zeros are loaded into the receive

FIFO, interrupts are generated, if appropriate and the

RIDLE bit is set.

BRG = 16-bit value held in UxBRG register

(0 through 65535)

FCY = Instruction Clock Rate (1/TCY)

The baud rate is given by Equation 18-1.

When the module receives a long Break signal and the

receiver has detected the Start bit, the data bits and

the invalid Stop bit (which sets the FERR), the receiver

must wait for a valid Stop bit before looking for the next

Start bit. It cannot assume that the Break condition on

the line is the next Start bit.

EQUATION 18-1: BAUD RATE

Baud Rate = FCY/(16*(BRG+1))

Break is regarded as a character containing all 0’s,

with the FERR bit set. The Break character is loaded

into the buffer. No further reception can occur until a

Stop bit is received. Note that RIDLE goes high when

the Stop bit has not been received yet.

Therefore, maximum baud rate possible is

FCY/16 (if BRG = 0),

and the minimum baud rate possible is

FCY/(16 * 65536).

With a full 16-bit Baud Rate Generator, at 30 MIPs

operation, the minimum baud rate achievable is

28.5 bps.

DS70141E-page 121

dsPIC30F3010/3011

18.10.2 UART OPERATION DURING CPU

IDLE MODE

18.9 Auto Baud Support

To allow the system to determine baud rates of

received characters, the input can be optionally linked

to a selected capture input. To enable this mode, the

user must program the input capture module to detect

the falling and rising edges of the Start bit.

For the UART, the USIDL bit selects if the module will

stop operation when the device enters Idle mode, or

whether the module will continue on Idle. If USIDL = 0,

the module will continue operation during Idle mode. If

USIDL = 1, the module will stop on Idle.

18.10 UART Operation During CPU

Sleep and Idle Modes

18.10.1 UART OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’. If

entry into Sleep mode occurs while a transmission is

in progress, then the transmission is aborted. The

UxTX pin is driven to logic ‘1’. Similarly, if entry into

Sleep mode occurs while a reception is in progress,

then the reception is aborted. The UxSTA, UxMODE,

Transmit and Receive registers and buffers, and the

UxBRG register are not affected by Sleep mode.

If the WAKE bit (UxMODE<7>) is set before the device

enters Sleep mode, then a falling edge on the UxRX

pin will generate a receive interrupt. The Receive

Interrupt Select Mode bit (URXISEL) has no effect for

this function. If the receive interrupt is enabled, then

this will wake-up the device from Sleep. The UARTEN

bit must be set in order to generate a wake-up

interrupt.

DS70141E-page 122

dsPIC30F3010/3011

DS70141E-page 123

dsPIC30F3010/3011

NOTES:

DS70141E-page 124

dsPIC30F3010/3011

The ADC module has six 16-bit registers:

19.0 10-BIT HIGH-SPEED ANALOG-

TO-DIGITAL CONVERTER

(ADC) MODULE

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

• A/D Control Register 3 (ADCON3)

• A/D Input Select register (ADCHS)

• A/D Port Configuration register (ADPCFG)

• A/D Input Scan Selection register (ADCSSL)

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046).

The ADCON1, ADCON2 and ADCON3 registers

control the operation of the ADC module. The ADCHS

register selects the input channels to be converted. The

ADPCFG register configures the port pins as analog

inputs or as digital I/O. The ADCSSL register selects

inputs for scanning.

The 10-bit high-speed Analog-to-Digital Converter

(ADC) allows conversion of an analog input signal to a

10-bit digital number. This module is based on a Suc-

cessive Approximation Register (SAR) architecture,

and provides a maximum sampling rate of 1 Msps. The

ADC module has 16 analog inputs which are multi-

plexed into four sample and hold amplifiers. The output

of the sample and hold is the input into the converter,

which generates the result. The analog reference volt-

ages are software selectable to either the device sup-

ply voltage (AVDD/AVSS) or the voltage level on the

(VREF+/VREF-) pin. The ADC has a unique feature of

being able to operate while the device is in Sleep

mode.

Note:

The SSRC<2:0>, ASAM, SIMSAM,

SMPI<3:0>, BUFM and ALTS bits, as well

as the ADCON3 and ADCSSL registers,

must not be written to while ADON = 1.

This would lead to indeterminate results.

The block diagram of the ADC module is shown in

Figure 19-1.

DS70141E-page 125

dsPIC30F3010/3011

FIGURE 19-1:

10-BIT HIGH-SPEED ADC FUNCTIONAL BLOCK DIAGRAM

AVDD

VREF+

AVSS

VREF-

AN0

AN3

AN0

AN1

AN2

+

CH1

CH2

CH3

ADC

S/H

AN6

-

10-Bit Result

Conversion Logic

AN1

AN4

+

S/H

AN7

-

16-word, 10-bit

Dual Port

Buffer

AN2

AN5

+

S/H

AN8

CH1,CH2,

CH3,CH0

-

Sample/Sequence

Control

Sample

AN0

AN1

AN2

AN3

Input

Switches

Input Mux

Control

AN3

AN4

AN5

AN6

AN7

AN8

AN5

AN6⁽¹⁾

AN7⁽¹⁾

AN8⁽¹⁾

+

CH0

S/H

-

AN1

Note 1: Not available on dsPIC30F3010 devices.

DS70141E-page 126

dsPIC30F3010/3011

The CHPS bits select how many channels are sam-

pled. This can vary from 1, 2 or 4 channels. If the CHPS

bits select 1 channel, the CH0 channel will be sampled

at the sample clock and converted. The result is stored

in the buffer. If the CHPS bits select 2 channels, the

CH0 and CH1 channels will be sampled and converted.

If the CHPS bits select 4 channels, the CH0, CH1, CH2

and CH3 channels will be sampled and converted.

19.1 ADC Result Buffer

The module contains a 16-word, dual port, read-only

buffer, called ADCBUF0...ADCBUFF, to buffer the ADC

results. The RAM is 10 bits wide, but is read into different

format 16-bit words. The contents of the sixteen ADC

Conversion Result Buffer registers, ADCBUF0 through

ADCBUFF, cannot be written by user software.

The SMPI bits select the number of acquisition/

conversion sequences that would be performed before

an interrupt occurs. This can vary from 1 sample per

interrupt to 16 samples per interrupt.

19.2 Conversion Operation

After the ADC module has been configured, the sample

acquisition is started by setting the SAMP bit. Various

sources, such as a programmable bit, timer time-outs

and external events, will terminate acquisition and start

a conversion. When the A/D conversion is complete,

the result is loaded into ADCBUF0...ADCBUFF, and

the A/D Interrupt Flag, ADIF, and the DONE bit are set

after the number of samples specified by the SMPI bit.

The user cannot program a combination of CHPS and

SMPI bits that specifies more than 16 conversions per

interrupt, or 8 conversions per interrupt, depending on

the BUFM bit. The BUFM bit, when set, will split the

16-word results buffer (ADCBUF0...ADCBUFF) into

two 8-word groups. Writing to the 8-word buffers will be

alternated on each interrupt event. Use of the BUFM bit

will depend on how much time is available for moving

data out of the buffers after the interrupt, as determined

by the application.

The following steps should be followed for doing an

A/D conversion:

• Configure the ADC module:

- Configure analog pins, voltage reference and

digital I/O

If the processor can quickly unload a full buffer within

the time it takes to acquire and convert one channel,

the BUFM bit can be ‘0’ and up to 16 conversions may

be done per interrupt. The processor will have one

sample and conversion time to move the sixteen

conversions.

- Select A/D input channels

- Select A/D conversion clock

- Select A/D conversion trigger

- Turn on A/D module

• Configure A/D interrupt (if required):

- Clear ADIF bit

If the processor cannot unload the buffer within the

acquisition and conversion time, the BUFM bit should be

‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,

then eight conversions will be loaded into 1/2 of the buf-

fer, following which an interrupt occurs. The next eight

conversions will be loaded into the other 1/2 of the buffer.

The processor will have the entire time between

interrupts to move the eight conversions.

- Select A/D interrupt priority

• Start sampling

• Wait the required acquisition time

• Trigger acquisition end; start conversion

• Wait for A/D conversion to complete, by either:

- Waiting for the A/D interrupt

- Waiting for the DONE bit to be set

• Read A/D result buffer; clear ADIF if required

The ALTS bit can be used to alternate the inputs

selected during the sampling sequence. The input

multiplexer has two sets of sample inputs: MUX A and

MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are

selected for sampling. If the ALTS bit is ‘1’ and

SMPI<3:0> = 0000, on the first sample/convert

sequence, the MUX A inputs are selected, and on the

next acquire/convert sequence, the MUX B inputs are

selected.

19.3 Selecting the Conversion

Sequence

Several groups of control bits select the sequence in

which the A/D connects inputs to the sample/hold

channels, converts channels, writes the buffer memory

and generates interrupts. The sequence is controlled

by the sampling clocks.

The CSCNA bit (ADCON2<10>) will allow the CH0

channel inputs to be alternately scanned across a

selected number of analog inputs for the MUX A group.

The inputs are selected by the ADCSSL register. If a

particular bit in the ADCSSL register is ‘1’, the corre-

sponding input is selected. The inputs are always

scanned from lower to higher numbered inputs, starting

after each interrupt. If the number of inputs selected is

greater than the number of samples taken per interrupt,

the higher numbered inputs are unused.

The SIMSAM bit controls the acquire/convert

sequence for multiple channels. If the SIMSAM bit is

‘0’, the two or four selected channels are acquired and

converted sequentially, with two or four sample clocks.

If the SIMSAM bit is ‘1’, two or four selected channels

are acquired simultaneously, with one sample clock.

The channels are then converted sequentially. Obvi-

ously, if there is only 1 channel selected, the SIMSAM

bit is not applicable.

DS70141E-page 127

dsPIC30F3010/3011

19.4 Programming the Start of

Conversion Trigger

19.6 Selecting the A/D Conversion

Clock

The conversion trigger will terminate acquisition and

start the requested conversions.

The A/D conversion requires 12 TAD. The source of the

A/D conversion clock is software selected using a 6-bit

counter. There are 64 possible options for TAD.

The SSRC<2:0> bits select the source of the

conversion trigger.

EQUATION 19-1: A/D CONVERSION CLOCK

The SSRC bits provide for up to five alternate sources

of conversion trigger.

TAD = TCY • (0.5 • (ADCS<5:0> + 1))

TAD

When SSRC<2:0> = 000, the conversion trigger is

under software control. Clearing the SAMP bit will

cause the conversion trigger.

ADCS<5:0> = 2

– 1

TCY

The internal RC oscillator is selected by setting the

ADRC bit.

When SSRC<2:0> = 111 (Auto-Start mode), the

conversion trigger is under A/D clock control. The

SAMC bits select the number of A/D clocks between

the start of acquisition and the start of conversion. This

provides the fastest conversion rates on multiple

channels. The SAMC bits must always be at least one

clock cycle.

For correct A/D conversions, the A/D conversion clock

(TAD) must be selected to ensure a minimum TAD time

of 83.33 nsec (for VDD = 5V). Refer to Section 23.0

"Electrical Characteristics" for minimum TAD under

other operating conditions.

Other trigger sources can come from timer modules,

motor control PWM module or external interrupts.

Example 19-1 shows a sample calculation for the

ADCS<5:0> bits, assuming a device operating speed

of 30 MIPS.

Note:

To operate the A/D at the maximum

specified conversion speed, the auto-

convert trigger option should be selected

(SSRC = 111) and the auto-sample time

EXAMPLE 19-1:

A/D CONVERSION CLOCK

CALCULATION

bits should be set to

(SAMC = 00001). This configuration will

give total conversion period

(sample + convert) of 13 TAD.

1

TAD

TAD = 154 nsec

TCY = 33 nsec (30 MIPS)

a

TAD

TCY

ADCS<5:0> = 2

– 1

The use of any other conversion trigger

will result in additional TAD cycles to

synchronize the external event to the A/D.

154 nsec

33 nsec

= 2 •

– 1

= 8.33

19.5 Aborting a Conversion

Therefore,

Set ADCS<5:0> = 9

Clearing the ADON bit during a conversion will abort

the current conversion and stop the sampling sequenc-

ing. The ADCBUF will not be updated with the partially

completed A/D conversion sample. That is, the

ADCBUF will continue to contain the value of the last

completed conversion (or the last value written to the

ADCBUF register).

TCY

2

Actual TAD =

=

(ADCS<5:0> + 1)

33 nsec

2

(9 + 1)

= 165 nsec

If the clearing of the ADON bit coincides with an

auto-start, the clearing has a higher priority.

After the A/D conversion is aborted, a 2 TAD wait is

required before the next sampling may be started by

setting the SAMP bit.

If sequential sampling is specified, the A/D will continue

at the next sample pulse which corresponds with the

next channel converted. If simultaneous sampling is

specified, the A/D will continue with the next multi-chan-

nel group conversion sequence.

DS70141E-page 128

dsPIC30F3010/3011

19.7 ADC Conversion Speeds

The dsPIC30F 10-bit ADC specifications permit a

maximum

1

Msps sampling rate. Table 19-1

summarizes the conversion speeds for the dsPIC30F

10-bit A/D converter and the required operating

conditions.

TABLE 19-1: 10-BIT ADC CONVERSION RATE PARAMETERS

dsPIC30F 10-Bit ADC Conversion Rates

TAD

Sampling

ADC Speed

RS Max

VDD

Temperature

A/D Channels Configuration

Minimum Time Min

Up to

83.33 ns

12 TAD

500Ω

4.5V to 5.5V -40°C to +85°C

V

CH1, CH2 or CH3

CH0

REF- VREF+

1 Msps⁽¹⁾

ANx

S/H

ADC

Up to

95.24 ns

2 TAD

500Ω

4.5V to 5.5V -40°C to +85°C

3.0V to 5.5V -40°C to +125°C

V

REF

-

VREF+

750 ksps⁽¹⁾

CHX

ANx

S/H

ADC

Up to

138.89 ns

12 TAD

VREF

-

VREF+

600 ksps⁽¹⁾

CH1, CH2 or CH3

CH0

ANx

S/H

ADC

Up to

500 ksps

153.85 ns

256.41 ns

1 TAD

5.0 kΩ

4.5V to 5.5V -40°C to +125°C

3.0V to 5.5V -40°C to +125°C

V

REF

or

-

V

REF

or

+

AVSS AVDD

CHX

ANx

S/H

ADC

ANx or VREF

-

Up to

300 ksps

VREF

-

VREF

+

or

AVSS AVDD

CHX

ANx

S/H

ADC

ANx or VREF

-

Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 19-2 for recommended

circuit.

DS70141E-page 129

dsPIC30F3010/3011

The configuration guidelines give the required setup

values for the conversion speeds above 500 ksps,

since they require external VREF pins usage and there

are some differences in the configuration procedure.

Configuration details that are not critical to the

conversion speed have been omitted.

Figure 19-2 depicts the recommended circuit for the

conversion rates above 500 ksps.

FIGURE 19-2:

ADC VOLTAGE REFERENCE SCHEMATIC

1

2

3

4

5

6

7

8

9

33

32

31

30

29

28

27

26

25

24

23

V

DD

V

DD

V

DD

C8

C7

C6

0.01

0.1

μ

F

μ

F

1 μF

V

SS

V

SS

VDD

dsPIC30F3011

VDD

V

C5

1 μF

C4

C3

0.01

0.1

μ

F

μ

F

10

11

V

DD

R1

10

R2

10

VDD

C2

0.1 μF

C1

0.01

μF

19.7.1

1 Msps CONFIGURATION

GUIDELINE

19.7.1.2

Multiple Analog Inputs

The ADC can also be used to sample multiple analog

inputs using multiple sample and hold channels. In this

case, the total 1 Msps conversion rate is divided among

the different input signals. For example, four inputs can

be sampled at a rate of 250 ksps for each signal or two

inputs could be sampled at a rate of 500 ksps for each

signal. Sequential sampling must be used in this con-

figuration to allow adequate sampling time on each

input.

The configuration for 1 Msps operation is dependent on

whether a single input pin is to be sampled or whether

multiple pins will be sampled.

19.7.1.1

Single Analog Input

For conversions at 1 Msps for a single analog input, at

least two sample and hold channels must be enabled.

The analog input multiplexer must be configured so

that the same input pin is connected to both sample

and hold channels. The ADC converts the value held

on one S/H channel, while the second S/H channel

acquires a new input sample.

DS70141E-page 130

dsPIC30F3010/3011

19.7.1.3

1 Msps Configuration Items

19.7.3

600 ksps CONFIGURATION

GUIDELINE

The following configuration items are required to

achieve a 1 Msps conversion rate.

The configuration for 600 ksps operation is dependent

on whether a single input pin is to be sampled or

whether multiple pins will be sampled.

• Comply with conditions provided in Table 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 19-2

19.7.3.1

Single Analog Input

• Set SSRC<2:0> = 111in the ADCON1 register to

When performing conversions at 600 ksps for a single

analog input, at least two sample and hold channels

must be enabled. The analog input multiplexer must be

configured so that the same input pin is connected to

both sample and hold channels. The A/D converts the

value held on one S/H channel, while the second S/H

channel acquires a new input sample.

enable the auto-convert option

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable sequential sampling by clearing the

SIMSAM bit in the ADCON1 register

• Enable at least two sample and hold channels by

writing the CHPS<1:0> control bits in the

ADCON2 register

19.7.3.2

Multiple Analog Input

• Write the SMPI<3:0> control bits in the ADCON2

register for the desired number of conversions

between interrupts. At a minimum, set

SMPI<3:0> = 0001since at least two sample and

hold channels should be enabled

The A/D converter can also be used to sample multiple

analog inputs using multiple sample and hold channels.

In this case, the total 600 ksps conversion rate is

divided among the different input signals. For example,

four inputs can be sampled at a rate of 150 ksps for

each signal or two inputs can be sampled at a rate of

300 ksps for each signal. Sequential sampling must be

used in this configuration to allow adequate sampling

time on each input.

• Configure the A/D clock period to be:

1

= 83.33 ns

12 x 1,000,000

by writing to the ADCS<5:0> control bits in the

ADCON3 register

19.7.3.3

600 ksps Configuration Items

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

The following configuration items are required to

achieve a 600 ksps conversion rate.

• Select at least two channels per analog input pin

by writing to the ADCHS register

• Comply with conditions provided in Table 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 19-2

19.7.2

750 ksps CONFIGURATION

GUIDELINE

• Set SSRC<2:0> = 111in the ADCON1 register to

enable the auto-convert option

The following configuration items are required to

achieve a 750 ksps conversion rate. This configuration

assumes that a single analog input is to be sampled.

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable sequential sampling by clearing the

SIMSAM bit in the ADCON1 register

• Comply with conditions provided in Table 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 19-2

• Enable at least two sample and hold channels by

writing the CHPS<1:0> control bits in the

ADCON2 register

• Set SSRC<2:0> = 111in the ADCON1 register to

enable the auto-convert option

• Write the SMPI<3:0> control bits in the ADCON2

register for the desired number of conversions

between interrupts. At a minimum, set

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

SMPI<3:0> = 0001since at least two sample and

hold channels should be enabled

• Enable one sample and hold channel by setting

CHPS<1:0> = 00in the ADCON2 register

• Configure the A/D clock period to be:

1

• Write the SMPI<3:0> control bits in the ADCON2

register for the desired number of conversions

between interrupts

= 138.89 ns

12 x 600,000

• Configure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

1

= 95.24 ns

(12 + 2) x 750,000

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

by writing to the ADCS<5:0> control bits in the

ADCON3 register

Select at least two channels per analog input pin by

writing to the ADCHS register.

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

DS70141E-page 131

dsPIC30F3010/3011

The user must allow at least 1 TAD period of sampling

time, TSAMP, between conversions to allow each

sample to be acquired. This sample time may be

controlled manually in software by setting/clearing the

SAMP bit, or it may be automatically controlled by the

ADC. In an automatic configuration, the user must

allow enough time between conversion triggers so that

the minimum sample time can be satisfied. Refer to the

Section 23.0 "Electrical Characteristics" for TAD and

sample time requirements.

19.8 A/D Acquisition Requirements

The analog input model of the 10-bit ADC is shown in

Figure 19-3. The total sampling time for the ADC is a

function of the internal amplifier settling time, device

VDD and the holding capacitor charge time.

For the ADC to meet its specified accuracy, the Charge

Holding Capacitor (CHOLD) must be allowed to fully

charge to the voltage level on the analog input pin. The

Source Impedance (RS), the Interconnect Impedance

(RIC) and the Internal Sampling Switch (RSS)

Impedance combine to directly affect the time required

to charge the capacitor, CHOLD. The combined

impedance of the analog sources must therefore be

small enough to fully charge the holding capacitor

within the chosen sample time. To minimize the effects

of pin leakage currents on the accuracy of the A/D

converter, the maximum recommended source

impedance, RS, is 5 kΩ. After the analog input channel

is selected (changed), this sampling function must be

completed prior to starting the conversion. The internal

holding capacitor will be in a discharged state prior to

each sample operation.

FIGURE 19-3:

ADC ANALOG INPUT MODEL

VDD

RIC ≤ 250Ω

RSS ≤ 3 kΩ

Sampling

Switch

VT = 0.6V

ANx

RSS

Rs

CHOLD

CPIN

= DAC capacitance

VA

ILEAKAGE

± 500 nA

VT = 0.6V

= 4.4 pF

VSS

Legend: CPIN

VT

= Input Capacitance

= Threshold Voltage

ILEAKAGE = Leakage Current at the pin due to

various junctions

RIC

= Interconnect Resistance

RSS

CHOLD

= Sampling Switch Resistance

= Sample/Hold Capacitance (from DAC)

Note:

CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ.

DS70141E-page 132

dsPIC30F3010/3011

If the ADC interrupt is enabled, the device will wake-up

from Sleep. If the ADC interrupt is not enabled, the

ADC module will then be turned off, although the

ADON bit will remain set.

19.9 Module Power-Down Modes

The module has three internal power modes. When the

ADON bit is ‘1’, the module is in Active mode; it is fully

powered and functional. When ADON is ‘0’, the module

is in Off mode. The digital and analog portions of the

circuit are disabled for maximum current savings. In

order to return to the Active mode from Off mode, the

user must wait for the ADC circuitry to stabilize.

19.10.2 A/D OPERATION DURING CPU IDLE

MODE

The ADSIDL bit selects if the module will stop on Idle or

continue on Idle. If ADSIDL = 0, the module will

continue operation on assertion of Idle mode. If

ADSIDL = 1, the module will stop on Idle.

19.10 ADC Operation During CPU Sleep

and Idle Modes

19.11 Effects of a Reset

19.10.1 ADC OPERATION DURING CPU

SLEEP MODE

A device Reset forces all registers to their Reset state.

This forces the ADC module to be turned off, and any

conversion and acquisition sequence is aborted. The

values that are in the ADCBUF registers are not

modified. The A/DC Result register will contain

unknown data after a Power-on Reset.

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’.

If Sleep occurs in the middle of a conversion, the

conversion is aborted. The converter will not continue

with a partially completed conversion on exit from

Sleep mode.

19.12 Output Formats

Register contents are not affected by the device

entering or leaving Sleep mode.

The ADC result is 10 bits wide. The data buffer RAM is

also 10 bits wide. The 10-bit data can be read in one of

four different formats. The FORM<1:0> bits select the

format. Each of the output formats translates to a 16-bit

result on the data bus.

The ADC module can operate during Sleep mode if the

ADC clock source is set to RC (ADRC = 1). When the

RC clock source is selected, the ADC module waits

one instruction cycle before starting the conversion.

This allows the SLEEP instruction to be executed,

which eliminates all digital switching noise from the

conversion. When the conversion is complete, the

DONE bit will be set and the result loaded into the

ADCBUF register.

Write data will always be in right justified (integer)

format.

FIGURE 19-4:

ADC OUTPUT DATA FORMATS

RAM Contents:

d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional (1.15)

Fractional (1.15)

Signed Integer

Integer

d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

0

d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

0

d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

DS70141E-page 133

dsPIC30F3010/3011

19.13 Configuring Analog Port Pins

19.14 Connection Considerations

The use of the ADPCFG and TRIS registers control the

operation of the ADC port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared

(output), the digital output level (VOH or VOL) will be

converted.

The analog inputs have diodes to VDD and VSS as ESD

protection. This requires that the analog input be

between VDD and VSS. If the input voltage exceeds this

range by greater than 0.3V (either direction), one of the

diodes becomes forward biased and it may damage the

device if the input current specification is exceeded.

The A/D operation is independent of the state of the

CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.

An external RC filter is sometimes added for anti-

aliasing of the input signal. The R component should be

selected to ensure that the sampling time requirements

are satisfied. Any external components connected (via

high-impedance) to an analog input pin (capacitor,

zener diode, etc.) should have very little leakage

current at the pin.

When reading the PORT register, all pins configured as

analog input channels will read as cleared.

Pins configured as digital inputs will not convert an

analog input. Analog levels on any pin that is defined as

a digital input (including the ANx pins) may cause the

input buffer to consume current that exceeds the

device specifications.

DS70141E-page 134

dsPIC30F3010/3011

DS70141E-page 135

dsPIC30F3010/3011

NOTES:

DS70141E-page 136

dsPIC30F3010/3011

20.1 Oscillator System Overview

20.0 SYSTEM INTEGRATION

The dsPIC30F oscillator system has the following

modules and features:

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

• Various external and internal oscillator options as

clock sources

• An on-chip PLL to boost internal operating

frequency

• A clock switching mechanism between various

clock sources

• Programmable clock postscaler for system power

savings

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

There are several features intended to maximize

system reliability, minimize cost through elimination of

external components, provide power-saving operating

modes and offer code protection:

• Clock Control register, OSCCON

• Configuration bits for main oscillator selection

Configuration bits determine the clock source upon

Power-on Reset and Brown-out Reset. Thereafter, the

clock source can be changed between permissible

clock sources. The OSCCON register controls the

clock switching and reflects system clock related

status bits.

• Oscillator Selection

• Reset

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Programmable Brown-out Reset (BOR)

• Watchdog Timer (WDT)

• Power-Saving modes (Sleep and Idle)

• Code Protection

Table 20-1 provides a summary of the dsPIC30F

oscillator operating modes. A simplified diagram of the

oscillator system is shown in Figure 20-1.

• Unit ID Locations

• In-Circuit Serial Programming (ICSP)

dsPIC30F devices have a Watchdog Timer, which is

permanently enabled via the Configuration bits, or can

be software controlled. It runs off its own RC oscillator

for added reliability. There are two timers that offer nec-

essary delays on power-up. One is the Oscillator Start-

up Timer (OST), intended to keep the chip in Reset until

the crystal oscillator is stable. The other is the Power-

up Timer (PWRT), which provides a delay on power-up

only, designed to keep the part in Reset while the

power supply stabilizes. With these two timers on-chip,

most applications need no external Reset circuitry.

Sleep mode is designed to offer a very low-current

Power-Down mode. The user can wake-up from Sleep

through external Reset, Watchdog Timer wake-up or

through an interrupt. Several oscillator options are also

made available to allow the part to fit a wide variety of

applications. In the Idle mode, the clock sources are

still active, but the CPU is shut off. The RC oscillator

option saves system cost, while the LP crystal option

saves power.

DS70141E-page 137

dsPIC30F3010/3011

TABLE 20-1: OSCILLATOR OPERATING MODES

Oscillator Mode

Description

XTL

200 kHz-4 MHz crystal on OSC1:OSC2.

4 MHz-10 MHz crystal on OSC1:OSC2.

XT

XT w/PLL 4x

XT w/PLL 8x

XT w/PLL 16x

LP

4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled.

4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled.

4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled⁽¹⁾

.

32 kHz crystal on SOSCO:SOSCI⁽²⁾

.

HS

10 MHz-25 MHz crystal.

HS/2 w/PLL 4x

HS/2 w/PLL 8x

HS/2 w/PLL 16x

HS/3 w/PLL 4x

HS/3 w/PLL 8x

HS/3 w/PLL 16x

EC

10 MHz-25 MHz crystal, divide by 2, 4x PLL enabled.

10 MHz-25MHz crystal, divide by 2, 8x PLL enabled.

10 MHz-25MHz crystal, divide by 2, 16x PLL enabled⁽¹⁾

10 MHz-25 MHz crystal, divide by 3, 4x PLL enabled.

10 MHz-25MHz crystal, divide by 3, 8x PLL enabled.

10 MHz-25MHz crystal, divide by 3, 16x PLL enabled⁽¹⁾

External clock input (0-40 MHz).

.

ECIO

External clock input (0-40 MHz), OSC2 pin is I/O.

EC w/PLL 4x

EC w/PLL 8x

EC w/PLL 16x

ERC

External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled⁽¹⁾

External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled⁽¹⁾

.

External clock input (4-10 MHz), OSC2 pin is I/O, 16x PLL enabled⁽¹⁾

External RC oscillator, OSC2 pin is FOSC/4 output⁽³⁾

.

ERCIO

External RC oscillator, OSC2 pin is I/O⁽³⁾

.

FRC

8 MHz internal RC oscillator.

FRC w/PLL 4x

FRC w/PLL 8x

FRC w/PLL 16x

LPRC

7.37 MHz Internal RC oscillator, 4x PLL enabled.

7.37 MHz Internal RC oscillator, 8x PLL enabled.

7.37 MHz Internal RC oscillator, 16x PLL enabled.

512 kHz internal RC oscillator.

Note 1: dsPIC30F maximum operating frequency of 120 MHz must be met.

2: LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1.

3: Requires external R and C. Frequency operation up to 4 MHz.

DS70141E-page 138

dsPIC30F3010/3011

FIGURE 20-1:

OSCILLATOR SYSTEM BLOCK DIAGRAM

Oscillator Configuration bits

PWRSAVInstruction

Wake-up Request

FPLL

OSC1

OSC2

Primary

PLL

Oscillator

x4, x8, x16

PLL

Lock

COSC<2:0>

NOSC<2:0>

OSWEN

Primary Osc

TUN<3:0>

4

Primary

Oscillator

Stability Detector

Internal Fast RC

Oscillator (FRC)

Oscillator

Start-up

Timer

POR Done

Clock

Programmable

Switching

and Control

Block

Secondary Osc

Clock Divider

System

Clock

SOSCO

SOSCI

Secondary

Oscillator

Stability Detector

32 kHz LP

Oscillator

2

POST<1:0>

LPRC

Internal Low

Power RC

Oscillator (LPRC)

CF

Fail-Safe Clock

Monitor (FSCM)

FCKSM<1:0>

2

Oscillator Trap

To Timer1

DS70141E-page 139

dsPIC30F3010/3011

20.2.2

OSCILLATOR START-UP TIMER

(OST)

20.2 Oscillator Configurations

20.2.1

INITIAL CLOCK SOURCE

SELECTION

In order to ensure that a crystal oscillator (or ceramic

resonator) has started and stabilized, an Oscillator

Start-up Timer is included. It is a simple 10-bit counter

that counts 1024 TOSC cycles before releasing the

oscillator clock to the rest of the system. The time-out

period is designated as TOST. The TOST time is involved

every time the oscillator has to restart (i.e., on POR,

BOR and wake-up from Sleep). The Oscillator Start-up

Timer is applied to the LP, XT, XTL and HS Oscillator

modes (upon wake-up from Sleep, POR and BOR) for

the primary oscillator.

While coming out of Power-on Reset or Brown-out

Reset, the device selects its clock source based on:

a) FOS<2:0> Configuration bits that select one of

four oscillator groups,

b) and FPR<4:0> Configuration bits that select one

of 15 oscillator choices within the primary group.

The selection is as shown in Table 20-2.

TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator

Source

Oscillator Mode

FOS<2:0>

FPR<4:0>

OSC2 Function

ECIO w/PLL 4x

PLL

1

0

1

0

1

0

1

0

1

0

X

1

0

1

0

1

0

1

0

X

1

0

1

0

1

0

X

0

1

0

1

0

1

0

1

0

1

0

1

0

X

1

0

1

0

1

0

1

0

1

0

1

0

1

0

X

I/O

ECIO w/PLL 8x

ECIO w/PLL 16x

FRC w/PLL 4X

FRC w/PLL 8x

FRC w/PLL 16x

XT w/PLL 4x

XT w/PLL 8x

XT w/PLL 16x

HS2 w/PLL 4x

HS2 w/PLL 8x

HS2 w/PLL 16x

HS3 w/PLL 4x

HS3 w/PLL 8x

HS3 w/PLL 16x

ECIO

I/O

OSC2

I/O

External

XT

External

OSC2

CLKO

I/O

HS

External

EC

External

ERC

External

ERCIO

External

XTL

External

OSC2

(Note 1, 2)

LP

Secondary

Internal FRC

Internal LPRC

FRC

LPRC

Note 1: OSC2 pin function is determined by (FPR<4:0>).

2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all

times.

DS70141E-page 140

dsPIC30F3010/3011

.

20.2.3

LP OSCILLATOR CONTROL

Note:

When a 16x PLL is used, the FRC fre-

quency must not be tuned to a frequency

greater than 7.5 MHz.

Enabling the LP oscillator is controlled with two

elements:

1. The current oscillator group bits, COSC<2:0>

2. The LPOSCEN bit (OSCON register)

TABLE 20-4: FRC TUNING

TUN<3:0>

FRC Frequency

The LP oscillator is on (even during Sleep mode) if

LPOSCEN = 1. The LP oscillator is the device clock if:

Bits

0111

0110

0101

0100

0011

0010

0001

0000

+10.5%

+9.0%

+7.5%

+6.0%

+4.5%

+3.0%

+1.5%

•

COSC<1:0> = 00(LP selected as main oscillator)

and

•

LPOSCEN = 1

Keeping the LP oscillator on at all times allows for a

fast switch to the 32 kHz system clock for lower power

operation. Returning to the faster main oscillator will

still require a start-up time.

Center Frequency (oscillator is

running at calibrated frequency)

20.2.4

PHASE LOCKED LOOP (PLL)

1111

1110

1101

1100

1011

1010

1001

1000

-1.5%

-3.0%

-4.5%

-6.0%

-7.5%

-9.0%

-10.5%

-12.0%

The PLL multiplies the clock which is generated by the

primary oscillator. The PLL is selectable to have either

gains of x4, x8 and x16. Input and output frequency

ranges are summarized in Table 20-3.

TABLE 20-3: PLL FREQUENCY RANGE

PLL

Fin

Fout

Multiplier

4 MHz-10 MHz

4 MHz-7.5 MHz

x4

x8

16 MHz-40 MHz

32 MHz-80 MHz

64 MHz-120 MHz

20.2.6

LOW-POWER RC OSCILLATOR

(LPRC)

x16

The LPRC oscillator is a component of the Watchdog

Timer (WDT) and oscillates at a nominal frequency of

512 kHz. The LPRC oscillator is the clock source for

the Power-up Timer (PWRT) circuit, WDT and clock

monitor circuits. It may also be used to provide a low-

frequency clock source option for applications where

power consumption is critical and timing accuracy is

not required.

The PLL features a lock output, which is asserted when

the PLL enters a phase locked state. Should the loop

fall out of lock (e.g., due to noise), the lock signal will be

rescinded. The state of this signal is reflected in the

read-only LOCK bit in the OSCCON register.

20.2.5

FAST RC OSCILLATOR (FRC)

The FRC oscillator is a fast (7.37 MHz +/- 2% nominal)

internal RC oscillator. This oscillator is intended to pro-

vide reasonable device operating speeds without the

use of an external crystal, ceramic resonator or RC net-

work. The FRC oscillator can be used with the PLL to

obtain higher clock frequencies.

The LPRC oscillator is always enabled at a Power-on

Reset, because it is the clock source for the PWRT.

After the PWRT expires, the LPRC oscillator will remain

ON if one of the following is true:

• The Fail-Safe Clock Monitor is enabled

• The WDT is enabled

The dsPIC30F operates from the FRC oscillator

whenever the current oscillator selection control bits in

the OSCCON register (OSCCON<13:12>) are set to

‘01’.

• The LPRC oscillator is selected as the system

clock via the COSC<1:0> control bits in the

OSCCON register

The

four-bit

field

specified

by

TUN<3:0>

If one of the above conditions is not true, the LPRC will

shut-off after the PWRT expires.

(OSCTUN<3:0>) allows the user to tune the internal

fast RC oscillator (nominal 7.37 MHz). The user can

tune the FRC oscillator within a range of +10.5%

(840 kHz) and -12% (960 kHz) in steps of 1.50%

around the factory calibrated setting (see Table 20-4).

Note 1: OSC2 pin function is determined by the

Primary Oscillator mode selection

(FPR<3:0>).

2: OSC1 pin cannot be used as an I/O pin,

even if the secondary oscillator or an

internal clock source is selected at all

times.

If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are

set to ‘00101’, ‘00110’ or ‘00111’, then a PLL

multiplier of 4, 8 or 16 (respectively) is applied

DS70141E-page 141

dsPIC30F3010/3011

The OSCCON register holds the control and status bits

related to clock switching.

20.2.7

FAIL-SAFE CLOCK MONITOR

The Fail-Safe Clock Monitor (FSCM) allows the device

to continue to operate even in the event of an oscillator

failure. The FSCM function is enabled by appropriately

programming the FCKSM Configuration bits (Clock

Switch and Monitor Selection bits) in the FOSC Con-

figuration register. If the FSCM function is enabled, the

LPRC internal oscillator will run at all times (except

during Sleep mode) and will not be subject to control

by the SWDTEN bit.

• COSC<1:0>: Read-only status bits always reflect

the current oscillator group in effect.

• NOSC<1:0>: Control bits which are written to

indicate the new oscillator group of choice.

- On POR and BOR, COSC<1:0> and

NOSC<1:0> are both loaded with the

Configuration bit values, FOS<1:0>.

• LOCK: The LOCK status bit indicates a PLL lock.

In the event of an oscillator failure, the FSCM will

generate a clock failure trap event and will switch the

system clock over to the FRC oscillator. The user will

then have the option to either attempt to restart the

oscillator or execute a controlled shut down. The user

may decide to treat the trap as a warm Reset by simply

loading the Reset address into the oscillator fail trap

vector. In this event, the CF (Clock Fail) status bit

(OSCCON<3>) is also set whenever a clock failure is

recognized.

• CF: Read-only status bit indicating if a clock fail

detect has occurred.

• OSWEN: Control bit changes from a ‘0’ to a ‘1’

when a clock transition sequence is initiated.

Clearing the OSWEN control bit will abort a clock

transition in progress (used for hang-up

situations).

If Configuration bits, FCKSM<1:0> = 1x, then the clock

switching and Fail-Safe Clock Monitor functions are

disabled. This is the default Configuration bit setting.

In the event of a clock failure, the WDT is unaffected

and continues to run on the LPRC clock.

If clock switching is disabled, then the FOS<1:0> and

FPR<3:0> bits directly control the oscillator selection

and the COSC<1:0> bits do not control the clock

selection. However, these bits will reflect the clock

source selection.

If the oscillator has a very slow start-up time coming

out of POR, BOR or Sleep, it is possible that the

PWRT timer will expire before the oscillator has

started. In such cases, the FSCM will be activated and

the FSCM will initiate a clock failure trap, and the

COSC<1:0> bits are loaded with FRC oscillator selec-

tion. This will effectively shut-off the original oscillator

that was trying to start.

Note:

The application should not attempt to

switch to a clock of frequency lower than

100 kHz when the Fail-Safe Clock Monitor

is enabled. If such clock switching is

performed, the device may generate an

oscillator fail trap and switch to the fast RC

oscillator.

The user may detect this situation and restart the

oscillator in the clock fail trap ISR.

Upon a clock failure detection, the FSCM module will

initiate a clock switch to the FRC oscillator as follows:

20.2.8

PROTECTION AGAINST

1. The COSC bits (OSCCON<13:12>) are loaded

with the FRC Oscillator selection value.

ACCIDENTAL WRITES TO OSCCON

A write to the OSCCON register is intentionally made

difficult because it controls clock switching and clock

scaling.

2. CF bit is set (OSCCON<3>).

3. OSWEN control bit (OSCCON<0>) is cleared.

For the purpose of clock switching, the clock sources

are sectioned into four groups:

To write to the OSCCON low byte, the following code

sequence must be executed without any other

instructions in between:

1. Primary

2. Secondary

3. Internal FRC

4. Internal LPRC

Byte Write “0x46” to OSCCON low

Byte Write “0x57” to OSCCON low

Byte Write is allowed for one instruction cycle. Write the

The user can switch between these functional groups,

but cannot switch between options within a group. If the

primary group is selected, then the choice within the

group is always determined by the FPR<3:0>

Configuration bits.

desired value or use bit manipulation instruction.

To write to the OSCCON high byte, the following

instructions must be executed without any other

instructions in between:

:

Byte Write “0x78” to OSCCON high

Byte Write “0x9A” to OSCCON high

Byte Write is allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

DS70141E-page 142

dsPIC30F3010/3011

Different registers are affected in different ways by

various Reset conditions. Most registers are not

affected by a WDT wake-up, since this is viewed as the

resumption of normal operation. Status bits from the

RCON register are set or cleared differently in different

Reset situations, as indicated in Table 20-5. These bits

are used in software to determine the nature of the

Reset.

20.3 Reset

The dsPIC30F3010/3011 differentiates between various

kinds of Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during normal

operation)

A block diagram of the on-chip Reset circuit is shown in

Figure 20-2.

e) Programmable Brown-out Reset (BOR)

f) RESETInstruction

A MCLR noise filter is provided in the MCLR Reset

path. The filter detects and ignores small pulses.

g) Reset cause by trap lockup (TRAPR)

Internally generated Resets do not drive MCLR pin low.

h) Reset caused by illegal opcode, or by using an

uninitialized W register as an Address Pointer

(IOPUWR)

FIGURE 20-2:

RESET SYSTEM BLOCK DIAGRAM

RESET

Instruction

Digital

Glitch Filter

MCLR

Sleep or Idle

WDT

Module

POR

VDD Rise

Detect

S

VDD

Brown-out

Reset

BOR

BOREN

R

Q

SYSRST

TRAP Conflict

Illegal Opcode/

Uninitialized W Register

The POR circuit inserts a small delay, TPOR, which is

nominally 10 μs and ensures that the device bias

20.3.1

POR: POWER-ON RESET

A power-on event will generate an internal POR pulse

when a VDD rise is detected. The Reset pulse will occur

at the POR circuit threshold voltage (VPOR), which is

nominally 1.85V. The device supply voltage

characteristics must meet specified starting voltage

and rise rate requirements. The POR pulse will reset a

POR timer and place the device in the Reset state. The

POR also selects the device clock source identified by

the oscillator configuration fuses.

circuits are stable. Furthermore,

a user-selected

power-up time-out (TPWRT) is applied. The TPWRT

parameter is based on device Configuration bits and

can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total

delay is at device power-up TPOR + TPWRT. When

these delays have expired, SYSRST will be negated on

the next leading edge of the Q1 clock, and the PC will

jump to the Reset vector.

The timing for the SYSRST signal is shown in

Figure 20-3 through Figure 20-5.

DS70141E-page 143

dsPIC30F3010/3011

FIGURE 20-3:

TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

VDD

MCLR

INTERNAL POR

TOST

OST TIME-OUT

TPWRT

PWRT TIME-OUT

INTERNAL Reset

FIGURE 20-4:

TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

VDD

MCLR

INTERNAL POR

TOST

OST TIME-OUT

TPWRT

PWRT TIME-OUT

INTERNAL Reset

FIGURE 20-5:

TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

VDD

MCLR

INTERNAL POR

TOST

OST TIME-OUT

TPWRT

PWRT TIME-OUT

INTERNAL Reset

DS70141E-page 144

dsPIC30F3010/3011

A BOR will generate a Reset pulse which will reset the

device. The BOR will select the clock source, based on

the device Configuration bit values (FOS<1:0> and

FPR<3:0>). Furthermore, if an oscillator mode is

selected, the BOR will activate the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, then the clock will be held

until the LOCK bit (OSCCON<5>) is ‘1’.

20.3.1.1

POR with Long Crystal Start-up Time

(with FSCM Enabled)

The oscillator start-up circuitry is not linked to the POR

circuitry. Some crystal circuits (especially low-

frequency crystals) will have a relatively long start-up

time. Therefore, one or more of the following conditions

is possible after the POR timer and the PWRT have

expired:

Concurrently, the POR time-out (TPOR) and the PWRT

time-out (TPWRT) will be applied before the internal

Reset is released. If TPWRT = 0and a crystal oscillator is

being used, then a nominal delay of TFSCM = 100 μs is

applied. The total delay in this case is (TPOR + TFSCM).

• The oscillator circuit has not begun to oscillate.

• The Oscillator Start-up Timer has NOT expired (if

a crystal oscillator is used).

• The PLL has not achieved a LOCK (if PLL is

used).

The BOR status bit (RCON<1>) will be set to indicate

that a BOR has occurred. The BOR circuit, if enabled,

will continue to operate while in Sleep or Idle modes

and will reset the device should VDD fall below the BOR

threshold voltage.

If the FSCM is enabled and one of the above conditions

is true, then a clock failure trap will occur. The device

will automatically switch to the FRC oscillator and the

user can switch to the desired crystal oscillator in the

trap ISR.

FIGURE 20-6:

EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

20.3.1.2

Operating without FSCM and PWRT

If the FSCM is disabled and the Power-up Timer

(PWRT) is also disabled, then the device will exit

rapidly from Reset on power-up. If the clock source is

FRC, LPRC, EXTRC or EC, it will be active

immediately.

VDD

D

R

R1

MCLR

If the FSCM is disabled and the system clock has not

started, the device will be in a frozen state at the Reset

vector until the system clock starts. From the user’s

perspective, the device will appear to be in Reset until

a system clock is available.

dsPIC30F

C

Note 1: External Power-on Reset circuit is

required only if the VDD power-up slope

is too slow. The diode D helps discharge

the capacitor quickly when VDD powers

down.

20.3.2

BOR: PROGRAMMABLE

BROWN-OUT RESET

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit. The main purpose of

the BOR module is to generate a device Reset when

a brown-out condition occurs. Brown-out conditions

are generally caused by glitches on the AC mains

(i.e., missing portions of the AC cycle waveform due

to bad power transmission lines or voltage sags due

to excessive current draw when a large inductive load

is turned on).

2: R should be suitably chosen so as to

make sure that the voltage drop across

R does not violate the device’s electrical

specification.

3: R1 should be suitably chosen so as to

limit any current flowing into MCLR from

external capacitor C, in the event of

MCLR/VPP pin breakdown due to

Electrostatic Discharge (ESD) or

Electrical Overstress (EOS).

The BOR module allows selection of one of the

following voltage trip points:

• 2.6V-2.71V

• 4.1V-4.4V

Note:

Dedicated supervisory devices, such as

the MCP1XX and MCP8XX, may also be

used as an external Power-on Reset

circuit.

• 4.58V-4.73V

Note:

The BOR voltage trip points indicated here

are nominal values provided for design

guidance only.

DS70141E-page 145

dsPIC30F3010/3011

Table 20-5 shows the Reset conditions for the RCON

register. Since the control bits within the RCON register

are R/W, the information in the table implies that all the

bits are negated prior to the action specified in the

condition column.

TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1

Program

Condition

TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Counter

Power-on Reset

Brown-out Reset

0x000000

0

1

0

1

0

1

0

MCLR Reset during Normal 0x000000

Operation

Software Reset during

Normal Operation

0x000000

0

1

0

MCLR Reset during Sleep

MCLR Reset during Idle

WDT Time-out Reset

WDT Wake-up

0x000000

PC + 2

0

1

0

1

0

1

0

1

0

1

0

Interrupt Wake-up from

Sleep

PC + 2⁽¹⁾

Clock Failure Trap

Trap Reset

0x000004

0x000000

0

1

0

1

0

Illegal Operation Trap

Legend: u= unchanged, x= unknown

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

Table 20-6 shows a second example of the bit

conditions for the RCON register. In this case, it is not

assumed the user has set/cleared specific bits prior to

action specified in the condition column.

TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2

Program

Condition

TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Counter

Power-on Reset

0x000000

0

u

0

u

0

u

1

0

u

0

u

0

u

0

u

0

1

0

u

1

u

Brown-out Reset

MCLR Reset during Normal

Operation

Software Reset during

Normal Operation

0x000000

u

0

1

0

u

MCLR Reset during Sleep

MCLR Reset during Idle

WDT Time-out Reset

WDT Wake-up

0x000000

PC + 2

u

1

0

u

0

u

0

1

u

0

1

0

u

1

0

1

u

Interrupt Wake-up from

Sleep

PC + 2⁽¹⁾

Clock Failure Trap

Trap Reset

0x000004

0x000000

u

1

u

1

u

Illegal Operation Reset

Legend: u= unchanged, x= unknown

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

DS70141E-page 146

dsPIC30F3010/3011

20.5.1

SLEEP MODE

20.4

Watchdog Timer (WDT)

In Sleep mode, the clock to the CPU and peripherals is

shut down. If an on-chip oscillator is being used, it is

shut down.

20.4.1

WATCHDOG TIMER OPERATION

The primary function of the Watchdog Timer (WDT) is

to reset the processor in the event of a software

malfunction. The WDT is a free-running timer, which

runs off an on-chip RC oscillator, requiring no external

component. Therefore, the WDT timer will continue to

operate even if the main processor clock (e.g., the

crystal oscillator) fails.

The Fail-Safe Clock Monitor is not functional during

Sleep, since there is no clock to monitor. However, the

LPRC clock remains active if WDT is operational during

Sleep.

The brown-out protection circuit and the Low-Voltage

Detect (LVD) circuit, if enabled, will remain functional

during Sleep.

20.4.2

ENABLING AND DISABLING THE

WDT

The processor wakes up from Sleep if at least one of

the following conditions has occurred:

The Watchdog Timer can be “enabled” or “disabled”

only through a Configuration bit (FWDTEN) in the

Configuration register, FWDT.

• any interrupt that is individually enabled and

meets the required priority level

• any Reset (POR, BOR and MCLR)

• WDT time-out

Setting FWDTEN = 1 enables the Watchdog Timer.

The enabling is done when programming the device.

By default, after chip erase, FWDTEN bit = 1. Any

device programmer capable of programming

dsPIC30F devices allows programming of this and

other Configuration bits.

On waking up from Sleep mode, the processor will

restart the same clock that was active prior to entry

into Sleep mode. When clock switching is enabled,

bits, COSC<1:0>, will determine the oscillator source

that will be used on wake-up. If clock switch is

disabled, then there is only one system clock.

If enabled, the WDT will increment until it overflows or

“times out”. A WDT time-out will force a device Reset

(except during Sleep). To prevent a WDT time-out, the

user must clear the Watchdog Timer using a CLRWDT

instruction.

Note:

If a POR or BOR occurred, the selection of

the oscillator is based on the FOS<1:0>

and FPR<3:0> Configuration bits.

If a WDT times out during Sleep, the device will wake-

up. The WDTO bit in the RCON register will be cleared

to indicate a wake-up resulting from a WDT time-out.

If the clock source is an oscillator, the clock to the

device will be held off until OST times out (indicating a

stable oscillator). If PLL is used, the system clock is

held off until LOCK = 1 (indicating that the PLL is

stable). In either case, TPOR, TLOCK and TPWRT delays

are applied.

Setting FWDTEN = 0 allows user software to enable/

disable the Watchdog Timer via the SWDTEN

(RCON<5>) control bit.

If EC, FRC, LPRC or EXTRC oscillators are used, then

a delay of TPOR (~ 10 μs) is applied. This is the smallest

delay possible on wake-up from Sleep.

20.5 Power-Saving Modes

There are two power-saving states that can be entered

through the execution of a special instruction, PWRSAV.

Moreover, if the LP oscillator was active during Sleep,

and LP is the oscillator used on wake-up, then the start-

up delay will be equal to TPOR. PWRT delay and OST

timer delay are not applied. In order to have the small-

est possible start-up delay when waking up from Sleep,

one of these faster wake-up options should be selected

before entering Sleep.

These are: Sleep and Idle.

The format of the PWRSAVinstruction is as follows:

PWRSAV <parameter>, where ‘parameter’ defines

Idle or Sleep mode.

DS70141E-page 147

dsPIC30F3010/3011

Any interrupt that is individually enabled (using the

corresponding IE bit) and meets the prevailing priority

level will be able to wake-up the processor. The proces-

sor will process the interrupt and branch to the ISR.

The SLEEP status bit in RCON register is set upon

wake-up.

Any interrupt that is individually enabled (using the IE

bit) and meets the prevailing priority level will be able to

wake-up the processor. The processor will process the

interrupt and branch to the ISR. The IDLE status bit in

the RCON register is set upon wake-up.

Any Reset, other than POR, will set the IDLE status bit.

On a POR, the IDLE bit is cleared.

Note:

In spite of various delays applied (TPOR,

TLOCK and TPWRT), the crystal oscillator

(and PLL) may not be active at the end of

the time-out (e.g., for low-frequency crys-

tals). In such cases, if FSCM is enabled,

then the device will detect this as a clock

failure and process the clock failure trap,

the FRC oscillator will be enabled, and the

user will have to re-enable the crystal

oscillator. If FSCM is not enabled, then the

device will simply suspend execution of

code until the clock is stable, and will

remain in Sleep until the oscillator clock

has started.

If the Watchdog Timer is enabled, then the processor

will wake-up from Idle mode upon WDT time-out. The

IDLE and WDTO status bits are both set.

Unlike wake-up from Sleep, there are no time delays

involved in wake-up from Idle.

20.6 Device Configuration Registers

The Configuration bits in each device Configuration

register specify some of the device modes and are pro-

grammed by a device programmer, or by using the

In-Circuit Serial Programming (ICSP) feature of the

device. Each device Configuration register is a 24-bit

register, but only the lower 16 bits of each register are

used to hold configuration data. There are four device

Configuration registers available to the user:

All Resets will wake-up the processor from Sleep

mode. Any Reset, other than POR, will set the SLEEP

status bit. In a POR, the SLEEP bit is cleared.

If the Watchdog Timer is enabled, then the processor

will wake-up from Sleep mode upon WDT time-out. The

SLEEP and WDTO status bits are both set.

1. FOSC (0xF80000): Oscillator Configuration

register

2. FWDT (0xF80002): Watchdog Timer

Configuration register

20.5.2

IDLE MODE

3. FBORPOR (0xF80004): BOR and POR

Configuration register

In Idle mode, the clock to the CPU is shut down while

peripherals keep running. Unlike Sleep mode, the clock

source remains active.

4. FGS (0xF8000A): General Code Segment

Configuration register

Several peripherals have a control bit in each module

that allows them to operate during Idle.

5. FICD (0xF8000C): Fuse Configuration

Register

The LPRC fail-safe clock remains active if clock failure

detect is enabled.

The placement of the Configuration bits is

automatically handled when you select the device in

your device programmer. The desired state of the

Configuration bits may be specified in the source code

(dependent on the language tool used), or through the

programming interface. After the device has been

programmed, the application software may read the

Configuration bit values through the table read

instructions. For additional information, please refer to

the programming specifications of the device.

The processor wakes up from Idle if at least one of the

following conditions is true:

• on any interrupt that is individually enabled (IE bit

is ‘1’) and meets the required priority level

• on any Reset (POR, BOR, MCLR)

• on WDT time-out

Upon wake-up from Idle mode, the clock is re-applied

to the CPU and instruction execution begins

immediately, starting with the instruction following the

PWRSAVinstruction.

Note:

If the code protection Configuration bits

(FGS<GCP> and FGS<GWRP>) have

been programmed, an erase of the entire

code-protected device is only possible at

voltages VDD ≥ 4.5V.

DS70141E-page 148

dsPIC30F3010/3011

In each case, the selected EMUD pin is the Emulation/

Debug Data line, and the EMUC pin is the Emulation/

Debug Clock line. These pins will interface to the

MPLAB ICD 2 module available from Microchip. The

selected pair of debug I/O pins is used by MPLAB

ICD 2 to send commands and receive responses, as

well as to send and receive data. To use the in-circuit

debugger function of the device, the design must imple-

ment ICSP connections to MCLR, VDD, VSS, PGC,

PGD and the selected EMUDx/EMUCx pin pair.

20.7 In-Circuit Debugger

When MPLAB^®ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This func-

tion allows simple debugging functions when used with

MPLAB IDE. When the device has this feature enabled,

some of the resources are not available for general

use. These resources include the first 80 bytes of data

RAM and two I/O pins.

One of four pairs of debug I/O pins may be selected by

the user using configuration options in MPLAB IDE.

These pin pairs are named EMUD/EMUC, EMUD1/

EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3.

This gives rise to two possibilities:

1. If EMUD/EMUC is selected as the debug I/O pin

pair, then only a 5-pin interface is required, as

the EMUD and EMUC pin functions are multi-

plexed with the PGD and PGC pin functions in

all dsPIC30F devices.

2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/

EMUC3 is selected as the debug I/O pin pair,

then a 7-pin interface is required, as the

EMUDx/EMUCx pin functions (x = 1, 2 or 3) are

not multiplexed with the PGD and PGC pin

functions.

DS70141E-page 149

dsPIC30F3010/3011

DS70141E-page 150

dsPIC30F3010/3011

Most bit-oriented instructions (including simple rotate/

shift instructions) have two operands:

21.0 INSTRUCTION SET SUMMARY

Note:

This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and gen-

eral device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

• The W register (with or without an address modi-

fier) or File register (specified by the value of ‘Ws’

or ‘f’)

• The bit in the W register or File register

(specified by a literal value, or indirectly by the

contents of register ‘Wb’)

The literal instructions that involve data movement may

use some of the following operands:

• A literal value to be loaded into a W register or

File register (specified by the value of ‘k’)

• The W register or File register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

The dsPIC30F instruction set adds many

enhancements to the previous PIC^®microcontroller

(MCU) instruction sets, while maintaining an easy

migration from PIC MCU instruction sets.

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

• The first source operand, which is a register ‘Wb’

without any address modifier

• The second source operand, which is a literal

value

Each single-word instruction is a 24-bit word divided

into an 8-bit opcode which specifies the instruction

type, and one or more operands which further specify

the operation of the instruction.

• The destination of the result (only if not the same

as the first source operand), which is typically a

register ‘Wd’ with or without an address modifier

The instruction set is highly orthogonal and is grouped

into five basic categories:

The MACclass of DSP instructions may use some of the

following operands:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• The accumulator (A or B) to be used (required

operand)

• The W registers to be used as the two operands

• The X and Y address space prefetch operations

• The X and Y address space prefetch destinations

• The accumulator write-back destination

• DSP operations

• Control operations

Table 21-1 shows the general symbols used in

describing the instructions.

The other DSP instructions do not involve any

multiplication, and may include:

The dsPIC30F instruction set summary in Table 21-2

lists all the instructions along with the status flags

affected by each instruction.

• The accumulator to be used (required)

• The source or destination operand (designated as

Wso or Wdo, respectively) with or without an

address modifier

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The amount of shift, specified by a W register ‘Wn’

or a literal value

• The first source operand, which is typically a

register ‘Wb’ without any address modifier

The control instructions may use some of the following

operands:

• The second source operand, which is typically a

register ‘Ws’ with or without an address modifier

• A program memory address

• The destination of the result, which is typically a

register ‘Wd’ with or without an address modifier

• The mode of the table read and table write

instructions

However, word or byte-oriented file register instructions

have two operands:

All instructions are a single word, except for certain

double-word instructions, which were made double-

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8 MSbs are ‘0’s. If this second word is executed as an

instruction (by itself), it will execute as a NOP.

• The File register specified by the value ‘f’

• The destination, which could either be the File

register ‘f’ or the W0 register, which is denoted as

‘WREG’

DS70141E-page 151

dsPIC30F3010/3011

Most single-word instructions are executed in a single

instruction cycle, unless a conditional test is true or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/computed branch), indirect CALL/GOTO, all table

reads and writes and RETURN/RETFIE instructions,

which are single-word instructions, but take two or

three cycles. Certain instructions that involve skipping

over the subsequent instruction, require either two or

three cycles if the skip is performed, depending on

whether the instruction being skipped is a single-word

or two-word instruction. Moreover, double-word moves

require two cycles. The double-word instructions

execute in two instruction cycles.

Note:

For more details on the instruction set,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text

Means literal defined by “text“

Means “content of text“

Means “the location addressed by text”

Optional field or operation

Register bit field

(text)

[text]

{

}

<n:m>

.b

Byte mode selection

.d

Double-Word mode selection

Shadow register select

.S

.w

Word mode selection (default)

One of two accumulators {A, B}

Acc

AWB

bit4

Accumulator Write-Back Destination Address register ∈ {W13, [W13] + = 2}

4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero

Absolute address, label or expression (resolved by the linker)

File register address ∈ {0x0000...0x1FFF}

1-bit unsigned literal ∈ {0,1}

C, DC, N, OV, Z

Expr

f

lit1

lit4

4-bit unsigned literal ∈ {0...15}

lit5

5-bit unsigned literal ∈ {0...31}

lit8

8-bit unsigned literal ∈ {0...255}

lit10

lit14

lit16

lit23

None

10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

14-bit unsigned literal ∈ {0...16384}

16-bit unsigned literal ∈ {0...65535}

23-bit unsigned literal ∈ {0...8388608}; LSB must be ‘0’

Field does not require an entry, may be blank

DSP status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate

Program Counter

OA, OB, SA, SB

PC

Slit10

Slit16

Slit6

10-bit signed literal ∈ {-512...511}

16-bit signed literal ∈ {-32768...32767}

6-bit signed literal ∈ {-16...16}

DS70141E-page 152

dsPIC30F3010/3011

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

Wb

Base W register ∈ {W0..W15}

Wd

Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo

Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn

Wm*Wm

Dividend, Divisor Working register pair (direct addressing)

Multiplicand and Multiplier working register pair for Square instructions ∈

{W4*W4,W5*W5,W6*W6,W7*W7}

Wm*Wn

Multiplicand and Multiplier working register pair for DSP instructions ∈

{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}

Wn

One of 16 working registers ∈ {W0..W15}

Wnd

Wns

WREG

Ws

One of 16 destination working registers ∈ {W0..W15}

One of 16 source working registers ∈ {W0..W15}

W0 (working register used in File register instructions)

Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso

Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx

X data space Prefetch Address register for DSP instructions

∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,

[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,

[W9+W12],none}

Wxd

Wy

X data space Prefetch Destination register for DSP instructions ∈ {W4..W7}

Y data space Prefetch Address register for DSP instructions

∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,

[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,

[W11+W12], none}

Wyd

Y data space Prefetch Destination register for DSP instructions ∈ {W4..W7}

DS70141E-page 153

dsPIC30F3010/3011

TABLE 21-2: INSTRUCTION SET OVERVIEW

Base

Instr

#

# of

cycle

s

Assembly

Mnemonic

# of

words

Status Flags

Affected

Assembly Syntax

Description

Add Accumulators

1

ADD

ADDC

AND

ASR

BCLR

BRA

BSET

BSW.C

BSW.Z

BTG

Acc

1

OA,OB,SA,SB

C,DC,N,OV,Z

OA,OB,SA,SB

C,DC,N,OV,Z

N,Z

f

f = f + WREG

f,WREG

WREG = f + WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

Wso,#Slit4,Acc

f

Wd = lit10 + Wd

Wd = Wb + Ws

Wd = Wb + lit5

16-bit Signed Add to Accumulator

f = f + WREG + (C)

2

3

4

ADDC

AND

f,WREG

WREG = f + WREG + (C)

Wd = lit10 + Wd + (C)

Wd = Wb + Ws + (C)

Wd = Wb + lit5 + (C)

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

f = f .AND. WREG

f,WREG

WREG = f .AND. WREG

Wd = lit10 .AND. Wd

N,Z

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

N,Z

Wd = Wb .AND. Ws

N,Z

Wd = Wb .AND. lit5

N,Z

ASR

f = Arithmetic Right Shift f

WREG = Arithmetic Right Shift f

Wd = Arithmetic Right Shift Ws

Wnd = Arithmetic Right Shift Wb by Wns

Wnd = Arithmetic Right Shift Wb by lit5

Bit Clear f

C,N,OV,Z

N,Z

f,WREG

Ws,Wd

Wb,Wns,Wnd

Wb,#lit5,Wnd

f,#bit4

Ws,#bit4

C,Expr

N,Z

5

6

BCLR

BRA

None

Bit Clear Ws

None

Branch if Carry

1 (2) None

GE,Expr

GEU,Expr

GT,Expr

GTU,Expr

LE,Expr

LEU,Expr

LT,Expr

LTU,Expr

N,Expr

Branch if Greater than or Equal

Branch if Unsigned Greater than or Equal

Branch if Greater than

Branch if Unsigned Greater than

Branch if Less than or Equal

Branch if Unsigned Less than or Equal

Branch if Less than

Branch if Unsigned Less than

Branch if Negative

NC,Expr

NN,Expr

NOV,Expr

NZ,Expr

OA,Expr

OB,Expr

OV,Expr

SA,Expr

SB,Expr

Expr

Branch if Not Carry

Branch if Not Negative

Branch if Not Overflow

Branch if Not Zero

Branch if Accumulator A Overflow

Branch if Accumulator B Overflow

Branch if Overflow

Branch if Accumulator A Saturated

Branch if Accumulator B Saturated

Branch Unconditionally

Branch if Zero

2

None

Z,Expr

1 (2) None

Wn

Computed Branch

2

1

None

7

8

9

BSET

BSW

f,#bit4

Ws,#bit4

Ws,Wb

Bit Set f

Bit Set Ws

Write C bit to Ws<Wb>

Write Z bit to Ws<Wb>

Bit Toggle f

Ws,Wb

BTG

f,#bit4

Ws,#bit4

Bit Toggle Ws

DS70141E-page 154

dsPIC30F3010/3011

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

# of

cycle

s

Assembly

Mnemonic

# of

words

Status Flags

Affected

Assembly Syntax

Description

Bit Test f, Skip if Clear

10

11

12

13

BTSC

BTSS

BTST

BTSTS

BTSC

BTSS

f,#bit4

1

(2 or

3)

None

Ws,#bit4

f,#bit4

Ws,#bit4

Bit Test Ws, Skip if Clear

Bit Test f, Skip if Set

1

(2 or

3)

1

(2 or

3)

Bit Test Ws, Skip if Set

1

(2 or

3)

BTST

f,#bit4

Ws,#bit4

Ws,Wb

Bit Test f

1

2

1

2

1

Z

BTST.C

BTST.Z

BTST.C

BTST.Z

BTSTS

Bit Test Ws to C

C

Bit Test Ws to Z

Z

Bit Test Ws<Wb> to C

Bit Test Ws<Wb> to Z

Bit Test then Set f

C

Ws,Wb

Z

f,#bit4

Z

BTSTS.C Ws,#bit4

BTSTS.Z Ws,#bit4

Bit Test Ws to C, then Set

Bit Test Ws to Z, then Set

Call Subroutine

C

Z

14

15

CALL

CLR

CALL

CLR

CLRWDT

COM

CP

lit23

None

Wn

Call Indirect Subroutine

f = 0x0000

None

f

None

WREG

WREG = 0x0000

None

Ws

Ws = 0x0000

None

Acc,Wx,Wxd,Wy,Wyd,AWB

Clear Accumulator

Clear Watchdog Timer

f = f

OA,OB,SA,SB

WDTO,Sleep

N,Z

16

17

CLRWDT

COM

f

f,WREG

Ws,Wd

f

WREG = f

N,Z

Wd = Ws

N,Z

18

CP

Compare f with WREG

Compare Wb with lit5

Compare Wb with Ws (Wb – Ws)

Compare f with 0x0000

Compare Ws with 0x0000

Compare f with WREG, with Borrow

Compare Wb with lit5, with Borrow

C,DC,N,OV,Z

CP

Wb,#lit5

Wb,Ws

f

CP

19

20

CP0

CPB

CP0

CPB

Ws

f

Wb,#lit5

Wb,Ws

Compare Wb with Ws, with Borrow

(Wb – Ws – C)

21

22

23

24

CPSEQ

CPSGT

CPSLT

CPSNE

CPSEQ

CPSGT

CPSLT

CPSNE

Wb, Wn

Compare Wb with Wn, Skip if =

Compare Wb with Wn, Skip if >

Compare Wb with Wn, Skip if <

Compare Wb with Wn, Skip if ≠

1

(2 or

3)

None

1

(2 or

3)

1

(2 or

3)

1

(2 or

3)

25

26

DAW

DEC

DAW

Wn

Wn = Decimal Adjust Wn

f = f – 1

1

C

DEC

f

C,DC,N,OV,Z

None

DEC

f,WREG

Ws,Wd

f

WREG = f –1

DEC

Wd = Ws – 1

27

28

DEC2

DISI

DEC2

DISI

f = f – 2

f,WREG

Ws,Wd

#lit14

WREG = f – 2

Wd = Ws – 2

Disable Interrupts for k Instruction Cycles

DS70141E-page 155

dsPIC30F3010/3011

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

# of

cycle

s

Assembly

Mnemonic

# of

words

Status Flags

Affected

Assembly Syntax

Description

29

DIV

DIV.S

DIV.SD

DIV.U

DIV.UD

DIVF

DO

Wm,Wn

Signed 16/16-bit Integer Divide

1

2

1

18

2

N,Z,C, OV

None

Wm,Wn

Signed 32/16-bit Integer Divide

Wm,Wn

Unsigned 16/16-bit Integer Divide

Unsigned 32/16-bit Integer Divide

Signed 16/16-bit Fractional Divide

Do Code to PC+Expr, lit14 + 1 Times

Do Code to PC+Expr, (Wn) + 1 Times

Euclidean Distance (no accumulate)

Wm,Wn

30

31

DIVF

DO

Wm,Wn

#lit14,Expr

Wn,Expr

DO

2

None

32

33

ED

Wm*Wm,Acc,Wx,Wy,Wxd

1

OA,OB,OAB,

SA,SB,SAB

EDAC

Wm*Wm,Acc,Wx,Wy,Wxd

Euclidean Distance

1

OA,OB,OAB,

SA,SB,SAB

34

35

36

37

38

EXCH

FBCL

FF1L

FF1R

GOTO

EXCH

FBCL

FF1L

FF1R

GOTO

INC

Wns,Wnd

Ws,Wnd

Expr

Swap Wns with Wnd

Find Bit Change from Left (MSb) Side

Find First One from Left (MSb) Side

Find First One from Right (LSb) Side

Go to Address

1

2

1

2

1

None

C

None

Wn

Go to Indirect

None

39

40

41

INC

f

f = f + 1

C,DC,N,OV,Z

N,Z

INC

f,WREG

Ws,Wd

WREG = f + 1

INC

Wd = Ws + 1

INC2

IOR

INC2

IOR

f

f = f + 2

f,WREG

Ws,Wd

WREG = f + 2

Wd = Ws + 2

f

f = f .IOR. WREG

IOR

f,WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

Wso,#Slit4,Acc

WREG = f .IOR. WREG

Wd = lit10 .IOR. Wd

Wd = Wb .IOR. Ws

Wd = Wb .IOR. lit5

Load Accumulator

N,Z

IOR

N,Z

IOR

N,Z

IOR

N,Z

42

LAC

OA,OB,OAB,

SA,SB,SAB

43

44

LNK

LSR

LNK

LSR

MAC

#lit14

Link Frame Pointer

1

None

f

f = Logical Right Shift f

C,N,OV,Z

N,Z

f,WREG

WREG = Logical Right Shift f

Wd = Logical Right Shift Ws

Wnd = Logical Right Shift Wb by Wns

Wnd = Logical Right Shift Wb by lit5

Ws,Wd

Wb,Wns,Wnd

Wb,#lit5,Wnd

N,Z

45

46

MAC

MOV

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, Multiply and Accumulate

AWB

OA,OB,OAB,

SA,SB,SAB

MAC

Wm*Wm,Acc,Wx,Wxd,Wy,Wyd

Square and Accumulate

1

OA,OB,OAB,

SA,SB,SAB

MOV

f,Wn

Move f to Wn

1

2

1

None

N,Z

MOV

f

Move f to f

MOV

f,WREG

Move f to WREG

N,Z

MOV

#lit16,Wn

#lit8,Wn

Wn,f

Move 16-bit Literal to Wn

Move 8-bit Literal to Wn

Move Wn to f

None

N,Z

MOV.b

MOV

Wso,Wdo

Move Ws to Wd

MOV

WREG,f

Move WREG to f

MOV.D

MOVSAC

MPY

Wns,Wd

Move Double from W(ns):W(ns + 1) to Wd

Move Double from Ws to W(nd + 1):W(nd)

Prefetch and Store Accumulator

Multiply Wm by Wn to Accumulator

None

Ws,Wnd

47

48

MOVSAC

MPY

Acc,Wx,Wxd,Wy,Wyd,AWB

OA,OB,OAB,

SA,SB,SAB

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd

MPY

Square Wm to Accumulator

1

OA,OB,OAB,

SA,SB,SAB

Wm*Wm,Acc,Wx,Wxd,Wy,Wyd

49

50

MPY.N

MSC

MPY.N

MSC

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator

1

None

Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, Multiply and Subtract from Accumulator

AWB

OA,OB,OAB,

SA,SB,SAB

DS70141E-page 156

dsPIC30F3010/3011

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

# of

cycle

s

Assembly

Mnemonic

# of

words

Status Flags

Affected

Assembly Syntax

Description

51

MUL

MUL.SS

MUL.SU

MUL.US

MUL.UU

Wb,Ws,Wnd

{Wnd+1, Wnd} = signed(Wb) * signed(Ws)

{Wnd+1, Wnd} = signed(Wb) * unsigned(Ws)

{Wnd+1, Wnd} = unsigned(Wb) * signed(Ws)

1

None

{Wnd+1, Wnd} = unsigned(Wb) *

unsigned(Ws)

MUL.SU

MUL.UU

Wb,#lit5,Wnd

{Wnd+1, Wnd} = signed(Wb) * unsigned(lit5)

1

None

{Wnd+1, Wnd} = unsigned(Wb) *

unsigned(lit5)

MUL

NEG

f

W3:W2 = f * WREG

Negate Accumulator

1

None

52

NEG

Acc

OA,OB,OAB,

SA,SB,SAB

NEG

f

f = f + 1

1

2

C,DC,N,OV,Z

None

NEG

f,WREG

Ws,Wd

WREG = f + 1

NEG

Wd = Ws + 1

53

54

NOP

POP

NOP

No Operation

NOPR

POP

No Operation

None

f

Pop f from Top-of-Stack (TOS)

Pop from Top-of-Stack (TOS) to Wdo

None

POP

Wdo

Wnd

None

POP.D

Pop from Top-of-Stack (TOS) to

W(nd):W(nd + 1)

None

POP.S

PUSH

PUSH.D

PUSH.S

PWRSAV

RCALL

REPEAT

RESET

RETFIE

RETLW

RETURN

RLC

Pop Shadow Registers

1

2

1

2

1

All

55

PUSH

f

Push f to Top-of-Stack (TOS)

Push Wso to Top-of-Stack (TOS)

Push W(ns):W(ns + 1) to Top-of-Stack (TOS)

Push Shadow Registers

None

WDTO,Sleep

None

Wso

Wns

56

57

PWRSAV

RCALL

#lit1

Expr

Go into Sleep or Idle mode

Relative Call

Wn

Computed Call

58

REPEAT

#lit14

Wn

Repeat Next Instruction lit14 + 1 Times

Repeat Next Instruction (Wn) + 1 Times

Software Device Reset

59

60

61

62

63

RESET

RETFIE

RETLW

RETURN

RLC

Return from Interrupt

3 (2) None

#lit10,Wn

Return with Literal in Wn

Return from Subroutine

f

f = Rotate Left through Carry f

WREG = Rotate Left through Carry f

Wd = Rotate Left through Carry Ws

f = Rotate Left (No Carry) f

WREG = Rotate Left (No Carry) f

Wd = Rotate Left (No Carry) Ws

f = Rotate Right through Carry f

WREG = Rotate Right through Carry f

Wd = Rotate Right through Carry Ws

f = Rotate Right (No Carry) f

WREG = Rotate Right (No Carry) f

Wd = Rotate Right (No Carry) Ws

Store Accumulator

1

C,N,Z

N,Z

RLC

f,WREG

RLC

Ws,Wd

64

65

66

67

RLNC

RRC

RLNC

RRC

f

f,WREG

N,Z

Ws,Wd

N,Z

f

C,N,Z

N,Z

RRC

f,WREG

RRC

Ws,Wd

RRNC

SAC

RRNC

SAC

f

f,WREG

N,Z

Ws,Wd

N,Z

Acc,#Slit4,Wdo

None

C,N,Z

None

SAC.R

SE

Acc,#Slit4,Wdo

Store Rounded Accumulator

Wnd = Sign-Extended Ws

f = 0xFFFF

68

69

SE

Ws,Wnd

f

SETM

SFTAC

WREG

Ws

WREG = 0xFFFF

Ws = 0xFFFF

70

SFTAC

Acc,Wn

Arithmetic Shift Accumulator by (Wn)

OA,OB,OAB,

SA,SB,SAB

SFTAC

Acc,#Slit6

Arithmetic Shift Accumulator by Slit6

1

OA,OB,OAB,

SA,SB,SAB

DS70141E-page 157

dsPIC30F3010/3011

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

# of

cycle

s

Assembly

Mnemonic

# of

words

Status Flags

Affected

Assembly Syntax

Description

71

SL

SUB

f

f = Left Shift f

1

C,N,OV,Z

N,Z

f,WREG

WREG = Left Shift f

Ws,Wd

Wd = Left Shift Ws

Wb,Wns,Wnd

Wb,#lit5,Wnd

Acc

Wnd = Left Shift Wb by Wns

Wnd = Left Shift Wb by lit5

Subtract Accumulators

N,Z

72

SUB

OA,OB,OAB,

SA,SB,SAB

SUB

f

f = f – WREG

1

2

1

C,DC,N,OV,Z

None

SUB

f,WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

WREG = f – WREG

Wn = Wn – lit10

SUB

Wd = Wb – Ws

SUB

Wd = Wb – lit5

73

SUBB

SUBR

SUBBR

SWAP.b

SWAP

TBLRDH

TBLRDL

TBLWTH

TBLWTL

ULNK

XOR

f = f – WREG – (C)

WREG = f – WREG – (C)

Wn = Wn – lit10 – (C)

Wd = Wb – Ws – (C)

Wd = Wb – lit5 – (C)

f = WREG – f

f,WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

74

75

76

SUBR

SUBBR

SWAP

f,WREG

Wb,Ws,Wd

Wb,#lit5,Wd

f

WREG = WREG – f

Wd = Ws – Wb

Wd = lit5 – Wb

f = WREG – f – (C)

WREG = WREG – f – (C)

Wd = Ws – Wb – (C)

Wd = lit5 – Wb – (C)

Wn = Nibble Swap Wn

Wn = Byte Swap Wn

Read Prog<23:16> to Wd<7:0>

Read Prog<15:0> to Wd

Write Ws<7:0> to Prog<23:16>

Write Ws to Prog<15:0>

Unlink Frame Pointer

f = f .XOR. WREG

f,WREG

Wb,Ws,Wd

Wb,#lit5,Wd

Wn

None

77

78

79

80

81

82

TBLRDH

TBLRDL

TBLWTH

TBLWTL

ULNK

Ws,Wd

None

Ws,Wd

None

Ws,Wd

None

Ws,Wd

None

XOR

f

N,Z

XOR

f,WREG

WREG = f .XOR. WREG

Wd = lit10 .XOR. Wd

Wd = Wb .XOR. Ws

Wd = Wb .XOR. lit5

Wnd = Zero-Extend Ws

N,Z

XOR

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

Ws,Wnd

N,Z

XOR

N,Z

XOR

N,Z

83

ZE

C,Z,N

DS70141E-page 158

dsPIC30F3010/3011

22.1 MPLAB Integrated Development

Environment Software

22.0 DEVELOPMENT SUPPORT

The PIC^®microcontrollers are supported with a full

range of hardware and software development tools:

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows^®

operating system-based application that contains:

• Integrated Development Environment

- MPLAB^®IDE Software

• Assemblers/Compilers/Linkers

- MPASM^TMAssembler

• A single graphical interface to all debugging tools

- Simulator

- MPLAB C18 and MPLAB C30 C Compilers

- MPLINK^TMObject Linker/

MPLIB^TMObject Librarian

- Programmer (sold separately)

- Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

• Emulators

• Customizable data windows with direct edit of

contents

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debugger

• High-level source code debugging

• Visual device initializer for easy register

initialization

- MPLAB ICD 2

• Mouse over variable inspection

• Device Programmers

• Drag and drop variables from source to watch

windows

- PICSTART^®Plus Development Programmer

- MPLAB PM3 Device Programmer

- PICkit™ 2 Development Programmer

• Extensive on-line help

• Integration of select third party tools, such as

HI-TECH Software C Compilers and IAR

C Compilers

• Low-Cost Demonstration and Development

Boards and Evaluation Kits

The MPLAB IDE allows you to:

• Edit your source files (either assembly or C)

• One touch assemble (or compile) and download

to PIC MCU emulator and simulator tools

(automatically updates all project information)

• Debug using:

- Source files (assembly or C)

- Mixed assembly and C

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

DS70141E-page 159

dsPIC30F3010/3011

22.2 MPASM Assembler

22.5 MPLAB ASM30 Assembler, Linker

and Librarian

The MPASM Assembler is a full-featured, universal

macro assembler for all PIC MCUs.

MPLAB ASM30 Assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 C Compiler uses the

assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker, Intel^®standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• User-defined macros to streamline

assembly code

• Rich directive set

• Conditional assembly for multi-purpose

source files

• Flexible macro language

• MPLAB IDE compatibility

• Directives that allow complete control over the

assembly process

22.6 MPLAB SIM Software Simulator

22.3 MPLAB C18 and MPLAB C30

C Compilers

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC^®DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB C18 and MPLAB C30 Code Development

Systems are complete ANSI

C

compilers for

Microchip’s PIC18 and PIC24 families of microcon-

trollers and the dsPIC30 and dsPIC33 family of digital

signal controllers. These compilers provide powerful

integration capabilities, superior code optimization and

ease of use not found with other compilers.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C18 and

MPLAB C30 C Compilers, and the MPASM and

MPLAB ASM30 Assemblers. The software simulator

offers the flexibility to develop and debug code outside

of the hardware laboratory environment, making it an

excellent, economical software development tool.

22.4 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

DS70141E-page 160

dsPIC30F3010/3011

22.7 MPLAB ICE 2000

High-Performance

22.9 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low-cost, run-time development tool,

connecting to the host PC via an RS-232 or high-speed

USB interface. This tool is based on the Flash PIC

MCUs and can be used to develop for these and other

PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes

the in-circuit debugging capability built into the Flash

devices. This feature, along with Microchip’s In-Circuit

Serial Programming^TM(ICSP^TM) protocol, offers cost-

effective, in-circuit Flash debugging from the graphical

user interface of the MPLAB Integrated Development

Environment. This enables a designer to develop and

debug source code by setting breakpoints, single step-

ping and watching variables, and CPU status and

peripheral registers. Running at full speed enables

testing hardware and applications in real time. MPLAB

ICD 2 also serves as a development programmer for

selected PIC devices.

In-Circuit Emulator

The MPLAB ICE 2000 In-Circuit Emulator is intended

to provide the product development engineer with a

complete microcontroller design tool set for PIC

microcontrollers. Software control of the MPLAB ICE

2000 In-Circuit Emulator is advanced by the MPLAB

Integrated Development Environment, which allows

editing, building, downloading and source debugging

from a single environment.

The MPLAB ICE 2000 is a full-featured emulator

system with enhanced trace, trigger and data monitor-

ing features. Interchangeable processor modules allow

the system to be easily reconfigured for emulation of

different processors. The architecture of the MPLAB

ICE 2000 In-Circuit Emulator allows expansion to

support new PIC microcontrollers.

The MPLAB ICE 2000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft^®Windows^®32-bit operating system were

chosen to best make these features available in a

simple, unified application.

22.10 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an SD/MMC card for

file storage and secure data applications.

22.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC^®Flash MCUs and dsPIC^®Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The MPLAB REAL ICE probe is connected to the design

engineer’s PC using a high-speed USB 2.0 interface and

is connected to the target with either a connector

compatible with the popular MPLAB ICD 2 system

(RJ11) or with the new high-speed, noise tolerant, Low-

Voltage Differential Signal (LVDS) interconnection

(CAT5).

MPLAB REAL ICE is field upgradeable through future

firmware downloads in MPLAB IDE. In upcoming

releases of MPLAB IDE, new devices will be sup-

ported, and new features will be added, such as soft-

ware breakpoints and assembly code trace. MPLAB

REAL ICE offers significant advantages over competi-

tive emulators including low-cost, full-speed emulation,

real-time variable watches, trace analysis, complex

breakpoints, a ruggedized probe interface and long (up

to three meters) interconnection cables.

DS70141E-page 161

dsPIC30F3010/3011

22.11 PICSTART Plus Development

Programmer

22.13 Demonstration, Development and

Evaluation Boards

The PICSTART Plus Development Programmer is an

easy-to-use, low-cost, prototype programmer. It

connects to the PC via a COM (RS-232) port. MPLAB

Integrated Development Environment software makes

using the programmer simple and efficient. The

PICSTART Plus Development Programmer supports

most PIC devices in DIP packages up to 40 pins.

Larger pin count devices, such as the PIC16C92X and

PIC17C76X, may be supported with an adapter socket.

The PICSTART Plus Development Programmer is CE

compliant.

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

22.12 PICkit 2 Development Programmer

The PICkit™ 2 Development Programmer is a low-cost

programmer and selected Flash device debugger with

an easy-to-use interface for programming many of

Microchip’s baseline, mid-range and PIC18F families of

Flash memory microcontrollers. The PICkit 2 Starter Kit

includes a prototyping development board, twelve

sequential lessons, software and HI-TECH’s PICC™

Lite C compiler, and is designed to help get up to speed

quickly using PIC^®microcontrollers. The kit provides

everything needed to program, evaluate and develop

applications using Microchip’s powerful, mid-range

Flash memory family of microcontrollers.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

®

for analog filter design, KEELOQ security ICs, CAN,

IrDA^®, PowerSmart battery management, SEEVAL^®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

DS70141E-page 162

dsPIC30F3010/3011

23.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future

revisions of this document as it becomes available.

For detailed information about the dsPIC30F architecture and core, refer to “dsPIC30F Family Reference Manual”

(DS70046).

Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for

extended periods may affect device reliability. Functional operation of the device at these or any other conditions above

the parameters indicated in the operation listings of this specification is not implied.

(†)

Absolute Maximum Ratings

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1)..................................... -0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Voltage on MCLR with respect to VSS ....................................................................................................... 0V to +13.25V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin (Note 2)................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin ....................................................................................................25 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports (Note 2)....................................................................................................200 mA

Note 1: Voltage spikes below Vss at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.

Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather

than pulling this pin directly to Vss.

2: Maximum allowable current is a function of device maximum power dissipation. See Table 23-2.

^†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

23.1 DC Characteristics

TABLE 23-1: OPERATING MIPS VS. VOLTAGE

Max MIPS

VDD Range

Temp Range

dsPIC30F301X-30I

dsPIC30F301X-20E

4.5-5.5V

3.0-3.6V

2.5-3.0V

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

30

—

20

—

10

—

20

—

15

—

DS70141E-page 163

dsPIC30F3010/3011

TABLE 23-2: THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

dsPIC30F301X-30I

Operating Junction Temperature Range

Operating Ambient Temperature Range

dsPIC30F301X-20E

TJ

TA

-40

—

+125

+85

°C

Operating Junction Temperature Range

Operating Ambient Temperature Range

TJ

TA

-40

—

+150

+125

°C

Power Dissipation:

Internal chip power dissipation:

P_INT= V_DD× (I_DD

–

)

∑ I_OH

PD

PINT + PI/O

W

I/O Pin power dissipation:

P_I/O

=

({

} ×

) +

I_OH

(

∑

)

V_OL× I_OL

V_DD– V_OH

∑

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/θJA

TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 28-pin SPDIP (SP)

Package Thermal Resistance, 28-pin SOIC (SO)

Package Thermal Resistance, 40-pin PDIP (P)

Package Thermal Resistance, 44-pin TQFP (PT, 10x10x1 mm)

Package Thermal Resistance, 44-pin QFN (ML)

θ^JA

θJA

θ^JA

θJA

42

49

37

45

28

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.

TABLE 23-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

DC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic

Min

Typ⁽¹⁾Max Units

Conditions

Operating Voltage⁽²⁾

DC10

DC11

DC12

DC16

VDD

VDR

VPOR

Supply Voltage

2.5

3.0

1.75

—

5.5

—

V

Industrial temperature

Extended temperature

Supply Voltage

RAM Data Retention Voltage⁽³⁾

—

VDD Start Voltage

to Ensure Internal

VSS

—

Power-on Reset Signal

DC17

SVDD

VDD Rise Rate

to Ensure Internal

Power-on Reset Signal

0.05

—

V/ms 0-5V in 0.1 sec

0-3V in 60 ms

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: This is the limit to which VDD can be lowered without losing RAM data.

DS70141E-page 164

dsPIC30F3010/3011

TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Parameter

Typical⁽¹⁾

No.

Max

Units

Conditions

Operating Current (IDD)⁽²⁾

DC31a

DC31b

DC31c

DC31e

DC31f

DC31g

DC30a

DC30b

DC30c

DC30e

DC30f

DC30g

DC23a

DC23b

DC23c

DC23e

DC23f

DC23g

DC24a

DC24b

DC24c

DC24e

DC24f

DC24g

DC27a

DC27b

DC27d

DC27e

DC27f

DC29a

DC29b

1.4

2.5

mA

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

25°C

85°C

125°C

25°C

85°C

3.3V

5V

1.4

2.5

0.128 MIPS

LPRC (512 kHz)

3.0

4.5

2.8

4.5

2.8

4.5

3.2

5.0

3.3

5.0

3.3V

5V

3.3

5.0

1.8 MIPS

FRC (7.37MHz)

6.0

9.0

5.9

9.0

5.9

9.0

10.0

11.0

17.0

18.0

24.0

25.0

41.0

46.0

76.0

109.0

108.0

17.0

27.0

38.0

62.0

70.0

115.0

155.0

3.3V

5V

4 MIPS

3.3V

10 MIPS

5V

3.3V

5V

20 MIPS

30 MIPS

5V

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, program memory and data memory

are operational. No peripheral modules are operating.

DS70141E-page 165

dsPIC30F3010/3011

TABLE 23-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Parameter

Typical^(1,2)

No.

Max

Units

Conditions

Operating Current (IDD)

DC51a

DC51b

DC51c

DC51e

DC51f

DC51g

DC50a

DC50b

DC50c

DC50e

DC50f

DC50g

DC43a

DC43b

DC43c

DC43e

DC43f

DC43g

DC44a

DC44b

DC44c

DC44e

DC44f

DC44g

DC47a

DC47b

DC47d

DC47e

DC47f

DC49a

DC49b

1.1

1.8

mA

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

25°C

85°C

125°C

25°C

85°C

3.3V

5V

1.1

1.8

0.128 MIPS

LPRC (512 kHz)

2.6

4.0

2.4

4.0

2.3

4.0

3.2

5.0

3.3

5.0

3.3V

5V

3.3

5.0

1.8 MIPS

FRC (7.37MHz)

6.0

9.0

5.9

9.0

5.9

9.0

6.0

9.3

6.1

9.3

3.3V

5V

6.2

9.3

4 MIPS

11.0

13.0

14.0

23.0

25.0

26.0

43.0

62.0

63.0

17.0

21.0

35.0

40.0

60.0

80.0

3.3V

10 MIPS

5V

3.3V

5V

20 MIPS

30 MIPS

5V

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with core off, clock on and all modules turned off.

DS70141E-page 166

dsPIC30F3010/3011

TABLE 23-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Parameter

Typical⁽¹⁾

No.

Max

Units

Conditions

Power-Down Current (IPD)⁽²⁾

DC60a

DC60b

DC60c

DC60e

DC60f

DC60g

DC61a

DC61b

DC61c

DC61e

DC61f

DC61g

DC62a

DC62b

DC62c

DC62e

DC62f

DC62g

DC63a

DC63b

DC63c

DC63e

DC63f

DC63g

0.3

1.0

14.0

27.0

55.0

20.0

40.0

90.0

12.0

21.0

10.0

15.0

57.0

65.0

μA

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

25°C

85°C

125°C

3.3V

5V

12.0

0.5

Base Power-Down Current

2.0

17.0

8.0

3.3V

5V

8.0

(3)

Watchdog Timer Current: ΔIWDT

14.0

4.0

5.0

3.3V

5V

4.0

Timer 1 w/32 kHz Crystal: ΔITI32⁽³⁾

4.0

6.0

5.0

33.0

37.0

38.0

41.0

43.0

3.3V

5V

(3)

BOR on: ΔIBOR

Note 1: Parameters are for design guidance only and are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: These values represent the difference between the base power-down current and the power-down current

with the specified peripheral enabled during Sleep.

DS70141E-page 167

dsPIC30F3010/3011

TABLE 23-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

VIL

Input Low Voltage⁽²⁾

DI10

I/O Pins:

with Schmitt Trigger Buffer

VSS

—

0.2 VDD

0.3 VDD

0.2 VDD

V

DI15

DI16

DI17

DI18

DI19

MCLR

OSC1 (in XT, HS and LP modes)

OSC1 (in RC mode)⁽³⁾

SDA, SCL

SMbus disabled

SDA, SCL

SMbus enabled

VIH

Input High Voltage⁽²⁾

DI20

I/O Pins:

with Schmitt Trigger Buffer

0.8 VDD

—

VDD

V

DI25

DI26

DI27

DI28

DI29

MCLR

OSC1 (in XT, HS and LP modes) 0.7 VDD

OSC1 (in RC mode)⁽³⁾

0.9 VDD

0.7 VDD

0.8 VDD

SDA, SCL

SMbus disabled

SMbus enabled

SDA, SCL

ICNPU

IIL

CNXX Pull-up Current⁽²⁾

DI30

50

250

400

μA VDD = 5V, VPIN = VSS

Input Leakage Current^(2,4,5)

DI50

DI51

I/O Ports

—

0.01

0.50

±1

—

μA VSS ≤ VPIN ≤ VDD,

Pin at high-impedance

Analog Input Pins

μA VSS ≤ VPIN ≤ VDD,

Pin at high-impedance

DI55

DI56

MCLR

OSC1

—

0.05

±5

μA

VSS ≤ VPIN ≤ VDD

μA VSS ≤ VPIN ≤ VDD, XT, HS

and LP Oscillator mode

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that

the dsPIC30F device be driven with an external clock while in RC mode.

4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

5: Negative current is defined as current sourced by the pin.

DS70141E-page 168

dsPIC30F3010/3011

TABLE 23-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾Max Units

Conditions

VOL

Output Low Voltage⁽²⁾

DO10

DO16

I/O Ports

—

0.6

0.15

0.6

V

IOL = 8.5 mA, VDD = 5V

IOL = 2.0 mA, VDD = 3V

IOL = 1.6 mA, VDD = 5V

IOL = 2.0 mA, VDD = 3V

OSC2/CLKO

(RC or EC Oscillator mode)

Output High Voltage⁽²⁾

I/O Ports

0.72

VOH

DO20

DO26

VDD – 0.7

VDD – 0.2

VDD – 0.7

VDD – 0.1

—

V

IOH = -3.0 mA, VDD = 5V

IOH = -2.0 mA, VDD = 3V

IOH = -1.3 mA, VDD = 5V

IOH = -2.0 mA, VDD = 3V

OSC2/CLKO

(RC or EC Oscillator mode)

Capacitive Loading Specs

on Output Pins⁽²⁾

DO50 COSC2

OSC2/SOSC2 pin

—

15

pF In XTL, XT, HS and LP modes

when external clock is used to

drive OSC1.

DO56 CIO

DO58 CB

All I/O Pins and OSC2

SCL, SDA

—

50

pF RC or EC Oscillator mode

pF In I²C™ mode

400

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

FIGURE 23-1:

BROWN-OUT RESET CHARACTERISTICS

VDD

(Device not in Brown-out Reset)

BO15

BO10

(Device in Brown-out Reset)

Reset (due to BOR)

Power-Up Time-out

DS70141E-page 169

dsPIC30F3010/3011

TABLE 23-10: ELECTRICAL CHARACTERISTICS: BOR

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min Typ⁽¹⁾Max Units

Conditions

BO10

VBOR

BOR Voltage on VDD BORV = 11⁽³⁾

—

V

Not in operating

range

Transition

High-to-Low⁽²⁾

BORV = 10

2.6

4.1

4.58

—

5

2.71

4.4

V

BORV = 01

BORV = 00

4.73

—

V

BO15

VBHYS

mV

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: ‘11’ values not in usable operating range.

TABLE 23-11: DC CHARACTERISTICS: PROGRAM AND EEPROM

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

DC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic

Min Typ⁽¹⁾Max Units

Conditions

Data EEPROM Memory⁽²⁾

Byte Endurance

D120

D121

ED

100K

VMIN

1M

—

E/W -40°C ≤ TA ≤ +85°C

VDRW

VDD for Read/Write

5.5

V

Using EECON to read/write

VMIN = Minimum operating

voltage

D122

D123

TDEW

Erase/Write Cycle Time

Characteristic Retention

—

2

—

ms

TRETD

40

100

Year Provided no other specifications

are violated

D124

IDEW

IDD During Programming

Program Flash Memory⁽²⁾

Cell Endurance

—

10

30

mA Row Erase

D130

D131

EP

10K

100K

—

E/W -40°C ≤ TA ≤ +85°C

VPR

VDD for Read

VMIN

5.5

V

VMIN = Minimum operating

voltage

D132

D133

D134

D135

VEB

VDD for Bulk Erase

4.5

3.0

1

—

5.5

2

V

VPEW

TPEW

TRETD

VDD for Erase/Write

Erase/Write Cycle Time

Characteristic Retention

—

ms

40

100

—

Year Provided no other specifications

are violated

D136

D137

D138

TEB

IPEW

IEB

ICSP™ Block Erase Time

IDD During Programming

—

4

—

30

ms

10

mA Row Erase

mA Bulk Erase

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing.

DS70141E-page 170

dsPIC30F3010/3011

23.2 AC Characteristics and Timing Parameters

The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 23-12: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Operating voltage VDD range as described

in Section 23.1 "DC Characteristics".

FIGURE 23-2:

LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Load Condition 1 – for all pins except OSC2

VDD/2

Load Condition 2 – for OSC2

CL

RL

VSS

CL

RL = 464Ω

CL = 50 pF for all pins except OSC2

5 pF for OSC2 output

VSS

FIGURE 23-3:

EXTERNAL CLOCK TIMING

Q4

Q1

Q2

Q3

Q4

Q1

OSC1

CLKO

OS20

OS30 OS30

OS25

OS31 OS31

OS40

OS41

DS70141E-page 171

dsPIC30F3010/3011

TABLE 23-13: EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

OS10

FOSC

External CLKI Frequency⁽²⁾

(External clocks allowed

only in EC mode)

DC

4

—

40

10

7.5

MHz

EC

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

4

Oscillator Frequency⁽²⁾

DC

0.4

4

—

7.37

512

4

MHz

kHz

RC

XTL

XT

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

HS

10

7.5

25

33

—

4

10

31

—

LP

MHz

kHz

FRC internal

LPRC internal

OS20

TOSC

TOSC = 1/FOSC

—

See parameter OS10

for FOSC value

OS25 TCY

Instruction Cycle Time^(2,3)

33

—

DC

—

ns

See Table 23-16

EC

OS30 TosL,

TosH

External Clock in (OSC1)

High or Low Time⁽²⁾

.45 x TOSC

OS31 TosR,

TosF

External Clock in (OSC1)

Rise or Fall Time⁽²⁾

—

20

ns

EC

OS40 TckR

OS41 TckF

CLKO Rise Time^(2,4)

CLKO Fall Time^(2,4)

—

ns

See parameter DO31

See parameter DO32

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “Min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“Max.” cycle time limit is “DC” (no clock) for all devices.

4: Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is

low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

DS70141E-page 172

dsPIC30F3010/3011

TABLE 23-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

OS50

FPLLI

PLL Input Frequency Range⁽²⁾

4

—

10

MHz EC with 4x PLL

MHz EC with 8x PLL

MHz EC with 16x PLL

MHz XT with 4x PLL

MHz XT with 8x PLL

MHz XT with 16x PLL

MHz HS/2 with 4x PLL

MHz HS/2 with 8x PLL

MHz HS/2 with 16x PLL

7.5⁽⁴⁾

10

4

7.5⁽⁴⁾

10

5⁽³⁾

4

10

7.5⁽⁴⁾

8.33⁽³⁾MHz HS/3 with 4x PLL

4

8.33⁽³⁾MHz HS/3 with 8x PLL

7.5⁽⁴⁾

120

MHz HS/3 with 16x PLL

OS51

OS52

FSYS

TLOC

On-Chip PLL Output⁽²⁾

16

—

MHz EC, XT, HS/2, HS/3 modes

with PLL

PLL Start-up Time (lock time)

—

20

50

μs

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Limited by oscillator frequency range.

4: Limited by device operating frequency range.

TABLE 23-15: PLL JITTER

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature

AC CHARACTERISTICS

-40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

-40°C ≤ TA ≤ +85°C

OS61

x4 PLL

—

0.251 0.413

%

VDD = 3.0 to 3.6V

VDD = 4.5 to 5.5V

VDD = 3.0 to 3.6V

VDD = 4.5 to 5.5V

VDD = 3.0 to 3.6V

VDD = 4.5 to 5.5V

-40°C ≤ TA ≤ +125°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

0.256

0.47

x8 PLL

0.355 0.584

0.362 0.664

x16 PLL

0.67

0.92

0.632 0.956

Note 1: These parameters are characterized but not tested in manufacturing.

DS70141E-page 173

dsPIC30F3010/3011

TABLE 23-16: INTERNAL CLOCK TIMING EXAMPLES

Clock

FOSC

MIPS⁽³⁾

w PLL x4

MIPS⁽³⁾

w PLL x8

MIPS⁽³⁾

w PLL x16

Oscillator

Mode

TCY (μsec)⁽²⁾

(MHz)⁽¹⁾

w/o PLL

EC

XT

0.200

4

20.0

1.0

0.05

1.0

—

4.0

10.0

—

8.0

20.0

—

16.0

—

10

25

4

0.4

2.5

0.16

1.0

6.25

1.0

—

4.0

10.0

8.0

20.0

16.0

—

10

0.4

2.5

Note 1: Assumption: Oscillator Postscaler is divide by 1.

2: Instruction Execution Cycle Time: TCY = 1/MIPS.

3: Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 since there are 4 Q clocks per instruction cycle.

DS70141E-page 174

dsPIC30F3010/3011

TABLE 23-17: AC CHARACTERISTICS: INTERNAL FRC ACCURACY

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

AC CHARACTERISTICS⁽²⁾

Operating temperature

-40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

Characteristic

No.

Min

Typ

Max

Units

Conditions

Internal FRC Accuracy @ FRC Freq. = 7.37 MHz⁽¹⁾

OS63

FRC

—

±2.00

±5.00

%

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

VDD = 3.0-5.5V

Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.

TABLE 23-18: AC CHARACTERISTICS: INTERNAL LPRC ACCURACY

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Characteristic

Min

Typ

Max

Units

Conditions

LPRC @ Freq. = 512 kHz⁽¹⁾

OS65A

OS65B

OS65C

-50

-60

-70

—

+50

+60

+70

%

VDD = 5.0V, ±10%

VDD = 3.3V, ±10%

VDD = 2.5V

Note 1: Change of LPRC frequency as VDD changes.

DS70141E-page 175

dsPIC30F3010/3011

FIGURE 23-4:

CLKO AND I/O TIMING CHARACTERISTICS

I/O Pin

(Input)

DI35

DI40

I/O Pin

(Output)

New Value

Old Value

DO31

DO32

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-19: CLKO AND I/O TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic^(1,2,3)

Min

Typ⁽⁴⁾

Max

Units

Conditions

DO31

DO32

DI35

TIOR

TIOF

TINP

TRBP

Port Output Rise Time

—

7

20

—

ns

Port Output Fall Time

INTx Pin High or Low Time (output)

CNx High or Low Time (input)

20

—

DI40

2 TCY

Note 1: These parameters are asynchronous events not related to any internal clock edges.

2: Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.

3: These parameters are characterized but not tested in manufacturing.

4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

DS70141E-page 176

dsPIC30F3010/3011

FIGURE 23-5:

RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

SY12

MCLR

SY10

Internal

POR

SY11

PWRT

Time-out

SY30

Oscillator

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY20

SY13

I/O Pins

SY35

FSCM

Delay

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-20: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max Units

Conditions

SY10

SY11

TmcL

MCLR Pulse Width (low)

Power-up Timer Period

2

—

μs

-40°C to +85°C

TPWRT

2

10

43

4

16

64

8

32

128

ms

-40°C to +85°C,

VDD = 5V

User programmable

SY12

SY13

TPOR

TIOZ

Power-on Reset Delay

3

10

30

μs

-40°C to +85°C

I/O High-impedance from MCLR

Low or Watchdog Timer Reset

—

0.8

1.0

SY20

TWDT1

TWDT2

TWDT3

Watchdog Timer Time-out Period

(no prescaler)

1.1

1.2

1.3

2.0

6.6

5.0

4.0

ms

VDD = 2.5V

VDD = 3.3V, ±10%

VDD = 5V, ±10%

SY25

SY30

SY35

TBOR

TOST

Brown-out Reset Pulse Width⁽³⁾

Oscillator Start-up Timer Period

Fail-Safe Clock Monitor Delay

100

—

1024 TOSC

500

—

μs

—

μs

VDD ≤ VBOR (D034)

TOSC = OSC1 period

-40°C to +85°C

TFSCM

—

900

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

3: Refer to Figure 23-1 and Table 23-10 for BOR.

DS70141E-page 177

dsPIC30F3010/3011

FIGURE 23-6:

BAND GAP START-UP TIME CHARACTERISTICS

VBGAP

0V

Enable Band Gap⁽¹⁾

Band Gap

Stable

SY40

Note 1: Band gap is enabled when FBORPOR<7> is set.

TABLE 23-21: BAND GAP START-UP TIME REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

Symbol

No.

Characteristic⁽¹⁾

Band Gap Start-up Time

Min Typ⁽²⁾Max Units

40 65

Conditions

SY40

TBGAP

—

μs Defined as the time between the

instant that the band gap is enabled

and the moment that the band gap

reference voltage is stable.

RCON<13> status bit

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

DS70141E-page 178

dsPIC30F3010/3011

FIGURE 23-7:

TIMER1, 2, 3, 4 AND 5 EXTERNAL CLOCK TIMING CHARACTERISTICS

TxCK

Tx11

Tx10

Tx15

OS60

Tx20

TMRX

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ Max Units

Conditions

TA10

TA11

TA15

TTXH

TTXL

TTXP

TxCK High Time

TxCK Low Time

Synchronous,

no prescaler

0.5 TCY + 20

—

ns

Must also meet

parameter TA15

Synchronous,

with prescaler

10

Asynchronous

10

—

ns

Synchronous,

no prescaler

0.5 TCY + 20

Must also meet

parameter TA15

Synchronous,

with prescaler

10

—

ns

Asynchronous

10

—

ns

TxCK Input Period Synchronous,

no prescaler

TCY + 10

Synchronous,

with prescaler

Greater of:

20 ns or

—

N = prescale value

(1, 8, 64, 256)

(TCY + 40)/N

Asynchronous

20

—

ns

OS60

TA20

Ft1

SOSC1/T1CK Oscillator Input

Frequency Range (oscillator

enabled by setting bit, TCS

(T1CON<1>))

DC

50

kHz

TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment

0.5 TCY

1.5

TCY

—

DS70141E-page 179

dsPIC30F3010/3011

TABLE 23-23: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

TtxH

Characteristic

Min

Typ

Max

Units

Conditions

TB10

TxCK High Time Synchronous, 0.5 TCY + 20

no prescaler

—

ns

Must also meet

parameter TB15

Synchronous,

with prescaler

10

—

ns

TB11

TB15

TtxL

TtxP

TxCK Low Time

Synchronous, 0.5 TCY + 20

no prescaler

Must also meet

parameter TB15

Synchronous,

with prescaler

10

TxCK Input

Period

Synchronous,

no prescaler

TCY + 10

N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler

Greater of:

20 ns or

(TCY + 40)/N

TB20

TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment

0.5 TCY

—

1.5 TCY

—

TABLE 23-24: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

No.

Symbol

TtxH

Characteristic

Min

Typ

Max Units

Conditions

TC10

TC11

TC15

TxCK High Time

TxCK Low Time

Synchronous

0.5 TCY + 20

—

ns

Must also meet

parameter TC15

TtxL

TtxP

0.5 TCY + 20

TCY + 10

—

Must also meet

parameter TC15

TxCK Input Period Synchronous,

no prescaler

N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler

Greater of:

20 ns or

(TCY + 40)/N

TC20

TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment

0.5 TCY

—

1.5

TCY

—

DS70141E-page 180

dsPIC30F3010/3011

FIGURE 23-8:

TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS

QEB

TQ11

TQ10

TQ15

TQ20

POSCNT

TABLE 23-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

TQ10 TtQH

TQ11 TtQL

TQ15 TtQP

TQCK High Time Synchronous,

with prescaler

TCY + 20

—

ns

Must also meet

parameter TQ15

TQCK Low Time

Synchronous,

with prescaler

TCY + 20

—

ns

—

Must also meet

parameter TQ15

TQCP Input

Period

Synchronous, 2 * TCY + 40

with prescaler

TQ20

TCKEXTMRL Delay from External TQCK Clock

Edge to Timer Increment

0.5 TCY

1.5 TCY

Note 1: These parameters are characterized but not tested in manufacturing.

DS70141E-page 181

dsPIC30F3010/3011

FIGURE 23-9:

INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

ICX

IC10

IC11

IC15

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-26: INPUT CAPTURE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Max

Units

Conditions

IC10

IC11

IC15

TccL

TccH

TccP

ICx Input Low Time No prescaler

With prescaler

0.5 TCY + 20

10

—

ns

ICx Input High Time No prescaler

With prescaler

0.5 TCY + 20

10

ICx Input Period

(2 TCY + 40)/N

N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

FIGURE 23-10:

OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

OCx

(Output Compare

or PWM Mode)

OC10

OC11

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

AC CHARACTERISTICS

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

OC10 TccF

OC11 TccR

OCx Output Fall Time

OCx Output Rise Time

—

ns

See parameter DO32

See parameter DO31

Note 1: These parameters are characterized but not tested in manufacturing.

DS70141E-page 182

dsPIC30F3010/3011

FIGURE 23-11:

OCFA/OCFB

OCx

OCx/PWM MODULE TIMING CHARACTERISTICS

OC20

OC15

TABLE 23-28: SIMPLE OCx/PWM MODE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

No.

Symbol

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

OC15 TFD

Fault Input to PWM I/O

Change

—

50

ns

OC20 TFLT

Fault Input Pulse Width

50

—

ns

Note 1: These parameters are characterized but not tested in manufacturing.

DS70141E-page 183

dsPIC30F3010/3011

FIGURE 23-12:

MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS

MP30

FLTA/B

PWMx

MP20

FIGURE 23-13:

MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS

MP11 MP10

PWMx

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

MP10

MP11

TFPWM

TRPWM

PWM Output Fall Time

—

ns

See parameter DO32

See parameter DO31

PWM Output Rise

Time

MP20

MP30

TFD

TFH

Fault Input ↓ to PWM

I/O Change

—

50

—

ns

Minimum Pulse Width

50

Note 1: These parameters are characterized but not tested in manufacturing.

DS70141E-page 184

dsPIC30F3010/3011

FIGURE 23-14:

QEA/QEB INPUT CHARACTERISTICS

TQ36

QEA

(input)

TQ30

TQ31

TQ35

QEB

(input)

TQ41

TQ31

TQ40

TQ30

TQ35

QEB

Internal

TABLE 23-30: QUADRATURE DECODER TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Typ⁽²⁾

Max

Units

Conditions

TQ30

TQ31

TQ35

TQ36

TQ40

TQUL

Quadrature Input Low Time

Quadrature Input High Time

Quadrature Input Period

Quadrature Phase Period

6 TCY

—

ns

TQUH

TQUIN

TQUP

TQUFL

12 TCY

3 TCY

Filter Time to Recognize Low,

with Digital Filter

3 * N * TCY

N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ41

TQUFH

Filter Time to Recognize High,

with Digital Filter

3 * N * TCY

—

ns

N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

Note 1: These parameters are characterized but not tested in manufacturing.

2: N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 16. “Quadrature Encoder

Interface (QEI)” in the”dsPIC30F Family Reference Manual” (DS70046).

DS70141E-page 185

dsPIC30F3010/3011

FIGURE 23-15:

QEI MODULE INDEX PULSE TIMING CHARACTERISTICS

QEA

(input)

QEB

(input)

Ungated

Index

TQ50

TQ51

Index Internal

TQ55

Position

TABLE 23-31: QEI INDEX PULSE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Max

Units

Conditions

TQ50

TQ51

TQ55

TqIL

Filter Time to Recognize Low,

with Digital Filter

3 * N * TCY

—

ns

N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TqiH

Tqidxr

Filter Time to Recognize High,

with Digital Filter

3 * N * TCY

3 TCY

—

ns

N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

Index Pulse Recognized to Position

Counter Reset (ungated index)

Note 1: These parameters are characterized but not tested in manufacturing.

2: Alignment of index pulses to QEA and QEB is shown for position counter reset timing only. Shown for

forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB), but

index pulse recognition occurs on falling edge.

DS70141E-page 186

dsPIC30F3010/3011

FIGURE 23-16:

SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCKx

(CKP = 0)

SP11

SP10

SP21

SP20

SCKx

(CKP = 1)

SP35

SP31

SP21

LSb

BIT14 - - - - - -1

MSb

SDOx

SDIx

SP30

MSb In

SP40

LSb In

BIT14 - - - -1

SP41

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-32: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

SP10

SP11

SP20

TscL

TscH

TscF

SCKX Output Low Time⁽²⁾

SCKX Output High Time⁽²⁾

SCKX Output Fall Time⁽³⁾

TCY/2

—

ns

See parameter

DO32

SP21

SP30

SP31

SP35

SP40

SP41

TscR

TdoF

TdoR

SCKX Output Rise Time⁽³⁾

—

20

—

30

—

ns

See parameter

DO31

SDOX Data Output Fall Time⁽³⁾

SDOX Data Output Rise Time⁽³⁾

See parameter

DO32

See parameter

DO31

TscH2doV, SDOX Data Output Valid after

TscL2doV SCKX Edge

TdiV2scH, Setup Time of SDIX Data Input

TdiV2scL

TscH2diL, Hold Time of SDIX Data Input

TscL2diL to SCKX Edge

Note 1: These parameters are characterized but not tested in manufacturing.

to SCKX Edge

2: The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

3: Assumes 50 pF load on all SPI pins.

DS70141E-page 187

dsPIC30F3010/3011

FIGURE 23-17:

SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

SP36

SCKX

(CKP = 0)

SP11

SP10

SP21

SP20

SP21

SCKX

(CKP = 1)

SP35

SP20

LSb

MSb

SP40

BIT14 - - - - - -1

SDOX

SP30,SP31

BIT14 - - - -1

SDIX

MSb IN

SP41

Note: Refer to Figure 23-2 for load conditions.

LSb IN

TABLE 23-33: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

TscL

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

SP10

SP11

SP20

SCKX Output Low Time⁽²⁾

SCKX Output High Time⁽²⁾

SCKX Output Fall Time⁽³⁾

TCY/2

—

ns

TscH

TscF

See parameter

DO32

SP21

SP30

SP31

SP35

SP36

SP40

SP41

TscR

TdoF

TdoR

SCKX Output Rise Time⁽³⁾

—

30

20

—

30

—

ns

See parameter

DO31

SDOX Data Output Fall

Time⁽³⁾

See parameter

DO32

SDOX Data Output Rise

Time⁽³⁾

See parameter

DO31

TscH2doV, SDOX Data Output Valid After

TscL2doV SCKX Edge

TdoV2sc,

TdoV2scL First SCKX Edge

SDOX Data Output Setup to

TdiV2scH, Setup Time of SDIX Data

TdiV2scL

TscH2diL, Hold Time of SDIX Data Input

TscL2diL to SCKX Edge

Note 1: These parameters are characterized but not tested in manufacturing.

Input to SCKX Edge

2: The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in master mode must not

violate this specification.

3: Assumes 50 pF load on all SPI pins.

DS70141E-page 188

dsPIC30F3010/3011

FIGURE 23-18:

SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

SSX

SP52

SP50

SCK

(CKP =

X

0

)

SP71

SP70

SP72

SP73

SCK

(CKP =

X

1

SP35

SP73

LSb

SP72

MSb

SDOX

BIT14 - - - - - -1

SP51

SP30,SP31

BIT14 - - - -1

SDIX

MSb In

SP41

LSb In

SP40

Note: Refer to Figure 23-2 for load conditions.

TABLE 23-34: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

AC CHARACTERISTICS

Operating temperature

-40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for

Extended

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ⁽²⁾Max Units

Conditions

SP70 TscL

SP71 TscH

SP72 TscF

SP73 TscR

SP30 TdoF

SCKX Input Low Time

SCKX Input High Time

SCKX Input Fall Time⁽³⁾

SCKX Input Rise Time⁽³⁾

SDOX Data Output Fall Time⁽³⁾

30

—

10

—

25

—

ns

See parameter

DO32

SP31 TdoR

SDOX Data Output Rise Time⁽³⁾

—

30

—

See parameter

DO31

SP35 TscH2doV, SDOX Data Output Valid after

TscL2doV SCKX Edge

SP40 TdiV2scH, Setup Time of SDIX Data Input

TdiV2scL to SCKX Edge

20

SP41 TscH2diL, Hold Time of SDIX Data Input

TscL2diL to SCKX Edge

20

SP50 TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input

120

TssL2scL

SP51 TssH2doZ SSX↑ to SDOX Output High-Impedance⁽³⁾

10

—

50

—

ns

SP52 TscH2ssH SSX after SCKx Edge

TscL2ssH

1.5 TCY + 40

—

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Assumes 50 pF load on all SPI pins.

DS70141E-page 189

dsPIC30F3010/3011

FIGURE 23-19:

SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SP60

SSX

SP52

SP50

SCKX

(CKP = 0)

SP71

SP70

SP72

SP73

SCKX

(CKP = 1)

SP35

SP72

LSb

SP52

BIT14 - - - - - -1

MSb

SDOX

SDIX

SP30,SP31

BIT14 - - - -1

SP51

MSb In

SP41

LSb In

SP40

Note: Refer to Figure 23-2 for load conditions.

DS70141E-page 190

dsPIC30F3010/3011

TABLE 23-35: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

SP70

SP71

SP72

SP73

SP30

TscL

TscH

TscF

TscR

TdoF

SCKX Input Low Time

30

—

10

—

25

—

ns

SCKX Input High Time

SCKX Input Fall Time⁽³⁾

SCKX Input Rise Time⁽³⁾

SDOX Data Output Fall Time⁽³⁾

See parameter

DO32

SP31

SP35

SP40

SP41

SP50

SP51

SP52

SP60

TdoR

SDOX Data Output Rise Time⁽³⁾

—

30

—

50

—

50

ns

See parameter

DO31

TscH2doV, SDOX Data Output Valid after

TscL2doV SCKX Edge

—

TdiV2scH, Setup Time of SDIX Data Input

TdiV2scL to SCKX Edge

20

TscH2diL, Hold Time of SDIX Data Input

TscL2diL

20

to SCKX Edge

TssL2scH, SSX↓ to SCKX↓ or SCKX↑ Input

TssL2scL

120

TssH2doZ SSX↑ to SDOX Output

10

1.5 TCY + 40

—

High-Impedance⁽⁴⁾

TscH2ssH SSX↑ after SCKX Edge

TscL2ssH

TssL2doV SDOX Data Output Valid after

SSX Edge

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCx is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

DS70141E-page 191

dsPIC30F3010/3011

FIGURE 23-20:

I²C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

SCL

SDA

IM31

IM34

IM30

IM33

Stop

Condition

Start

Condition

Note: Refer to Figure 23-2 for load conditions.

FIGURE 23-21:

I²C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM20

IM21

IM11

IM10

SCL

IM11

IM26

IM10

IM33

IM25

SDA

In

IM45

IM40

SDA

Out

Note: Refer to Figure 23-2 for load conditions.

DS70141E-page 192

dsPIC30F3010/3011

)

TABLE 23-36: I²C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min⁽¹⁾

Max

Units

Conditions

IM10

IM11

IM20

IM21

IM25

IM26

IM30

IM31

IM33

IM34

IM40

IM45

IM50

TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1)

400 kHz mode TCY/2 (BRG + 1)

—

μs

ns

μs

ns

μs

ns

μs

pF

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1)

—

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TF:SCL

TR:SCL

SDA and SCL

Fall Time

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

—

300

100

1000

300

—

CB is specified to be

from 10 to 400 pF

20 + 0.1 CB

—

SDA and SCL

Rise Time

—

CB is specified to be

from 10 to 400 pF

20 + 0.1 CB

—

250

100

—

TSU:DAT Data Input

Setup Time

—

THD:DAT Data Input

Hold Time

0

—

0

0.9

—

TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1)

—

Only relevant for

Repeated Start

condition

Setup Time

400 kHz mode TCY/2 (BRG + 1)

—

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1)

—

After this period the

first clock pulse is

generated

Hold Time

400 kHz mode TCY/2 (BRG + 1)

—

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1)

—

Setup Time

400 kHz mode TCY/2 (BRG + 1)

—

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1)

—

Hold Time

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TAA:SCL Output Valid

From Clock

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

—

3500

1000

—

TBF:SDA Bus Free Time 100 kHz mode

4.7

1.3

—

Time the bus must be

free before a new

transmission can start

400 kHz mode

1 MHz mode⁽²⁾

—

CB

Bus Capacitive Loading

—

400

Note 1: BRG is the value of the I²C™ Baud Rate Generator. Refer to Section 21. “Inter-Integrated Circuit (I²C)”

in the”dsPIC30F Family Reference Manual” (DS70046).

2: Maximum pin capacitance = 10 pF for all I²C pins (for 1 MHz mode only).

DS70141E-page 193

dsPIC30F3010/3011

FIGURE 23-22:

I²C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

SCL

SDA

IS34

IS31

IS30

IS33

Stop

Condition

Start

Condition

FIGURE 23-23:

I²C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IS20

IS21

IS11

IS10

SCL

IS30

IS26

IS31

IS33

IS25

SDA

In

IS45

IS40

SDA

Out

TABLE 23-37: I²C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

No.

Symbol

Characteristic

Min

Max Units

Conditions

IS10

TLO:SCL Clock Low Time 100 kHz mode

400 kHz mode

4.7

—

μs

Device must operate at a

minimum of 1.5 MHz

1.3

Device must operate at a

minimum of 10 MHz.

1 MHz mode⁽¹⁾

0.5

4.0

—

μs

IS11

THI:SCL

Clock High Time 100 kHz mode

Device must operate at a

minimum of 1.5 MHz

400 kHz mode

0.6

—

μs

Device must operate at a

minimum of 10 MHz

1 MHz mode⁽¹⁾

0.5

—

300

100

1000

300

μs

ns

IS20

IS21

TF:SCL

TR:SCL

SDA and SCL

Fall Time

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

—

CB is specified to be from

10 to 400 pF

20 + 0.1 CB

—

SDA and SCL

Rise Time

—

20 + 0.1 CB

—

CB is specified to be from

10 to 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I²C™ pins (for 1 MHz mode only).

DS70141E-page 194

dsPIC30F3010/3011

TABLE 23-37: I²C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE) (CONTINUED)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Max Units

Conditions

IS25

IS26

IS30

IS31

IS33

IS34

IS40

IS45

IS50

TSU:DAT Data Input

100 kHz mode

250

100

0

—

0.9

0.3

—

ns

μs

ns

μs

pF

Setup Time

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

THD:DAT Data Input

Hold Time

0

TSU:STA Start Condition

Setup Time

4.7

0.6

0.25

4.0

0.6

0.25

4.7

0.6

4000

600

250

0

Only relevant for Repeated

Start condition

THD:STA Start Condition

Hold Time

After this period the first

clock pulse is generated

TSU:STO Stop Condition

Setup Time

THD:STO Stop Condition

Hold Time

TAA:SCL

Output Valid

From Clock

3500

1000

350

—

0

TBF:SDA Bus Free Time

4.7

1.3

0.5

—

Time the bus must be free

before a new transmission

can start

—

CB

Bus Capacitive

Loading

400

Note 1: Maximum pin capacitance = 10 pF for all I²C™ pins (for 1 MHz mode only).

DS70141E-page 195

dsPIC30F3010/3011

TABLE 23-38: 10-BIT HIGH-SPEED ADC MODULE SPECIFICATIONS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min.

Typ

Max.

Units

Conditions

Device Supply

AD01

AD02

AVDD

AVSS

Module VDD Supply

Module VSS Supply

Greater of

VDD – 0.3

or 2.7

—

Lesser of

VDD + 0.3

or 5.5

V

VSS – 0.3

—

VSS + 0.3

Reference Inputs

AD05

AD06

AD07

AD08

VREFH

VREFL

VREF

IREF

Reference Voltage High

Reference Voltage Low

AVSS + 2.7

AVSS

—

AVDD

V

AVDD – 2.7

AVDD + 0.3

Absolute Reference Voltage AVSS – 0.3

Current Drain

—

200

.001

300

3

μA A/D operating

μA A/D off

Analog Input

AD10

AD12

VINH-VINL Full-Scale Input Span

VREFL

VREFH

±0.244

V

—

Leakage Current

—

±0.001

μA VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

Source Impedance = 5 kΩ

AD13

AD17

—

Leakage Current

±0.001

±0.244

5K

μA VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

Source Impedance = 5 kΩ

RIN

Recommended Impedance

of Analog Voltage Source

—

Ω

DC Accuracy⁽²⁾

10 data bits

AD20 Nr

AD21 INL

Resolution

bits

Integral Nonlinearity

—

+1

±1

±5

±1

±6

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD21A INL

Integral Nonlinearity

Differential Nonlinearity

Gain Error

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD22 DNL

AD22A DNL

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD23

GERR

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD23A GERR

Gain Error

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

Note 1: These parameters are characterized but not tested in manufacturing.

2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.

3: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

DS70141E-page 196

dsPIC30F3010/3011

TABLE 23-38: 10-BIT HIGH-SPEED ADC MODULE SPECIFICATIONS (CONTINUED)

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Offset Error⁽²⁾

Min.

Typ

Max.

Units

Conditions

AD24

EOFF

±1

±2

±3

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD24A EOFF

Offset Error⁽²⁾

Monotonicity⁽³⁾

±1

±2

±3

—

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD25

—

Guaranteed

Dynamic Performance

AD30 THD

Total Harmonic Distortion

—

-64

57

-67

58

dB

AD31 SINAD

Signal to Noise and

Distortion

AD32 SFDR

Spurious Free Dynamic

Range

—

67

71

dB

AD33

FNYQ

Input Signal Bandwidth

Effective Number of Bits

—

500

—

kHz

bits

AD34 ENOB

9.29

9.41

Note 1: These parameters are characterized but not tested in manufacturing.

2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.

3: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

DS70141E-page 197

dsPIC30F3010/3011

FIGURE 23-24:

10-BIT HIGH-SPEED ADC TIMING CHARACTERISTICS

(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)

AD50

ADCLK

Instruction

Execution

SET SAMP

CLEAR SAMP

SAMP

ch0_dischrg

ch0_samp

ch1_dischrg

ch1_samp

eoc

AD61

AD60

TSAMP

AD55

DONE

ADIF

ADRES(0)

ADRES(1)

1

2

3

4

5

6

7

8

5

6

7

8

— Software sets ADCON. SAMP to start sampling.

— Sampling starts after discharge period.

1

2

TSAMP is described in Section 17, “10-Bit A/D Converter” of the “dsPIC30F Family Reference Manual”, (DS70046).

— Software clears ADCON. SAMP to start conversion.

— Sampling ends, conversion sequence starts.

— Convert bit 9.

3

4

5

6

8

9

— Convert bit 8.

— Convert bit 0.

— One TAD for end of conversion.

DS70141E-page 198

dsPIC30F3010/3011

FIGURE 23-25:

10-BIT HIGH-SPEED ADC TIMING CHARACTERISTICS

(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)

AD50

ADCLK

Instruction

Execution

SET ADON

SAMP

ch0_dischrg

ch0_samp

ch1_dischrg

ch1_samp

eoc

TSAMP

AD55

TCONV

DONE

ADIF

ADRES(0)

ADRES(1)

1

2

3

4

5

6

7

3

4

5

6

8

3

4

— Software sets ADCON. ADON to start AD operation.

— Sampling starts after discharge period.

— Convert bit 0.

1

2

5

6

7

8

— One TAD for end of conversion.

TSAMP is described in Section 17. “10-Bit A/D Converter”

of the”dsPIC30F Family Reference Manual” (DS70046).

— Begin conversion of next channel

— Sample for time specified by SAMC.

TSAMP is described in Section 17. “10-Bit

A/D Converter” of the”dsPIC30F Family

Reference Manual” (DS70046).

— Convert bit 9.

— Convert bit 8.

3

4

DS70141E-page 199

dsPIC30F3010/3011

TABLE 23-39: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

AC CHARACTERISTICS

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic

Min.

Typ

Max.

Units

Conditions

Clock Parameters

AD50 TAD

AD51 tRC

A/D Clock Period

A/D Internal RC Oscillator Period

84

—

ns

See Table 20-2⁽¹⁾

700

900

1100

Conversion Rate

AD55 tCONV

AD56 FCNV

Conversion Time

Throughput Rate

—

12 TAD

—

1.0

—

Msps See Table 20-2⁽¹⁾

AD57 TSAMP Sample Time

1 TAD

—

See Table 20-2⁽¹⁾

Timing Parameters

AD60 tPCS

AD61 tPSS

AD62 t_CSS

AD63 tDPU

Conversion Start from Sample

Trigger

—

0.5 TAD

—

1.0 TAD

—

1.5 TAD

—

μs

Sample Start from Setting

Sample (SAMP) Bit

—

0.5 TAD

—

Conversion Completion to

Sample Start (ASAM = 1)

(2)

Time to Stabilize Analog Stage

from A/D Off to A/D On

—

20

Note 1: Because the sample caps will eventually lose charge, clock periods above 100 μsec can affect linearity

performance, especially at elevated temperatures.

2: tDPU is the time required for the ADC module to stabilize when it is turned on (ADCON1<ADON> = 1).

During this time the ADC result is indeterminate.

DS70141E-page 200

dsPIC30F3010/3011

24.0 PACKAGING INFORMATION

24.1 Package Marking Information

28-Lead PDIP (Skinny DIP)

Example

dsPIC30F3010

30I/SP

XXXXXXXXXXXXXXXXX

e

3

YYWWNNN

0810017

28-Lead SOIC

Example

dsPIC30F3010

XXXXXXXXXXXXXXXXXXXX

30I/SO

e

3

YYWWNNN

0810017

40-Lead PDIP

Example

XXXXXXXXXXXXXXXXXX

YYWWNNN

dsPIC30F3011

30I/P

e

3

0810017

44-Lead QFN

Example

dsPIC

XXXXXXXXXX

YYWWNNN

30F3011

30I/ML

0810017

e

3

Legend: XX...X Customer-specific information

Y

Year code (last digit of calendar year)

YY

Year code (last 2 digits of calendar year)

WW

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

*

)

3

e

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS70141E-page 201

dsPIC30F3010/3011

Package Marking Information (Continued)

44-Lead TQFP

Example

dsPIC

XXXXXXXXXX

YYWWNNN

30F3011

30I/PT

0810017

e

3

44-Lead QFN

Example

XXXXXXXXXX

YYWWNNN

dsPIC

30F3011

30I/ML

0810017

e

3

DS70141E-page 202

dsPIC30F3010/3011

24.2 Package Details

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DS70141E-page 203

dsPIC30F3010/3011

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NOTE 1

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DS70141E-page 206

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DS70141E-page 207

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ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ

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ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ

1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ

ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ

ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜ?1

DS70141E-page 208

dsPIC30F3010/3011

**ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ12ꢊꢋꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ3ꢅꢑꢉꢇꢕꢍ1ꢖꢇMꢇ4ꢘ04ꢘ04ꢇꢙꢙꢇꢚꢛꢆꢌ%ꢇꢀ'ꢘꢘꢇꢙꢙꢇꢜ1,-ꢍ

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ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ

DS70141E-page 209

dsPIC30F3010/3011

**ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇꢁ0ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!

!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ

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ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ

ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ

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ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ

ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢕ-1

DS70141E-page 210

dsPIC30F3010/3011

**ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇꢁ0ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!

!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ

ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ

DS70141E-page 211

dsPIC30F3010/3011

NOTES:

DS70141E-page 212

dsPIC30F3010/3011

Revision E (April 2008)

APPENDIX A: REVISION HISTORY

Revision B (May 2006)

This revision reflects these updates:

• Added OSCTUN register information and updated

the OSCCON register information (removed TUN

bits) in System Integration Register Map (see

Table 20-7)

Previous versions of this data sheet contained

Advance or Preliminary Information. They were

distributed with incomplete characterization data.

• Changed the location of the input reference in the

10-Bit High-Speed ADC Functional Block

Diagram (see Figure 19-1)

This revision reflects these updates:

• Supported I²C Slave Addresses

(see Table 17-1)

• Added Fuse Configuration Register (FICD) details

(see Section 20.6 “Device Configuration

Registers” and Table 20-8)

• ADC Conversion Clock selection to allow 1 Msps

operation (see Section 19.0 “10-bit High-Speed

Analog-to-Digital Converter (ADC) Module”)

• Added Note 2 in Device Configuration Registers

table (Table 20-8)

• Operating Current (IDD) Specifications

(see Table 23-5)

• Updated FOSC register bit definition in Device

Configuration Registers table (Table 20-8)

• Power-Down Current (IPD)

(see Table 23-7)

• Electrical Specifications:

• I/O pin Input Specifications

(see Table 23-8)

- Updated values for parameters DO10, DO16,

DO20, and DO26 (see Table 23-9)

• BOR voltage limits

(see Table 23-10)

- 10-Bit High-Speed ADC tPDU timing parame-

ter (time to stabilize) has been updated from

20 µs typical to 20 µs maximum (see

Table 23-39)

• Watchdog Timer time-out limits

(see Table 23-20)

- Parameter OS65 (Internal RC Accuracy) has

been expanded to reflect multiple Min and

Max values for different temperatures (see

Table 23-18)

Revision C (September 2006)

Updates

made

to

Section 23.0

“Electrical

Characteristics”.

- Parameter DC12 (RAM Data Retention Volt-

age) has been updated to include a Min value

(see Table 23-4)

Revision D (January 2007)

This revision includes updates to the packaging

diagrams.

- Parameter D134 (Erase/Write Cycle Time)

has been updated to include Min and Max

values and the Typ value has been removed

(see Table 23-11)

- Removed parameters OS62 (Internal FRC

Jitter) and OS64 (Internal FRC Drift) and

Note 2 from AC Characteristics (see

Table 23-17)

- Parameter OS63 (Internal FRC Accuracy)

has been expanded to reflect multiple Min

and Max values for different temperatures

(see Table 23-17)

- Updated Min and Max values and Conditions

for parameter SY11 and updated Min, Typ,

and Max values and Conditions for

parameter SY20 (see Table 23-20)

• Additional minor corrections throughout the

document

DS70141E-page 213

dsPIC30F3010/3011

NOTES:

DS70141E-page 214

dsPIC30F3010/3011

INDEX

A

C

A/D

C Compilers

MPLAB C18.............................................................. 160

1 Msps Configuration Guideline................................ 130

600 ksps Configuration Guideline............................. 131

Conversion Rate Parameters.................................... 129

Selecting the Conversion Clock................................ 128

Voltage Reference Schematic .................................. 130

AC Characteristics ............................................................ 171

Load Conditions........................................................ 171

AC Temperature and Voltage Specifications.................... 171

ADC

750 ksps Configuration Guideline............................. 131

Conversion Speeds................................................... 129

Address Generator Units .................................................... 35

Alternate 16-Bit Timer/Counter ........................................... 89

Alternate Vector Table ........................................................ 45

Assembler

MPASM Assembler................................................... 160

Automatic Clock Stretch.................................................... 112

During 10-Bit Addressing (STREN = 1) .................... 112

During 7-Bit Addressing (STREN = 1) ...................... 112

Receive Mode........................................................... 112

Transmit Mode.......................................................... 112

MPLAB C30.............................................................. 160

Center-Aligned PWM.......................................................... 97

CLKOUT and I/O Timing

Characteristics.......................................................... 176

Requirements ........................................................... 176

Code Examples

Data EEPROM Block Erase ....................................... 54

Data EEPROM Block Write ........................................ 56

Data EEPROM Read.................................................. 53

Data EEPROM Word Erase ....................................... 54

Data EEPROM Word Write ........................................ 55

Erasing a Row of Program Memory ........................... 49

Initiating a Programming Sequence ........................... 50

Loading Write Latches................................................ 50

Code Protection................................................................ 137

Complementary PWM Operation........................................ 98

Configuring Analog Port Pins.............................................. 60

Control Registers................................................................ 48

NVMADR.................................................................... 48

NVMADRU ................................................................. 48

NVMCON.................................................................... 48

NVMKEY .................................................................... 48

Core Overview.................................................................... 15

Core Register Map.............................................................. 31

Customer Change Notification Service............................. 220

Customer Notification Service .......................................... 220

Customer Support............................................................. 220

B

Band Gap Start-up Time

Requirements............................................................ 178

Timing Characteristics .............................................. 178

Barrel Shifter ....................................................................... 22

Bit-Reversed Addressing .................................................... 38

Example...................................................................... 38

Implementation ........................................................... 38

Modifier Values (table)................................................ 39

Sequence Table (16-Entry)......................................... 39

Block Diagrams

D

Data Access from Program Memory Using

Program Space Visibility............................................. 26

Data Accumulators and Adder/Subtracter .......................... 20

Overflow and Saturation............................................. 20

Data Accumulators and Adder/Subtracter

Data Space Write Saturation...................................... 22

Round Logic ............................................................... 21

Write Back .................................................................. 21

Data Address Space........................................................... 27

Alignment.................................................................... 30

Alignment (Figure)...................................................... 30

Effect of Invalid Memory Accesses............................. 30

MCU and DSP (MAC Class)

Instructions Example .......................................... 29

Memory Map......................................................... 27, 28

Near Data Space........................................................ 31

Software Stack ........................................................... 31

Spaces........................................................................ 30

Width .......................................................................... 30

Data EEPROM Memory...................................................... 53

Erasing ....................................................................... 54

Erasing, Block............................................................. 54

Erasing, Word............................................................. 54

Protection Against Spurious Write.............................. 57

Reading ...................................................................... 53

Write Verify................................................................. 57

Writing ........................................................................ 55

Writing, Block.............................................................. 56

Writing, Word.............................................................. 55

10-Bit High-Speed ADC Functional .......................... 126

16-Bit Timer1 Module.................................................. 66

16-Bit Timer4 .............................................................. 76

16-Bit Timer5 .............................................................. 77

32-Bit Timer4/5 ........................................................... 75

Dedicated Port Structure............................................. 59

DSP Engine ................................................................ 19

dsPIC30F3010.............................................................. 9

dsPIC30F3011.............................................................. 8

External Power-on Reset Circuit............................... 145

2

I C............................................................................. 110

Input Capture Mode .................................................... 79

Oscillator System...................................................... 139

Output Compare Mode ............................................... 83

PWM Module .............................................................. 94

Quadrature Encoder Interface .................................... 87

Reset System............................................................ 143

Shared Port Structure ................................................. 60

SPI ............................................................................ 106

SPI Master/Slave Connection................................... 106

UART Receiver......................................................... 118

UART Transmitter..................................................... 117

BOR Characteristics ......................................................... 170

BOR. See Brown-out Reset.

Brown-out Reset

Timing Requirements................................................ 177

Brown-out Reset (BOR).................................................... 137

DS70141E-page 215

dsPIC30F3010/3011

2

DC Characteristics ............................................................163

BOR ..........................................................................170

Brown-out Reset .......................................................169

I/O Pin Output Specifications....................................169

Idle Current (IIDLE) ....................................................166

Operating Current (IDD).............................................165

Power-Down Current (IPD) ........................................167

Program and EEPROM.............................................170

Temperature and Voltage Specifications..................163

Dead-Time Generators .......................................................98

Ranges........................................................................98

Development Support .......................................................159

Device Configuration

Register Map.............................................................150

Device Configuration Registers.........................................148

FBORPOR ................................................................148

FGS...........................................................................148

FOSC ........................................................................148

FWDT........................................................................148

Device Overview ...................................................................7

Divide Support.....................................................................18

DSP Engine.........................................................................18

Multiplier......................................................................20

dsPIC30F3010 PORT Register Map...................................61

dsPIC30F3011 PORT Register Map...................................62

Dual Output Compare Match Mode ....................................84

Continuous Pulse Mode..............................................84

Single Pulse Mode ......................................................84

I C 10-Bit Slave Mode Operation ..................................... 111

Reception ................................................................. 112

Transmission ............................................................ 112

2

I C 7-Bit Slave Mode Operation ....................................... 111

Reception ................................................................. 111

Transmission ............................................................ 111

2

I C Master Mode

Baud Rate Generator ............................................... 114

Clock Arbitration ....................................................... 114

Multi-Master Communication, Bus Collision

and Bus Arbitration........................................... 114

Reception ................................................................. 114

Transmission ............................................................ 113

2

I C Module

Addresses................................................................. 111

Bus Data Timing Characteristics

Master Mode..................................................... 192

Slave Mode....................................................... 194

Bus Data Timing Requirements

Master Mode..................................................... 193

Slave Mode....................................................... 194

Bus Start/Stop Bits Timing Characteristics

Master Mode..................................................... 192

Slave Mode....................................................... 194

General Call Address Support.................................. 113

Interrupts .................................................................. 113

IPMI Support............................................................. 113

Master Operation...................................................... 113

Master Support ......................................................... 113

Operating Function Description ................................ 109

Operation During CPU Sleep and Idle Modes.......... 114

Pin Configuration ...................................................... 109

Programmer’s Model ................................................ 109

Register Map ............................................................ 115

Registers .................................................................. 109

Slope Control............................................................ 113

Software Controlled Clock Stretching

E

Edge-Aligned PWM.............................................................97

Electrical Characteristics...................................................163

AC .............................................................................171

DC.............................................................................163

Equations

A/D Conversion Clock...............................................128

Baud Rate.................................................................121

PWM Period................................................................96

PWM Resolution .........................................................96

Serial Clock Rate ......................................................114

Errata ....................................................................................6

Exception Processing

(STREN = 1)..................................................... 112

Various Modes.......................................................... 109

Idle Current (IIDLE) ............................................................ 166

In-Circuit Serial Programming (ICSP)............................... 137

Independent PWM Output ................................................ 100

Initialization Condition for RCON

Interrupt Priority ..........................................................42

Exception Sequence

Trap Sources ..............................................................43

External Clock Timing Characteristics

Register Case 1........................................................ 146

Initialization Condition for RCON

Register Case 2........................................................ 146

Input Capture (CAPx) Timing Characteristics................... 182

Input Capture Interrupts...................................................... 81

Register Map .............................................................. 82

Input Capture Module ......................................................... 79

In CPU Sleep Mode.................................................... 80

Simple Capture Event Mode....................................... 80

Input Capture Timing Requirements................................. 182

Input Change Notification Module....................................... 63

Register Map (Bits 7-0)............................................... 63

Instruction Addressing Modes ............................................ 35

File Register Instructions ............................................ 35

Fundamental Modes Supported ................................. 35

MAC Instructions ........................................................ 36

MCU Instructions ........................................................ 35

Move and Accumulator Instructions............................ 36

Other Instructions ....................................................... 36

Instruction Set Overview................................................... 154

Instruction Set Summary .................................................. 151

Internal Clock Timing Examples ....................................... 174

Timer1, 2, 3, 4, 5.......................................................179

External Clock Timing Requirements................................172

Timer1.......................................................................179

Timer2 and Timer 4...................................................180

Timer3 and Timer5....................................................180

External Interrupt Requests ................................................45

F

Fast Context Saving............................................................45

Flash Program Memory.......................................................47

In-Circuit Serial Programming (ICSP).........................47

Run-Time Self-Programming (RTSP) .........................47

Table Instruction Operation Summary ........................47

I

I/O Pin Specifications

Output .......................................................................169

I/O Ports..............................................................................59

Parallel I/O (PIO).........................................................59

DS70141E-page 216

dsPIC30F3010/3011

Internet Address................................................................ 220

Interrupt Controller

Register Map............................................................... 46

Interrupt Priority

Traps........................................................................... 43

Interrupt Sequence ............................................................. 45

Interrupt Stack Frame ................................................. 45

Interrupts............................................................................. 41

Pinout Descriptions

dsPIC30F3010............................................................ 12

dsPIC30F3011............................................................ 10

PLL Clock Timing Specifications ...................................... 173

POR. See Power-on Reset.

Port Write/Read Example ................................................... 60

Position Measurement Mode.............................................. 89

Power-Down Current (IPD)................................................ 167

Power-on Reset (POR)..................................................... 137

Oscillator Start-up Timer (OST)................................ 137

Power-up Timer (PWRT).......................................... 137

Power-Saving Modes........................................................ 147

Idle............................................................................ 148

Sleep ........................................................................ 147

Power-Saving Modes (Sleep and Idle)............................. 137

Power-up Timer

Timing Characteristics.............................................. 177

Timing Requirements ............................................... 177

Program Address Space..................................................... 23

Construction ............................................................... 24

Data Access From Program Memory

L

Load Conditions................................................................ 171

M

Memory Organization.......................................................... 23

Microchip Internet Web Site.............................................. 220

Modulo Addressing ............................................................. 36

Applicability................................................................. 38

Operation Example ..................................................... 37

Start and End Address................................................ 37

W Address Register Selection .................................... 37

Motor Control PWM Module................................................ 93

Fault Timing Characteristics ..................................... 184

Timing Characteristics .............................................. 184

Timing Requirements................................................ 184

MPLAB ASM30 Assembler, Linker, Librarian ................... 160

MPLAB ICD 2 In-Circuit Debugger ................................... 161

MPLAB ICE 2000 High-Performance

Universal In-Circuit Emulator .................................... 161

MPLAB Integrated Development

Environment Software............................................... 159

MPLAB PM3 Device Programmer .................................... 161

MPLAB REAL ICE In-Circuit Emulator System................. 161

MPLINK Object Linker/MPLIB Object Librarian ................ 160

Using Table Instructions..................................... 25

Data Access from, Address Generation ..................... 24

Memory Map............................................................... 23

Table Instructions

TBLRDH ............................................................. 25

TBLRDL.............................................................. 25

TBLWTH............................................................. 25

TBLWTL ............................................................. 25

Program and EEPROM Characteristics............................ 170

Program Counter................................................................ 16

Program Data Table Access............................................... 26

Program Space Visibility

Window into Program Space Operation ..................... 27

Programmable .................................................................. 137

Programmable Digital Noise Filters .................................... 89

Programmer’s Model .......................................................... 16

Diagram...................................................................... 17

Programming Operations.................................................... 49

Algorithm for Program Flash....................................... 49

Erasing a Row of Program Memory ........................... 49

Initiating the Programming Sequence ........................ 50

Loading Write Latches................................................ 50

PWM

Register Map ............................................................ 103

PWM Duty Cycle Comparison Units................................... 97

Duty Cycle Register Buffers ....................................... 97

PWM Fault Pins................................................................ 101

Enable Bits ............................................................... 101

Fault States .............................................................. 101

Modes....................................................................... 101

Cycle-by-Cycle ................................................. 101

Latched............................................................. 101

PWM Operation During CPU Idle Mode ........................... 102

PWM Operation During CPU Sleep Mode........................ 102

PWM Output and Polarity Control..................................... 101

Output Pin Control.................................................... 101

PWM Output Override ...................................................... 100

Complementary Output Mode .................................. 100

Synchronization........................................................ 100

PWM Period........................................................................ 96

PWM Special Event Trigger.............................................. 102

Postscaler................................................................. 102

O

OCx/PWM Module Timing Characteristics........................ 183

Operating Current (IDD)..................................................... 165

Oscillator

Operating Modes (Table).......................................... 138

Oscillator Configurations................................................... 140

Fail-Safe Clock Monitor............................................. 142

Fast RC (FRC).......................................................... 141

Initial Clock Source Selection ................................... 140

Low-Power RC (LPRC)............................................. 141

LP Oscillator Control................................................. 141

Phase Locked Loop (PLL) ........................................ 141

Start-up Timer (OST) ................................................ 140

Oscillator Selection ........................................................... 137

Oscillator Start-up Timer

Timing Characteristics .............................................. 177

Timing Requirements................................................ 177

Output Compare Interrupts ................................................. 85

Output Compare Mode

Register Map............................................................... 86

Output Compare Module..................................................... 83

Timing Characteristics .............................................. 182

Timing Requirements................................................ 182

Output Compare Operation During

CPU Idle Mode............................................................ 85

Output Compare Sleep Mode Operation ............................ 85

P

Packaging ......................................................................... 201

Details....................................................................... 203

Marking ..................................................................... 201

PICSTART Plus Development Programmer ..................... 162

DS70141E-page 217

dsPIC30F3010/3011

PWM Time Base .................................................................95

Continuous Up/Down Count Modes............................95

Double-Update Mode..................................................96

Free-Running Mode ....................................................95

Postscaler ...................................................................96

Prescaler.....................................................................96

Single-Shot Mode .......................................................95

PWM Update Lockout .......................................................102

Timing Requirements

Master Mode (CKE = 0).................................... 187

Master Mode (CKE = 1).................................... 188

Slave Mode (CKE = 0)...................................... 189

Slave Mode (CKE = 1)...................................... 191

Word and Byte Communication................................ 105

SPI Operation During CPU Idle Mode .............................. 107

SPI Operation During CPU Sleep Mode........................... 107

STATUS Register ............................................................... 16

Symbols Used in Opcode Descriptions ............................ 152

System Integration............................................................ 137

Overview................................................................... 137

Register Map ............................................................ 150

Q

QEA/QEB Input Characteristics ........................................185

QEI Module

External Clock Timing Requirements........................181

Index Pulse Timing Characteristics...........................186

Index Pulse Timing Requirements ............................186

Operation During CPU Idle Mode ...............................90

Operation During CPU Sleep Mode............................89

Register Map...............................................................91

Timer Operation During CPU Idle Mode .....................90

Timer Operation During CPU Sleep Mode..................89

Quadrature Decoder Timing Requirements ......................185

Quadrature Encoder Interface (QEI) Module ......................87

Quadrature Encoder Interface Interrupts ............................90

Quadrature Encoder Interface Logic...................................88

T

Temperature and Voltage Specifications

AC............................................................................. 171

DC ............................................................................ 163

Timer1 Module.................................................................... 65

16-Bit Asynchronous Counter Mode........................... 65

16-Bit Synchronous Counter Mode............................. 65

16-Bit Timer Mode ...................................................... 65

Gate Operation ........................................................... 66

Interrupt ...................................................................... 67

Operation During Sleep Mode .................................... 66

Prescaler .................................................................... 66

Real-Time Clock ......................................................... 67

RTC Interrupts.................................................... 67

RTC Oscillator Operation ................................... 67

Register Map .............................................................. 68

Timer2 and Timer3 Selection Mode.................................... 84

Timer2/3 Module................................................................. 69

32-Bit Synchronous Counter Mode............................. 69

32-Bit Timer Mode ...................................................... 69

ADC Event Trigger...................................................... 72

Gate Operation ........................................................... 72

Interrupt ...................................................................... 72

Operation During Sleep Mode .................................... 72

Register Map .............................................................. 73

Timer Prescaler .......................................................... 72

Timer4/5 Module................................................................. 75

Register Map .............................................................. 78

TimerQ (QEI Module) External Clock

R

Reader Response .............................................................221

Reset......................................................................... 137, 143

Reset Sequence..................................................................43

Reset Sources ............................................................43

Reset Timing Characteristics ............................................177

Reset Timing Requirements..............................................177

Resets

BOR, Programmable.................................................145

POR ..........................................................................143

POR with Long Crystal Start-up Time.......................145

POR, Operating without FSCM and PWRT ..............145

Revision History ................................................................213

S

Simple Capture Event Mode

Capture Buffer Operation............................................80

Capture Prescaler.......................................................80

Hall Sensor Mode .......................................................80

Input Capture in CPU Idle Mode .................................81

Timer2 and Timer3 Selection Mode............................80

Simple OCx/PWM Mode Timing Requirements................183

Simple Output Compare Match Mode.................................84

Simple PWM Mode .............................................................84

Input Pin Fault Protection............................................84

Period..........................................................................85

Single Pulse PWM Operation............................................100

Software Simulator (MPLAB SIM).....................................160

Software Stack Pointer, Frame Pointer...............................16

CALL Stack Frame......................................................31

SPI Mode

Slave Select Synchronization ...................................107

SPI1 Register Map....................................................108

SPI Module........................................................................105

Framed SPI Support .................................................106

Operating Function Description ................................105

SDOx Disable ...........................................................105

Timing Characteristics

Timing Characteristics.............................................. 181

Timing Characteristics

SPI Module

Slave Mode (CKE = 0)...................................... 189

Timing Diagrams

A/D Conversion

10-Bit High-speed (CHPS = 01,

SIMSAM = 0, ASAM = 1, SSRC = 111,

SAMC = 00001)........................................ 199

ADC Conversion

10-Bit High-speed (CHPS = 01,

SIMSAM = 0, ASAM = 0,

SSRC = 000) ............................................ 198

Band Gap Start-up Time........................................... 178

Center Aligned PWM .................................................. 97

CLKOUT and I/O ...................................................... 176

Dead Time .................................................................. 99

Edge-Aligned PWM .................................................... 97

External Clock........................................................... 171

2

I C Bus Data

Master Mode (CKE = 0)....................................187

Master Mode (CKE = 1)....................................188

Slave Mode (CKE = 1) .............................. 189, 190

Master Mode..................................................... 192

Slave Mode....................................................... 194

DS70141E-page 218

dsPIC30F3010/3011

2

I C Bus Start/Stop Bits

U

Master Mode..................................................... 192

Slave Mode....................................................... 194

Input Capture (CAPx)................................................ 182

Motor Control PWM Module...................................... 184

Motor Control PWM Module Fault............................. 184

OCx/PWM Module .................................................... 183

Oscillator Start-up Timer........................................... 177

Output Compare Module........................................... 182

PWM Output ............................................................... 85

QEA/QEB Inputs....................................................... 185

QEI Module Index Pulse ........................................... 186

Reset......................................................................... 177

SPI Module

Master Mode (CKE = 0).................................... 187

Master Mode (CKE = 1).................................... 188

Slave Mode (CKE = 1)...................................... 190

Time-out Sequence on Power-up

(MCLR Not Tied to VDD), Case 1...................... 144

Time-out Sequence on Power-up

UART

Address Detect Mode............................................... 121

Auto Baud Support ................................................... 122

Baud Rate Generator ............................................... 121

Enabling and Setting Up UART................................ 119

Alternate I/O ..................................................... 119

Disabling........................................................... 119

Enabling ........................................................... 119

Setting Up Data, Parity and

Stop Bit Selections ................................... 119

Loopback Mode........................................................ 121

Module Overview...................................................... 117

Operation During CPU Sleep and Idle Modes.......... 122

Receiving Data ......................................................... 120

In 8-Bit or 9-Bit Data Mode............................... 120

Interrupt ............................................................ 120

Receive Buffer (UxRXB)................................... 120

Reception Error Handling ......................................... 120

Framing Error (FERR) ...................................... 121

Idle Status ........................................................ 121

Parity Error (PERR).......................................... 121

Receive Break .................................................. 121

Receive Buffer Overrun Error

(MCLR Not Tied to VDD), Case 2...................... 144

Time-out Sequence on Power-up

(MCLR Tied to VDD).......................................... 144

Timer1, 2, 3, 4, 5 External Clock............................... 179

TimerQ (QEI Module) External Clock ....................... 181

Timing Diagrams and Specifications

(OERR Bit) ............................................... 120

Transmitting Data ..................................................... 119

In 8-Bit Data Mode............................................ 119

In 9-Bit Data Mode............................................ 119

Interrupt ............................................................ 120

Transmit Buffer (UxTXB) .................................. 119

UART1 Register Map ............................................... 123

UART2 Register Map ............................................... 123

Unit ID Locations .............................................................. 137

Universal Asynchronous Receiver

DC Characteristics - Internal

RC Accuracy..................................................... 174

Timing Diagrams.See Timing Characteristics.

Timing Requirements

A/D Conversion

10-Bit High-Speed ............................................ 200

Band Gap Start-up Time........................................... 178

Brown-out Reset ....................................................... 177

CLKOUT and I/O....................................................... 176

External Clock........................................................... 172

Transmitter Module (UART) ..................................... 117

2

I C Bus Data (Master Mode)..................................... 193

W

2

I C Bus Data (Slave Mode)....................................... 194

Wake-up from Sleep......................................................... 137

Wake-up from Sleep and Idle ............................................. 45

Watchdog Timer

Timing Characteristics.............................................. 177

Timing Requirements ............................................... 177

Watchdog Timer (WDT)............................................ 137, 147

Enabling and Disabling............................................. 147

Operation.................................................................. 147

WWW Address ................................................................. 220

WWW, On-Line Support ....................................................... 6

Input Capture ............................................................ 182

Motor Control PWM Module...................................... 184

Oscillator Start-up Timer........................................... 177

Output Compare Module........................................... 182

Power-up Timer ........................................................ 177

QEI Module

External Clock................................................... 181

Index Pulse ....................................................... 186

Quadrature Decoder ................................................. 185

Reset......................................................................... 177

Simple OCx/PWM Mode........................................... 183

SPI Module

Master Mode (CKE = 0).................................... 187

Master Mode (CKE = 1).................................... 188

Slave Mode (CKE = 0)...................................... 189

Slave Mode (CKE = 1)...................................... 191

Timer1 External Clock............................................... 179

Timer3 and Timer5 External Clock ........................... 180

Watchdog Timer........................................................ 177

Timing Specifications

PLL Clock.................................................................. 173

Trap Vectors ....................................................................... 44

DS70141E-page 219

dsPIC30F3010/3011

NOTES:

DS70141E-page 220

dsPIC30F3010/3011

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

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To register, access the Microchip web site at

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Notification and follow the registration instructions.

DS70141E-page 221

dsPIC30F3010/3011

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

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dsPIC30F3010/3011

DS70141E

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

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7. How would you improve this document?

DS70141E-page 222

dsPIC30F3010/3011

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

dsPIC30F3010AT-30I/PF-000

Custom ID (3 digits) or

Engineering Sample (ES)

Trademark

Architecture

Package

PT = TQFP 10x10

PT = TQFP 12x12

P

= DIP

Flash

SO = SOIC

SP = SPDIP

ML = QFN 6x6 or 8x8

Memory Size in Bytes

0 = ROMless

1 = 1K to 6K

2 = 7K to 12K

S

W

= Die (Waffle Pack)

= Die (Wafers)

3 = 13K to 24K

4 = 25K to 48K

5 = 49K to 96K

6 = 97K to 192K

7 = 193K to 384K

8 = 385K to 768K

9 = 769K and Up

Temperature

I = Industrial -40°C to +85°C

E = Extended High Temp -40°C to +125°C

Speed

20 = 20 MIPS

30 = 30 MIPS

Device ID

T = Tape and Reel

A,B,C… = Revision Level

Example:

dsPIC30F3010AT-30I/PT = 30 MIPS, Industrial temp., TQFP package, Rev. A

DS70141E-page 223

Worldwide Sales and Service

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EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

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Tel: 852-2401-1200

Fax: 852-2401-3431

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Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

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Web Address:

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Tel: 45-4450-2828

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Tel: 91-11-4160-8631

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Tel: 60-4-227-8870

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Farmington Hills, MI

Tel: 248-538-2250

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Tel: 86-21-5407-5533

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Philippines - Manila

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Fax: 63-2-634-9069

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

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Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

China - Shenzhen

Tel: 86-755-8203-2660

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Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

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Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

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China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

01/02/08

DS70141E-page 224


型号：	DSPIC30F3011-20I/ML
厂家：	MICROCHIP
描述：	16-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQCC44, 8 X 8 MM, PLASTIC, MO-220, QFN-44 控制器
文件：	总226页 (文件大小：2732K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DSPIC30F3011-20I/ML [MICROCHIP]

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