MCP2551I/P [MICROCHIP]
High-Speed CAN Transceiver; 高速CAN收发器
| 型号： | MCP2551I/P |
| 厂家： | 
MICROCHIP |
| 描述： | High-Speed CAN Transceiver |
| 文件： | 总20页 (文件大小：351K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP2551
M
High-Speed CAN Transceiver
Features
Package Types
• Supports 1 Mb/s operation
• Implements ISO-11898 standard physical layer
requirements
PDIP/SOIC
TXD
VSS
1
2
3
4
8
7
6
5
RS
• Suitable for 12V and 24V systems
• Externally-controlled slope for reduced RFI
emissions
• Detection of ground fault (permanent dominant)
on TXD input
• Power-on reset and voltage brown-out protection
CANH
VDD
RXD
CANL
VREF
• An unpowered node or brown-out event will not
disturb the CAN bus
• Low current standby operation
• Protection against damage due to short-circuit
conditions (positive or negative battery voltage)
• Protection against high-voltage transients
• Automatic thermal shutdown protection
• Up to 112 nodes can be connected
• High noise immunity due to differential bus
implementation
• Temperature ranges:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
Block Diagram
VDD
TXD
Thermal
Dominant
Detect
Shutdown
VDD
Driver
TXD
Control
Slope
Power-On
Reset
CANH
RS
RXD
VREF
Control
0.5 VDD
GND
CANL
Receiver
Reference
Voltage
VSS
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 1
MCP2551
NOTES:
DS21667C-page 2
Preliminary
2002 Microchip Technology Inc.
MCP2551
1.4
Operating Modes
1.0
DEVICE OVERVIEW
The RS pin allows three modes of operation to be
selected:
• High-Speed
• Slope-Control
• Standby
The MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN pro-
tocol controller and the physical bus. The MCP2551
provides differential transmit and receive capability for
the CAN protocol controller and is fully compatible with
the ISO-11898 standard, including 24V requirements. It
will operate at speeds of up to 1 Mb/s.
These modes are summarized in Table 1-1.
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a CAN
controller to signals suitable for transmission over the
bus cabling (differential output). It also provides a buffer
between the CAN controller and the high-voltage spikes
that can be generated on the CAN bus by outside
sources (EMI, ESD, electrical transients, etc.).
When in High-Speed or Slope-Control mode, the driv-
ers for the CANH and CANL signals are internally regu-
lated to provide controlled symmetry in order to
minimize EMI emissions.
Additionally, the slope of the signal transitions on
CANH and CANL can be controlled with a resistor con-
nected from pin 8 (RS) to ground, with the slope propor-
tional to the current output at RS, further reducing EMI
emissions.
1.1
Transmitter Function
The CAN bus has two states: Dominant and Reces-
sive. A dominant state occurs when the differential volt-
age between CANH and CANL is greater than a
defined voltage (e.g.,1.2V). A recessive state occurs
when the differential voltage is less than a defined volt-
age (typically 0V). The dominant and recessive states
correspond to the low and high state of the TXD input
pin, respectively. However, a dominant state initiated
by another CAN node will override a recessive state on
the CAN bus.
1.4.1
HIGH-SPEED
The High-Speed mode is selected by connecting the
RS pin to VSS. In this mode, the transmitter output driv-
ers have fast output rise and fall times to support high-
speed CAN bus rates.
1.4.2
SLOPE-CONTROL
Slope-Control mode further reduces EMI by limiting the
rise and fall times of CANH and CANL. The slope, or
slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The slope is proportional to the current output at the RS
pin. Since the current is primarily determined by the
slope-control resistance value REXT, a certain slew rate
is achieved by applying a respective resistance.
Figure 1-1 illustrates typical slew rate values as a
function of the slope-control resistance value.
1.1.1
MAXIMUM NUMBER OF NODES
The MCP2551 CAN outputs will drive a minimum load
of 45Ω, allowing a maximum of 112 nodes to be con-
nected (given a minimum differential input resistance of
20 kΩ and a nominal termination resistor value of
120Ω).
1.2
Receiver Function
1.4.3
STANDBY MODE
The RXD output pin reflects the differential bus voltage
between CANH and CANL. The low and high states of
the RXD output pin correspond to the Dominant and
Recessive states of the CAN bus, respectively.
The device may be placed in standby or “SLEEP” mode
by applying a high-level to RS. In SLEEP mode, the
transmitter is switched off and the receiver operates at
a lower current. The receive pin on the controller side
(RXD) is still functional but will operate at a slower rate.
The attached microcontroller can monitor RXD for CAN
bus activity and place the transceiver into normal oper-
ation via the RS pin (at higher bus rates the first CAN
message may be lost).
1.3
Internal Protection
CANH and CANL are protected against battery short-
circuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmitter output stage during such a fault condition.
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of 165°C. All other parts of the chip
remain operational and the chip temperature is lowered
due to the decreased power dissipation in the transmit-
ter outputs. This protection is essential to protect
against bus line short-circuit induced damage.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 3
MCP2551
TABLE 1-1:
MODES OF OPERATION
Mode
Current at R Pin
Resulting Voltage at RS Pin
s
Standby
Slope-Control
High-Speed
-IRS < 10 µA
10 µA < -IRS < 200 µA
-IRS < 610 µA
VRS > 0.75VDD
0.4VDD < VRS < 0.6VDD
0 < VRS < 0.3VDD
TABLE 1-2:
TRANSCEIVER TRUTH TABLE
( 1)
( 1)
VDD
VRS
TXD
CANH
CANL
Bus State
RXD
4.5V ≤ VDD ≤ 5.5V
VRS < 0.75VDD
0
HIGH
LOW
Dominant
Recessive
0
1
1
0
1
1
X
1 or floating
Not Driven
Not Driven
HIGH
Not Driven
Not Driven
LOW
VRS > 0.75VDD
VRS < 0.75VDD
X
0
Recessive
VPOR < VDD < 4.5V
Dominant
(See Note 3)
1 or floating
Not Driven
Not Driven
Not Driven/
No Load
Not Driven
Not Driven
Not Driven/
No Load
Recessive
VRS > 0.75VDD
X
X
X
Recessive
0 < VDD < VPOR
High Impedance
Note 1: If another bus node is transmitting a dominant bit on the CAN bus, then RXD is a logic 0.
2: X = “don’t care”.
3: Device drivers will function, although outputs are not guaranteed to meet the ISO-11898 specification.
FIGURE 1-1:
SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE
25
20
15
10
5
0
10 20 30 40 49 60 70 76 90 100 110 120
Resistance (kΩ)
DS21667C-page 4
Preliminary
2002 Microchip Technology Inc.
MCP2551
1.7.2
GROUND SUPPLY (VSS)
1.5
TXD Permanent Dominant
Detection
Ground supply pin.
If the MCP2551 detects an extended low state on the
TXD input, it will disable the CANH and CANL output
drivers in order to prevent the corruption of data on the
CAN bus. The drivers are disabled if TXD is low for
more than 1.25 ms (minimum). This implies a maxi-
mum bit time of 62.5 µs (16 kb/s bus rate) allowing up
to 20 consecutive transmitted dominant bits during a
multiple bit error and error frame scenario. The drivers
remain disabled as long as TXD remains low. A rising
edge on TXD will reset the timer logic and enable the
CANH and CANL output drivers.
1.7.3
SUPPLY VOLTAGE (VDD)
Positive supply voltage pin.
1.7.4
RECEIVER DATA OUTPUT (RXD)
RXD is a CMOS-compatible output that drives high or
low depending upon the differential signals on the
CANH and CANL pins and is usually connected to the
receiver data input of the CAN controller device. RXD
is high when the CAN bus is recessive and low in the
dominant state.
1.6
Power-on Reset
1.7.5
REFERENCE VOLTAGE (VREF)
When the device is powered on, CANH and CANL
remain in a high-impedance state until VDD reaches the
voltage level VPORH. In addition, CANH and CANL will
remain in a high-impedance state if TXD is low when
VDD reaches VPORH. CANH and CANL will become
active only after TXD is asserted high. Once powered
on, CANH and CANL will enter a high-impedance state
if the voltage level at VDD falls below VPORL, providing
voltage brown-out protection during normal operation.
Reference Voltage Output (Defined as VDD/2).
1.7.6
CAN LOW (CANL)
The CANL output drives the low side of the CAN differ-
ential bus. This pin is also tied internally to the receive
input comparator.
1.7.7
CAN HIGH (CANH)
The CANH output drives the high side of the CAN dif-
ferential bus. This pin is also tied internally to the
receive input comparator.
1.7
Pin Descriptions
The 8-pin pinout is listed in Table 1-3.
1.7.8
SLOPE RESISTOR INPUT (RS)
TABLE 1-3:
MCP2551 PINOUT
The RS pin is used to select High-Speed, Slope-Control
or Standby modes via an external biasing resistor.
Pin
Pin
Pin Function
Number
Name
1
2
3
4
5
6
7
8
TXD
VSS
VDD
RXD
VREF
Transmit Data Input
Ground
Supply Voltage
Receive Data Output
Reference Output Voltage
CANL CAN Low-Level Voltage I/O
CANH CAN High-Level Voltage I/O
RS
Slope-Control Input
1.7.1
TRANSMITTER DATA INPUT (TXD)
TXD is a TTL compatible input pin. The data on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data out-
put of the CAN controller device. When TXD is low,
CANH and CANL are in the dominant state. When TXD
is high, CANH and CANL are in the recessive state,
provided that another CAN node is not driving the CAN
bus with a dominant state. TXD has an internal pull-up
resistor (nominal 25 kΩ to VDD).
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 5
MCP2551
2.1.5
DIFFERENTIAL VOLTAGE, VDIFF
(OF CAN BUS)
2.0
ELECTRICAL
CHARACTERISTICS
Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH - VCANL.
2.1
Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.1.6
INTERNAL CAPACITANCE, CIN (OF
A CAN NODE)
Capacitance seen between CANL (or CANH) and
ground during the recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
2.1.1
BUS VOLTAGE
VCANL and VCANH, denoting the voltages of the bus line
wires, CANL and CANH, relative to ground of each
individual CAN node.
2.1.7
INTERNAL RESISTANCE, RIN (OF A
CAN NODE)
Resistance seen between CANL (or CANH) and
ground during the recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
2.1.2
COMMON MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANL and VCANH with
respect to ground, for which proper operation will occur,
if up to the maximum number of CAN nodes are
connected to the bus.
FIGURE 2-1:
PHYSICAL LAYER
DEFINITIONS
ECU
2.1.3
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF (OF A CAN
NODE)
RIN
RIN
CANL
Capacitance seen between CANL and CANH during
the recessive state when the CAN node is
disconnected from the bus (see Figure 2-1).
CDIFF
RDIFF
CIN
CANH
CIN
2.1.4
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF (OF A CAN
NODE)
GROUND
Resistance seen between CANL and CANH during the
recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).
DS21667C-page 6
Preliminary
2002 Microchip Technology Inc.
MCP2551
Absolute Maximum Ratings†
VDD.............................................................................................................................................................................7.0V
DC Voltage at TXD, RXD, VREF and VS.............................................................................................-0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1).......................................................................................................... -42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2)............................................................................................. -250V to +250V
Storage temperature ...............................................................................................................................-55°C to +150°C
Operating ambient temperature ..............................................................................................................-40°C to +125°C
Virtual Junction Temperature, TVJ (Note 3) ............................................................................................-40°C to +150°C
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
ESD protection on CANH and CANL pins (Note 4) ................................................................................................... 6 kV
ESD protection on all other pins (Note 4) .................................................................................................................. 4 kV
Note 1: Short-circuit applied when TXD is high and low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 7
MCP2551
2.2
DC Characteristics
Electrical Characteristics:
DC Specifications
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
Supply:
D1
IDD
Supply Current
—
—
75
10
mA Dominant; VTXD = 0.8V; VDD
D2
mA Recessive; VTXD = +2V;
RS = 47 kΩ
D3
—
—
365
465
4.3
4.0
0.8
µA -40°C ≤ TAMB ≤ +85°C,
Standby; (Note 2)
µA -40°C ≤ TAMB ≤ +125°C,
Standby; (Note 2)
D4
D5
D6
VPORH
VPORL
VPORD
High-level of the power-on reset
comparator
Low-level of the power-on reset
comparator
Hysteresis of power-on reset
comparator
3.8
3.4
0.3
V
V
V
CANH, CANL outputs are
active when VDD > VPORH
CANH, CANL outputs are not
active when VDD < VPORL
Note 1
Bus Line (CANH; CANL) Transmitter:
D7
D8
D9
VCANH(r);VCANL
CANH, CANL Recessive bus
2.0
-2
3.0
+2
V
VTXD = VDD; no load.
(r)
voltage
IO(CANH)(reces) Recessive output current
IO(CANL)(reces)
mA -2V < V(CAHL,CANH) < +7V,
0V <VDD < 5.5V
mA -5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V
-10
+10
D10
D11
D12
VO(CANH)
VO(CANL)
VDIFF(r)(o)
CANH dominant output voltage
CANL dominant output voltage
Recessive differential output
voltage
2.75
0.5
-500
4.5
2.25
+50
V
V
VTXD = 0.8V
VTXD = 0.8V
mV VTXD = 2V; no load
D13
VDIFF(d)(o)
Dominant differential output
voltage
1.5
3.0
V
VTXD = 0.8V; VDD = 5V
40 Ω < RL < 60 Ω (Note 2)
D14
D15
IO(SC)(CANH)
CANH short-circuit output
current
—
—
-200
-100
(typical)
mA VCANH = -5V
mA VCANH = -40V, +40V. (Note 1)
D16
IO(SC)(CANL)l
CANL short circuit output current
—
200
mA VCANL = -40V, +40V. (Note 1)
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D17
VDIFF(r)(i)
Recessive differential input
-1.0
-1.0
0.9
+0.5
+0.4
5.0
V
V
V
V
-2V < V(CANL, CANH) < +7V
voltage
(Note 3)
-12V < V(CANL, CANH) < +12V
(Note 3)
-2V < V(CANL, CANH) < +7V
(Note 3)
-12V < V(CANL, CANH) < +12V
(Note 3)
D18
VDIFF(d)(i)
Dominant differential input
voltage
1.0
5.0
D19
D20
VDIFF(h)(i)
RIN
Differential input hysteresis
CANH, CANL common-mode
input resistance
100
5
200
50
mV see Figure 2-4. (Note 1)
kΩ
D21
RIN(d)
Deviation between CANH and
CANL common-mode input
resistance
-3
+3
%
VCANH = VCANL
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD
.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.
DS21667C-page 8
Preliminary
2002 Microchip Technology Inc.
MCP2551
2.2
DC Characteristics (Continued)
Electrical Characteristics:
DC Specifications (Continued)
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22
D24
RDIFF
ILI
Differential input resistance
CANH, CANL input leakage
current
20
—
100
150
kΩ
µA
VDD < VPOR;
VCANH = VCANL = +5V
Transmitter Data Input (TXD):
D25
D26
D27
D28
VIH
VIL
IIH
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
2.0
—
-1
—
+0.8
+1
V
V
µA
µA
Output recessive
Output dominant
VTXD = VDD
IIL
-100
-400
VTXD = 0V
Receiver Data Output (RXD):
D31
D32
VOH
VOL
High-level output voltage
Low-level output voltage
0.7
—
—
0.8
V
V
IOH = 8 mA
IOL = 8 mA
Voltage Reference Output (VREF):
D33 Reference output voltage
Standby/Slope-Control (RS pin):
VREF
0.45 VDD
0.55 VDD
V
-50 µA < IVREF < 50 µA
D34
D35
D36
VSTB
ISLOPE
VSLOPE
Input voltage for standby mode
Slope-control mode current
Slope-control mode voltage
0.75 VDD
-10
0.4 VDD
—
-200
0.6 VDD
V
µA
V
Thermal Shutdown:
Note 1
(sd)
TJ
oC
oC
D37
TJ
Shutdown junction temperature
155
20
180
30
D38
Shutdown temperature
hysteresis
-12V < V(CANL, CANH) < +12V
(Note 3)
(h)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD
.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.
FIGURE 2-2:
TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
0.1µF
V
DD
CANH
TXD
VREF
CAN
60 Ω
100 pF
Transceiver
RXD
CANL
30 pF
RS
GND
Rext
Note:
RS may be connected to VDD or GND via a load resistor depending on desired operating mode
as described in Section 1.7.8, “Slope Resistor Input”.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 9
MCP2551
FIGURE 2-3:
TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
500 pF
CANH
TXD
VREF
RXD
Schaffner
Generator
CAN
60Ω
Transceiver
CANL
RS
Rext
500 pF
GND
Note:
RS may be connected to VDD or
GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8
The wave forms of the applied transients shall be in accordance with “ISO-7637, Part 1”, test pulses 1, 2, 3a and 3b.
FIGURE 2-4:
HYSTERESIS OF THE RECEIVER
RXD (receive data
output voltage)
VOH
VOL
VDIFF (r)(i)
VDIFF (d)(i)
hysteresis
D19
0.5
0.9
VDIFF (V)
DS21667C-page 10
Preliminary
2002 Microchip Technology Inc.
MCP2551
2.3
AC Characteristics
Electrical Characteristics:
AC Specifications
Industrial (I): TAMB = -40°C to +85°CVDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°CVDD = 4.5V to 5.5V
Param
Sym
No.
Characteristic
Bit time
Min
Max
Units
Conditions
1
2
3
tBIT
fBIT
1
16
—
62.5
1000
70
µs
kHz
ns
VRS = 0V
VRS = 0V
Bit frequency
TtxL2bus(d) Delay TXD to bus active
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
4
5
6
TtxH2bus(r) Delay TXD to bus inactive
—
—
125
170
130
250
175
225
235
400
8.5
ns
ns
ns
ns
ns
ns
ns
ns
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
TtxL2rx(d)
TtxH2rx(r)
Delay TXD to receive active
—
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
Delay TXD to receiver
inactive
—
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
—
-40°C ≤ TAMB ≤ +85°C,
RS = 47 kΩ
—
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
7
SR
CANH, CANL slew rate
5.5
—
V/µs Refer to Figure 1-1;
RS = 47 kΩ, (Note 1)
see Figure 2-6
10
11
12
13
14
15
tWAKE
Wake-up time from standby
(Rs pin)
5
µs
ns
TbusD2rx(s) Bus dominant to RXD Low
—
550
VRS = +4V; (see Figure 2-7)
(standby mode)
CIN(CANH)
CIN(CANL)
CANH; CANL input
capacitance
—
20
(typical)
pF
pF
ms
µs
1 Mbit/s data rate;
VTXD = VDD, (Note 1)
CDIFF
Differential input
—
10
1 Mbit/s data rate
capacitance
(typical)
(Note 1)
TtxL2busZ TX Permanent Dominant
Timer Disable Time
1.25
—
4
TtxR2pdt(res) TX Permanent Dominant
1
Rising edge on TXD while
device is in permanent
dominant state
Timer Reset Time
Note 1: This parameter is periodically sampled and not 100% tested.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 11
MCP2551
2.4
Timing Diagrams and Specifications
FIGURE 2-5:
TIMING DIAGRAM FOR AC CHARACTERISTICS
VDD
0V
TXD (transmit data
input voltage)
VDIFF (CANH,
CANL differential
voltage)
0.5V
0.9V
RXD (receive data
output voltage)
0.7 VDD
0.3 VDD
3
4
5
6
FIGURE 2-6:
TIMING DIAGRAM FOR WAKEUP FROM STANDBY
VRS Slope resistor
VDD
input voltage
0.6 VDD
0V
VRXD Receive data
output voltage
0.3 VDD
10
VTXD = 0.8V
FIGURE 2-7:
TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)
1.5V
0.9V
VDIFF, Differential
voltage
0V
Receive data
output voltage
0.3 VDD
11
VRS = 4V; VTXD = 2V
DS21667C-page 12
Preliminary
2002 Microchip Technology Inc.
MCP2551
3.0
3.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
MCP2551
I/P256
0234
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
MCP2551
I/SN0234
NNN
256
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 13
MCP2551
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
L
c
B1
B
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
8
.100
.155
.130
2.54
3.94
3.30
.140
.170
.145
3.56
2.92
4.32
3.68
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21667C-page 14
Preliminary
2002 Microchip Technology Inc.
MCP2551
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
h
L
φ
Number of Pins
Pitch
Overall Height
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
Standoff
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 15
MCP2551
NOTES:
DS21667C-page 16
Preliminary
2002 Microchip Technology Inc.
MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Examples:
Temperature Package
Range
a)
b)
c)
d)
e)
MCP2551-I/P: Industrial temperature,
PDIP package.
MCP2551-E/P: Extended temperature,
PDIP package.
MCP2551-I/SN: Industrial temperature,
SOIC package.
MCP2551T-I/SN: Tape and Reel, Industrial
Temperature, SOIC package.
MCP2551T-E/SN:
Extended Temperature, SOIC package.
Device:
MCP2551= High-Speed CAN Transceiver
Temperature
Range:
I
=
=
-40°C to +85°C
-40°C to +125°C
E
Tape
and
Reel,
Package:
P
=
=
Plastic DIP (300 mil Body) 8-lead
Plastic SOIC (150 mil Body) 8-lead
SN
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
Preliminary
DS21667C-page 17
MCP2551
NOTES:
DS21667C-page 18
Preliminary
2002 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl-
edge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21667C - page 19
M
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
China - Beijing
Rocky Mountain
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Bei Hai Wan Tai Bldg.
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Atlanta
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Singapore
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Microchip Technology Singapore Pte Ltd.
200 Middle Road
Tel: 770-640-0034 Fax: 770-640-0307
China - Chengdu
#07-02 Prime Centre
Boston
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Singapore, 188980
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Ming Xing Financial Tower
Microchip Technology (Barbados) Inc.,
Taiwan Branch
No. 88 TIDU Street
Chicago
Chengdu 610016, China
333 Pierce Road, Suite 180
Itasca, IL 60143
11F-3, No. 207
Tel: 86-28-86766200 Fax: 86-28-86766599
Tung Hua North Road
Taipei, 105, Taiwan
China - Fuzhou
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
EUROPE
Austria
No. 71 Wusi Road
Tel: 972-818-7423 Fax: 972-818-2924
Fuzhou 350001, China
Microchip Technology Austria GmbH
Durisolstrasse 2
Detroit
Tel: 86-591-7503506 Fax: 86-591-7503521
Tri-Atria Office Building
China - Shanghai
A-4600 Wels
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
Los Angeles
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 15-16, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
18201 Von Karman, Suite 1090
Irvine, CA 92612
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Tel: 949-263-1888 Fax: 949-263-1338
San Jose
Shenzhen 518001, China
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 86-755-82350361 Fax: 86-755-82366086
Batiment A - ler Etage
China - Hong Kong SAR
91300 Massy, France
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Tel: 408-436-7950 Fax: 408-436-7955
Germany
Toronto
Microchip Technology GmbH
Steinheilstrasse 10
Kwai Fong, N.T., Hong Kong
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
Tel: 852-2401-1200 Fax: 852-2401-3431
D-85737 Ismaning, Germany
India
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Microchip Technology Inc.
India Liaison Office
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
11/15/02
DS21667C-page 20
2002 Microchip Technology Inc.
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