MCP73855IML [MICROCHIP]
USB Compatible Li-Ion/Li-Polymer Charge Management Controllers; USB兼容锂离子/锂聚合物充电管理控制器型号: | MCP73855IML |
厂家: | MICROCHIP |
描述: | USB Compatible Li-Ion/Li-Polymer Charge Management Controllers |
文件: | 总24页 (文件大小:353K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP73853/55
USB Compatible Li-Ion/Li-Polymer
Charge Management Controllers
Features
Description
• Linear Charge Management Controllers
- Integrated Pass Transistor
The MCP7385X devices are highly advanced linear
charge management controllers for use in space-
limited, cost-sensitive applications. The MCP73853
combines high-accuracy constant-voltage, constant-
current regulation, cell preconditioning, cell temperature
monitoring, advanced safety timers, automatic charge
termination, internal current sensing, reverse blocking
protection and charge status and fault indication in a
space-saving 16-lead, 4 x 4 QFN package.
- Integrated Current Sense
- Reverse Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
• Two Selectable Voltage Regulation Options:
- 4.1V, 4.2V
• Programmable Charge Current
• USB Compatible Charge Current Settings
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
The MCP73855 employs all the features of the
MCP73853, with the exception of the cell temperature
monitor and one status output. The MCP73855 is
offered in a space-saving 10-lead, 3 x 3 DFN package.
The MCP73853 and MCP73855 are designed
specifically for USB applications, adhering to all the
specifications governing the USB power bus.
• Optional Continuous Cell Temperature
Monitoring:
- MCP73853
The MCP7385X devices provide two selectable voltage
regulation options (4.1V or 4.2V) for use with either
coke or graphite anodes.
• Charge Status Output for Direct LED Drive
• Fault Output for Direct LED Drive
- MCP73853
The MCP7385X devices provide complete, fully-
functional, charge management solutions, operating
with an input voltage range of 4.5V to 5.5V.
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging:
The MCP7385X devices are fully specified over the
ambient temperature range of -40°C to +85°C.
- 16-Lead, 4x4 mm QFN (MCP73853)
- 10-Lead, 3x3 mm DFN (MCP73855)
Package Types
16-Pin QFN
Applications
16 15 14 13
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
• Cellular Telephones
VSET
VDD1
VDD2
VSS1
VBAT3
VBAT2
VBAT1
VSS3
1
2
3
4
12
11
10
9
MCP73853
• Hand-Held Instruments
• Cradle Chargers
5
6
7
8
• Digital Cameras
• MP3 Players
10-Pin DFN
• Bluetooth Headsets
• USB Chargers
1
10
EN
STAT1
VSET
2
3
4
5
9
8
7
6
VBAT2
VBAT1
VDD1
MCP73855
VSS2
VSS1
TIMER
PROG
2004 Microchip Technology Inc.
DS21915A-page 1
MCP73853/55
Typical Application
400 mA Lithium-Ion Battery Charger
3
2
8
9
5V
4.7 µF
V
V
V
V
DD1
BAT1
4.7 µF
SET
BAT2
10
1
EN
STAT1
+
–
Single
Lithium-Ion
Cell
6
TIMER
0.1 µF
5
4, 7
PROG
V
SS
MCP73855
Functional Block Diagram
Direction
Control
V
V
V
BAT1
DD1
V
V
BAT2
DD2
DD
G = 0.001
4 kΩ
V
REF
Charge Current
Control Amplifier
90
3 kΩ
kΩ
PROG
Voltage Control
Amplifier
+
+
–
11 kΩ
–
Charge
Termination
Comparator
V
REF
10 kΩ
V
REF
V
BAT3
110 kΩ
10 kΩ
+
–
Precondition
Charge_OK
Precon
600 kΩ
149 kΩ
I
/12
Precondition
Control
+
REG
Comp.
–
U
VLO
COMPARATOR
+
–
Constant-voltage/
Recharge Comp.
V
UVLO
+
–
1.58 kΩ
300 kΩ
EN
Power-On
Delay
V
REF
V
V
UVLO
Bias and
Reference
Generator
(1.2V)
V
REF
SET
10.3 kΩ
V
V
V
SS1
SS2
SS3
THREF
THERM
Temperature
Comparators
100 kΩ
STAT1
+
Drv Stat 1
Drv Stat 2
-
Charge Control,
50 kΩ
50 kΩ
Charge Timers,
and
I
/12
REG
STAT2
+
-
Status Logic
Oscillator
MCP73853 ONLY
MCP73853 ONLY
Charge_OK
TIMER
DS21915A-page 2
2004 Microchip Technology Inc.
MCP73853/55
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
V
...............................................................................6.5V
DD1,2
All Inputs and Outputs w.r.t. V ..............-0.3 to (V + 0.3)V
SS
DD
Maximum Junction Temperature, T ............Internally Limited
J
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5kW in Series with 100pF) ....≥ 4 kV
Machine Model (200pF, No Series Resistance) ..........400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Supply Input
Sym
Min
Typ
Max Units
Conditions
Supply Voltage
Supply Current
VDD
ISS
4.5
—
—
5.5
4
V
0.28
0.83
4.45
4.40
µA Disabled
mA Operating
—
4
UVLO Start Threshold
UVLO Stop Threshold
VSTART
VSTOP
4.25
4.20
4.65
4.55
V
V
VDD Low-to-High
VDD High-to-Low
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage
VREG
4.079
4.179
4.1
4.2
4.121
4.221
V
V
VSET = VSS
VSET = VDD
VDD = [VREG(Typ) + 1V],
I
OUT = 10 mA, TA = -5°C to +55°C
%/V VDD = [VREG(Typ) + 1V] to 5.5V
OUT = 10 mA
Line Regulation
|(∆VBAT
BAT)| /∆VDD
/
—
—
0.020
0.022
0.25
0.25
V
I
Load Regulation
|∆VBAT/VBAT
|
%
IOUT = 10 mA to 150 mA
VDD = [VREG(Typ) + 1V]
Supply Ripple Attenuation
PSRR
—
—
—
—
50
26
—
—
—
1
dB IOUT = 10 mA, 10 Hz to 1 kHz
dB IOUT = 10 mA, 10 Hz to 10 kHz
24
dB
µA
I
OUT = 10 mA, 10 Hz to 1 MHz
0.24
Output Reverse-Leakage
Current
I
VDD < VBAT = VREG(Typ)
DISCHARGE
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current
Regulation
IREG
70
85
100
475
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
325
400
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Regulation
IPREG
5
9
15
75
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
25
40
Precondition Threshold
Voltage
VPTH
2.70
2.75
2.80
2.85
2.90
2.95
V
V
VSET = VSS
VSET = VDD
VBAT Low-to-High
2004 Microchip Technology Inc.
DS21915A-page 3
MCP73853/55
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Sym
Min
Typ
Max Units
Conditions
Charge Termination
Charge Termination Current
ITERM
3.7
18
6.5
32
9.3
46
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
Automatic Recharge
Recharge Threshold Voltage
VRTH
VREG – VREG – VREG
–
V
VBAT High-to-Low
300mV 200mV 100mV
Thermistor Reference - MCP73853
Thermistor Reference
Output Voltage
VTHREF
2.475
200
—
2.55
—
2.625
—
V
TA = 25°C, VDD = VREG(Typ) + 1V,
ITHREF = 0 mA
Thermistor Reference
Source Current
ITHREF
µA
Thermistor Reference Line
Regulation
|(∆VTHREF
/
0.05
0.02
0.25
0.10
%/V VDD = [VREG (Typ) + 1V] to 5.5V
VTHREF)|/∆VDD
|∆V
/
%
Thermistor Reference Load
Regulation
ITHREF = 0 mA to 0.20 mA
THREF
V
THREF|
Thermistor Comparator - MCP73853
Upper Trip Threshold
Upper Trip Point Hysteresis
Lower Trip Threshold
Lower Trip Point Hysteresis
Input Bias Current
VT1
VT1HYS
VT2
1.18
—
1.25
-50
0.62
80
1.32
—
V
mV
V
0.59
—
0.66
—
VT2HYS
IBIAS
mV
µA
—
—
2
Status Indicator – STAT1, STAT2
Sink Current
ISINK
VOL
ILK
4
8
12
400
1
mA
Low Output Voltage
Input Leakage Current
Enable Input
—
—
200
0.01
mV ISINK = 1 mA
µA ISINK = 0 mA, VSTAT1,2 = 5.5V
Input High Voltage Level
Input Low Voltage Level
Input Leakage Current
Thermal Shutdown
Die Temperature
VIH
VIL
ILK
1.4
—
—
—
—
0.8
1
V
V
—
0.01
µA VENABLE = 5.5V
TSD
—
—
155
10
—
—
°C
°C
Die Temperature Hysteresis
TSDHYS
DS21915A-page 4
2004 Microchip Technology Inc.
MCP73853/55
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD Low-to-High
UVLO Start Delay
tSTART
—
—
5
ms
Current Regulation
Transition Time Out of
Preconditioning
tDELAY
tRISE
—
—
—
—
1
1
ms
ms
VBAT < VPTH to VBAT > VPTH
IOUT Rising to 90% of IREG
Current Rise Time Out of
Preconditioning
Fast Charge Safety Timer
Period
tFAST
1.1
1.5
1.9
Hours CTIMER = 0.1 µF
Minutes CTIMER = 0.1 µF
Hours CTIMER = 0.1 µF
Preconditioning Current Regulation
Preconditioning Charge
Safety Timer Period
tPRECON
45
60
3
75
Charge Termination
Elapsed Time Termination
Period
tTERM
2.2
3.8
Status Indicators
Status Output turn-off
Status Output turn-on
tOFF
tON
—
—
—
—
200
200
µs
µs
ISINK = 1 mA to 0 mA
ISINK = 0 mA to 1 mA
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5.
Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
TJ
TA
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
4-Layer JC51-7
Thermal Resistance, 16-L, 4mm x 4mm QFN
Thermal Resistance, 10-L, 3mm x 3mm DFN
θJA
—
—
37
51
—
—
°C/W Standard Board,
Natural Convection
4-Layer JC51-7
°C/W Standard Board,
Natural Convection
θJA
2004 Microchip Technology Inc.
DS21915A-page 5
MCP73853/55
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
VDD = 5.2 V
VSET = VDD
VDD = 5.2 V
0
50 100 150 200 250 300 350 400
0
50 100 150 200 250 300 350 400
IOUT (mA)
IOUT (mA)
FIGURE 2-1:
Battery Regulation Voltage
FIGURE 2-4:
Supply Current (ISS) vs.
(VBAT) vs. Charge Current (IOUT).
Charge Current (IOUT).
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
IOUT = 375 mA
VSET = VDD
IOUT = 375 mA
4.5
4.7
4.9
5.1
DD (V)
5.3
5.5
4.5
4.7
4.9
5.1
5.3
5.5
V
VDD (V)
FIGURE 2-2:
Battery Regulation Voltage
FIGURE 2-5:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
IOUT = 10 mA
VSET = VDD
IOUT = 10 mA
4.5
4.7
4.9
5.1
DD (V)
5.3
5.5
4.5
4.7
4.9
5.1
5.3
5.5
V
VDD (V)
FIGURE 2-3:
Battery Regulation Voltage
FIGURE 2-6:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
DS21915A-page 6
2004 Microchip Technology Inc.
MCP73853/55
2.0
TYPICAL PERFORMANCE CURVES (CONT)
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
VDD = VSS
VSET = VDD
IOUT = 10 mA
+85°C
+25°C
-40°C
2.0
2.4
2.8
3.2
3.6
4.0
4.4
VBAT (V)
TA (°C)
FIGURE 2-7:
Output Leakage Current
FIGURE 2-10:
Supply Current (ISS) vs.
(IDISCHARGE) vs. Battery Voltage (VBAT).
Ambient Temperature (TA).
2.575
4.250
4.230
4.210
4.190
4.170
4.150
MCP73853
SET = VDD
ITHREF = 100 µA
VSET = VDD
IOUT = 10 mA
V
2.565
2.555
2.545
2.535
2.525
4.5
4.7
4.9
5.1
5.3
5.5
VDD (V)
TA (°C)
FIGURE 2-8:
Thermistor Reference
FIGURE 2-11:
Battery Regulation Voltage
Voltage (VTHREF) vs. Supply Voltage (VDD).
(VBAT) vs. Ambient Temperature (TA).
2.575
2.575
MCP73853
SET = VDD
ITHREF = 100 µA
MCP73853
VSET = VDD
V
2.565
2.555
2.545
2.535
2.525
2.565
2.555
2.545
2.535
2.525
0
25
50
75 100 125 150 175 200
ITHREF (µA)
TA (°C)
FIGURE 2-9:
Thermistor Reference
FIGURE 2-12:
Thermistor Reference
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
Voltage (VTHREF) vs. Ambient Temperature (TA).
2004 Microchip Technology Inc.
DS21915A-page 7
MCP73853/55
2.0
TYPICAL PERFORMANCE CURVES (CONT)
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
FIGURE 2-13:
Line Transient Response.
FIGURE 2-16:
Line Transient Response.
FIGURE 2-14:
Load Transient Response.
FIGURE 2-17:
Load Transient Response.
0
0
-10
-20
-30
-40
-50
-60
-70
MCP73853
VDD = 5.2 V
VAC = 100 mVp-p
IOUT = 10 mA
-10
-20
-30
-40
-50
-60
-70
COUT = 10 µF, Ceramic
MCP73853
VDD = 5.2 V
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 10 µF, X7R, Ceramic
-80
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-15:
Power Supply Ripple
FIGURE 2-18:
Power Supply Ripple
Rejection.
Rejection.
DS21915A-page 8
2004 Microchip Technology Inc.
MCP73853/55
2.0
TYPICAL PERFORMANCE CURVES (CONT)
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA, and TA= +25°C.
500
400
300
200
100
0
300
295
290
285
280
275
270
265
260
255
250
VSET = VDD
VSET = VDD
RPROG = 1.6 kΩ
OPEN
4.8K
1.6K
536
0
TA (°C)
RPROG (Ω)
FIGURE 2-19:
Charge Current (IOUT) vs.
FIGURE 2-20:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
Ambient Temperature (TA).
2004 Microchip Technology Inc.
DS21915A-page 9
MCP73853/55
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP73853
PIN FUNCTION TABLE
MCP73855
Sym
Description
1
2
2
3
VSET
VDD1
Voltage Regulation Selection
Battery Management Input Supply
Battery Management Input Supply
Battery Management 0V Reference
Current Regulation Set
3
—
4
VDD2
4
VSS1
5
5
PROG
THREF
THERM
TIMER
VSS3
6
—
—
6
Cell Temperature Sensor Bias
Cell Temperature Sensor Input
Timer Set
7
8
9
—
8
Battery Management 0V Reference
Battery Charge Control Output
Battery Charge Control Output
Battery Voltage Sense
10
11
12
13
14
15
16
VBAT1
VBAT2
VBAT3
VSS2
9
—
7
Battery Management 0V Reference
Logic Enable
10
—
1
EN
STAT2
STAT1
Fault Status Output
Charge Status Output
3.1
Voltage Regulation Selection
(V
3.7
Timer Set (TIMER)
)
SET
Connect to VSS for 4.1V regulation voltage. Connect to
DD for 4.2V regulation voltage.
All safety timers are scaled by CTIMER/0.1 µF.
3.8
Battery Charge Control Output
(V , V
V
)
BAT2
BAT1
3.2
Battery Management Input Supply
(V , V
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 µF to ensure loop stability
when the battery is disconnected.
)
DD2
DD1
A supply voltage of [VREG(Typ) + 0.3V] to 5.5V is
recommended. Bypass to VSS with a minimum of
4.7 µF.
3.9
Battery Voltage Sense (V
)
BAT3
3.3
Battery Management 0V Reference
(V , V , V
Voltage sense input. Connect to positive terminal of
battery. A precision internal resistor divider regulates
)
SS3
SS1
SS2
the final voltage on this pin to VREG
.
Connect to negative terminal of battery.
3.10 Logic Enable (EN)
3.4
Current Regulation Set (PROG)
Input to force charge termination, initiate charge, clear
faults or disable automatic recharge.
Preconditioning, fast and termination currents are
scaled by placing a resistor from PROG to VSS
.
3.11 Fault Status Output (STAT2)
3.5
Cell Temperature Sensor Bias
(THREF)
Current-limited, open-drain drive for direct connection
to a LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
THREF is a voltage reference to bias external
thermistor for continuous cell temperature monitoring
and pre-qualification.
3.12 Charge Status Output (STAT1)
3.6
Cell Temperature Sensor Input
(THERM)
Current-limited, open-drain drive for direct connection
to a LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
Input for an external thermistor for continuous cell-
temperature monitoring and prequalification. Connect
to THREF/3 to disable temperature sensing.
DS21915A-page 10
2004 Microchip Technology Inc.
MCP73853/55
With VSET tied to VSS, the MCP7385X devices regulate
to 4.1V. With VSET tied to VDD, the MCP7385X devices
regulate to 4.2V.
4.0
DEVICE OVERVIEW
The MCP7385X devices are highly advanced linear
charge management controllers. Refer to the functional
block diagram. Figure 4-2 depicts the operational flow
algorithm from charge initiation to completion and
automatic recharge.
4.4
Charge Cycle Completion and
Automatic Recharge
The MCP7385X devices monitor the charging current
during the Constant-voltage Regulation mode. The
charge cycle is considered complete when either the
charge current has diminished below approximately
7% of the regulation current (IREG), or the elapsed timer
has expired.
4.1
Charge Qualification and
Preconditioning
Upon insertion of a battery, or application of an external
supply, the MCP7385X devices automatically perform a
series of safety checks to qualify the charge. The input
source voltage must be above the Undervoltage Lock-
out (UVLO) threshold, the enable pin must be above the
logic high level, and the cell temperature monitor must
be within the upper and lower thresholds (MCP73853
only). The qualification parameters are continuously
monitored, with any deviation beyond the limits automat-
ically suspending, or terminating, the charge cycle. The
input voltage must deviate below the UVLO stop
threshold for at least one clock period to be considered
valid.
The MCP7385X devices automatically begin a new
charge cycle when the battery voltage falls below the
recharge threshold (VRTH), assuming all the qualifica-
tion parameters are met.
4.5
Thermal Regulation
The MCP7385X devices limit the charge current based
on the die temperature. Thermal regulation optimizes
the charge cycle time while maintaining device reliabil-
ity. If thermal regulation is entered, the timer is automat-
ically slowed down to ensure that a charge cycle will
not terminate prematurely. Figure 4-1 depicts the
thermal regulation.
Once the qualification parameters have been met, the
MCP7385X devices initiate a charge cycle. The charge
status output is pulled low throughout the charge cycle
(see Tables 5-1 and 5-2 for charge status outputs). If
the battery voltage is below the preconditioning thresh-
old (VPTH), the MCP7385X devices precondition the
battery with a trickle charge. The preconditioning
current is set to approximately 10% of the fast charge
regulation current. The preconditioning trickle charge
safely replenishes deeply depleted cells and minimizes
heat dissipation during the initial charge cycle. If the
battery voltage has not exceeded the preconditioning
threshold before the preconditioning timer has expired,
a fault is indicated and the charge cycle is terminated.
450
400
350
Minimum
Maximum
300
250
200
150
100
50
0
0
20
40
60
80
100
120
140
4.2
Constant Current Regulation –
Fast Charge
Junction Temperature (C)
Preconditioning ends and fast charging begins when
the battery voltage exceeds the preconditioning thresh-
old. Fast charge regulates to a constant current (IREG),
which is set via an external resistor connected to the
PROG pin. Fast charge continues until either the
FIGURE 4-1:
Current vs. Junction Temperature.
Typical Maximum Charge
4.6
Thermal Shutdown
battery voltage reaches the regulation voltage (VREG
or the fast charge timer expires; in which case, a fault
is indicated and the charge cycle is terminated.
)
The MCP7385X devices suspend charge if the die
temperature exceeds 155°C. Charging will resume
when the die temperature has cooled by approximately
10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
4.3
Constant Voltage Regulation
When the battery voltage reaches the regulation volt-
age (VREG), constant voltage regulation begins. The
MCP7385X devices monitor the battery voltage at the
V
BAT pin. This input is tied directly to the positive termi-
nal of the battery. The MCP7385X devices select the
voltage regulation value based on the state of VSET
.
2004 Microchip Technology Inc.
DS21915A-page 11
Initialize
Note 1:
Note 2:
The qualification parameters are continuously
monitored throughout the charge cycle. For more
details on this, refer to Section 4.1 “Charge
Qualification and Preconditioning”.
V
DD > VUVLO
EN High
NOTE 1
NOTE 1
No
The charge current will be scaled based on the
die temperature during thermal regulation. For
more details, refer to Section 4.5 “Thermal
Regulation”.
STAT1 = Off
STAT2 = Off
Yes
Temperature OK
Yes
No
STAT1 = Off
STAT2 = Flashing
Charge Current = 0
Preconditioning Mode
Charge Current = IPREG
Reset Safety Timer
No
STAT1 = On
STAT2 = Off
VBAT > VPTH
Yes
Constant-current
Mode
Charge Current = IREG
Constant-voltage Mode
Output Voltage = VREG
NOTE 2
Yes
VBAT > VPTH
Reset Safety Timer
Charge Termination
Charge Current = 0
Reset Safety Timer
Yes
IOUT < ITERM
Yes
VBAT = VREG
Elapsed Timer
Expired
No
No
No
Fault
Charge Current = 0
Reset Safety Timer
Yes
V
V
DD < VUVLO
BAT < VRTH
Yes
Yes
Yes
Safety Timer
Expired
Safety Timer
Expired
Temperature OK
or EN Low
No
No
No
Yes
STAT1 = Flashing
Safety Timer Suspended
Charge Current = 0
No
Yes
STAT1 = Flashing
STAT2 = Off
VDD < VUVLO
or EN Low
Temperature OK
No
Temperature OK
No
No
Yes
STAT1 = Off
STAT1 = Off
STAT2 = On
STAT1 = Off
STAT2 = Flashing
STAT2 = Flashing
Safety Timer Suspended
Charge Current = 0
Safety Timer Suspended
Charge Current = 0
FIGURE 4-2:
Operational Flow Algorithm.
MCP73853/55
Figure 6-1 depicts a typical application circuit with
connection of the THERM input. The resistor values of
RT1 and RT2 are calculated with the following
equations.
5.0
DETAILED DESCRIPTION
5.1
Analog Circuitry
For NTC thermistors:
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD1, VDD2
)
2 × RCOLD × RHOT
----------------------------------------------
RT1
=
R
COLD – RHOT
The VDD input is the input supply to the MCP7385X
devices. The MCP7385X devices automatically enter a
power-down mode if the voltage on the VDD input falls
below the UVLO voltage (VSTOP). This feature prevents
draining the battery pack when the VDD supply is not
present.
2 × RCOLD × RHOT
----------------------------------------------
RT2
=
R
COLD – 3 × RHOT
For PTC thermistors:
2 × RCOLD × RHOT
5.1.2
PROG INPUT
----------------------------------------------
RT1
=
R
HOT – RCOLD
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. Connecting the PROG input to VSS allows for a
maximum fast charge current of 400 mA, typically. The
minimum fast charge current is 85 mA (Typ) and is set
by letting the PROG input float. Equation 5-1 calculates
2 × RCOLD × RHOT
----------------------------------------------
HOT – 3 × RCOLD
RT2
=
R
Where:
the value for RPROG
.
RCOLD and RHOT are the thermistor
resistance values at the temperature window
of interest.
EQUATION 5-1:
13.32 – 33.3 × IREG
-----------------------------------------------
14.1 × IREG – 1.2
Applying a voltage equal to VTHREF/3 to the THERM
input disables temperature monitoring.
RPROG
=
Where:
5.1.5
TIMER SET INPUT (TIMER)
IREG is the desired fast charge current in
amps
The TIMER input programs the period of the safety tim-
ers by placing a timing capacitor (CTIMER) between the
TIMER input pin and VSS. Three safety timers are
programmed via the timing capacitor.
RPROG is in kilo-ohms.
The preconditioning trickle charge current and the
charge termination current are scaled to approximately
10% and 7% of IREG, respectively.
The preconditioning safety timer period:
CTIMER
------------------
× 1.0Hours
tPRECON
=
0.1µF
5.1.3
CELL TEMPERATURE SENSOR
BIAS (THREF)
The fast charge safety timer period:
A 2.55V voltage reference is provided to bias an exter-
nal thermistor for continuous cell temperature monitor-
CTIMER
------------------
× 1.5Hours
tFAST
=
0.1µF
ing and prequalification.
comparison is performed at threshold levels of
THREF/2 and VTHREF/4.
A ratio-metric window
V
And, the elapsed time termination period:
CTIMER
5.1.4
CELL TEMPERATURE SENSOR
INPUT (THERM)
------------------
× 3.0Hours
tTERM
=
0.1µF
The MCP73853 continuously monitors temperature by
comparing the voltage between the THERM input and
VSS with the upper and lower temperature thresholds.
A negative or positive temperature coefficient, NTC or
PTC thermistor and an external voltage divider typically
develops this voltage. The temperature-sensing circuit
has its own reference to which it performs a ratio-metric
comparison. Therefore, it is immune to fluctuations in
the supply input (VDD). The temperature-sensing circuit
is removed from the system when VDD is not applied,
eliminating additional discharge of the battery pack.
The preconditioning timer starts after qualification and
resets when the charge cycle transitions to the
constant-current, fast charge phase. The fast charge
timer and the elapsed timer start after the MCP7385X
devices transition from preconditioning. The fast
charge timer resets when the charge cycle transitions
to the Constant-voltage mode. The elapsed timer will
expire and terminate the charge if the sensed current
does not diminish below the termination threshold.
During thermal regulation, the timer is slowed down
proportional to the charge current.
2004 Microchip Technology Inc.
DS21915A-page 13
MCP73853/55
5.1.6
BATTERY VOLTAGE SENSE (VBAT3)
TABLE 5-2:
STATUS OUTPUT – MCP73855
The MCP73853 monitors the battery voltage at the
VBAT3 pin. This input is tied directly to the positive
terminal of the battery pack.
CHARGE CYCLE STATE
STAT1
Qualification
OFF
ON
Preconditioning
Constant Current Fast Charge
Constant Voltage
Charge Complete
Fault
5.1.7
BATTERY CHARGE CONTROL
OUTPUT (VBAT1, VBAT2
ON
)
ON
The battery charge control output is the drain terminal of
an internal P-channel MOSFET. The MCP7385X
devices provide constant-current and constant-voltage
regulation to the battery pack by controlling this
MOSFET in the linear region. The battery charge
control output should be connected to the positive
terminal of the battery pack.
OFF
Flashing (1Hz,
50% duty cycle)
THERM Invalid
Flashing (1Hz,
50% duty cycle)
Disabled - Sleep mode
OFF
OFF
Input Voltage Disconnected
5.2
Digital Circuitry
Note:
OFF state: open-drain is high impedance;
ON state: open-drain can sink current, typ-
ically 7 mA; FLASHING: toggles between
OFF state and ON state.
5.2.1
CHARGE STATUS OUTPUTS
(STAT1,STAT2)
Two status outputs provide information on the state of
charge for the MCP73853. One status output provides
information on the state of charge for the MCP73855.
The current-limited, open-drain outputs can be used to
illuminate external LEDs. Optionally, a pull-up resistor
can be used on the output for communication with a
host microcontroller. Table 5-1 and Table 5-2 summa-
rize the state of the status outputs during a charge
cycle for the MCP73853 and MCP73855, respectively.
The flashing rate (1 Hz) is based off a timer capacitor
(CTIMER) of 0.1 µF. The rate will vary based on the
value of the timer capacitor.
5.2.1.1
MCP73853 Only
STAT2 is on whenever the input voltage is above the
under voltage lockout, the device is enabled, and all
conditions are normal.
During a fault condition, the STAT1 status output will be
off and the STAT2 status output will flash. To recover
from a fault condition, the input voltage must be
removed and then reapplied, or the enable input, EN,
must be de-asserted to a logic-low, then asserted to a
logic-high.
TABLE 5-1: STATUS OUTPUTS – MCP73853
CHARGE
STAT1
STAT2
CYCLE STATE
Qualification
OFF
ON
OFF
OFF
OFF
Preconditioning
When the voltage on the THERM input is outside the
preset window, the charge cycle will either not start or
be suspended. However, the charge cycle is not termi-
nated, with recovery beng automatic. The charge cycle
will resume (or start) once the THERM input is valid and
all other qualification parameters are met.
Constant-
current Fast
Charge
ON
Constant-
voltage
ON
OFF
OFF
ON
Charge
Complete
Flashing (1 Hz,
50% duty cycle)
5.2.2
VSET INPUT
Fault
OFF
OFF
The VSET input selects the regulated output voltage of
the MCP7385X devices. With VSET tied to VSS, the
MCP7385X devices regulate to 4.1V. With VSET tied to
THERM Invalid
Flashing (1 Hz,
50% duty cycle)
VDD, the MCP7385X devices regulate to 4.2V.
Disabled -
Sleep mode
OFF
OFF
OFF
5.2.3 LOGIC ENABLE (EN)
Input Voltage
Disconnected
OFF
The logic enable input pin (EN) can be used to termi-
nate a charge anytime during the charge cycle, initiate
a charge cycle or initiate a recharge cycle.
Note:
OFF state: open-drain is high-impedance;
ON state: open-drain can sink current,
typically 7 mA; FLASHING: toggles
between OFF and ON states.
Applying a logic-high input signal to the EN pin, or tying
it to the input source, enables the device. Applying a
logic-low input signal disables the device and termi-
nates a charge cycle. When disabled, the device’s
supply current is reduced to 0.28 µA, typically.
DS21915A-page 14
2004 Microchip Technology Inc.
MCP73853/55
cells, constant current followed by constant voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figures 6-2 and 6-3 depict the
accompanying charge profile.
6.0
APPLICATIONS
The MCP7385X devices are designed to operate in
conjunction with a host microcontroller or in stand-
alone applications. The MCP7385X devices provide
the preferred charge algorithm for Li-Ion/Li-Polymer
Regulated Wall Cube
STAT1
EN VSS2
or
16 15 14 13
USB Power Bus
VSET
VDD1
VDD2
VSS1
VBAT3
12
1
2
3
4
+
-
Single
Lithium-Ion
Cell
VBAT2
VBAT1
VSS3
11
10
9
MCP73853
5
6
7
8
PROG
RPROG
TIMER
CTIMER
RT1
RT2
FIGURE 6-1:
Typical Application Circuit.
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Regulation
Voltage
(V
)
REG
Regulation
Current
(I
)
REG
Charge
Voltage
Transition
Threshold
(V
)
PTH
Precondition
Current
Charge
Current
(I
)
PREG
Termination
Current
(I
)
TERM
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-2:
Typical Charge Profile.
2004 Microchip Technology Inc.
DS21915A-page 15
MCP73853/55
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Regulation
Voltage
(V
)
REG
Regulation
Current
(I
)
REG
Charge
Voltage
Transition
Threshold
(V
)
PTH
Precondition
Current
Charge
Current
(I
)
PREG
Termination
Current
(I
)
TERM
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-3:
Typical Charge Profile in Thermal Regulation.
DS21915A-page 16
2004 Microchip Technology Inc.
MCP73853/55
6.1.1.3
EXTERNAL CAPACITORS
6.1
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost. These
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation
exists when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
The MCP7385X devices are stable with or without a
battery load. In order to maintain good AC stability in
the Constant-voltage mode, a minimum capacitance of
4.7 µF is recommended to bypass the VBAT pin to VSS
.
This capacitance provides compensation when there is
no battery load. In addition, the battery and intercon-
nections appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for up to
the maximum output current.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging sys-
tem. The following discussion is intended to be a guide
for the component selection process.
6.1.1.1
CURRENT PROGRAMMING RESISTOR
(RPROG
)
6.1.1.4
REVERSE BLOCKING PROTECTION
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAH battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance or
life.
The MCP7385X devices provide protection from a
faulted or shorted input or from a reversed-polarity
input source. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
6.1.1.5
ENABLE INTERFACE
400 mA is the typical maximum charge current
obtainable from the MCP7385X devices. For this situa-
tion, the PROG input should be connected directly to
In the stand-alone configuration, the enable pin is gen-
erally tied to the input voltage. The MCP7385X devices
automatically enter a low power mode when voltage on
the VDD input falls below the UVLO voltage (VSTOP),
reducing the battery drain current to 0.28 µA, typically.
VSS
.
6.1.1.2
THERMAL CONSIDERATIONS
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
6.1.1.6
CHARGE STATUS INTERFACE
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Refer to Table 5-1
and Table 5-2 for a summary of the state of the status
output during a charge cycle.
PowerDissipation = (V
– V
) × I
DDMAX
PTHMIN
REGMAX
6.2
PCB Layout Issues
Where VDDMAX is the maximum input voltage
(IREGMAX) is the maximum fast charge current, and
VPTHMIN is the minimum transition threshold voltage.
Power dissipation with a 5V, +/-10% input voltage
source is:
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins.
It is recommended that the designer minimize voltage
drops along the high-current-carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature.
PowerDissipation = (5.5V – 2.7V) × 475mA = 1.33W
With the battery charger mounted on a 1 in2 pad of
1 oz. copper, the junction temperature rise is approxi-
mately 50°C. This would allow for a maximum operat-
ing ambient temperature of 35°C before thermal
regulation is entered.
2004 Microchip Technology Inc.
DS21915A-page 17
MCP73853/55
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
16-Lead QFN (MCP73853)
Example
XXXXXXX
XXXXXXX
YYWWNNN
73853
I/ML
0429256
10-Lead DFN (MCP73855)
Example
3855
I429
256
XXXX
XYWW
NNN
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21915A-page 18
2004 Microchip Technology Inc.
MCP73853/55
16-Lead Plastic Quad Flat No Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated
D
D1
EXPOSED
METAL
PAD
e
E1
E
2
1
b
n
OPTIONAL
INDEX
L
TOP VIEW
BOTTOM VIEW
AREA
A3
A
A1
Units
Dimension Limits
INCHES
MILLIMETERS*
MIN
NOM
16
MAX
MIN
NOM
16
MAX
n
e
Number of Pins
Pitch
.026 BSC
0.65 BSC
0.90
Overall Height
Standoff
A
.031
.035
.001
.008 REF
.039
0.80
1.00
A1
A3
E
.000
.002
0.00
0.02
0.05
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
0.20 REF
4.00
.152
.100
.152
.100
.010
.012
.157
.106
.157
.106
.012
.016
.163
.110
.163
.110
.014
.020
3.85
2.55
3.85
2.55
0.25
0.30
4.15
2.80
4.15
2.80
0.35
0.50
E2
D
2.70
4.00
D2
b
2.70
0.30
L
0.40
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
Drawing No. C04-127
Revised 04-24-05
2004 Microchip Technology Inc.
DS21915A-page 19
MCP73853/55
10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
p
b
E
n
L
D
D2
EXPOSED
METAL
PAD
2
1
PIN 1
ID INDEX
AREA
E2
TOP VIEW
BOTTOM VIEW
(NOTE 2)
A
EXPOSED
TIE BAR
A3
A1
(NOTE 1)
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
10
MAX
n
e
Number of Pins
Pitch
10
.020 BSC
0.50 BSC
0.90
Overall Height
Standoff
A
.031
.035
.001
.008 REF.
.039
.002
0.80
1.00
A1
A3
E
.000
0.00
0.02
0.05
Lead Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Lead Width
0.20 REF.
3.00
.112
.055
.112
.047
.008
.012
.118
--
.124
.096
.124
.069
.015
.020
2.85
1.39
2.85
1.20
0.18
0.30
3.15
2.45
3.15
1.75
0.30
0.50
(Note 3)
(Note 3)
E2
D
--
.118
--
3.00
D2
b
--
.010
.016
0.25
Lead Length
L
0.40
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: Not registered
Drawing No. C04-063
Revised 05/24/04
DS21915A-page 20
2004 Microchip Technology Inc.
MCP73853/55
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
a)
MCP73853T-I/ML: Tape and Reel,
Temperature Package
Range
USB compatible charge
controller with tempera-
ture monitor
b)
MCP73853-I/ML: USB compatible charge
controller with tempera-
ture monitor
Device
MCP73853:
USB compatible charge controller with tem-
perature monitor
a)
b)
MCP73855T-I/MF: Tape and Reel,
USB compatible charge
controller
MCP73855-I/MF: USB compatible charge
controller
MCP73853T: USB compatible charge controller with tem-
perature monitor, Tape and Reel
MCP73855:
USB compatible charge controller
MCP73855T: USB compatible charge controller,
Tape and Reel
Temperature Range
Package
I
= -40°C to +85°C (Industrial)
ML
MF
=
Plastic Quad Flat No Lead, 4x4 mm Body (QFN),
16-Lead
=
Plastic Dual Flat No Lead, 3x3 mm Body (DFN),
10-Lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21915A-page 21
MCP73853/55
NOTES:
DS21915A-page 22
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21915A-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
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Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Seoul
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Boston
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Tel: 65-6334-8870
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Fax: 886-7-536-4803
Chicago
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Fax: 630-285-0075
England - Berkshire
Tel: 44-118-921-5869
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Taiwan - Taipei
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Dallas
Addison, TX
China - Shenzhen
Tel: 86-755-8203-2660
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Tel: 972-818-7423
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Taiwan - Hsinchu
Tel: 886-3-572-9526
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China - Shunde
Detroit
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Kokomo
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Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
10/20/04
DS21915A-page 24
2004 Microchip Technology Inc.
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