MIC33M350YMP-TRVAO [MICROCHIP]
3A, Pin Strapping Power Module with HyperLight Load® Mode and Output Voltage Select;
| 型号： | MIC33M350YMP-TRVAO |
| 厂家： | 
MICROCHIP |
| 描述： | 3A, Pin Strapping Power Module with HyperLight Load® Mode and Output Voltage Select |
| 文件： | 总32页 (文件大小：1107K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC33M350
3A, Pin Strapping Power Module
with HyperLight Load® Mode and Output Voltage Select
Features
General Description
The MIC33M350 device is a pin-selectable output
voltage, high-efficiency, low-voltage input, 3A current,
synchronous step-down regulator power module with
integrated inductor. The Constant On-Time (COT)
control architecture with HyperLight Load provides very
high efficiency at light loads, while maintaining an
ultra-fast transient response.
• 2.4V to 5.5V Input Voltage Range
• 3A Output Current
• Pin Strapping Voltage Selection:
- Three-state pins (nine voltage combinations)
- 0.6V, 0.8V, 0.9V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V
or 3.3V output voltage
• Passes Automotive AEC-Q104 Reliability Testing
The MIC33M350 output voltage is set by two VSEL
(Voltage Selection) pins, between nine different values.
This method eliminates the need for an external
feedback resistor divider and improves the output
voltage setting accuracy.
• Reduced Component Count (no feedback
resistors)
• High Efficiency (up to 95%)
• Output Discharge when Disabled
• Constant On-Time Control with High Switching
Frequency:
The 2.4V to 5.5V input voltage range, low shutdown
and quiescent currents make the MIC33M350 device
ideal for single cell Li-Ion battery-powered applications.
The 100% duty cycle capability provides Low Dropout
operation, extending operating range in portable
systems.
- 1.2 MHz typical at 1.0V output voltage
• ±1.5% Output Voltage Accuracy Over
Line/Load/Temperature Range
• 0.8 ms/V Soft Start Speed
• Supports Safe Start-up with Pre-Biased Output
• Typical 1.5 µA Shutdown Supply Current
• Low Dropout Operation (100% duty cycle)
• Ultra Fast Transient Response
The MIC33M350 pinout is compatible with the
MIC33M356 I2C-based programmable regulator
version, such that applications can be easily converted.
An open-drain Power Good output is provided to
indicate when the output voltage is within 9% of
regulation and facilitates the interface with an MCU. If
set in shutdown (EN = GND), the MIC33M350 typically
draws 1.5 µA, while the output is discharged through
10pull-down.
• Latch-Off Thermal Shutdown Protection
• Latch-Off Current Limit Protection
• Power Good (PG) Open-Drain Output
• Meets CISPR32 Class B Radiated EMI
• Meets CISPR 25 Class 5 Radiated EMI
MIC33M350 is available in a thermally efficient
package: 24-Lead 3.0 mm x 4.5 mm x 1.8 mm QFN
package, with an operating junction temperature range
from -40°C to +125°C.
• Package: 3.0 mm × 4.5 mm × 1.8 mm,
24-Lead QFN
Applications
MIC33M350 passes Automotive AEC-Q104 Reliability
Testing.
• Solid State Drives (SSD)
• Tablets, Netbooks and Ultrabooks
• FPGAs, DSP and Low-Voltage ASIC Power
Horizontal Polarization
Vertical Polarization
FIGURE 1:
CISPR32, Class B (V = 5V, V
Radiated Emissions,
= 1V,
IN
OUT
I
= 3A).
OUT
2020-2021 Microchip Technology Inc.
DS20006348B-page 1
MIC33M350
FIGURE 2:
Horizontal Polarization Average,CISPR25,
Radiated Emissions,
FIGURE 3:
Radiated Emissions,
Vertical Polarization Average, CISPR25, Class 5
Class 5 (V = 5V, V
= 1V, I
= 3A).
IN
OUT
OUT
(V = 5V, V
= 1V, I = 3A).
OUT
IN
OUT
Package Type
MIC33M350
24-Lead QFN, 3.0 mm x 4.5 mm x 1.8 mm
(Top View)
EP_SW
SW
A
9
24
GND
P
10
23 V
22
GND
OUT
EP2_P
GND
P
11
12
GND
PG
OUT
EP_OUT
21
EN
Typical Application
VOUT
SVIN
OUT
VOUT
C1
1 µF
C3
47 µF
C4
0.1 µF
VIN
2.4V TO 5.5V
PVIN
EN
C2
22 µF
MIC33M350
PGND
AGND
Enable
VSEL1
VSEL2
VSEL1
VSEL2
Program
VOUT
PG
DS20006348B-page 2
2020-2021 Microchip Technology Inc.
MIC33M350
Functional Block Diagram
MIC33M350
SVIN
1 µF
TON
ADJUST
10Ω
VIN
2.4V to 5.5V
MINIMUM
TOFF
22µF
UVLO
OT
HSD
2.225V/
2.072V
VOUT/3A
0.6V
0.8V
0.9V
1.0V
1.2V
1.5V
1.8V
2.5V
3.3V
L1
0.47 µH
Control
Logic
SW
EN
165°C/143°C
0.1
µF
47
µF
PD
ZC
PVIN
LSD
RIPPLE
INJECTION
PGND
COMP
EA
VSEL1
VSEL1
VREF
VSEL1/VSEL2
DECODE LOGIC
VREF
DAC
PD
VSEL2
VIN
100k
AGND
PG
PG
VREF -9%
DELAY
2020-2021 Microchip Technology Inc.
DS20006348B-page 3
MIC33M350
NOTES:
DS20006348B-page 4
2020-2021 Microchip Technology Inc.
MIC33M350
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
SVIN, PVIN to AGND ...................................................................................................................................... -0.3V to +6V
VSW to AGND ................................................................................................................................................ -0.3V to +6V
VEN to AGND ................................................................................................................................................ -0.3V to PVIN
VPG to AGND................................................................................................................................................ -0.3V to PVIN
VVSEL1, VVSEL2 to AGND ............................................................................................................................. -0.3V to PVIN
PVIN to SVIN.............................................................................................................................................. -0.3V to +0.3V
AGND to PGND ........................................................................................................................................... -0.3V to +0.3V
Junction Temperature........................................................................................................................................... +150°C
Storage Temperature (TS)...................................................................................................................... -65°C to +150°C
Lead Temperature (soldering, 10s) ...................................................................................................................... +260°C
ESD Rating(1)
HBM....................................................................................................................................................................... 2000V
CDM....................................................................................................................................................................... 1500V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended peri-
ods may affect device reliability.
Note 1: Devices are ESD-sensitive. Handling precautions recommended. Human body model, 1.5 k in series with
100 pF.
Operating Ratings(1)
Supply Voltage (PVIN).................................................................................................................................. 2.4V to 5.5V
Enable Voltage (VEN)...................................................................................................................................... 0V to PVIN
Power Good (PG) Pull-up Voltage (VPU_PG)................................................................................................... 0V to 5.5V
Maximum Output Current............................................................................................................................................. 3A
Junction Temperature (TJ)...................................................................................................................... -40°C to +125°C
Note 1: The device is not ensured to function outside the operating range.
2020-2021 Microchip Technology Inc.
DS20006348B-page 5
MIC33M350
(1)
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
VIN Supply
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Input Range
PVIN
2.4
—
5.5
V
V
Undervoltage Lockout
Threshold
UVLO
2.15
2.225
2.35
SVIN rising
Undervoltage Lockout
Hysteresis
UVLO_H
IIN0
—
—
153
60
—
V
SVIN falling (Note 3)
Operating Supply Current
100
µA
µA
VFB =1.2V, non-switching
10
VEN = 0V, PVIN = SVIN = 5.5V,
-40°C TJ +105°C
Shutdown Current
ISHDN
—
1.5
20
µA
VEN = 0V, PVIN = SVIN = 5.5V,
-40°C TJ +125°C
Output Voltage
Output Accuracy
VOUT_ACC 0.5910
0.7880
0.6
0.8
0.9
1
0.6090
0.8120
0.9135
1.0150
1.2180
1.5225
1.8270
2.5375
3.3495
—
V
V
V
V
V
V
V
V
V
%
VSEL2 = 0; VSEL1 = 0
V
SEL2 = 0; VSEL1 = Z
SEL2 = 0; VSEL1 = 1
0.8865
V
0.9850
VSEL2 = Z; VSEL1 = 0
1.1820
1.2
1.5
1.8
2.5
3.3
0.03
V
SEL2 = Z; VSEL1 = Z
SEL2 = Z; VSEL1 = 1
1.4775
V
1.7730
VSEL2 = 1; VSEL1 = 0
2.4625
V
SEL2 = 1; VSEL1 = Z
SEL2 = 1; VSEL1 = 1
3.2505
V
Line Regulation
Load Regulation
—
VOUT = 1.0V, VIN = 2.5V to 5.5V,
IOUT = 300 mA (Note 3)
—
0.1
—
%
VOUT = 1.0V, IOUT = 0A to 3A
(Note 3)
Enable Control
EN Logic Level High
EN Logic Level Low
VEN_H
VEN_L
1.2
—
—
V
V
VEN rising, regulator enabled
—
0.4
VEN falling,
regulator shutdown
EN Low Input Current
EN High Input Current
Enable Lockout Delay
VSEL Logic Level Control
VSEL1,2 Logic Level High
IEN_L
IEN_H
—
—
0.01
0.01
0.25
500
500
0.4
nA
nA
ms
VEN = 0V
VEN = 5.5V
0.15
VSEL_H
VSEL_L
VSEL_O
1.2
—
—
—
0.4
—
V
V
V
VSEL1,2 rising,
regulator enabled
VSEL1,2 Logic Level Low
VSEL1,2 falling,
regulator shutdown
VSEL1,2 Logic Level Open
VSEL1,2 Low Input Current
—
0.8
VSEL1,2 falling,
regulator shutdown (Note 3)
IVSEL_L
IVSEL_H
-1
-1
0.01
0.01
1
1
µA
µA
VSEL1,2 = 0V
VSEL1,2 High Input Current
VSEL1,2 = 5.5V
Note 1: Specification for packaged product only.
2: Tested in open loop. The closed-loop current limit is affected by the inductance value.
3: Not production tested, data from bench characterization only
DS20006348B-page 6
2020-2021 Microchip Technology Inc.
MIC33M350
(1)
ELECTRICAL CHARACTERISTICS
(CONTINUED)
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
TON Control/Switching Frequency
Switching ON Time
Switching Frequency
TON
—
—
180
1.2
—
—
ns
VIN = 5V, VOUT = 1V
VOUT = 1.0V, IOUT = 3A
(Note 3)
FREQ
MHz
%
—
—
1.1
—
—
VOUT = 3.3V, IOUT = 3A
Maximum Duty Cycle
DCMAX
100
Note 3
Short Circuit Protection
High-Side MOSFET Forward
Current Limit
ILIM_HS
ILIM_LS
ILIM_NEG
IZC_TH
HICCUP
—
4
5
4.2
-3
0.9
8
6.5
—
-4
A
A
A
A
Note 2
Low-Side MOSFET Forward
Current Limit
—
-2
—
—
—
Note 2, Note 3
Note 2
Low-Side MOSFET Negative
Current Limit
N-Channel Zero-Crossing
Threshold
—
—
—
Note 3
Current Limit Pulses Before
Hiccup
Cycles Note 3
Hiccup Period Before Restart
Internal MOSFETs
1
ms
Note 3
High-Side On Resistance
Low-Side On Resistance
RDS-ON-HS
RDS-ON-LS
—
—
—
30
16
10
60
40
50
mΩ
mΩ
Ω
ISW = 1A
ISW = -1A
Output Discharge Resistance RDS-ON-DSC
VEN = 0V, VSW = 5.5V, from
VOUT to PGND
SW Leakage Current
ILEAK_SW
—
1
10
µA
PVIN = 5.5V, VSW = 0V,
VEN = 0V,
current flowing out of SW pin
Power-Good (PG)
Power Good Threshold
Power Good Hysteresis
Power Good Blanking Time
PG Output Leakage Current
PG_TH
PG_HYS
87
—
—
—
91
4
95
—
%VOUT VOUT rising (good)
%VOUT VOUT falling (Note 3)
PG_BLANK
PG_LEAK
65
30
—
µs
Note 3
OUT = VOUT (NOM),
VPG = 5.5V
VOUT = 0V; IPG = 10 mA
300
nA
V
Power Good Sink Low
Voltage
PG_SINKV
—
—
200
mV
Thermal Shutdown
Thermal Shutdown
TSHDN
—
—
—
165
22
4
—
—
—
°C
°C
—
TJ rising (Note 3)
TJ falling (Note 3)
Note 3
Thermal Shutdown Hysteresis TSHDN_HYST
Thermal Latch-Off Soft Start
Cycles
TH_LATCH
Note 1: Specification for packaged product only.
2: Tested in open loop. The closed-loop current limit is affected by the inductance value.
3: Not production tested, data from bench characterization only
2020-2021 Microchip Technology Inc.
DS20006348B-page 7
MIC33M350
TEMPERATURE SPECIFICATIONS
Electrical Specifications: unless otherwise specified, SVIN = PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Temperature
TJ
-40
-65
—
—
125
150
°C
°C
Storage Temperature Range
Package Thermal Resistances
TA
Thermal Resistance, 24-Lead,
3 mm x 4.5 mm QFN
JA
—
+36
—
°C/W
DS20006348B-page 8
2020-2021 Microchip Technology Inc.
MIC33M350
2.0
TYPICAL CHARACTERISTIC CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
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FIGURE 2-1:
Operating Supply Current
FIGURE 2-4:
R
vs. Temperature.
DS(on)
vs. Input Voltage, Switching.
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FIGURE 2-5:
Efficiency vs. Load Current
FIGURE 2-2:
High-Side Current Limits vs.
(V
= 0.6V).
Temperature.
OUT
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Ambient Temperature (°C)
FIGURE 2-6:
(V = 1V).
Efficiency vs. Load Current
FIGURE 2-3:
vs. Temperature, Switching.
Operating Supply Current
OUT
2020-2021 Microchip Technology Inc.
DS20006348B-page 9
MIC33M350
Note:
Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
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FIGURE 2-7:
Efficiency vs. Load Current
FIGURE 2-10:
Output Voltage Variation vs.
(V
= 2.5V).
Input Voltage.
OUT
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FIGURE 2-8:
Efficiency vs. Load Current
FIGURE 2-11:
V
Voltage vs. I
.
OUT
OUT
(V
= 3.3V).
OUT
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5.5
VIN (V)
FIGURE 2-12:
Input Voltage.
Switching Frequency vs.
FIGURE 2-9:
vs. V .
DCM/FPWM I
Threshold
OUT
IN
DS20006348B-page 10
2020-2021 Microchip Technology Inc.
MIC33M350
Note:
Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C
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FIGURE 2-13:
Switching Frequency vs.
FIGURE 2-16:
EN Turn-On, R
= 0.3.
LOAD
Output Current.
V
IN
5V/div
EN
5V/div
V
OUT
500 mV/div
V
PG
OUT
500 mV/div
5V/div
PG
5V/div
I
OUT
I
OUT
2A/div
2A/div
80 µs/div
4 ms/div
FIGURE 2-17:
EN Turn-Off, R
= 0.3.
FIGURE 2-14:
V
Turn-On (EN = PV ).
IN IN
LOAD
V
IN
5V/div
EN
5V/div
V
OUT
V
OUT
500 mV/div
500 mV/div
PG
5V/div
PG
5V/div
I
OUT
2A/div
SW
5V/div
400 µs/div
400 µs/div
FIGURE 2-18:
EN Turn-On Into Pre-Biased
= 0.8V).
FIGURE 2-15:
V
Turn-Off (EN = PV ),
IN IN
Output (V
R
= 0.3.
pre-bias
LOAD
2020-2021 Microchip Technology Inc.
DS20006348B-page 11
MIC33M350
Note:
Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
V
V
IN
IN
5V/div
5V/div
V
V
OUT
OUT
50 mV/div
AC coupled
500 mV/div
SW
5V/div
PG
5V/div
I
OUT
SW
50 mA/div
5V/div
2 ms/div
1 µs/div
FIGURE 2-19:
Power-Up Into Short Circuit.
FIGURE 2-22:
Switching Waveforms -
I
= 50 mA, HLL Mode.
OUT
V
IN
5V/div
V
OUT
V
OUT
1V/div
50 mV/div
AC coupled
I
OUT
5A/div
PG
5V/div
SW
5V/div
I
OUT
SW
5V/div
5A/div
1 µs/div
2 ms/div
FIGURE 2-20:
Output Current Limit
FIGURE 2-23:
Switching Waveforms -
Threshold.
I
= 3A.
OUT
Step from 0.5A to 3A
PG
5V/div
V
OUT
V
OUT
1V/div
100 mV/div
AC coupled
I
OUT
5A/div
SW
5V/div
SW
5V/div
I
OUT
5A/div
PG
5V/div
1 ms/div
80 µs/div
FIGURE 2-21:
Hiccup Mode Short Circuit
FIGURE 2-24:
Load Transient Response.
Current Limit Response.
DS20006348B-page 12
2020-2021 Microchip Technology Inc.
MIC33M350
Note:
Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
Step from 4.5V to 5.5V
PG
5V/div
V
IN
2V/div
V
OUT
10 mV/div
AC coupled
I
OUT
2A/div
1 ms/div
FIGURE 2-25:
Line Transient Response.
2020-2021 Microchip Technology Inc.
DS20006348B-page 13
MIC33M350
NOTES:
DS20006348B-page 14
2020-2021 Microchip Technology Inc.
MIC33M350
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MIC33M350
PIN FUNCTION TABLE
Symbol
Pin Function
1, 2, 3, 10, 11
PGND
Power Ground Pin: PGND is the ground path for the MIC33M350 buck
converter power stage.
4, 5, 6, 7, 8, 9
SW
PVIN
SVIN
Switch Node Pin
17
18
Power Supply Voltage Pin
Analog Voltage Input Pin. The power to the internal reference and
control sections of the MIC33M350 device. A 1.0 µF ceramic
capacitor from SVIN to GND must be used. Internally connected to
PVIN through a 10 resistor.
19
20
VSEL2
Output Voltage Selection Control Pin 2 (Input): The Logic state of the
VSEL1 and VSEL2 selects the register that sets the output voltage. This
input has three Digital states: High, Low and Floating.
VSEL1
Output Voltage Selection Control Pin 1 (Input): The Logic state of the
VSEL1 and VSEL2 selects the register that sets the output voltage. This
input has three Digital states: High, Low and Floating.
21
22
23
EN
PG
Enable Pin (Input): Logic high enables operation of the regulator. The
EN pin should not be left open.
Power Good Pin (Output): This is an open-drain output that indicates
when the output voltage is lower than the 91% limit.
VOUT
Output Voltage Sense Pin (Input): This pin is used to remote sense
the output voltage. Connect VOUT as close to the output capacitor as
possible to sense output voltage. Also provides the path to discharge
the output through an internal 10 resistor when disabled.
12, 13, 14, 15, 16
OUT
Power Output Side Connection Pins
24
25
26
27
28
AGND
Analog Ground: Internal signal ground for all low-power circuits
Exposed Thermal Pad Pin: Internally connected to PGND
Exposed Thermal Pad Pin: Internally connected to PGND
Exposed Thermal Pad Pin: Internally connected to SW Node
Exposed Thermal Pad Pin: Internally connected to Output side
EP1_PGND
EP2_PGND
EP_SW
EP_OUT
2020-2021 Microchip Technology Inc.
DS20006348B-page 15
MIC33M350
3.1
Power Ground Pin (PGND
)
3.7
Enable Pin (EN)
PGND is the ground path for the MIC33M350 buck
converter power stage. The PGND pin connects to the
sources of the low-side N-Channel MOSFETs, the
negative terminals of input capacitors and the negative
terminals of output capacitors. The loop for the Power
Ground should be as small as possible and separate
from the Analog Ground (AGND) loop.
Logic high enables operation of the regulator. Logic low
shuts down the device. In the OFF state, the supply
current to the device is greatly reduced (typically
1.5 µA). The EN pin should not be left open.
3.8
Power Good Pin (PG)
This is an open-drain output that indicates when the
output voltage is higher than the 91% limit. There is a
4% hysteresis, therefore, PG will return to low when the
falling output voltage falls below 87% of the target
regulation voltage.
3.2
Switch Node Pin (SW)
The SW pin connects directly to the switch node. The
Switching Node output pin is connected to the internal
MOSFETs and inductor. Due to the high-speed
switching on this pin, the SW pin should be routed
away from sensitive nodes. The SW pin also senses
the current by monitoring the voltage across the
low-side MOSFET during off-time.
3.9
Output Voltage Sense Pin (VOUT)
This pin is used to remotely sense the output voltage.
Connect it to VOUT as close to the output capacitor as
possible to sense output voltage. This pin also provides
the path to discharge the output through an internal
10 resistor when it is disabled.
3.3
Input Voltage Pin (PVIN)
This is an input supply to the source of the internal
high-side P-channel MOSFET. The PVIN operating
voltage range is from 2.4V to 5.5V. An input capacitor
between PVIN and the Power Ground (PGND) pin is
required and placed as close as possible to the IC.
3.10 Analog Ground Pin (AGND
)
This is an internal signal ground for all low-power
circuits. Connect it to ground plane. For the best load
regulation, the connection path from AGND to the output
capacitor ground terminal should be free from parasitic
voltage drops.
3.4
Analog Voltage Input Pin (SVIN)
The power to the internal reference and control
sections of the MIC33M350. A 1.0 µF ceramic
capacitor from SVIN to ground must be used. Internally
connected to PVIN through a 10 resistor.
3.11 EP1_PGND, EP2_PGND
These pins electrically connected to the PGND pins.
They must be connected with thermal vias to the
ground plane to ensure adequate heat sinking.
3.5
Output Voltage Selection Control
Pin 2 (VSEL2
)
3.12 EP_SW Exposed Pad (SW)
The Logic state of the VSEL1 and VSEL2 selects the
output voltage. This input has three Digital states: High,
Low and Floating. See Table 4-1.
This pin is electrically connected to the SW node.
3.13 OUT Exposed Pad (OUT)
This pin is electrically connected to the OUT pins. It
must be externally connected to the output power
connection.
3.6
Output Voltage Selection Control
Pin 1 (VSEL1
)
The Logic state of the VSEL1 and VSEL2 selects the
output voltage. This input has three Digital states: High,
Low and Floating. See Table 4-1.
DS20006348B-page 16
2020-2021 Microchip Technology Inc.
MIC33M350
4.3
Enable (EN)
4.0
4.1
DETAILED DESCRIPTION
Device Overview
When the EN pin is pulled low, the IC is in a Shutdown
state, with all internal circuits disabled and with the
Power Good output low. During shutdown, the
MIC33M350 part typically consumes 1.5 µA. When the
EN pin is pulled high, the start-up sequence is initiated.
The MIC33M350 device is a high-efficiency, 3A current,
synchronous buck regulator power module with inte-
grated inductor. The COT control architecture with
automatic HyperLight Load mode provides very high
efficiency at light loads and ultra-fast transient
response.
4.4
Power Good (PG)
The Power Good output is generally used for power
sequencing, where the PG output is tied to the Enable
output of another regulator. This technique avoids all
the regulators powering up at the same time, which
causes large inrush current.
The MIC33M350 output voltage is set by two VSEL
three-state logic pins that can set the output voltage to
nine different values (see Table 4-1).
The 2.4V to 5.5V input voltage operating range makes
the device ideal for single cell Li-ion battery-powered
applications. The 100% duty cycle capability provides
Low Dropout operation, extending battery life in
portable systems. The automatic HyperLight Load
mode provides very high efficiency at light loads.
PG is an open-drain output that indicates that the
output is above 87% of its voltage set value. During
start-up, when the output voltage is rising, the Power
Good output goes high when the output voltage
reaches 91% of its set value. The Power Good
threshold has 4% hysteresis, so the Power Good
output stays high until the output voltage falls below
87% of the set value. A built-in 65 µs blanking time is
incorporated to prevent nuisance tripping.
These devices focus on high output voltage accuracy.
Total output error is less than 1.5% over line, load and
temperature.
MIC33M350 focuses on high output voltage accuracy.
A pull-up resistor can be connected to VIN, VOUT, or an
external source that is less than or equal to VIN. The
PG pin can be connected to another regulator’s enable
pin for sequencing of the outputs. The PG output is
deasserted as soon as the Enable pin is pulled low or
an input undervoltage condition, or any other Fault is
detected.
The MIC33M350 buck regulator uses an adaptive
Constant On-Time control method. The adaptive
on-time control scheme is employed to obtain a nearly
constant switching frequency and to simplify the control
compensation. Overcurrent protection is implemented
without the use of an external sense resistor. The
MIC33M350 device includes an internal soft start
function which reduces the power supply input surge
current at start-up by controlling the output voltage rise
time.
4.5
Resistive Discharge (Soft
Discharge)
To ensure a known output condition when the output is
turned off, then back on again (i.e. in a brown output
condition), the output is actively discharged to ground
by means of an internal 10 resistor if the output is
disabled.
4.2
HyperLight Load® Mode (HLL)
HLL is a power-saving mode. In HLL, the switching
frequency is not constant over the operation current
range. At light loads, the minimum duty cycle is limited,
which causes the switching frequency to decrease at
light loads, this reduces switching and drive losses, and
increases efficiency.
2020-2021 Microchip Technology Inc.
DS20006348B-page 17
MIC33M350
4.6
Output Voltage Setting
4.8
Soft Start
The MIC33M350 device has two pins, VSEL1 and
VSEL2, which are used for choosing between nine
predefined voltage settings: 0.6V, 0.8V, 0.9V, 1.0V,
1.2V, 1.5V, 1.8V, 2.5V, 3.3V. These pins can be tied to
VIN, GND or left floating. The relationship between
VSEL1/VSEL2 and the output voltage is shown in
Table 4-1.
Excess bulk capacitance on the output can cause
excessive input inrush current. The MIC33M350 soft
start feature forces the output voltage to rise gradually,
keeping the inrush current at reasonable levels. This is
particularly important in battery-powered applications.
When the Enable pin goes high, the output voltage
starts to rise. Once the soft start period has finished,
the Power Good comparator is enabled and the Power
Good output goes high.
TABLE 4-1:
VSEL2
OUTPUT VOLTAGE SETTINGS
VSEL1
VOUT
The output voltage soft start time is determined by the
soft start equation below. The Soft Start Time, tSS can
be calculated by Equation 4-2.
GND
GND
GND
OPEN
OPEN
OPEN
VIN
GND
OPEN
VIN
0.6V
0.8V
0.9V
1.0V
1.2V
1.5V
1.8V
2.5V
3.3V
EQUATION 4-2:
.
GND
OPEN
VIN
tSS = VOUT tRAMP
tSS = 1.0V 800 s V
tss = 800 s = 0.8 ms
GND
OPEN
VIN
VIN
VIN
Where:
VOUT should be connected exactly to the desired
Point-of-Load (POL) regulation, avoiding parasitic
resistive drops. It is possible to fine-tune the desired
output voltage by adding a series resistor on the VOUT
pin. This allows slightly higher output value
programming, but should not exceed 5% deviation from
the VSEL selected value.
VOUT = 1.0V
tRAMP = 800 µs/V
4.9
Dropout Operation
As the input voltage approaches the output voltage, the
minimum on-time limits the maximum duty cycle. To
achieve 100% duty cycle, the high-side switch is
latched when the duty cycle reaches around 92% and
stays latched until the output voltage falls 4% below its
regulated value. In dropout, the output voltage is
determined by the input voltage minus the voltage drop
across the high-side MOSFET.
EQUATION 4-1:
R
= 8.2 k TRIM
VOUT
Where:
RVOUT = VOUT series resistance needed for a
TRIM% output voltage increase
4.7
Converter Stability/Output
Capacitor
The MIC33M350 device utilizes an internal
compensation network and is designed to provide
stable operation with output capacitors, from 47 µF to
1000 µF. This greatly simplifies the design, where you
can add supplementary output capacitance without
having to worry about stability.
DS20006348B-page 18
2020-2021 Microchip Technology Inc.
MIC33M350
During recovery from a thermal shutdown event, if the
regulator hits another thermal shutdown event or a
current limit event causing hiccup before Power Good
can be achieved, the controller resets again. If this
happens more than four times in a row, then the part
enters the Latch-Off state, which turns off both
MOSFETs permanently. The MIC33M350 part does not
restart again unless the input power is cycled. This
Latch-Off feature eliminates the thermal stress on the
MIC33M350 during a persistent Fault event.
4.10 Switching Frequency
The switching frequency of the MIC33M350 is
determined by the internal On-Time (TON) calculation.
For an input voltage of 5V and an output voltage of 1V,
the typical value of TON is 180 ns. The resulting
switching frequency can be estimated by Equation 4-3.
EQUATION 4-3:
fSW = VOUT VIN TON
4.13 Safe Start-up Into a Pre-Biased
Output
Equation 4-3 is only valid in continuous conduction
mode and for a lossless converter. In practice, losses
cause an increase of the switching frequency
compared to the ideal case. As the load current
increases, losses increase too and so does the
switching frequency.
The MIC33M350 is designed for safe start-up into a
pre-biased output in forced PWM. This feature
prevents high negative inductor current flow in a
pre-bias condition, which can damage the IC. This is
achieved by not allowing forced PWM until the control
loop commands eight switching cycles. After eight
cycles, the low-side negative current limit is switched
from 0A to -3A. The cycle counter is reset to zero if the
enable pin is pulled low, or an input undervoltage
condition or any other Fault is detected.
The on-time calculation is adaptive, in that the TON
value is modulated based on the input voltage and on
the target output voltage to stabilize the switching
frequency against their variations. Losses are not
accounted for.
4.14 Current Limiting
VIN (V)
VOUT (V)
TON
The MIC33M350 regulator uses both high-side and
low-side current sense for current limiting. When the
high-side current sense threshold is reached, the
high-side MOSFET is turned off and the low-side
MOSFET is turned on. The low-side MOSFET stays on
until the current falls to 80% of the high-side current
threshold value, then the high side can be turned on
again. If the overload condition lasts for more than four
cycles, the MIC33M350 enters hiccup current limiting
and both MOSFETs are turned off. There is a 1 ms
cool-off period before the MOSFETs are allowed to be
turned on. If the regulator has another hiccup event
before it reaches the Power Good threshold on restart,
turn both MOSFETs off again and wait for 1 ms. If this
happens more than three times in a row, then the part
enters the Latch-Off state, which turns off both
MOSFETs permanently, unless the part is reset by
cycling the input power.
5
0.6
1
110
180
340
490
610
270
1.8
2.5
3.3
1
3.3
4.11 Undervoltage Protection (UVLO)
Undervoltage protection ensures that the IC has
enough voltage to bias the internal circuitry properly
and provide sufficient gate drive for the power
MOSFETs. When the input voltage starts to rise, both
power MOSFETs are off and the power good output is
pulled low. The IC starts at approximately 2.225V and
has a nominal 153 mV of hysteresis to prevent
chattering between the UVLO high and low states.
4.15 Thermal Considerations
4.12 Overtemperature Fault
Although the MIC33M350 is capable of delivering up to
3A under load, the package thermal resistance and the
device internal power dissipation may dictate some
limitations to the continuous output current.
The MIC33M350 monitors the die junction temperature
to keep the IC operating properly. If the IC junction
temperature exceeds +165°C, both power MOSFETs
are immediately turned off. The IC is allowed to restart
when the die temperature falls below +143°C.
If operated above the rated junction temperature,
electrical parameters may drift beyond characterized
specifications. The MIC33M350 is protected under all
circumstances by thermal shutdown.
2020-2021 Microchip Technology Inc.
DS20006348B-page 19
MIC33M350
NOTES:
DS20006348B-page 20
2020-2021 Microchip Technology Inc.
MIC33M350
EQUATION 5-3:
5.0
5.1
APPLICATION INFORMATION
Output Voltage Sensing
2
I
2
LPP
------------------------------------------
V
=
+
I
ESR
C
OUTPP
LPP
C
f 8
OUT SW
OUT
To achieve accurate output voltage regulation, the
VOUT pin (internal feedback divider top terminal) should
be Kelvin-connected as close as possible to the point
of regulation top terminal. Since both the internal
reference and the internal feedback divider’s bottom
terminal refer to AGND, it is important to minimize
voltage drops between the AGND and the point of
regulation return terminal (typically the ground terminal
of the output capacitor which is closest to the load).
Where:
COUT
fSW
Output Capacitance Value
Switching Frequency
The output capacitor RMS current is calculated in
Equation 5-4.
EQUATION 5-4:
I
LPP
5.2
Output Capacitor Selection
I
= ---------------------
12
C
OUTRMS
The type of the output capacitor is usually determined
by its Equivalent Series Resistance (ESR). Voltage and
RMS current capability are two other important factors
for selecting the output capacitor. Recommended
capacitor types are ceramic, low-ESR aluminum
electrolytic, OS-CON, and POSCAP. The output
capacitor’s ESR is usually the main cause of the output
ripple. The output capacitor ESR also affects the
control loop from a stability point of view. The maximum
value of ESR is calculated using Equation 5-1.
The power dissipated in the output capacitor is:
EQUATION 5-5:
2
P
= I
ESR
DISSCOUT
COUTRMS
COUT
5.3
Input Capacitor Selection
The input capacitor for the power stage input VIN
should be selected for ripple current rating and voltage
rating. Tantalum input capacitors can fail when
subjected to high inrush currents, caused by turning on
the input supply. A tantalum input capacitor’s voltage
rating should be at least two times the maximum input
voltage, to maximize reliability. Aluminum electrolytic,
OS–CON, and multilayer polymer film capacitors can
handle the higher inrush currents without voltage
derating. The input voltage ripple depends on the input
capacitor’s ESR. The peak input current is equal to the
peak inductor current, as shown in Equation 5-6.
EQUATION 5-1:
V
OUTPP
--------------------------------
ESR
C
I
OUT
LPP
Where:
VOUT(PP)
IL(PP)
Peak-to-peak output voltage ripple
Peak-to-peak inductor current ripple
The peak-to-peak inductor current ripple can be
calculated with the formula in Equation 5-2.
EQUATION 5-6:
EQUATION 5-2:
V
= I
C
IN
LPK
ESR
V
V
– V
OUT
IN(MAX)
f
OUT
L
I
= ----------------------------------------------------------------------------
The input capacitor must be rated for the input current
ripple. The RMS value of input capacitor current is
determined at the maximum output current. Assuming
the peak-to-peak inductor current ripple is low:
L(PP)
V
IN(MAX) SW
Where:
L
=
0.47 µH
EQUATION 5-7:
The total output ripple is a combination of the ESR and
output capacitance.The total ripple is calculated in
Equation 5-3.
I
I
CINRMS OUTMAX
D 1 – D
The power dissipated in the input capacitor is
calculated in Equation 5-8.
EQUATION 5-8:
2
P
= I
C
DISSCIN
CINRMS
ESR
2020-2021 Microchip Technology Inc.
DS20006348B-page 21
MIC33M350
NOTES:
DS20006348B-page 22
2020-2021 Microchip Technology Inc.
MIC33M350
6.0
PACKAGE MARKING INFORMATION
MIC33M350
Example
24-Lead QFN, 3.0 mm x 4.5 mm x 1.8 mm
350
2110
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2020-2021 Microchip Technology Inc.
DS20006348B-page 23
MIC33M350
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24X
A1
0.05 C
0.08 C
NOTE 1
D
A
B
E
N
E
4
1
2
(DATUM B)
(DATUM A)
2X
0.05 C
2X
(A3)
TOP VIEW
0.05 C
A
SEATING
PLANE
C
D2
2X b2
SIDE VIEW
6X L2
K2 0.20
24X b
0.10
0.05
C A B
C
E2
2
1
E3
e
N
11X L
NOTE 1
K1 0.20
D3
BOTTOM VIEW
Microchip Technology Drawing C04-1220A Sheet 1 of 2
DS20006348B-page 24
2020-2021 Microchip Technology Inc.
MIC33M350
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
N
24
0.50 BSC
1.85
e
A
A1
A3
D
D2
D3
E
E2
E3
b
b2
L
1.80
0.00
1.90
0.05
Standoff
0.02
Terminal Thickness
Overall Length
Exposed Pad Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Exposed Pad Width
Terminal Width
Terminal Width
Terminal Length
Terminal Length
0.203 REF
3.00 BSC
0.388
1.394
4.50 BSC
2.40
0.376
0.25
0.13
0.338
1.344
0.438
1.444
2.35
0.326
0.20
0.08
0.35
0.20
0.20
0.20
2.45
0.426
0.30
0.18
0.45
0.30
-
0.40
0.25
-
-
L2
K1
K2
Terminal to Exposed Pad
Terminal to Exposed Pad
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1220A Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006348B-page 25
MIC33M350
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X4
C1
X6
X1
EV
24
Y6
Y1
Y4
EV
1
2
C2
Y5
Y7
EV
EV
8X ØV
Y2
X3
X5
SILK SCREEN
E
Outer Features
Inner Features
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Contact Pitch
E
0.50 BSC
Contact Pad Spacing
Contact Pad Spacing
Contact Pad Width (X24)
Contact Pad Length (X24)
Contact Pad Length (X7)
Contact Pad Width
Exposed Pad Length
Exposed Pad Width
Exposed Pad Width
Exposed Pad Length
Terminal to Exposed Pad
Terminal to Exposed Pad
Terminal to Exposed Pad
Thermal Via Diameter
Thermal Via Pitch
C1
C2
X1
3.00
4.50
0.30
0.80
0.65
0.20
Y1
Y2
X3
X4
Y4
X5
Y5
X6
Y6
Y7
V
1.41
0.40
0.43
2.40
0.20
0.50
0.20
0.30
1.00
EV
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3220 Rev A
DS20006348B-page 26
2020-2021 Microchip Technology Inc.
MIC33M350
APPENDIX A: REVISION HISTORY
Revision B (March 2021)
The following is the list of modifications:
1. Added edits to incorporate the AEC-Q104
qualification.
Revision A (May 2020)
• Initial release of this document.
2020-2021 Microchip Technology Inc.
DS20006348B-page 27
MIC33M350
NOTES:
2020-2021 Microchip Technology Inc.
DS20006348B-page 28
MIC33M350
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XXX
XX
XX
a) MIC33M350YMP-TR:
Extended Temperature,
24-Lead QFN package,
Tape and Reel
Junction
Temperature
Range
Package
Qualification
Tape and Reel
Option(1)
b) MIC33M350YMP-VAO:
Extended Temperature
24-Lead QFN package,
Tape and Reel,
Device:
MIC33M350
Automotive Qualified
c) MIC33M350YMP-TRVAO:
Extended Temperature,
24-Lead QFN package,
Tape and Reel,
Junction
Temperature
Range:
Y
= -40C to +125C (Extended)
Automotive Qualified
Package:
MP = QFN (Plastic Quad Flat, No Lead Package)
Blank = Tube
Tape and
Reel Option: TR = Tape and Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not printed
on the device package. Check with your
Microchip Sales Office for package availability
with the Tape and Reel option.
Qualification: Blank = Tube
VAO = AEC-Q104 Automotive Qualification
Vxx = AEC-Q104 Automotive Qualification; custom device,
additional terms or conditions may apply.
2020-2021 Microchip Technology Inc.
DS20006348B-page 29
MIC33M350
NOTES:
DS20006348B-page 30
2020-2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
•
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Infor-
mation regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NON-
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-
Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-
RECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUEN-
TIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life sup-
port and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP,
INICnet, Intelligent Paralleling, Inter-Chip Connectivity,
JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi,
MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK,
NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O,
simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020-2021, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
ISBN: 978-1-5224-7800-3
2020-2021 Microchip Technology Inc.
DS20006348B-page 31
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DS20006348B-page 32
2020-2021 Microchip Technology Inc.
02/28/20
相关型号：
MIC33M350YMP-VAO
3A, Pin Strapping Power Module with HyperLight Load® Mode and Output Voltage Select
MICROCHIP
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