APT50GT120JU2 [MICROSEMI]

Boost chopper Trench + Field Stop IGBT; 升压斩波沟道+场截止IGBT
APT50GT120JU2
型号: APT50GT120JU2
厂家: Microsemi    Microsemi
描述:

Boost chopper Trench + Field Stop IGBT
升压斩波沟道+场截止IGBT

双极性晶体管
文件: 总7页 (文件大小:506K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APT50GT120JU2  
ISOTOP
®
Boost chopper  
VCES = 1200V  
Trench + Field Stop IGBT®  
IC = 50A @ Tc = 80°C  
K
Application  
AC and DC motor control  
Switched Mode Power Supplies  
Power Factor Correction  
Brake switch  
C
Features  
G
Trench + Field Stop IGBT® Technology  
-
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery parallel diodes  
Low diode VF  
E
Low leakage current  
Avalanche energy rated  
RBSOA and SCSOA rated  
ISOTOP® Package (SOT-227)  
Very low stray inductance  
High level of integration  
K
E
Benefits  
Low conduction losses  
C
G
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
RoHS Compliant  
ISOTOP  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
IC1  
IC2  
Collector - Emitter Breakdown Voltage  
1200  
75  
50  
100  
±20  
347  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
V
W
Maximum Power Dissipation  
TC = 25°C  
IFAV  
IFRMS  
Maximum Average Forward Current  
RMS Forward Current (Square wave, 50% duty)  
Duty cycle=0.5 TC = 80°C  
27  
34  
A
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.  
1 - 7  
www.microsemi.com  
APT50GT120JU2  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 1200V  
5
2.1  
mA  
Tj = 25°C  
Tj = 125°C  
1.4  
5.0  
1.7  
2.0  
VGE =15V  
VCE(sat) Collector Emitter saturation Voltage  
V
IC = 50A  
VGE(th) Gate Threshold Voltage  
IGES  
VGE = VCE, IC = 2mA  
6.5  
500  
V
nA  
Gate – Emitter Leakage Current  
VGE = ±20V, VCE = 0V  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
VGE = 0V  
VCE = 25V  
f = 1MHz  
3600  
pF  
Output Capacitance  
188  
163  
85  
Reverse Transfer Capacitance  
Resistive Switching (25°C)  
VGE = 15V  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Tf Fall Time  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
30  
420  
65  
ns  
VBus = 600V  
IC = 50A  
RG = 18  
Inductive Switching (125°C)  
90  
VGE = 15V  
45  
520  
90  
ns  
VBus = 600V  
IC = 50A  
Tf  
Eon  
Eoff  
Fall Time  
Turn-on Switching Energy  
Turn-off Switching Energy  
RG = 18Ω  
6.6  
5.8  
mJ  
2 - 7  
www.microsemi.com  
APT50GT120JU2  
Chopper diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
IF = 30A  
2.0  
2.3  
1.8  
2.5  
VF  
Diode Forward Voltage  
V
IF = 60A  
IF = 30A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
VR = 1200V  
VR = 1200V  
VR = 200V  
IF=1A,VR=30V  
di/dt =100A/µs  
250  
500  
IRM  
CT  
Maximum Reverse Leakage Current  
Junction Capacitance  
µA  
pF  
32  
31  
Reverse Recovery Time  
Tj = 25°C  
trr  
ns  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
370  
500  
5
Reverse Recovery Time  
IF = 30A  
IRRM  
Qrr  
Maximum Reverse Recovery Current  
A
VR = 800V  
di/dt =200A/µs  
12  
660  
3450  
Reverse Recovery Charge  
nC  
Tj = 125°C  
trr  
Qrr  
IRRM  
Reverse Recovery Time  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
220  
4650  
37  
ns  
nC  
A
IF = 30A  
VR = 800V  
di/dt =1000A/µs  
Tj = 125°C  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.36  
RthJC  
Junction to Case Thermal Resistance  
Junction to Ambient (IGBT & Diode)  
°C/W  
1.1  
20  
RthJA  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
VISOL  
2500  
-55  
V
TJ,TSTG Storage Temperature Range  
150  
300  
1.5  
°C  
TL  
Max Lead Temp for Soldering:0.063” from case for 10 sec  
Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)  
N.m  
g
Wt  
Package Weight  
29.2  
Typical IGBT Performance Curve  
Operating Frequency vs Collector Current  
60  
VCE=600V  
D=50%  
RG=18  
50  
40  
TJ=125°C  
30  
20  
10  
0
0
10 20 30 40 50 60 70 80  
IC (A)  
3 - 7  
www.microsemi.com  
APT50GT120JU2  
Output Characteristics (VGE=15V)  
Output Characteristics  
100  
75  
50  
25  
0
100  
75  
50  
25  
0
TJ = 125°C  
TJ=25°C  
VGE=17V  
VGE=13V  
VGE=15V  
VGE=9V  
TJ=125°C  
0
1
2
3
4
0
1
2
CE (V)  
3
4
VCE (V)  
V
Energy losses vs Collector Current  
Transfert Characteristics  
100  
75  
50  
25  
0
20  
16  
12  
8
VCE = 600V  
Eon  
TJ=25°C  
VGE = 15V  
TJ=125°C  
RG = 18  
TJ = 125°C  
Eoff  
4
0
0
25  
50  
75  
100  
5
6
7
8
9
10  
11  
12  
I
C (A)  
VGE (V)  
Switching Energy Losses vs Gate Resistance  
Reverse Safe Operating Area  
12  
120  
100  
80  
60  
40  
20  
0
Eon  
VCE = 600V  
GE =15V  
IC = 50A  
TJ = 125°C  
10  
8
V
Eoff  
6
4
VGE=15V  
TJ=125°C  
RG=18 Ω  
2
0
5
10  
15  
20  
25  
30  
0
400  
800  
VCE (V)  
1200  
1600  
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Pulse Duration  
0.4  
IGBT  
0.35  
0.3  
0.9  
0.7  
0.25  
0.2  
0.5  
0.3  
0.15  
0.1  
0.1  
0.05  
0.05  
0
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 7  
www.microsemi.com  
APT50GT120JU2  
Typical Diode Performance Curve  
5 - 7  
www.microsemi.com  
APT50GT120JU2  
6 - 7  
www.microsemi.com  
APT50GT120JU2  
SOT-227 (ISOTOP®) Package Outline  
11.8 (.463)  
12.2 (.480)  
31.5 (1.240)  
31.7 (1.248)  
8.9 (.350)  
9.6 (.378)  
W=4.1 (.161)  
W=4.3 (.169)  
H=4.8 (.187)  
H=4.9 (.193)  
(4 places)  
7.8 (.307)  
8.2 (.322)  
Hex Nut M4  
(4 places)  
25.2 (0.992)  
r = 4.0 (.157)  
(2 places)  
25.4 (1.000)  
4.0 (.157)  
4.2 (.165)  
(2 places)  
0.75 (.030) 12.6 (.496)  
0.85 (.033) 12.8 (.504)  
3.3 (.129)  
3.6 (.143)  
1.95 (.077)  
2.14 (.084)  
14.9 (.587)  
15.1 (.594)  
Collector  
Cathode  
30.1 (1.185)  
30.3 (1.193)  
38.0 (1.496)  
38.2 (1.504)  
Emitter  
Dimensions in Millimeters and (Inches)  
Gate  
ISOTOP® is a registered trademark of ST Microelectronics NV  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
7 - 7  
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