APT50M75JLLU2_06 [MICROSEMI]
Boost chopper MOSFET Power Module; 升压斩波MOSFET功率模块型号: | APT50M75JLLU2_06 |
厂家: | Microsemi |
描述: | Boost chopper MOSFET Power Module |
文件: | 总8页 (文件大小:493K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
APT50M75JLLU2
VDSS = 500V
ISOTOP® Boost chopper
RDSon = 75mΩ max @ Tj = 25°C
MOSFET Power Module
ID = 51A @ Tc = 25°C
K
Application
•
•
•
•
AC and DC motor control
Switched Mode Power Supplies
Power Factor Correction
Brake switch
D
Features
•
Power MOS 7® MOSFETs
-
-
-
-
-
-
Low RDSon
G
Low input and Miller capacitance
Low gate charge
Fast intrinsic reverse diode
Avalanche energy rated
Very rugged
S
•
•
•
ISOTOP® Package (SOT-227)
Very low stray inductance
High level of integration
K
S
Benefits
•
•
•
•
•
•
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Very rugged
D
Low profile
RoHS Compliant
ISOTOP
Absolute maximum ratings
Symbol
Parameter
Max ratings
Unit
VDSS
Drain - Source Breakdown Voltage
500
V
Tc = 25°C
Tc = 80°C
51
39
204
±30
75
ID
Continuous Drain Current
A
IDM
VGS
RDSon
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
V
mΩ
W
PD
IAR
EAR
EAS
IFAV
IFRMS
Maximum Power Dissipation
Tc = 25°C
Tc = 80°C
290
Avalanche current (repetitive and non repetitive)
51
50
A
Repetitive Avalanche Energy
mJ
Single Pulse Avalanche Energy
2500
30
Maximum Average Forward Current
Duty cycle=0.5
A
RMS Forward Current (Square wave, 50% duty)
39
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
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APT50M75JLLU2
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
Test Conditions
Min Typ Max Unit
VGS = 0V,VDS = 500V Tj = 25°C
100
500
75
5
±100
IDSS
Zero Gate Voltage Drain Current
µA
VGS = 0V,VDS = 400V Tj = 125°C
RDS(on) Drain – Source on Resistance
VGS(th) Gate Threshold Voltage
IGS S
VGS = 10V, ID = 25.5A
mΩ
V
nA
VGS = VDS, ID = 1mA
3
Gate – Source Leakage Current
VGS = ±20 V, VDS = 0V
Dynamic Characteristics
Symbol Characteristic
Test Conditions
Min Typ Max Unit
Ciss
Coss
Crss
Input Capacitance
5590
VGS = 0V
VDS = 25V
f = 1MHz
pF
Output Capacitance
1180
85
Reverse Transfer Capacitance
Qg
Qgs
Qgd
Total gate Charge
123
33
65
10
20
21
5
VGS = 10V
VBus = 250V
ID = 51A
nC
Gate – Source Charge
Gate – Drain Charge
Td(on) Turn-on Delay Time
Tr Rise Time
Td(off) Turn-off Delay Time
Resistive Switching
VGS = 15V
VBus = 250V
ID = 51A
ns
RG = 0.6Ω
Tf
Fall Time
Inductive switching @ 25°C
VGS = 15V, VBus = 330V
ID = 51A, RG = 5Ω
Inductive switching @ 125°C
VGS = 15V, VBus = 330V
ID = 51A, RG = 5Ω
Eon
Eoff
Eon
Eoff
Turn-on Switching Energy
Turn-off Switching Energy
Turn-on Switching Energy
Turn-off Switching Energy
755
726
µJ
µJ
1241
846
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APT50M75JLLU2
Chopper diode ratings and characteristics
Symbol Characteristic
Test Conditions
Min Typ Max Unit
IF = 30A
1.6
1.9
1.4
1.8
VF
Diode Forward Voltage
V
IF = 60A
IF = 30A
Tj = 125°C
Tj = 25°C
Tj = 125°C
VR = 600V
VR = 600V
VR = 200V
IF=1A,VR=30V
di/dt =100A/µs
250
500
IRM
CT
Maximum Reverse Leakage Current
Junction Capacitance
µA
pF
44
23
Reverse Recovery Time
Tj = 25°C
trr
ns
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
85
160
4
Reverse Recovery Time
IF = 30A
IRRM
Qrr
Maximum Reverse Recovery Current
A
VR = 400V
di/dt =200A/µs
8
130
700
Reverse Recovery Charge
nC
Tj = 125°C
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
70
1300
30
ns
nC
A
IF = 30A
VR = 400V
di/dt =1000A/µs
Tj = 125°C
Thermal and package characteristics
Symbol Characteristic
Min Typ Max Unit
MOSFET
Diode
0.27
RthJC
Junction to Case Thermal Resistance
Junction to Ambient (IGBT & Diode)
°C/W
1.21
20
RthJA
VISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500
-55
V
TJ,TSTG Storage Temperature Range
150
300
1.5
°C
TL
Max Lead Temp for Soldering:0.063” from case for 10 sec
Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
N.m
g
Wt
Package Weight
29.2
Typical MOSFET Performance Curve
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APT50M75JLLU2
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APT50M75JLLU2
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APT50M75JLLU2
Typical Diode Performance Curve
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APT50M75JLLU2
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APT50M75JLLU2
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
31.5 (1.240)
31.7 (1.248)
8.9 (.350)
9.6 (.378)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
7.8 (.307)
8.2 (.322)
Hex Nut M4
(4 places)
25.2 (0.992)
r = 4.0 (.157)
(2 places)
25.4 (1.000)
4.0 (.157)
4.2 (.165)
(2 places)
0.75 (.030) 12.6 (.496)
0.85 (.033) 12.8 (.504)
3.3 (.129)
3.6 (.143)
1.95 (.077)
2.14 (.084)
14.9 (.587)
15.1 (.594)
Drain
Cathode
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
Source
Dimensions in Millimeters and (Inches)
Gate
ISOTOP® is a registered trademark of ST Microelectronics NV
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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