APTDF100H1201G [MICROSEMI]

Fast Diode Full Bridge Power Module; 快速二极管全桥电源模块
APTDF100H1201G
型号: APTDF100H1201G
厂家: Microsemi    Microsemi
描述:

Fast Diode Full Bridge Power Module
快速二极管全桥电源模块

电源电路 整流二极管 桥式整流二极管 局域网
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中文:  中文翻译
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APTDF100H1201G  
VRRM = 1200V  
Fast Diode Full Bridge  
Power Module  
IC = 100A @ Tc = 60°C  
3
4
Application  
Uninterruptible Power Supply (UPS)  
Induction heating  
CR1  
CR3  
CR4  
Welding equipment  
5
6
1
2
High speed rectifiers  
Features  
CR2  
7
Ultra fast recovery times  
Soft recovery characteristics  
High blocking voltage  
High current  
Low leakage current  
Very low stray inductance  
High level of integration  
8
9 10  
Benefits  
Outstanding performance at high frequency  
operation  
Low losses  
Low noise switching  
Solderable terminals for easy PCB mounting  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
RoHS Compliant  
All multiple inputs and outputs must be shorted together  
3/4 ; 5/6 ; 7/8 ; 1/2 ; 9/10  
Absolute maximum ratings  
Symbol  
VR  
Parameter  
Maximum DC reverse Voltage  
Max ratings  
Unit  
1200  
V
VRRM  
Maximum Peak Repetitive Reverse Voltage  
TC = 25°C  
TC = 60°C  
TC = 45°C  
120  
100  
500  
Maximum Average Forward  
IF(AV)  
IFSM  
Duty cycle = 50%  
Current  
A
Non-Repetitive Forward Surge Current  
8.3ms  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 4  
www.microsemi.com  
APTDF100H1201G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
IF = 100A  
Min Typ Max Unit  
2.4  
2.7  
1.8  
3
VF  
Diode Forward Voltage  
IF = 150A  
V
IF = 100A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
100  
500  
IRM  
CT  
Maximum Reverse Leakage Current  
Junction Capacitance  
VR = 1200V  
VR = 200V  
µA  
pF  
110  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min  
Typ  
Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
385  
480  
1055  
5240  
6
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
ns  
IF = 100A  
VR = 800V  
Qrr  
nC  
A
di/dt = 200A/µs  
IRRM  
19  
trr  
Qrr  
IRRM  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
210  
9.4  
70  
ns  
µC  
A
IF = 100A  
VR = 800V  
Tj = 125°C  
di/dt=1000A/µs  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
RthJC  
Junction to Case Thermal Resistance  
0.55 °C/W  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
2500  
-40  
-40  
-40  
2.5  
V
TJ  
175  
125  
100  
4.7  
80  
°C  
TSTG  
TC  
Operating Case Temperature  
Torque Mounting torque  
To heatsink  
M4  
N.m  
g
Wt  
Package Weight  
2 - 4  
www.microsemi.com  
APTDF100H1201G  
Typical Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.9  
0.7  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Forward Current vs Forward Voltage  
Trr vs. Current Rate of Charge  
300  
250  
200  
150  
100  
50  
600  
500  
400  
300  
200  
100  
0
TJ=125°C  
VR=800V  
150 A  
TJ=125°C  
100 A  
TJ=25°C  
50 A  
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5  
0
200 400 600 800 1000 1200  
VF, Anode to Cathode Voltage (V)  
-diF/dt (A/µs)  
IRRM vs. Current Rate of Charge  
QRR vs. Current Rate Charge  
12  
10  
8
80  
70  
60  
50  
40  
30  
20  
10  
TJ=125°C  
TJ=125°C  
VR=800V  
VR=800V  
100 A  
50 A  
150 A  
150 A  
100 A  
50 A  
6
4
2
0
200 400 600 800 1000 1200  
0
200 400 600 800 1000 1200  
-diF/dt (A/µs)  
-diF/dt (A/µs)  
Capacitance vs. Reverse Voltage  
Max. Average Forward Current vs. Case Temp.  
800  
120  
Duty Cycle = 0.5  
TJ=175°C  
100  
600  
400  
200  
0
80  
60  
40  
20  
0
25  
50  
75  
100 125 150 175  
1
10  
100  
1000  
VR, Reverse Voltage (V)  
Case Temperature (ºC)  
3 - 4  
www.microsemi.com  
APTDF100H1201G  
SP1 Package outline (dimensions in mm)  
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
4 - 4  
www.microsemi.com  

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