APTGF330SK60D3G [MICROSEMI]

Buck Chopper NPT IGBT Power Module; 降压斩波NPT IGBT功率模块
APTGF330SK60D3G
型号: APTGF330SK60D3G
厂家: Microsemi    Microsemi
描述:

Buck Chopper NPT IGBT Power Module
降压斩波NPT IGBT功率模块

双极性晶体管
文件: 总5页 (文件大小:212K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APTGF330SK60D3G  
VCES = 600V  
IC = 330A @ Tc = 80°C  
Buck Chopper  
NPT IGBT Power Module  
Application  
AC and DC motor control  
3
Q1  
Switched Mode Power Supplies  
4
Features  
Non Punch Through (NPT) FAST IGBT  
- Low voltage drop  
5
1
- Low tail current  
- Switching frequency up to 50 kHz  
- Soft recovery parallel diodes  
- Low diode VF  
2
- Low leakage current  
- RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
High level of integration  
M6 power connectors  
Benefits  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
600  
520  
330  
800  
±20  
1560  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
800A @ 520V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
See application note APT0502 on www.microsemi.com  
1 - 5  
www.microsemi.com  
APTGF330SK60D3G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 600V  
500  
1.95 2.45  
2.2  
µA  
Tj = 25°C  
V
GE = 15V  
VCE(sat) Collector Emitter saturation Voltage  
VGE(th) Gate Threshold Voltage  
V
IC = 400A  
Tj = 125°C  
VGE = VCE , IC = 7.5 mA  
VGE = 20V, VCE = 0V  
5.0  
5.8  
6.5  
V
nA  
1200  
IGES  
Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
VGE = 0V ; VCE = 25V  
f = 1MHz  
Min Typ Max Unit  
Cies  
Cres  
Input Capacitance  
Reverse Transfer Capacitance  
18  
nF  
1.6  
VGE=15V, IC=400A  
VCE=300V  
QG  
Gate charge  
1.3  
µC  
Inductive Switching (25°C)  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
150  
72  
V
GE = ±15V  
ns  
VBus = 300V  
IC = 400A  
RG = 8Ω  
Inductive Switching (125°C)  
VGE = ±15V  
Td(off) Turn-off Delay Time  
530  
Tf  
Td(on)  
Tr  
Fall Time  
40  
160  
75  
Turn-on Delay Time  
Rise Time  
ns  
V
Bus = 300V  
Td(off) Turn-off Delay Time  
550  
50  
IC = 400A  
RG = 8Ω  
Tf  
Fall Time  
V
GE = ±15V  
Eon  
Turn on Energy  
Tj = 125°C  
Tj = 125°C  
18  
17  
VBus = 300V  
IC = 400A  
RG = 8Ω  
mJ  
A
Eoff  
Isc  
Turn off Energy  
Short Circuit data  
V
GE 15V ; VBus = 360V  
1800  
tp 10µs ; Tj = 125°C  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRRM  
IF  
600  
V
µA  
A
Tj = 25°C  
750  
1000  
VR = 600V  
Tj = 125°C  
Tc = 80°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
400  
1.25  
1.2  
150  
250  
27  
44  
5.6  
9.2  
IF = 400A  
VGE = 0V  
1.6  
VF  
Diode Forward Voltage  
V
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
ns  
µC  
mJ  
IF = 400A  
VR = 300V  
di/dt =4400A/µs  
Qrr  
Err  
2 - 5  
www.microsemi.com  
APTGF330SK60D3G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.08  
0.15  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
V
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
2500  
-40  
-40  
-40  
3
150  
125  
125  
5
5
350  
°C  
Operating Case Temperature  
For terminals  
To Heatsink  
M6  
M6  
Torque Mounting torque  
N.m  
g
3
Wt  
Package Weight  
D3 Package outline (dimensions in mm)  
1°  
A
DÉTAIL A  
3 - 5  
www.microsemi.com  
APTGF330SK60D3G  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
Output Characteristics  
800  
800  
600  
400  
200  
0
TJ = 125°C  
VGE=15V  
TJ=25°C  
600  
VGE=20V  
VGE=12V  
TJ=125°C  
400  
200  
0
VGE=9V  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
0
1
2
3
4
5
VCE (V)  
V
CE (V)  
Energy losses vs Collector Current  
Transfert Characteristics  
800  
600  
400  
200  
0
40  
30  
20  
10  
0
VCE = 300V  
GE = 15V  
G = 8  
TJ = 125°C  
Eon  
V
R
Eoff  
Err  
TJ=125°C  
TJ=25°C  
0
200  
400  
600  
800  
5
6
7
8
9
10  
11  
12  
I
C (A)  
V
GE (V)  
Switching Energy Losses vs Gate Resistance  
Reverse Safe Operating Area  
50  
1000  
800  
600  
400  
200  
0
VCE = 300V  
Eon  
V
GE =15V  
C = 400A  
TJ = 125°C  
40  
30  
20  
10  
0
I
Eoff  
Err  
VGE=15V  
TJ=125°C  
RG=8 Ω  
0
100 200 300 400 500 600  
CE (V)  
0
10  
20  
30  
40  
V
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Pulse Duration  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.9  
0.7  
IGBT  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 5  
www.microsemi.com  
APTGF330SK60D3G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
70  
60  
50  
40  
30  
20  
10  
0
800  
VCE=300V  
D=50%  
RG=8  
600  
ZVS  
TJ=125°C  
TC=75°C  
400  
TJ=125°C  
ZCS  
hard  
switching  
200  
TJ=25°C  
0
0
0.3  
0.6  
0.9  
F (V)  
1.2  
1.5  
0
100  
200  
IC (A)  
300  
400  
500  
V
maximum Effective Transient Thermal Impedance, Junction to Pulse Duration  
0.1  
0.08  
0.06  
0.04  
0.02  
0
Diode  
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103  
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 - 5  
www.microsemi.com  

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