H33N-008-210-AGGE [MITSUMI]
microSD card connectors; microSD卡连接器
| 型号： | H33N-008-210-AGGE |
| 厂家： | 
MITSUMI ELECTRONICS, CORP. |
| 描述： | microSD card connectors |
| 文件： | 总2页 (文件大小：111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MITSUMI
microSD card connectors
CIM-H33N
Connectors
FEATURES
1. Hinge machanism type
2. Small and tin design
3. Prevents from losing card by attaching a card
to the plate at card attachment and removal.
4. Card attachment and removal is easy by plate
opening with spring force.
5. Contact slide on card pad at card setting with
self-cleaning mechanism.
6. ESD countermeasure is possible at card
attachment.
HOW TO ORDER
H33N-008-21 0 - A G G E
1
2
3
4
5
6
7 8
1 Series No. (H33N : Nomal type)
2 No. of contacts (008 : 8pins)
3 Housing material (21 : LCP resin)
4 Housing UL grade (0 : UL94V-0)
5 Contact plating (A : Gold)
6 Contact plating thickness (G : 3µm)
7 Contact read style (G : Angle SMT)
8 Package (E : Taping)
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
Rated Voltage
AC 50V (rms)
0.5A
Rated Current
Withstanding Voltage
Insulation Resistance
Contact Resistance
500V AC (rms) 1minute
1000MΩ min. (Initial value)
100mΩ max. (Initial value)
MECHANICAL CHARACTERISTICS
Life (Matching Cycle)
10,000times
Using Temperature Range
-25~+85°C
MITSUMI
microSD card connectors
MATERIAL & FINISH
Component Parts
Housing
Material
LCP resin
Copper Alloy
SUS
Finish
(Black)
Gold plating
Contact
Plate
-
Lock Spring
Wing
Copper Alloy
Copper Alloy
SUS
Gold plating
Gold plating
Shaft
-
-
Torsion Spring
SUS
DIMENSIONS
14
0.55
0.25
2.15
#1
#8
0.3
1.1
7.7
1.9
2.15
0.55
13.75
0.55
Slide lock
Slide unlock
Recommended PWB layout
1.7
10.1
1.65
9.625
OPE.1
Card insert
0.5
Note
[For GND]
OPE.2
Plate close
1.7
OPE.3
Plate slide
0.9
1.1
1.3
1.7
OPE.4
Slide lock position
7.7
10.76
1.7
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