0015800183 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路18
0015800183
元器件型号: 0015800183
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路18

PDF文件: 总7页 (文件大小:1222K)
下载文档:  下载PDF数据表文档文件
型号参数:0015800183参数

0015800183_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800185

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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20 MOLEX

0015800185_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800187

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating

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10 MOLEX

0015800187_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800189

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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8 MOLEX

0015800189_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800201

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

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4 MOLEX

0015800201_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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-
0 MOLEX1

0015800203

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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-
9 MOLEX

0015800203_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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-
0 MOLEX1

0015800205

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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-
8 MOLEX

0015800205_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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-
0 MOLEX1

0015800207

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

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14 MOLEX

0015800207_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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-
0 MOLEX1