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0015800283 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路， 0.38μm （ 15μ ），金（Au ）选择性电镀

0015800283


元器件型号：	0015800283
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路， 0.38μm （ 15μ ），金（Au ）选择性电镀
PDF文件：	总7页 (文件大小：1222K)
下载文档：	下载PDF数据表文档文件
型号参数：0015800283参数

0015800283_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800285

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

0015800289

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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19 MOLEX

0015800289_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800301

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

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8 MOLEX

0015800301_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800303

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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6 MOLEX

0015800303_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800305

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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12 MOLEX

0015800305_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800307

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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8 MOLEX

0015-80-0307

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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21 MOLEX

001580-0307

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

0015800307-ND

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

0015800309

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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10 MOLEX

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