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0878345045 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating; 2.54毫米（ .100 ）间距C- Grid®头，双排，低调，垂直，通孔，罩，无铅， 50电路， 0.13微米（ 5μ ），金（Au ）选择性电镀

0878345045


元器件型号：	0878345045
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating 2.54毫米（ .100 ）间距C- Grid®头，双排，低调，垂直，通孔，罩，无铅， 50电路， 0.13微米（ 5μ ），金（Au ）选择性电镀
PDF文件：	总3页 (文件大小：124K)
下载文档：	下载PDF数据表文档文件
型号参数：0878345045参数

0878345095

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

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6 MOLEX

0878346011

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 60 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

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7 MOLEX

0878346021

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

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6 MOLEX

0878346041

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

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11 MOLEX

0878350842

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

0878351042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

0878351043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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5 MOLEX

0878351242

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

0878351442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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9 MOLEX

0878351642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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12 MOLEX

0878351643

2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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8 MOLEX

0878352042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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10 MOLEX

0878352043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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9 MOLEX

0878352442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

0878352642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

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