MC10H125L [MOTOROLA]
Quad MECL-to-TTL Translator; 四MECL至TTL转换器
| 型号： | MC10H125L |
| 厂家： | 
MOTOROLA |
| 描述： | Quad MECL-to-TTL Translator |
| 文件： | 总4页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H125 is a quad translator for interfacing data and control signals
between the MECL section and saturated logic section of digital systems. The
10H part is a functional/pinout duplication of the standard MECL 10K family
part, with 100% improvement in propagation delay, and no increase in
power–supply current.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
Outputs of unused translators will go to low state when their inputs are left
open.
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
•
•
Propagation Delay, 2.5 ns Typical
Improved Noise Margin 150 mV
•
•
Voltage Compensated
MECL 10K–Compatible
(Over Operating Voltage and Temperature Range)
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Characteristic
Symbol
Rating
–8.0 to 0
0 to +7.0
Unit
Vdc
Vdc
Vdc
°C
Power Supply (V
Power Supply (V
Input Voltage (V
= 5.0 V)
V
CC
EE
EE
= –5.2 V)
= 5.0 V)
V
CC
V
I
0 to V
EE
CC
LOGIC DIAGRAM
Operating Temperature Range
T
A
0 to +75
Storage Temperature Range — Plastic
— Ceramic
T
–55 to +150
–55 to +165
°C
°C
stg
2
3
4
ELECTRICAL CHARACTERISTICS (V
(See Note)
= –5.2 V ±5%; V
= 5.0 V ± 5.0 %)
EE
CC
6
7
5
0°
25°
75°
Characteristic
Symbol
Min
Max
Min
Max
40
Min
Max
Unit
10
11
I
—
44
—
—
44
mA
12
Negative Power
Supply Drain
Current
E
14
15
13
1
I
—
—
—
63
40
—
—
—
63
40
—
—
—
63
40
mA
mA
µA
Positive Power Supply
Drain Current
CCH
I
CCL
I
225
145
145
Input Current
V
*
inH
BB
I
—
1.5
—
—
1.0
—
—
1.0
—
µA
Input Leakage Current
CBO
GND = PIN 16
( +5.0 VDC)= PIN 9
( –5.2 VDC) = PIN 8
V
2.5
2.5
2.5
Vdc
High Output Voltage
OH
V
V
CC
EE
I
= –1.0 mA
OH
Low Output Voltage
= +20 mA
V
—
0.5
—
0.5
—
0.5
Vdc
OL
*V
to be used to supply bias to the MC10H125
only and bypassed (when used) with 0.01 µF to
BB
I
OL
0.1 µF capacitor to ground (0 V). V
< 1.0 mA.
can source
V
–1.17
–1.95
60
–0.84
–1.48
150
–1.13
–1.95
60
–0.81
–1.48
150
–1.07
–1.95
50
–0.735
–1.45
150
Vdc
Vdc
mA
Vdc
V
High Input Voltage(1)
Low Input Voltage(1)
Short Circuit Current
Reference Voltage
BB
IH
V
IL
I
OS
DIP
V
–1.38
—
–1.27
—
–1.35
–1.25
–1.31
–1.19
BB
PIN ASSIGNMENT
V
–2.85 to +0.3
Common Mode
Range (3)
CMR
V
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Typical
BB
V
150
mV
Input Sensitivity (4)
PP
D
A
IN
IN
AC PARAMETERS
Propagation Delay
Rise Time(5)
D
A
IN
IN
t
0.8
0.3
0.3
3.3
1.2
1.2
0.85
0.3
3.35
0.9
0.3
0.3
3.4
1.2
1.2
ns
ns
ns
pd
t
1.2
1.2
D
A
B
r
OUT
OUT
t
f
0.3
Fall Time(5)
C
OUT
OUT
NOTES:
1. When V
is used as the reference voltage.
BB
C
B
IN
IN
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained.
C
B
IN
IN
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
differential input required to obtain full logic swing on output.
V
V
p–p
5. 1.0 V to 2.0 V w/25 pF into 500
EE
CC
.
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
9/96
Motorola, Inc. 1996
REV 6
MC10H125
APPLICATION INFORMATION
The MC10H125 incorporates differential inputs and
output level is achieved with a minimum input level of 150
Schottky TTL “totem pole” outputs. Differential inputs
allow for use as an inverting/non–inverting translator or
mV
.
p–p
An advantage of this device is that MECL–level
as a differential line receiver. The V
reference voltage
information can be received, via balanced twisted pair
lines, intheTTLequipment. ThisisolatestheMECL–logic
from the noisy TTL environment. Power supply
requirements are ground, +5.0 volts and –5.2 volts.
BB
is available on Pin 1 for use in single–ended input biasing.
The outputs of the MC10H125 go to a low–logic level
whenever the inputs are left floating, and a high–logic
MOTOROLA
2–30
MC10H125
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–31
MOTOROLA
MC10H125
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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MC10H125/D
◊
相关型号：
MC10H125MNG
QUAD TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, QCC16, 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, QFN-16
ONSEMI
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