MRFIC1813R2 [MOTOROLA]
1700 MHz - 2500 MHz RF/MICROWAVE UP CONVERTER, PLASTIC, TSSOP-16;
| 型号： | MRFIC1813R2 |
| 厂家： | 
MOTOROLA |
| 描述： | 1700 MHz - 2500 MHz RF/MICROWAVE UP CONVERTER, PLASTIC, TSSOP-16 射频 微波 |
| 文件： | 总6页 (文件大小：125K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M O T OR O LA
SEMICONDUCTOR TECHNICAL DATA
The MRFIC Line
M
R
F
I
C
1
8
1
3
1
.
9
G
H
z
G
a
A
s
Up co nv e r t er
Designed primarily for use in wireless Personal Communication Systems
(PCS) applications such as Digital European Cordless Telephone (DECT),
Japan’s Personal Handy System (PHS) and the emerging North American
systems. The MRFIC1813 is also applicable to 2.4 GHz ISM equipment. The
device combines a balanced upmixer and a transmit exciter amplifier in a
low-cost TSSOP–16 package. Minimal off-chip matching is required while
allowing for maximum flexibility and efficiency. The mixer is optimized for
low–side injection and provides more than 12 dB of conversion gain with over 0
dBm output at 1 dB gain compression. Image filtering is implemented off-chip to
allow maximum flexibility. A CMOS compatible ENABLE pin allows standby
operation where the current drain is less than 250 mA.
1.9 GHz UPMIXER AND
EXCITER AMPLIFIER
Together with other devices from the MRFIC180X or the MRFIC240X series,
this GaAs IC family offers the complete transmit and receive functions, less LO
and filters, needed for a typical 1.8 GHz cordless telephone or 2.4 GHz ISM
band equipment.
CASE 948C–03
(TSSOP–16)
•
•
•
Usable Frequency Range = 1.7 to 2.5 GHz
15 dB Typ IF to RF Conversion Gain
3 dBm Power Output Typ, 0 dBm Minimum at 1 dB Gain Com-
pression
•
•
•
•
•
•
Simple Off-chip Matching for Maximum Flexibility
Low Power Consumption = 75 mW (Typ)
Single Bias Supply = 2.7 to 4.5 Volts
Low LO Power Requirement = – 5 dBm (Typ)
Low Cost Surface Mount Plastic Package
Order MRFIC1813R2 for Tape and Reel.
R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel.
•
Device Marking = M1813
V
1
2
3
4
5
6
7
T
X
E
N
A
B
L
E
1
6
D
D
1
N
/
C
1
5
N
/
C
I
F
I
N
1
4
N
/
C
G
N
D
1
1
3
2
G
V
N
D
L
O
I
N
D
D
3
M
I
X
E
R
G
N
D
G
N
D
1
1
N
/
C
R
F
O
U
T
1
0
V
D D 2
N
/
C
8
9
E
X
C
I
T
E
R
Pin Connections and Functional Block Diagram
REV 2
MRFIC1813
2.2–30
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Ratings
Supply Voltage
Symbol
, V , V
DD3
Limit
Unit
Vdc
dBm
dBm
Vdc
°C
V
DD1
5.5
DD2
IF Input Power
P
IF
3
3
LO Input Power
P
LO
Enable Voltage
TX ENABLE
5.5
Storage Temperature Range
Operating Ambient Temperature
T
stg
– 65 to +150
– 30 to +85
T
A
°C
RECOMMENDED OPERATING RANGES
Parameter
Symbol
Value
Unit
GHz
GHz
MHz
Vdc
Vdc
Vdc
RF Output Frequency
LO Input Frequency
f
RF
f
LO
1.7 to 2.5
1.5 to 2.4
70 to 350
2.7 to 4.5
IF Input Frequency
f
IF
Supply Voltage
V
DD
TX Enable Voltage, ON
TX Enable Voltage, OFF
TX ENABLE
TX ENABLE
2.7 to V
DD
0 to 0.2
ELECTRICAL CHARACTERISTICS (V
TX ENABLE= 3 V, T = 25°C, f = 1.65 GHz @ – 5 dBm, f = 250 MHz
A LO IF
DD1,2,3,
@ –15 dBm)
Min
12
0
Typ
15
3
Max
—
Unit
dB
Characteristic
IF to RF Small Signal Conversion Gain (P = –35 dBm)
RF
RF Output 1 dB Gain Compression
RF Output 3rd Order Intercept
LO Feedthrough to RF Port
—
dBm
dBm
dBm
dB
—
—
—
—
—
—
—
11
—
–15
11
–10
—
Noise Figure
Lower Sideband Output Power at RF Port
Supply Current TX Mode
–10
25
100
3
–6
dBm
mA
35
Supply Current Standby Mode (TX ENABLE = 0 V, LO Off)
TX Enable Current
250
—
mA
mA
V
T
X
E
N
A
B
L
E
D
D
1
1
2
3
4
5
6
7
8
1
1
6
5
C
2
C
5
L1
1
R
1
4
I
F
I
N
1
3
C
1
L
O
I
N
V
D D 3
1
2
T
2
1
1
M
I
X
E
R
C
4
C
6
R
F
O
U
T
1
0
9
E
X
C
I
T
E
R
V
D
D
2
T
1
C
3
IF Frequency
110 MHz
250 MHz
L1
C5
C1, C2, C3, C4 15 pF
180 nH 12 pF
68 nH
39 nH
C6
1 µF
5.6 pF
3.9 pF
R1
300 Ω
350 MHz
T1, T2
MICROSTRIP, Z = 73 Ω, θ = 29° @ 1.9 GHz
0
BOARD MATERIAL – GLASS/EPOXY, ε = 4.45,
r
DIELECTRIC THICKNESS = 0.018 INCH
Figure 1. Applications Circuit Configuration
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
MRFIC1813
2.2–31
1
1
1
1
1
1
1
8
7
6
5
4
3
2
1
1
1
1
1
8
6
4
2
0
2 5°C
V
=
3
V
d
c
D
D
8
5
°
C
4
&
4
.
5
V
d
c
f
f
P
=
=
=
1
2
-
.
5
3
9
0
5
G Hz
MH z
d Bm
R
F
T
A
=
°
-
C
3
5
I
F
1
1
f
f
P
=
=
=
1
.
9
0
G H z
MH z
R
F
I
F
2
5
1
0
0
0
I
F
T
=
°
C
2
5
A
8
.
0
0
-
3
5
d
B
m
I
F
9
.
.
6
.
8
-
1 0
10
70
-
8
.
0
-
6
.
0
-
4
.
0
-
2
.
0
0
-
1
0
-
8
.0
-
6
.
0
-
4
.
0
-
2
.
0
0
P
,
L
O
I
N
P
U
T
P
O
W
E
R
(
d
B
m
)
P ,
LO
L
O
I
N
P
U
T
P
O
W
E
R
(
d
B
m
)
L O
Figure 2. Conversion Gain versus LO Power
Figure 3. Conversion Gain versus LO Power
1
1
1
1
1
6
5
4
3
2
2
1
1
1
1
1
0
8
6
4
2
0
4
V dc
V
=
3
V
d
c
2
5
0
M
H
z
D
D
3
5
0
M
H
z
I
F
=
1
1
0
M
H
z
4
.
5
V
d
c
1
1
f
=
=
1
-
.
3
3
9
5
G Hz
d
R
F
1
0
0
P
=
=
-
3
0
5
5
d
B
m
R
F
P
V
T
B
c
m
I
F
f
IF
=
2
5
MH z
d Bm
9
.
=
V
d
D
D
P
T
-
L
O
=
°
C
2
5
8
.
.
0
0
A
8
7
.
.
0
0
=
°
C
2
5
A
6
-
-
8
.
0
-
6
.
0
-
4
.
0
-
2
.
0
0
1
7
0
0
1
8
0
0
1
9
0
0
2
0
0
0
2
1
0
0
2
2
0
0
2
3
0
0
2
4
0
0
2
5
0
0
P
,
O
L
O
P
O
W
E
R
(
d
B
m
)
f ,
R F
R
F
F
R
E
Q
U
E
N
C
Y
(
M
H
z
)
L
Figure 4. Conversion Gain versus LO Power
Figure 5. Conversion Gain versus RF
Frequency
1
1
1
1
1
8
1 6
1 5
1 4
1 3
1 2
I
F
=
1
1
0
M
H
z
6
2
5
°
C
T
=
°
-
C
3
5
A
4
2
0
0
0
2
5
0
M
H
z
8
5
°
C
1
1
1
0
0
0
P
P
T
=
=
-
3
5
d
B
m
I
F
f
=
2
5
0
M Hz
dB m
dB m
I
F
-
5
d
B
m
9
.
.
LO
P
P
V
=
=
=
-
3
5
I
F
3
5
0
M
H
z
=
°
C
2
5
A
-
3
5
8
L
O
8
.
.
V
d
c
D
D
7
6
.
.
0
0
6
1
0
1
8
0
0
1
9
0
0
2
0
0
0
2
1
0
0
2
2
0
0
2
3
0
0
2
4
0
0
2
5
0
0
1
7
0
0
1
80
0
1
9
0
0
2
0
0
0
2
1
0
0
2
2
0
0
2
3
0
0
2
4
0
0
2
5
0
0
f
R
,
F
R
F
F
R
E
Q
U
E
N
C
Y
(
M
H
z
)
f ,
R F
R
F
F
R
E
Q
U
E
N
C
Y
(
G
H
z
)
Figure 6. Conversion Gain versus RF
Frequency
Figure 7. Conversion Gain versus RF
Frequency
MRFIC1813
2.2–32
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
1
0
0
0
0
0
1
0
0
0
0
0
4
&
4
.
5
Vd c
5
.
5
.
V
D
=
3
V
d
c
D
-
5
.
-
5.
T
A
=
°
-
C
3
5
-
1
2
5
&
°
C
8
5
-
1
f
=
1
.
9
G
H
z
f
f
P
V
=
=
=
=
1
.
0
9
G H z
MH z
d Bm
R
F
R
F
-
-
-
1
2
2
5
0
5
f
P
T
=
2
5
-
5
0
5
M
H
m
z
2
5
I
F
I
F
=
d
B
-
3
5
L
O
LO
-
-
1
2
5
0
=
°
C
2
V
d
c
A
D
D
-
35
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
5
.
0
0
-
3
5
-
3
0
-
2
5
-
F
2
0
-
1
5
-
1
0
-
5
.
0
0
P
,
IF
I
F
I
N
P
U
T
P
O
W
E
R
(
d
B
m
)
P ,
IF
I
I
N
P
U
T
P
O
W
E
R
(d B m )
Figure 8. RF Output versus Input Power
Figure 9. RF Output Power versus IF Input
Power
1
0
5
.
0
0
0
0
5
.
0
f
IF
=
1
1
0
M
H
z
0
0
0
-
5
.
3
5
0
M
H
z
-
5
.
2
=
5
0
M
H
z
I
F
=
1
1
0
M
H
z
-
1
-
1
f
2
-
.
4
5
G H z
d Bm
2
5
0
&
3
5
0
M
H
z
R
F
f
=
=
=
1
-
3
.
9
5
G
d B
V d c
H
m
z
R
F
-
-
-
1
2
2
5
0
5
P
LO
=
5
P
V
T
-
-
-
1
2
2
5
0
5
L
O
V
T
=
3
V
d
c
D
D
D
D
=
°
C
2
5
A
=
°
C
2
5
A
-
3
5
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
)
5
.
0
0
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
5
.
0
0
P
,
I
F
I
N
P
U
T
P
O
W
E
R
(
d
B
m
,
IF
I
F
P
I
N
P
U
T
P
O
W
E
R
(
d
B
m
)
I
F
Figure 10. RF Output versus IF Input Power
Figure 11. Output Power versus IF Input
Power
2
9
8
7
6
5
2
6
.
.
.
.
.
0
5
0
5
0
2
2
2
2
2
2
2
2
5
5
4
4
4
.
5
V
d
c
-
3
5
°
C
4
V
c
d
c
2 4
2 3
2 2
2 1
2 0
V
=
3
V
d
D
D
f
f
=
=
1
.
0
9
G Hz
M
2
2
2
3
3
2
.
.
.
5
0
5
R
F
f
f
P
T
=
=
=
1
.
0
9
G
H
z
z
m
8
5
°
C
R
F
2
5
H
z
I
F
2
5
M
H
I
F
P
V
=
=
-
3
5
d
V d c
B
m
L
O
-
5
d
B
T
A
=
°
C
2
5
L
O
D
D
=
°
C
2
5
A
-
3
5
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
5
.0
0
-
3
5
-
3
0
-
2
5
-
F
2
0
-
1
5
-
1
0
-
5
.
0
0
P
,
IF
I
F
I
NP
U
T
P
O
W
E
R
(
d
B
m
)
P ,
IF
I
I
N
P
U
T
P
O
W
E
R
(
d
B
m
)
Figure 12. Supply Current versus IF Input
Power
Figure 13. Supply Current versus IF Input
Power
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
MRFIC1813
2.2–33
2
4
.
5
0
0
0
5
0
24
23
23
22
22
.
.
.
.
.
0
5
0
5
0
-
5
.
I
F
=
1
1
0
M
H
z
2
5
0
M Hz
-
1
1
2
2
5
0
M
H
z
I
F
=
11
0
M
H
z
-
-
3
5
0
M
H
z
P
V
T
=
=
-
3
5
d Bm
V d c
L
O
f
=
=
=
1
.
9
5
3
G Hz
dB m
R
F
D
D
P
V
T
-
L
O
= °C25
A
V
d
c
D
D
-
-
2
3
5
0
2
2
1
1
.
.
5
0
=
°
C
2
5
A
3
50
MH z
-
3
5
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
)
5
.
0
0
1
30
0
1
4
0
0
1
5
0
0
1
6
0
0
L
1
7
0
0
1
8
0
0
1
9
0
0
2
0
0
0
2
1
0
0
P
,
IF
I
F
I
N
P
U
T
P
O
W
E
R
(
d
B
m
F ,
LO
O
F
R
E
Q
U
E
N
C
Y
(
M
H
z
)
Figure 14. Supply Current versus IF Input
Power
Figure 15. LO to RF Feedthrough versus LO
Frequency
2
2
1
1
5
0
0
0
0
0
0
2
4
6
-
-
-
-
2
4
6
8
.
.
.
.
0
5
0
0
0
4
&
4
.
5
V
d
c
-
1
1
1
1
-
-
-
f
=
=
2
-
5
1
-
0
5
5
MH z
d Bm
d Bm
I
F
P
P
T
I
F
V
=
3
V
d
c
D
D
V
T
=
3
V
d
c
D
D
=
L
O
5
.
=
°
C
2
5
A
=
°
C
2
5
A
-
-
1
8
0
2
1
7
0
0
1
8
0
0
1
9
0
0
2
0
0
0
2
1
0
0
2
2
0
0
2
3
0
0
2
4
0
0
2
5
0
0
0
0
.
5
1
.
0
1
.
5
2
.
0
2
.
5
3
.
0
f
R
,
F
R
F
F
R
E
Q
U
E
N
C
Y
(
M
H
z
)
T
X
E
N
(
V
O
L
T
S
)
Figure 16. Lower Side Band Power versus RF
Frequency
Figure 17. Supply Current versus Transmit
Enable Voltage
MRFIC1813
2.2–34
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
f
IF Input
LO Input
RF Output (1)
(MHz)
70
R
jX
R
jX
R
jX
8.3
7.3
7.1
6.6
6.5
6.1
5.7
–452.4
–318.5
–211.3
–156.4
–123.1
–100.7
–84.2
100
150
200
250
300
350
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
62.5
58.1
53.7
50.2
47.3
44.4
42.0
40.6
39.6
38.7
38.2
38.4
38.9
39.5
3.1
4.3
4.7
4.2
3.9
3.2
1.6
30.4
42.6
49.1
40.6
33.8
33.3
32.9
29.6
27.4
33.6
16.9
2.3
0.5
–0.7
–2.2
–3.6
–5.1
–6.5
–7.8
14.2
17.7
15.7
13.7
13.2
11.9
(1) Includes T1 shown in Figure 1.
Table 1. Port Impedances versus Frequency
(VD1, VD2, VD3, TX EN = 3 Vdc)
APPLICATIONS INFORMATION
DESIGN CONSIDERATIONS
The MRFIC1813 combines a single–balanced MESFET
mixer with an exciter amplifier. It is usable for transmit fre-
quencies from 1.7 to 2.5 GHz and IF frequencies from 70 to
350 MHz. The design is optimized for low–side local oscilla-
tor injection in hetrodyne transmit applications.
Minimal off–chip matching is required while allowing for
flexibility and performance optimization. An active balun is
employed at the IF port which gives good balance down to at
least 70 MHz. A passive splitter is used at the LO input to
complete the single–balanced configuration.
conversion gain is reduced to about 8 dB. Microstrip induc-
tors T1 and T2 combine with inductance internal to the de-
vice to form RF chokes. Some tuning of the RF output can be
achieved with T1.
As with all RF devices, circuit layout is important. Con-
trolled impedance lines should be used for all RF and IF in-
terconnects. As shown in Figure 1, power supply by–passing
should be used to avoid device instability. Ground vias
should be included near all ground connections indicated in
the schematic. Off–chip components should be mounted as
close to the IC leads as possible.
CIRCUIT CONSIDERATIONS
EVALUATION BOARDS
Figure 1 shows the application circuit used to gather the
data presented in the characterization curves. As shown in
Table 1, the IF port impedance is very high. Three hundred
ohms was chosen for R1 to shunt the IF port as a compro-
mise of gain and bandwidth. A 50 Ω resistor can be used and
L1 and C5 eliminated to provide a broadband match. The
Evaluation boards are available for RF Monolithic Inte-
grated Circuits by adding a “TF” to the device type. For a
complete list of currently available boards and one in devel-
opment for newly introduced products, please contact your
local Motorola Distributor or Sales Office.
MOTOROLA WIRELESS
RF PRODUCT DEVICE DATA
MRFIC1813
2.2–35
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