N02L163WN1AT-70I [NANOAMP]

Standard SRAM, 128KX16, 70ns, CMOS, PDSO44;
N02L163WN1AT-70I
型号: N02L163WN1AT-70I
厂家: NANOAMP SOLUTIONS, INC.    NANOAMP SOLUTIONS, INC.
描述:

Standard SRAM, 128KX16, 70ns, CMOS, PDSO44

静态存储器 光电二极管 内存集成电路
文件: 总10页 (文件大小:91K)
中文:  中文翻译
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NanoAmp Solutions, Inc.  
1982 Zanker Road, San Jose, CA 95112  
ph: 408-573-8878, FAX: 408-573-8877  
www.nanoamp.com  
N02L163WN1A  
2Mb Ultra-Low Power Asynchronous CMOS SRAM  
128Kx16 bit  
Overview  
Features  
The N02L163WN1A is an integrated memory  
device containing a 2 Mbit Static Random Access  
Memory organized as 131,072 words by 16 bits.  
The device is designed and fabricated using  
NanoAmp’s advanced CMOS technology to  
provide both high-speed performance and ultra-low  
power. The base design is the same as  
• Single Wide Power Supply Range  
2.3 to 3.6 Volts  
• Very low standby current  
2.0µA at 3.0V (Typical)  
• Very low operating current  
2.0mA at 3.0V and 1µs (Typical)  
NanoAmp’s N02L1618N1A, which is processed to  
operate at lower voltages. The device operates  
with a single chip enable (CE) control and output  
enable (OE) to allow for easy memory expansion.  
Byte controls (UB and LB) allow the upper and  
lower bytes to be accessed independently. The  
N02L163WN1A is optimal for various applications  
where low-power is critical such as battery backup  
and hand-held devices. The device can operate  
• Very low Page Mode operating current  
0.8mA at 3.0V and 1µs (Typical)  
• Simple memory control  
Single Chip Enable (CE)  
Byte control for independent byte operation  
Output Enable (OE) for memory expansion  
• Low voltage data retention  
Vcc = 1.8V  
over a very wide temperature range of -40oC to  
• Very fast output enable access time  
30ns OE access time  
+85oC and is available in JEDEC standard  
packages compatible with other standard 128Kb x  
16 SRAMs.  
• Automatic power down to standby mode  
• TTL compatible three-state output driver  
• Compact space saving BGA package avail-  
able  
Product Family  
Standby  
Operating  
Current (Icc),  
Max  
Package  
Type  
Operating  
Temperature  
Power  
Supply (Vcc)  
Current (I ),  
Part Number  
Speed  
SB  
Max  
N02L163WN1AB  
48 - BGA  
55ns @ 2.7V  
70ns @ 2.3V  
o
o
2.3V - 3.6V  
20 µA  
4 mA @ 1MHz  
-40 C to +85 C  
N02L163WN1AT 44 - TSOP II  
Pin Configurations  
Pin Descriptions  
1
LB  
I/O  
2
3
4
5
6
NC  
I/O  
A
A
A
A
A
4
3
2
1
0
1
2
3
4
5
6
7
8
PIN  
ONE  
A
A
A
OE  
UB  
5
6
7
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
Pin Name  
A -A  
Pin Function  
A
A
A
OE  
A
B
C
D
E
F
0
1
2
Address Inputs  
Write Enable Input  
Chip Enable Input  
Output Enable Input  
Lower Byte Enable Input  
Upper Byte Enable Input  
Data Inputs/Outputs  
Not Connected  
0
16  
A
A
A
A
A
UB  
CE  
I/O  
8
3
5
4
6
7
0
CE  
LB  
WE  
CE  
OE  
LB  
I/O  
I/O  
I/O  
I/O  
VCC  
VSS  
I/O  
I/O  
I/O  
I/O  
0
I/O15  
I/O14  
I/O13  
I/O12  
VSS  
VCC  
I/O11  
I/O10  
I/O  
V
I/O  
I/O  
V
9
10  
11  
12  
13  
1
2
1
2
3
9
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
NC  
NC  
SS  
3
4
5
CC  
V
A
A
A
A
V
CC  
16  
15  
13  
10  
SS  
4
5
6
7
UB  
I/O  
I/O  
A
I/O  
I/O  
14  
15  
14  
6
7
I/O  
I/O  
NC  
9
I/O -I/O  
8
0
15  
A
WE  
NC  
WE  
G
H
12  
A
A
A
A
A
16  
15  
14  
13  
12  
A
A
A
A
8
NC  
9
A
A
9
A
NC  
NC  
8
11  
V
10  
11  
Power  
CC  
48 Pin BGA (top)  
6 x 8 mm  
NC  
V
Ground  
SS  
Stock No. 23116-10 1/02  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
1
NanoAmp Solutions, Inc.  
Functional Block Diagram  
N02L163WN1A  
Word  
Address  
Inputs  
Address  
Decode  
Logic  
A0 - A3  
Input/  
Output  
Mux  
and  
Buffers  
Page  
Address  
Decode  
Logic  
8K Page  
x 16 word  
x 16 bit  
Address  
Inputs  
I/O0 - I/O7  
I/O8 - I/O15  
A4 - A16  
RAM Array  
CE  
WE  
OE  
UB  
LB  
Control  
Logic  
Functional Description  
1
CE  
WE  
OE  
UB  
LB  
MODE  
POWER  
I/O - I/O  
0
15  
2
H
L
L
L
L
X
X
L
X
X
X
H
X
H
High Z  
High Z  
Standby  
Active  
Active  
Active  
Active  
Standby  
Active  
3
1
1
3
Data In  
Data Out  
High Z  
X
L
L
Write  
1
1
H
H
L
L
L
Read  
H
X
X
Active  
1. When UB and LB are in select mode (low), I/O - I/O are affected as shown. When LB only is in the select mode only I/O - I/O7  
0
15  
0
are affected as shown. When UB is in the select mode only I/O8 - I/O15 are affected as shown.  
2. When the device is in standby mode, control inputs (WE, OE, UB, and LB), address inputs and data input/outputs are internally  
isolated from any external influence and disabled from exerting any influence externally.  
3. When WE is invoked, the OE input is internally disabled and has no effect on the circuit.  
Capacitance1  
Item  
Symbol  
Test Condition  
Min  
Max  
8
Unit  
pF  
o
C
Input Capacitance  
I/O Capacitance  
V
V
= 0V, f = 1 MHz, T = 25 C  
IN  
IN  
IN  
A
o
C
8
pF  
= 0V, f = 1 MHz, T = 25 C  
I/O  
A
1. These parameters are verified in device characterization and are not 100% tested  
Stock No. 23116-10 1/02  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
2
NanoAmp Solutions, Inc.  
N02L163WN1A  
Absolute Maximum Ratings1  
Item  
Symbol  
Rating  
Unit  
V
Voltage on any pin relative to V  
V
–0.3 to V +0.3  
SS  
IN,OUT  
CC  
Voltage on V Supply Relative to V  
V
–0.3 to 4.5  
500  
V
CC  
SS  
CC  
P
Power Dissipation  
Storage Temperature  
mW  
D
o
T
–40 to 125  
-40 to +85  
C
STG  
o
T
Operating Temperature  
C
A
o
o
T
Soldering Temperature and Time  
SOLDER  
240 C, 10sec(Lead only)  
C
1. Stresses greater than those listed above may cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the operating section of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
Operating Characteristics (Over Specified Temperature Range)  
1
Item  
Symbol  
Test Conditions  
Min.  
Max  
Unit  
Typ  
V
Supply Voltage  
Data Retention Voltage  
Input High Voltage  
2.3  
1.8  
3.6  
V
V
CC  
2
V
Chip Disabled  
DR  
V
V
+0.3  
CC  
1.8  
V
IH  
V
Input Low Voltage  
–0.3  
0.6  
V
IL  
V
I
= 0.2mA  
= -0.2mA  
= 0 to V  
V
–0.2  
CC  
Output High Voltage  
V
OH  
OH  
V
I
OL  
Output Low Voltage  
0.2  
0.5  
0.5  
V
OL  
I
V
IN  
Input Leakage Current  
Output Leakage Current  
Read/Write Operating Supply Current  
µA  
µA  
LI  
CC  
I
OE = V or Chip Disabled  
IH  
LO  
V
=3.6 V, V =V or V  
CC  
IN  
IH  
IL  
I
2.0  
12  
4.0  
mA  
mA  
CC1  
2
Chip Enabled, I  
= 0  
@ 1 µs Cycle Time  
OUT  
V
=3.6 V, V =V or V  
Read/Write Operating Supply Current  
CC  
IN  
IH  
IL  
I
16.0  
CC2  
2
Chip Enabled, I  
= 0  
@ 70 ns Cycle Time  
OUT  
Page Mode Operating Supply Current  
2
V
=3.6 V, V =V or V  
CC  
IN  
IH  
IL  
@ 70ns Cycle Time (Refer to Power  
I
4
mA  
mA  
CC3  
Chip Enabled, I  
= 0  
Savings with Page Mode Operation  
diagram)  
OUT  
V
=3.6 V, V =V or V  
CC  
IN  
IH  
IL  
Read/Write Quiescent Operating Sup-  
I
Chip Enabled, I  
f = 0  
= 0,  
3.0  
CC4  
OUT  
3
ply Current  
V
= V or 0V  
CC  
IN  
3
Chip Disabled  
I
2.0  
20  
10  
µA  
µA  
Maximum Standby Current  
SB1  
o
t = 85 C, VCC = 3.6 V  
A
V
= 1.8V, V = V or 0  
IN CC  
CC  
3
I
Maximum Data Retention Current  
DR  
o
Chip Disabled, t = 85 C  
A
1. Typical values are measured at Vcc=Vcc Typ., T =25°C and are not 100% tested.  
A
2. This parameter is specified with the outputs disabled to avoid external loading effects. The user must add current required to drive  
output capacitance expected in the actual system.  
3. This device assumes a standby mode if the chip is disabled (CE high). In order to achieve low standby current all inputs must be  
within 0.2 volts of either VCC or VSS  
Stock No. 23116-10 1/02  
3
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
NanoAmp Solutions, Inc.  
N02L163WN1A  
Power Savings with Page Mode Operation (WE = VIH)  
Page Address (A4 - A16 )  
Word Address (A0 - A3)  
CE  
Open page  
...  
Word 16  
Word 1  
Word 2  
OE  
LB, UB  
Note: Page mode operation is a method of addressing the SRAM to save operating current. The internal  
organization of the SRAM is optimized to allow this unique operating mode to be used as a valuable power  
saving feature.  
The only thing that needs to be done is to address the SRAM in a manner that the internal page is left open  
and 16-bit words of data are read from the open page. By treating addresses A0-A3 as the least significant  
bits and addressing the 16 words within the open page, power is reduced to the page mode value which is  
considerably lower than standard operating currents for low power SRAMs.  
Stock No. 23116-10 1/02  
4
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
NanoAmp Solutions, Inc.  
Timing Test Conditions  
N02L163WN1A  
Item  
0.1V to 0.9 V  
Input Pulse Level  
Input Rise and Fall Time  
Input and Output Timing Reference Levels  
Output Load  
CC  
CC  
5ns  
0.5 V  
CC  
CL = 30pF  
o
Operating Temperature  
-40 to +85 C  
Timing  
2.3 - 3.6 V  
2.7 - 3.6 V  
Item  
Symbol  
Units  
Min.  
Max.  
Min.  
Max.  
t
Read Cycle Time  
70  
55  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
t
Address Access Time  
70  
70  
35  
35  
55  
55  
30  
30  
AA  
t
Chip Enable to Valid Output  
Output Enable to Valid Output  
Byte Select to Valid Output  
Chip Enable to Low-Z output  
Output Enable to Low-Z Output  
Byte Select to Low-Z Output  
Chip Disable to High-Z Output  
Output Disable to High-Z Output  
Byte Select Disable to High-Z Output  
Output Hold from Address Change  
Write Cycle Time  
CO  
t
OE  
t
, t  
LB UB  
t
10  
5
10  
5
LZ  
t
OLZ  
t
, t  
10  
0
10  
0
LBZ UBZ  
t
20  
20  
20  
20  
20  
20  
HZ  
t
0
0
OHZ  
t
, t  
0
0
LBHZ UBHZ  
t
10  
70  
50  
50  
50  
40  
0
10  
55  
40  
40  
40  
40  
0
OH  
t
WC  
t
Chip Enable to End of Write  
Address Valid to End of Write  
Byte Select to End of Write  
Write Pulse Width  
CW  
t
AW  
t
, t  
LBW UBW  
t
WP  
t
Address Setup Time  
AS  
t
Write Recovery Time  
0
0
WR  
t
Write to High-Z Output  
20  
20  
WHZ  
t
Data to Write Time Overlap  
Data Hold from Write Time  
End Write to Low-Z Output  
40  
0
35  
0
DW  
t
DH  
t
10  
10  
ns  
OW  
Stock No. 23116-10 1/02  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
5
NanoAmp Solutions, Inc.  
N02L163WN1A  
Timing of Read Cycle (CE = OE = VIL, WE = VIH)  
tRC  
Address  
tAA  
tOH  
Previous Data Valid  
Data Out  
Data Valid  
Timing Waveform of Read Cycle (WE= VIH)  
tRC  
Address  
tAA  
tHZ  
tCO  
CE  
tLZ  
tOHZ  
tOE  
OE  
tOLZ  
tLB, UB  
t
LB, UB  
tLBLZ, UBLZ  
t
tLBHZ, UBHZ  
t
High-Z  
Data Valid  
Data Out  
Stock No. 23116-10 1/02  
6
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
NanoAmp Solutions, Inc.  
N02L163WN1A  
Timing Waveform of Write Cycle (WE control)  
tWC  
Address  
tWR  
tAW  
tCW  
CE  
tLBW, tUBW  
LB, UB  
tWP  
tAS  
WE  
tDW  
tDH  
High-Z  
Data Valid  
Data In  
Data Out  
tWHZ  
tOW  
High-Z  
Timing Waveform of Write Cycle (CE Control)  
tWC  
Address  
CE  
tAW  
tCW  
tWR  
tAS  
tLBW, tUBW  
LB, UB  
WE  
tWP  
tDW  
tDH  
Data Valid  
High-Z  
Data In  
tLZ  
tWHZ  
Data Out  
Stock No. 23116-10 1/02  
7
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
NanoAmp Solutions, Inc.  
N02L163WN1A  
44-Lead TSOP II Package (T44)  
18.41±0.13  
11.76±0.20  
10.16±0.13  
0.80mm REF  
0.45  
0.30  
SEE DETAIL B  
DETAIL B  
1.10±0.15  
0o-8o  
0.20  
0.00  
0.80mm REF  
Note:  
1. All dimensions in inches (Millimeters)  
2. Package dimensions exclude molding flash  
Stock No. 23116-10 1/02  
8
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
NanoAmp Solutions, Inc.  
Ball Grid Array Package  
N02L163WN1A  
0.28±0.05  
1.24±0.10  
D
A1 BALL PAD  
CORNER (3)  
1. 0.35±0.05 DIA.  
E
2. SEATING PLANE - Z  
0.15  
0.05  
Z
Z
TOP VIEW  
SIDE VIEW  
1. DIMENSION IS MEASURED AT THE  
MAXIMUM SOLDER BALL DIAMETER.  
PARALLEL TO PRIMARY Z.  
A1 BALL PAD  
CORNER  
SD  
2. PRIMARY DATUM Z AND SEATING  
PLANE ARE DEFINED BY THE  
SPHERICAL CROWNS OF THE  
SOLDER BALLS.  
e
SE  
3. A1 BALL PAD CORNER I.D. TO BE  
MARKED BY INK.  
K TYP  
J TYP  
e
BOTTOM VIEW  
Dimensions (mm)  
e = 0.75  
BALL  
D
E
MATRIX  
TYPE  
SD  
SE  
J
K
6±0.10  
8±0.10  
0.375  
0.375  
1.125  
1.375  
FULL  
Stock No. 23116-10 1/02  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  
9
NanoAmp Solutions, Inc.  
Ordering Information  
N02L163WN1A  
N02L163WN1AX-XX X  
I = Industrial, -40°C to 85°C  
Temperature  
55 = 55ns  
Performance  
T = 44-pin TSOP II  
B = 48-ball BGA  
Package Type  
Note: Add -T&R following the part number for Tape and Reel. Orders will be  
considered in tray if not noted.  
Revision History  
Revision #  
Date  
Change Description  
01  
02  
03  
04  
05  
06  
07  
08  
09  
Dec. 1999  
Sept. 2000  
Oct. 2000  
Oct. 2000  
Jan. 2001  
Mar. 2001  
May 2001  
June 2001  
Sept. 2001  
Initial Preliminary Release  
Modified Voltage Range and Standby Current Limits.  
Added Missing Tas Parameter Specification.  
Modified Standby Current Specifications.  
Extensive Modification to use voltage regulator design  
Modified BGA pinout, access time 70ns @ 2.7V, misc. errata  
Changed access time to 55ns, modified 44-Lead TSOP Package diagram  
Revised voltage range in Timing table, revised Dimensions table  
Minor parametric modifications, full production release  
Part number change from EM128L16, modified Overview and Features, added  
Page Mode Operation diagram, revised Operating Characteristics table, Package  
diagram, Functional Description table and Ordering Information diagram  
10  
Dec. 2001  
© 2001 - 2002 Nanoamp Solutions, Inc. All rights reserved.  
NanoAmp Solutions, Inc. ("NanoAmp") reserves the right to change or modify the information contained in this data sheet and the products described therein, without prior notice.  
NanoAmp does not convey any license under its patent rights nor the rights of others. Charts, drawings and schedules contained in this data sheet are provided for illustration pur-  
poses only and they vary depending upon specific applications.  
NanoAmp makes no warranty or guarantee regarding suitability of these products for any particular purpose, nor does NanoAmp assume any liability arising out of the application  
or use of any product or circuit described herein. NanoAmp does not authorize use of its products as critical components in any application in which the failure of the NanoAmp  
product may be expected to result in significant injury or death, including life support systems and critical medical instruments.  
Stock No. 23116-10 1/02  
10  
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.  

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