N-HFA30PA40C [NELLSEMI]

FRED Ultrafast Soft Recovery Diode, 2 x 15 A; FRED超快软恢复二极管, 2× 15 A
N-HFA30PA40C
型号: N-HFA30PA40C
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

FRED Ultrafast Soft Recovery Diode, 2 x 15 A
FRED超快软恢复二极管, 2× 15 A

二极管 超快软恢复二极管
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RoHS  
RoHS  
N-HFA30PA40C  
SEMICONDUCTOR  
Nell High Power Products  
FRED  
Ultrafast Soft Recovery Diode, 2 x 15 A  
FEATURES  
Ultrafast recovery  
Ultrasoft recovery  
Very low I  
Very low Q  
Specified at operating conditions  
RRM  
rr  
Designed and qualified for industrial level  
TO-247AB  
BENEFITS  
Reduced RFI and EMI  
common  
cathode  
Reduced power loss in diode and switching transistor  
Higher frequency operation  
Reduced snubbing  
2
Reduced parts count  
DESCRIPTION  
HFA30PA40C is a state of the art center tap ultrafast  
1
3
recovery diode.  
Employing the latest in epitaxial  
Anode  
Anode  
2
2
1
construction and advanced processing techniques  
it features a superb combination of characteristics  
which result in performance which is unsurpassed by  
any rectifier previously available. With basic ratings  
of 400V and 15 A per leg continuous current, the  
HFA30PA40C is especially well suited for use as the  
companion diode for IGBTs and MOSFETs. In addition  
to ultrafast recovery time, the FRED product line  
features extremely low values of peak recovery  
Common  
cathode  
PRODUCT SUMMARY  
current (I  
) and does not exhibit any tendency to  
RRM  
VR  
VF at 15A at 25 °C  
IF(AV)  
400 V  
1.3 V  
“snap-off” during the t  
b portion of recovery. The FRED  
features combine to offer designers a rectifier with  
lower noise and significantly lower switching losses  
in both the diode and the switching transistor.  
These FRED advantages can help to significantly  
reduce snubbing, component count and heatsink  
sizes. The FRED HFA30PA40C is ideally suited for  
applications in power conversion systems (such as  
inverters), motor drives, and many other similar  
applications where high speed, high efficiency is  
needed.  
2 x 15 A  
19 ns  
trr (typical)  
TJ (maximum)  
Qrr (typical)  
150 °C  
80 nC  
dl(rec)M/dt (typical)  
lRRM (typical)  
160 A/µs  
4.0 A  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Cathode to anode voltage  
VR  
400  
15  
V
per leg  
Maximum continuous forward current  
IF  
T
= 100 ºC  
c
per device  
30  
A
Single pulse forward current  
lFSM  
lFRM  
150  
60  
Maximum repetitive forward current  
T
= 25 ºC  
75  
c
PD  
Maximum power dissipation  
W
T
= 100 ºC  
70  
c
TJ, TStg  
Operating junction and storage temperature range  
- 55 to + 150  
ºC  
Page 1 of 5  
RoHS  
RoHS  
N-HFA30PA40C  
SEMICONDUCTOR  
Nell High Power Products  
ELECTRICAL SPECIFICATIONS  
(T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
MAX.  
TYP.  
UNITS  
TEST CONDITIONS  
MIN.  
Cathode to anode  
breakdown voltage  
-
-
VBR  
IR = 100 µA  
400  
IF = 15 A  
IF = 30 A  
-
-
1.3  
1.6  
1.5  
-
V
VFM  
Maximum forward voltage  
IF = 15 A, TJ = 125 ºC  
-
-
1.2  
VR = VR rated  
TJ = 125°C, VR = VR rated  
VR = 200V  
-
-
-
-
50  
500  
Maximum reverse  
leakage current  
IRM  
µA  
Junction capacitance  
Series inductance  
pF  
nH  
CT  
LS  
50  
25  
12  
-
-
Measured lead to lead 5 mm from package body  
-
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
MAX. UNITS  
TYP.  
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)  
IF = 1.0 A, dIF/dt = -100 A/µs, VR =30 V, TJ = 25°C  
-
-
35  
28  
trr  
-
19  
ns  
Reverse recovery time  
trr1  
trr2  
-
-
TJ = 25 ºC  
35  
95  
3
60  
TJ = 125 ºC  
120  
IF= 15A  
dIF/dt = -200 A/µs  
VR = 266 V  
IRRM1  
TJ = 25 ºC  
-
-
6.0  
Peak recovery current  
A
IRRM2  
Qrr1  
TJ = 125 ºC  
10  
6
-
-
TJ = 25 ºC  
60  
180  
Reverse recovery charge  
nC  
Qrr2  
TJ = 125 ºC  
300  
600  
THERMAL - MECHANICAL SPECIFICATIONS PER LEG  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063'' from case (1.6 mm) for 10 s  
-
-
300  
°C  
Junction to case,  
single leg conduction  
Junction to case,  
both legs conducting  
Thermal resistance,  
junction to ambient  
Thermal resistance,  
case to heatsink  
-
-
1.40  
RthJC  
-
-
-
-
-
0.70  
40  
-
K/W  
RthJA  
RthCS  
Typical socket mount  
Mounting surface, flat, smooth and greased  
0.25  
-
-
6.0  
-
-
g
Weight  
0.21  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf . cm  
(lbf . in)  
Mounting torque  
Marking device  
-
Case style TO-247AB (JEDEC)  
HFA30PA40C  
Page 2 of 5  
RoHS  
RoHS  
N-HFA30PA40C  
SEMICONDUCTOR  
Nell High Power Products  
Fig.1 Maximum effective transient thermal impedance, junction-to-case vs. pulse duration  
1.40  
0.9  
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
0
0.7  
0.5  
0.3  
Note:  
t1  
t2  
Duty Factor D =t /t  
1
θJC  
2
+T  
0.1  
0.05  
Peak T = PDM xZ  
J
SINGLE PULSE  
C
10-5  
10-4  
10-3  
10-2  
10-1  
1.0  
Rectangular pulse duration (seconds)  
Fig.2 Forward current vs. forward voltage  
Fig.3 Reverse recovery time vs. current rate of change  
60  
120  
T
T
=125°C  
=266V  
J
R
30A  
50  
40  
30  
100  
80  
60  
40  
20  
0
15A  
7.5A  
T
=125°C  
J
20  
10  
0
T
=25°C  
J
T
=150°C  
J
T
=150°C  
J
T
=-55°C  
J
0
0.5  
1
1.5  
2
2.5  
0
200  
400  
600  
800 1000 1200  
Anode-to-cathode voltage (V), V  
Current rate of change(A/μs), -di /dt  
F
F
Fig.4 Reverse recovery charge vs. current rate of change  
Fig 5. Reverse recovery current vs. current rate of change  
800  
25  
T
T
=125°C  
=266V  
J
T
T
=125°C  
=266V  
J
R
30A  
R
700  
600  
500  
400  
300  
200  
30A  
20  
15  
10  
5
15A  
15A  
7.5A  
7.5A  
100  
0
0
0
200  
400  
600  
800 1000 1200  
0
200  
400  
600  
800 1000 1200  
Current rate of change (A/μs), -di /dt  
Current rate of change (A/μs), -di /dt  
F
F
Page 3 of 5  
RoHS  
RoHS  
N-HFA30PA40C  
SEMICONDUCTOR  
Nell High Power Products  
Fig.7 Maximum average forward current vs. case temperature  
Fig6. Dynamic parameters vs. junction temperature  
40  
1.4  
Duty cycle = 0.5  
Q
rr  
rr  
T
=175°C  
J
35  
30  
25  
20  
15  
10  
5
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
t
I
RRM  
t
rr  
Q
rr  
0
25  
0
25  
50  
75  
100  
125  
150  
50  
75  
100  
125  
150  
175  
Junction temperature (°C),T  
Case temperature (°C)  
J
Fig.8 Junction capacitance vs. reverse voltage  
Fig.9 Reverse recovery parameter test circuit  
200  
VR = 200 V  
150  
100  
Ω
0.01  
L = 70 µH  
D.U.T.  
D
dI /dt  
F
adjust  
50  
0
IRFP250  
G
S
1
10  
100 200  
reverse voltage (V), V  
R
Fig.10 Reverse recovery waveform and definitions  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 I  
RRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
and IRRM  
(1) dIF/dt - rate of change of current  
through zero crossing  
x l  
2
trr  
RRM  
(2) IRRM - peak reverse recovery current  
Q
rr  
=
(3) trr - reverse recovery time measured  
/dt - peak rate of change of  
(5) dI(rec)M  
current during tb portion of trr  
from zero crossing point of negative  
going I to point where a line passing  
F
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
Page 4 of 5  
RoHS  
RoHS  
N-HFA30PA40C  
SEMICONDUCTOR  
Nell High Power Products  
ORDERING INFORMATION TABLE  
Device code  
-
HFA 30 PA  
C
N
40  
1
2
3
4
5
6
-
-
-
-
-
-
Nell Semiconductors product  
1
2
3
4
FRED family  
Current rating (30 = 30 A, 15A x 2)  
Package outline (PA = TO-247, 3 pins)  
Voltage rating (40 = 400 V)  
5
6
Configuration (C = Center tap common cathode)  
Page 5 of 5  

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