BAS116GW [NEXPERIA]

Low leakage switching diodeProduction;


型号：	BAS116GW
厂家：	Nexperia
描述：	Low leakage switching diodeProduction
文件：	总11页 (文件大小：201K)
中文：	中文翻译
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BAS116GW

Low leakage switching diode

5 April 2018

Product data sheet

1. General description

Low leakage switching diode, encapsulated in an SOD123 small Surface-Mounted Device (SMD)

plastic package.

2. Features and benefits

•

High switching speed: t_rr= 0.8 µs

•

Low leakage current: I_R= 3 pA

Repetitive peak reverse voltage V_RRM≤ 85 V

Low capacitance: C_d= 2 pF

Small SMD plastic package

AEC-Q101 qualified

3. Applications

•

Low-leakage current applications

General-purpose switching

4. Quick reference data

Table 1. Quick reference data

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_RRM

repetitive peak reverse T_j= 25 °C

voltage

I_F

forward current

reverse voltage

forward voltage

t_p≤ 300 µs; δ ≤ 0.02; T_amb= 25 °C

215

V_R

V_F

T_j= 25 °C

I_F= 150 mA; t_p≤ 300 µs; δ ≤ 0.02;

T_j= 25 °C

1.25

I_R

t_rr

reverse current

V_R= 75 V; pulsed; T_j= 25 °C

0.003

0.8

µs

reverse recovery time I_F= 10 mA; I_R= 10 mA; R_L= 100 Ω;

I_R(meas)= 1 mA; T_j= 25 °C

Nexperia

BAS116GW

Low leakage switching diode

5. Pinning information

Table 2. Pinning information

Symbol Description

Simplified outline

Graphic symbol

Cathode

Anode

sym001

SOD123

6. Ordering information

Table 3. Ordering information

Type number

Package

Name

Description

Version

BAS116GW

SOD123

Plastic surface-mounted package; 2 leads

SOD123

7. Marking

Table 4. Marking codes

Type number

Marking code

BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

V_RRM

repetitive peak reverse

voltage

T_j= 25 °C

V_R

I_F

reverse voltage

forward current

215

t_p≤ 300 µs; δ ≤ 0.02; T_amb= 25 °C

t_p= 1 µs; T_j(init)= 25 °C; square wave

t_p= 1 ms; T_j(init)= 25 °C; square wave

t_p= 1 s; T_j(init)= 25 °C; square wave

I_FSM

non-repetitive peak

forward current

0.5

500

I_FRM

P_tot

repetitive peak forward

current

total power dissipation

T_amb≤ 25 °C

[1]

[2]

357

600

Per device, one diode loaded

T_j

junction temperature

150

°C

T_amb

T_stg

ambient temperature

storage temperature

-55

-65

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated mounting pad for cathode 1cm².

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

350

210

Unit

K/W

R_th(j-a)

thermal resistance

from junction to

ambient

In free air

[1]

[2]

R_th(j-sp)

thermal resistance

from junction to solder

point

[3]

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm².

[3] Soldering point of cathode tab.

BAS116GW

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Product data sheet

5 April 2018

3 / 11

Nexperia

BAS116GW

Low leakage switching diode

aaa-025046

duty cycle = 1

0.75

th(j-a)

(K/W)

0.50

0.33

0.25

0.20

0.10

0.05

0.01

0.02

-5

-4

-3

-2

-1

(s)

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-025047

th(j-a)

(K/W)

duty cycle = 1

0.75

0.50

0.33

0.25

0.20

0.10

0.05

0.02

0.01

-5

-4

-3

-2

-1

(s)

FR4 PCB, mounting pad for cathode 1 cm²

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

10. Characteristics

Table 7. Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_F

forward voltage

I_F= 1 mA; t_p≤ 300 µs; δ ≤ 0.02;

T_j= 25 °C

0.9

I_F= 10 mA; t_p≤ 300 µs; δ ≤ 0.02;

T_j= 25 °C

I_F= 50 mA; t_p≤ 300 µs; δ ≤ 0.02;

T_j= 25 °C

1.1

1.25

I_F= 150 mA; t_p≤ 300 µs; δ ≤ 0.02;

T_j= 25 °C

I_R

reverse current

V_R= 75 V; pulsed; T_j= 25 °C

V_R= 75 V; pulsed; T_j= 150 °C

V_R= 0 V; f = 1 MHz; T_j= 25 °C

0.003

µs

C_d

t_rr

diode capacitance

reverse recovery time I_F= 10 mA; I_R= 10 mA; R_L= 100 Ω;

I_R(meas)= 1 mA; T_j= 25 °C

0.8

aaa-022961

mlb754

(nA)

(A)

(1)

(2)

(3)

(4)

-1

-2

-3

-4

- 1

(2)

- 2

- 3

0.0

0.5

1.0

1.5

2.0

100

150

200

T (°C)

(V)

(1) T_j= 150 °C

(2) T_j= 85 °C

(3) T_j= 25 °C

(4) T_j= −40 °C

V_R= 75 V

(1) Maximum values

(2) Typical values

Fig. 4. Reverse current as a function of junction

temperature

Fig. 3. Forward current as a function of forward

voltage; typical values

BAS116GW

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Product data sheet

5 April 2018

5 / 11

Nexperia

BAS116GW

Low leakage switching diode

mbg526

mbg704

FSM

(A)

(pF)

-1

(V)

(ms)

Based on square wave currents.

T_j(init)= 25 °C

f = 1 MHz; T_amb= 25 °C

Fig. 5. Diode capacitance as a function of reverse

voltage; typical values

Fig. 6. Non-repetitive peak forward current as a

function of pulse duration; maximum values

11. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Fig. 7. Reverse recovery time test circuit and waveforms

Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC)

standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in

automotive applications.

BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

12. Package outline

3.75

3.45

2.80

2.55

1.3

1.0

1.7

1.5

Dimensions in mm

16-10-13

Fig. 8. Package outline SOD123

13. Soldering

SOD123

4.58

3.27

3.1

2.1 1.62

1.12 1.22 1.42

0.81

0.91

0.81

0.91

2.36

4.18

1.11

occupied area

Cu pad

solder resist

solder paste

16-05-10

16-08-31

Dimensions in mm

sod123_fr

Fig. 9. Reflow soldering footprint for SOD123

BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

SOD123

7.5

2.65

2.5

4.5

3.5 2.55 2.4

1.2

0.33

1.2

occupied area

solder resist

glue dot

solder land

16-09-02

16-09-06

Dimensions in mm

sod123_fw

Fig. 10. Wave soldering footprint for SOD123

BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

14. Revision history

Table 8. Revision history

Data sheet ID

BAS116GW v.2

Modifications:

Release date

20180405

Data sheet status

Change notice

Supersedes

Product data sheet

BAS116GW v.1

•

Unit corrected to nA in Table 7, reverse current at 150 °C

BAS116GW v.1

20161124 Product data sheet

BAS116GW

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Product data sheet

5 April 2018

9 / 11

Nexperia

BAS116GW

Low leakage switching diode

for the products described herein shall be limited in accordance with the

Terms and conditions of commercial sale of Nexperia.

15. Legal information

Right to make changes — Nexperia reserves the right to make changes

to information published in this document, including without limitation

specifications and product descriptions, at any time and without notice. This

document supersedes and replaces all information supplied prior to the

publication hereof.

Data sheet status

Suitability for use in automotive applications — This Nexperia product

has been qualified for use in automotive applications. Unless otherwise

agreed in writing, the product is not designed, authorized or warranted to

be suitable for use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction of an Nexperia

product can reasonably be expected to result in personal injury, death or

severe property or environmental damage. Nexperia and its suppliers accept

no liability for inclusion and/or use of Nexperia products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Document

status [1][2] status [3]

Product

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production

This document contains the product

specification.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no representation

or warranty that such applications will be suitable for the specified use

without further testing or modification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nexperia.com.

Customers are responsible for the design and operation of their applications

and products using Nexperia products, and Nexperia accepts no liability for

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Customers should provide appropriate design and operating safeguards to

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Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

Nexperia does not give any representations or warranties as to the accuracy

or completeness of information included herein and shall have no liability for

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or problem which is based on any weakness or default in the customer’s

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Draft — The document is a draft version only. The content is still under

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warranties as to the accuracy or completeness of information included herein

and shall have no liability for the consequences of use of such information.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the relevant

full data sheet, which is available on request via the local Nexperia sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

Nexperia and its customer, unless Nexperia and customer have explicitly

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sold subject to the general terms and conditions of commercial sale, as

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BAS116GW

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Product data sheet

5 April 2018

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Nexperia

BAS116GW

Low leakage switching diode

16. Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................2

6. Ordering information....................................................2

7. Marking..........................................................................2

8. Limiting values............................................................. 3

9. Thermal characteristics............................................... 3

10. Characteristics............................................................5

11. Test information..........................................................6

12. Package outline.......................................................... 7

13. Soldering..................................................................... 7

14. Revision history..........................................................9

15. Legal information..................................................... 10

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 5 April 2018

BAS116GW

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Product data sheet

5 April 2018

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BAS116GW [NEXPERIA]

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