PUMX2 [NEXPERIA]
NPN/NPN general-purpose double transistorsProduction;
| 型号： | PUMX2 |
| 厂家： | 
Nexperia |
| 描述： | NPN/NPN general-purpose double transistorsProduction 开关 光电二极管 晶体管 |
| 文件： | 总9页 (文件大小：213K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
PUMX2
NPN/NPN general-purpose double transistors
Rev. 02 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN/NPN general-purpose double transistors in a small SOT363 (SC-88) Surface
Mounted Device (SMD) plastic package.
1.2 Features
Simplifies circuit design
Reduces component count
Reduces pick and place costs
1.3 Applications
General-purpose switching and amplification
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max Unit
Per transistor
VCEO
IC
collector-emitter voltage open base
collector current
-
-
50
V
-
-
150 mA
560
hFE
DC current gain
VCE = 6 V; IC = 1 mA
120
250
2. Pinning information
Table 2.
Pinning
Pin
1
Description
emitter TR1
emitter TR2
base TR2
Simplified outline
Symbol
6
5
2
4
6
5
4
2
3
TR1
TR2
4
collector TR2
base TR1
1
2
3
5
1
3
006aaa653
6
collector TR1
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PUMX2
SC-88
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PUMX2
Z1*
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
VCEO
VEBO
IC
collector-base voltage
open emitter
open base
-
-
-
-
-
60
50
7
V
collector-emitter voltage
emitter-base voltage
collector current
V
open collector
V
150
200
mA
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
IBM
peak base current
single pulse;
tp ≤ 1 ms
-
-
100
180
mA
[1]
[1]
Ptot
total power dissipation
Tamb ≤ 25 °C
Tamb ≤ 25 °C
mW
Per device
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
ambient temperature
-
300
mW
°C
−65
-
+150
150
°C
Tamb
−65
+150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
2 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Per transistor
Conditions
Min
Typ
Max
Unit
[1]
[1]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
694
K/W
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
417
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Per transistor
Conditions
Min
Typ
Max
Unit
ICBO
collector-base
cut-off current
VCB = 60 V; IE = 0 A
-
-
-
-
100
50
nA
VCB = 60 V; IE = 0 A;
μA
Tj = 150 °C
IEBO
emitter-base
VEB = 7 V; IC = 0 A
-
-
100
nA
cut-off current
hFE
DC current gain
VCE = 6 V; IC = 1 mA
IC = 50 mA; IB = 5 mA
120
-
250
-
560
250
VCEsat
collector-emitter
mV
MHz
pF
saturation voltage
fT
transition
frequency
VCE = 12 V; IE = 2 mA;
f = 100 MHz
100
-
-
-
-
Cc
collector
capacitance
VCB = 12 V; IE = ie = 0 A;
f = 1 MHz
3
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
3 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
8. Package outline
2.2
1.8
1.1
0.8
0.45
0.15
6
5
4
2.2 1.35
2.0 1.15
pin 1
index
1
2
3
0.25
0.10
0.3
0.2
0.65
1.3
Dimensions in mm
06-03-16
Fig 1. Package outline SOT363 (SC-88)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
-115
-125
10000
[2]
PUMX2
SOT363 4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-135
-165
[3]
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
4 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
10. Soldering
2.65
solder lands
0.4 (2×)
1.5
2.35
0.6
(4×)
0.5
(4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
occupied area
Dimensions in mm
0.6
(4×)
1.8
sot363_fr
Fig 2. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
solder resist
occupied area
2.5
0.3
4.5
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 3. Wave soldering footprint SOT363 (SC-88)
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
5 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
11. Revision history
Table 9.
Revision history
Document ID
PUMX2_2
Release date
Data sheet status
Change notice
Supersedes
20091117
Product data sheet
-
PUMX2_1
Modifications:
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
• Figure 1 “Package outline SOT363 (SC-88)”: updated
• Figure 2 “Reflow soldering footprint SOT363 (SC-88)”: updated
• Figure 3 “Wave soldering footprint SOT363 (SC-88)”: updated
PUMX2_1
20051110
Product data sheet
-
-
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
6 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PUMX2_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 17 November 2009
7 of 8
PUMX2
NXP Semiconductors
NPN/NPN general-purpose double transistors
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Packing information . . . . . . . . . . . . . . . . . . . . . 4
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . . 7
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2009
Document identifier: PUMX2_2
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