LM4953SD [NSC]

Ground-Referenced, Ultra Low Noise, Ceramic Speaker Driver; 以地为参考,超低噪声,陶瓷扬声器驱动器
LM4953SD
型号: LM4953SD
厂家: National Semiconductor    National Semiconductor
描述:

Ground-Referenced, Ultra Low Noise, Ceramic Speaker Driver
以地为参考,超低噪声,陶瓷扬声器驱动器

驱动器 消费电路 商用集成电路 音频放大器 视频放大器
文件: 总11页 (文件大小:662K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2005  
LM4953  
Ground-Referenced, Ultra Low Noise, Ceramic Speaker  
Driver  
General Description  
Key Specifications  
The LM4953 is an audio power amplifier designed for driving  
Ceramic Speaker in portable applications. When powered by  
a 3.6V supply, it is capable of forcing 12.6Vpp across a 2µF  
+ 30bridge-tied-load (BTL) with less than 1% THD+N.  
Boomer audio power amplifiers were designed specifically to  
provide high quality output power with a minimal amount of  
external components. The LM4953 does not require boot-  
strap capacitors, or snubber circuits. Therefore it is ideally  
suited for display applications requiring high power and mini-  
mal size.  
j
Quiescent Power Supply Current (Vdd = 3V) 7mA(typ)  
j
BTL Voltage Swing  
(2µF+30load, 1% THD+N,  
Vdd = 3.6V)  
12.6Vpp (typ)  
1µA (max)  
j
Shutdown Current  
Features  
n Pop & click circuitry eliminates noise during turn-on and  
turn-off transitions  
The LM4953 features a low-power consumption shutdown  
mode. Additionally, the LM4953 features an internal thermal  
shutdown protection mechanism.  
n Low, 1µA (max) shutdown current  
n Low, 7mA (typ) quiescent current  
n 12.6Vpp mono BTL output, load = 2µF+ 30Ω  
n Thermal shutdown  
The LM4953 contains advanced pop & click circuitry that  
eliminates noises which would otherwise occur during  
turn-on and turn-off transitions.  
n Unity-gain stable  
The LM4953 is unity-gain stable and can be configured by  
external gain-setting resistors.  
n External gain configuration capability  
Applications  
n Cellphone  
n PDA  
Typical Application  
20142168  
FIGURE 1. Typical Application Circuit  
Boomer® is a registered trademark of National Semiconductor Corporation.  
© 2005 National Semiconductor Corporation  
DS201421  
www.national.com  
Connection Diagram  
LLP Package  
20142101  
Top View  
Order Number LM4953SD  
See NS Package Number SDA14A  
Pin Descriptions  
Pin  
Name  
SD  
Function  
1
Active Low Shutdown  
Charge Pump Power Supply  
2
CPVDD  
CCP+  
PGND  
CCP-  
VCP_OUT  
NC  
3
Positive Terminal - Charge Pump Flying Capacitor  
4
Power Ground  
5
Negative Terminal - Charge Pump Flying Capacitor  
Charge Pump Output  
No Connect  
6
7
8
AVSS  
OUT B  
AVDD  
OUT A  
NC  
Negative Power Supply - Amplifier  
Output B  
9
10  
11  
12  
13  
14  
Positive Power Supply - Amplifier  
Output A  
No Connect  
VIN  
Signal Input  
SGND  
Signal Ground  
www.national.com  
2
Absolute Maximum Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Junction Temperature  
Thermal Resistance  
150˚C  
See AN-1187 ’Leadless Leadframe Packaging (LLP).’  
Supply Voltage (VDD  
)
4.5V  
−65˚C to +150˚C  
-0.3V to VDD + 0.3V  
Internally Limited  
2000V  
Operating Ratings  
Temperature Range  
Storage Temperature  
Input Voltage  
TMIN TA TMAX  
−40˚C TA 85˚C  
1.6V VDD 4.2V  
Power Dissipation (Note 3)  
ESD Susceptibility (Note 4)  
ESD Susceptibility (Note 5)  
Supply Voltage (VDD  
)
200V  
Electrical Characteristics VDD = 3.6V  
The following specifications apply for VDD = 3.6V, AV-BTL = 6dB, ZL = 2µF+30unless otherwise specified. Limits apply to TA  
=
25˚C. See Figure 1.  
Symbol  
Parameter  
Conditions  
LM4953  
Units (Limits)  
Typ  
Limit  
(Note 6)  
(Notes 7, 8)  
Quiescent Power Supply  
Current  
IDD  
Istandby  
ISD  
VIN = 0, RLOAD = 2µF+30Ω  
VIN = 0, ZLOAD = 2µF+30Ω  
8
TBD  
mA (max)  
mA  
Quiescent Power Supply  
Current Auto Standby Mode  
Shutdown Current  
2.7  
0.1  
VSD = GND  
SD1  
1
µA (max)  
V (min)  
VSDIH  
Shutdown Voltage Input High  
Shutdown Voltage Input Low  
0.7*CPVdd  
SD2  
SD1  
V (max)  
VSDIL  
0.3*CPVdd  
10  
SD2  
TWU  
VOS  
Wake-up Time  
125  
1
µsec  
Output Offset Voltage  
mV (max)  
THD = 1% (max); f = 1kHz  
VOUT  
Output Voltage Swing  
12.6  
Vpp  
RL = 2µF+30, Mono BTL  
Total Harmonic Distortion +  
Noise  
THD+N  
VOUT = 6Vp-p, fIN = 1kHz  
0.02  
15  
%
Output Noise  
A-Weighted Filter, VIN = 0V  
VRIPPLE = 200mVp-p, f = 217Hz,  
Input Referred  
µV  
dB  
OS  
67  
Power Supply Rejection  
Ratio  
PSRR  
SNR  
VRIPPLE = 200mVp-p, f = 1kHz,  
Input Referred  
65  
dB  
dB  
Signal-to-Noise Ratio  
ZL = 2µF+30, VOUT = 6Vp-p  
105  
Electrical Characteristics VDD = 3.0V  
The following specifications apply for VDD = 3.0V, AV-BTL = 6dB, ZL = 2µF+30unless otherwise specified. Limits apply to TA  
=
25˚C. See Figure 1.  
Symbol  
Parameter  
Conditions  
LM4953  
Units (Limits)  
Typ  
Limit  
(Note 6)  
(Notes 7, 8)  
Quiescent Power Supply  
Current  
IDD  
Istandby  
ISD  
VIN = 0, ZLOAD = 2µF+30Ω  
VIN = 0, ZLOAD = 2µF+30Ω  
7
10  
mA (max)  
mA  
Quiescent Power Supply  
Current Auto Standby Mode  
Shutdown Current  
2.3  
0.1  
VSD-LC = VSD-RC = GND  
1
µA (max)  
V (min)  
SD1  
SD2  
VSDIH  
Shutdown Voltage Input High  
0.7*CPVdd  
3
www.national.com  
Electrical Characteristics VDD = 3.0V (Continued)  
The following specifications apply for VDD = 3.0V, AV-BTL = 6dB, ZL = 2µF+30unless otherwise specified. Limits apply to TA  
=
25˚C. See Figure 1.  
Symbol  
Parameter  
Conditions  
LM4953  
Units (Limits)  
Typ  
Limit  
(Note 6)  
(Notes 7, 8)  
SD1  
SD2  
V (max)  
VSDIL  
Shutdown Voltage Input Low  
0.3*CPVdd  
10  
TWU  
VOS  
Wake-up Time  
125  
1
µsec  
Output Offset Voltage  
mV (max)  
THD = 1% (max); f = 1kHz  
VOUT  
Output Voltage Swing  
10.2  
Vpp  
ZL = 2µF+30, Mono BTL  
Total Harmonic Distortion +  
Noise  
THD+N  
VOUT = 8.5Vp-p, fIN = 1kHz  
0.02  
15  
%
Output Noise  
A-Weighted Filter, VIN = 0V  
VRIPPLE = 200mVp-p, f = 217Hz,  
Input Referred  
µV  
dB  
OS  
73  
Power Supply Rejection  
Ratio  
PSRR  
SNR  
VRIPPLE = 200mVp-p, f = 1kHz,  
Input Referred  
68  
dB  
dB  
Signal-to-Noise Ratio  
ZL = 2µF+30, VOUT = 8.5Vp-p  
105  
Note 1: All voltages are measured with respect to the GND pin unless otherwise specified.  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions that  
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit  
is given; however, the typical value is a good indication of device performance.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature, T . The maximum  
A
JMAX JA  
allowable power dissipation is P  
= (T  
– T )/θ or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4xxx typical application  
DMAX  
JMAX A JA  
(shown in Figure 1) with V  
= yyV, R = 2µF+30mono BTL operation the total power dissipation is xxxW. θ = 40˚C/W.  
DD  
L
J
A
Note 4: Human body model, 100pF discharged through a 1.5kresistor.  
Note 5: Machine Model, 220pF-240pF discharged through all pins.  
Note 6: Typicals are measured at 25˚C and represent the parametric norm.  
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.  
Note 9: If the product is in shutdown mode and V exceeds 3.6V (to a max of 4V V ), then most of the excess current will flow through the ESD protection circuits.  
DD  
DD  
If the source impedance limits the current to a max of 10mA, then the part will be protected. If the part is enabled when V  
be curtailed or the part may be permanently damaged.  
is above 4V, circuit performance will  
DD  
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4
Typical Performance Characteristics  
THD+N vs Frequency  
THD+N vs Frequency  
VDD = 2V, VO = 2Vpp, ZL = 2µF+30Ω  
VDD = 3V, VO = 6Vpp, ZL = 2µF+30Ω  
20142112  
20142113  
THD+N vs Frequency  
THD+N vs Frequency  
VDD = 3.6V, VO = 8.5Vpp, ZL = 2µF+30Ω  
VDD = 4.2V, VO = 10Vpp, ZL = 2µF+30Ω  
20142114  
20142118  
THD+N vs Output Voltage  
THD+N vs Output Voltage  
VDD = 2V, f = 1kHz, ZL = 2µF+30Ω  
VDD = 3V, f = 1kHz, ZL = 2µF+30Ω  
20142121  
20142119  
5
www.national.com  
Typical Performance Characteristics (Continued)  
THD+N vs Output Voltage  
THD+N vs Output Voltage  
VDD = 3.6V, f = 1kHz, ZL = 2µF+30Ω  
VDD = 4.2V, f = 1kHz, ZL = 2µF+30Ω  
20142120  
20142122  
PSRR vs Frequency  
PSRR vs Frequency  
VDD = 2V, ZL = 2µF+30Ω  
VDD = 3V, ZL = 2µF+30Ω  
20142123  
20142125  
PSRR vs Frequency  
PSRR vs Frequency  
VDD = 3.6V, ZL = 2µF+30Ω  
VDD = 4.2V, ZL = 2µF+30Ω  
20142124  
20142126  
www.national.com  
6
Typical Performance Characteristics (Continued)  
Supply Current vs Supply Voltage  
ZL = 2µF+30Ω  
20142127  
By driving the load differentially through outputs OUT A and  
Application Information  
OUT B, an amplifier configuration commonly referred to as  
“bridged mode” is established. Bridged mode operation is  
different from the classic single-ended amplifier configura-  
tion where one side of the load is connected to ground.  
ELIMINATING THE OUTPUT COUPLING CAPACITOR  
The LM4953 features a low noise inverting charge pump that  
generates an internal negative supply voltage. This allows  
the outputs of the LM4953 to be biased about GND instead  
of a nominal DC voltage, like traditional headphone amplifi-  
ers. Because there is no DC component, the large DC  
blocking capacitors (typically 220µF) are not necessary. The  
coupling capacitors are replaced by two, small ceramic  
charge pump capacitors, saving board space and cost.  
A bridge amplifier design has a few distinct advantages over  
the single-ended configuration. It provides differential drive  
to the load, thus doubling the output swing for a specified  
supply voltage. Four times the output power is possible as  
compared to a single-ended amplifier under the same con-  
ditions. This increase in attainable output power assumes  
that the amplifier is not current limited or clipped. In order to  
choose an amplifier’s closed-loop gain without causing ex-  
cessive clipping, please refer to the Audio Power Amplifier  
Design section.  
Eliminating the output coupling capacitors also improves low  
frequency response. In traditional headphone amplifiers, the  
headphone impedance and the output capacitor form a high  
pass filter that not only blocks the DC component of the  
output, but also attenuates low frequencies, impacting the  
bass response. Because the LM4953 does not require the  
output coupling capacitors, the low frequency response of  
the device is not degraded by external components.  
The bridge configuration also creates a second advantage  
over single-ended amplifiers. Since the differential outputs,  
OUT A and OUT B, are biased at half-supply, no net DC  
voltage exists across the load. This eliminates the need for  
an output coupling capacitor which is required in a single  
supply, single-ended amplifier configuration. Without an out-  
put coupling capacitor, the half-supply bias across the load  
would result in both increased internal IC power dissipation  
and also possible loudspeaker damage.  
In addition to eliminating the output coupling capacitors, the  
ground referenced output nearly doubles the available dy-  
namic range of the LM4953 when compared to a traditional  
headphone amplifier operating from the same supply volt-  
age.  
OUTPUT TRANSIENT (’CLICK AND POPS’)  
ELIMINATED  
BRIDGE CONFIGURATION EXPLANATION  
The Audio Amplifier portion of the LM4953has two internal  
amplifiers allowing different amplifier configurations. The first  
amplifier’s gain is externally configurable, whereas the sec-  
ond amplifier is internally fixed in a unity-gain, inverting  
configuration. The closed-loop gain of the first amplifier is set  
by selecting the ratio of Rf to Ri while the second amplifier’s  
gain is fixed by the two internal 20kresistors. Figure 1  
shows that the output of amplifier one serves as the input to  
amplifier two. This results in both amplifiers producing sig-  
nals identical in magnitude, but out of phase by 180˚. Con-  
sequently, the differential gain for the Audio Amplifier is  
The LM4953 contains advanced circuitry that virtually elimi-  
nates output transients (’clicks and pops’). This circuitry  
prevents all traces of transients when the supply voltage is  
first applied or when the part resumes operation after coming  
out of shutdown mode.  
POWER DISSIPATION  
Power dissipation is a major concern when using any power  
amplifier and must be thoroughly understood to ensure a  
successful design. Equation 1 states the maximum power  
dissipation point for a single-ended amplifier operating at a  
given supply voltage and driving a specified output load.  
AVD = 2 *(Rf/Ri)  
2
PDMAX = (VDD  
)
/ (2π2ZL)  
(1)  
7
www.national.com  
There are a few ways to control the micro-power shutdown.  
These include using a single-pole, single-throw switch, a  
microprocessor, or a microcontroller. When using a switch,  
connect an external 100kpull-up resistor between the SD  
pins and VDD. Connect the switch between the SD pins and  
ground. Select normal amplifier operation by opening the  
switch. Closing the switch connects the SD pins to ground,  
activating micro-power shutdown. The switch and resistor  
guarantee that the SD pins will not float. This prevents  
unwanted state changes. In a system with a microprocessor  
or microcontroller, use a digital output to apply the control  
voltage to the SD pins. Driving the SD pins with active  
circuitry eliminates the pull-up resistor.  
Application Information (Continued)  
Since the LM4953 has two operational amplifiers in one  
package, the maximum internal power dissipation point is  
twice that of the number which results from Equation 1. Even  
with large internal power dissipation, the LM4953 does not  
require heat sinking over a large range of ambient tempera-  
tures. The maximum power dissipation point obtained must  
not be greater than the power dissipation that results from  
Equation 2:  
PDMAX = (TJMAX - TA) / (θJA  
)
(2)  
Depending on the ambient temperature, TA, of the system  
surroundings, Equation 2 can be used to find the maximum  
internal power dissipation supported by the IC packaging. If  
the result of Equation 1 is greater than that of Equation 2,  
then either the supply voltage must be decreased, the load  
impedance increased or TA reduced. Power dissipation is a  
function of output power and thus, if typical operation is not  
around the maximum power dissipation point, the ambient  
temperature may be increased accordingly.  
SELECTING PROPER EXTERNAL COMPONENTS  
Optimizing the LM4953’s performance requires properly se-  
lecting external components. Though the LM4953 operates  
well when using external components with wide tolerances,  
best performance is achieved by optimizing component val-  
ues.  
Charge Pump Capacitor Selection  
<
Use low ESR (equivalent series resistance) ( 100m) ce-  
ramic capacitors with an X7R dielectric for best perfor-  
mance. Low ESR capacitors keep the charge pump output  
impedance to a minimum, extending the headroom on the  
negative supply. Higher ESR capacitors result in reduced  
output power from the audio amplifiers.  
POWER SUPPLY BYPASSING  
As with any power amplifier, proper supply bypassing is  
critical for low noise performance and high power supply  
rejection. Applications that employ a 3V power supply typi-  
cally use a 4.7µF capacitor in parallel with a 0.1µF ceramic  
filter capacitor to stabilize the power supply’s output, reduce  
noise on the supply line, and improve the supply’s transient  
response. Keep the length of leads and traces that connect  
capacitors between the LM4953’s power supply pin and  
ground as short as possible.  
Charge pump load regulation and output impedance are  
affected by the value of the flying capacitor (C1). A larger  
valued C1 (up to 3.3uF) improves load regulation and mini-  
mizes charge pump output resistance. Beyond 3.3uF, the  
switch-on resistance dominates the output impedance for  
capacitor values above 2.2uF.  
The output ripple is affected by the value and ESR of the  
output capacitor (C2). Larger capacitors reduce output ripple  
on the negative power supply. Lower ESR capacitors mini-  
mize the output ripple and reduce the output impedance of  
the charge pump.  
AUTOMATIC STANDBY MODE  
The LM4953 features Automatic Standby Mode circuitry  
(patent pending). In the absence of an input signal, after  
approximately 3 seconds, the LM4953 goes into low current  
standby mode. The LM4953 recovers into full power operat-  
ing mode immediately after a signal, which is greater than  
the input threshold voltage, is applied to either the left or right  
input pins. The input threshold voltage is not a static value,  
as the supply voltage increases, the input threshold voltage  
decreases. This feature reduces power supply current con-  
sumption in battery operated applications.  
The LM4953 charge pump design is optimized for 2.2uF, low  
ESR, ceramic, flying, and output capacitors.  
Input Capacitor Value Selection  
Amplifying the lowest audio frequencies requires high value  
input coupling capacitors (Ci in Figure 1). A high value ca-  
pacitor can be expensive and may compromise space effi-  
ciency in portable designs. In many cases, however, the  
speakers used in portable systems, whether internal or ex-  
ternal, have little ability to reproduce signals below 150Hz.  
Applications using speakers with this limited frequency re-  
sponse reap little improvement by using high value input and  
output capacitors.  
To ensure correct operation of Automatic Standby Mode,  
proper layout techniques should be implemented. Separat-  
ing PGND and SGND can help reduce noise entering the  
LM4953 in noisy environments. It is also important to use  
correct power off sequencing. The device should be in shut-  
down and then powered off in order to ensure proper func-  
tionality of the Auto-Standby feature. While Automatic  
Standby Mode reduces power consumption very effectively  
during silent periods, maximum power saving is achieved by  
putting the device into shutdown when it is not in use.  
Besides affecting system cost and size, Ci has an effect on  
the LM4953’s click and pop performance. The magnitude of  
the pop is directly proportional to the input capacitor’s size.  
Thus, pops can be minimized by selecting an input capacitor  
value that is no higher than necessary to meet the desired  
−3dB frequency.  
MICRO POWER SHUTDOWN  
The voltage applied to the SD controls the LM4953’s shut-  
down function. When active, the LM4953’s micropower shut-  
down feature turns off the amplifiers’ bias circuitry, reducing  
the supply current. The trigger point is 0.3*CPVDD for a  
logic-low level, and 0.7*CPVDD for logic-high level. The low  
0.01µA (typ) shutdown current is achieved by applying a  
voltage that is as near as ground a possible to the SD pins.  
A voltage that is higher than ground may increase the shut-  
down current.  
As shown in Figure 1, the internal input resistor, Ri and the  
input capacitor, Ci, produce a -3dB high pass filter cutoff  
frequency that is found using Equation (3). Conventional  
headphone amplifiers require output capacitors; Equation (3)  
can be used, along with the value of RL, to determine to-  
wards the value of output capacitor needed to produce a  
–3dB high pass filter cutoff frequency.  
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8
types of capacitors (tantalum, electrolytic, ceramic) have  
unique performance characteristics and may affect overall  
system performance. (See the section entitled Charge Pump  
Capacitor Selection.)  
Application Information (Continued)  
fi-3dB = 1 / 2πRiCi  
(3)  
Also, careful consideration must be taken in selecting a  
certain type of capacitor to be used in the system. Different  
9
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Revision History  
Rev  
Date  
Description  
Started D/S by copying LM4926  
(DS201161).  
1.0  
2/18/05  
1.2  
1.3  
1.4  
9/13/05  
9/14/05  
9/19/05  
Added the Typ Perf curves and  
Application Info section.  
Added more Typ Perf curves.  
First WEB release on the D/S.  
Fixed some typo, then re-released D/S to  
the WEB.  
www.national.com  
10  
Physical Dimensions inches (millimeters) unless otherwise noted  
LLP Package  
Order Number LM4953SD  
NS Package Number SDA14A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
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National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
Leadfree products are RoHS compliant.  
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