74HC3G14DC-Q100H [NXP]
74HC(T)3G14-Q100 - Triple inverting Schmitt trigger SSOP 8-Pin;型号: | 74HC3G14DC-Q100H |
厂家: | NXP |
描述: | 74HC(T)3G14-Q100 - Triple inverting Schmitt trigger SSOP 8-Pin |
文件: | 总20页 (文件大小:149K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74HC3G14-Q100;
74HCT3G14-Q100
Triple inverting Schmitt trigger
Rev. 2 — 9 December 2013
Product data sheet
1. General description
The 74HC3G14-Q100; 74HCT3G14-Q100 is a triple inverter with Schmitt-trigger inputs.
Inputs include clamp diodes that enable the use of current limiting resistors to interface
inputs to voltages in excess of VCC. Schmitt trigger inputs transform slowly changing input
signals into sharply defined jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Complies with JEDEC standard no. 7A
Wide supply voltage range from 2.0 V to 6.0 V
Input levels:
For 74HC3G14-Q100: CMOS level
For 74HCT3G14-Q100: TTL level
High noise immunity
Low power dissipation
Balanced propagation delays
Unlimited input rise and fall times
Multiple package options
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Applications
Wave and pulse shaper for highly noisy environments
Astable multivibrators
Monostable multivibrators
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
4. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
Type number
Description
Version
74HC3G14DP-Q100 40 C to +125 C
74HCT3G14DP-Q100
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74HC3G14DC-Q100 40 C to +125 C
74HCT3G14DC-Q100
VSSOP8
plastic very thin shrink small outline package; 8
leads; body width 2.3 mm
SOT765-1
5. Marking
Table 2.
Marking
Type number
Marking code[1]
74HC3G14DP-Q100
74HCT3G14DP-Q100
74HC3G14DC-Q100
74HCT3G14DC-Q100
H14
T14
H14
T14
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
1A
3Y
2A
1Y
3A
2Y
A
Y
001aah728
001aah729
mna025
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
(one Schmitt trigger)
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
2 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
7. Pinning information
7.1 Pinning
ꢀꢁ+&ꢂ*ꢃꢁꢄ4ꢃꢅꢅ
ꢀꢁ+&7ꢂ*ꢃꢁꢄ4ꢃꢅꢅ
ꢀ
ꢂ
ꢁ
ꢃ
ꢆ
ꢇ
ꢄ
ꢅ
ꢀ$
ꢁ<
9
&&
ꢀ<
ꢁ$
ꢂ<
ꢂ$
*1'
DDDꢀꢁꢁꢂꢃꢄꢅ
Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8)
7.2 Pin description
Table 3.
Symbol
1A, 2A, 3A
GND
Pin description
Pin
Description
data input
1, 3, 6
4
ground (0 V)
data output
supply voltage
1Y, 2Y, 3Y
VCC
7, 5, 2
8
8. Functional description
Table 4.
Function table[1]
Input
nA
L
Output
nY
H
H
L
[1] H = HIGH voltage level; L = LOW voltage level.
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
3 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Max
+7.0
20
20
25
+50
-
Unit
V
VCC
IIK
supply voltage
0.5
[1]
[1]
[1]
[1]
[1]
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
VO = 0.5 V to VCC + 0.5 V
-
mA
mA
mA
mA
mA
C
IOK
IO
-
-
ICC
IGND
Tstg
Ptot
supply current
-
ground current
50
65
-
storage temperature
total power dissipation
+150
300
[2]
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions
74HC3G14-Q100
74HCT3G14-Q100
Unit
Min
Typ
5.0
-
Max
Min
Typ
5.0
-
Max
VCC
VI
supply voltage
input voltage
2.0
0
6.0
VCC
VCC
+125
4.5
0
5.5
VCC
VCC
V
V
V
VO
output voltage
ambient temperature
0
-
0
-
Tamb
40
+25
40
+25
+125 C
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
4 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
11. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C.
Symbol Parameter
Conditions
25 C
40 C to +85 C 40 C to +125 C Unit
Min Typ Max
Min
Max
Min
Max
74HC3G14-Q100
VOH
HIGH-level
VI = VT+ or VT
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
VI = VT+ or VT
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
4.18 4.32
5.68 5.81
4.13
5.63
VOL
LOW-level
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
1.0
V
V
II
input leakage VI = VCC or GND; VCC = 6.0 V
current
-
0.1
1.0
-
A
ICC
CI
supply current per input pin; VCC = 6.0 V;
VI = VCC or GND; IO = 0 A;
-
-
-
-
-
10
-
-
-
20
-
A
input
2.0
pF
capacitance
74HCT3G14-Q100
VOH
HIGH-level
VI = VT+ or VT
output voltage
IO = 20 A; VCC = 4.5 V
IO = 4.0 mA; VCC = 4.5 V
VI = VIH or VIL
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
4.18 4.32
4.13
VOL
LOW-level
output voltage
IO = 20 A; VCC = 4.5 V
IO = 4.0 mA; VCC = 4.5 V
-
-
-
0
0.1
-
-
-
0.1
-
-
-
0.1
0.4
V
0.15 0.26
0.33
1.0
V
II
input leakage VI = VCC or GND; VCC = 5.5 V
current
-
-
-
0.1
1.0
A
ICC
ICC
supply current per input pin; VCC = 5.5 V;
VI = VCC or GND; IO = 0 A;
-
-
1.0
-
-
10
-
-
20
A
A
additional
per input;
300
375
410
supply current VCC = 4.5 V to 5.5 V;
VI = VCC 2.1 V; IO = 0 A
CI
input
-
2.0
-
-
-
-
-
pF
capacitance
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
5 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
Table 8.
Transfer characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 10.
Symbol Parameter
Conditions
25 C
40 C to +125 C
Unit
Min
Typ Max
Min
Max
Max
(85 C) (125 C)
74HC3G14-Q100
VT+
VT
VH
positive-going
threshold voltage
see Figure 5, Figure 6
VCC = 2.0 V
1.00 1.18 1.50 1.00
2.30 2.60 3.15 2.30
3.00 3.46 4.20 3.00
1.50
3.15
4.20
1.50
3.15
4.20
V
V
V
VCC = 4.5 V
VCC = 6.0 V
negative-going
threshold voltage
see Figure 5, Figure 6
VCC = 2.0 V
0.30 0.60 0.90 0.30
1.13 1.47 2.00 1.13
1.50 2.06 2.60 1.50
0.90
2.00
2.60
0.90
2.00
2.60
V
V
V
VCC = 4.5 V
VCC = 6.0 V
hysteresis voltage
(VT+ VT); see Figure 5,
Figure 6 and Figure 8
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
0.30 0.60 1.00 0.30
0.60 1.13 1.40 0.60
0.80 1.40 1.70 0.80
1.00
1.40
1.70
1.00
1.40
1.70
V
V
V
74HCT3G14-Q100
VT+
VT
VH
positive-going
threshold voltage
see Figure 5, Figure 6
VCC = 4.5 V
1.20 1.58 1.90 1.20
1.40 1.78 2.10 1.40
1.90
2.10
1.90
2.10
V
V
VCC = 5.5 V
negative-going
threshold voltage
see Figure 5, Figure 6
VCC = 4.5 V
0.50 0.87 1.20 0.50
0.60 1.11 1.40 0.60
1.20
1.40
1.20
1.40
V
V
VCC = 5.5 V
hysteresis voltage
(VT+ VT); see Figure 5,
Figure 6 and Figure 7
VCC = 4.5 V
VCC = 5.5 V
0.40 0.71
0.40 0.67
-
-
0.40
0.40
-
-
-
-
V
V
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
6 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
11.1 Waveforms transfer characteristics
V
O
V
T+
V
I
V
H
V
T−
V
I
V
V
O
H
V
V
T+
T−
mna207
mna208
Fig 5. Transfer characteristic
Fig 6. Definition of VT+, VT and VH
mna031
mna032
2.0
3.0
I
CC
I
CC
(mA)
(mA)
2.0
1.0
1.0
0
0
0
2.5
5.0
0
3.0
6.0
V (V)
I
V (V)
I
a. VCC = 4.5 V.
Fig 7. Typical 74HCT3G14-Q100 transfer characteristics
b. VCC = 5.5 V.
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
7 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
mna029
mna028
1.0
100
I
CC
(mA)
I
CC
(μA)
0.8
0.6
0.4
0.2
0
50
0
0
2.5
5.0
0
1.0
2.0
V (V)
I
V (V)
I
a. VCC = 2.0 V
b. VCC = 4.5 V
mna030
1.6
I
CC
(mA)
0.8
0
0
3.0
6.0
V (V)
I
c.
VCC = 6.0 V
Fig 8. Typical 74HC3G14-Q100 transfer characteristics
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
8 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
12. Dynamic characteristics
Table 9.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 10.
Symbol Parameter
Conditions
25 C
40 C to +125 C
Unit
Min
Typ Max
Min
Max
Max
(85 C) (125 C)
74HC3G14-Q100
[1]
[2]
[3]
tpd
propagation delay
nA to nY; see Figure 9
VCC = 2.0 V
-
-
-
53
16
13
125
25
-
-
-
155
31
190
38
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
21
26
32
tt
transition time
nY; see Figure 9
VCC = 2.0 V
-
-
-
-
20
7
75
15
13
-
-
-
-
-
95
19
16
-
110
22
19
-
ns
ns
ns
pF
VCC = 4.5 V
VCC = 6.0 V
5
CPD
power dissipation
capacitance
VI = GND to VCC
10
74HCT3G14-Q100
tpd propagation delay
[1]
[2]
[3]
nA to nY; see Figure 9
VCC = 4.5 V
-
21
32
-
40
48
ns
tt
transition time
nY; see Figure 9
VCC = 4.5 V
-
-
6
15
-
-
-
19
-
22
-
ns
CPD
power dissipation
capacitance
VI = GND to VCC 1.5 V
10
pF
[1] tpd is the same as tPLH and tPHL
[2] tt is the same as tTLH and tTHL
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of the outputs.
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
9 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
13. Waveforms
V
I
V
V
M
nA input
GND
M
t
t
PHL
PLH
V
OH
90 %
V
V
nY output
M
M
10 %
V
OL
t
t
TLH
THL
mna722
Measurement points are given in Table 10.
OL and VOH are typical voltage output levels that occur with the output load.
V
Fig 9. The data input (nA) to output (nY) propagation delays and output transition times
Table 10. Measurement points
Type
Input
VM
Output
VM
74HC3G14-Q100
74HCT3G14-Q100
0.5VCC
1.3 V
0.5VCC
1.3 V
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
10 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
CC
V
CC
V
V
O
I
R
L
S1
G
open
DUT
R
T
C
L
001aad983
Test data is given in Table 11.
Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 10. Test circuit for measuring switching times
Table 11. Test data
Type
Input
VI
Load
CL
S1 position
tPHL, tPLH
open
tr, tf
RL
74HC3G14-Q100 GND to VCC
74HCT3G14-Q100 GND to 3.0 V
6 ns
6 ns
50 pF
50 pF
1 k
1 k
open
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
11 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
14. Application information
The slow input rise and fall times cause additional power dissipation, which can be
calculated using the following formula:
Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC where:
Padd = additional power dissipation (W);
fi = input frequency (MHz);
tr = input rise time (ns); 10 % to 90 %;
tf = input fall time (ns); 90 % to 10 %;
ICC(AV) = average additional supply current (A).
ICC(AV) differs with positive or negative input transitions, as shown in Figure 11 and
Figure 12.
An example of a relaxation circuit using the 74HC3G14-Q100/74HCT3G14-Q100 is
shown in Figure 13.
mna036
200
ΔI
CC(AV)
(μA)
150
positive-going
edge
100
50
negative-going
edge
0
0
2.0
4.0
6.0
V
(V)
CC
linear change of VI between 0.1VCC to 0.9VCC
.
Fig 11. ICC(AV) as a function of VCC for 74HC3G14-Q100
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
12 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
mna058
200
ΔI
CC(AV)
(μA)
150
100
50
positive-going
edge
negative-going
edge
0
0
2
4
6
V
(V)
CC
linear change of VI between 0.1VCC to 0.9VCC
.
Fig 12. ICC(AV) as a function of VCC for 74HCT3G14-Q100
R
C
mna035
1
T
1
-- ---------------------
For 74HC3G14-Q100: f =
0.8 RC
1
T
1
-- ------------------------
For 74HCT3G14-Q100: f =
0.67 RC
For K-factor, see Figure 14
Fig 13. Relaxation oscillator
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
13 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
DDDꢀꢁꢁꢄꢆꢁꢂ
DDDꢀꢁꢁꢄꢆꢇꢁ
ꢂꢋꢌ
.
ꢀꢋꢂ
ꢀꢋꢌ
ꢌꢋꢆ
ꢌꢋꢄ
ꢌꢋꢃ
ꢌꢋꢂ
ꢌ
.
ꢀꢋꢅ
ꢀꢋꢌ
ꢌꢋꢅ
ꢌ
ꢂ
ꢁ
ꢃ
ꢅ
ꢄ
ꢃꢋꢅ
ꢅꢋꢌ
ꢅꢋꢅ
9
ꢈꢉ9ꢊ
&&
9
ꢈꢉ9ꢊ
&&
K-factor for 74HC3G14-Q100
K-factor for 74HCT3G14-Q100
Fig 14. Typical K-factor for relaxation oscillator
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
14 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 15. Package outline SOT505-2 (TSSOP8)
74HC_HCT3G14_Q100
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
15 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 16. Package outline SOT765-1 (VSSOP8)
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
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NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
16. Abbreviations
Table 12. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ElectroStatic Discharge
Human Body Model
Military
ESD
HBM
MIL
MM
Machine Model
17. Revision history
Table 13. Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
- 74HC_HCT3G14_Q100 v.1
74HC_HCT3G14_Q100 v.2 20131209
Product data sheet
Modifications:
• Figure 14 added (typical K-factor for relaxation oscillator).
74HC_HCT3G14_Q100 v.1 20131115
Product data sheet
-
-
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
17 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
18.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
18 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT3G14_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 9 December 2013
19 of 20
NXP Semiconductors
74HC3G14-Q100; 74HCT3G14-Q100
Triple inverting Schmitt trigger
20. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Waveforms transfer characteristics . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
9
10
11
11.1
12
13
14
15
16
17
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 December 2013
Document identifier: 74HC_HCT3G14_Q100
相关型号:
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