74LVC3G07GM [NXP]
Triple buffer with open-drain output; 开漏输出三重缓冲
| 型号： | 74LVC3G07GM |
| 厂家： | 
NXP |
| 描述： | Triple buffer with open-drain output |
| 文件： | 总16页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC3G07
Triple buffer with open-drain output
Rev. 06 — 16 June 2008
Product data sheet
1. General description
The 74LVC3G07 provides three non-inverting buffers.
The output of the device is an open-drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall
time.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
2. Features
I Wide supply voltage range from 1.65 V to 5.5 V
I 5 V tolerant input/output for interfacing with 5 V logic
I High noise immunity
I Complies with JEDEC standard:
N JESD8-7 (1.65 V to 1.95 V)
N JESD8-5 (2.3 V to 2.7 V)
N JESD8-B/JESD36 (2.7 V to 3.6 V).
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
I −24 mA output drive (VCC = 3.0 V)
I CMOS low power consumption
I Latch-up performance exceeds 250 mA
I Direct interface with TTL levels
I Inputs accept voltages up to 5 V
I Multiple package options
I Specified from −40 °C to +85 °C and −40 °C to +125 °C.
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC3G07DP −40 °C to +125 °C
74LVC3G07DC −40 °C to +125 °C
74LVC3G07GT −40 °C to +125 °C
74LVC3G07GD −40 °C to +125 °C
74LVC3G07GM −40 °C to +125 °C
TSSOP8 plastic thin shrink small outline package; 8 leads; body
width 3 mm; lead length 0.5 mm
SOT505-2
SOT765-1
SOT833-1
SOT996-2
SOT902-1
VSSOP8 plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
XSON8
plastic extremely thin small outline package; no leads; 8
terminals; body 1 × 1.95 × 0.5 mm
XSON8U plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
XQFN8U plastic extremely thin quad flat package; no leads; 8
terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm
4. Marking
Table 2.
Marking codes
Type number
74LVC3G07DP
74LVC3G07DC
74LVC3G07GT
74LVC3G07GD
74LVC3G07GM
Marking code
V07
V07
V07
V07
V07
5. Functional diagram
1
1A
2A
3A
1Y
2Y
3Y
1A
2A
3A
1Y
2Y
1
Y
3Y
1
A
001aah762
001aah763
GND mna591
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram (one driver)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
2 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
6. Pinning information
6.1 Pinning
74LVC3G07
1A
3Y
1
2
3
4
8
7
6
5
V
CC
1Y
3A
2Y
74LVC3G07
2A
1
2
3
4
8
7
6
5
1A
3Y
V
CC
1Y
3A
2Y
GND
2A
GND
001aac022
Transparent top view
001aab022
Fig 4. Pin configuration SOT505-2 (TSSOP8) and
SOT765-1 (VSSOP8)
Fig 5. Pin configuration SOT833-1 (XSON8)
74LVC3G07
terminal 1
index area
1Y
1
7
6
5
1A
3Y
2A
74LVC3G07
1A
3Y
1
2
3
4
8
7
6
5
V
CC
3A
2Y
2
3
1Y
3A
2Y
2A
GND
001aag243
001aai252
Transparent top view
Transparent top view
Fig 6. Pin configuration SOT996-2 (XSON8U)
Fig 7. Pin configuration SOT902-1 (XQFN8U)
6.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT505-2, SOT765-1,
SOT902-1
SOT833-1 and SOT996-2
1A, 2A, 3A
GND
1, 3, 6
7, 5, 2
data input
4
4
ground (0 V)
data output
supply voltage
1Y, 2Y, 3Y
VCC
7, 5, 2
8
1, 3, 6
8
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
3 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
7. Functional description
Table 4.
Function table[1]
Input nA
Output nY
L
L
Z
H
[1] H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
−0.5
−50
−0.5
−50
−0.5
−0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
VI
+6.5
-
IOK
output clamping current
output voltage
VO < 0 V
mA
V
[1]
VO
Active mode
+6.5
+6.5
50
[1][2]
Power-down mode
VO = 0 V to 6.5 V
V
IO
output current
mA
mA
mA
°C
ICC
IGND
Tstg
Ptot
supply current
-
100
-
ground current
−100
−65
-
storage temperature
total power dissipation
+150
250
[3]
Tamb = −40 °C to +125 °C
mW
[1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K.
For XSON8, XSON8U and XQFN8U packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
VCC
Operating conditions
Parameter
Conditions
Min
Max
5.5
5.5
5.5
5.5
+125
20
Unit
supply voltage
input voltage
1.65
V
VI
0
V
VO
output voltage
Active mode
0
V
Power-down mode; VCC = 0 V
0
V
Tamb
ambient temperature
−40
°C
ns/V
ns/V
∆t/∆V
input transition rise and fall rate
VCC = 1.65 V to 2.7 V
VCC = 2.7 V to 5.5 V
-
-
10
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
4 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +85 °C[1]
VIH
HIGH-level input
voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VI = VIH or VIL
0.65 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7 × VCC
-
VIL
LOW-level input
voltage
-
-
-
-
0.35 × VCC
0.7
0.8
0.3 × VCC
VOL
LOW-level output
voltage
IO = 100 µA;
-
-
0.1
V
VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
-
-
-
-
-
-
-
0.45
0.3
V
-
V
-
0.4
V
-
0.55
0.55
±5
V
-
V
[2]
II
input leakage current VI = 5.5 V or GND;
CC = 0 V to 5.5 V
±0.1
µA
V
IOZ
IOFF
ICC
∆ICC
CI
OFF-state output
current
VI = VIH or VIL; VO = VCC or GND;
CC = 5.5 V
-
-
-
-
-
±0.1
±0.1
0.1
5
±10
±10
10
µA
µA
µA
µA
pF
V
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
supply current
VI = 5.5 V or GND; IO = 0 A;
VCC = 1.65 V to 5.5 V
[2]
additional supply
current
per pin; VCC = 2.3 V to 5.5 V;
VI = VCC − 0.6 V; IO = 0 A
500
-
input capacitance
2.5
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
5 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +125 °C
VIH
HIGH-level input
voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VI = VIH or VIL
0.65 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7 × VCC
-
VIL
LOW-level input
voltage
-
-
-
-
0.35 × VCC
0.7
0.8
0.3 × VCC
VOL
LOW-level output
voltage
IO = 100 µA;
-
-
0.1
V
VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.70
0.45
0.60
0.80
0.80
±20
V
V
V
V
V
II
input leakage current VI = 5.5 V or GND;
CC = 0 V to 5.5 V
µA
V
IOZ
IOFF
ICC
∆ICC
OFF-state output
current
VI = VIH or VIL; VO = VCC or GND;
CC = 5.5 V
-
-
-
-
-
-
-
-
±10
±20
40
µA
µA
µA
µA
V
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
supply current
VI = 5.5 V or GND; IO = 0 A;
VCC = 1.65 V to 5.5 V
additional supply
current
per pin; VCC = 2.3 V to 5.5 V;
VI = VCC − 0.6 V; IO = 0 A
5000
[1] All typical values are measured at Tamb = 25 °C.
[2] These typical values are measured at VCC = 3.3 V.
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
6 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.
Symbol Parameter Conditions −40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
[2]
tpd
propagation delay nA to nY; see Figure 8
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
1.0
0.5
1.0
0.5
0.5
-
2.9
1.7
2.3
2.1
1.5
6.5
6.7
4.3
4.2
3.7
2.9
-
1.0
0.5
1.0
0.5
0.5
-
8.4
5.5
5.3
4.7
3.7
-
ns
ns
ns
ns
ns
pF
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
[3]
CPD
power dissipation VI = GND to VCC; VCC = 3.3 V
capacitance
[1] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2] tpd is the same as tPLZ and tPZL
.
[3] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of outputs.
12. Waveforms
V
I
V
V
M
nA input
M
GND
t
t
PZL
PLZ
V
CC
nY output
V
M
V
V
OL
X
mna528
Measurement points are given in Table 9.
VOL is the typical output voltage drop that occur with the output load.
Fig 8. The input (nA) to output (nY) propagation delays
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
7 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
Table 9.
Measurement points
Supply voltage
VCC
Input
Output
VM
VM
VX
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
0.5 × VCC
0.5 × VCC
1.5 V
0.5 × VCC
0.5 × VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.3 V
3.0 V to 3.6 V
4.5 V to 5.5 V
1.5 V
1.5 V
0.5 × VCC
0.5 × VCC
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
R
T
C
L
R
L
mna616
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 9. Load circuit for measuring switching times
Table 10. Test data
Supply voltage
VCC
Input
VI
Load
CL
VEXT
tr = tf
RL
tPZL, tPLZ
2 × VCC
2 × VCC
6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
VCC
VCC
2.7 V
2.7 V
VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
≤ 2.5 ns
30 pF
30 pF
50 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
500 Ω
3.0 V to 3.6 V
4.5 V to 5.5 V
6 V
2 × VCC
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
8 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 10. Package outline SOT505-2 (TSSOP8)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
9 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 11. Package outline SOT765-1 (VSSOP8)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
10 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
b
1
2
3
4
4×
(2)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×
(2)
A
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
1
L
L
1
max max
0.25
0.17
2.0
1.9
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
07-11-14
07-12-07
SOT833-1
- - -
MO-252
Fig 12. Package outline SOT833-1 (XSON8)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
11 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
M
M
v
C A
C
B
b
e
L
1
y
y
w
C
1
1
4
L
2
L
8
5
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
L
L
L
v
w
y
y
1
1
2
max
0.05 0.35
0.00 0.15
2.1
1.9
3.1
2.9
0.5
0.3
0.15
0.05
0.6
0.4
mm
0.5
0.5
1.5
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
07-12-18
07-12-21
SOT996-2
- - -
Fig 13. Package outline SOT996-2 (XSON8U)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
12 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
XQFN8U: plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
SOT902-1
D
B
A
terminal 1
index area
E
A
A
1
detail X
e
L
1
e
C
y
C
1
y
L
M
M
v
C A
C
B
4
w
5
6
7
3
2
metal area
not for soldering
e
1
b
e
1
1
terminal 1
index area
8
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
L
L
v
w
y
y
1
1
max
0.05 0.25 1.65 1.65
0.00 0.15 1.55 1.55
0.35 0.15
0.25 0.05
mm
0.5
0.55
0.5
0.1
0.05 0.05 0.05
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
MO-255
JEITA
05-11-25
07-11-14
SOT902-1
- - -
- - -
Fig 14. Package outline SOT902-1 (XQFN8U)
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
13 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
14. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12. Revision history
Document ID
74LVC3G07_6
Modifications:
74LVC3G07_5
74LVC3G07_4
74LVC3G07_3
74LVC3G07_2
74LVC3G07_1
Release date
20080616
Data sheet status
Change notice
Supersedes
Product data sheet
-
74LVC3G07_5
• Added type number 74LVC3G07GD (XSON8U package)
20080219
20070521
20050201
20041027
20040608
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
-
-
-
-
-
74LVC3G07_4
74LVC3G07_3
74LVC3G07_2
74LVC3G07_1
-
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
14 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
16.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC3G07_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2008
15 of 16
74LVC3G07
NXP Semiconductors
Triple buffer with open-drain output
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 June 2008
Document identifier: 74LVC3G07_6
相关型号：
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