74LVC3G07GT [NXP]
Triple buffer with open-drain output; 开漏输出三重缓冲型号: | 74LVC3G07GT |
厂家: | NXP |
描述: | Triple buffer with open-drain output |
文件: | 总14页 (文件大小:79K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74LVC3G07
Triple buffer with open-drain output
Rev. 03 — 01 February 2005
Product data sheet
1. General description
The 74LVC3G07 is a high-performance, low-power, low-voltage, Si-gate CMOS device
and superior to most advanced CMOS compatible TTL families.
Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall
time.
This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry
disables the output, preventing the damaging backflow current through the device when it
is powered down.
The 74LVC3G07 provides three non-inverting buffers.
The output of the device is an open drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
2. Features
■ Wide supply voltage range from 1.65 V to 5.5 V
■ 5 V tolerant input/output for interfacing with 5 V logic
■ High noise immunity
■ Complies with JEDEC standard:
◆ JESD8-7 (1.65 V to 1.95 V)
◆ JESD8-5 (2.3 V to 2.7 V)
◆ JESD8-B/JESD36 (2.7 V to 3.6 V).
■ ESD protection:
◆ HBM EIA/JESD22-A114-B exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V.
■ −24 mA output drive (VCC = 3.0 V)
■ CMOS low power consumption
■ Latch-up performance exceeds 250 mA
■ Direct interface with TTL levels
■ Inputs accept voltages up to 5 V
■ Multiple package options
■ Specified from −40 °C to +85 °C and −40 °C to +125 °C.
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; Tamb = 25 °C.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
tPLZ, tPZL
propagation delay
input nA to output nY CL = 30 pF; RL = 1 kΩ
VCC = 1.8 V;
-
2.9
-
-
-
-
-
ns
ns
ns
ns
ns
VCC = 2.5 V;
CL = 30 pF; RL = 500 Ω
-
-
-
-
1.7
2.3
2.1
1.5
VCC = 2.7 V;
CL = 50 pF; RL = 500 Ω
VCC = 3.3 V;
CL = 50 pF; RL = 500 Ω
VCC = 5.0 V;
CL = 50 pF; RL = 500 Ω
CI
input capacitance
-
-
2.5
6.5
-
-
pF
pF
[1] [2]
CPD
power dissipation
VCC = 3.3 V
capacitance per gate
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
[2] The condition is VI = GND to VCC
.
4. Ordering information
Table 2:
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC3G07DP −40 °C to +125 °C
74LVC3G07DC −40 °C to +125 °C
74LVC3G07GT −40 °C to +125 °C
TSSOP8 plastic thin shrink small outline package; 8 leads; body
width 3 mm; lead length 0.5 mm
SOT505-2
VSSOP8 plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
SOT833-1
XSON8
plastic extremely thin small outline package; no leads;
8 terminals; body 1 × 1.95 × 0.5 mm
5. Marking
Table 3:
Marking codes
Type number
74LVC3G07DP
74LVC3G07DC
74LVC3G07GT
Marking code
V07
V07
V07
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
2 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
6. Functional diagram
1
1
1
1
3
6
7
5
2
1Y
2Y
3Y
1A
2A
3A
1Y
2Y
7
5
2
1A
2A
3A
1
3
6
3Y
mnb136
mnb137
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Y
A
GND mna591
Fig 3. Logic diagram (one driver)
7. Pinning information
7.1 Pinning
07
1A
3Y
1
2
3
4
8
7
6
5
V
CC
1
2
3
4
8
7
6
5
1A
V
CC
1Y
3A
2Y
3Y
2A
1Y
3A
2Y
07
2A
GND
001aab022
GND
001aac022
Transparent top view
Fig 4. Pin configuration VSSOP8 and
TSSOP8
Fig 5. Pin configuration XSON8
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
3 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
7.2 Pin description
reserved
Table 4:
Pin description
Symbol
1A
Pin
1
Description
data input
3Y
2
data output
data input
2A
3
GND
2Y
4
ground (0 V)
data output
data input
5
3A
6
1Y
7
data output
supply voltage
VCC
8
8. Functional description
8.1 Function table
Table 5:
Function table[1]
Input nA
Output nY
L
L
Z
H
[1] H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
9. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Max
+6.5
+6.5
+6.5
+6.5
−50
Unit
V
VCC
VI
supply voltage
input voltage
output voltage
−0.5
[1]
[1]
−0.5
V
VO
active mode
Power-down mode
VI < 0 V
−0.5
V
[1] [2]
−0.5
V
IIK
IOK
IO
input diode current
-
mA
mA
mA
mA
°C
mW
output diode current VO < 0 V
output sink current VO = 0 V to 6.5 V
-
−50
-
50
ICC, IGND VCC or GND current
-
±100
+150
300
Tstg
Ptot
storage temperature
power dissipation
−65
Tamb = −40 °C to +125 °C
-
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
4 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
10. Recommended operating conditions
Table 7:
Recommended operating conditions
Symbol Parameter
Conditions
Min
1.65
0
Typ
Max Unit
VCC
VI
supply voltage
input voltage
output voltage
-
-
-
-
-
-
-
5.5
5.5
VCC
5.5
V
V
V
V
VO
active mode
0
Power-down mode; VCC = 0 V
0
Tamb
tr, tf
ambient temperature
−40
0
+125 °C
input rise and fall
times
VCC = 1.65 V to 2.7 V
VCC = 2.7 V to 5.5 V
20
10
ns/V
0
ns/V
11. Static characteristics
Table 8:
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +85 °C[1]
VIH
HIGH-level input
voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VI = VIH or VIL
0.65 × VCC
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
2.0
0.7 × VCC
VIL
LOW-level input
voltage
-
-
-
-
0.35 × VCC
0.7
0.8
0.3 × VCC
VOL
LOW-level output
voltage
IO = 100 µA;
-
-
0.1
V
VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
-
-
-
-
-
-
-
0.45
0.3
V
-
V
-
0.4
V
-
0.55
0.55
±5
V
-
V
ILI
input leakage current VI = 5.5 V or GND;
CC = 1.65 V to 5.5 V
±0.1
µA
V
IOZ
Ioff
ICC
∆ICC
3-state output
OFF-state current
VI = VIH or VIL; VO = VCC or GND;
CC = 5.5 V
-
-
-
-
-
±0.1
±0.1
0.1
5
±10
±10
10
µA
µA
µA
µA
pF
V
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
additional quiescent
supply current per pin VCC = 2.3 V to 5.5 V
VI = VCC − 0.6 V; IO = 0 A;
500
-
CI
input capacitance
2.5
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
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74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
Table 8:
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +125 °C
VIH
HIGH-level input
voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VI = VIH or VIL
0.65 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7 × VCC
-
VIL
LOW-level input
voltage
-
-
-
-
0.35 × VCC
0.7
0.8
0.3 × VCC
VOL
LOW-level output
voltage
IO = 100 µA;
-
-
0.1
V
VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.70
0.45
0.60
0.80
0.80
±20
V
V
V
V
V
ILI
input leakage current VI = 5.5 V or GND;
CC = 1.65 V to 5.5 V
µA
V
IOZ
Ioff
ICC
∆ICC
3-state output
OFF-state current
VI = VIH or VIL; VO = VCC or GND;
CC = 5.5 V
-
-
-
-
-
-
-
-
±10
±20
40
µA
µA
µA
µA
V
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
additional quiescent
VI = VCC − 0.6 V; IO = 0 A;
5000
supply current per pin VCC = 2.3 V to 5.5 V
[1] All typical values are measured at nominal VCC and Tamb = 25 °C.
12. Dynamic characteristics
Table 9:
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +85 °C[1]
tPLZ, tPZL
propagation delay
input nA to output nY
see Figure 6 and 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
0.5
1.0
0.5
0.5
2.9
1.7
2.3
2.1
1.5
6.7
4.3
4.2
3.7
2.9
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
6 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
Table 9:
Dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[2] [3]
CPD
power dissipation
VCC = 3.3 V
-
6.5
-
pF
capacitance per gate
Tamb = −40 °C to +125 °C
tPLZ, tPZL propagation delay
input nA to output nY
see Figure 6 and 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
0.5
1.0
0.5
0.5
-
-
-
-
-
8.4
5.5
5.3
4.7
3.7
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
[1] All typical values are measured at nominal VCC and Tamb = 25 °C.
[2] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
[3] The condition is VI = GND to VCC
.
13. Waveforms
V
I
V
nA input
M
GND
t
t
PZL
PLZ
V
CC
nY output
V
M
V
X
V
OL
mna528
Measurement points are given in Table 10.
VOL is typical output voltage drop that occurs with the output load.
Fig 6. The input (nA) to output (nY) propagation delays
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
7 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
Table 10: Measurement points
Supply voltage
Input
Output
VCC
VM
VI
VM
VX
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
0.5 × VCC
0.5 × VCC
1.5 V
VCC
VCC
2.7 V
2.7 V
VCC
0.5 × VCC
0.5 × VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.3 V
3.0 V to 3.6 V
4.5 V to 5.5 V
1.5 V
1.5 V
0.5 × VCC
0.5 × VCC
V
EXT
V
CC
R
L
V
I
V
O
PULSE
GENERATOR
D.U.T.
C
L
R
L
R
T
mna616
Test data are given in Table 11.
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse
generator.
Fig 7. Load circuitry for switching times
Table 11: Test data
Supply voltage
VCC
Input
VI
Load
CL
VEXT
tr = tf
RL
tPZL, tPLZ
2 × VCC
2 × VCC
6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
VCC
VCC
2.7 V
2.7 V
VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
≤ 2.5 ns
30 pF
30 pF
50 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
500 Ω
3.0 V to 3.6 V
4.5 V to 5.5 V
6 V
2 × VCC
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
8 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
14. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 8. Package outline SOT505-2 (TSSOP8)
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
9 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 9. Package outline SOT765-1 (VSSOP8)
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
10 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
b
1
2
3
4
4×
(2)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×
(2)
A
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
L
L
1
1
max max
0.25
0.17
2.0
1.9
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
04-07-22
04-11-09
SOT833-1
- - -
MO-252
Fig 10. Package outline SOT833-1 (XSON8)
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
11 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
15. Revision history
Table 12: Revision history
Document ID
74LVC3G07_3
Modifications:
74LVC3G07_2
74LVC3G07_1
Release date Data sheet status
20050201 Product data sheet
Change notice Doc. number
Supersedes
-
9397 750 14542 74LVC3G07_2
• Changed: type number 74LVC3G07GT (XSON8 package).
20041027
Product data sheet
-
9397 750 13791 74LVC3G07_1
20040608
Product data sheet
-
9397 750 13267
-
9397 750 14542
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Product data sheet
Rev. 03 — 01 February 2005
12 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
16. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
18. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14542
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 01 February 2005
13 of 14
74LVC3G07
Philips Semiconductors
Triple buffer with open-drain output
20. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
8.1
9
Functional description . . . . . . . . . . . . . . . . . . . 4
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information . . . . . . . . . . . . . . . . . . . . 13
10
11
12
13
14
15
16
17
18
19
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 01 February 2005
Document number: 9397 750 14542
Published in The Netherlands
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