933438800602 [NXP]

IC ADDR LATCH BASED PRPHL DRVR, PDIP16, 0.300 INCH, PLASTIC, SOT38-4, DIP-16, Peripheral Driver;
933438800602
型号: 933438800602
厂家: NXP    NXP
描述:

IC ADDR LATCH BASED PRPHL DRVR, PDIP16, 0.300 INCH, PLASTIC, SOT38-4, DIP-16, Peripheral Driver

驱动 双倍数据速率 光电二极管 接口集成电路
文件: 总10页 (文件大小:85K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
NE590  
Addressable peripheral driver  
Product data  
2001 Aug 03  
Supersedes data of 1994 Aug 31  
File under Integrated Circuits, IC11 Handbook  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
DESCRIPTION  
PIN CONFIGURATIONS  
The NE590 addressable peripheral driver is a high current latched  
driver, similar in function to the 9334 address decoder. The device  
has eight Darlington power outputs, each capable of 250 mA load  
current. The outputs are turned on or off by respectively loading a  
logic HIGH or logic LOW into the device data input. The required  
output is defined by a 3-bit address. The device must be enabled by  
a CE input line. A common clear input, CLR, turns all outputs off  
when a logic LOW is applied.  
N Package  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A
A
V
CC  
0
1
CLR  
CE  
D
A
2
Q
Q
Q
0
1
2
3
NE590  
Q
7
The NE590 has eight open-collector Darlington outputs which sink  
current to ground. The device is packaged in a 16-pin plastic DIP  
package.  
Q
6
Q
Q
5
GND  
Q
4
TOP VIEW  
FEATURES  
SL00479  
8 high current outputs  
Figure 1. Pin Configuration  
Low-loading bus compatible inputs  
Power-on clear ensures safe operation  
NE590 will operate in addressable or demultiplex mode  
Allows random (addressed) data entry  
Easily expandable  
PIN DESCRIPTION  
PIN  
SYMBOL  
A -A  
NAME & FUNCTION  
1-3  
A 3-bit binary address on these pins  
defines which of the 8 output latches is to  
receive the data.  
0
2
NE590 is pin compatible with 54/74LS259  
4-7,  
9-12  
Q -Q  
0
The 8 device outputs. The NE590 has  
open-collector Darlington outputs.  
7
13  
D
The data input. When the chip is  
enabled, this data bit is transferred to the  
defined output such that:  
APPLICATIONS  
Relay driver  
“1” turns output switch “ON”  
“0” turns output switch “OFF”  
Indicator lamp driver  
Triac trigger  
Thus in logic terms, the NE590 inverts  
data to the relevant output.  
LED display digit driver  
Stepper motor driver  
14  
15  
CE  
The chip enable. When this input is LOW,  
the output latches will accept data. When  
CE goes HIGH, all outputs will retain their  
existing state regardless of address or  
data input conditions.  
CLR  
The clear input. When CLR goes LOW all  
output switches are turned “OFF”.  
A HIGH data input will override the clear  
function on the addressed latch.  
ORDERING INFORMATION  
DESCRIPTION  
TEMPERATURE RANGE  
ORDER CODE  
DWG #  
16-Pin Plastic Dual In-Line Package (DIP)  
0 °C to +70 °C  
NE590N  
SOT38-4  
2
2001 Aug 03  
853-0951 26836  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
BLOCK DIAGRAM  
CLR  
CE  
LATCH  
LATCH  
LATCH  
LATCH  
Q
Q
0
1
2
3
Q
Q
A
0
A
1
COMTROL  
GATE  
1–OF–8  
DECODER  
LATCH  
Q
Q
Q
4
5
6
7
A
2
LATCH  
LATCH  
D
LATCH  
Q
INPUT STAGE  
OUTPUT STAGE  
V
CC  
SL00480  
Figure 2. Block Diagram  
OUTPUTS  
TRUTH TABLE  
INPUTS  
MODE  
CLR  
L
CE  
H
L
D
X
L
A
A
A
Q
Q
Q
Q
Q
Q
Q
Q
7
0
1
2
0
1
2
3
4
5
6
X
X
X
H
H
H
H
H
H
H
H
Clear  
L
L
L
L
L
L
L
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
H
L
L
L
H
H
H
H
X
L
L
L
H
H
H
H
Demultiplex  
L
L
H
L
L
L
L
L
H
H
X
L
H
H
X
L
H
H
L
L
H
X
L
H
H
H
H
H
H
H
L
Q
Memory  
N-1  
H
Q
N-1  
N-1  
L
H
L
L
L
L
L
Q
L
H
H
H
H
L
L
Q
H
L
Q
N-1  
N-1  
N-1  
N-1  
N-1  
N-1  
Addressable Latch  
L
H
L
L
L
Q
Q
Q
Q
L
H
H
H
H
H
L
H
L
H
NOTES:  
X = Don’t care condition  
Q
= Previous output state  
N-1  
L = Low voltage level/“OFF” output state  
H = High voltage level/“ON” output state  
3
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
RATING  
–0.5 to +7  
–0.5 to +15  
0 to +7  
UNIT  
V
V
V
Supply voltage  
Input voltage  
Output voltage  
V
V
V
CC  
IN  
OUT  
OUT  
I
Output current  
Each output  
All outputs  
300  
mA  
1000  
1
P
D
Maximum power dissipation  
1450  
mW  
T
amb  
= 25 °C (still air)  
T
Ambient temperature range  
Junction temperature  
0 to +70  
165  
°C  
°C  
°C  
°C  
amb  
T
j
T
stg  
Storage temperature range  
–65 to +150  
230  
T
sld  
Lead soldering temperature (10 sec max)  
NOTE:  
1. Derate above 25 °C at the following rates:  
N package at 11.6 mW/°C.  
DC ELECTRICAL CHARACTERISTICS  
1
V
= 4.75 V to 5.25 V; 0 °C T  
+70 °C; unless otherwise specified.  
CC  
amb  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
UNIT  
Min  
Typ  
Max  
V
V
V
HIGH-level input voltage  
LOW-level input voltage  
LOW-level output voltage  
2.0  
V
IH  
0.8  
1.3  
1.5  
10  
IL  
I
OL  
= 250 mA; T  
= 25 °C  
1.0  
0.1  
amb  
OL  
Over temperature  
V
I
I
HIGH-level input current  
V
=V  
CC  
µA  
IH  
IN  
IN  
LOW-level input current  
CE input  
V
= 0 V  
IL  
–25  
–15  
–60  
–50  
µA  
µA  
All other inputs  
I
Leakage current  
V
OUT  
= 5.25 V  
10  
250  
µA  
OH  
Supply current  
All outputs LOW  
All outputs HIGH  
V = V = 5 V  
S CC  
I
I
33  
15  
50  
50  
mA  
mA  
CCL  
CCH  
P
D
Power dissipation  
No output load  
350  
mW  
NOTES:  
1. All typical values are at V = 5 V and T  
= 25 °C.  
amb  
CC  
4
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
SWITCHING CHARACTERISTICS  
V
CC  
= 5 V; T  
= 25 °C.  
amb  
Limits  
Typ  
SYMBOL  
PARAMETER  
TO  
FROM  
UNIT  
Min  
Max  
Propagation delay time  
1
t
Low-to-High  
Output  
Output  
Output  
Output  
CE  
Data  
65  
115  
150  
230  
ns  
ns  
ns  
ns  
PLH  
1
t
High-to-Low  
PHL  
2
t
t
Low-to-High  
65  
120  
130  
240  
PLH  
2
High-to-Low  
PHL  
3
t
t
Low-to-High  
Address  
CLR  
100  
130  
200  
260  
PLH  
3
High-to-Low  
PHL  
4
t
t
Low-to-High  
65  
130  
PLH  
4
High-to-Low  
PHL  
Switching setup requirements  
t
t
t
t
t
t
Chip enable  
Chip enable  
Chip enable  
Chip enable  
Chip enable  
High data  
Low data  
Address  
210  
210  
30  
ns  
ns  
ns  
ns  
ns  
ns  
S(H)  
S(L)  
S(A)  
H(H)  
H(L)  
High data  
Low data  
40  
30  
1
Chip enable pulse width  
120  
PW(E)  
NOTES:  
1. See Turn-On and Turn-Off Delays, Enable to Output and Enable Pulse Width timing diagram.  
2. See Turn-On and Turn-Off Delays, Data to Output timing diagram.  
3. See Turn-On and Turn-Off Delays, Address to Output timing diagram.  
4. See Turn-Off Delay, Clear to Output timing diagram.  
5. See Setup and Hold Time, Data to Enable timing diagram.  
6. See Setup Time, Address to Enable timing diagram.  
The maximum die junction temperature must be limited to 165 °C,  
and the temperature rise above ambient and the junction  
temperature are defined as:  
FUNCTIONAL DESCRIPTION  
These peripheral drivers have latched outputs which hold the input  
data until cleared. The NE590 has active-Low, open-collector  
outputs. All outputs are cleared when power is first applied.  
T
R
= θ × P  
JA  
T = T  
+ T  
R
j
amb  
Addressable Latch Function  
where  
Any given output can be turned on or off by presenting the address  
of the output to be set or cleared to the three address pins, by  
holding the “D” input High to turn on the selected input, or by holding  
it Low to turn off, holding the CLR input High, and bringing the CE  
input Low. Once an output is turned on or off, it will remain so until  
addressed again, or until all outputs are cleared by bringing the  
CLR, CE, and “D” inputs Low.  
θ
P
T
is die junction to ambient thermal resistance.  
is total power dissipation  
is junction temperature rise above ambient  
JA  
D
R
T is die junction temperature  
j
T
amb  
is ambient (surrounding medium) temperature  
For example, if we are using the NE590 in a plastic package in an  
application where the ambient temperature is never expected to rise  
above 50 °C, and the output current at the 8 outputs, when on, are  
100, 40, 50, 200, 15, 30, 80, and 10 mA, we find from the graph of  
output voltage versus load current that the output voltages are  
expected to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4 V,  
respectively. Total device power due to these loads is found to be  
473.5 mW. Adding the 250 mW due to the power supply brings total  
device power dissipation to 723.5 mW. The thermal resistance is  
83 °C per W for plastic packages. Using the equations above we  
find:  
Demultiplexer Operation  
By bringing the CLR and CE inputs Low and the “D” input High, the  
addressed output will remain on and all other outputs will be off. This  
condition will remain only as long as the output is addressed.  
High Current Outputs  
The obvious advantage of these devices over the 9334 and  
N74LS259 (which provide a similar function) is the fact that the  
NE590 is capable of output currents of 250 mA at each of its eight  
outputs. It should be noted, however, that the load power dissipation  
would be over 2.5 W if all 8 outputs were to carry their full rated load  
current at one time. Since the total power dissipation is limited by  
the package to 1 W, and since the power dissipation due to supply  
current is 0.25 W, the total load power dissipation by the device is  
limited to 0.75 W, and decreases as ambient temperature rises.  
T
R
= 83 × 0.7235 = 60 °C  
T = 50 + 60 = 100 °C  
j
Thus we find that T is below the 165 °C maximum and this package  
j
could be used in this application. The graphs of total load power  
versus ambient temperature would also give us this same  
information, although interpreting the graphs would not yield the  
same accuracy.  
5
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.2  
1.0  
N PACKAGE  
1.0  
0.75  
0.8  
0.50  
0.25  
0 C  
25 C  
0.6  
70 C  
0.4  
0
200  
50  
OUTPUT LOAD CURRENT (mA)  
100  
0
25  
50  
75  
100  
o
125  
150  
TEMPERATURE ( C)  
Output Voltage vs Load Current  
Total Load Power vs Temperature  
SL00481  
Figure 3. Typical Performance Characteristics  
6
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
TIMING DIAGRAMS  
D
D
t
t
PW  
PW  
t
t
PHL  
PLH  
CE  
Q
t
t
PHL  
PLH  
Q
NOTE:  
Other inputs CE = L, CLR = H, A = Stable  
NOTE:  
Other inputs CLR = H, A = Stable  
Turn-On and Turn-Off Delays, Enable-to-Output  
and Enable Pulse Width  
Turn-On and Turn-Off Delays, Data-to-Output  
A
A
CLR  
Q
t
PLH  
t
t
PHL  
PLH  
NOTE:  
Other inputs CE = H  
Q
NOTE:  
Other inputs CE = L, CLR = L, D = H  
Turn-On and Turn-Off Delays, Address-to-Output  
Turn-On and Turn-Off Delays, Clear-to-Output  
D
A
t
HH  
t
HL  
t
S
t
SH  
t
SL  
CE  
CE  
NOTE:  
Other inputs CLR = H  
Q
Set-Up Time, Address-to-Enable  
NOTE:  
Other inputs CLR = H, A = Stable  
Set-Up and Hold Time, Data-to-Enable  
SL00482  
Figure 4. Timing Diagrams  
7
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
TYPICAL APPLICATIONS  
DATA  
BUS  
+5V  
+ 5V  
µP  
R
L
+6V  
Q
Q
Q
0
1
2
D
D
4
A
A
A
Q
Q
Q
Q
Q
Q
Q
Q
A
A
A
Q
0
2
1
0
0
1
2
3
0
5
6
7
2
1
0
Q
1
Q
Q
3
0
Q
2
NE590  
CE  
RELAY  
LOAD  
Q
3
NE590  
NE590  
Q
0
Q
Q
Q
5
6
7
Q
5
CE  
CLR  
CE  
CLR  
Q
6
Q
7
IQ  
CONTROL  
CLEAR  
NOTE:  
NE590 Driving Simple Loads  
A
, A , and A may be connected to the address bus if permitted by system design.  
0
1
2
Turn-On and Turn-Off Delays, Address-to-Output  
+5V  
+5V  
+5V  
Q
0
Q
1
Q
2
D
A
0
3–BIT  
COUNTER  
Q
3
A
1
555  
Q
0
A
2
Q
5
Q
6
Q
7
NE590  
CE  
CLR  
NE590 Operating in Demultiplex Mode  
Figure 5. Typical Applications  
SL00484  
8
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
9
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable peripheral driver  
NE590  
Data sheet status  
Product  
status  
Definitions  
[1]  
Data sheet status  
[2]  
Objective data  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
Preliminary data  
Product data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be  
published at a later date. Philips Semiconductors reserves the right to change the specification  
without notice, in order to improve the design and supply the best possible product.  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply.  
Changes will be communicated according to the Customer Product/Process Change Notification  
(CPCN) procedure SNW-SQ-650A.  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Koninklijke Philips Electronics N.V. 2001  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 12-01  
9397 750 09235  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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