933768950602 [NXP]
IC F/FAST SERIES, OCTAL 1-BIT DRIVER, INVERTED OUTPUT, PDIP20, 0.300 INCH, PLASTIC, SOT-146-1, DIP-20, Bus Driver/Transceiver;
| 型号： | 933768950602 |
| 厂家： | 
NXP |
| 描述： | IC F/FAST SERIES, OCTAL 1-BIT DRIVER, INVERTED OUTPUT, PDIP20, 0.300 INCH, PLASTIC, SOT-146-1, DIP-20, Bus Driver/Transceiver 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总10页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74F1240
Octal inverter buffer (3-State)
Product specification
2000 Jun 30
Supercedes data of 1999 Jan 08
IC15 Data Handbook
Philips
Semiconductors
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
FEATURES
TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
TYPE
• High impedance NPN base inputs for reduced loading
(20µA in High and Low states)
74F1240
3.5ns
40mA
• Low power, light loading
• Functional pin-for-pin equivalent of 74F240
• 1/30th the bus loading of 74F240
ORDERING INFORMATION
COMMERCIAL RANGE
= 5V ±10%,
• Provides ideal interface and increase fan-out of MOS
DRAWING
NUMBER
V
DESCRIPTION
CC
microprocessors
T
amb
= 0°C to +70°C
• Octal bus interface
20-pin plastic DIP
20-pin plastic SOL
N74F1240N
N74F1240D
SOT146-1
SOT163-1
• 3-State buffer outputs sink 64mA
• 15mA source current
DESCRIPTION
The 74F1240 is an octal buffer that is ideal for driving bus lines or
buffer memory address registers. The outputs are capable of sinking
64mA and sourcing up to 15mA, producing very good capacitive
drive characteristics. The device features two Output Enables, OEa
and OEb, each controlling four of the 3-State outputs.
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
74F (U.L.)
LOAD VALUE
PINS
DESCRIPTION
HIGH/LOW
1.0/0.033
1.0/0.033
750/106.7
HIGH/LOW
20µA/20µA
20µA/20µA
15mA/64mA
Ian, Ibn
OEa, OEb
Yan, Ybn
Data inputs
Output enable inputs (active Low)
Data outputs (74F1240)
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
2
2000 Jun 30
853–0039 24025
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
PIN CONFIGURATION
LOGIC SYMBOL
OEa
Ia0
1
2
3
4
5
6
7
8
9
20 V
CC
2
4
6
8
17 15 13 11
19 OEb
18 Ya0
17 Ib0
16 Ya1
15 Ib1
14 Ya2
13 Ib2
12 Ya3
11 Ib3
Yb0
Ia1
Ia0 Ia1 Ia2 Ia3 Ib0 Ib1 Ib2 Ib3
OEa
OEb
Ya0 Ya1 Ya2 Ya3 Yb0 Yb1 Yb2 Yb3
1
Yb1
Ia2
19
Yb2
Ia3
Yb3
18 16 14 12
3
5
7
9
GND 10
V
= Pin 20
CC
GND = Pin 10
SF00320
SF00321
IEC/IEEE SYMBOL
FUNCTION TABLE
INPUTS
OUTPUTS
1
EN1
EN2
19
OEa
L
Ia
L
OEb
L
Ib
L
Ya
H
L
Yb
H
L
2
4
6
18
16
14
12
1
2
L
H
X
L
H
X
H
H
Z
Z
8
H
L
X
Z
=
=
=
=
High voltage level
Low voltage level
Don’t care
17
3
5
15
High impedance “off” state
7
9
13
11
SF01367
LOGIC DIAGRAM
2
18
Ia0
Ya0
4
16
Ia1
Ya1
6
14
Ia2
Ya2
8
12
Ia3
Ya3
1
OEa
17
3
Ib0
Yb0
15
5
Ib1
Yb1
13
7
Ib2
Yb2
11
9
Ib3
Yb3
19
OEb
SF01369
3
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
UNIT
V
V
Supply voltage
Input voltage
Input current
CC
IN
V
V
I
mA
V
IN
V
Voltage applied to output in High output state
Current applied to output in Low output state
Operating free-air temperature range
Storage temperature range
–0.5 to V
128
OUT
OUT
CC
I
mA
°C
°C
T
amb
0 to +70
T
stg
–65 to +150
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
MIN
4.5
NOM
MAX
V
Supply voltage
5.0
5.5
V
V
CC
IH
IL
V
V
High-level input voltage
Low-level input voltage
Input clamp current
2.0
0.8
–18
–15
64
V
I
I
I
mA
mA
mA
°C
IK
High-level output current
Low-level output current
OH
OL
T
amb
Operating free-air temperature range
0
+70
4
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
1
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
MAX
2
MIN
2.4
2.7
2.0
2.0
TYP
±10% V
V
V
V
V
CC
I
I
= –3mA
OH
V
V
V
= MIN
= MAX
= MIN
CC
IL
±5% V
3.3
CC
V
OH
High-level output voltage
±10% V
±5% V
CC
IH
= –15mA
OH
CC
V
V
V
= MIN
= MAX
= MIN
I
I
= 48mA
= 64mA
±10% V
0.38
0.42
0.55
V
CC
IL
OL
CC
V
Low-level output voltage
OL
±5% V
0.55
–1.2
100
20
V
OL
CC
IH
V
Input clamp voltage
V
CC
V
CC
V
CC
V
CC
= MIN, I = I
IK
–0.73
V
IK
I
I
Input current at maximum input voltage
High-level input current
= 0.0V, V = 7.0V
µA
µA
µA
I
I
I
IH
= MAX, V = 2.7V
I
I
Low-level input current
= MAX, V = 0.5V
–20
IL
I
Off-state output current,
High-level voltage applied
I
V
= MAX, V = 2.7V
50
µA
µA
OZH
CC
O
Off-state output current,
Low-level voltage applied
I
V
V
= MAX, V = 0.5V
–50
OZL
CC
O
3
I
Short-circuit output current
= MAX
–100
–225
30
mA
mA
mA
mA
OS
CC
I
22
58
44
CCH
I
Supply current (total)
V
CC
= MAX
I
75
CC
CCL
I
58
CCZ
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V = 5V, T = 25°C.
CC
amb
3. Not more than one output should be shorted at a time. For testing I , the use of high-speed test apparatus and/or sample-and-hold
OS
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I tests should be performed last.
OS
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
V
= +25°C
= +5.0V
T
V
= 0°C to +70°C
= +5.0V ± 10%
amb
CC
amb
CC
TEST
CONDITION
SYMBOL
PARAMETER
UNIT
C = 50pF, R = 500Ω
C = 50pF, R = 500Ω
L
L
L
L
MIN
TYP
MAX
MIN
MAX
t
t
Propagation delay
Ian, Ibn, to Yn
3.0
1.5
4.5
2.5
6.5
4.5
2.5
1.5
7.5
5.0
ns
ns
PLH
PHL
Waveform 1
t
t
Output Enable time
to High or Low level
Waveform 3
Waveform 4
3.0
4.0
5.5
7.0
7.5
9.0
3.0
4.0
8.0
9.5
ns
ns
PZH
PZL
t
t
Output Disable time
to High or Low level
Waveform 3
Waveform 4
2.0
2.0
4.0
4.0
6.0
5.5
2.0
2.0
6.5
6.0
ns
ns
PHZ
PLZ
5
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
AC WAVEFORMS
For all waveforms, V = 1.5V.
M
Ian, Ibn
V
Ian, Ibn
V
M
V
V
M
M
M
t
t
t
t
PHL
PLH
PHL
PLH
Yn
V
V
V
V
M
M
M
Yn
M
SF00328
SF00329
Waveform 1. For Inverting Outputs
Waveform 2. For Non-inverting Outputs
OEn
OEb
OEn
OEb
V
V
M
V
t
V
M
M
M
V
-0.3V
0V
OH
t
t
PHZ
t
PZH
PZL
PLZ
3.5V
Yn, Yn
V
V
M
M
Yn, Yn
V
+0.3V
OL
SF00330
SF00331
Waveform 3. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
Waveform 4. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
TEST CIRCUIT AND WAVEFORMS
V
CC
t
w
AMP (V)
0V
7.0V
90%
90%
NEGATIVE
PULSE
V
V
M
R
M
L
V
V
OUT
IN
10%
10%
PULSE
GENERATOR
D.U.T.
t
t )
t
t )
THL ( f
TLH ( r
R
C
R
L
T
L
t
t )
t
t )
TLH ( r
THL ( f
AMP (V)
0V
90%
M
90%
POSITIVE
PULSE
V
V
M
Test Circuit for Open Collector Outputs
10%
10%
t
w
SWITCH POSITION
TEST
SWITCH
closed
closed
open
Input Pulse Definition
t
t
PLZ
PZL
All other
DEFINITIONS:
R
L
C
L
R
T
=
=
=
Load resistor;
INPUT PULSE REQUIREMENTS
see AC electrical characteristics for value.
Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
Termination resistance should be equal to Z
pulse generators.
family
V
M
rep. rate
t
w
t
t
THL
amplitude
TLH
of
OUT
2.5ns
2.5ns
74F
3.0V
1.5V
1MHz
500ns
SF00128
6
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
7
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
8
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
NOTES
9
2000 Jun 30
Philips Semiconductors
Product specification
Octal inverter buffer (3-State)
74F1240
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 2000
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 06-00
Document order number:
9397-750 07279
Philips
Semiconductors
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