933930000112 [NXP]
TRANSISTOR VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC PACKAGE-4, FET RF Power;型号: | 933930000112 |
厂家: | NXP |
描述: | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC PACKAGE-4, FET RF Power 局域网 放大器 晶体管 |
文件: | 总12页 (文件大小:78K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BLF147
VHF power MOS transistor
Product specification
2001 May 23
Supersedes data of September 1992
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
FEATURES
PIN CONFIGURATION
• High power gain
• Low intermodulation distortion
• Easy power control
ook, halfpage
4
3
• Good thermal stability
• Withstands full load mismatch.
d
DESCRIPTION
g
Silicon N-channel enhancement
mode vertical D-MOS transistor
designed for industrial and military
applications in the HF/VHF frequency
range.
s
MBB072
1
2
MLA876
The transistor is encapsulated in a
4-lead, SOT121 flange envelope, with
a ceramic cap. All leads are isolated
from the flange.
Fig.1 Simplified outline and symbol.
A marking code, showing gate-source
voltage (VGS) information is provided
for matched pair applications. Refer
to 'General' section for further
information.
CAUTION
The device is supplied in an antistatic package. The gate-source input must
be protected against static charge during transport and handling.
WARNING
PINNING - SOT121
Product and environmental safety - toxic materials
PIN
DESCRIPTION
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
1
2
3
4
drain
source
gate
source
QUICK REFERENCE DATA
RF performance at Th = 25 °C in a common source test circuit.
MODE OF
OPERATION
f
VDS
(V)
PL
(W)
Gp
(dB)
ηD
(%)
d3
(dB)
d5
(dB)
(MHz)
SSB, class-AB
CW, class-B
28
28
28
150 (PEP)
150
> 17
> 35
< −30
< −30
108
typ. 14
typ. 70
−
−
2001 May 23
2
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
VDS
PARAMETER
drain-source voltage
CONDITIONS
MIN.
MAX.
65
UNIT
−
−
−
−
V
±VGS
ID
gate-source voltage
DC drain current
20
V
25
A
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
up to Tmb = 25 °C
220
150
200
W
°C
°C
−65
−
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth j-mb
Rth mb-h
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
0.8 K/W
0.2 K/W
MGP049
MRA904
2
10
300
handbook, halfpage
handbook, halfpage
P
tot
I
D
(W)
(A)
(1)
(2)
200
(1)
(2)
10
100
1
1
0
0
2
10
10
50
100
150
V
(V)
DS
T
(°C)
h
(1) Current is this area may be limited by RDS(on)
.
(1) Short-time operation during mismatch.
(2) Continuous operation.
(2) Tmb = 25 °C.
Fig.2 DC SOAR.
Fig.3 Power/temperature derating curves.
2001 May 23
3
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
V(BR)DSS
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
drain-source breakdown voltage
drain-source leakage current
gate-source leakage current
gate-source threshold voltage
ID = 100 mA; VGS = 0
VGS = 0; VDS = 28 V
±VGS = 20 V; VDS = 0
ID = 200 mA; VDS = 10 V
65
−
−
−
−
−
−
−
V
IDSS
5
mA
µA
V
IGSS
−
1
VGS(th)
∆VGS
2
4.5
100
gate-source voltage difference of ID = 100 mA; VDS = 10 V
matched pairs
−
mV
gfs
forward transconductance
drain-source on-state resistance
on-state drain current
input capacitance
ID = 8 A; VDS = 10 V
5
−
−
−
−
−
7.5
0.1
37
−
S
RDS(on)
IDSX
Cis
ID = 8 A; VGS = 10 V
0.15
−
Ω
VGS = 10 V; VDS = 10 V
A
VGS = 0; VDS = 28 V; f = 1 MHz
VGS = 0; VDS = 28 V; f = 1 MHz
VGS = 0; VDS = 28 V; f = 1 MHz
450
360
55
−
pF
pF
pF
Cos
output capacitance
−
Crs
feedback capacitance
−
MGP051
MGP050
60
0
handbook, halfpage
handbook, halfpage
T.C.
I
(mV/K)
D
(A)
−1
40
−2
−3
−4
−5
20
0
−2
−1
0
5
10
15
20
10
10
1
10
V
(V)
GS
I
(A)
D
VDS = 28 V; valid for Th = 25 to 70 °C.
VDS = 10 V.
Fig.5 Drain current as a function of gate-source
voltage, typical values.
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical
values.
2001 May 23
4
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
MGP052
MRA903
1400
170
handbook, halfpage
handbook, halfpage
C
(pF)
R
DS (on)
(mΩ)
1200
800
150
130
110
90
C
C
is
400
os
0
0
10
20
30
40
0
50
100
150
T (°C)
V
(V)
j
DS
ID = 8 A; VGS = 10 V.
VGS = 0; f = 1 MHz.
Fig.6 Drain-source on-state resistance as a
Fig.7 Input and output capacitance as functions
of drain-source voltage, typical values.
function of junction temperature, typical
values.
MRA902
500
handbook, halfpage
C
rs
(pF)
400
300
200
100
0
0
10
20
30
40
V
(V)
DS
VGS = 0; f = 1 MHz.
Fig.8 Feedback capacitance as a function of
drain-source voltage, typical values.
2001 May 23
5
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
APPLICATION INFORMATION FOR CLASS-AB OPERATION
Th = 25 °C; Rth mb-h = 0.2 K/W; RGS = 9.8 Ω; unless otherwise specified.
RF performance in SSB operation in a common source class-AB circuit.
f1 = 28.000 MHz; f2 = 28.001 MHz.
d3
(dB)
(note 2)
d5
(dB)
(note 2)
PL
(W)
f
VDS
(V)
IDQ
(A)
Gp
(dB)
ηD
(%)
(MHz)
20 to 150 (PEP)
28
28
1
> 17
> 35
< −30
< −30
typ. 19
typ. 40
typ. −34
typ. −40
Notes
1. Optimum load impedance: 2.1 + j0 Ω.
2. Stated figures are maximum values encountered at any driving level between the specified value of PEP and are
referred to the according level of either the equal amplified tones. Related to the according peak envelope power
these figures should be decreased by 6 dB.
Ruggedness in class-AB operation
The BLF147 is capable of withstanding a load mismatch
corresponding to VSWR = 50 through all phases under the
following conditions:
VDS = 28 V; f = 28 MHz at rated load power.
MGP054
MGP053
60
30
handbook, halfpage
handbook, halfpage
η
D
(%)
G
p
(dB)
40
20
20
0
0
10
0
100
200
100
200
P
(W) PEP
P (W) PEP
L
L
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 9.8 Ω; f1 = 28.000 MHz; f2 = 28.001 MHz.
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 9.8 Ω; f1 = 28.000 MHz; f2 = 28.001 MHz.
Fig.9 Gain as a function of load power, typical
values.
Fig.10 Efficiency as a function of load power,
typical values.
2001 May 23
6
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
MGP055
MGP056
−20
−20
handbook, halfpage
handbook, halfpage
d
d
5
3
(dB)
(dB)
−30
−30
−40
−40
−50
−50
−60
−60
0
100
200
0
100
200
P
(W) PEP
P
(W) PEP
L
L
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 9.8 Ω; f1 = 28.000 MHz; f2 = 28.001 MHz.
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 9.8 Ω; f1 = 28.000 MHz; f2 = 28.001 MHz.
Fig.11 Third order intermodulation distortion as a
function of load power, typical values.
Fig.12 Fifth order intermodulation distortion as a
function of load power, typical values.
C8
L7
C10
C11
C12
C14
L3
D.U.T.
output
50 Ω
C2
C1
L2
L1
input
C15
C13
50 Ω
C9
C3
R1
R3
R2
C4
L4
C5
L5
C6
R5
R4
L6
C7
+V
G
+V
MGP057
D
f = 28 MHz.
Fig.13 Test circuit for class-AB operation.
2001 May 23
7
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
List of components (class-AB test circuit)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
CATALOGUE NO.
C1, C3, C13, C14 film dielectric trimmer
7 to 100 pF
75 pF
2222 809 07015
C2, C8, C9
multilayer ceramic chip capacitor
(note 1)
C4, C5
C6
multilayer ceramic chip capacitor
100 nF
2222 852 47104
2222 852 47104
multilayer ceramic chip capacitors in 3 × 100 nF
parallel
C7
electrolytic capacitor
2.2 µF, 63 V
C10
multilayer ceramic chip capacitor
(note 1)
100 pF
C11, C12
C15
multilayer ceramic chip capacitor
(note 1)
150 nF
240 pF
145 nH
multilayer ceramic chip capacitor
(note 1)
L1
6 turns enamelled 0.7 mm copper
wire
length 5 mm;
int. dia. 6 mm;
leads 2 × 5 mm
L2, L3
L4
stripline (note 2)
41.1 Ω
length 13 × 6 mm
4 turns enamelled 1.5 mm copper
wire
148 nH
length 8 mm;
int. dia. 10 mm;
leads 2 × 5 mm
L5, L6
L7
grade 3B Ferroxcube wideband HF
choke
4312 020 36642
3 turns enamelled 2.2 mm copper
wire
79 nH
length 8 mm;
int. dia. 8 mm;
leads 2 × 5 mm
R1, R2
R3
1 W metal film resistor
0.4 W metal film resistor
0.4 W metal film resistor
1 W metal film resistor
19.6 Ω
10 kΩ
1 MΩ
10 Ω
2322 153 51969
2322 151 71003
2322 151 71005
2322 153 51009
R4
R5
Notes
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.
2. The striplines are on a double copper-clad printed circuit board, with PTFE fibre-glass dielectric (εr = 2.2),
thickness 1.6 mm.
2001 May 23
8
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
MGP058
MGP059
30
10
handbook, halfpage
handbook, halfpage
G
P
Z
i
(dB)
(Ω)
20
5
r
i
10
0
x
i
0
−5
0
10
20
30
0
10
20
30
f (MHz)
f (MHz)
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 6.25 Ω; PL = 150 W (PEP); RL = 2.1 Ω.
Class-AB operation; VDS = 28 V; IDQ = 1 A;
RGS = 6.25 Ω; PL = 150 W (PEP); RL = 2.1 Ω.
Fig.14 Gain as a function of frequency, typical
values.
Fig.15 Input impedance as a function of frequency
(series components), typical values.
MGP061
MGP062
4
3
handbook, halfpage
handbook, halfpage
Z
i
Z
L
(Ω)
(Ω)
2
2
r
i
R
L
0
1
x
i
X
L
−2
−4
0
−1
0
50
100
150
200
0
50
100
150
200
f (MHz)
f (MHz)
Class-B operation; VDS = 28 V; IDQ = 0.2 A;
RGS = 15 Ω; PL = 150 W.
Class-B operation; VDS = 28 V; IDQ = 0.2 A;
RGS = 15 Ω; PL = 150 W.
Fig.16 Input impedance as a function of frequency
(series components), typical values.
Fig.17 Load impedance as a function of frequency
(series components), typical values.
2001 May 23
9
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
MGP060
30
handbook, halfpage
G
p
(dB)
20
10
0
0
50
100
150
200
f (MHz)
Class-B operation; VDS = 28 V; IDQ = 0.2 A;
RGS = 15 Ω; PL = 150 W.
Fig.18 Power gain as a function of frequency,
typical values.
2001 May 23
10
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF147
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 4 leads
SOT121B
D
A
F
D
1
q
C
U
1
B
c
H
b
w
M
M
C
2
4
3
α
A
U
U
p
3
2
w
M
M
M
B
A
1
1
2
H
Q
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
c
A
b
D
D
F
H
p
Q
q
U
U
U
w
1
w
2
α
UNIT
1
1
2
3
5.82
5.56
12.83
12.57
7.27
6.17
12.86
12.59
2.67 28.45 3.30
2.41 25.52 3.05
4.45
3.91
24.90 6.48 12.32
24.63 6.22 12.06
0.16
0.10
18.42
0.51
0.25
mm
45°
0.229
0.219
0.505
0.495
0.286
0.243
0.506
0.496
0.105 1.120 0.130
0.095 1.005 0.120
0.255 0.485
0.245 0.475
0.006
0.004
0.175
0.154
0.98
0.97
0.725
0.01 0.02
inches
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT121B
99-03-29
2001 May 23
11
Philips Semiconductors – a worldwide company
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Internet: http://www.semiconductors.philips.com
72
SCA
© Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613524/03/pp12
Date of release: 2001 May 23
Document order number: 9397 750 08411
相关型号:
933930010112
TRANSISTOR VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC PACKAGE-4, FET RF Power
NXP
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