933986070215 [NXP]

0.215A, 70V, SILICON, SIGNAL DIODE, PLASTIC, SMD, 3 PIN;
933986070215
型号: 933986070215
厂家: NXP    NXP
描述:

0.215A, 70V, SILICON, SIGNAL DIODE, PLASTIC, SMD, 3 PIN

光电二极管
文件: 总12页 (文件大小:55K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BAL99  
High-speed diode  
1999 May 26  
Product specification  
Supersedes data of 1996 Sep 10  
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
FEATURES  
DESCRIPTION  
PINNING  
PIN  
Small plastic SMD package  
The BAL99 is a high-speed switching  
diode fabricated in planar technology,  
and encapsulated in the small SOT23  
plastic SMD package.  
DESCRIPTION  
High switching speed: max. 4 ns  
1
2
3
not connected  
cathode  
Continuous reverse voltage:  
max. 70 V  
anode  
Repetitive peak reverse voltage:  
max. 70 V  
Repetitive peak forward current:  
max. 500 mA.  
handbookpage  
2
1
1
n.c.  
APPLICATIONS  
2
High-speed switching in e.g.  
surface mounted circuits.  
3
3
MAM231  
Marking code: JFp = made in Hong Kong; JFt = made in Malaysia.  
Fig.1 Simplified outline (SOT23) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
70  
UNIT  
VRRM  
VR  
repetitive peak reverse voltage  
continuous reverse voltage  
continuous forward current  
repetitive peak forward current  
V
V
70  
IF  
see Fig.2; note 1  
215  
500  
mA  
mA  
IFRM  
IFSM  
non-repetitive peak forward current square wave; Tj = 25 °C prior to  
surge; see Fig.4  
t = 1 µs  
t = 1 ms  
t = 1 s  
4
A
1
A
0.5  
250  
+150  
150  
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
Tamb = 25 °C; note 1  
mW  
°C  
°C  
65  
Note  
1. Device mounted on an FR4 printed-circuit board.  
1999 May 26  
2
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MAX.  
UNIT  
VF  
see Fig.3  
IF = 1 mA  
IF = 10 mA  
IF = 50 mA  
IF = 150 mA  
see Fig.5  
VR = 25 V  
VR = 70 V  
715  
mV  
855  
1
mV  
V
1.25  
V
IR  
reverse current  
30  
1
nA  
µA  
µA  
µA  
pF  
ns  
VR = 25 V; Tj = 150 °C  
VR = 70 V; Tj = 150 °C;  
f = 1 MHz; VR = 0; see Fig.6  
30  
50  
1.5  
4
Cd  
trr  
diode capacitance  
reverse recovery time  
when switched from IF = 10 mA to  
IR = 10 mA; RL = 100 ; measured at  
IR = 1 mA; see Fig.7  
Vfr  
forward recovery voltage  
when switched from IF = 10 mA; tr = 20 ns;  
see Fig.8  
1.75  
V
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient note 1  
CONDITIONS  
VALUE  
360  
UNIT  
Rth j-tp  
Rth j-a  
K/W  
K/W  
500  
Note  
1. Device mounted on an FR4 printed-circuit board.  
1999 May 26  
3
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
GRAPHICAL DATA  
MSA562 -1  
MBG382  
300  
250  
handbook, halfpage  
I
F
I
(mA)  
F
(mA)  
200  
(1)  
(2)  
(3)  
200  
150  
100  
100  
50  
0
0
0
1
2
0
50  
100  
150  
T
200  
( C)  
V (V)  
F
o
amb  
(1) Tj = 150 °C; typical values.  
(2) Tj = 25 °C; typical values.  
Device mounted on an FR4 printed-circuit board.  
(3) Tj = 25 °C; maximum values.  
Fig.2 Maximum permissible continuous forward  
current as a function of ambient  
temperature.  
Fig.3 Forward current as a function of forward  
voltage.  
MBG704  
2
10  
I
FSM  
(A)  
10  
1
1  
10  
2
3
4
1
10  
10  
10  
10  
t
(µs)  
p
Based on square wave currents.  
Tj = 25 °C prior to surge.  
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.  
1999 May 26  
4
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
MBH182  
MBG446  
5
10  
0.8  
handbook, halfpage  
C
I
d
R
(pF)  
0.6  
(nA)  
4
10  
(1)  
(2)  
(3)  
3
10  
10  
0.4  
0.2  
2
0
0
10  
o
0
100  
4
8
12  
16  
200  
T ( C)  
j
V
(V)  
R
(1) VR = 70 V; maximum values.  
(2) VR = 70 V; typical values.  
(3) VR = 25 V; typical values.  
f = 1 MHz; Tj = 25 °C.  
Fig.5 Reverse current as a function of junction  
temperature.  
Fig.6 Diode capacitance as a function of reverse  
voltage; typical values.  
1999 May 26  
5
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
t
t
p
r
t
D.U.T.  
10%  
I
F
I
t
R
= 50  
F
rr  
S
SAMPLING  
t
OSCILLOSCOPE  
R = 50 Ω  
V = V  
I x R  
F S  
R
i
(1)  
90%  
V
R
MGA881  
input signal  
output signal  
(1) IR = 1 mA.  
Fig.7 Reverse recovery voltage test circuit and waveforms.  
I
1 kΩ  
450 Ω  
I
V
90%  
R
= 50 Ω  
S
OSCILLOSCOPE  
V
fr  
D.U.T.  
R = 50 Ω  
i
10%  
MGA882  
t
t
t
t
p
r
input  
signal  
output  
signal  
Fig.8 Forward recovery voltage test circuit and waveforms.  
6
1999 May 26  
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
1999 May 26  
7
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 May 26  
8
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
NOTES  
1999 May 26  
9
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
NOTES  
1999 May 26  
10  
Philips Semiconductors  
Product specification  
High-speed diode  
BAL99  
NOTES  
1999 May 26  
11  
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© Philips Electronics N.V. 1999  
SCA65  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115002/03/pp12  
Date of release: 1999 May 26  
Document order number: 9397 750 05888  

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