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935069140118 [NXP]

IC LED DISPLAY DRIVER, PDSO16, 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16, Display Driver;
935069140118
型号： 935069140118
厂家： NXP    NXP
描述：

IC LED DISPLAY DRIVER, PDSO16, 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16, Display Driver

驱动 光电二极管 接口集成电路
文件： 总16页 (文件大小：78K)
中文：  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
HEF4794B  
8-stage shift-and-store register  
LED driver  
1999 Jun 30  
Product specification  
Supersedes data of 1994 Jul 01  
File under Integrated Circuits, IC04  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
transferred to the storage register when the strobe (STR)  
input is HIGH. Data in the storage register appears at the  
outputs whenever the output enable (EO) signal is HIGH.  
APPLICATIONS  
• Automotive  
• Industrial.  
Two serial outputs (OS and OS') are available for  
cascading a number of HEF4794B devices. Data is  
available at OS on positive-going clock edges to allow  
high-speed operation in cascaded systems in which the  
clock rise time is fast. The same serial information is  
available at OS' on the next negative-going clock edge and  
provides cascading HEF4794B devices when the clock  
rise time is slow.  
GENERAL DESCRIPTION  
The HEF4794B is an 8-stage serial shift register having a  
storage latch associated with each stage for strobing data  
from the serial input to parallel LED driver outputs  
O0 to O7. Data is shifted on positive-going clock  
transitions. The data in each shift register stage is  
ORDERING INFORMATION  
TYPE NUMBER  
PACKAGES  
PINS  
PIN POSITION  
MATERIAL  
CODE  
HEF4794BT  
HEF4794BP  
16  
16  
SO16  
DIP16  
plastic  
plastic  
SOT109-1  
SOT38-1  
FUNCTIONAL DIAGRAM  
LOGIC DIAGRAMS  
V
DD  
16  
HEF4794B  
D
2
3
O
O
'
10  
9
S
8-STAGE SHIFT  
REGISTER  
CP  
D
S
handbook, halfpage  
STR  
1
8-BIT STORAGE  
REGISTER  
CP  
O
MBD912  
EO 15  
OPEN-DRAIN OUTPUTS  
8
4
5
6
7
14 13 12 11  
V
O
O
O
O
O
O
O
O
6 7  
MBD909  
SS  
0
1
2
3
4
5
Fig.2 One D-latch.  
Fig.1 Functional diagram.  
1999 Jun 30  
2
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
STAGE 0  
STAGE 1 to 6  
STAGE 7  
D
D
O
O
S
D
O
D
O
CP  
CP  
FF  
FF  
O
'
1
8
D
Q
S
CP  
CP  
latch  
D
O
D
O
CP  
CP  
latch  
latch  
1
8
STR  
EO  
HEF4794B  
MBD911  
O
O
O
O
O
O
O
O
7
0
1
2
3
4
5
6
Fig.3 Logic diagram.  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
strobe input  
handbook, halfpage  
STR  
D
1
2
3
V
STR  
D
1
2
3
4
5
6
7
8
16  
DD  
data input  
clock input  
15 EO  
CP  
O
O
O
O
CP  
14  
13  
12  
11  
10  
9
4
5
6
7
S
S
O0 to O3  
4 to 7  
parallel outputs 0 to 3  
(open drain)  
O
0
HEF4794B  
O
1
VSS  
OS,OS'  
O7  
8
ground  
9 and 10 serial outputs  
O
2
11  
12  
13  
14  
15  
16  
parallel output 7 (open drain)  
O
3
O
O
'
O6  
parallel output 6 (open drain)  
parallel output 5 (open drain)  
parallel output 4 (open drain)  
output enable input  
V
SS  
O5  
MBD910  
O4  
EO  
VDD  
Fig.4 Pin configuration.  
supply voltage  
1999 Jun 30  
3
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
FUNCTIONAL DESCRIPTION  
FAMILY DATA  
See “Family Specifications” except for: rating for DC  
current into any open-drain output is 40 mA.  
Table 1 Function table; note 1  
PARALLEL  
OUTPUTS  
SERIAL  
OUTPUTS  
INPUTS  
IDD LIMITS CATEGORY MSI  
CP  
EO STR  
D
O0  
On  
OS  
OS'  
See “Family Specifications” for ratings.  
↑
↓
↑
↑
↑
↓
L
L
X
X
L
X
X
X
L
Z
Z
Z
Z
O6'  
nc  
nc  
O7  
nc  
nc  
nc  
O7  
H
H
H
H
nc  
L
nc  
O6'  
H
H
H
On − 1 O6'  
On − 1 O6'  
H
H
H
nc  
nc  
nc  
Note  
1. H = HIGH state;  
L = LOW state;  
X = don’t care;  
↑ = positive-going transition;  
↓ = negative-going transition;  
Z = high-impedance OFF state;  
nc = no change;  
O6' = the information in the seventh shift register  
stage.  
a) At the positive clock edge the information in the  
7th register stage is transferred to the 8th register  
stage and the OS output.  
DC CHARACTERISTICS  
VSS = 0 V.  
Tamb (°C)  
SYMBOL  
PARAMETER  
CONDITIONS  
−40  
MAX.  
+25  
+85  
MIN. MAX.  
UNIT  
MIN.  
MIN.  
MAX.  
VOL  
LOW level output VI = VSS or VDD  
voltage IO < 20 mA; VDD = 5 V  
;
−
0.75  
−
0.75  
−
1.5  
V
V
VI = VSS or VDD  
IO < 20 mA;  
VDD = 10 V  
;
;
−
−
0.75  
−
−
0.75  
0.75  
−
−
1.5  
VI = VSS or VDD  
IO < 20 mA;  
VDD = 15 V  
0.75  
1.5  
V
IOZH  
HIGH level output VO = 15 V; VDD = 5 V  
−
−
−
2
2
2
−
−
−
2
2
2
−
−
−
15  
15  
15  
µA  
µA  
µA  
leakage current;  
3-state  
VO = 15 V; VDD = 10 V  
VO = 15 V; VDD = 15 V  
1999 Jun 30  
4
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
AC POWER CHARACTERISTICS  
VSS = 0 V; Tamb = 25 °C; input transition times ≤ 20 ns; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
VDD = 5 V  
TYPICAL FORMULA FOR P (µW)(1)  
1200fi + Σ (foCL) × VD2D  
P
dynamic power dissipation per  
package  
V
DD = 10 V  
5550fi + Σ (foCL) × VD2D  
15000fi + Σ (foCL) × VD2D  
VDD = 15 V  
Note  
1. Where:  
RL = ∞;  
fi = input frequency (MHz);  
fo = output frequency (MHz);  
CL = load capacitance (pF);  
Σ(foCL) = sum of outputs;  
VDD = supply voltage (V).  
AC TIMING CHARACTERISTICS  
VSS = 0 V; Tamb = 25 °C; CL = 50 pF; input transition times ≤20 ns; unless otherwise specified.  
TYPICAL  
EXTRAPOLATION  
FORMULA  
VDD  
(V)  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
160  
MAX. UNIT  
tPHL  
propagation delay time CP to OS;  
HIGH-to-LOW  
5
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
320  
130  
90  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
132 ns + (0.55 ns/pF)CL  
53 ns + (0.23 ns/pF)CL  
37 ns + (0.16 ns/pF)CL  
102 ns + (0.55 ns/pF)CL  
44 ns + (0.23 ns/pF)CL  
32 ns + (0.16 ns/pF)CL  
92 ns + (0.55 ns/pF)CL  
39 ns + (0.23 ns/pF)CL  
32 ns + (0.16 ns/pF)CL  
102 ns + (0.55 ns/pF)CL  
49 ns + (0.23 ns/pF)CL  
37 ns + (0.16 ns/pF)CL  
note 1  
10  
15  
5
65  
45  
tPLH  
tPHL  
tPLH  
tPZL  
tPLZ  
propagation delay time CP to OS;  
LOW-to-HIGH  
130  
55  
260  
110  
80  
10  
15  
5
40  
propagation delay time CP to OS';  
HIGH-to-LOW  
120  
50  
240  
100  
80  
10  
15  
5
40  
propagation delay time CP to OS';  
LOW-to-HIGH  
130  
60  
260  
120  
90  
10  
15  
5
45  
propagation delay time CP to On;  
OFF-to-LOW  
240  
80  
480  
160  
110  
340  
150  
120  
10  
15  
5
55  
propagation delay time CP to On;  
LOW-to-OFF  
170  
75  
note 1  
10  
15  
60  
1999 Jun 30  
5
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
TYPICAL  
EXTRAPOLATION  
FORMULA  
VDD  
(V)  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
140  
MAX. UNIT  
tPZL  
propagation delay time STR to On;  
OFF-to-LOW  
5
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
280  
140  
110  
200  
100  
70  
170  
80  
60  
170  
80  
60  
200  
110  
100  
160  
80  
60  
−
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
MHz  
MHz  
MHz  
note 1  
10  
15  
5
70  
55  
100  
40  
35  
85  
40  
30  
85  
40  
30  
100  
55  
50  
80  
40  
30  
30  
15  
12  
40  
30  
12  
30  
10  
5
tPLZ  
propagation delay time STR to On;  
LOW-to-OFF  
note 1  
10  
15  
5
tTHL  
output transition time OS and OS';  
HIGH-to-LOW  
35 ns + (1.0 ns/pF)CL  
19 ns + (0.42 ns/pF)CL  
16 ns + (0.28 ns/pF)CL  
35 ns + (1.0 ns/pF)CL  
19 ns + (0.42 ns/pF)CL  
16 ns + (0.28 ns/pF)CL  
note 1  
10  
15  
5
tTLH  
output transition time OS and OS';  
LOW-to-HIGH  
10  
15  
5
tPZL  
output enable time EO to On;  
OFF-to-LOW  
10  
15  
5
tPLZ  
output disable time EO to On;  
LOW-to-OFF  
note 1  
10  
15  
5
tWCPL  
tWSTRH  
tsu  
minimum clock pulse width LOW  
60  
30  
24  
80  
60  
24  
60  
20  
15  
+5  
20  
20  
5
10  
15  
−
−
minimum strobe pulse width HIGH 5  
10  
−
−
15  
5
−
set-up time D to CP  
hold time D to CP  
−
10  
15  
+5  
10  
15  
5
−
−
th  
−15  
5
−
−
5
−
fclk(max)  
maximum clock frequency  
10  
22  
28  
−
10  
15  
11  
14  
−
−
Note  
1. Definition of symbol equivalent to 3-state outputs.  
1999 Jun 30  
6
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
clock input  
data input  
strobe input  
output enable input  
internal O ' (FF1)  
0
output O  
0
internal O ' (FF7)  
6
output O  
6
serial output O  
S
serial output O  
'
S
MBD914  
Fig.5 Timing diagram.  
1999 Jun 30  
7
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V
DD  
V
CC  
O
O
O
O
0
0
7
7
V
D
DD  
O
'
S
V
D
HEF4794B  
HEF4794B  
DD  
O
'
S
V
V
SS  
SS  
STR  
CP  
STR  
CP  
EO  
EO  
PWM  
dimmer input  
MBD913  
CONTROL AND  
SYNC CIRCUITRY  
DATA  
CLOCK  
from remote  
controller  
Fig.6 Application example: serial-to-parallel converting LED drivers.  
ahdnbok,uflapegwidt  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
PACKAGE OUTLINES  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
c
y
H
v
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-23  
97-05-22  
SOT109-1  
076E07S  
MS-012AC  
1999 Jun 30  
9
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
DIP16: plastic dual in-line package; 16 leads (300 mil); long body  
SOT38-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
2
(1)  
(1)  
1
w
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.  
max.  
min.  
max.  
1.40  
1.14  
0.53  
0.38  
0.32  
0.23  
21.8  
21.4  
6.48  
6.20  
3.9  
3.4  
8.25  
7.80  
9.5  
8.3  
4.7  
0.51  
3.7  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
2.2  
0.021  
0.015  
0.013  
0.009  
0.86  
0.84  
0.32  
0.31  
0.055  
0.045  
0.26  
0.24  
0.15  
0.13  
0.37  
0.33  
inches  
0.19  
0.020  
0.15  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-10-02  
95-01-19  
SOT38-1  
050G09  
MO-001AE  
1999 Jun 30  
10  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
Typical reflow peak temperatures range from  
215 to 250 °C. The top-surface temperature of the  
packages should preferable be kept below 230 °C.  
SOLDERING  
Introduction  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(document order number 9398 652 90011).  
WAVE SOLDERING  
Conventional single wave soldering is not recommended  
for surface mount devices (SMDs) or printed-circuit boards  
with a high component density, as solder bridging and  
non-wetting can present major problems.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mount components are mixed on  
one printed-circuit board. However, wave soldering is not  
always suitable for surface mount ICs, or for printed-circuit  
boards with high population densities. In these situations  
reflow soldering is often used.  
To overcome these problems the double-wave soldering  
method was specifically developed.  
If wave soldering is used the following conditions must be  
observed for optimal results:  
• Use a double-wave soldering method comprising a  
turbulent wave with high upward pressure followed by a  
smooth laminar wave.  
Through-hole mount packages  
SOLDERING BY DIPPING OR BY SOLDER WAVE  
• For packages with leads on two sides and a pitch (e):  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joints for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
– larger than or equal to 1.27 mm, the footprint  
longitudinal axis is preferred to be parallel to the  
transport direction of the printed-circuit board;  
– smaller than 1.27 mm, the footprint longitudinal axis  
must be parallel to the transport direction of the  
printed-circuit board.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
The footprint must incorporate solder thieves at the  
downstream end.  
• For packages with leads on four sides, the footprint must  
be placed at a 45° angle to the transport direction of the  
printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
MANUAL SOLDERING  
Apply the soldering iron (24 V or less) to the lead(s) of the  
package, either below the seating plane or not more than  
2 mm above it. If the temperature of the soldering iron bit  
is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
300 and 400 °C, contact may be up to 5 seconds.  
Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Surface mount packages  
REFLOW SOLDERING  
MANUAL SOLDERING  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Fix the component by first soldering two  
diagonally-opposite end leads. Use a low voltage (24 V or  
less) soldering iron applied to the flat part of the lead.  
Contact time must be limited to 10 seconds at up to  
300 °C.  
Several methods exist for reflowing; for example,  
infrared/convection heating in a conveyor type oven.  
Throughput times (preheating, soldering and cooling) vary  
between 100 and 200 seconds depending on heating  
method.  
When using a dedicated tool, all other leads can be  
soldered in one operation within 2 to 5 seconds between  
270 and 320 °C.  
1999 Jun 30  
11  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
Suitability of IC packages for wave, reflow and dipping soldering methods  
SOLDERING METHOD  
WAVE  
REFLOW(1) DIPPING  
suitable(2)  
MOUNTING  
PACKAGE  
Through-hole mount DBS, DIP, HDIP, SDIP, SIL  
−
suitable  
Surface mount  
BGA, SQFP  
not suitable  
not suitable(3)  
suitable  
suitable  
−
−
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,  
SMS  
PLCC(4), SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
suitable  
suitable  
−
−
−
not recommended(4)(5) suitable  
not recommended(6)  
suitable  
Notes  
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink  
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).  
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;  
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
1999 Jun 30  
12  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jun 30  
13  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
NOTES  
1999 Jun 30  
14  
Philips Semiconductors  
Product specification  
8-stage shift-and-store register LED driver  
HEF4794B  
NOTES  
1999 Jun 30  
15  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
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Norway: Box 1, Manglerud 0612, OSLO,  
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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
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Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Tel. +48 22 612 2831, Fax. +48 22 612 2327  
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Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
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Colombia: see South America  
Czech Republic: see Austria  
Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
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Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
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Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
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Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
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Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA66  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
245002/02/pp16  
Date of release: 1999 Jun 30  
Document order number: 9397 750 06151  

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