935269058125 [NXP]
IC LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, PLASTIC, SC-88A, SOT-353, 5 PIN, Bus Driver/Transceiver;
| 型号： | 935269058125 |
| 厂家： | 
NXP |
| 描述： | IC LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, PLASTIC, SC-88A, SOT-353, 5 PIN, Bus Driver/Transceiver 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总27页 (文件大小：179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74LVC1G66
Bilateral switch
Product specification
2002 Nov 15
Supersedes data of 2002 May 29
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
FEATURES
DESCRIPTION
• Very low ON resistance:
The 74LVC1G66 is a high-speed Si-gate CMOS device.
– 7.5 Ω (typical) at VCC = 2.7 V
– 6.5 Ω (typical) at VCC = 3.3 V
– 6 Ω (typical) at VCC = 5 V.
The 74LVC1G66 provides an analog switch. The switch
has two input/output pins (Y and Z) and an active HIGH
enable input pin (E). When pin E is LOW, the analog
switch is turned off.
• High noise immunity
• CMOS low power consumption
• Latch up performance exceeds 250 mA
• Direct interface TTL-levels
• Multiple package options
• ESD protection:
– HBM EIA/JESD22-A114-A exceeds 2000 V
– MM EIA/JESD22-A115-A exceeds 200 V.
• Specified from −40 to +125 °C.
QUICK REFERENCE DATA
Ground = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
SYMBOL
PZH/tPZL
PARAMETER
CONDITIONS
TYPICAL
UNIT
t
t
turn-on time E to VOS
CL = 50 pF; RL = 500 Ω; VCC = 3 V
CL = 50 pF; RL = 500 Ω; VCC = 5 V
CL = 50 pF; RL = 500 Ω; VCC = 3 V
CL = 50 pF; RL = 500 Ω; VCC = 5 V
2.5
1.9
3.4
2.5
2
ns
ns
ns
ns
PHZ/tPLZ
turn-off time E to VOS
CI
input capacitance
pF
pF
CPD
power dissipation capacitance
CL = 50 pF; f = 10 MHz; VCC = 3.3 V;
notes 1 and 2
16
CS
switch capacitance
OFF-state
ON-state
5
pF
pF
9.5
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. The condition is VI = GND to VCC
.
2002 Nov 15
2
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
FUNCTION TABLE
See note 1.
INPUT E
SWITCH
L
OFF
ON
H
Note
1. H = HIGH voltage level;
L = LOW voltage level.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATUR
PINS
PACKAGE
MATERIAL
CODE
MARKING
E RANGE
74LVC1G66GW −40 to +125 °C
74LVC1G66GV −40 to +125 °C
5
5
SC-88A
SC-74A
plastic
plastic
SOT353
SOT753
VL
V66
PINNING
PIN
SYMBOL
DESCRIPTION
1
2
3
4
5
Y
Z
independent input/output
independent output/input
ground (0 V)
GND
E
enable input (active HIGH)
supply voltage
VCC
handbook, halfpage
handbook, halfpage
Y
Z
1
2
3
5
4
V
CC
Y
E
Z
66
E
GND
MNA074
MNA657
Fig.1 Pin configuration.
Fig.2 Logic symbol.
2002 Nov 15
3
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
handbook, halfpage
Z
1
4
handbook, halfpage
1
2
1
#
Y
E
X1
MNA076
V
MNA658
CC
Fig.3 IEC logic symbol.
Fig.4 Logic diagram.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
1.65
MAX.
5.5
UNIT
V
VI
input voltage
0
5.5
VCC
5.5
+125
20
V
VO
output voltage
active mode
CC = 0 V; Power-down mode
0
V
V
0
V
Tamb
tr, tf
operating ambient temperature
input rise and fall times
−40
0
°C
VCC = 1.65 to 2.7 V
VCC = 2.7 to 5.5 V
ns/V
ns/V
0
10
2002 Nov 15
4
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.5
MAX.
+6.5
UNIT
VCC
IIK
V
input diode current
input voltage
VI < 0
note 1
−
−50
mA
V
VI
−0.5
−
+6.5
±50
IOK
VO
output diode current
output voltage
VO > VCC or VO < 0
mA
V
active mode; notes 1 and 2
Power-down mode; notes 1 and 2
−0.5
−0.5
−
VCC + 0.5
+6.5
±50
V
IO
output source or sink current VO = 0 to VCC
mA
mA
°C
mW
ICC, IGND VCC or GND current
−
±100
+150
250
Tstg
PD
storage temperature
−65
−
power dissipation per package for temperature range from
−40 to +125 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
2002 Nov 15
5
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.(1)
MAX.
UNIT
OTHER
VCC (V)
Tamb = −40 to +85 °C
VIH HIGH-level input voltage
1.65 to 1.95 0.65 × VCC
−
−
−
−
−
V
V
V
V
V
V
V
V
µA
2.3 to 2.7
2.7 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7 to 3.6
4.5 to 5.5
1.7
−
2.0
−
0.7 × VCC
−
VIL
LOW-level input voltage
−
−
−
−
−
−
0.35 × VCC
0.7
−
−
0.8
−
0.3 × VCC
±5
ILI
IS
input leakage current
(control pin)
VI = 5.5 V or GND 5.5
±0.1
analog switch OFF-state
current
VI = VIH or VIL;
|VS| = VCC − GND;
see Fig.6
5.5
5.5
−
−
−
−
±0.1
±0.1
0.1
5
±5
µA
µA
µA
µA
analog switch ON-state
current
VI = VIH or VIL;
|VS| = VCC − GND;
see Fig.7
±5
ICC
quiescent supply current
VI = VCC or GND; 5.5
10
VS = GND or VCC
;
IO = 0
∆ICC
additional quiescent supply VI = VCC − 0.6 V;
5.5
500
current per control pin
VS = GND or VCC
IO = 0
;
RON(peak)
ON-resistance (peak)
VS = GND to VCC;
VI = VIH; see Fig.5
IS = 4 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
35
100
30
25
20
15
Ω
Ω
Ω
Ω
Ω
IS = 8 mA
14
IS = 12 mA
IS = 24 mA
IS = 32 mA
11.5
8.5
6.5
3.0 to 3.6
4.5 to 5.5
2002 Nov 15
6
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
TEST CONDITIONS
OTHER VCC (V)
VS = GND;
SYMBOL
PARAMETER
ON-resistance (rail)
MIN.
TYP.(1)
MAX.
UNIT
RON(rail)
VI = VIH; see Fig.5
IS = 4 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
10
8.5
7.5
6.5
6
30
20
18
15
10
Ω
Ω
Ω
Ω
Ω
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
3.0 to 3.6
4.5 to 5.5
VS = VCC;VI = VIH;
see Fig.5
IS = 4 mA
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
12
8.5
7.5
6.5
6
30
20
18
15
10
Ω
Ω
Ω
Ω
Ω
3.0 to 3.6
4.5 to 5.5
RON(flatness) ON-resistance (flatness)
VS = GND to VCC
;
VI = VIH;
see Figs 9 to 12
IS = 4 mA
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
100(2)
17(2)
10(2)
5(2)
−
−
−
−
−
Ω
Ω
Ω
Ω
Ω
3.0 to 3.6
4.5 to 5.5
3(2)
Tamb = −40 to +125 °C
VIH
HIGH-level input voltage
1.65 to 1.95 0.65 × VCC
−
−
−
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
V
V
V
µA
2.3 to 2.7
2.7 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7 to 3.6
4.5 to 5.5
1.7
2.0
0.7 × VCC
VIL
LOW-level input voltage
−
−
−
−
−
0.35 × VCC
0.7
0.8
0.3 × VCC
100
ILI
IS
input leakage current
(control pin)
VI = 5.5 V or GND 5.5
analog switch OFF-state
current
VI = VIH or VIL;
|VS| = VCC − GND;
see Fig.6
5.5
5.5
−
−
−
−
200
200
µA
µA
analog switch ON-state
current
VI = VIH or VIL;
|VS| = VCC − GND;
see Fig.7
2002 Nov 15
7
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
TEST CONDITIONS
SYMBOL
ICC
PARAMETER
quiescent supply current
MIN.
TYP.(1)
MAX.
200
UNIT
OTHER
VCC (V)
VI = VCC or GND; 5.5
−
−
−
µA
VS = GND or VCC
;
IO = 0
∆ICC
additional quiescent supply VI = VCC − 0.6 V;
5.5
−
5000
µA
current per control pin
VS = GND or VCC
IO = 0
;
RON(peak)
ON-resistance (peak)
VS = GND to VCC;
VI = VIH; see Fig.5
IS = 4 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
−
−
−
−
−
150
45
38
30
23
Ω
Ω
Ω
Ω
Ω
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
3.0 to 3.6
4.5 to 5.5
RON(rail)
ON-resistance (rail)
VS = GND;
VI = VIH; see Fig.5
IS = 4 mA
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
−
−
−
−
−
45
30
27
23
15
Ω
Ω
Ω
Ω
Ω
3.0 to 3.6
4.5 to 5.5
VS = VCC;VI = VIH;
see Fig.5
IS = 4 mA
IS = 8 mA
IS = 12 mA
IS = 24 mA
IS = 32 mA
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
−
−
−
−
−
45
30
27
23
15
Ω
Ω
Ω
Ω
Ω
3.0 to 3.6
4.5 to 5.5
Notes
1. All typical values are measured at Tamb = 25 °C.
2. RON flatness over operating temperature range (Tamb = −40 to +85 °C).
2002 Nov 15
8
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
E
V
IL
E
V
IH
V
Y
Z
Y
Z
A
A
V
= GND to V
I
S
S
CC
V = V
or GND
CC
V
= GND or V
I
O
CC
GND
MNA659
GND
GND
MNA660
Fig.5 Test circuit for measuring ON-resistance
(RON).
Fig.6 Test circuit for measuring OFF-state current.
MNA673
2
10
handbook, halfpage
R
ON
E
V
= 1.8 V
2.5 V
(Ω)
CC
V
IH
Y
Z
2.7 V
10
A
A
3.3 V
5.0 V
V = V
or GND
V
(open circuit)
GND
I
CC
O
MNA661
1
0
1
2
3
4
5
V (V)
I
Fig.8 Typical ON-resistance (RON) as a function
of input voltage (VS) for VS = GND to VCC
Fig.7 Test circuit for measuring ON-state current.
.
2002 Nov 15
9
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
MNA664
MNA663
15
15
handbook, halfpage
handbook, halfpage
R
R
ON
ON
°
C
°
C
°
C
T
= +85
+25
amb
(Ω)
(Ω)
°
C
°
C
°
C
T
= +85
+25
amb
−40
10
10
−40
5
5
0
0
0
0
1
2
3
1
2
3
V (V)
V (V)
l
l
Fig.9 RON for VCC = 2.5 V.
Fig.10 RON for VCC = 2.7 V.
MNA666
MNA665
10
8
handbook, halfpage
handbook, halfpage
R
ON
R
ON
(Ω)
(Ω)
T
=
amb
7
8
°
+85
C
6
5
4
3
°
= +85 C
T
amb
°
°
6
4
2
+25
−40
C
C
°
+25
C
°
−40
C
2
0
0
0
1
2
3
4
5
1
2
3
4
V (V)
l
V (V)
I
Fig.11 RON for VCC = 3.3 V.
Fig.12 RON for VCC = 5.0 V.
2002 Nov 15
10
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
AC CHARACTERISTICS
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.(1)
MAX.
UNIT
WAVEFORMS
VCC (V)
Tamb = −40 to +85 °C
tPHL/tPLH
propagation delay Y to Z see Figs 13 and 15
or Z to Y
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
1
1
1
1
1
1
1
1
1
1
0.8
2
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
0.4
0.4
0.3
0.2
5.3
3.0
2.6
2.5
1.9
4.2
2.4
3.6
3.4
2.5
1.2
1
3.0 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7
0.8
0.6
12
6.5
6
t
PZH/tPZL
turn-ON time E to VOS
see Figs 14 and 15
see Figs 14 and 15
3.0 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7
5
4.2
10
6.9
7.5
6.5
5
tPHZ/tPLZ
turn-OFF time E to VOS
3.0 to 3.6
4.5 to 5.5
Tamb = −40 to +125 °C
tPHL/tPLH
propagation delay Y to Z see Figs 13 and 15
or Z to Y
1.65 to 1.95
2.3 to 2.7
2.7
−
−
−
−
−
1
1
1
1
1
1
1
1
1
1
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2
1.5
1.5
1
3.0 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7
t
PZH/tPZL
turn-ON time E to VOS
see Figs 14 and 15
see Figs 14 and 15
15.5
8.5
8
3.0 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
2.7
6.5
5.5
13
9
tPHZ/tPLZ
turn-OFF time E to VOS
9.5
8.5
6.5
3.0 to 3.6
4.5 to 5.5
Note
1. All typical values are measured at Tamb = 25 °C.
2002 Nov 15
11
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
AC WAVEFORMS
V
handbook, halfpage
Y or Z
I
V
M
GND
t
t
PHL
PLH
V
OH
V
Z or Y
M
V
OL
MNA667
INPUT
tr = tf
VCC
VM
VI
1.65 to 1.95 V 0.5 × VCC VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
≤ 2.5 ns
2.3 to 2.7 V
2.7 V
0.5 × VCC VCC
1.5 V
1.5 V
2.7 V
2.7 V
3.0 to 3.6 V
4.5 to 5.5 V
0.5 × VCC VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.13 The input (VS) to output (VO) propagation delays.
2002 Nov 15
12
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
V
I
E
V
M
t
GND
t
PLZ
PZL
V
CC
output
Y or Z
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
output
Y
Y or Z
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
switch
enabled
switch
enabled
switch
disabled
MNA668
INPUT
tr = tf
VCC
VM
VI
1.65 to 1.95 V
2.3 to 2.7 V
2.7 V
0.5 × VCC VCC
0.5 × VCC VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
≤ 2.5 ns
VX = VOL + 0.3 V at VCC ≥ 2.7 V;
X = VOL + 0.1 x VCC at VCC < 2.7 V;
V
1.5 V
1.5 V
2.7 V
2.7 V
VY = VOH − 0.3 V at VCC ≥ 2.7 V;
3.0 to 3.6 V
4.5 to 5.5 V
VY = VOH − 0.1 x VCC at VCC < 2.7 V.
0.5 × VCC VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.14 The turn-on and turn-off times.
2002 Nov 15
13
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
V
EXT
V
CC
R
L
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
R
R
L
L
T
MNA616
VEXT
VCC
VI
CL
RL
tPLH/tPHL
tPZH/tPHZ
tPZL/tPLZ
1.65 to 1.95 V
2.3 to 2.7 V
2.7 V
VCC
VCC
30 pF
30 pF
1 kΩ
open
open
open
open
open
GND
GND
GND
GND
GND
2 × VCC
2 × VCC
6 V
500 Ω
500 Ω
500 Ω
500 Ω
2.7 V 50 pF
2.7 V 50 pF
3.0 to 3.6 V
4.5 to 5.5 V
6 V
VCC
50 pF
2 × VCC
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.15 Load circuitry for switching times.
2002 Nov 15
14
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
ADDITIONAL AC CHARACTERISTICS
At recommended conditions and all typical values are measured at Tamb = 25 °C.
SYMBOL
PARAMETER
TEST CONDITIONS
V
CC (V)
TYP.
0.032
UNIT
sine-wave distortion
RL = 10 kΩ; CL = 50 pF;
fin = 1 kHz; see Fig.17
1.65
2.3
3
%
%
%
%
%
%
%
%
0.008
0.006
0.001
0.068
0.009
0.008
0.006
135
4.5
1.65
2.3
3
RL = 10 kΩ; CL = 50 pF;
fin = 10 kHz; see Fig.17
4.5
1.65
2.3
3
switch ON signal frequency
response
RL = 600 Ω; CL = 50 pF;
fin = 1 MHz; see Fig.16;
note 1
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
dB
145
150
4.5
1.65
2.3
3
155
RL = 50 Ω; CL = 5 pF;
fin = 1 MHz; see Fig.16;
note 1
>500
>500
>500
>500
−46
4.5
1.65
2.3
3
switch OFF signal
feed-through attenuation
RL = 600 Ω; CL = 50 pF;
fin = 1 MHz; see Fig.18;
note 2
−46
dB
−46
dB
4.5
1.65
2.3
3
−46
dB
RL = 0 Ω; CL = 50 pF;
fin = 1 MHz; see Fig.18;
note 2
−37
dB
−37
dB
−37
dB
4.5
1.65
2.3
3
−37
dB
crosstalk (control input to
signal output)
RL = 600 Ω; CL = 50 pF;
fin = 1 MHz; tr = tf = 2 ns;
see Fig.19
69
mV
87
mV
156
mV
4.5
1.65
2.3
3
302
mV
minimum frequency response RL = 50 Ω; CL = 10 pF;
(−3 dB) see Fig.16; note 1
200
MHz
MHz
MHz
MHz
350
410
4.5
440
2002 Nov 15
15
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
SYMBOL
PARAMETER
TEST CONDITIONS
VCC (V)
2.5
TYP.
13.7
UNIT
CPD
power dissipation capacitance CL = 50 pF; fin = 10 MHz
pF
pF
pF
pC
3.3
5.0
15.2
18.3
Q
charge injection
CL = 0.1 nF; Vgen = 0 V;
Rgen = 0 Ω; f = 1 MHz;
1.65 to 5.5 0.05
RL = 1 MΩ; see Fig.20; note 3
Notes
1. Adjust fin voltage to obtain 0 dBm level at output. Increase fin frequency until dB meter reads −3 dB.
2. Adjust fin voltage to obtain 0 dBm level at input.
3. Guaranteed by design.
E
V
IH
0.1 µF
Y/Z
Z/Y
V
O
f
R
50 Ω
C
dB
in
L
L
channel
ON
1/2V
CC
MNA669
Fig.16 Test circuit for measuring the frequency response when switch is ON.
2002 Nov 15
16
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
E
V
IH
10 µF
Y/Z
Z/Y
V
O
DISTORTION
METER
f
600 Ω
R
C
L
in
L
channel
ON
1/2V
CC
MNA670
VCC
VI
1.65 V
2.3 V
3 V
1.4 V (p-p)
2 V (p-p)
2.5 V (p-p)
4 V (p-p)
4 V
Fig.17 Test circuit for measuring sine-wave distortion.
E
V
IL
0.1 µF
Y/Z
Z/Y
V
O
f
R
R
L
50 Ω
1/2V
C
dB
in
L
L
channel
ON
1/2V
CC
CC
MNA671
Fig.18 Test circuit for measuring feed-through when switch is OFF.
17
2002 Nov 15
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
E
Y/Z
in
Z/Y
V
O
R
R
600 Ω
C
L
L
50 Ω
600 Ω
50 pF
1/2V
1/2V
CC
CC
MNA672
Fig.19 Crosstalk.
E
R
gen
Y/Z
Z/Y
V
O
logic
input
1
MΩ
0.1
nF
V
R
C
L
gen
L
MNA674
logic
input (E)
off
on
off
V
∆V
out
O
MNA675
Q = (∆Vout) × (CL)
Fig.20 Charge injection test.
18
2002 Nov 15
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
PACKAGE OUTLINES
Plastic surface mounted package; 5 leads
SOT353
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
(2)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SC-88A
97-02-28
SOT353
2002 Nov 15
19
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
Plastic surface mounted package; 5 leads
SOT753
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X
e
b
p
w
M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100
0.013
0.40
0.25
1.1
0.9
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
0.95
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
SOT753
SC-74A
02-04-16
2002 Nov 15
20
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2002 Nov 15
21
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Nov 15
22
Philips Semiconductors
Product specification
Bilateral switch
74LVC1G66
DATA SHEET STATUS
DATA SHEET
LEVEL
PRODUCT
STATUS(2)(3)
DEFINITION
STATUS(1)
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Nov 15
23
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp24
Date of release: 2002 Nov 15
Document order number: 9397 750 10074
it Q
Philips Semiconductors Home
ProducBuy
MySemContac
Product Information
catalogonline
Information as of 2003-04-23
My.Semiconductors.COM.
Your personal service from Use right mouse button to
Philips Semiconductors.
Please register now !
Stay informed
74LVC1G66;
Bilateral switch
download datasheet
Download datasheet
General description
Features
Applications
Datasheet
Products
Buy online
Parametrics
Support & tools
Similar products
Email/translate
Block diagram
Products & packages
MultiMarket
•
•
•
Semiconductors
Product Selector
Catalog by
Function
General description
The 74LVC1G66 is a high-speed Si-gate CMOS device.
Catalog by
System
•
The 74LVC1G66 provides an analog switch. The switch has two input/output pins (Y and Z) and an active HIGH
enable input pin (E). When pin E is LOW, the analog switch is turned off.
Cross-reference
Packages
•
•
End of Life
information
Distributors Go
Here!
•
•
Features
●
Very low ON resistance:
❍
❍
❍
7.5 Ohm (typical) at VCC = 2.7 V
Models
•
•
6.5 Ohm (typical) at VCC = 3.3 V
6 Ohm (typical) at VCC =5 V.
SoC solutions
●
●
●
●
●
●
High noise immunity
CMOS low power consumption
Latch up performance exceeds 250 mA
Direct interface TTL-levels
Multiple package options
ESD protection:
❍
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
❍
●
Specified from -40 to +125 Cel.
Applications
AN10161_2: PicoGate Logic footprints (date 30-Oct-02)
Datasheet
Type number Title
Publication release Datasheet status
date
Page
count
File size Datasheet
(kB)
74LVC1G66 Bilateral
switch
11/15/2002
Product specification 24
117
Download
Parametrics
Type number Package Description Propagation Voltage No. Power
Logic
Output
Delay(ns)
of
Dissipation
Switching Drive
Pins Considerations Levels
Capability
3.3V
Low Power or
Battery
Applications
SOT353
(UMT5)
PicoGate
Bilateral
Switch
74LVC1G66GW
4~6
Low
5
TTL
Low
Products, packages, availability and ordering
Type number
North American Ordering code Marking/Packing Package Device
Buy online
IC packing info
type number
(12NC)
status
Standard Marking
9352 720 34125 * Reel Pack,
Reverse
SOT753
Full production
74LVC1G66GV
74LVC1G66GW
-
Standard Marking
9352 690 58115 * Reel Pack,
SMD, 7"
SOT353
(UMT5)
74LVC1G66GW-
G
Full production
Full production
Full production
-
Standard Marking
9352 690 58118 * Reel Pack,
SMD, 13"
SOT353
(UMT5)
Standard Marking
9352 690 58125 * Reel Pack,
Reverse
SOT353
(UMT5)
-
-
Standard Marking
SOT353
(UMT5)
* Reel Pack,
SMD, Large,
Reverse
Full production
9352 690 58165
Similar products
74LVC1G66 links to the similar products page containing an overview of products that are similar in function
or related to the type number(s) as listed on this page. The similar products page includes products from the same
catalog tree(s), relevant selection guides and products from the same functional category.
Support & tools
I²C Bus Solutions, Typical I²C Bus Arrangement
Philips PicoGate Logic The logical alternative for miniaturization(date 01-Nov-02)
Email/translate this product information
●
●
Email this product information.
Translate this product information page from English to:
French
Translate
The English language is the official language used at the semiconductors.philips.com website and webpages. All
translations on this website are created through the use of Google Language Tools and are provided for convenience
purposes only. No rights can be derived from any translation on this website.
About this Web Site
| Copyright © 2003 Koninklijke Philips N.V. All rights reserved. | Privacy Policy |
| Koninklijke Philips N.V. | Access to and use of this Web Site is subject to the following Terms of Use. |
相关型号：
935269058165
IC LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, PLASTIC, SC-88A, SOT-353, 5 PIN, Bus Driver/Transceiver
NXP
935269076118
IC CBT/FST/QS/5C/B SERIES, 10 1-BIT DRIVER, TRUE OUTPUT, PDSO24, 7.50 MM, PLASTIC, MS-013, SOT-137-1, SO-24, Bus Driver/Transceiver
NXP
935269077118
IC CBT/FST/QS/5C/B SERIES, 10 1-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24, Bus Driver/Transceiver
NXP
935269089112
IC 10 1-BIT DRIVER, TRUE OUTPUT, PDSO24, 7.50 MM, PLASTIC, MS-013, SOT-137-1, SO-24, Bus Driver/Transceiver
NXP
935269089118
IC 10 1-BIT DRIVER, TRUE OUTPUT, PDSO24, 7.50 MM, PLASTIC, MS-013, SOT-137-1, SO-24, Bus Driver/Transceiver
NXP
935269117115
IC LINE TRANSCEIVER, PBCC16, 3 X 3 X 0.65 MM, PLASTIC, MO-217, SOT-639-2, HBCC-16, Line Driver or Receiver
NXP
935269132112
PLL BASED CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48
NXP
935269132118
PLL BASED CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48
NXP
935269138115
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5, PLASTIC, SOT-23, SO-5, Power Management Circuit
NXP
935269143115
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5, PLASTIC, SOT-23, SO-5, Power Management Circuit
NXP
935269144115
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5, 1.50 MM, PLASTIC, SOT-23, SOT-25, SO-5, Power Management Circuit
NXP
935269145115
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5, PLASTIC, SOT-23, SO-5, Power Management Circuit
NXP
©2020 ICPDF网 联系我们和版权申明