BAS70-05W,115 [NXP]
BAS70 series; 1PS7xSB70 series - General-purpose Schottky diodes SC-70 3-Pin;型号: | BAS70-05W,115 |
厂家: | NXP |
描述: | BAS70 series; 1PS7xSB70 series - General-purpose Schottky diodes SC-70 3-Pin PC 光电二极管 |
文件: | 总20页 (文件大小:200K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAS70 series;
1PS7xSB70 series
General-purpose Schottky diodes
Rev. 09 — 13 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
1PS76SB70
1PS79SB70
BAS70
SOD323
SOD523
SOT23
SC-76
single diode
SC-79
single diode
-
single diode
BAS70H
SOD123F
SOD882
SOT323
SOT23
-
single diode
BAS70L
-
single diode
BAS70W
SC-70
single diode
BAS70-04
BAS70-04W
BAS70-05
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07S
BAS70-07V
BAS70VV
BAS70XY
-
dual series
SOT323
SOT23
SC-70
dual series
-
dual common cathode
dual common cathode
dual common anode
dual common anode
dual isolated
SOT323
SOT23
SC-70
-
SOT323
SOT143B
SOT363
SOT666
SOT666
SOT363
SC-70
-
SC-88
dual isolated
-
dual isolated
-
triple isolated
SC-88
quadruple; 2 series
1.2 Features
High switching speed
High breakdown voltage
Low leakage current
Low capacitance
1.3 Applications
Ultra high-speed switching
Voltage clamping
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per diode
IF
forward current
forward voltage
reverse voltage
-
-
-
-
-
-
70
mA
mV
V
[1]
VF
VR
IF = 1 mA
410
70
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2. Pinning information
Table 3.
Pin
BAS70H; 1PS76SB70; 1PS79SB70
Pinning
Description
Simplified outline
Symbol
[1]
1
2
cathode
anode
1
2
1
2
sym001
001aab540
BAS70L
[1]
1
2
cathode
anode
1
2
1
2
sym001
Transparent
top view
BAS70; BAS70W
1
2
3
anode
3
3
not connected
cathode
2
n.c.
1
006aaa436
1
2
006aaa144
BAS70-04; BAS70-04W
1
2
3
anode (diode 1)
3
3
cathode (diode 2)
cathode (diode 1),
anode (diode 2)
1
2
006aaa437
1
2
006aaa144
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
2 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pin
BAS70-05; BAS70-05W
Pinning …continued
Description
Simplified outline
Symbol
1
2
3
anode (diode 1)
3
3
anode (diode 2)
cathode (diode 1),
cathode (diode 2)
1
2
006aaa438
1
2
006aaa144
BAS70-06; BAS70-06W
1
2
3
cathode (diode 1)
3
3
cathode (diode 2)
anode (diode 1),
anode (diode 2)
1
2
006aaa439
1
2
006aaa144
BAS70-07
1
2
3
4
cathode (diode 1)
cathode (diode 2)
anode (diode 2)
anode (diode 1)
4
3
4
3
2
1
2
1
006aaa434
BAS70-07S; BAS70-07V
1
2
3
4
5
6
anode (diode 1)
6
1
5
2
4
3
6
1
5
4
not connected
cathode (diode 2)
anode (diode 2)
not connected
006aaa440
2
5
3
cathode (diode 1)
001aab555
BAS70VV
1
2
3
4
5
6
anode (diode 1)
anode (diode 2)
anode (diode 3)
cathode (diode 3)
cathode (diode 2)
cathode (diode 1)
6
1
5
4
6
4
3
2
3
sym046
1
2
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
3 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pinning …continued
Pin
Description
Simplified outline
Symbol
BAS70XY
1
2
3
anode (diode 1)
6
1
5
2
4
3
6
5
4
cathode (diode 2)
anode (diode 3),
cathode (diode 4)
4
5
6
anode (diode 4)
cathode (diode 3)
1
2
3
cathode (diode 1),
anode (diode 2)
006aaa256
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
SOD323
SOD523
SOT23
1PS76SB70
1PS79SB70
BAS70
SC-76
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 2 leads
SC-79
-
-
-
BAS70H
SOD123F
SOD882
BAS70L
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
BAS70W
SC-70
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 4 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
SOT323
SOT23
BAS70-04
BAS70-04W
BAS70-05
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07S
BAS70-07V
BAS70VV
BAS70XY
-
SC-70
SOT323
SOT23
-
SC-70
SOT323
SOT23
-
SC-70
SOT323
SOT143B
SOT363
SOT666
SOT666
SOT363
-
SC-88
-
-
SC-88
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
4 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
4. Marking
Table 5.
Marking codes
Type number
1PS76SB70
1PS79SB70
BAS70
Marking code[1]
Type number
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07S
BAS70-07V
BAS70VV
BAS70XY
-
Marking code[1]
S2
G
75*
76*
76*
77*
77*
77
73*
AH
S8
BAS70H
BAS70L
BAS70W
73*
74*
74*
75*
BAS70-04
BAS70-04W
BAS70-05
N1
70*
-
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
VR
Parameter
Conditions
Min
Max
Unit
reverse voltage
forward current
-
-
-
70
70
70
V
IF
mA
mA
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
[1]
IFSM
non-repetitive peak forward tp ≤ 10 ms
-
100
mA
current
Tj
junction temperature
ambient temperature
storage temperature
-
150
°C
°C
°C
Tamb
Tstg
−65
−65
+150
+150
[1] Tj = 25 °C prior to surge.
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
5 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol Parameter
Per device
Conditions
Min
Typ
Max
Unit
[1]
Rth(j-a)
thermal resistance from
in free air
junction to ambient
SOT23
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
500
416
700
416
330
450
450
500
625
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
[2]
[2]
[2]
SOD323
[2]
[2]
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS70XY)
-
-
260
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Per diode
Conditions
Min
Typ
Max
Unit
[1]
VF
forward voltage
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
410
750
1
mV
mV
V
IF = 10 mA
IF = 15 mA
VR = 50 V
IR
reverse current
100
10
2
nA
μA
pF
VR = 70 V
Cd
diode capacitance
VR = 0 V; f = 1 MHz
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
6 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
mra803
mra805
2
2
10
10
I
(1)
(2)
R
I
F
(μA)
(mA)
10
10
1
1
−1
10
−1
10
−2
10
10
(3)
(1)
(2) (3) (4)
−2
−3
10
0
0.2
0.4
0.6
0.8
1
0
20
40
60
80
V
F
(V)
V (V)
R
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mra802
mra804
3
10
2
C
d
r
(Ω)
(pF)
dif
1.5
2
10
1
0.5
0
10
1
10
−1
2
1
10
10
0
20
40
60
80
I
F
(mA)
V
R
(V)
f = 10 kHz
Tamb = 25 °C; f = 1 MHz
Fig 3. Differential forward resistance as a function of
forward current; typical values
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
7 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
8. Package outline
0.85
0.75
0.65
0.58
1.35
1.15
1.1
0.8
0.45
0.15
1
1
1.65 1.25
1.55 1.15
2.7 1.8
2.3 1.6
2
2
0.40
0.25
0.25
0.10
0.34
0.26
0.17
0.11
Dimensions in mm
03-12-17
Dimensions in mm
02-12-13
04-11-29
04-11-04
Fig 5. Package outline SOD323 (SC-76)
Fig 6. Package outline SOD523 (SC-79)
1.7
1.5
1.2
1.0
3.0
2.8
1.1
0.9
1
3
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6 2.7
3.4 2.5
1
2
2
0.48
0.38
0.15
0.09
0.70
0.55
0.25
0.10
1.9
Dimensions in mm
04-11-04
Dimensions in mm
Fig 7. Package outline SOT23 (TO-236AB)
Fig 8. Package outline SOD123F
2.2
1.8
1.1
0.50
0.46
0.62
0.55
0.8
0.45
0.15
3
2
1
0.30
0.22
2.2 1.35
2.0 1.15
1.02
0.95
0.65
0.30
0.22
1
2
0.4
0.3
0.25
0.10
0.55
0.47
cathode marking on top side
1.3
Dimensions in mm
03-04-17
Dimensions in mm
Fig 9. Package outline SOD882
Fig 10. Package outline SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
8 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
3.0
2.8
2.2
1.8
1.1
0.8
1.1
0.9
1.9
0.45
0.15
6
5
4
4
3
0.45
0.15
2.2 1.35
2.0 1.15
2.5 1.4
2.1 1.2
pin 1
index
1
2
1
2
3
0.88
0.78
0.48
0.38
0.15
0.09
0.25
0.10
0.3
0.2
0.65
1.3
1.7
Dimensions in mm
06-03-16
Dimensions in mm
04-11-16
Fig 11. Package outline SOT143B
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
0.6
0.5
6
5
4
0.3
0.1
1.7 1.3
1.5 1.1
pin 1 index
1
2
3
0.18
0.08
0.27
0.17
0.5
1
Dimensions in mm
04-11-08
Fig 13. Package outline SOT666
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
9 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
1PS76SB70
1PS79SB70
SOD323
SOD523
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-115
-
-
-
-135
-
-
-315
-115
-215
-115
-
-
-
-135
-235
-135
-315
-135
-235
-135
-235
-135
-235
-135
-235
-135
-165
-
BAS70
SOT23
-
-
BAS70H
SOD123F 4 mm pitch, 8 mm tape and reel
-
-
BAS70L
SOD882
SOT323
SOT23
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-
-
BAS70W
-115
-215
-115
-215
-115
-215
-115
-215
-115
-125
-
-
-
BAS70-04
BAS70-04W
BAS70-05
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07S
-
-
SOT323
SOT23
-
-
-
-
SOT323
SOT23
-
-
-
-
SOT323
-
-
SOT143B 4 mm pitch, 8 mm tape and reel
-
-
[2]
[3]
SOT363
SOT666
SOT666
SOT363
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-
-
-
-
BAS70-07V
BAS70VV
BAS70XY
-
-315
-
-115
-
-
-
-
-315
-
-
-115
-
-
-
-
[2]
[3]
-115
-125
-
-
-135
-165
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
10 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65 0.95
0.50 0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
0.50 0.60
1.20
solder lands
solder paste
solder resist
occupied area
0.30
0.40
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
11 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.90
2.50
solder lands
solder resist
2
1
0.85
0.85
occupied area
solder paste
2.70
3.00
1.30
3
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
12 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
1.30
0.30
R = 0.05 (8×)
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
0.30
solder lands
solder paste
solder resist
occupied area
(2×)
0.40
(2×)
0.50
(2×)
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
13 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.30
1.325
solder lands
solder paste
2
0.50
3
0.60
(3×)
2.35 0.85
1.90
(3×)
solder resist
occupied area
Dimensions in mm
1
0.55
(3×)
msa429
2.40
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3
3.65 2.10
2.70
solder lands
0.90
(2×)
solder resist
1
occupied area
Dimensions in mm
msa419
preferred transport direction during soldering
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
14 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
occupied area
solder paste
4
3
2
2.70
1.30 3.00
1
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
4
3
1.15 4.00 4.60
solder lands
solder resist
occupied area
1
2
Dimensions in mm
1.00
preferred transport direction during soldering
3.40
msa422
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
15 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.60
(2×)
0.40
(2×)
2.35
0.90 2.10
0.50
(4×)
solder paste
solder lands
solder resist
occupied area
0.50
(4×)
1.20
2.40
MSA432
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
2.5
0.3
4.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 26. Wave soldering footprint SOT363 (SC-88)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
16 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.75
2.45
2.1
1.6
solder lands
0.4
(6×)
0.3
(2×)
0.25
(2×)
placement area
0.538
0.55
1.075
1.7
2
(2×)
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
17 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
11. Revision history
Table 10. Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
BAS70_1PS7XSB70_SER_8
BAS70_1PS7XSB70_SER_9 20100113
Product data sheet
-
Modifications:
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
BAS70_1PS7XSB70_SER_8 20060504
BAS70_1PS7XSB70_SER_7 20050718
Product data sheet
Product data sheet
-
-
BAS70_1PS7XSB70_SER_7
1PS76SB70_2
1PS79SB70_1 BAS70H_1
BAS70L_1 BAS70-07V_1
BAS70VV_1 BAS70W_3
BAS70-07S_4
BAS70_SERIES_6
1PS76SB70_2
1PS79SB70_1
BAS70H_1
20040126
19980716
20050425
20030520
20020117
20040910
19990326
20030411
20011011
Product specification
Product specification
Product data sheet
Product specification
Product specification
Product data sheet
Product specification
Product specification
Product specification
-
-
-
-
-
-
-
-
-
1PS76SB70_1
-
-
BAS70L_1
-
BAS70-07V_1
BAS70VV_1
BAS70W_3
-
-
BAS70W_2
BAS70_07S_3
BAS70_5
BAS70-07S_4
BAS70_SERIES_6
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
18 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
19 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAS70_1PS7XSB70_SER_9
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