BF422-T/R [NXP]

50mA, 250V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN;
BF422-T/R
型号: BF422-T/R
厂家: NXP    NXP
描述:

50mA, 250V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN

放大器 晶体管
文件: 总6页 (文件大小:109K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BF420; BF422  
NPN high-voltage transistors  
Product data sheet  
2004 Nov 10  
Supersedes data of 1996 Dec 09  
NXP Semiconductors  
Product data sheet  
NPN high-voltage transistors  
BF420; BF422  
FEATURES  
PINNING  
Low feedback capacitance.  
PIN  
1
DESCRIPTION  
base  
APPLICATIONS  
2
collector  
emitter  
Class-B video output stages in colour television and  
3
professional monitor equipment.  
DESCRIPTION  
1
handbook, halfpage  
NPN transistors in a TO-92 plastic package.  
PNP complements: BF421 and BF423.  
2
2
3
1
3
MAM259  
Fig.1 Simplified outline (TO-92) and symbol.  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
plastic single-ended leaded (through hole) package; 3 leads  
VERSION  
SOT54  
BF420  
BF422  
SC-43A  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VCBO  
collector-base voltage  
BF420  
open emitter  
open base  
300  
V
V
BF422  
250  
VCEO  
collector-emitter voltage  
BF420  
300  
250  
100  
830  
V
BF422  
V
ICM  
Ptot  
hFE  
Cre  
fT  
peak collector current  
total power dissipation  
DC current gain  
feedback capacitance  
transition frequency  
mA  
mW  
Tamb 25 °C  
VCE = 20 V; IC = 25 mA  
50  
VCE = 30 V; IC = ic = 0 A; f = 1 MHz  
VCE = 10 V; IC = 10 mA; f = 100 MHz  
1.6  
pF  
60  
MHz  
2004 Nov 10  
2
NXP Semiconductors  
Product data sheet  
NPN high-voltage transistors  
BF420; BF422  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN. MAX. UNIT  
VCBO  
BF420  
300  
250  
V
V
BF422  
VCEO  
collector-emitter voltage  
BF420  
open base  
300  
250  
5
V
BF422  
V
VEBO  
IC  
emitter-base voltage  
collector current (DC)  
peak collector current  
peak base current  
total power dissipation  
storage temperature  
junction temperature  
ambient temperature  
open collector  
V
50  
mA  
mA  
mA  
mW  
°C  
°C  
°C  
ICM  
IBM  
Ptot  
Tstg  
Tj  
100  
50  
Tamb 25 °C; note 1  
830  
+150  
150  
+150  
65  
Tamb  
65  
Note  
1. Transistor mounted on a printed-circuit board.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
thermal resistance from junction to ambient note 1  
CONDITIONS  
VALUE  
150  
UNIT  
Rth(j-a)  
K/W  
Note  
1. Transistor mounted on a printed-circuit board.  
CHARACTERISTICS  
Tamb = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
VCB = 200 V; IE = 0 A  
MIN. MAX. UNIT  
ICBO  
collector-base cut-off current  
10  
10  
50  
nA  
µA  
nA  
VCB = 200 V; IE = 0 A; Tj = 150 °C  
VEB = 5 V; IC = 0 A  
IEBO  
hFE  
VCEsat  
Cre  
emitter-base cut-off current  
DC current gain  
VCE = 20 V; IC = 25 mA  
50  
collector-emitter saturation voltage  
feedback capacitance  
transition frequency  
IC = 30 mA; IB = 5 mA  
0.6  
1.6  
V
VCE = 30 V; IC = ic = 0 A; f = 1 MHz  
VCE = 10 V; IC = 10 mA; f = 100 MHz  
pF  
fT  
60  
MHz  
2004 Nov 10  
3
NXP Semiconductors  
Product data sheet  
NPN high-voltage transistors  
BF420; BF422  
PACKAGE OUTLINE  
Plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
A
b
b
c
D
d
E
e
e
L
1
1
max.  
5.2  
5.0  
0.48  
0.40  
0.66  
0.55  
0.45  
0.38  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
mm  
2.54  
1.27  
2.5  
Note  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
04-06-28  
04-11-16  
SOT54  
TO-92  
SC-43A  
2004 Nov 10  
4
NXP Semiconductors  
Product data sheet  
NPN high-voltage transistors  
BF420; BF422  
DATA SHEET STATUS  
DOCUMENT  
STATUS(1)  
PRODUCT  
STATUS(2)  
DEFINITION  
Objective data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary data sheet  
Product data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Notes  
1. Please consult the most recently issued document before initiating or completing a design.  
2. The product status of device(s) described in this document may have changed since this document was published  
and may differ in case of multiple devices. The latest product status information is available on the Internet at  
URL http://www.nxp.com.  
DISCLAIMERS  
the device. Limiting values are stress ratings only and  
operation of the device at these or any other conditions  
above those given in the Characteristics sections of this  
document is not implied. Exposure to limiting values for  
extended periods may affect device reliability.  
General Information in this document is believed to be  
accurate and reliable. However, NXP Semiconductors  
does not give any representations or warranties,  
expressed or implied, as to the accuracy or completeness  
of such information and shall have no liability for the  
consequences of use of such information.  
Terms and conditions of sale NXP Semiconductors  
products are sold subject to the general terms and  
conditions of commercial sale, as published at  
http://www.nxp.com/profile/terms, including those  
pertaining to warranty, intellectual property rights  
infringement and limitation of liability, unless explicitly  
otherwise agreed to in writing by NXP Semiconductors. In  
case of any inconsistency or conflict between information  
in this document and such terms and conditions, the latter  
will prevail.  
Right to make changes NXP Semiconductors  
reserves the right to make changes to information  
published in this document, including without limitation  
specifications and product descriptions, at any time and  
without notice. This document supersedes and replaces all  
information supplied prior to the publication hereof.  
Suitability for use NXP Semiconductors products are  
not designed, authorized or warranted to be suitable for  
use in medical, military, aircraft, space or life support  
equipment, nor in applications where failure or malfunction  
of an NXP Semiconductors product can reasonably be  
expected to result in personal injury, death or severe  
property or environmental damage. NXP Semiconductors  
accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at  
the customer’s own risk.  
No offer to sell or license Nothing in this document  
may be interpreted or construed as an offer to sell products  
that is open for acceptance or the grant, conveyance or  
implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control This document as well as the item(s)  
described herein may be subject to export control  
regulations. Export might require a prior authorization from  
national authorities.  
Applications Applications that are described herein for  
any of these products are for illustrative purposes only.  
NXP Semiconductors makes no representation or  
warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Quick reference data The Quick reference data is an  
extract of the product data given in the Limiting values and  
Characteristics sections of this document, and as such is  
not complete, exhaustive or legally binding.  
Limiting values Stress above one or more limiting  
values (as defined in the Absolute Maximum Ratings  
System of IEC 60134) may cause permanent damage to  
2004 Nov 10  
5
NXP Semiconductors  
Customer notification  
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal  
definitions and disclaimers. No changes were made to the technical content, except for package outline  
drawings which were updated to the latest version.  
Contact information  
For additional information please visit: http://www.nxp.com  
For sales offices addresses send e-mail to: salesaddresses@nxp.com  
© NXP B.V. 2009  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R75/03/pp6  
Date of release: 2004 Nov 10  
Document order number: 9397 750 13582  

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