BFG198 [NXP]

NPN 8 GHz wideband transistor; NPN 8 GHz宽带晶体管
BFG198
型号: BFG198
厂家: NXP    NXP
描述:

NPN 8 GHz wideband transistor
NPN 8 GHz宽带晶体管

晶体 晶体管
文件: 总12页 (文件大小:99K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BFG198  
NPN 8 GHz wideband transistor  
1995 Sep 12  
Product specification  
File under Discrete Semiconductors, SC14  
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
DESCRIPTION  
PINNING  
PIN  
NPN planar epitaxial transistor in a  
plastic SOT223 envelope, intended  
for wideband amplifier applications.  
The device features a high gain and  
excellent output voltage capabilities.  
DESCRIPTION  
emitter  
base  
age  
4
1
2
3
4
emitter  
collector  
1
2
3
MSB002 - 1  
Top view  
Fig.1 SOT223.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
collector-base voltage  
collector-emitter voltage  
DC collector current  
total power dissipation  
DC current gain  
CONDITIONS  
MIN.  
TYP.  
MAX.  
20  
UNIT  
VCBO  
VCEO  
IC  
open emitter  
open base  
V
10  
100  
1
V
mA  
W
Ptot  
hFE  
fT  
up to Ts = 135 °C (note 1)  
IC = 50 mA; VCE = 5 V; Tj = 25 °C  
40  
90  
8
transition frequency  
IC = 50 mA; VCE = 8 V; f = 1 GHz;  
Tamb = 25 °C  
GHz  
dB  
GUM  
maximum unilateral power IC = 50 mA; VCE = 8 V; f = 500 MHz;  
gain  
18  
Tamb = 25 °C  
IC = 50 mA; VCE = 8 V; f = 800 MHz;  
amb = 25 °C  
15  
dB  
T
Vo  
output voltage  
dim = 60 dB; IC = 70 mA; VCE = 8 V;  
RL = 75 ; Tamb = 25 °C;  
700  
mV  
f(p+qr) = 793.25 MHz  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VCBO  
VCEO  
VEBO  
IC  
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
DC collector current  
total power dissipation  
storage temperature  
junction temperature  
open emitter  
open base  
20  
V
10  
V
open collector  
2.5  
100  
1
V
mA  
W
°C  
°C  
Ptot  
Tstg  
Tj  
up to Ts = 135 °C (note 1)  
65  
+150  
175  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
1995 Sep 12  
2
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE UNIT  
Rth j-s  
thermal resistance from junction to soldering point up to Ts = 135 °C (note 1)  
40  
K/W  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
collector cut-off current  
DC current gain  
CONDITIONS  
IE = 0; VCB = 5 V  
MIN.  
TYP.  
MAX.  
UNIT  
ICBO  
hFE  
Cc  
100  
nA  
IC = 50 mA; VCE = 5 V  
40  
90  
1.5  
4
collector capacitance  
emitter capacitance  
feedback capacitance  
transition frequency  
IE = ie = 0; VCB = 8 V; f = 1 MHz  
IC = ic = 0; VEB = 0.5 V; f = 1 MHz  
IC = 0; VCE = 8 V; f = 1 MHz  
pF  
Ce  
pF  
Cre  
fT  
0.8  
8
pF  
IC = 50 mA; VCE = 8 V; f = 1 GHz;  
GHz  
Tamb = 25 °C  
GUM  
maximum unilateral power  
gain; note 1  
IC = 50 mA; VCE = 8 V; f = 500 MHz;  
Tamb = 25 °C  
18  
15  
dB  
dB  
IC = 50 mA; VCE = 8 V; f = 800 MHz;  
Tamb = 25 °C  
Vo  
d2  
output voltage  
note 2  
note 3  
note 4  
750  
700  
55  
mV  
mV  
dB  
second order  
intermodulation distortion  
Note  
2
s21  
------------------------------------------------------------  
1. GUM is the maximum unilateral power gain, assuming S12 is zero and GUM = 10 log  
dB.  
(1 s11 2) (1 s22  
)
2
2. dim = 60 dB (DIN 45004B); IC = 70 mA; VCE = 8 V; RL = 75 ; Tamb = 25 °C;  
Vp = Vo at dim = 60 dB;  
Vq = Vo 6 dB; fp = 445.25 MHz;  
Vr = Vo 6 dB; fq = 453.25 MHz; fr = 455.25 MHz  
measured at f(p+qr) = 443.25 MHz.  
3. dim = 60 dB (DIN 45004B); IC = 70 mA; VCE = 8 V; RL = 75 ; Tamb = 25 °C;  
Vp = Vo at dim = 60 dB; fp = 795.25 MHz;  
Vq = Vo 6 dB; fq = 803.25 MHz;  
Vr = Vo 6 dB; fr = 805.25 MHz;  
measured at f(p+qr) = 793.25 MHz.  
4. IC = 50 mA; VCE = 8 V; Vo = 50 dBmV;  
f(p+q) = 810 MHz; fp = 250 MHz; fq = 560 MHz.  
1995 Sep 12  
3
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
V
= 8 V  
CC  
C5  
L4  
L3  
C4  
V
BB  
C3  
C6  
L6  
L5  
output  
75  
R1  
R2  
C1  
L1  
L2  
input  
75  
DUT  
C2  
R3  
R4  
MBB754  
Fig.2 Intermodulation distortion and second order intermodulation distortion test circuit.  
List of components (see test circuit)  
DESIGNATION  
DESCRIPTION  
VALUE  
UNIT  
pF  
DIMENSIONS  
CATALOGUE NO.  
C2  
multilayer ceramic capacitor  
1.2  
10  
10  
10  
1.5  
2222 851 12128  
2222 590 08627  
2222 851 12128  
2222 629 08103  
2222 851 12158  
C1, C4, C6, C7 multilayer ceramic capacitor  
nF  
nF  
nF  
pF  
C3  
multilayer ceramic capacitor  
multilayer ceramic capacitor  
multilayer ceramic capacitor  
1.5 turns 0.4 mm copper wire  
C5 (note 1)  
C8  
L1 (note 1)  
int. dia. 3 mm;  
winding pitch 1 mm  
L2  
microstripline  
75  
length 22 mm;  
width 2.5 mm  
L3 (note 1)  
L4 (note 1)  
L5  
0.4 mm copper wire  
0.4 mm copper wire  
microstripline  
24  
3.6  
75  
nH  
nH  
length 30 mm  
length 4 mm  
length 19 mm;  
width 2.5 mm  
L6  
Ferroxcube choke  
metal film resistor  
metal film resistor  
metal film resistor  
5
µH  
3122 108 20153  
2322 180 73103  
2322 180 73221  
2322 180 73309  
R1  
10  
220  
30  
R2 (note 1)  
R3, R4  
Note  
1. Components C5, L1, L3, L4, and R2 are mounted on the underside of the PCB.  
The circuit is constructed on a double copper-clad printed circuit board with PTFE dielectric (εr = 2.2);  
thickness 116 inch; thickness of copper sheet 2 x 35 µm; see Fig.2.  
1995 Sep 12  
4
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
V
V
CC  
BB  
C4  
C6  
R1  
L6  
R3  
R4  
L1  
C2  
C7  
L4  
75  
input  
75 Ω  
output  
L2  
L5  
C1  
C3  
C8  
C5  
R2  
L3  
MEA968  
80 mm  
60 mm  
MEA966  
80 mm  
60 mm  
mounting  
screws  
M 2.5 (8x)  
MEA967  
Fig.3 Intermodulation distortion and second order intermodulation distortion printed-circuit board.  
1995 Sep 12  
5
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
MBB752  
MBB267  
1.2  
160  
handbook, halfpage  
handbook, halfpage  
P
tot  
(W)  
h
1.0  
0.8  
0.6  
0.4  
0.2  
FE  
120  
80  
40  
0
0
0
50  
100  
150  
200  
C)  
40  
80  
120  
o
T
(
I
(mA)  
C
s
VCE = 5 V; Tj = 25 °C.  
Fig.5 DC current gain as a function of collector  
current.  
Fig.4 Power derating curve.  
MBB751  
MBB499  
10  
1.2  
handbook, halfpage  
handbook, halfpage  
f
T
C
(GHz)  
re  
8
6
(pF)  
0.8  
4
2
0
0.4  
0
0
0
40  
80  
120  
4
8
12  
16  
V
20  
(V)  
I
(mA)  
C
CB  
IE = 0; f = 1 MHz; Tj = 25 °C.  
VCE = 8 V; f = 1 GHz; Tamb = 25 °C.  
Fig.6 Feedback capacitance as a function of  
collector-base voltage.  
Fig.7 Transition frequency as a function of  
collector current.  
1995 Sep 12  
6
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
MBB753  
MBB498  
40  
45  
handbook, halfpage  
handbook, halfpage  
d
im  
(dB)  
G
UM  
(dB)  
50  
30  
55  
60  
20  
10  
65  
70  
0
2
4
3
20  
40  
60  
80  
100  
120  
(mA)  
10  
10  
10  
10  
f (MHz)  
I
C
VCE = 8 V; Vo = 750 mV; Tamb = 25 °C;  
f(p+qr) = 443.25 MHz.  
IC = 50 mA; VCE = 8 V; Tamb = 25 °C;  
Fig.9 Intermodulation distortion as a function of  
collector current.  
Fig.8 Maximum gain as a function of frequency.  
MBB266  
MBB497  
45  
35  
handbook, halfpage  
handbook, halfpage  
d
d
im  
(dB)  
2
(dB)  
50  
40  
55  
60  
45  
50  
65  
70  
55  
60  
20  
40  
60  
80  
100  
120  
(mA)  
20  
40  
60  
80  
100  
120  
(mA)  
I
I
C
C
VCE = 8 V; Vo = 700 mV; Tamb = 25 °C;  
(p+q) = 793.25 MHz.  
VCE = 8 V; Vo = 50 dBmV; Tamb = 25 °C  
f
f(p+q) = 450 MHz.  
Fig.10 Intermodulation distortion as a function of  
collector current.  
Fig.11 Second order intermodulation distortion as  
a function of collector current.  
1995 Sep 12  
7
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
MBB268  
35  
handbook, halfpage  
d
2
(dB)  
40  
45  
50  
55  
60  
20  
40  
60  
80  
100  
120  
(mA)  
I
C
VCE = 8 V; Vo = 50 dBmV; Tamb = 25 °C  
f(p+q) = 810 MHz.  
Fig.12 Second order intermodulation distortion as  
a function of collector current.  
1995 Sep 12  
8
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
50  
25  
100  
2 GHz  
10  
250  
+ j  
10  
25  
50  
100  
250  
0
– j  
40 MHz  
250  
10  
100  
25  
MBB494  
50  
IC = 50 mA; VCE = 8 V; Tamb = 25 °C; Zo = 50 .  
Fig.13 Common emitter input reflection coefficient (S11).  
o
90  
o
o
60  
120  
o
o
150  
30  
40 MHz  
ϕ
ϕ
100 80  
60  
40  
20  
o
o
0
180  
2 GHz  
o
o
30  
150  
o
o
60  
120  
o
MBB496  
90  
IC = 50 mA; VCE = 8 V; Tamb = 25 °C.  
Fig.14 Common emitter forward transmission coefficient (S21).  
9
1995 Sep 12  
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
o
90  
2 GHz  
o
o
60  
120  
o
o
150  
30  
ϕ
ϕ
0.2 0.16 0.12 0.08 0.04  
o
o
0
180  
40 MHz  
o
o
30  
150  
o
o
60  
120  
o
MBB495  
90  
IC = 50 mA; VCE = 8 V; Tamb = 25 °C.  
Fig.15 Common emitter reverse transmission coefficient (S12).  
50  
25  
100  
10  
250  
2 GHz  
+ j  
– j  
10  
25  
50  
100  
250  
0
250  
40 MHz  
10  
100  
25  
MBB493  
50  
IC = 50 mA; VCE = 8 V; Tamb = 25 °C; Zo = 50 .  
Fig.16 Common emitter output reflection coefficient (S22).  
10  
1995 Sep 12  
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
PACKAGE OUTLINE  
0.95  
0.85  
0.1 S  
S
seating plane  
0.32  
0.24  
6.7  
6.3  
3.1  
2.9  
B
M
0.2  
A
4
A
0.10  
0.01  
3.7  
3.3  
7.3  
6.7  
o
o
16  
max  
16  
1
2
3
o
10  
max  
0.80  
0.60  
1.80  
max  
M
2.3  
0.1  
B
(4x)  
MSA035 - 1  
4.6  
Dimensions in mm.  
Fig.17 SOT223.  
1995 Sep 12  
11  
Philips Semiconductors  
Product specification  
NPN 8 GHz wideband transistor  
BFG198  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
Short-form specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
The data in this specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1995 Sep 12  
12  

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