BFQ18A,115 [NXP]

BFQ18A - NPN 4 GHz wideband transistor SOT-89 3-Pin;
BFQ18A,115
型号: BFQ18A,115
厂家: NXP    NXP
描述:

BFQ18A - NPN 4 GHz wideband transistor SOT-89 3-Pin

放大器 晶体管
文件: 总7页 (文件大小:230K)
中文:  中文翻译
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BFQ18A  
NPN 4 GHz wideband transistor  
Rev. 03 — 28 September 2007  
Product data sheet  
IMPORTANT NOTICE  
Dear customer,  
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If you have any questions related to the data sheet, please contact our nearest sales  
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NXP Semiconductors  
NXP Semiconductors  
Product specification  
NPN 4 GHz wideband transistor  
BFQ18A  
DESCRIPTION  
PINNING  
PIN  
NPN transistor in a plastic SOT89  
envelope intended for application in  
thick and thin-film circuits. It is  
primarily intended for MATV  
purposes.  
DESCRIPTION  
Code: FF  
1
2
3
emitter  
collector  
base  
3
2
1
Fig.1 SOT89.  
QUICK REFERENCE DATA  
SYMBOL  
VCBO  
VCEO  
IC  
PARAMETER  
CONDITIONS  
open emitter  
open base  
TYP. MAX. UNIT  
collector-base voltage  
collector-emitter voltage  
DC collector current  
total power dissipation  
transition frequency  
4
25  
18  
150  
1
V
V
mA  
W
Ptot  
up to Ts = 155 °C (note 1)  
fT  
IC = 100 mA; VCE = 10 V; f = 500 MHz;  
GHz  
Tj = 25 °C  
Cre  
dim  
feedback capacitance  
IC = 0; VCE = 10 V; f = 10.7 MHz  
1.2  
pF  
dB  
intermodulation distortion  
IC = 80 mA; VCE = 10 V; RL = 75 ;  
Vo = 700 mV; measured at  
f(p+q-r) = 793.25 MHz  
60  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
MIN. MAX. UNIT  
VCBO  
VCEO  
VEBO  
IC  
open emitter  
open base  
25  
18  
2
V
collector-emitter voltage  
emitter-base voltage  
DC collector current  
total power dissipation  
storage temperature  
junction temperature  
V
open collector  
V
150  
1
mA  
W
°C  
°C  
Ptot  
Tstg  
Tj  
up to Ts = 155 °C (note 1)  
65 150  
175  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
Rev. 03 - 28 September 2007  
2 of 7  
NXP Semiconductors  
Product specification  
NPN 4 GHz wideband transistor  
BFQ18A  
THERMAL RESISTANCE  
SYMBOL  
PARAMETER  
CONDITIONS  
THERMAL RESISTANCE  
Rth j-s  
thermal resistance from junction to  
soldering point  
up to Ts = 155 °C (note 1)  
20 K/W  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
DC current gain  
CONDITIONS  
MIN.  
25  
TYP.  
UNIT  
hFE  
Cc  
Ce  
Cre  
fT  
IC = 100 mA; VCE = 10 V  
collector capacitance  
emitter capacitance  
feedback capacitance  
transition frequency  
IE = ie = 0; VCB = 10 V; f = 1 MHz  
IC = ic = 0; VEB = 0.5 V; f = 1 MHz  
IC = 0; VCE = 10 V; f = 10.7 MHz  
IC = 100 mA; VCE = 10 V; f = 500 MHz  
2
pF  
11  
1.2  
4
pF  
pF  
GHz  
dB  
dim  
intermodulation distortion (see Fig.2) note 1  
60  
Note  
1. Ic = 80 mA; VCE = 10 V; RL = 75 ;  
Vp = Vo = 700 mV; fp =795.25 MHz;  
Vq = Vo 6 dB; fq = 803.25 MHz;  
Vr = Vo 6 dB; fr = 805.25 MHz;  
measured at f(p+q-r) = 793.25 MHz.  
Rev. 03 - 28 September 2007  
3 of 7  
NXP Semiconductors  
Product specification  
NPN 4 GHz wideband transistor  
BFQ18A  
MBB361  
120  
handbook, halfpage  
5 µH  
handbook, halfpage  
1.5 nF  
2.2 nF  
h
FE  
V
BB  
200 Ω  
V
CC  
80  
40  
5 µH  
10 kΩ  
10 nF  
L1  
4.7 nF  
10 nF  
DUT  
2.2 nF  
0.68  
pF  
R
L
0.68 pF  
12 Ω  
0
0
MBB829  
40  
80  
120  
160  
(mA)  
I
C
f = 40 860 MHz.  
VCE = 10 V; Tj = 25 °C.  
Fig.2 Intermodulation distortion MATV test circuit.  
Fig.3 DC current gain as a function of collector  
current.  
MBB357  
8
handbook, halfpage  
f
T
(GHz)  
6
4
2
0
0
40  
80  
120  
160  
I
(mA)  
C
VCE = 10 V; f = 500 MHz; Tj = 25 °C.  
Fig.4 Transition frequency as a function of  
collector current.  
Rev. 03 - 28 September 2007  
4 of 7  
NXP Semiconductors  
Product specification  
NPN 4 GHz wideband transistor  
BFQ18A  
PACKAGE OUTLINE  
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads  
SOT89  
B
A
D
b
p3  
E
H
E
L
p
1
2
3
c
b
p2  
w
M
B
b
p1  
e
1
e
0
2
4 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
b
b
b
c
D
E
e
e
H
E
L
p
w
p1  
p2  
p3  
1
1.6  
1.4  
0.48  
0.35  
0.53  
0.40  
1.8  
1.4  
0.44  
0.23  
4.6  
4.4  
2.6  
2.4  
4.25  
3.75  
1.2  
0.8  
mm  
3.0  
1.5  
0.13  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
SC-62  
06-03-16  
06-08-29  
SOT89  
TO-243  
Rev. 03 - 28 September 2007  
5 of 7  
BFQ18A  
NXP Semiconductors  
NPN 4 GHz wideband transistor  
Legal information  
Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
Rev. 03 - 28 September 2007  
6 of 7  
BFQ18A  
NXP Semiconductors  
NPN 4 GHz wideband transistor  
Revision history  
Revision history  
Document ID  
BFQ18A_N_3  
Modifications:  
BFQ18A_CNV_2  
Release date  
20070928  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
BFQ18A_CNV_2  
Fig. 1 and package outline updated  
19950901 Product specification  
-
-
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 28 September 2007  
Document identifier: BFQ18A_N_3  

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