BFU520XAR [NXP]
BFU520X - NPN wideband silicon RF transistor SOT-143 4-Pin;
| 型号： | BFU520XAR |
| 厂家： | 
NXP |
| 描述： | BFU520X - NPN wideband silicon RF transistor SOT-143 4-Pin |
| 文件： | 总22页 (文件大小：323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BFU520X
%
ꢂ
ꢁ
ꢀ
7
2
6
NPN wideband silicon RF transistor
Rev. 2 — 5 March 2014
Product data sheet
1. Product profile
1.1 General description
NPN silicon RF transistor for high speed, low noise applications in a plastic, 4-pin
dual-emitter SOT143B package.
The BFU520X is part of the BFU5 family of transistors, suitable for small signal to medium
power applications up to 2 GHz.
1.2 Features and benefits
Low noise, high breakdown RF transistor
AEC-Q101 qualified
Minimum noise figure (NFmin) = 0.7 dB at 900 MHz
Maximum stable gain 20 dB at 900 MHz
11 GHz fT silicon technology
1.3 Applications
Applications requiring high supply voltages and high breakdown voltages
Broadband amplifiers up to 2 GHz
Low noise amplifiers for ISM applications
ISM band oscillators
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
open emitter
open base
Min Typ Max Unit
VCB
VCE
collector-base voltage
collector-emitter voltage
-
-
24
12
24
2
V
-
-
V
shorted base
open collector
-
-
V
VEB
IC
emitter-base voltage
collector current
-
-
V
-
5
30
mA
[1]
Ptot
hFE
Cc
total power dissipation
DC current gain
Tsp 87 C
-
-
450 mW
200
IC = 5 mA; VCE = 8 V
VCB = 8 V; f = 1 MHz
IC = 10 mA; VCE = 8 V; f = 900 MHz
60
-
95
0.52
10.5
collector capacitance
transition frequency
-
-
pF
fT
-
GHz
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
Table 1.
Quick reference data …continued
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
[2]
Gp(max)
NFmin
maximum power gain
minimum noise figure
IC = 5 mA; VCE = 8 V; f = 900 MHz
IC = 1 mA; VCE = 8 V; f = 900 MHz; S = opt
-
-
-
20
-
-
-
dB
0.7
6.5
dB
PL(1dB)
output power at 1 dB gain
compression
IC = 10 mA; VCE = 8 V; ZS = ZL = 50 ;
f = 900 MHz
dBm
[1] Tsp is the temperature at the solder point of the collector lead.
[2] If K > 1 then Gp(max) is the maximum power gain. If K 1 then Gp(max) = MSG.
2. Pinning information
Table 2.
Discrete pinning
Description
collector
Pin
1
Simplified outline
Graphic symbol
ꢁ
ꢃ
ꢂ
2
emitter
ꢂ
3
base
4
emitter
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ꢀ
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name Description
Version
SOT143B
-
BFU520X
OM7963
-
-
plastic surface-mounted package; 4 leads
Customer evaluation kit for BFU520X, BFU530X and BFU550X [1]
[1] The customer evaluation kit contains the following:
a) Unpopulated RF amplifier Printed-Circuit Board (PCB)
b) Unpopulated RF amplifier Printed-Circuit Board (PCB) with emitter degeneration
c) Four SMA connectors for fitting unpopulated Printed-Circuit Board (PCB)
d) BFU520X, BFU530X and BFU550X samples
e) USB stick with data sheets, application notes, models, S-parameter and noise files
4. Marking
Table 4.
Marking
Type number
Marking
Description
BFU520X
*TE
* = t : made in Malaysia
* = w : made in China
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
2 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
5. Design support
Table 5.
Available design support
Download from the BFU520X product information page on http://www.nxp.com.
Support item
Available
yes
Remarks
Device models for Agilent EEsof EDA ADS
SPICE model
Based on Mextram device model.
yes
Based on Gummel-Poon device
model.
S-parameters
yes
yes
yes
yes
yes
Noise parameters
Customer evaluation kit
Solder pattern
See Section 3 and Section 10.
Application notes
See Section 10.1 and Section 10.2.
6. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
open emitter
open base
Min Max
Unit
V
VCB
VCE
collector-base voltage
-
-
-
-
-
30
16
30
3
collector-emitter voltage
V
shorted base
open collector
V
VEB
IC
emitter-base voltage
collector current
V
50
mA
Tstg
VESD
storage temperature
electrostatic discharge voltage
65 +150 C
Human Body Model (HBM) According to JEDEC
standard 22-A114E
-
150
V
Charged Device Model (CDM) According to
JEDEC standard 22-C101B
-
2
kV
7. Recommended operating conditions
Table 7.
Symbol
VCB
Characteristics
Parameter
Conditions
open emitter
open base
Min Typ Max
Unit
V
collector-base voltage
collector-emitter voltage
-
-
-
-
-
-
-
-
-
24
VCE
-
12
V
shorted base
open collector
-
24
V
VEB
IC
emitter-base voltage
collector current
-
2
V
-
30
mA
dBm
C
mW
Pi
input power
ZS = 50
-
10
Tj
junction temperature
total power dissipation
40
+150
450
[1]
Ptot
Tsp 87 C
-
[1] Tsp is the temperature at the solder point of the collector lead.
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
3 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
8. Thermal characteristics
Table 8.
Thermal characteristics
Symbol Parameter
Conditions
Typ Unit
[1]
Rth(j-sp)
thermal resistance from junction to solder point
140 K/W
[1] Tsp is the temperature at the solder point of the collector lead.
Tsp has the following relation to the ambient temperature Tamb
Tsp = Tamb + P Rth(sp-a)
:
With P being the power dissipation and Rth(sp-a) being the thermal resistance between the solder point and
ambient. Rth(sp-a) is determined by the heat transfer properties in the application.
The heat transfer properties are set by the application board materials, the board layout and the
environment e.g. housing.
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Fig 1. Power derating curve
9. Characteristics
Table 9.
Characteristics
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
V(BR)CBO collector-base breakdown voltage
V(BR)CEO collector-emitter breakdown voltage
IC = 100 nA; IE = 0 mA
IC = 150 nA; IB = 0 mA
24
12
-
-
-
V
-
-
V
IC
collector current
5
<1
30
-
mA
nA
ICBO
hFE
Ce
Cre
Cc
collector-base cut-off current
DC current gain
IE = 0 mA; VCB = 8 V
IC = 5 mA; VCE = 8 V
VEB = 0.5 V; f = 1 MHz
VCE = 8 V; f = 1 MHz
VCB = 8 V; f = 1 MHz
-
60 95
200
emitter capacitance
feedback capacitance
collector capacitance
transition frequency
-
-
-
-
0.74 -
0.28 -
pF
pF
0.52 -
10.5 -
pF
fT
IC = 10 mA; VCE = 8 V; f = 900 MHz
GHz
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
4 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
Table 9.
Characteristics …continued
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
[1]
Gp(max)
maximum power gain
insertion power gain
minimum noise figure
f = 433 MHz; VCE = 8 V
IC = 1 mA
-
-
-
17
-
dB
dB
dB
IC = 5 mA
23.5 -
IC = 10 mA
26
-
[1]
[1]
f = 900 MHz; VCE = 8 V
IC = 1 mA
-
-
-
14
20
22
-
-
-
dB
dB
dB
IC = 5 mA
IC = 10 mA
f = 1800 MHz; VCE = 8 V
IC = 1 mA
-
-
-
11.5
17
-
-
-
dB
dB
dB
IC = 5 mA
IC = 10 mA
18
s212
f = 433 MHz; VCE = 8 V
IC = 1 mA
-
-
-
10.5 -
21
23.5 -
dB
dB
dB
IC = 5 mA
-
IC = 10 mA
f = 900 MHz; VCE = 8 V
IC = 1 mA
-
-
-
9.5
-
dB
dB
dB
IC = 5 mA
17.5 -
IC = 10 mA
19
-
-
f = 1800 MHz; VCE = 8 V
IC = 1 mA
-
-
-
6.5
dB
dB
dB
IC = 5 mA
12.5 -
IC = 10 mA
13
-
NFmin
f = 433 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
0.6
-
dB
dB
dB
IC = 5 mA
0.75 -
0.95 -
IC = 10 mA
f = 900 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
0.7
0.8
1
-
-
-
dB
dB
dB
IC = 5 mA
IC = 10 mA
f = 1800 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
0.9
-
dB
dB
dB
IC = 5 mA
0.95 -
1.1
IC = 10 mA
-
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
5 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
Table 9.
Characteristics …continued
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
Gass
associated gain
f = 433 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
25.5 -
25.5 -
dB
dB
dB
IC = 5 mA
IC = 10 mA
26
-
f = 900 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
18
19
20
-
-
-
dB
dB
dB
IC = 5 mA
IC = 10 mA
f = 1800 MHz; VCE = 8 V; S = opt
IC = 1 mA
-
-
-
11.5
-
dB
dB
dB
IC = 5 mA
13.5 -
IC = 10 mA
14
-
PL(1dB)
output power at 1 dB gain compression f = 433 MHz; VCE = 8 V; ZS = ZL = 50
IC = 5 mA
-
-
1
-
-
dBm
dBm
IC = 10 mA
5.5
f = 900 MHz; VCE = 8 V; ZS = ZL = 50
IC = 5 mA
-
-
0
-
-
dBm
dBm
IC = 10 mA
6.5
f = 1800 MHz; VCE = 8 V; ZS = ZL = 50
IC = 5 mA
-
-
3.5
9.5
-
-
dBm
dBm
IC = 10 mA
IP3o
output third-order intercept point
f1 = 433 MHz; f2 = 434 MHz; VCE = 8 V;
ZS = ZL = 50
IC = 5 mA
-
-
10.5 -
dBm
dBm
IC = 10 mA
15
-
f1 = 900 MHz; f2 = 901 MHz; VCE = 8 V;
ZS = ZL = 50
IC = 5 mA
-
-
9.5
16
-
-
dBm
dBm
IC = 10 mA
f1 = 1800 MHz; f2 = 1801 MHz;
VCE = 8 V; ZS = ZL = 50
IC = 5 mA
-
-
13
-
dBm
dBm
IC = 10 mA
19.5 -
[1] If K > 1 then Gp(max) is the maximum power gain. If K 1 then Gp(max) = MSG.
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
6 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
9.1 Graphs
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Tamb = 25 C.
(1)
IB = 25 A
(2) IB = 75 A
(3) IB = 125 A
(4)
IB = 175 A
(5) IB = 225 A
(6) IB = 275 A
(7)
IB = 325 A
Fig 2. Collector current as a function of collector-emitter voltage; typical values
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Tamb = 25 C.
CE = 3.0 V
(2) VCE = 8.0 V
V
CE = 8 V.
(1)
V
(1)
(2) Tamb = +25 C
(3) Tamb = +125 C
Tamb = 40 C
Fig 3. DC current gain as function of collector
current; typical values
Fig 4. DC current gain as function of collector
current; typical values
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
7 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
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Tamb = 25 C.
Tamb = 25 C.
(1) VCE = 3.0 V
(2) VCE = 8.0 V
(1) VCE = 3.0 V
(2) VCE = 8.0 V
Fig 5. Collector current as a function of base-emitter
voltage; typical values
Fig 6. Base current as a function of base-emitter
voltage; typical values
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VCE = 3 V.
IC = 0 mA; f = 1 MHz; Tamb = 25 C.
(1) Tamb = 40 C
(2) Tamb = +25 C
(3)
Tamb = +125 C
Fig 7. Reverse base current as a function of
emitter-base voltage; typical values
Fig 8. Collector capacitance as a function of
collector-base voltage; typical values
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
8 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
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Tamb = 25 C.
(1) VCE = 3.3 V
(2) VCE = 5.0 V
(3)
VCE = 8.0 V
(4) VCE = 12.0 V
Fig 9. Transition frequency as a function of collector current; typical values
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IC = 5 mA; VCE = 8 V; Tamb = 25 C.
IC = 10 mA; VCE = 8 V; Tamb = 25 C.
Fig 10. Gain as a function of frequency; typical values Fig 11. Gain as a function of frequency; typical values
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
9 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
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VCE = 8 V; Tamb = 25 C.
VCE = 8 V; Tamb = 25 C.
(1) f = 300 MHz
(2) f = 433 MHz
(3) f = 800 MHz
(4) f = 900 MHz
(5) f = 1800 MHz
If K >1 then Gp(max) = maximum power gain. If K < 1 then
Gp(max) = MSG.
(1) f = 300 MHz
(2) f = 433 MHz
(3) f = 800 MHz
(4) f = 900 MHz
(5) f = 1800 MHz
Fig 12. Insertion power gain as a function of collector
current; typical values
Fig 13. Maximum power gain as a function of collector
current; typical values
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
10 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
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IC = 10 mA; Tamb = 25 C.
IC = 10 mA; Tamb = 25 C.
(1) f = 300 MHz
(2) f = 433 MHz
(3) f = 800 MHz
(4) f = 900 MHz
(5) f = 1800 MHz
If K >1 then Gp(max) = maximum power gain. If K < 1 then
Gp(max) = MSG.
(1) f = 300 MHz
(2) f = 433 MHz
(3) f = 800 MHz
(4) f = 900 MHz
(5) f = 1800 MHz
Fig 14. Insertion power gain as a function of
collector-emitter voltage; typical values
Fig 15. Maximum power gain as a function of
collector-emitter voltage; typical values
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NPN wideband silicon RF transistor
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VCE = 8 V; 40 MHz f 3 GHz.
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I
Fig 16. Input reflection coefficient (s11); typical values
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VCE = 8 V; 40 MHz f 3 GHz.
(1) IC = 5 mA
(2) IC = 10 mA
Fig 17. Output reflection coefficient (s22); typical values
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NPN wideband silicon RF transistor
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VCE = 8 V; Tamb = 25 C.
VCE = 8 V; Tamb = 25 C.
(1) f1 = 433 MHz; f2 = 434 MHz
(2) f1 = 900 MHz; f2 = 901 MHz
(3) f1 = 1800 MHz; f2 = 1801 MHz
(1) f = 433 MHz
(2) f = 900 MHz
(3) f = 1800 MHz
Fig 18. Output third-order intercept point as a function
of collector current; typical values
Fig 19. Output power at 1 dB gain compression as a
function of collector current; typical values
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IC = 10 mA; Tamb = 25 C.
IC = 10 mA; Tamb = 25 C.
(1) f1 = 433 MHz; f2 = 434 MHz
(2) f1 = 900 MHz; f2 = 901 MHz
(3) f1 = 1800 MHz; f2 = 1801 MHz
(1) f = 433 MHz
(2) f = 900 MHz
(3) f = 1800 MHz
Fig 20. Output third-order intercept point as a function
of collector-emitter voltage; typical values
Fig 21. Output power at 1 dB gain compression as a
function of collector-emitter voltage;
typical values
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NPN wideband silicon RF transistor
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VCE = 8 V; Tamb = 25 C; S = opt
.
VCE = 8 V; Tamb = 25 C; S = opt.
(1) f = 433 MHz
(2) f = 900 MHz
(3) f = 1800 MHz
(1) IC = 1 mA
(2) IC = 2 mA
(3)
IC = 3 mA
(4) IC = 5 mA
(5) IC = 8 mA
(6)
IC = 10 mA
(7) IC = 15 mA
(8) IC = 20 mA
Fig 22. Minimum noise figure as a function of
collector current; typical values
Fig 23. Minimum noise figure as a function of
frequency; typical values
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NXP Semiconductors
NPN wideband silicon RF transistor
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VCE = 8 V; 400 MHz f 2 GHz.
(1) IC = 1 mA
(2) C = 2 mA
I
(3) IC = 3 mA
(4) IC = 5 mA
(5)
IC = 8 mA
(6) IC = 10 mA
(7) IC = 15 mA
(8)
IC = 20 mA
Fig 24. Optimum reflection coefficient (opt); typical values
10. Application information
More information about the following application example can be found in the application
notes. See Section 5 “Design support”.
The following application example can be implemented using the evaluation kit. See
Section 3 “Ordering information” for the order type number.
The following application example can be simulated using the simulation package. See
Section 5 “Design support”.
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NPN wideband silicon RF transistor
10.1 Application example: 433 ISM band LNA
433 ISM band LNA, optimized for low noise.
More detailed information of the application example can be found in the application note:
AN11433.
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Fig 25. Schematic 433 MHz ISM band LNA
Remark: fine tuning of components maybe required depending on PCB parasitics.
Table 10. Application performance data at 433 MHz
ICC = 7 mA; VCC = 3.6 V
Symbol Parameter
Conditions
Min Typ
Max Unit
s212
NF
insertion power gain
-
-
-
19
1.0
11
-
-
-
dB
noise figure
dB
IP3o
output third-order
intercept point
f1 = 433.1 MHz; f2 = 433.2 MHz;
Pi = 30 dBm per carrier
dBm
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NXP Semiconductors
NPN wideband silicon RF transistor
10.2 Application example: 866 ISM band LNA
866 ISM band LNA, optimized for low noise.
More detailed information of the application example can be found in the application note:
AN11434.
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Fig 26. Schematic 866 MHz ISM band LNA
Remark: fine tuning of components maybe required depending on PCB parasitics.
Table 11. Application performance data at 866 MHz
ICC = 7 mA; VCC = 3.6 V
Symbol Parameter
Conditions
Min Typ
Max Unit
s212
NF
insertion power gain
-
-
-
16
1.1
14
-
-
-
dB
noise figure
dB
IP3o
output third-order
intercept point
f1 = 866.1 MHz; f2 = 866.2 MHz;
Pi = 30 dBm per carrier
dBm
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Product data sheet
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NXP Semiconductors
NPN wideband silicon RF transistor
11. Package outline
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BFU520X
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Product data sheet
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NPN wideband silicon RF transistor
12. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
13. Abbreviations
Table 12. Abbreviations
Acronym
AEC
Description
Automotive Electronics Council
Industrial, Scientific and Medical
Low-Noise Amplifier
ISM
LNA
MSG
NPN
Maximum Stable Gain
Negative-Positive-Negative
SubMiniature version A
SMA
14. Revision history
Table 13. Revision history
Document ID
BFU520X v.2
Modifications:
Release date
20140305
Data sheet status
Change notice
Supersedes
Product data sheet
-
BFU520X v.1
• Section 10.1 on page 16: a remarks has been added below Figure 25.
• Section 10.2 on page 17: a remarks has been added below Figure 26.
BFU520X v.1
20140220
Product data sheet
-
-
BFU520X
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NPN wideband silicon RF transistor
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Applications — Applications that are described herein for any of these
15.2 Definitions
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
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Product data sheet
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BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BFU520X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2014
21 of 22
BFU520X
NXP Semiconductors
NPN wideband silicon RF transistor
17. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Design support . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
9.1
10
10.1
10.2
Application information. . . . . . . . . . . . . . . . . . 15
Application example: 433 ISM band LNA. . . . 16
Application example: 866 ISM band LNA. . . . 17
11
12
13
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 19
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 March 2014
Document identifier: BFU520X
相关型号：
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