BFU690F [NXP]
NPN wideband silicon RF transistor; NPN宽带硅RF晶体管型号: | BFU690F |
厂家: | NXP |
描述: | NPN wideband silicon RF transistor |
文件: | 总12页 (文件大小:108K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BFU690F
NPN wideband silicon RF transistor
Rev. 1 — 16 December 2010
Product data sheet
1. Product profile
1.1 General description
NPN silicon microwave transistor for high speed, low noise applications in a plastic, 4-pin
dual-emitter SOT343F package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
1.2 Features and benefits
Low noise high linearity microwave transistor
High output third-order intercept point 34 dBm at 1.8 GHz
40 GHz fT silicon technology
1.3 Applications
Ka band oscillators DRO’s
C-band high output buffer amplifier
ZigBee
LTE, cellular, UMTS
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
open emitter
Min Typ
Max
16
Unit
V
VCBO
VCEO
VEBO
IC
collector-base voltage
-
-
collector-emitter voltage open base
-
-
5.5
V
emitter-base voltage
collector current
open collector
-
-
2.5
V
-
70
-
100
230
180
mA
mW
[1]
Ptot
total power dissipation
DC current gain
Tsp 90 C
-
hFE
IC = 20 mA; VCE = 2 V;
90
135
Tj = 25 C
CCBS
fT
collector-base
capacitance
VCB = 2 V; f = 1 MHz
-
-
-
-
-
404
18
-
-
-
-
-
fF
transition frequency
IC = 60 mA; VCE = 1 V;
f = 2 GHz; Tamb = 25 C
GHz
dB
[2]
Gp(max) maximum power gain
IC = 60 mA; VCE = 1 V;
f = 1.8 GHz; Tamb = 25 C
20.5
0.65
22
NF
noise figure
IC = 15 mA; VCE = 2 V;
f = 1.8 GHz; S = opt
dB
PL(1dB)
output power at 1 dB
gain compression
IC = 70 mA; VCE = 4 V;
ZS = ZL = 50 ;
dBm
f = 1.8 GHz; Tamb = 25 C
[1] Tsp is the temperature at the solder point of the emitter lead.
[2] Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = Maximum Stable Gain (MSG).
2. Pinning information
Table 2.
Discrete pinning
Pin
1
Description
emitter
Simplified outline
Graphic symbol
3
4
4
2
base
3
emitter
2
4
collector
1, 3
2
1
mbb159
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
-
Description
Version
BFU690F
plastic surface-mounted flat pack package; reverse
pinning; 4 leads
SOT343F
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
2 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
4. Marking
Table 4.
Marking
Type number
Marking
Description
BFU690F
D4*
* = p : made in Hong Kong
* = t : made in Malaysia
* = w : made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
IC
Parameter
Conditions
open emitter
open base
Min
Max
16
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
-
-
5.5
V
open collector
-
2.5
V
-
100
230
+150
150
mA
mW
C
C
[1]
Ptot
total power dissipation
storage temperature
junction temperature
Tsp 90 C
-
Tstg
65
Tj
-
[1] Tsp is the temperature at the solder point of the emitter lead.
6. Thermal characteristics
Table 6.
Symbol Parameter
Rth(j-sp) thermal resistance from junction to solder point
Thermal characteristics
Conditions
Typ Unit
260 K/W
001aam832
300
tot
P
(mW)
250
200
150
100
50
0
0
40
80
120
160
T
(°C)
sp
Fig 1. Power derating curve
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
3 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
7. Characteristics
Table 7.
Characteristics
Tj = 25 C unless otherwise specified
Symbol Parameter
Conditions
Min Typ
Max Unit
V(BR)CBO collector-base breakdown voltage
V(BR)CEO collector-emitter breakdown voltage
IC = 2.5 A; IE = 0 mA
IC = 1 mA; IB = 0 mA
16
5.5
-
-
-
-
V
V
-
IC
collector current
70
-
100 mA
100 nA
180
ICBO
hFE
collector-base cut-off current
DC current gain
IE = 0 mA; VCB = 8 V
IC = 20 mA; VCE = 2 V
VCB = 2 V; f = 1 MHz
VEB = 0.5 V; f = 1 MHz
VCB = 2 V; f = 1 MHz
-
90 135
CCES
CEBS
CCBS
fT
collector-emitter capacitance
emitter-base capacitance
collector-base capacitance
transition frequency
-
-
-
-
527
1699
404
18
-
-
-
-
fF
fF
fF
IC = 60 mA; VCE = 1 V; f = 2 GHz;
GHz
Tamb = 25 C
[1]
Gp(max)
s212
NF
maximum power gain
insertion power gain
noise figure
IC = 60 mA; VCE = 1 V; Tamb = 25 C
f = 1.5 GHz
-
-
-
22
-
-
-
dB
dB
dB
f = 1.8 GHz
20.5
17
f = 2.4 GHz
IC = 60 mA; VCE = 1 V; Tamb = 25 C
f = 1.5 GHz
-
-
-
15
-
-
-
dB
dB
dB
f = 1.8 GHz
13.5
11
f = 2.4 GHz
IC = 15 mA; VCE = 2 V; S = opt
;
Tamb = 25 C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
-
-
-
0.60
0.65
0.70
-
-
-
dB
dB
dB
Gass
PL(1dB)
IP3
associated gain
IC = 15 mA; VCE = 2 V; S = opt
Tamb = 25 C
;
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
-
-
-
18.5
17.5
15.5
-
-
-
dB
dB
dB
output power at 1 dB gain compression
IC = 70 mA; VCE = 4 V; ZS = ZL = 50 ;
Tamb = 25 C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
-
-
-
22
22
20
-
-
-
dBm
dBm
dBm
third-order intercept point
IC = 70 mA; VCE = 4 V; ZS = ZL = 50 ;
Tamb = 25 C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
-
-
-
34
34
33
-
-
-
dBm
dBm
dBm
[1] Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = MSG.
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
4 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
001aam833
001aam834
80
200
(1)
(2)
(3)
(4)
I
h
FE
C
(mA)
60
150
100
50
(5)
(6)
(7)
40
20
0
(8)
(9)
(10)
0
0
1
2
3
4
5
0
20
40
60
80
100
I (mA)
C
V
CE
(V)
Tamb = 25 C.
B = 550 A
V
CE = 2 V; Tamb = 25 C.
(1)
I
(2) IB = 500 A
(3) IB = 450 A
(4)
IB = 400 A
(5) IB = 350 A
(6) IB = 300 A
(7)
IB = 250 A
(8) IB = 200 A
(9) IB = 150 A
(10)
IB = 100 A
Fig 2. Collector current as a function of
collector-emitter voltage; typical values
Fig 3. DC current gain as a function of collector
current; typical values
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
5 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
001aam835
001aam836
600
25
fT
(GHz)
C
CBS
(fF)
20
400
15
10
5
200
0
0
0
4
8
12
0
20
40
60
80
100
I (mA)
C
V
CB
(V)
f = 1 MHz, Tamb = 25 C.
VCE = 1 V; f = 2 GHz; Tamb = 25 C.
Fig 4. Collector-base capacitance as a function of
collector-base voltage; typical values
Fig 5. Transition frequency as a function of collector
current; typical values
001aam837
25
G
(1)
(2)
MSG
(dB)
20
(3)
G
p(max)
15
10
5
0
0
20
40
60
80
100
(mA)
I
C
VCE = 1 V; Tamb = 25 C.
(1) f = 1.5 GHz
(2) f = 1.8 GHz
(3) f = 2.4 GHz
Fig 6. Gain as a function of collector current; typical value
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
6 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
001aam838
001aam839
40
40
G
G
(dB)
(dB)
30
30
MSG
20
10
0
MSG
2
20
10
0
G
p(max)
2
|S21|
G
p(max)
|S21|
0
2
4
6
8
10
0
2
4
6
8
10
f (GHz)
f (GHz)
VCE = 1 V; IC = 10 mA; Tamb = 25 C.
VCE = 1 V; IC = 60 mA; Tamb = 25 C.
Fig 7. Gain as a function of frequency; typical values Fig 8. Gain as a function of frequency; typical values
001aam840
001aam841
1.0
1.0
NF
min
NF
min
(dB)
(dB)
(1)
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
(2)
(3)
10
15
20
25
30
35
40
45
0
1
2
3
I
(mA)
f (GHz)
C
VCE = 2 V; Tamb = 25 C.
VCE = 2 V; IC = 15 mA; Tamb = 25 C.
(1) f = 2.4 GHz
(2) f = 1.8 GHz
(3) f = 1.5 GHz
Fig 9. Minimum noise figure as a function of
collector current; typical values
Fig 10. Minimum noise figure as a function of
frequency; typical values
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
7 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
8. Package outline
Plastic surface-mounted flat pack package; reverse pinning; 4 leads
SOT343F
D
E
A
X
y
H
E
e
3
4
A
c
L
p
2
1
b
p
b
1
M
M
A
w
A
w
detail X
e
1
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
b
p
b
c
D
E
e
e
H
E
L
p
w
y
1
1
max
0.75
0.65
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.48
0.38
mm
1.3
1.15
0.2
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
05-07-12
06-03-16
SOT343F
Fig 11. Package outline SOT343F
BFU690F
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
8 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
9. Abbreviations
Table 8.
Abbreviations
Description
Acronym
DC
Direct Current
DRO
Ka
Dielectric Resonator Oscillator
Kurtz above
LTE
Long Term Evolution
Negative-Positive-Negative
Radio Frequency
NPN
RF
UMTS
Universal Mobile Telecommunications System
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BFU690F v.1
20101216
Product data sheet
-
-
BFU690F
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
9 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BFU690F
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
10 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BFU690F
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 December 2010
11 of 12
BFU690F
NXP Semiconductors
NPN wideband silicon RF transistor
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 December 2010
Document identifier: BFU690F
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